Ceramic electronic component and method for manufacturing a ceramic electronic component

Abstract

The present disclosure provides a ceramic electronic component and a method for manufacturing a ceramic electronic component. The ceramic electronic component includes a main body including a dielectric layer and an internal electrode, and an external electrode disposed on the main body, wherein a first carbon material is disposed in the internal electrode. The first carbon material includes carbon black having electrical conductivity, having a substantially spherical shape, and having a particle diameter of the carbon black of 0.05 μm or less.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2021-0167099, filed November 29, 2021, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] The disclosure relates to a ceramic electronic component and a method for manufacturing a ceramic electronic component, and more particularly, to a multilayer ceramic capacitor. BACKGROUND

[0003] As the realization of complexity and high performance in electronic devices, miniaturization and high capacity are necessary in multilayer ceramic capacitors. In addition, high reliability is also necessary for the application of electronic components. In order to secure miniaturization, high capacity, and high reliability of multilayer ceramic capacitors, relevant development has been made in various fields. For example, it is necessary to improve the performance of internal electrodes formed by alternately disposing dielectric layers. SUMMARY

[0004] An aspect of the disclosure is to provide a ceramic electronic component that can improve electrical characteristics.

[0005] Another aspect of the disclosure is to provide a ceramic electronic component having improved high-temperature load reliability.

[0006] According to an aspect of the disclosure, by forming an internal electrode using a conductive paste containing a carbon material, the carbon material can be disposed in the internal electrode and / or on an interface between a dielectric layer and the internal electrode after sintering.

[0007] According to an aspect of the disclosure, a ceramic electronic component includes a main body including a dielectric layer and an internal electrode, and an external electrode disposed on the main body, wherein a first carbon material is disposed in the internal electrode.

[0008] According to an aspect of the disclosure, a ceramic electronic component includes a main body including a dielectric layer and an internal electrode, and an external electrode disposed on the main body, wherein a carbon material is disposed on an interface between the dielectric layer and the internal electrode.

[0009] According to an aspect of the disclosure, a method for manufacturing a ceramic electronic component includes forming an internal electrode containing conductive particles and carbon material particles smaller than the conductive particles, forming a main body, and forming an external electrode. BRIEF DESCRIPTION OF DRAWINGS

[0010] The above and other aspects, features, and advantages of the disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a perspective view showing a ceramic electronic component according to an example embodiment of the present disclosure;

[0012] Figure 2 is a cross-sectional view taken along line I-I' in Figure 1

[0013] Figure 3 is a cross-sectional view taken along line II-II' in Figure 1

[0014] Figure 4 is a cross-sectional view showing an example of a region P in Figure 2

[0015] Figure 5 is a cross-sectional view showing another example of a region P in Figure 2

[0016] Figure 6A is a view showing shapes of an internal electrode and a dielectric layer after sintering in an example in which ceramic is used as a material for forming the internal electrode;

[0017] Figure 6B is a view showing shapes of an internal electrode and a dielectric layer after sintering in an example in which carbon black is used as a material for forming the internal electrode;

[0018] Figure 7 is a spectrum of a carbon black component represented by Raman analysis; and

[0019] Figure 8 is an image of a shape of carbon black obtained by transmission electron microscopy (TEM). DETAILED DESCRIPTION

[0020] Hereinafter, embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0021] In the drawings, some elements can be exaggerated, omitted, or simply shown, and the sizes of the elements do not necessarily reflect the actual sizes of these elements.

[0022] In the drawings, a first direction can be defined as a thickness direction, a second direction can be defined as a length direction, and a third direction can be defined as a width direction.

[0023] Figure 1 is a perspective view showing a ceramic electronic component according to an example embodiment of the present disclosure;

[0024] Figure 2 is a cross-sectional view taken along line I-I' in Figure 1

[0025] Figure 3 Figure 1 ​​​​​​a cross-sectional view taken along line II-II' in FIG. 1.

[0026] The shape of the main body 110 can not be limited to any particular shape, for example, the main body 110 can have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the baking and / or sintering process, the main body 110 can not have a precise hexahedral shape formed by straight lines, but can have a substantially hexahedral shape. The corner shape of the main body 110, for example, the corner portion of the main body 110, can be polished to be rounded by a polishing process.

[0027] The main body 110 can have a first surface 1 and a second surface 2 opposite each other in a thickness direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite each other in a length direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and opposite each other in a width direction.

[0028] In the main body 110, the dielectric layers 111 can be alternately stacked with the internal electrodes 121 and 122. The plurality of dielectric layers 111 can be in a baked and / or sintered state, and adjacent dielectric layers 111 can be integrated with each other such that the boundary therebetween can not be easily distinguished without using a scanning electron microscope (SEM).

[0029] The dielectric layer 111 can be formed by baking a ceramic green sheet containing a ceramic powder, an organic solvent, and an organic binder. The ceramic powder can be a material having a high dielectric constant, and a barium titanate (BaTiO3) material or a strontium titanate (SrTiO3) material can be used, but example embodiments are not limited thereto.

[0030] The thickness of the dielectric layer 111 can not be limited to any particular size, and in general, when the dielectric layer 111 is formed to have a thickness less than 0.6 μm, particularly when the thickness of the dielectric layer 111 is less than or equal to 0.4 μm, reliability can be reduced. In example embodiments, even when the thickness of the dielectric layer 111 is less than or equal to 0.4 μm, excellent reliability can be ensured. Thus, when the thickness of the dielectric layer 111 is less than or equal to 0.4 μm, the effect of improved reliability in example embodiments can be increased, and miniaturization and high capacity can be easily achieved in a ceramic electronic component.

[0031] The thickness of the dielectric layer 111 can refer to an average thickness of the dielectric layer 111 disposed between the inner electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning an image of a section of the main body 110 taken in the length direction and the thickness direction using a scanning electron microscope at a magnification of 10,000. More specifically, the average value can be measured by measuring the thickness of the dielectric layer at 30 equidistant points in the length direction in the scanned image. The 30 equidistant points can be designated in the active part Ac, which will be described later. Furthermore, the average thickness of the dielectric layer 111 can be further generalized when the measurement of the average value is extended to 10 dielectric layers 111.

[0032] The main body 110 can include an active part Ac including a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 disposed opposite each other with the dielectric layer 111 interposed therebetween. The active part Ac can contribute to the capacitance of the capacitor and can be formed by alternately stacking the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122 with the dielectric layer 111 interposed therebetween.

[0033] The main body 110 can further include cover parts 112 and 113 disposed on the upper and lower parts of the active part Ac with respect to the thickness direction. The cover parts 112 and 113 can include a first cover part 112 disposed above the active part Ac and a second cover part 113 disposed below the active part Ac. The first cover part 112 and the second cover part 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active part Ac, respectively, in the thickness direction, and can prevent damage to the inner electrodes caused by physical or chemical stress. The cover parts 112 and 113 can not include inner electrodes and can include the same material as that of the dielectric layer 111. For example, the cover parts 112 and 113 can include a ceramic material such as the above-described barium titanate material. Accordingly, the cover parts 112 and 113 can be integrated with the adjacent dielectric layer 111 such that the boundary therebetween can not be easily distinguished without using a scanning electron microscope. In this regard, the cover parts 112 and 113 can include the dielectric layer 111. For example, the cover parts 112 and 113 can be formed by the dielectric layer 111. The thickness of the cover parts 112 and 113 can not be limited to any particular size. However, in order to easily achieve miniaturization and high capacity of the ceramic electronic component, the thickness of the cover parts 112 and 113 can be 20 µm or less.

[0034] The main body 110 can further include edge portions 114 and 115 disposed on both sides of the active portion Ac in the width direction. The edge portions 114 and 115 can include a first edge portion 114 providing a fifth surface 5 of the main body 110 and a second edge portion 115 providing a sixth surface 6. The edge portions 114 and 115 can refer to regions between both ends of the internal electrodes 121 and 122 and the outer surface of the main body 110 on a cross section of the main body 110 cut in the width direction-thickness direction. The edge portions 114 and 115 can prevent damage to the internal electrodes 121 and 122 caused by physical or chemical stress. The edge portions 114 and 115 can include the same or different material from that of the dielectric layer 111. For example, the edge portions 114 and 115 can be formed by applying a conductive paste to an area of a ceramic green sheet other than an area where the edge portions are formed, thereby forming the internal electrodes. Alternatively, to prevent a step difference due to the internal electrodes 121 and 122, the internal electrodes 121 and 122 can be partially cut to be exposed after lamination, and a single dielectric layer or two or more dielectric layers can be laminated on both side portions of the active portion Ac in the width direction, thereby forming the edge portions 114 and 115.

[0035] The internal electrodes 121 and 122 can be alternately laminated with the dielectric layer 111. The internal electrodes 121 and 122 can include a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122. The plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 can be alternately disposed opposite to each other with the dielectric layer 111 interposed therebetween, and the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 can be respectively exposed to the third surface 3 and the fourth surface 4. For example, each of the plurality of first internal electrodes 121 can be spaced apart from the fourth surface 4 and can be exposed through the third surface 3. Also, each of the plurality of second internal electrodes 122 can be spaced apart from the third surface 3 and can be exposed through the fourth surface 4. The plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 can be electrically isolated from each other by the dielectric layer 111 disposed therebetween. The plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 can be alternately laminated in the thickness direction, but example embodiments thereof are not limited thereto, and the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122 can be alternately laminated in the width direction.

[0036] The inner electrodes 121 and 122 can be formed of a conductive paste including a conductive metal and a sintering inhibitor. For example, the inner electrodes 121 and 122 can be printed by a printing method such as a screen printing method or a gravure printing method on a ceramic green sheet forming the dielectric layer 111. By alternately layering the ceramic green sheets on which the inner electrodes 121 and 122 are printed and baking and / or sintering the sheets, the active part Ac of the main body 110 can be formed. The conductive metal can include nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and / or alloys thereof, and preferably, can include, for example, nickel (Ni), but example embodiments thereof are not limited thereto. The sintering inhibitor can include a carbon material such as, for example, carbon black, graphite, and the like, and preferably, can include, for example, carbon black, but example embodiments thereof are not limited thereto.

[0037] Since the sintering temperature of the nickel (Ni) inner electrode is about 600 degrees Celsius lower than the sintering temperature of the ceramic dielectric, the sintering shrinkage delay of the inner electrode can be achieved using a ceramic material, which can be the same material as the dielectric, as a sintering inhibitor. However, in this case, the uniformity of the dielectric composition can occur due to the ceramic material, and it can be difficult to improve the electrical characteristics and reliability due to the side effects of coarse grains that can be difficult to control.

[0038] However, for the ceramic electronic component 100 according to the example, a carbon material different from the ceramic such as, for example, carbon black, can be used as a sintering inhibitor in the conductive paste for forming the inner electrodes 121 and 122. In this case, the electrical characteristics can be improved, and excellent high-temperature load reliability can be secured. For example, an equivalent or higher level of inner electrode connectivity can be achieved by replacing the ceramic material. In addition, the uniformity of the dielectric composition can be maintained by applying a sintering inhibitor that does not react with the dielectric, and the formation of coarse grains can be prevented. Accordingly, the electrical characteristics and reliability can be improved.

[0039] In addition, in the ceramic electronic component 100 according to the example embodiment, even after sintering, the carbon material such as, for example, carbon black, can be disposed in the inner electrodes 121 and 122 and / or on the interface between the dielectric layer 111 and the inner electrodes 121 and 122. For example, the carbon material such as carbon black can remain without being decomposed. Accordingly, due to the coverage bridge property of the defective portion of the connection of the inner electrodes 121 and 122, the electrical characteristics and reliability can be improved, which can be advantageous in terms of implementing the inner electrodes 121 and 122 to have a reduced thickness. In addition, due to the heat dissipation function by the carbon material, heat accumulation can be reduced during high-voltage operation.

[0040] The carbon material (such as exemplified by carbon black) can have a substantially spherical shape. The configuration of the substantially spherical shape of the carbon black can include a perfect spherical shape, and can also include a shape similar to a spherical shape. The carbon material (such as exemplified by carbon black) having a substantially spherical shape can have various shapes, such as a hollow shape, a core-shell shape, and a filled shape. In this case, the above-described effects can be effectively achieved. The shape can be in the conductive paste, but example embodiments thereof are not limited thereto, and the shape in the inner electrodes 121 and 122 after sintering or the shape on the interface with the dielectric layer 111 can also be the same as described above.

[0041] Further, the carbon material (such as exemplified by carbon black) particles can be smaller than the conductive particles (such as exemplified by nickel (Ni) particles). For example, the particle diameter of the carbon material particles can be less than 1 / 2 of the particle diameter of the nickel (Ni) particles. For example, the particle diameter of the carbon material particles can be greater than 0 μm and less than or equal to 0.05 μm. The particle diameter of the carbon material particles can be measured by imaging the shape of the carbon black in the conductive paste using TEM, or by polishing the main body 110, exposing the inner electrodes 121 and 122, and imaging using TEM. When there are a plurality of carbon blacks, each particle diameter can be less than or equal to 0.05 μm. In this case, the above-described effects can be effectively achieved. The particle diameter can be the particle diameter in the conductive paste, but example embodiments thereof are not limited thereto, and the particle diameter in the inner electrodes 121 and 122 after sintering or the particle diameter on the interface with the dielectric layer 111 can also be substantially the same as described above.

[0042] The particle diameter of the conductive particles can be measured by imaging the shape of the conductive particles in the conductive paste, for example, using a scanning electron microscope (SEM) or TEM.

[0043] Further, the carbon material (such as exemplified by carbon black) can have electrical conductivity. Similarly, in this case, the carbon material can be effectively used as the above-described sintering inhibitor. In this case, the above-described effects can be effectively achieved. Such electrical conductivity can also be obtained in the conductive paste, and can also be obtained in the inner electrodes 121 and 122 after sintering, or on the interface with the dielectric layer 111.

[0044] The thickness of the inner electrodes 121 and 122 can not be limited to any particular size, and in general, when the inner electrodes 121 and 122 are formed to have a thickness of less than 0.6 μm, particularly when the thickness of the inner electrodes 121 and 122 is less than or equal to 0.4 μm, reliability can decrease. However, in example embodiments, even when the thickness of the inner electrodes 121 and 122 is less than or equal to 0.4 μm, excellent reliability can be ensured. Thus, when the thickness of the inner electrodes 121 and 122 is less than or equal to 0.4 μm, the effect of improving reliability in example embodiments can be increased, and miniaturization and a high-capacity ceramic electronic component can be easily achieved.

[0045] The thickness of the inner electrodes 121 and 122 can refer to the average thickness of the inner electrodes 121 and 122. The average thickness of the inner electrodes 121 and 122 can be measured by scanning an image of a cross-section of the main body 110 in the length direction and the thickness direction using a scanning electron microscope at a magnification of 10000. More specifically, the average value can be measured by measuring the thickness of the inner electrode at 30 equidistant points in the length direction in the scanned image. The 30 equidistant points can be designated in the active part Ac. Furthermore, when the measurement of the average value is extended to 10 inner electrodes, the average thickness of the inner electrodes 121 and 122 can be further generalized.

[0046] The outer electrodes 131 and 132 can be disposed on the third surface 3 and the fourth surface 4 of the main body 110, and a part of the outer electrodes 131 and 132 can extend to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The outer electrodes 131 and 132 can include a first outer electrode 131 and a second outer electrode 132 connected to the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122, respectively. The first outer electrode 131 can be disposed on the third surface 3 of the main body 110, and a part of the first outer electrode 131 can extend to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the main body 110. The second outer electrode 132 can be disposed on the fourth surface 4 of the main body 110, and a part of the second outer electrode 132 can extend to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the main body 110. However, exemplary embodiments thereof are not limited thereto, and the number or shape of the outer electrodes 131 and 132 can vary depending on the shape or other configurations of the inner electrodes 121 and 122.

[0047] The outer electrodes 131 and 132 can be formed of any material as long as the material has electrical conductivity, such as metal, and a specific material can be determined in consideration of electrical properties and structural stability, and in addition, the outer electrodes 131 and 132 can have a multi-layer structure. For example, the outer electrodes 131 and 132 can include first electrode layers 131a and 132a disposed on the main body 110 and second electrode layers 131b and 132b disposed on the first electrode layers 131a and 132a.

[0048] The first electrode layers 131a and 132a can be, for example, baked electrodes including a conductive metal and glass. The first electrode layers 131a and 132a can be formed by immersing the main body 110 in a paste including a conductive metal and glass. Alternatively, the first electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal and glass onto the main body 110. As the conductive metal included in the first electrode layers 131a and 132a, a material having excellent conductivity can be used, but example embodiments thereof are not limited thereto. For example, the conductive metal can include copper (Cu), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), and / or alloys thereof, and preferably can include, for example, copper (Cu) and / or nickel (Ni), but example embodiments thereof are not limited thereto.

[0049] The first electrode layers 131a and 132a can be, for example, resin-based electrodes including a conductive metal and a resin. The first electrode layers 131a and 132a can be formed by coating and curing a paste including a conductive metal and a resin. As the conductive metal included in the first electrode layers 131a and 132a, a material having excellent conductivity can be used, but example embodiments thereof are not limited thereto. For example, the conductive metal can include copper (Cu), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), and / or alloys thereof, and preferably can include, for example, copper (Cu) and / or nickel (Ni), but example embodiments thereof are not limited thereto. An insulating resin can be used as the resin included in the first electrode layers 131a and 132a, but example embodiments thereof are not limited thereto. For example, the resin can include an epoxy resin, but example embodiments thereof are not limited thereto.

[0050] For example, the first electrode layers 131a and 132a can have a multilayer shape in which the above-described resin-based electrode is disposed on the above-described baked electrode. However, example embodiments thereof are not limited thereto, and other various electrode layers can be further disposed.

[0051] The second electrode layers 131b and 132b can improve mounting characteristics. The types of the second electrode layers 131b and 132b are not limited to any particular type, and can be plating layers including nickel (Ni), tin (Sn), palladium (Pd), and / or alloys thereof, and can include a plurality of layers. The second electrode layers 131b and 132b can be, for example, nickel (Ni) plating layers or tin (Sn) plating layers, and a nickel (Ni) plating layer and a tin (Sn) plating layer can be sequentially formed on the first electrode layers 131a and 132a. In addition, the second electrode layers 131b and 132b can include a plurality of nickel (Ni) plating layers and / or a plurality of tin (Sn) plating layers.

[0052] Figure 4 is a cross-sectional view illustrating an example of a region P in Figure 2 .

[0053] Referring to the drawings, a plurality of first carbon materials a1 can be disposed in the first internal electrode 121. Also, a plurality of second carbon materials a2 can be disposed on the interface between the dielectric layer 111 and the first internal electrode 121. The dielectric layer 111 can be in contact with the upper and lower surfaces of the first internal electrode 121, and the plurality of second carbon materials a2 can be disposed on the interfaces between the dielectric layer 111 and the upper and lower surfaces of the first internal electrode 121, respectively.

[0054] Each of the plurality of first carbon materials a1 can include the above-described carbon black. The plurality of first carbon materials a1 can form a cluster channel. The cluster channel can be formed by the plurality of first carbon materials a1 arranged in the first internal electrode 121 such that a plurality of channels can be formed and the plurality of channels can be connected to each other. For example, a plurality of carbon black particles can be arranged in various directions in the internal electrode, and several channels can be formed, and the channels can be connected to each other.

[0055] Each of the plurality of second carbon materials a2 can include the above-described carbon black. The plurality of second carbon materials a2 can form a cluster channel. The cluster channel can be formed by the plurality of second carbon materials a2 linearly arranged on the interface between the dielectric layer 111 and the first internal electrode 121 and forming a channel. For example, a plurality of carbon black particles can be linearly arranged on the interface between the dielectric layer and the internal electrode, and a channel can be formed.

[0056] The arrangement of the plurality of first carbon materials a1 and the plurality of second carbon materials a2 has been described using the first internal electrode 121, and the same configuration can also be applied to the second internal electrode 122, and a detailed description thereof will not be provided.

[0057] Figure 5 is a cross-sectional view illustrating another example of a region P in Figure 2

[0058] Referring to the drawings, a plurality of first carbon materials a1' can be disposed in the first internal electrode 121. Also, a plurality of second carbon materials a2 can be disposed on the interface between the dielectric layer 111 and the first internal electrode 121. The dielectric layer 111 can be in contact with the upper and lower surfaces of the first internal electrode 121, and the plurality of second carbon materials a2 can be disposed on the interfaces between the dielectric layer 111 and the upper and lower surfaces of the first internal electrode 121, respectively.

[0059] ​Each of the plurality of first carbon materials a1' can include the above-described carbon black. The plurality of first carbon materials a1' can form cluster spots. The cluster spots can be formed by a portion of the plurality of first carbon materials a1' being gathered in the first internal electrode 121 and forming a plurality of spots, and the plurality of spots can be spaced apart from each other. The gathered first carbon materials a1' can be in contact with each other or can not be in contact with each other. For example, carbon black particles can be gathered in the internal electrode and form a plurality of spots, and the plurality of spots can be spaced apart from each other.

[0060] Each of the plurality of second carbon materials a2 can include the above-described carbon black. The plurality of second carbon materials a2 can form cluster channels. The cluster channels can be formed by the plurality of second carbon materials a2 being linearly disposed on the interface between the dielectric layer 111 and the first internal electrode 121 and forming channels. For example, a plurality of carbon black particles can be linearly disposed on the interface between the dielectric layer and the internal electrode and can form channels.

[0061] The cluster channels and the cluster spots disclosed herein can be observed by, for example, SEM or TEM.

[0062] A diameter of each particle of the plurality of first carbon materials a1' disposed in the first internal electrode 121 can be greater than a diameter of each particle of the plurality of second carbon materials a2 disposed on the interface between the dielectric layer 111 and the first internal electrode 121, but exemplary embodiments thereof are not limited thereto.

[0063] The arrangement of the plurality of first carbon materials a1' and the plurality of second carbon materials a2 has been described using the first internal electrode 121, and the same configuration can also be applied to the second internal electrode 122, and a detailed description thereof will not be provided.

[0064] Figure 6A is a view illustrating shapes of an internal electrode and a dielectric layer after sintering in an example in which ceramic is used as a material for forming the internal electrode. Figure 6B is a view illustrating shapes of an internal electrode and a dielectric layer after sintering in an example in which carbon black is used as a material for forming the internal electrode.

[0065] Referring to the drawings, a material including nickel (Ni) particles A and a ceramic material b is used as a conductive paste material for forming internal electrodes 121' and 122', as Figure 6A As shown, coarse grains G' can be formed during a sintering process, and the coarse grains G' can be distributed on surfaces of the internal electrodes 121' and 122' after sintering, such that connectivity and smoothness of the internal electrodes 121' and 122' can be deteriorated. However, as Figure 6BAs shown, when the material including the nickel (Ni) particles A and the carbon black sintering inhibitor a is used as the conductive paste material for forming the internal electrodes 121 and 122, the grains can be prevented from becoming coarse during the sintering process, and uniform grains G can be distributed on the surfaces of the internal electrodes 121 and 122 after sintering, so that the connectivity and smoothness of the internal electrodes 121 and 122 can be improved. The size of the grains can be measured by, for example, observing a sample of the sintered internal electrode using an SEM or a TEM.

[0066] Figure 7 is a spectrum of a carbon black component indicated by Raman analysis.

[0067] In the drawings, Figure 7 (a) of FIG. 1 is a Raman spectrum of carbon black in a powder state, Figure 7 (b) of FIG. 1 is a Raman spectrum of carbon black after sintering in a powder state, and Figure 7 (c) of FIG. 1 is a Raman spectrum of an electrode region of an internal electrode portion in a ceramic main body.

[0068] Referring to the drawings, the presence of a carbon material such as exemplified by carbon black can be confirmed in the internal electrodes 121 and 122 and / or on the interface between the dielectric layer 111 and the internal electrodes 121 and 122 using a Raman spectrum.

[0069] Figure 8 is an image of the shape of carbon black obtained by a transmission electron microscope (TEM).

[0070] Referring to the drawings, the carbon black in a powder sol state before being mixed with a conductive paste for forming an internal electrode can be a spherical conductive crystalline carbon black having a diameter less than or equal to about 50 nm, but example embodiments thereof are not limited thereto.

[0071] In example embodiments, a multilayer ceramic capacitor has been described as an example of a ceramic electronic component, but example embodiments thereof are not limited thereto, and example embodiments are also applicable to other types of ceramic electronic components such as exemplified by inductors, piezoelectric elements, piezoresistors, and thermistors.

[0072] According to the above-described example embodiments, a ceramic electronic component having improved electrical characteristics can be provided.

[0073] Further, a ceramic electronic component having improved high-temperature load reliability can be provided.

[0074] In example embodiments, for ease of description, the terms "side," "side surface," and the like can be used to refer to a surface formed in a rightward / leftward direction with respect to a cross section in the drawing, for ease of description, the terms "upper side," "upper portion," "upper surface," and the like can be used to refer to a surface formed in an upward direction with respect to a cross section in the drawing, and for ease of description, the terms "lower side," "lower portion," "lower surface," and the like can be used to refer to a surface formed in a downward direction with respect to a cross section in the drawing. The concept that an element is disposed on a side region, an upper side, an upper region, or a lower region can include a configuration in which the element is in direct contact with an element configured as a reference in each direction, as well as a configuration in which the element is not in direct contact with the reference element. However, for ease of description, these terms can be defined as above, and the scope of the rights of example embodiments is not particularly limited to the above terms.

[0075] In example embodiments, the term "connected" can refer not only to a "direct connection," but also to an "indirect connection" via an adhesion layer or the like. In addition, the term "electrically connected" can include both a case where elements are "physically connected" and a case where elements are "not physically connected." Furthermore, the terms "first," "second," and the like can be used to distinguish one element from another, and can not limit the order and / or importance of the elements related thereto, and the like. In some cases, a first element can be referred to as a second element, and similarly, a second element can be referred to as a first element, without departing from the scope of the rights of example embodiments.

[0076] In example embodiments, the term "example embodiment" can not refer to one identical example embodiment, and can be provided to describe and emphasize different unique features of each example embodiment. The above-described example embodiments can be implemented without excluding the possibility of combination with features of other example embodiments. For example, even if a feature described in one example embodiment is not described in another example embodiment, the description can be understood to be related to another example embodiment, unless otherwise specified.

[0077] The singular form of an expression includes the plural form, unless the context clearly indicates a different meaning.

[0078] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and changes can be made therein without departing from the scope of the present application as defined by the appended claims.

Claims

1. A ceramic electronic component, comprising: The main body includes a dielectric layer and an internal electrode; as well as External electrodes are disposed on the main body. The inner electrode has multiple interconnected cluster channels, each cluster channel being formed by multiple first carbon materials arranged together; or the inner electrode has multiple spaced-apart cluster points, each cluster point being formed by multiple first carbon materials aggregated together.

2. The ceramic electronic component according to claim 1, wherein, The first carbon material includes carbon black.

3. The ceramic electronic component according to claim 2, wherein, The carbon black has a generally spherical shape.

4. The ceramic electronic component according to claim 2, wherein, The carbon black is electrically conductive.

5. The ceramic electronic component according to claim 2, wherein, The carbon black has a particle diameter of less than or equal to 0.05 μm.

6. The ceramic electronic component according to claim 1, wherein, Multiple second carbon materials are linearly arranged on the interface between the dielectric layer and the inner electrode to form a channel.

7. The ceramic electronic component according to claim 1, wherein, At the cluster aggregation point, the aggregated first carbon material may or may not be in contact with each other.

8. The ceramic electronic component according to claim 1, wherein, The second carbon material is disposed at the interface between the dielectric layer and the inner electrode.

9. The ceramic electronic component according to claim 8, in, Multiple second carbon materials are disposed on the interface. The interface includes cluster channels, which contain the plurality of second carbon materials.

10. The ceramic electronic component according to claim 1, wherein, The internal electrode contains nickel.

11. A ceramic electronic component, comprising: The main body includes a dielectric layer and an internal electrode; as well as External electrodes are disposed on the main body. The carbon material is disposed at the interface between the dielectric layer and the inner electrode, and The inner electrode has multiple interconnected cluster channels, each cluster channel being formed by multiple first carbon materials arranged together; or the inner electrode has multiple spaced-apart cluster points, each cluster point being formed by multiple first carbon materials aggregated together.

12. The ceramic electronic component according to claim 11, wherein, The carbon material includes carbon black.

13. The ceramic electronic component according to claim 11, in, The dielectric layer is in contact with the upper and lower surfaces of the inner electrode, and The carbon material is disposed on the interface between the dielectric layer and the upper surface of the inner electrode, and on the interface between the dielectric layer and the lower surface of the inner electrode.

14. A method for manufacturing a ceramic electronic component according to any one of claims 1-10, comprising: The internal electrode is formed, the internal electrode comprising conductive particles and carbon material particles smaller than the conductive particles; Forming the main body; as well as The external electrode is formed.

15. The method according to claim 14, wherein, The particle diameter of the carbon material is less than or equal to 0.05 μm.

16. The method of claim 14, wherein, The conductive particles include nickel particles.

17. The method according to claim 16, wherein, The diameter of the carbon material particles is less than 1 / 2 the diameter of the nickel particles.

18. The method according to claim 17, wherein, The carbon material particles include carbon black.

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