Intelligent power module

Abstract

This invention discloses an intelligent power module, comprising: a circuit board, a lead frame, and a package. The circuit board has components mounted on it, and a first side plate is located on its outer periphery. The lead frame includes a frame, pins mounted on the frame, and a second side plate on one side of the frame. The first and second side plates are joined together to form a ring. The circuit board, the first side plate, and the second side plate define a potting cavity. The circuit board is located within the potting cavity, and one end of each pin is connected to the circuit board. The package fills the potting cavity. According to the intelligent power module of this invention, by connecting the circuit board to the pins of the lead frame and joining the first and second side plates of the circuit board into a ring, the thermosetting molding process can be eliminated, avoiding problems such as cracking and delamination. Furthermore, the potting process reduces processing steps, simplifies and controls the process, improves the yield rate of the intelligent power module, increases production efficiency, and reduces production costs.

Description

Technical Field

[0001] This invention relates to the field of electronic circuit technology, and more particularly to an intelligent power module. Background Technology

[0002] In related technologies, the semi-encapsulated packaging method of intelligent power modules has a complex structure. The lead frame is soldered to the circuit board by solder paste reflow soldering. During the injection molding process of intelligent power modules, the insulation layer is prone to cracking or delamination, which reduces the voltage withstand capability of the insulation layer and affects the reliability of intelligent power modules. In addition, injection molding requires a molding machine and molds, resulting in low production efficiency and high cost. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes an intelligent power module, which has the advantages of high reliability and low production cost.

[0004] According to an embodiment of the present invention, a smart power module includes: a circuit board on which components are disposed, and a first side plate on the outer periphery of the circuit board; a lead frame including a frame, pins disposed on the frame, and a second side plate disposed on one side of the frame, the first side plate and the second side plate being spliced ​​together to form a ring, the circuit board, the first side plate and the second side plate defining a potting cavity, the components being disposed in the potting cavity, and one end of the pins being connected to the circuit board; and a package filling the potting cavity.

[0005] According to an embodiment of the present invention, the intelligent power module connects the circuit board to the pins of the lead frame, and splices the first side plate and the second side plate of the circuit board into a ring, so that the circuit board, the first side plate and the second side plate define a filling cavity, and fill the packaged component in the packaging space. This eliminates the thermosetting plastic encapsulation process, so that the intelligent power module can avoid cracking and delamination problems, thereby improving the safety and reliability of the intelligent power module. At the same time, due to the use of the potting process, the processing steps are reduced, the processing is simple and controllable, which can improve the yield rate of the intelligent power module, improve production efficiency and reduce production costs.

[0006] According to some embodiments of the present invention, the first side plate includes a first plate and a second plate disposed opposite to each other, the second side plate includes a third plate and a fourth plate disposed opposite to each other, the third plate being located between one end of the first plate and one end of the second plate, and the fourth plate being located between the other end of the first plate and the other end of the second plate.

[0007] In some embodiments of the present invention, the third plate and the fourth plate are provided with an extension plate extending toward the center of the potting cavity at one end away from the circuit board, and the two ends of the extension plate in the length direction extend to the side of the first plate and the second plate away from the circuit board.

[0008] In some embodiments of the present invention, both ends of the first plate and the second plate in the longitudinal direction away from the surface of the circuit board are provided with protrusions, and both ends of the extension plate in the longitudinal direction are provided with avoidance notches to avoid the protrusions.

[0009] In some embodiments of the invention, the clearance notch is located on the side of the two extension plates furthest from each other.

[0010] In some embodiments of the present invention, the pins are a plurality of spaced-apart pins, a portion of which is disposed opposite to the first plate and another portion opposite to the second plate.

[0011] According to some embodiments of the present invention, the circuit board includes a metal substrate, a first insulating layer and a first copper foil layer stacked sequentially, and the components are connected to the first copper foil layer.

[0012] In some embodiments of the present invention, the first side plate includes a metal plate, and the metal plate and the metal substrate are integrally formed.

[0013] In some embodiments of the present invention, the first side plate further includes: a second insulating layer and a second copper foil layer, wherein the second copper foil layer, the second insulating layer and the metal plate are stacked sequentially, the second copper foil layer and the first copper foil layer are integral parts, and the second insulating layer and the first insulating layer are integral parts.

[0014] According to some embodiments of the present invention, the circuit board includes a ceramic substrate and a first copper foil layer stacked sequentially, the components are connected to the first copper foil layer, and the first side plate includes a ceramic plate, wherein the ceramic plate and the ceramic substrate are integrally formed.

[0015] In some embodiments of the present invention, the first side plate further includes a second copper foil layer stacked with the ceramic plate, wherein the second copper foil layer and the first copper foil layer are integral.

[0016] According to some embodiments of the present invention, an insulating element is provided at the end of the first side plate away from the circuit board, and the lead frame overlaps the insulating element.

[0017] According to some embodiments of the present invention, a sealant is provided between the second side plate and the circuit board, and between the first side plate and the second side plate.

[0018] According to some embodiments of the present invention, the lead frame is a single piece.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of an intelligent power module according to an embodiment of the present invention;

[0022] Figure 2 This is an assembly diagram of a circuit board and a lead frame according to an embodiment of the present invention;

[0023] Figure 3 This is a perspective view of a circuit board according to an embodiment of the present invention;

[0024] Figure 4 This is a perspective view of the lead frame according to an embodiment of the present invention.

[0025] Figure label:

[0026] 100. Intelligent power module;

[0027] 1. Circuit board; 11. First side plate; 111. First plate; 112. Second plate; 113. Protrusion; 114. Second insulating layer; 115. Second copper foil layer; 116. Metal plate; 12. Metal substrate; 13. First insulating layer; 14. First copper foil layer;

[0028] 2. Lead frame; 21. Frame; 22. Pin; 23. Second side plate; 231. Third plate; 232. Fourth plate; 24. Extension plate; 241. Clearance notch; 25. Hollowed-out section; 26. Longitudinal beam;

[0029] 3. Packaging components;

[0030] 4. Components; 41. Active components; 42. Passive components; 43. Metal bonding wires;

[0031] 5. Insulating components. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0033] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0035] The intelligent power module 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0036] like Figures 1-4 As shown, a smart power module 100 according to an embodiment of the present invention includes: a circuit board 1, a lead frame 2, and a package 3.

[0037] like Figure 1 As shown, the circuit board 1 is provided with component 4, and the outer periphery of the circuit board 1 is provided with a first side plate 11. By placing component 4 on the circuit board 1, component 4 becomes part of the circuit structure on the circuit board 1.

[0038] Specifically, such as Figure 1 As shown, the circuit board 1 is generally rectangular, and multiple components 4 can be mounted on the circuit board 1. The multiple components 4 can be fixed to the circuit board 1 by soldering. Soldering has the advantages of simple process and high processing efficiency. Soldering can achieve a reliable connection between the components 4 and the circuit board 1. In addition, while ensuring a reliable connection between the components 4 and the circuit board 1, it can also reduce costs.

[0039] In the description of this invention, "multiple" means two or more. For example, the multiple components 4 can be two, three, four, five, etc. The specific number of the multiple components 4 can be adjusted according to the specific specifications and model of the intelligent power module 100, and this invention does not limit it in this regard.

[0040] like Figure 2 and Figure 4 As shown, the lead frame 2 includes a frame 21, pins 22 disposed on the frame 21, and a second side plate 23 disposed on one side of the frame 21. The first side plate 11 and the second side plate 23 are spliced ​​together to form a ring. The circuit board 1, the first side plate 11, and the second side plate 23 define a potting cavity. The component 4 is disposed in the potting cavity, and one end of the pin 22 is connected to the circuit board 1. This arrangement allows the lead frame 2 and the circuit board 1 to be connected together after the pin 22 is connected to the circuit board 1, reducing the number of steps.

[0041] Specifically, the second side plate 23 of the lead frame 2 is spliced ​​and connected to the first side plate 11 on the circuit board 1 to form a ring, and together with the circuit board 1, defines the potting cavity with the top open. The component 4 is located in the potting cavity. One end of the pin 22 is connected to the frame 21, and the other end is located in the potting cavity and connected to the circuit board 1 to achieve electrical connection.

[0042] The connection between pin 22 and circuit board 1 can be achieved by soldering with solder paste, or by hot-press soldering, silver paste, or other methods.

[0043] like Figure 1 As shown, the encapsulation component 3 fills the potting cavity, thereby encapsulating the component 4 on the circuit board 1.

[0044] In existing technologies, smart power modules employ thermosetting molding compound injection molding. During the molding process, the clamping force acts on the pins, while the circuit board remains stationary due to the positioning action of the reset pins. This causes stress concentration points at the solder joints connecting the pins to the substrate, leading to problems such as pin breakage and delamination. This poses a safety hazard to the smart power module and prevents mass production. This application directly fills the potting cavity with the encapsulation component 3, eliminating external forces during reflow soldering of the pins 22 of the lead frame 2 to the circuit board 1. This avoids the problems of clamping force, breakage, and delamination, improving the safety and reliability of the smart power module 100. Furthermore, it eliminates the thermosetting molding process, and because this application involves fewer and simpler, more controllable steps, it reduces production costs and significantly improves production efficiency.

[0045] The encapsulation component 3 can be epoxy resin or potting compound, such as silicone rubber potting compound, polyurethane potting compound, UV potting compound, or hot melt potting compound. When the encapsulation component 3 is epoxy resin, its thermal conductivity is 0.5 W / mK to 4.0 W / mK. For example, the thermal conductivity of the encapsulation component 3 can be 0.5 W / mK, 0.6 W / mK, 0.7 W / mK, 0.8 W / mK, 0.9 W / mK, 1.0 W / mK, 2.0 W / mK, 3.0 W / mK, or 4.0 W / mK, etc.

[0046] According to an embodiment of the present invention, the intelligent power module 100 connects the circuit board 1 to the pins 22 of the lead frame 2, and splices the first side plate 11 and the second side plate 23 of the circuit board 1 into a ring, so that the circuit board 1, the first side plate 11 and the second side plate 23 define a filling cavity, and fill the encapsulation component 3 into the encapsulation space. This eliminates the thermosetting plastic encapsulation process, so that the intelligent power module 100 can avoid cracking and delamination problems, thereby improving the safety and reliability of the intelligent power module 100. At the same time, due to the use of the potting process, the processing steps are reduced, the processing is simple and controllable, which can improve the yield rate of the intelligent power module 100, increase production efficiency, and reduce production costs.

[0047] According to some embodiments of the present invention, such as Figures 2-4 As shown, the first side plate 11 includes a first plate 111 and a second plate 112 arranged opposite to each other, and the second side plate 23 includes a third plate 231 and a fourth plate 232 arranged opposite to each other. The third plate 231 is located between one end of the first plate 111 and one end of the second plate 112, and the fourth plate 232 is located between the other end of the first plate 111 and the other end of the second plate 112. Specifically, the first plate 111 and the second plate 112 are located on opposite sides of the circuit board 1, and the third plate 231 and the fourth plate 232 are located on opposite sides of the pin 22. After the circuit board 1 is connected to the lead frame 2, the third plate 231 is located between one end of the first plate 111 and one end of the second plate 112, and the fourth plate 232 is located between the other end of the first plate 111 and the other end of the second plate 112. Thus, the third plate 231 and the fourth plate 232 are located on opposite sides of the circuit board 1. This arrangement facilitates the processing of the circuit board 1, and at the same time, the structure is simple, making the connection between the circuit board 1 and the lead frame 2 convenient.

[0048] For example, in Figures 2-4 In the embodiment shown, the first board 111 is located on the left side of the circuit board 1, the second board 112 is located on the right side of the circuit board 1, the third board 231 is located in front of the pin 22, and the fourth board 232 is located behind the pin 22. When the first side board 11 and the second side board 23 are spliced ​​together, the third board 231 is located in front of the circuit board 1 and the fourth board 232 is located behind the circuit board 1, so that the first side board 11, the second side board 23 and the circuit board 1 define a potting cavity.

[0049] According to some embodiments of the present invention, such as Figure 2 and Figure 4 As shown, the third plate 231 and the fourth plate 232 have an extension plate 24 extending toward the center of the potting cavity at one end away from the circuit board 1. The two ends of the extension plate 24 extend to the side of the first plate 111 and the second plate 112 away from the circuit board 1 in the length direction. This arrangement makes it easier to connect the circuit board 1 to the lead frame 2.

[0050] For example, in Figure 2 and Figure 4 In the embodiment shown, the upper ends of the third plate 231 and the fourth plate 232 are provided with extension plates 24 extending toward the potting center. When the circuit board 1 is connected to the lead frame 2, the extension plates 24 are in contact with the upper surfaces of the first plate 111 and the second plate 112. The left end of the extension plates 24 extends to the upper side of the first plate 111, and the right end of the extension plates 24 extends to the upper side of the second plate 112.

[0051] According to some embodiments of the present invention, such as Figures 2-4 As shown, both ends of the first plate 111 and the second plate 112 along the length direction away from the surface of the circuit board 1 are provided with protrusions 113, and both ends of the extension plate 24 along the length direction are provided with clearance notches 241 to avoid the protrusions 113. This arrangement can limit the installation position of the circuit board 1 and the lead frame 2 through the protrusions 113 on the first plate 111 and the second plate 112 and the clearance notches 241 on the extension plate 24. The structure is simple and easy for workers to assemble.

[0052] According to some embodiments of the present invention, such as Figure 2 and Figure 4 As shown, the clearance notch 241 is located on the side of the two extension plates 24 furthest from each other. This arrangement enables effective positioning between the lead frame 2 and the circuit board 1, facilitates the processing of the extension plates 24, and simplifies the installation of the circuit board 1 and the lead frame 2.

[0053] For example, in Figure 2 and Figure 4In the embodiment shown, both ends of the upper surface of the first plate 111 and the second plate 112 in the front-rear direction are provided with protrusions 113, and the left and right ends of the extension plate 24 are provided with clearance notches 241 to avoid the protrusions 113. The clearance notches 241 on the front side of the extension plate 24 are located on the front side of the extension plate 24, and the clearance notches 241 on the rear side of the extension plate 24 are located on the rear side of the extension plate 24. When the circuit board 1 is connected to the lead frame 2, the pins 22 are soldered to the circuit board 1, and then the protrusions 113 on the first plate 111 and the second plate 112 are matched with the clearance notches 241 on the extension plate 24 to connect the circuit board 1 and the lead frame 2 together. The upper surface of the protrusions 113 on the first plate 111 and the second plate 112 after installation is flush with the upper surface of the extension plate 24.

[0054] According to some embodiments of the present invention, such as Figure 1 , Figure 2 and Figure 4 As shown, there are multiple spaced-apart pins 22, with some pins 22 facing the first board 111 and others facing the second board 112. Since one end of each pin 22 is connected to the circuit board 1, when the encapsulation component 3 is filled into the potting cavity, the encapsulation component 3 can flow into the gap between two adjacent pins 22, thereby ensuring the insulation between each pin 22 and improving the reliability of the intelligent power module 100. The number of pins 22 can be two, three, four, five, six, seven, etc., and this invention does not limit this number.

[0055] For example, in Figure 1 and Figure 2 In the embodiment shown, multiple spaced-apart pins 22 are provided on both the left and right sides of the lead frame 2.

[0056] According to some embodiments of the present invention, the circuit board 1 includes a metal substrate 12, a first insulating layer 13, and a first copper foil layer 14 stacked sequentially, and the component 4 is connected to the first copper foil layer 14. Specifically, the metal substrate 12, the first insulating layer 13, and the first copper foil layer 14 are stacked, and the component 4 is disposed on the side of the circuit board 1 with the first copper foil layer 14 and connected to the first copper foil layer 14. Using the metal substrate 12 as a substrate, the heat of the intelligent power module 100 can be transferred to the metal substrate 12 to cool the chip and prevent instantaneous overheating from causing the chip to burn out. The first insulating layer 13 can insulate the first copper foil layer 14 from the metal substrate 12, avoiding short circuits in the circuit structure on the first copper foil layer 14 and ensuring the reliability of the intelligent power module 100. The internal filler of the insulating layer can be selected from silicon dioxide, aluminum oxide, boron nitride, aluminum nitride, and silicon carbide.

[0057] For example, in Figure 1In the illustrated embodiment, the metal substrate 12 serves as the substrate of the intelligent power module 100. A first insulating layer 13 is disposed on the upper surface of the metal substrate 12, a first copper foil layer 14 is disposed on the upper surface of the first insulating layer 13, and multiple components 4 are disposed on the upper surface of the first copper foil layer 14. The multiple components 4 include active components 41 and passive components 42. Metal bonding wires 43 connect the active components 41. The active components 41 and passive components 42 are connected to the first copper foil layer 14 by metal reflow soldering, forming a circuit structure. The circuit board 1, multiple components 4, and metal bonding wires 43 are connected as a single unit using a wire bonding machine to process a semi-finished module. The pins 22 on the lead frame 2 are soldered to the upper surface of the copper foil layer, and the encapsulation component 3 is then encapsulated in the potting cavity, thereby manufacturing the intelligent power module 100. This reduces the assembly difficulty of the intelligent power module 100 and improves its assembly efficiency.

[0058] Among them, the metal bonding wire 43 can be made of aluminum, copper or gold.

[0059] According to some embodiments of the present invention, the metal substrate 12 is an aluminum substrate or a copper substrate. Using an aluminum substrate or a copper substrate can improve the heat dissipation of the smart power module 100. Since the aluminum substrate is lightweight and has better thermal conductivity, the metal substrate 12 is preferably an aluminum substrate.

[0060] According to some embodiments of the present invention, the thickness of the insulating layer is 0.05-0.3 mm. This configuration can better achieve insulation between the first copper foil layer 14 and the metal substrate 12, preventing the first insulating layer 13 from being broken down and improving the safety of the smart power module 100. For example, the thickness of the first insulating layer 13 can be 0.05 mm, 0.08 mm, 0.1 mm, 0.18 mm, 0.15 mm, 0.155 mm, 0.18 mm, 0.2 mm, 0.25 mm, 0.255 mm, 0.28 mm, or 0.3 mm, etc.

[0061] The thermal conductivity of the first insulating layer 13 is 1.0 W / mK to 12.0 W / mK. For example, the thermal conductivity of the first insulating layer 13 can be 1.0 W / mK, 2.0 W / mK, 3.0 W / mK, 4.0 W / mK, 5.0 W / mK, 6.0 W / mK, 7.0 W / mK, 8.0 W / mK, 9.0 W / mK, 10.0 W / mK, 11.0 W / mK, or 12.0 W / mK, etc. Because the first insulating layer 13 has good thermal conductivity, heat from the chip can be transferred to the metal substrate 12 to cool the chip, thus improving the thermal conductivity of the smart power module 100.

[0062] According to some embodiments of the present invention, the thickness of the first copper foil layer 14 is 1-6 OZ. This setting can ensure the stability of the operation of the intelligent power module 100. For example, the thickness of the first copper foil layer 14 can be 1 OZ, 2 OZ, 3 OZ, 4 OZ, 5 OZ, or 6 OZ, etc.

[0063] According to some embodiments of the present invention, the thickness of the metal substrate 12 is 0.5-2.5 mm. For example, the thickness of the metal substrate 12 can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, 2 mm, 2.2 mm, 2.4 mm or 2.5 mm, etc.

[0064] According to some embodiments of the present invention, the first side plate 11 includes a metal plate 116, and the metal plate 116 and the metal substrate 12 are integrally formed. This arrangement allows the heat generated by the components 4 in the intelligent power module 100 to be dissipated through the metal substrate 12 and the first side plate 11, which greatly improves the heat dissipation efficiency of the intelligent power module 100. It also allows the intelligent power module 100 to use a package 3 with low thermal conductivity, and further increases the integration density of the components 4. This provides technical support for the further development of high-performance, multi-functional intelligent power modules 100. At the same time, it also ensures the connection structure and performance stability between the first side plate 11 and the metal substrate 12, and is easy to form and simple to manufacture. Moreover, it can save unnecessary assembly parts and processes, improve the processing efficiency of the intelligent power module 100, and reduce costs.

[0065] The second side plate 23 can also be made of metal, which can further improve the heat dissipation efficiency of the intelligent power module 100. Since metal has high strength, it can also improve the overall strength of the intelligent power module 100 and improve its drop resistance.

[0066] According to some embodiments of the present invention, such as Figure 1As shown, the first side plate 11 further includes a second insulating layer 114 and a second copper foil layer 115. The second copper foil layer 115, the second insulating layer 114, and the metal plate 116 are stacked sequentially. The second copper foil layer 115 and the first copper foil layer 14 are integral components, and the second insulating layer 114 and the first insulating layer 13 are integral components. This simplifies the structure of the intelligent power module 100. Specifically, the first plate 111 includes a stacked metal plate 116, a second insulating layer 114, and a second copper foil layer 115, and the second plate 112 also includes a stacked metal plate 116, a second insulating layer 114, and a second copper foil layer 115. This arrangement allows for better heat transfer from the intelligent power module 100 to the metal substrate 12 to cool the chip, improving the reliability and safety of the intelligent power module 100. The first copper foil layer 14 and the second copper foil layer 115 are integral components, and their thicknesses can be consistent, ranging from 1 to 6 oz. The second insulating layer 114 and the first insulating layer 13 are integral components. The thickness and thermal conductivity of the second insulating layer 114 can be the same as those of the first insulating layer 13. The thickness can be the same and be 0.05-0.3mm, and the thermal conductivity can be 1.0W / mK-12.0W / mK.

[0067] For example, in Figure 1 In the embodiment shown, at the first plate 111, the second insulating layer 114 is disposed on the right side surface of the metal plate 116, and the second copper foil layer 115 is disposed on the right side surface of the second insulating layer 114. At the second plate 112, the second insulating layer 114 is disposed on the left side surface of the metal plate 116, and the second copper foil layer 115 is disposed on the left side surface of the second insulating layer 114.

[0068] According to some embodiments of the present invention, the circuit board 1 includes a ceramic substrate and a first copper foil layer 14 stacked sequentially. The component 4 is connected to the first copper foil layer 14. The first side plate 11 includes a ceramic plate, and the ceramic plate and the ceramic substrate are integrally formed. By using an electrically insulating ceramic substrate, the first insulating layer 14 can be omitted, reducing the thickness of the circuit board 1, thereby reducing the thickness of the intelligent power module 100. At the same time, the ceramic substrate has good thermal conductivity, which is more conducive to the heat dissipation of the intelligent power module 100 and can prevent the intelligent power module 100 from overheating and burning out the chip.

[0069] For example, in one embodiment of the present invention, the ceramic substrate is the substrate of the intelligent power module 100, the first copper foil layer 14 is disposed on the upper surface of the ceramic substrate, and a plurality of components 4 are disposed on the upper surface of the first copper foil layer 14. The plurality of components 4 include active components 41 and passive components 42. The active components 41 are connected by metal bonding wires 43. The active components 41 and passive components 42 are connected to the first copper foil layer 14 by metal reflow soldering. The active components 41 and passive components 42 form a circuit structure with the copper foil layer.

[0070] According to some embodiments of the present invention, the first side plate 11 further includes a second copper foil layer 115 stacked with the ceramic plate, the second copper foil layer 115 and the first copper foil layer 14 being an integral part. Specifically, the first plate 111 includes a ceramic plate and a second copper foil layer 115 stacked together, and the second plate 112 includes a ceramic plate and a second copper foil layer 115 stacked together. This arrangement simplifies the structure of the intelligent power module 100, better transfers the heat of the intelligent power module 100 to the ceramic substrate to cool the chip, and improves the reliability and safety of the intelligent power module 100. The first copper foil layer 14 and the second copper foil layer 115 are an integral part, and the thickness of the first copper foil layer 14 and the second copper foil layer 115 can be the same, ranging from 1 to 6 oz.

[0071] According to some embodiments of the present invention, such as Figure 1 As shown, an insulating member 5 is provided at the end of the first side plate 11 away from the circuit board 1, and the lead frame 2 overlaps on the insulating member 5. This arrangement ensures an insulated connection between the lead frame 2 and the circuit board 1, improving the reliability of the intelligent power module 100.

[0072] For example, in Figure 1 In the embodiment shown, the upper end of the first side plate 11 is provided with an insulating member 5. When the lead frame 2 is connected to the circuit board 1, the pins 22 of the lead frame 2 are insulated from the substrate.

[0073] According to some embodiments of the present invention, a sealant is provided between the second side plate 23 and the circuit board 1, and between the first side plate 11 and the second side plate 23. This arrangement can prevent leakage from occurring in the potting cavity when the encapsulation component 3 is filled into the potting cavity, thereby improving the sealing performance of the potting cavity. Optionally, the sealant can be one of epoxy resin cured product, amino resin cured product, phenolic resin, and silicone resin.

[0074] For example, in Figure 2 In the embodiment shown, when the protrusion 113 of the first side plate 11 mates with the clearance notches 241 on the left and right sides of the extension plate 24, sealant can be applied to the connection between the protrusion 113 and the clearance notches 241 to improve the sealing performance of the smart power module 100.

[0075] It should be noted that when the processing precision of circuit board 1 and lead frame 2 is high enough, the glue application process can be omitted.

[0076] According to some embodiments of the present invention, the lead frame 2 is a single piece. Specifically, the frame 21, pins 22, second side plate 23, and extension plate 24 are a single piece. This arrangement ensures stable connection structure and performance between the frame 21, pins 22, second side plate 23, and extension plate 24, and eliminates unnecessary assembly parts and processes, thereby improving the processing efficiency of the intelligent power module 100 and reducing costs.

[0077] For example, in Figure 2 and Figure 3 In the embodiment shown, the frame 21 is rectangular and has a hollowed-out portion 25. The frame 21 also has two longitudinal beams 26, which divide the hollowed-out portion 25 into three spaced-apart sections. The left and right ends of the extension plate 24 are connected to the two longitudinal beams 26. Since the pin 22 is relatively long, the two longitudinal beams 26 can also support the pin 22.

[0078] A smart power module 100 according to a specific embodiment of the present invention is described below with reference to the accompanying drawings.

[0079] like Figures 1-4 As shown, the intelligent power module 100 includes a circuit board 1, a lead frame 2, components 4, a package 3, and an insulating component 5.

[0080] refer to Figure 2 and Figure 3 The circuit board 1 includes a metal substrate 12, a first insulating layer 13, and a first copper foil layer 14 stacked together. The first side plate 11 includes a first plate 111 and a second plate 112 disposed opposite to each other. The first plate 111 and the second plate 112 are located on the left and right sides of the metal substrate 12. Both the first plate 111 and the second plate 112 include a metal plate 116, a second insulating layer 114, and a second copper foil layer 115 stacked together. The front and rear ends of the upper surface of the first plate 111 and the second plate 112 are provided with protrusions 113. Among them, the metal plate 116 is integral with the metal substrate 12, the first copper foil layer 14 and the second copper foil layer 115 are integral with each other, and the first insulating layer 13 and the second insulating layer 114 are integral with each other.

[0081] refer to Figure 2 and Figure 4The lead frame 2 includes a frame 21, pins 22, a second side plate 23, and an extension plate 24. The frame 21 is rectangular and has a cutout 25 and two longitudinal beams 26. The two longitudinal beams 26 divide the cutout 25 into three spaced-apart sections. The pins 22 are spaced-apart multiples. One end of each pin is connected to the frame 21, and the other end is reflow soldered to the circuit board 1. The first side plate 11 and the second side plate 23 are joined together to form a ring. The circuit board 1, the first side plate 11, and the second side plate 23 together define a potting cavity. The second side plate 23 includes a third plate 231 and a fourth plate 232 arranged opposite to each other. The third plate 231 is located on top of the first plate 111. The front end of the first plate 111 and the front end of the second plate 112 are located at the rear end of the first plate 111 and the rear end of the second plate 112. The end of the third plate 231 and the fourth plate 232 away from the circuit board 1 is provided with an extension plate 24 extending toward the center of the potting cavity. The two ends of the extension plate 24 in the left and right directions extend to the side of the first plate 111 and the second plate 112 away from the circuit board 1 and are connected to the longitudinal beam 26. At the same time, the extension plate 24 is also provided with a clearance notch 241 that cooperates with the protrusion 113. The clearance notch 241 is located on the side of the two extension plates 24 away from each other.

[0082] refer to Figure 1 The component 4 includes an active component 41 and a passive component 42. The active components 41 are connected by a metal bonding wire 43. The active components 41 and the passive components 42 are connected to the first copper foil layer 14 by metal reflow soldering. The active components 41 and the passive components 42 form a circuit structure with the first copper foil layer 14.

[0083] refer to Figure 1 The encapsulation component 3 is filled into the potting cavity, and the component 4 and pin 22 are encapsulated on the circuit board 1.

[0084] refer to Figure 1 An insulating component 5 is provided at the upper end of the first side plate 11, and the lead frame 2 is attached to the insulating component 5 to achieve insulation from the circuit board 1.

[0085] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0086] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A smart power module, characterized in that, include: A circuit board, on which components are provided, and a first side plate is provided on the outer periphery of the circuit board; A lead frame includes a frame, pins disposed on the frame, and a second side plate disposed on one side of the frame. The first side plate and the second side plate are spliced ​​together to form a ring. The circuit board, the first side plate, and the second side plate define a potting cavity. The components are disposed in the potting cavity. One end of the pins is connected to the circuit board. An encapsulation component that fills the potting cavity; The first side plate includes a first plate and a second plate disposed opposite to each other, and the second side plate includes a third plate and a fourth plate disposed opposite to each other. The third plate is located between one end of the first plate and one end of the second plate, and the fourth plate is located between the other end of the first plate and the other end of the second plate. An insulating element is provided at the end of the first side plate away from the circuit board, and the lead frame overlaps the insulating element.

2. The intelligent power module according to claim 1, characterized in that, The third plate and the fourth plate are provided with an extension plate at one end away from the circuit board, which extends toward the center of the potting cavity. The two ends of the extension plate extend to the side of the first plate and the second plate away from the circuit board in the length direction.

3. The intelligent power module according to claim 2, characterized in that, Both ends of the first plate and the second plate in the longitudinal direction away from the surface of the circuit board are provided with protrusions, and both ends of the extension plate in the longitudinal direction are provided with avoidance notches to avoid the protrusions.

4. The intelligent power module according to claim 3, characterized in that, The clearance gap is located on the side of the two extension plates furthest from each other.

5. The intelligent power module according to claim 1, characterized in that, The pins are a plurality of spaced-apart pins, with some of the pins positioned opposite the first board and others opposite the second board.

6. The intelligent power module according to claim 1, characterized in that, The circuit board includes a metal substrate, a first insulating layer and a first copper foil layer stacked in sequence, and the components are connected to the first copper foil layer.

7. The intelligent power module according to claim 6, characterized in that, The first side plate includes a metal plate, and the metal plate and the metal substrate are integrally formed.

8. The intelligent power module according to claim 7, characterized in that, The first side plate further includes: a second insulating layer and a second copper foil layer, wherein the second copper foil layer, the second insulating layer and the metal plate are stacked in sequence, the second copper foil layer and the first copper foil layer are integral parts, and the second insulating layer and the first insulating layer are integral parts.

9. The intelligent power module according to claim 1, characterized in that, The circuit board includes a ceramic substrate and a first copper foil layer stacked in sequence. The components are connected to the first copper foil layer. The first side plate includes a ceramic plate, and the ceramic plate and the ceramic substrate are an integral part.

10. The intelligent power module according to claim 9, characterized in that, The first side plate also includes a second copper foil layer stacked with the ceramic plate, and the second copper foil layer and the first copper foil layer are integral parts.

11. The intelligent power module according to claim 1, characterized in that, A sealant is provided between the second side plate and the circuit board, as well as between the first side plate and the second side plate.

12. The intelligent power module according to claim 1, characterized in that, The lead frame is a single piece.

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