A quality detection method for external power micro electrostatic device

Abstract

The application relates to a quality detection method for an external power micro electrostatic device, belonging to the technical field of air purification. The electrode contact patch of the micro electrostatic device is electrically connected with an external power supply and an ammeter to form an electrification circuit, and a detection element is connected to the electrification circuit. The detection element is in contact with the surface of the micro electrostatic device and moves along the surface of the micro electrostatic device to detect the current value in real time. If the current value shows a decreasing trend, it indicates that the dielectric material is not damaged, otherwise, it indicates that the dielectric material is damaged. The application can quickly identify the damaged dielectric material which cannot be seen by naked eyes, avoids the flow of defective products into the market, can identify whether the electrode strip is exposed on the outside of the micro electrostatic device, avoids the phenomenon that the electrode strip is not wrapped tightly, and can also quickly identify whether the dust collecting plate and the electrode strip are abnormally connected.

Description

Technical Field

[0001] This invention belongs to the field of air purification technology, and specifically relates to a quality testing method for an external power supply micro-electrostatic device. Background Technology

[0002] Current micro-electrostatic devices on the market utilize a strong electric field carried by a dielectric material for air purification. The principle is that the dielectric material wraps the electrode sheet to form a honeycomb-shaped hollow microporous channel, which generates a strong electric field. After the air particles become charged, they are attracted by the electric field and adsorbed into the honeycomb-shaped hollow microporous channel, thereby collecting the microorganisms attached to the particles and killing them in the strong electric field, such as CN202211260929.9, a micro-electrostatic purification device resistant to high humidity.

[0003] Micro-electrostatic devices have high requirements for manufacturing processes. Improper processes or incorrect operator handling can easily lead to defective products. Problematic micro-electrostatic devices mainly exhibit issues such as incomplete or damaged dielectric material coating, curled edges, and exposed electrode sheets. Dielectric material damage can be categorized into visible and invisible damage. Visible damage is manually identified by inspectors; however, invisible damage is difficult to detect. Micro-electrostatic devices with damaged dielectric materials will experience low dust holding capacity, low purification efficiency, short maintenance cycles, and safety issues during use, such as increased risk of arcing and short circuits, and even localized arcing and melting due to overheating. Furthermore, when the electrode strips and conductive materials are not reliably connected, or are partially disconnected, this is also difficult to detect visually.

[0004] Currently, there are no effective testing methods on the market to identify dielectric material damage that is invisible to the naked eye, or to detect the reliability of internal electrical connections. Summary of the Invention

[0005] In view of the various shortcomings of the existing technology, and in order to solve the above problems, a quality inspection method for external power supply micro-electrostatic devices is proposed.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] In a first aspect, the present invention provides a quality inspection method for an external power supply micro-electrostatic device, comprising:

[0008] S100, the electrode contacts of the micro-electrostatic device are electrically connected to its external power supply and ammeter to form an energized circuit, and the detection element is connected to the energized circuit.

[0009] S300: The detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

[0010] This technical solution is further configured such that, following S300, it also includes:

[0011] S500: Switch the electrical connection between the electrode contacts of the micro-electrostatic device and the external power supply, connect the ammeter to the circuit to form a energized circuit again, and connect the detection element to the energized circuit.

[0012] S700: The detection element contacts the other surface of the micro-electrostatic device and moves along the other surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

[0013] This technical solution is further configured such that, in S500, the electrical connection between the electrode contacts of the micro-electrostatic device and the external power supply is switched, specifically as follows:

[0014] The micro-electrostatic device is flipped 180°, after which the electrode contacts of the micro-electrostatic device are electrically connected to the external power supply.

[0015] The technical solution is further configured such that the micro-electrostatic device is located on a detection fixture, the detection fixture includes a side plate, a base plate and a conductive connector, the side plate has a mounting hole for mounting the conductive connector, the mounting hole is insulated from the conductive connector, the base plate has a first conductive layer, and the first conductive layer is connected in series or in parallel with the ammeter.

[0016] This technical solution is further configured such that if the ammeter reading shows an increasing trend or a fluctuating trend, arcing occurs at the contact point between the detection element and the micro-electrostatic device, or arcing occurs at the contact point between the base plate and the micro-electrostatic device, it indicates that the dielectric material is damaged.

[0017] If the ammeter reading shows a decreasing trend, and no arcing occurs at the contact points between the detection element, the base plate, and the micro-electrostatic device, it indicates that the dielectric material is not damaged.

[0018] The technical solution is further configured such that the testing fixture also includes a back plate, the back plate is provided with a second conductive layer, and the second conductive layer is bonded to the first conductive layer.

[0019] The technical solution is further configured such that the base plate has a first elongated hole along its width direction, and the back plate has a second elongated hole corresponding to the first elongated hole. The first elongated hole and the second elongated hole are fastened by fastening bolts, and the relative position of the back plate and the base plate can be adjusted by fastening bolts.

[0020] This technical solution is further configured such that if the ammeter reading shows an increasing trend or a fluctuating trend, arcing occurs at the contact point between the detection element and the micro-electrostatic device, or arcing occurs at the contact point between the base plate and the micro-electrostatic device, it indicates that the dielectric material is damaged.

[0021] If the ammeter reading shows an increasing or fluctuating trend, or if arcing occurs at the point where the backplate and the micro-electrostatic device are in contact, it indicates that the electrode strip is not properly wrapped.

[0022] If the ammeter reading shows a decreasing trend, and no arcing occurs at the contact points between the detection element, base plate, back plate, and micro-electrostatic device, it indicates that the micro-electrostatic device is a qualified product.

[0023] The technical solution is further configured such that the detection element is made of conductive material, one end of the detection element is in contact with the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device, and the other end of the detection element is connected in series or in parallel with the ammeter.

[0024] The technical solution is further configured such that the end of the detection element that contacts the surface of the micro-electrostatic device is configured as a brush-like structure.

[0025] Secondly, the present invention also provides a quality detection method for an external power supply micro-electrostatic device, comprising:

[0026] S100, the electrode contacts of the micro-electrostatic device are electrically connected to its external power supply and ammeter to form an energized circuit.

[0027] The S200 electrostatic field detector moves its test probe along the surface of the micro electrostatic device. When the absolute value of the real-time induced voltage displayed by the electrostatic field detector is not less than the voltage threshold, it indicates that the dust collection plate and electrode strip of the micro electrostatic device are connected normally. Otherwise, it indicates that the dust collection plate and electrode strip of the micro electrostatic device are connected abnormally.

[0028] S300. Connect the detection element to the energized circuit. The detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged. Conversely, it indicates that the dielectric material is damaged.

[0029] The technical solution is further configured such that, in S200, the movement path of the test probe of the electrostatic field detector on the surface of the micro-electrostatic device is an S-shaped curve.

[0030] This technical solution is further configured such that, in S200, the method for determining the voltage threshold is as follows:

[0031] The micro-electrostatic device is charged using the external power supply. When the micro-electrostatic device is fully charged, the induced voltage in the fully charged state is measured using an electrostatic field detector, and 0.5-1 times the induced voltage is taken as the voltage threshold of the electrostatic field detector.

[0032] This technical solution is further configured such that, following S300, it also includes:

[0033] S500: Switch the electrical connection between the electrode contacts of the micro-electrostatic device and the external power supply, connect the ammeter to the circuit to form a energized circuit again, and connect the detection element to the energized circuit.

[0034] S700: The detection element contacts the other surface of the micro-electrostatic device and moves along the other surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

[0035] The beneficial effects of this invention are:

[0036] 1. By moving the detection element along the surface of the micro-electrostatic device and observing the ammeter reading and whether arcing occurs, damaged dielectric materials that are invisible to the naked eye can be quickly identified, thus preventing defective products from entering the market.

[0037] 2. By observing whether arcing occurs at the contact point between the backplate and the micro-electrostatic device and the ammeter reading, determine whether the electrode strips are exposed on the outside of the micro-electrostatic device to avoid the electrode strips not being properly wrapped.

[0038] 3. By moving the test probe of the electrostatic field detector along the surface of the micro-electrostatic device and observing the reading of the electrostatic field detector, it is possible to quickly identify whether there is an abnormal connection between the dust collection plate and the electrode strip.

[0039] 4. Adjust the position of the back plate by using the first elongated hole, the second elongated hole, and the fastening bolts to accommodate micro-static devices of different specifications.

[0040] 5. The second end of the ejector pin is designed to be toothed or needle-shaped to improve its contact stability with the electrode contacts. Attached Figure Description

[0041] Figure 1 This is a flowchart of one embodiment of the present invention;

[0042] Figure 2 This is a circuit diagram of the present invention;

[0043] Figure 3 This is a schematic diagram of the detection tooling in this invention;

[0044] Figure 4This is a top view of the back plate in this invention;

[0045] Figure 5 This is a schematic diagram of one embodiment of the spring-loaded ejector pin in this invention;

[0046] Figure 6 This is a schematic diagram of another embodiment of the spring-loaded ejector pin in this invention;

[0047] Figure 7 This is a schematic diagram of one embodiment of the detection element in this invention;

[0048] Figure 8 This is a schematic diagram of another embodiment of the detection element in this invention;

[0049] Figure 9 This is a schematic diagram of another embodiment of the detection element in this invention;

[0050] Figure 10 This is a schematic diagram of the micro-electrostatic device in this invention;

[0051] Figure 11 This is a flowchart of another embodiment of the present invention.

[0052] In the attached diagram: 1-External power supply, 2-Micro electrostatic device, 3-Detection fixture, 4-Side plate, 5-Back plate, 6-Base plate, 7-Detection element, 8-First elongated hole, 9-Mounting hole, 10-Second elongated hole, 11-Ammeter, 13-Housing, 14-Filter layer, 15-Electrode contact, 16-Spring pin, 17-Outer shell, 18-Spring, 19-Pin, 20-Through hole, 21-Insulated handle, 22-Brush-like structure. Detailed Implementation

[0053] To enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments in this application, other similar embodiments obtained by those skilled in the art without creative effort should all fall within the scope of protection of this application. Furthermore, directional terms mentioned in the following embodiments, such as "up," "down," "left," and "right," are only for reference to the directions in the accompanying drawings; therefore, the directional terms used are for illustrative purposes and not for limiting the invention.

[0054] Example 1:

[0055] like Figure 1 , Figure 2 As shown, a quality inspection method for an external power supply micro-electrostatic device includes:

[0056] S100, the electrode contacts of the micro-electrostatic device 2 are electrically connected to its external power supply 1 and ammeter 11 to form a power-conducting circuit, and the detection element 7 is connected to the power-conducting circuit.

[0057] Specifically, for the detailed structure of the micro-electrostatic device using an external power supply, please refer to paragraphs 0075-0088 of the instruction manual in CN202211260929.9, "A Micro-electrostatic Purification Device Resistant to High Humidity". The ammeter 11 can be a microampere-level ammeter or the AC / DC microampere current range of a multimeter.

[0058] It's worth noting that the external power supply 1 provides power, which can be either negative or positive high voltage. The micro-electrostatic device 2 creates an electric field that attracts charged particles, thus sterilizing and disinfecting. In a DC circuit, the micro-electrostatic device functions similarly to a capacitor, storing charge. After the external power supply 1 and the micro-electrostatic device 2 form a energized circuit, the external power supply 1 charges the micro-electrostatic device 2. Initially, the current within the micro-electrostatic device 2 is typically tens of microamps. As the charging time increases, the charging current gradually decreases until it drops to 0 microamps. At this point, the micro-electrostatic module 2 is fully charged.

[0059] S300, the detection element 7 contacts the surface of the micro-electrostatic device 2 and moves along the surface of the micro-electrostatic device 2 to detect the reading of the ammeter 11 in real time. If the ammeter reading 11 shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

[0060] Specifically, such as Figure 10 As shown, the micro-electrostatic device 2 includes a housing 13 and a filter layer 14, wherein the filter layer 14 is located inside the housing 13. Electrode contacts 15 are provided on the housing 13, and the electrode contacts 15 are electrically connected to an electrode strip located at the end of the filter layer 14. Specifically, the detection element 7 contacts the surface of the filter layer 14 and moves along the surface of the filter layer 14.

[0061] It is worth noting that, to save time, when the current inside the micro-electrostatic device 2 decreases to 8-12 μA, preferably 10 μA, for example, at 10 μA, the detection element 7 moves along the surface of the micro-electrostatic device 2 to detect whether the micro-electrostatic module 2 is damaged. For different micro-electrostatic devices 2, different reference current values ​​for starting to detect dielectric damage can be set according to the actual situation.

[0062] This technical solution is further configured such that, following S300, it also includes:

[0063] S500, switch the electrical connection between the electrode contacts of the micro-electrostatic device 2 and the external power supply 1, connect the ammeter 11 to the circuit to form a power-on circuit again, and connect the detection element 7 to the power-on circuit.

[0064] S700, the detection element 7 contacts the other surface of the micro-electrostatic device 2 and moves along the other surface of the micro-electrostatic device 2 to detect the reading of the ammeter 11 in real time. If the reading of the ammeter 11 shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

[0065] This technical solution is further configured such that, in S500, the electrical connection between the electrode contacts of the micro-electrostatic device 2 and the external power supply 1 is switched, specifically as follows:

[0066] The micro-electrostatic device 2 is rotated 180°, after which the electrode contacts of the micro-electrostatic device 2 are electrically connected to the external power supply 1.

[0067] It is worth noting that rotating the micro-electrostatic device 2 180° and inspecting its two surfaces can more comprehensively detect the damage to low-potential dielectric materials.

[0068] like Figure 1 , Figure 3 , Figure 5 as well as Figure 11 As shown, the micro-electrostatic device 2 is located on the detection fixture 3. The external power supply 1 is connected to the electrode contact 15 through a conductive connector. Pushing the micro-electrostatic device 2 along the surface of the detection fixture 3 causes the conductive connector to connect with the electrode contact 15. At the same time, the detection fixture 3 is grounded.

[0069] The technical solution is further configured such that the testing fixture 3 includes a side plate 4, and the side plate 4 has a mounting hole 9 for mounting the conductive connector, and the mounting hole 9 is insulated from the conductive connector at the point of contact.

[0070] Specifically, side plate 4 can be made of insulating material. Alternatively, side plate 4 can be made of conductive material, with insulation only at the junction of mounting hole 9 and conductive connector.

[0071] It is worth noting that multiple mounting holes 9 are provided to match the spacing of the electrode contacts 15. When the electrode contacts 15 are located on the same side of the micro-electrostatic device 2, the conductive connector can be installed by selecting the mounting hole 9 corresponding to the electrode contact 15. When the electrode contacts 15 are located on different sides of the micro-electrostatic device 2, the electrode contacts 15 on one side are connected to the conductive connectors on the side plate 4, and the electrode contacts 15 on the other side can be connected to the external power supply 1 through other conductive elements. Alternatively, the detection fixture 3 is provided with two opposite side plates 4, and the electrode contacts 15 on both sides are connected to the conductive connectors on the corresponding side plates 4.

[0072] This technical solution is further configured such that the detection fixture 3 also includes a base plate 6, which is attached to the lower surface of the micro-electrostatic device 2, i.e., the micro-electrostatic device 2 is located on the base plate 6. The base plate 6 is provided with a first conductive layer, which is connected in series or in parallel with the ammeter 11.

[0073] Specifically, the base plate 6 can be made of a conductive material. Alternatively, the base plate 6 can be made of an insulating material, with a first conductive layer only at the point where the base plate 6 contacts the side of the micro-electrostatic device 2.

[0074] This technical solution is further configured such that if the reading of the ammeter 11 shows an increasing trend or a fluctuating trend, arcing occurs at the contact point between the detection element 7 and the micro-electrostatic device 2, or arcing occurs at the contact point between the base plate 6 and the micro-electrostatic device 2, it indicates that the dielectric material is damaged.

[0075] If the reading of ammeter 11 shows a decreasing trend, and no arcing occurs at the contact points between the detection element 7, the base plate 6, and the micro-electrostatic device 2, it indicates that the dielectric material is not damaged.

[0076] The technical solution is further configured such that the detection fixture 3 also includes a back plate 5, the back plate 5 is provided with a second conductive layer, and the second conductive layer is bonded to the first conductive layer.

[0077] Specifically, the backplate 5 can be made of a conductive material. Alternatively, the backplate 5 can be made of an insulating material, with a second conductive layer only at the point where the backplate 5 contacts the side of the micro-electrostatic device 2.

[0078] The technical solution is further configured such that the base plate 6 has a first elongated hole 8 along its width direction, and the back plate 5 has a second elongated hole 10 corresponding to the first elongated hole 8. The first elongated hole 8 and the second elongated hole 10 are fastened by fastening bolts, and the relative position of the back plate 5 and the base plate 6 can be adjusted by fastening bolts.

[0079] It is worth noting that, such as Figure 4 As shown, the back plate 5 has an L-shaped structure, with one side fitting against the side of the micro-electrostatic device 2 and the other side fitting against the base plate 6. The position of the back plate 5 can be adjusted by using the first elongated hole 8, the second elongated hole 10, and the fastening bolts to accommodate micro-electrostatic devices 2 of different specifications.

[0080] This technical solution is further configured such that if the reading of the ammeter 11 shows an increasing trend or a fluctuating trend, or if arcing occurs at the contact point between the detection element 7 and the micro-electrostatic device 2, or if arcing occurs at the contact point between the base plate 6 and the micro-electrostatic device 2, it indicates that the dielectric material is damaged.

[0081] If the reading of ammeter 11 shows an increasing trend or a fluctuating trend, or if arcing occurs at the point where the back plate 5 and the micro-electrostatic device 2 are in contact, it indicates that the electrode strip is not properly wrapped.

[0082] If the reading of ammeter 11 shows a decreasing trend, and no arcing occurs at the contact points between the detection element 7, base plate 6, back plate 5 and micro-static device 2, it indicates that micro-static device 2 is a qualified product.

[0083] The technical solution is further configured such that the conductive connector is a spring pin 16, which includes a housing 17, a spring 18 and a pin 19. The housing 17 has a cavity inside, the spring 18 is located in the cavity, the first end of the pin 19 extends into the cavity and is connected to the spring 18, and the second end of the pin 19 is located outside the cavity.

[0084] Specifically, the outer casing 17 is located inside and fixed within the mounting hole 9. The first end of the ejector pin 19 is connected to the external power supply 1, and the second end of the ejector pin 19 is connected to the electrode contact 15. The second end of the ejector pin 19 is toothed to improve its contact stability with the electrode contact 15. In other embodiments, such as... Figure 6 As shown, the second end of the ejector pin 19 can also be configured as a needle.

[0085] like Figure 1 , Figure 7 As shown, the detection element 7 is made of conductive material. One end of the detection element 7 is in contact with the surface of the micro-electrostatic device 2 and moves along the surface of the micro-electrostatic device 2. The other end of the detection element 7 is connected in series or in parallel with the ammeter 11.

[0086] This technical solution is further configured such that, in S300, if the reading of the ammeter 11 shows an increasing trend or a fluctuating trend, or if arcing occurs at the contact point between the detection element 7 and the micro-electrostatic device 2, it indicates that the dielectric material is damaged.

[0087] It is worth noting that when the detection element 7 moves, if the detection element 7 comes into contact with the damaged part of the dielectric material, the charge accumulated on the micro-electrostatic device 2 will be released quickly. At this time, the external power supply 1 will continue to charge the micro-electrostatic device 2, and the ammeter 11 will show an increasing trend and a fluctuating trend. At the same time, an arcing phenomenon will occur on the detection element 7, accompanied by a sound.

[0088] The technical solution is further configured such that the length of the detection element 7 is the same as the width of the filter layer 14, so as to improve the detection accuracy.

[0089] This technical solution is further configured such that the detection element 7 is provided with a through hole 20 and an insulating handle 21. The through hole 20 is electrically connected to the ammeter 11 via a wire, and the insulating handle 21 is convenient for holding. Specifically, the insulating handle 21 completely covers the top of the detection element 7, and a clearance groove is provided on the insulating handle 21 to accommodate the through hole 20. In some other embodiments, such as... Figure 8As shown, the insulating handle 21 does not completely cover the top of the detection element 7, which facilitates the setting of the through hole 20.

[0090] This technical solution is further configured such as... Figure 9 As shown, the end of the detection element 7 that contacts the upper surface of the micro-electrostatic device 2 is configured as a brush-like structure 22 to improve the contact stability between the detection element 7 and the upper surface of the micro-electrostatic device 2.

[0091] Example 2:

[0092] like Figure 11 As shown, the parts that are the same as those in Embodiment 1 will not be repeated here. The differences are as follows:

[0093] A quality inspection method for an external power supply micro-electrostatic device includes:

[0094] S100, the electrode contacts of the micro-electrostatic device are electrically connected to its external power supply and ammeter to form an energized circuit.

[0095] The S200 electrostatic field detector moves its test probe along the surface of the micro electrostatic device. When the absolute value of the real-time induced voltage displayed by the electrostatic field detector is not less than the voltage threshold, it indicates that the dust collection plate and electrode strip of the micro electrostatic device are connected normally. Otherwise, it indicates that the dust collection plate and electrode strip of the micro electrostatic device are connected abnormally.

[0096] S300. Connect the detection element to the energized circuit. The detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged. Conversely, it indicates that the dielectric material is damaged.

[0097] This technical solution is further configured such that, in step S200, the movement path of the test probe of the electrostatic field detector on the surface of the micro-electrostatic device follows an S-shaped curve, avoiding missed detection points and improving detection accuracy. Due to the unique structure of the micro-electrostatic module, detection along the S-shaped curve can include all energized conditions.

[0098] This technical solution is further configured such that, in S200, the method for determining the voltage threshold is as follows:

[0099] The micro-electrostatic device is charged using the external power supply. When the micro-electrostatic device is fully charged, the induced voltage in the fully charged state is measured using an electrostatic field detector. 0.5-1 times this induced voltage is used as the voltage threshold of the electrostatic field detector, preferably 0.8 times, to quickly determine the quality of the micro-electrostatic device during production, at which point the device is essentially close to being fully charged. It is worth noting that other multiples can also be selected for detection and judgment.

[0100] This technical solution is further configured such that, following S300, it also includes:

[0101] S500: Switch the electrical connection between the electrode contacts of the micro-electrostatic device and the external power supply, connect the ammeter to the circuit to form a energized circuit again, and connect the detection element to the energized circuit.

[0102] S700: The detection element contacts the other surface of the micro-electrostatic device and moves along the other surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

[0103] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of this application should still fall within the scope of the present invention.

Claims

1. A quality inspection method for an external power supply micro-electrostatic device, characterized in that, include: S100. The micro-electrostatic device is located on the testing fixture, which includes a side plate, a base plate, and a conductive connector. The side plate has mounting holes for mounting the conductive connector. The mounting holes are insulated from the conductive connector. The base plate has a first conductive layer. The first conductive layer is connected in series or in parallel with the ammeter. The electrode contacts of the micro-electrostatic device are electrically connected to its external power supply and the ammeter to form a power-conducting circuit, and the testing element is connected to the power-conducting circuit. After the external power supply and the micro electrostatic device form a power-carrying circuit, the external power supply charges the micro electrostatic device. As the charging time increases, the charging current gradually decreases. S300: The detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows an increasing or fluctuating trend, or if arcing occurs at the contact point between the detection element and the micro-electrostatic device, or at the contact point between the base plate and the micro-electrostatic device, it indicates that the dielectric material is damaged. If the ammeter reading shows a decreasing trend, and no arcing occurs at the contact points between the detection element, the base plate, and the micro-electrostatic device, it indicates that the dielectric material is not damaged.

2. The quality inspection method for an external power supply micro-electrostatic device according to claim 1, characterized in that, Following the S300 are: S500: Switch the electrical connection between the electrode contacts of the micro-electrostatic device and the external power supply, connect the ammeter to the circuit to form a energized circuit again, and connect the detection element to the energized circuit. S700: The detection element contacts the other surface of the micro-electrostatic device and moves along the other surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

3. The quality inspection method for an external power supply micro-electrostatic device according to claim 2, characterized in that: In the S500, the electrical connection between the electrode contacts of the micro-electrostatic device and the external power supply is switched as follows: The micro-electrostatic device is flipped 180°, after which the electrode contacts of the micro-electrostatic device are electrically connected to the external power supply.

4. The quality inspection method for an external power supply micro-electrostatic device according to claim 1, characterized in that, The testing fixture also includes a back plate, which has a second conductive layer attached to the first conductive layer.

5. The quality inspection method for an external power supply micro-electrostatic device according to claim 4, characterized in that, The base plate has a first elongated hole along its width direction, and the back plate has a second elongated hole corresponding to the first elongated hole. The first elongated hole and the second elongated hole are fastened together by fastening bolts, and the relative position of the back plate and the base plate can be adjusted by fastening bolts.

6. The quality inspection method for an external power supply micro-electrostatic device according to claim 4, characterized in that, If the ammeter reading shows an increasing or fluctuating trend, or if arcing occurs at the contact point between the detection element and the micro-electrostatic device, or at the contact point between the base plate and the micro-electrostatic device, it indicates that the dielectric material is damaged. If the ammeter reading shows an increasing or fluctuating trend, or if arcing occurs at the point where the backplate and the micro-electrostatic device are in contact, it indicates that the electrode strip is not properly wrapped. If the ammeter reading shows a decreasing trend, and no arcing occurs at the contact points between the detection element, base plate, back plate, and micro-electrostatic device, it indicates that the micro-electrostatic device is a qualified product.

7. A quality inspection method for an external power supply micro-electrostatic device according to any one of claims 1-3, characterized in that, The detection element is made of conductive material. One end of the detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device. The other end of the detection element is connected in series or in parallel with an ammeter.

8. A quality inspection method for an external power supply micro-electrostatic device according to claim 7, characterized in that, The end of the detection element that contacts the surface of the micro-electrostatic device is designed as a brush.

9. A quality inspection method for an external power supply micro-electrostatic device according to claim 1, characterized in that, include: S100, the electrode contacts of the micro-electrostatic device are electrically connected to its external power supply and ammeter to form an energized circuit. The S200 electrostatic field detector moves its test probe along the surface of the micro electrostatic device. When the absolute value of the real-time induced voltage displayed by the electrostatic field detector is not less than the voltage threshold, it indicates that the dust collection plate and electrode strip of the micro electrostatic device are connected normally. Otherwise, it indicates that the dust collection plate and electrode strip of the micro electrostatic device are connected abnormally. S300. Connect the detection element to the energized circuit. The detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device. The ammeter reading is detected in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged. Conversely, it indicates that the dielectric material is damaged.

10. A quality inspection method for an external power supply micro-electrostatic device according to claim 9, characterized in that, In S200, the movement path of the test probe of the electrostatic field detector on the surface of the micro-electrostatic device is an S-shaped curve.

11. A quality inspection method for an external power supply micro-electrostatic device according to claim 9, characterized in that, In S200, the method for determining the voltage threshold is as follows: The micro-electrostatic device is charged using the external power supply. When the micro-electrostatic device is fully charged, the induced voltage in the fully charged state is measured using an electrostatic field detector, and 0.5-1 times the induced voltage is taken as the voltage threshold of the electrostatic field detector.

12. The quality inspection method for an external power supply micro-electrostatic device according to claim 9, characterized in that, Following the S300 are: S500: Switch the electrical connection between the electrode contacts of the micro-electrostatic device and the external power supply, connect the ammeter to the circuit to form a energized circuit again, and connect the detection element to the energized circuit. S700: The detection element contacts the other surface of the micro-electrostatic device and moves along the other surface of the micro-electrostatic device to detect the ammeter reading in real time. If the ammeter reading shows a decreasing trend, it indicates that the dielectric material is not damaged; otherwise, it indicates that the dielectric material is damaged.

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