Manufacturing method of heat dissipating circuit board structure and embedded circuit board

Abstract

A manufacturing method of a heat dissipation circuit board structure and an embedded circuit board are disclosed. The manufacturing method of the heat dissipation circuit board structure includes: forming a cross-shaped through hole in a circuit board, the circuit board including a board material and a metal layer inside the board material; recessing a receiving groove to the metal layer from each of two board surfaces of the board material; widening the center of the cross-shaped through hole to form a deformation opening, so that the metal layer has multiple edge portions around the deformation opening and arranged apart from each other; and inserting a heat conduction block from one of the receiving grooves along the deformation opening towards the other receiving groove, so that the multiple edge portions are bent between the heat conduction block and the inner wall surface of the other receiving groove.

Description

Technical Field

[0001] This invention relates to a circuit board, and more particularly to a method for manufacturing a heat-dissipating circuit board structure and an embedded circuit board. Background Technology

[0002] Existing circuit boards are constructed by carving out a slot corresponding to the size of a heat-conducting block, and then embedding the heat-conducting block into the slot of the existing circuit board. However, the existing method of embedding heat-conducting blocks in circuit boards has been in use for many years, and the problems it causes (such as difficulty in rework and high requirements for processing precision) have persisted and are difficult to improve effectively.

[0003] Therefore, the applicant believes that the above-mentioned defects can be improved. With dedicated research and application of scientific principles, the applicant has finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0004] The purpose of this invention is to provide a method for manufacturing a heat-dissipating circuit board structure and an embedded circuit board, which can effectively improve the defects that may occur in existing circuit boards.

[0005] This invention discloses a method for manufacturing a heat-dissipating circuit board structure, comprising: a patterning step: forming a through-hole in a predetermined area of ​​a circuit board; wherein the circuit board includes a substrate and a metal layer located inside the substrate, and the through-hole penetrates the metal layer and the substrate; a slotting step: forming a receiving groove extending to the metal layer from each of the two surfaces of the substrate in the predetermined area of ​​the circuit board, such that the through-hole is located only in the metal layer and connects to the two receiving grooves; an opening step: widening the center of the through-hole in the metal layer to form a deformation opening, such that the metal layer portion located in the predetermined area has a plurality of edge portions surrounding the deformation opening and spaced apart from each other; and an embedding step: inserting a heat-conducting block from one of the receiving grooves along the deformation opening toward the other receiving groove, such that the plurality of edge portions are bent and located between the heat-conducting block and the inner wall surface of the other receiving groove.

[0006] This invention also discloses a method for manufacturing a heat-dissipating circuit board structure, comprising: a groove-cutting step: providing a circuit board comprising a substrate and a metal layer located inside the substrate, and in a predetermined area of ​​the circuit board, a receiving groove is recessed from each of the two surfaces of the substrate to the metal layer; a hole-opening step: forming a deformation opening in the metal layer to form an annular portion surrounding the deformation opening in the portion of the metal layer located in the predetermined area; a patterning step: patterning the annular portion to form a plurality of edge portions spaced apart from each other; and an embedding step: inserting a heat-conducting block from one of the receiving grooves along the deformation opening toward another receiving groove, such that the plurality of edge portions are bent and located between the heat-conducting block and the inner wall surface of the other receiving groove.

[0007] This invention discloses an embedded circuit board, comprising: a substrate having two surfaces located on opposite sides; and a metal layer located inside the substrate; wherein the substrate has a recessed receiving groove extending from each of the surfaces to the metal layer, and the metal layer has a deformation opening communicating with each of the receiving grooves; wherein the metal layer has a plurality of edge portions spaced apart from each of the receiving grooves around the deformation openings at a location corresponding to any one of the receiving grooves, and each edge portion is bendable toward the inner wall of any one of the receiving grooves to form a spring arm shape.

[0008] In summary, the manufacturing method of the heat-dissipating circuit board structure and the embedded circuit board disclosed in the embodiments of the present invention use a bendable structure design of multiple edges to match the heat-conducting block, thereby reducing the processing accuracy requirements of the receiving groove (or, thereby enabling the embedded circuit board to allow the heat-conducting block embedded therein to have a large range of processing errors), and also facilitating the rework of the heat-conducting block and the embedded circuit board.

[0009] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the patterned steps of the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 1 of the present invention.

[0011] Figure 2 This is a schematic diagram of the groove-cutting step in the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 1 of the present invention.

[0012] Figure 3 for Figure 2A cross-sectional view along section line III-III;

[0013] Figure 4 This is a schematic diagram of the hole-opening steps in the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 1 of the present invention.

[0014] Figure 5 for Figure 4 A cross-sectional view along section line VV;

[0015] Figure 6 and Figure 7 This is a schematic diagram of the embedding steps in the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 1 of the present invention;

[0016] Figure 8 This is a schematic diagram of the filling steps in the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 1 of the present invention.

[0017] Figure 9 This is a schematic diagram of the groove-cutting step in the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 2 of the present invention;

[0018] Figure 10 for Figure 9 A cross-sectional view along section line XX;

[0019] Figure 11 This is a schematic diagram of the hole-opening steps in the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 2 of the present invention;

[0020] Figure 12 This is a schematic diagram illustrating the patterned steps of the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 2 of the present invention.

[0021] Symbol Explanation

[0022] 1000: Heat-dissipating circuit board structure

[0023] 100: Embedded circuit board

[0024] 100a: Circuit board

[0025] 1: Board material

[0026] 11a, 11b: Panel surface

[0027] 12a, 12b: Reception slots

[0028] 121a, 121b: inner wall surface

[0029] 2: Metal layer

[0030] 21: Deformation Mouth

[0031] 22: Edge

[0032] 23: Circular part

[0033] 3: Cross-shaped through holes

[0034] 200: Heatsink

[0035] 201: Central Section

[0036] 300: Fill layer

[0037] H: Thickness direction

[0038] R: Preset area

[0039] G: Gap

[0040] α: Bending angle

[0041] T: Thickness

[0042] D1: First Distance

[0043] D2: Second Distance

[0044] L: Length

[0045] S110: Patterning Steps

[0046] S130: Trenching Steps

[0047] S150: Hole Opening Procedure

[0048] S170: Embedding Steps

[0049] S190: Filling Procedure

[0050] S210: Trenching Steps

[0051] S230: Hole Opening Procedure

[0052] S250: Patterning Steps Detailed Implementation

[0053] The following specific embodiments illustrate the implementation of the "manufacturing method of heat-dissipating circuit board structure and embedded circuit board" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0054] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0055] [Example 1]

[0056] Please see Figures 1 to 8 As shown, this is an embodiment of the present invention. This embodiment discloses a method for manufacturing a heat-dissipating circuit board structure, which sequentially includes a patterning step S110, a grooving step S130, an opening step S150, an embedding step S170, and a filling step S190. The specific implementation of the above steps will be described below. However, it should be noted that the implementation order or implementation method of the above steps can be adjusted according to design requirements, or some steps can be omitted (e.g., the filling step S190 can be omitted), so it is not limited to the content of this embodiment.

[0057] The patterning step S110: as follows Figure 1 As shown, a through-hole 3 is formed in a predetermined region R (along a thickness direction H) of a circuit board 100a. In this embodiment, the cross-section of the predetermined region R (e.g., a cross-section of the predetermined region R perpendicular to the thickness direction H) is polygonal (e.g., quadrilateral), and the through-hole 3 is formed by recessing along multiple diagonal faces of the predetermined region R. Furthermore, the circuit board 100a includes a substrate 1 and a metal layer 2 located inside the substrate 1, and the through-hole 3 penetrates the metal layer 2 and the substrate 1.

[0058] The trenching step S130: as follows Figure 2 and Figure 3 As shown, in the preset area R of the circuit board 100a, each of the two surfaces 11a and 11b of the board material 1 (along the thickness direction H) is recessed to form a receiving groove 12a and 12b extending to the metal layer 2, so that the intersecting through hole 3 is located only in the metal layer 2 and communicates with the two receiving grooves 12a and 12b. It should be noted that the two receiving grooves 12a and 12b are described as having approximately the same size in this embodiment, but in other embodiments not shown in this invention, the sizes of the two receiving grooves 12a and 12b can be adjusted and differ from each other according to design requirements.

[0059] The opening step S150: as follows: Figure 4 and Figure 5As shown, the center of the cross-shaped through hole 3 in the metal layer 2 is widened to form a deformation opening 21, so that the portion of the metal layer 2 located in the preset region R has a plurality of edge portions 22 that surround the deformation opening 21 and are spaced apart from each other, thereby forming an embedded circuit board 100a.

[0060] In this embodiment, each side of the cross-section of the preset region R is provided with an edge portion 22, and each edge portion 22 is approximately trapezoidal. Furthermore, each edge portion 22 of the embedded circuit board 100 can be bent toward the inner wall surface 121a, 121b of any of the receiving grooves 12a, 12b to form a spring arm shape.

[0061] The embedding step S170: as follows Figure 6 and Figure 7 As shown, a heat-conducting block 200 is inserted from one of the receiving grooves 12b through the deformation opening 21 (along the thickness direction H) toward the other receiving groove 12a, such that a plurality of edge portions 22 are bent and positioned between the heat-conducting block 200 and the inner wall surface 121a of the other receiving groove 12a. Each edge portion 22 (after being bent) is spring-loaded and elastically abuts against the heat-conducting block 200, thereby clamping and positioning the heat-conducting block 200 by the plurality of edge portions 22.

[0062] It should be further noted that a central segment 201 of the heat-conducting block 200 is clamped and positioned on a plurality of the edge portions 22, and the cross-section of the preset region R is larger than the cross-section of the central segment 201 of the heat-conducting block 200, while the size of the deformation port 21 is smaller than the cross-section of the central segment 201 of the heat-conducting block 200.

[0063] In other words, the specific shape and size of the preset region R and the deformation port 21 in this embodiment can be defined or shaped based on the heat-conducting block 200. Furthermore, the heat-conducting block 200 is described as a cube in this embodiment, but the invention is not limited thereto. For example, in other embodiments not shown in the invention, the heat-conducting block 200 may have the largest cross-section in the central segment 201, while the cross-sections of the remaining portions are smaller than the cross-section of the central segment 201.

[0064] More specifically, the thickness T of any of the edge portions 22, two edge portions 22 facing each other are separated by a first distance D1 at their adjacent end edges and by a second distance D2 at their far end edges; any of the sides of the cross section of the central segment 201 has a length L, and the length L of any of the sides conforms to the following relationship: (D2-2T)>L>D1.

[0065] Furthermore, the heat-conducting block 200 is spaced apart from the inner wall surfaces 121a, 121b of each of the receiving grooves 12a, 12b, and each groove has a gap G. The size of the gap G depends on the bending angle α of the plurality of edge portions 22. In this embodiment, the bending angle α of each edge portion 22 is preferably between 60 degrees and 90 degrees, but the present invention is not limited thereto. That is, depending on the size difference between the heat-conducting block 200 and each of the receiving grooves 12a, 12b, each edge portion 22 can be bent with a different bending angle α, so that there can be a large tolerance range of error between the heat-conducting block 200 and each of the receiving grooves 12a, 12b.

[0066] The filling step S190: as follows Figure 8 As shown, a filling layer 300 is formed to fill each of the gaps G. The material of the filling layer 300 can be adjusted according to design requirements. For example, electroplating can be performed in each of the gaps G to form the filling layer 300 (e.g., a conductive filling layer); or, an insulating material can be filled in each of the gaps G to form the filling layer 300 (e.g., an insulating filling layer).

[0067] The manufacturing method of the heat dissipation circuit board structure described above in this embodiment can be achieved by implementing the above-mentioned multiple steps. Figure 8 The illustrated heat-dissipating circuit board structure 1000 includes the embedded circuit board 100, the heat-conducting block 200 embedded within the embedded circuit board 100, and the filler layer 300 filling the embedded circuit board 100. However, the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the heat-dissipating circuit board structure 1000 may be manufactured by performing other steps or omit the filler layer 300 (e.g.: Figure 7 Alternatively, the embedded circuit board 100 can be used alone (e.g., for sale) or in combination with other components.

[0068] The specific structure of the heat dissipation circuit board structure 1000 in this embodiment will be briefly described below. Please refer to the description in the manufacturing method of the heat dissipation circuit board structure as appropriate (that is, the technical features already described in the manufacturing method of the heat dissipation circuit board structure will not be repeated here).

[0069] like Figure 8As shown, the embedded circuit board 100 includes a substrate 1 and a metal layer 2 formed on the substrate 1. The substrate 1 has two surfaces 11a and 11b located on opposite sides, and a receiving groove 12a and 12b is recessed from each of the surfaces 11a and 11b. The metal layer 2 is located inside the substrate 1 and forms the bottom of the two receiving grooves 12a and 12b. The metal layer 2 forms a deformation opening 21 communicating with each receiving groove 12, and the metal layer 2 forms a plurality of edge portions 22 around the deformation opening 21 and spaced apart from each other at a portion corresponding to any of the receiving grooves 12a and 12b. Furthermore, the heat-conducting block 200 is inserted into the embedded circuit board 100 from one of the receiving slots 12b along the deformation port 21 toward the other receiving slot 12a, and the plurality of edge portions 22 are bent and located between the heat-conducting block 200 and the inner wall surface 121a of the other receiving slot 12a.

[0070] More specifically, a central segment 201 of the heat-conducting block 200 is clamped and positioned on a plurality of the edge portions 22, and the size of the deformation opening 21 is smaller than the cross-section of the central segment 201 of the heat-conducting block 200. The cross-section of the central segment 201 is polygonal (e.g., quadrilateral), and the positions of the plurality of edge portions 22 correspond to a plurality of sides of the cross-section (e.g., four sides), but the invention is not limited thereto. For example, in other embodiments of the invention not illustrated, the number of the plurality of edge portions 22 may also be less than the number of sides of the cross-section.

[0071] The filling layer 300 may be a conductive filling layer that fills each of the gaps G by electroplating. Furthermore, the metal layer 2, the heat-conducting block 200, and the filling layer 300 (e.g., the conductive filling layer) are all made of the same material, so that the plurality of edge portions 22 and the heat-conducting block 200 are integrally connected to each other through the filling layer 300 (e.g., the conductive filling layer). Alternatively, the filling layer 300 may also be an insulating filling layer that fills each of the gaps G by filling each of the gaps G with an insulating material.

[0072] As described above, the manufacturing method of the heat-dissipating circuit board structure and the embedded circuit board 100 (or the heat-dissipating circuit board structure 1000 disclosed in the embodiments of the present invention) are designed with a bendable structure of multiple edge portions 22 to match the heat-conducting block 200, thereby reducing the processing accuracy requirements of the receiving grooves 12a and 12b (or, thereby enabling the embedded circuit board 100 to allow the heat-conducting block 200 embedded therein to have a large range of processing errors).

[0073] Furthermore, the manufacturing method of the heat-dissipating circuit board structure and the embedded circuit board 100 disclosed in the embodiments of the present invention (or the heat-dissipating circuit board structure 1000 disclosed in the embodiments of the present invention) can also facilitate the heat-conducting block 200 and the embedded circuit board 100 to perform rework operations (e.g., the heat-conducting block 200 can be pressed and moved away from the metal layer 2 and separated from the embedded circuit board 100).

[0074] [Example 2]

[0075] Please see Figures 9 to 12 As shown, this is Embodiment 2 of the present invention. Since this embodiment is similar to Embodiment 1 above, the similarities between the two embodiments will not be repeated (e.g., the embedding step S170 and the filling step S190). The main difference between this embodiment and Embodiment 1 is that the manufacturing method of the heat-dissipating circuit board structure in this embodiment first performs a trenching step S210, followed by a hole-opening step S230 and a patterning step S250 in sequence, which is different from the implementation order in Embodiment 1. The trenching step S210, the hole-opening step S230, and the patterning step S250 in this embodiment will be described below:

[0076] The trenching step S210: as follows Figure 9 and Figure 10 As shown, a circuit board 100a is provided, which includes a substrate 1 and a metal layer 2 formed on the substrate 1. In a predetermined area R of the circuit board 100a, two surfaces 11a and 11b of the substrate 1 are each recessed to form a receiving groove 12a and 12b extending to the metal layer 2.

[0077] The opening step S230: as follows: Figure 11 As shown, a deformation opening 21 is formed in the metal layer 2, so that a ring-shaped portion 23 is formed around the deformation opening 21 in the portion of the metal layer 2 located in the preset region R.

[0078] The patterning step S250: as follows Figure 11 and Figure 12 As shown, the annular portion 23 is patterned to form a plurality of edge portions 22 spaced apart from each other.

[0079] [Technical Effects of the Embodiments of the Invention]

[0080] In summary, the manufacturing method of the heat-dissipating circuit board structure and the embedded circuit board (or the heat-dissipating circuit board structure disclosed in the embodiments of the present invention) are designed with multiple bendable edge portions to match the heat-conducting blocks, thereby reducing the processing accuracy requirements of the receiving groove (or enabling the embedded circuit board to allow the heat-conducting blocks embedded therein to have a large range of processing errors), and also facilitating the rework of the heat-conducting blocks and the embedded circuit board.

[0081] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A method for manufacturing a heat-dissipating circuit board structure, comprising: Patterning step: A through-hole is formed in a predetermined area of ​​the circuit board; wherein the circuit board includes a substrate and a metal layer located inside the substrate, and the through-hole penetrates the metal layer and the substrate; Grooving step: In the preset area of ​​the circuit board, a receiving groove is formed from each of the two surfaces of the board material to the metal layer, so that the cross-shaped through hole is located only in the metal layer and communicates with the two receiving grooves; Opening step: The center of the intersecting through-hole in the metal layer is widened to form a deformation opening, so that the metal layer portion located in the predetermined region has a plurality of edge portions spaced apart from each other and surrounding the deformation opening; and Embedding step: Insert the heat-conducting block from one of the receiving slots along the deformation opening toward the other receiving slot, so that the plurality of the edges are bent and located between the heat-conducting block and the inner wall surface of the other receiving slot.

2. The manufacturing method of the heat-dissipating circuit board structure as described in claim 1, wherein, In the embedding step, the heat-conducting block is spaced apart from the inner wall surface of each of the receiving grooves and each groove has a gap. Each edge portion is elastically abutted against the heat-conducting block in the shape of a spring arm, so that the heat-conducting block is clamped and positioned by the multiple edge portions.

3. The manufacturing method of the heat-dissipating circuit board structure as described in claim 2, wherein, The manufacturing method of the heat-dissipating circuit board structure further includes a filling step after the embedding step: electroplating is performed in each of the gaps to form a conductive filling layer that fills each of the gaps.

4. The manufacturing method of the heat-dissipating circuit board structure as described in claim 2, wherein, The manufacturing method of the heat-dissipating circuit board structure further includes a filling step after the embedding step: filling each of the gaps with insulating material to form an insulating filling layer that fills each of the gaps.

5. The manufacturing method of the heat-dissipating circuit board structure as described in claim 2, wherein, The central section of the heat-conducting block is clamped and positioned on multiple edge portions, and the cross-section of the preset area is larger than the cross-section of the central section of the heat-conducting block, while the size of the deformation port is smaller than the cross-section of the central section of the heat-conducting block.

6. The method for manufacturing a heat-dissipating circuit board structure as described in claim 1, wherein, The central section of the heat-conducting block is clamped and positioned on a plurality of the edge portions; in the embedding step, the thickness of any one of the edge portions is defined as T, two edge portions facing each other are separated by a first distance at their adjacent end edges, which is defined as D1, and are separated by a second distance at their far end edges, which is defined as D2, any side of the cross section of the central section has a length, which is defined as L, and the length of any one of the sides conforms to the following relationship: (D2-2T)>L>D1.

7. The method for manufacturing a heat-dissipating circuit board structure as described in claim 1, wherein, The cross-section of the preset region is polygonal, and each side of the cross-section of the preset region is provided with an edge portion.

8. The method for manufacturing a heat-dissipating circuit board structure as described in claim 7, wherein, In the patterning step, the intersecting through holes are formed by recessing multiple diagonal surfaces along the preset area.

9. A method for manufacturing a heat-dissipating circuit board structure, comprising: Grooving step: A circuit board is provided, which includes a board material and a metal layer located inside the board material, and a receiving groove is formed from each of the two sides of the board material to the metal layer in a predetermined area of ​​the circuit board. Opening step: A deformation opening is formed in the metal layer so that the portion of the metal layer located in the preset area forms an annular portion surrounding the deformation opening; Patterning step: Pattern the annular portion to form a plurality of edge portions spaced apart from each other; as well as Embedding step: Insert the heat-conducting block from one of the receiving slots along the deformation opening toward the other receiving slot, so that the plurality of the edges are bent and located between the heat-conducting block and the inner wall surface of the other receiving slot.

10. An embedded circuit board, comprising: A sheet material having two surfaces located on opposite sides; as well as A metal layer is located inside the plate; wherein the plate has a receiving groove formed from each of the plate surfaces extending to the metal layer, and the metal layer has a deformation opening communicating with each of the receiving grooves; The metal layer has a plurality of edge portions that are spaced apart from each other around the deformation opening at a location corresponding to any of the receiving grooves, and each edge portion can be bent toward the inner wall of any of the receiving grooves to be in the shape of a spring arm.

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