Composite electroplated single-layer polymeric abrasive diamond wire, preparation method, device and application

Abstract

The present invention relates to a composite electroplated single-layer polymeric abrasive diamond wire, a preparation method, a device and an application thereof. The product has a skin-core structure and is composed of a metal wire and a single-layer polymeric abrasive plated on its surface. The polymeric abrasive has the characteristics of micro-fracture and a multi-micro-edge structure. The polymeric abrasive is mainly composed of superhard micropowder and binder powder, and the binder powder contains active metal powder. The method is as follows: during the Roll-to-Roll wire feeding process of the metal wire, sand plating is carried out on the metal wire to obtain the composite electroplated single-layer polymeric abrasive diamond wire. The device includes a driving device and a sand plating device. The driving device is used to drive the metal wire for Roll-to-Roll wire feeding. The sand plating device is used to plate the polymeric abrasive on the metal wire. The application is for the cutting and processing of high-hard and brittle semiconductor wafers. The product of the present invention has a small diameter, a simple method, a simple device, is applied to cutting and processing, has less consumption and a long service life.

Description

Technical Field

[0001] The present invention belongs to the technical field of cutting, and relates to a composite electroplated single-layer polymer abrasive diamond wire, a preparation method, a device and an application thereof. Background Art

[0002] Semiconductor materials (such as silicon crystals, sapphires, SiC, etc.) are widely used in chip manufacturing and LED displays due to their excellent optoelectronic properties, and the demand is continuously increasing. The first important processing step after semiconductor crystal growth is cutting, and the slice thickness and surface quality directly affect the processing time of subsequent grinding and polishing processes.

[0003] After years of technological changes, diamond wire saws have now replaced saw blades and slurry wires as the preferred tool for semiconductor ingot cutting, and diamond wires electroplated with diamond particles on the surface of metal wires are the mainstream.

[0004] Currently, electroplated diamond wires usually use diamond particles with a particle size of 3 - 20 μm, electroplated on the surface of steel wires with a diameter between 30 - 60 μm, and the coating thickness is between 20 - 60 μm. In the face of the development trend of large-size and thin-sliced ingot cutting, it is imperative to improve the wire cutting speed and reduce the diameter of the diamond wire. Patent CN115138701A discloses a method for preparing an ultra-fine diamond wire busbar. Although it reduces the diameter of the diamond wire by reducing the diameter of the metal wire, it is prone to wire breakage, especially after increasing the wire cutting speed. Summary of the Invention

[0005] To solve the problem that the service life of the diamond wire is shortened while its diameter is reduced in the prior art, the present invention provides a composite electroplated single-layer polymer abrasive diamond wire, a preparation method, a device and an application thereof.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A composite electroplated single-layer polymer abrasive diamond wire has a skin-core structure and is composed of a metal wire and a single-layer polymer abrasive coated on its surface. The polymer abrasive has a micro-fracture characteristic and a multi-micro-edge structure; the polymer abrasive is mainly composed of super-hard micropowder and binder powder, and the binder powder contains active metal powder.

[0008] Both "micro-fracture characteristic" and "multi-micro-edge structure" are technical terms, especially in the field of abrasive processing. "Micro-fracture characteristic" means that when a single super-hard micropowder on the surface of a single polymer abrasive is stressed, the binding force coating it breaks and the super-hard micropowder falls off. "Multi-micro-edge structure" means that the surface of the polymer abrasive can be regarded as multiple cutting edges.

[0009] Similar to patent CN115138701A, the present invention also reduces the diameter of the diamond wire by reducing the coating thickness. However, the present invention will not shorten the service life of the diamond wire. Because although the coating thickness decreases and its abrasive holding force decreases, due to the multi-micro-edge structure of the polymeric abrasive, the surface is rough and the surface area is large. Under the same coating thickness condition, compared with single-particle abrasives with a smooth surface (such as single-crystal diamond), the contact area is increased. At the same time, due to the micro-crushing characteristics of the polymeric abrasive, the diamond particles on the surface layer fall off after being cut and passivated, and the sharp diamond particles in the subsurface are exposed and participate in cutting, improving the cutting efficiency. In addition, the micro-crushing characteristics and multi-micro-edge structure can respectively improve the cutting stability and reduce the surface / subsurface damage of the cut surface.

[0010] There are polymeric abrasives with micro-crushing characteristics and multi-micro-edge structures in the prior art, but the prior art has not used them on diamond wires and mainly applies them to grinding and polishing. Because the diamond wire cutting in the prior art mainly relies on mechanical force and has relatively high requirements for the bonding strength between the metal wire and the polymeric abrasive, the bonding strength between the metal wire and the polymeric abrasive often cannot meet the requirements, resulting in the diamond wire composed of the two being unable to be used for cutting; the diamond wire cutting of the present invention no longer relies solely on mechanical force, and the cutting principle is the coupling of multi-energy fields of friction-catalyzed enhanced mechanical force-frictional heat-chemical reaction to improve the processing efficiency and stability. Specifically: the mechanical energy generated by high-speed cutting and the heat energy generated by friction cause the chemical structure of the cut surface of the crystal rod to change. At the same time, the active metal contained in the polymeric abrasive, such as Fe added during the firing of the polymeric abrasive grains, can generate high-valent iron and act as a catalyst to promote H2O or OH in the cutting fluid - to lose electrons and become hydroxyl radicals ·OH with strong oxidizing properties, oxidizing the damaged layer of the cut surface and softening it, so the requirements for the bonding strength between the metal wire and the polymeric abrasive are relatively reduced.

[0011] As a preferred technical solution:

[0012] For a composite electroplated single-layer polymeric abrasive diamond wire as described above, the metal wire is a steel wire or a tungsten wire with a diameter between 30 and 60 μm.

[0013] For a composite electroplated single-layer polymeric abrasive diamond wire as described above, the particle size of the polymeric abrasive is between 20 and 60 μm; the particle size of the superhard micropowder is between 3 and 10 μm, and the content of the superhard micropowder is 25 to 75% of the total mass of the superhard micropowder and the binder powder; the particle size of the binder powder is between 0.1 and 2 μm.

[0014] Considering the current range of the abrasive sizes used in diamond wires, the present invention sets the particle size of the polymeric abrasive between 20 and 60 μm. In addition, the superhard micropowder is set with a particle size of 3 to 10 μm according to the currently common sizes, and the particle size of the binder powder is about 1 / 5 or even smaller than that of the superhard micropowder, which is beneficial to filling the particle gaps, increasing the compactness and wear resistance of the polymeric abrasive, and extending the service life.

[0015] A composite electroplated single-layer polymeric abrasive diamond wire as described above, wherein the superhard micropowder is one or more of single-crystal diamond, polycrystalline diamond, and cubic boron nitride; the binder powder is a mixture of inorganic powder and active metal powder with a mass ratio of 4:1 to 8:1. The brittle fracture of the inorganic powder causes micro-fracture of the polymeric abrasive grains, and the active metal fills the pores, appropriately increasing the bonding strength. At the same time, the active metal or the oxidized active oxide is beneficial to tribocatalysis and can be used as a metal catalyst. The inorganic powder is one or more of silicon dioxide, silicon nitride, aluminum oxide, zirconium oxide, titanium oxide, and cerium oxide, and the active metal powder is one or more of Ag, Cu, Al, Ti, Fe, and Mg.

[0016] A composite electroplated single-layer polymeric abrasive diamond wire as described above, and the preparation steps of the polymeric abrasive are as follows:

[0017] (1) Mixing: The superhard micropowder and the binder powder are mixed evenly by wet ball milling or dry powder mixing to obtain a mixed powder. The mixed powder obtained by wet ball milling needs to be dried;

[0018] (2) Molding: After adding a binder to the mixed powder, a green body is formed by photocuring or hot pressing; the binder is one or more of UV resin, polyvinyl acetate, polyvinyl alcohol, and polyvinyl acetal; the mass of the binder is 1 to 6% of the mass of the mixed powder; among them, when using the photocuring method, the binder is UV resin; when using the hot pressing method, the binder is one or more of polyvinyl acetate, polyvinyl alcohol, and polyvinyl acetal;

[0019] (3) Granulation: The green body is dried, degummed, sintered, crushed, and classified to obtain the polymeric abrasive.

[0020] A composite electroplated single-layer polymeric abrasive diamond wire as described above. Due to the rough surface of the polymeric abrasive, compared with diamond particles of the same size, the effective contact area is larger when plating the same thickness of the coating, and the polymeric abrasive is not easily detached. The embedding depth of the polymeric abrasive (which can be understood as the complement of the abrasive exposure height) is 40 to 50% of the polymeric abrasive particle size, which is lower than the traditional abrasive embedding depth of 70%.

[0021] A composite electroplated single-layer polymeric abrasive diamond wire as described above, and the plating strength of the composite electroplated single-layer polymeric abrasive diamond wire is 600 to 950 KPa. According to the literature, the prior art is generally in the range of 140 to 540 KPa.

[0022] The present invention also provides a method for preparing a composite electroplated single-layer polymeric abrasive diamond wire as described in any one of the above. During the process of the metal wire walking in a Roll-to-Roll manner, sanding electroplating is performed on the metal wire to obtain the composite electroplated single-layer polymeric abrasive diamond wire. Sanding electroplating means electroplating the polymeric abrasive on the metal wire by means of roller brush plating. The walking speed is 10 - 25 mm / min, and the optimal speed is 15 mm / min. During sanding electroplating, the current density is 8 - 30 kA / m 2 , and the optimal value is 19 kA / m 2 , and the rotational speed of the roller brush is 350 - 500 r / min, and the optimal value is 450 r / min.

[0023] As Figure 1 shown, the present invention electroplates the polymeric abrasive on the surface of the metal wire through composite electroplating, and only forms a single-layer coating. The polymeric abrasive grains with a multi-edge structure achieve self-sharpening through the micro-crushing process. It can be seen that under the condition of unchanged metal wire diameter, changing the coating to a single layer can reduce the wire diameter of the diamond wire. However, due to the rough surface of the polymeric abrasive, the bonding strength of the coating increases instead of decreasing, and it is not easy to fall off as a whole, thus improving the service life.

[0024] As a preferred technical solution:

[0025] For the method as described above, before sanding electroplating the metal wire, the metal wire is pretreated. The pretreatment means sequentially pickling and washing the metal wire by spraying to remove rust and oil on the surface. After sanding electroplating the metal wire, the metal wire is post-treated. The post-treatment means sequentially performing ultrasonic cleaning, drying, and de-hydrogenation on the metal wire.

[0026] The present invention also provides an apparatus for preparing a composite electroplated single-layer polymeric abrasive diamond wire as described in any one of the above, including a driving device and a sanding electroplating device. The driving device is used to drive the metal wire to walk in a Roll-to-Roll manner. The sanding electroplating device is used to electroplate the polymeric abrasive on the metal wire by means of roller brush plating.

[0027] The single-layer abrasive electroplating proposed by the present invention can reduce the wire diameter while ensuring that the size of the metal busbar is not easily broken. However, it is difficult for existing machine tools to ensure the coating thickness. To ensure single-layer electroplating, the present invention realizes single-layer electroplating by walking in a single pass and adjusting the walking speed. The polymeric abrasive, single-layer electroplating, and Roll-to-Roll complement each other.

[0028] As a preferred technical solution:

[0029] For the apparatus as described above, it further includes a pretreatment device and a post-treatment device. The pretreatment device, the sanding electroplating device, and the post-treatment device are arranged in sequence along the walking direction of the diamond wire. The pretreatment device is used to sequentially pickle and wash the metal wire by spraying, and the post-treatment device is used to sequentially perform ultrasonic cleaning, drying, and de-hydrogenation on the metal wire.

[0030] The device as described above, the transmission device consists of a fixed wheel, a tensioning wheel, a guide wheel set, a steering wheel set and a driving wheel; the guide wheel set consists of two guide wheels arranged vertically, and the two are respectively located on the upper and lower sides of the metal wire; the steering wheel set consists of two steering wheels arranged vertically, and the two are simultaneously located on the left or right side of the metal wire;

[0031] The pretreatment device consists of a pickling spray head group, a water washing spray head group and a liquid tank; the pickling spray head group consists of two pickling spray heads arranged vertically, and the two are respectively located on the upper and lower sides of the metal wire; the water washing spray head group consists of two water washing spray heads arranged vertically, and the two are respectively located on the upper and lower sides of the metal wire;

[0032] The sanding and plating device consists of an electroplating bath, a round roller brush group, a power supply and a nickel plate; the round roller brush group consists of two round roller brushes arranged horizontally in parallel (i.e., metal rollers with felt wrapped on the surface), and the two are respectively located on the front and rear sides of the metal wire, and the middle distance is less than the diameter of the metal wire to ensure complete contact between the metal wire and the round roller brush; the round roller brush is immersed in the electroplating bath, and the immersion depth is 1 / 10 to 1 / 6 of the diameter of the round roller brush; the nickel plate is located in the electroplating bath;

[0033] The post-treatment device consists of an ultrasonic water tank, a drying head group and an annealing furnace; the drying head group consists of two drying heads arranged vertically, and the two are respectively located on the upper and lower sides of the metal wire.

[0034] For the device as described above, the number of fixed wheels is one, the number of tensioning wheels is two, the number of guide wheel sets is eight, the number of steering wheel sets is three, the number of pickling spray head groups is two, the number of water washing spray head groups is one, the number of liquid tanks is one, the number of sanding and plating devices is two, the number of ultrasonic water tanks is one, the number of drying head groups is one, the number of annealing furnaces is one, and the number of driving wheels is two;

[0035] The fixed wheel, the first tensioning wheel, the first guide wheel set, the first pickling spray head group, the second pickling spray head group, the water washing spray head group, the second guide wheel set, the first steering wheel set, the third guide wheel set, the first sanding and plating device, the fourth guide wheel set, the second steering wheel set, the fifth guide wheel set, the second sanding and plating device, the sixth guide wheel set, the third steering wheel set, the seventh guide wheel set, the ultrasonic water tank, the drying head group, the eighth guide wheel set, the second tensioning wheel, the first driving wheel and the second driving wheel are arranged in sequence along the running direction of the metal wire;

[0036] The first steering wheel set and the second steering wheel set are located on the left and right sides, the first steering wheel set and the third steering wheel set are located on the same side, and the first steering wheel set, the second steering wheel set and the third steering wheel set are arranged in sequence from top to bottom;

[0037] The first pickling spray head group, the second pickling spray head group and the water washing spray head group are located above the liquid tank, and the second driving wheel is located in the annealing furnace.

[0038] For the device as described above, in each upper sand plating device, the number of electroplating baths is one, the number of circular roller brush sets is three and they are arranged sequentially along the direction of the metal wire, the number of power supplies is one, and the number of nickel plates is one. The positive electrode of the power supply is connected to the nickel plate while the negative electrode is connected to the steering wheel closest to it.

[0039] Although roller brush plating is an existing technology, the multi-roller brush one-path electroplating of the present invention is proposed for the first time. Compared with the previous reciprocating wire-walking path, the multi-roller brush layout electroplates the metal wire on a one-way single-pass path, plating it only once without going back, avoiding uneven electroplating caused by multiple reciprocations. In particular, it is a means to ensure single-layer electroplated composite abrasive.

[0040] The present invention also provides an application of a composite electroplated single-layer composite abrasive diamond wire as described in any one of the above, which is used for the cutting process of high-hard and brittle semiconductor wafers. The Mohs hardness of the high-hard and brittle semiconductor wafers exceeds 8.5, such as silicon, sapphire, and silicon carbide.

[0041] As a preferred technical solution:

[0042] For the application as described above, when cutting high-hard and brittle semiconductor wafers, the wire consumption of the composite electroplated single-layer composite abrasive diamond wire is 1.0 - 2.9 m / kg, that is, 1 m of diamond wire is consumed for every 1 kg of wafer cut. The smaller the wire consumption value, the longer the life of the diamond wire.

[0043] Beneficial effects

[0044] (1) For the composite electroplated single-layer composite abrasive diamond wire of the present invention, only a single layer of composite abrasive is electroplated on its surface. The single-layer electroplated composite abrasive effectively reduces the coating thickness, reduces the wire diameter of the diamond wire, and at the same time prevents the coating of the multi-layer electroplated diamond wire from falling off in blocks under stress, changing the shape accuracy of the diamond wire and reducing the slicing flatness and surface quality.

[0045] (2) To achieve single-layer plating, it is necessary to control the coating thickness. In the prior art, CN111979572A and CN214736192U only control the wire-walking speed and current intensity and cannot solve the problem of coating re-plating in the current cyclic wire-walking electroplating process. Therefore, the present invention proposes a Roll-to-Roll electroplating device to achieve one-way wire-walking from the inlet to the outlet, which is also beneficial for large-scale production.

[0046] (3) The present invention provides a method for composite electroplating a single-layer composite abrasive diamond wire, which has few processes, high cutting yield, good surface quality, and mass production.

[0047] (4) The device of the present invention has a simple and feasible structure.

[0048] (5) Application of the composite electroplated single-layer polymeric abrasive diamond wire of the present invention. When cutting and processing a high-hardness and brittle semiconductor ingot, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 1.0 - 2.9 m / kg, with low wire consumption and long service life. Since the polymeric abrasive used has a multi-micro-edge structure, there are few scratches on the sliced surface and the surface quality is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic diagram of the diamond wire structure of the present invention and the process of cutting the ingot;

[0050] Figure 2 It is a flowchart of the preparation method and device of the diamond wire of the present invention;

[0051] Figure 3 is Figure 2 the view from direction A in

[0052] Among them: 1 - fixed wheel, 2 - tensioning wheel, 3 - guiding wheel, 4 - pickling spray head, 5 - water washing spray head, 6 - turning wheel, 7 - liquid tank, 8 - circular roller brush, 9 - power supply, 10 - electroplating bath, 11 - nickel plate, 12 - ultrasonic water tank, 13 - drying head, 14 - annealing furnace, 15 - driving wheel. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0053] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and not to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of this application.

[0054] In the description of the present invention, the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention; at the same time, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance; in addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of this application.

[0055] It should be noted that:

[0056] (1) The manufacturers and grades / part numbers of the relevant substances in each embodiment are as follows:

[0057] Steel wire: 304 stainless steel wire;

[0058] Tungsten wire: The manufacturer is Luoyang Fujiede Tungsten Molybdenum Materials Co., Ltd., and the grade is W1;

[0059] UV resin: The manufacturer is Huizhou Falaix New Materials Co., Ltd., and the grade is FL-001;

[0060] Polyvinyl acetate: The CAS number is 9003-20-7;

[0061] Polyvinyl alcohol: The CAS number is 9002-89-5;

[0062] Polyvinyl acetal: The CAS number is 70775-95-0;

[0063] Polycrystalline silicon rod: The manufacturer is Taizhou Aites Optoelectronic Materials Co., Ltd., and the grade is ATS-Si-2;

[0064] Sapphire crystal rod: The manufacturer is Kunshan Zhonglun Electronics Co., Ltd., and the grade is IN-B100;

[0065] Single crystal silicon carbide rod: The manufacturer is Suzhou Henglixin New Materials Co., Ltd., and the grade is 019606.

[0066] (2) In each embodiment, the plating solution temperature during the sanding plating process is 65°C, the constant temperature control accuracy is ±2°C, and the plating solution components are as shown in the following table.

[0067] Table 1 Plating Solution Component Table

[0068]

[0069] (3) The detection methods for relevant properties in each embodiment are as follows:

[0070] The detection method for plating strength is: Use an INSTRON-5566 type material testing machine to perform compression and shear tests on the diamond wire sample to be tested. The indenter loading speeds are 0.2 m / s and 0.1 m / s respectively. The shear test sensor is selected as 500 N, and the compression test sensor is selected as 10 kN; Take the minimum value of the compressive strength and shear strength obtained from the test as the plating strength;

[0071] The detection method for wire consumption is: Use a microscope to observe the shape and surface morphology of the diamond wire, and combine the slicing efficiency to determine whether the diamond wire fails, and then determine the wire consumption. The diameter deviation of the diamond wire should be less than 15 μm, otherwise it will cause a large deviation in the slicing thickness exceeding the requirement, and the diamond wire will fail. The single-layer abrasive grain emergence rate on the surface of the diamond wire (the total number of all abrasives within the circumference of the wire per millimeter) should be between 100 and 200 grains / mm, otherwise the diamond wire fails. Judge the wire consumption of the diamond wire through these indicators;

[0072] The method for detecting the thickness deviation of a slice of a high-hard-brittle semiconductor crystal bar is as follows: Use a microscopic thickness tester to measure the thickness at different positions of the same slice, with at least 9 measurement points, calculate the difference between the maximum value and the minimum value, and this difference is the thickness deviation of the slice;

[0073] The method for detecting the average surface roughness of a slice of a high-hard-brittle semiconductor crystal bar is as follows: Use a white light interferometer to measure the surface roughness Sa of different areas on the front and back of the same slice, with at least 9 measurement points, and the average value of all measurement points is the average surface roughness of the slice;

[0074] The method for detecting the average subsurface damage depth of a slice of a high-hard-brittle semiconductor crystal bar is as follows: Use the cross-section microscopy method or the angle polishing method to measure the thickness of the subsurface damage layer, with at least 9 measurement points, and the average value of all measurement points is the average subsurface damage depth of the slice.

[0075] (4) The device used in step (3) of each embodiment for preparing the composite electroplated single-layer abrasive diamond wire, as Figure 2 and Figure 3 shown, includes a driving device, a sanding and plating device, a pretreatment device, and a post-treatment device; the driving device is used to drive the metal wire to move in a Roll-to-Roll manner, the pretreatment device is used to sequentially pickle and wash the metal wire in a spraying manner, the sanding and plating device is used to electroplate the abrasive on the metal wire by means of roller brush plating, and the post-treatment device is used to sequentially ultrasonically clean, dry, and de-hydrogenate the metal wire;

[0076] The driving device consists of a fixed wheel 1, two tension wheels 2, eight guide wheel groups, three turning wheel groups, and two driving wheels 15; each guide wheel group consists of two guide wheels 3 arranged vertically, which are respectively located on the upper and lower sides of the metal wire; each turning wheel group consists of two turning wheels 6 arranged vertically, which are both located on the left or right side of the metal wire;

[0077] The number of sanding and plating devices is two, and each sanding and plating device consists of an electroplating bath 10, three circular roller brush groups arranged in sequence along the direction of the metal wire, a power supply 9, and a nickel plate 11; each circular roller brush group consists of two circular roller brushes 8 arranged horizontally in parallel, which are respectively located on the front and back sides of the metal wire, and the middle distance is less than the diameter of the metal wire; the circular roller brush 8 is immersed in the electroplating bath 10, and the immersion depth is 1 / 10 to 1 / 6 of the diameter of the circular roller brush 8; the nickel plate 11 is located in the electroplating bath 10; the positive pole of the power supply 9 is connected to the nickel plate 11 while the negative pole is connected to the turning wheel 6 closest to it;

[0078] The pretreatment device consists of two pickling nozzle groups, one water washing nozzle group and a liquid tank 7; the pickling nozzle group consists of two pickling nozzles 4 arranged vertically, which are respectively located on the upper and lower sides of the metal wire; the water washing nozzle group consists of two water washing nozzles 5 arranged vertically, which are respectively located on the upper and lower sides of the metal wire;

[0079] The post-treatment device consists of an ultrasonic water tank 12, a drying head group and an annealing furnace 14; the drying head group consists of two drying heads 13 arranged vertically, which are respectively located on the upper and lower sides of the metal wire;

[0080] The fixed wheel 1, the first tensioning wheel, the first guide wheel group, the first pickling nozzle group, the second pickling nozzle group, the water washing nozzle group, the second guide wheel group, the first turning wheel group, the third guide wheel group, the first sanding and plating device, the fourth guide wheel group, the second turning wheel group, the fifth guide wheel group, the second sanding and plating device, the sixth guide wheel group, the third turning wheel group, the seventh guide wheel group, the ultrasonic water tank 12, the drying head group, the eighth guide wheel group, the second tensioning wheel, the first driving wheel and the second driving wheel are arranged in sequence along the direction of the metal wire;

[0081] The first turning wheel group and the second turning wheel group are located on the left and right sides, the first turning wheel group and the third turning wheel group are located on the same side, and the first turning wheel group, the second turning wheel group and the third turning wheel group are arranged in sequence from top to bottom;

[0082] The first pickling nozzle group, the second pickling nozzle group and the water washing nozzle group are located above the liquid tank 10, and the second driving wheel is located inside the annealing furnace 14.

[0083] Example 1

[0084] A preparation method of a composite electroplated single-layer polymeric abrasive diamond wire is as follows:

[0085] (1) Prepare raw materials:

[0086] Metal wire: a steel wire with a diameter of 30 μm;

[0087] Superhard micropowder: single crystal diamond with an average particle size of 3 μm;

[0088] Binder powder: a mixture of inorganic powder and active metal powder with a mass ratio of 4:1, wherein the inorganic powder is silica with an average particle size of 0.1 μm, and the active metal powder is Ag with an average particle size of 0.1 μm;

[0089] Binder: UV resin;

[0090] (2) Prepare polymeric abrasive:

[0091] (2.1) Use the wet ball milling method to mix the superhard micropowder and the binder powder evenly to obtain a mixed powder;

[0092] (2.2) After adding a binder to the mixed powder prepared in (2.1), a green body is made by photocuring. Among them, the mass of the binder is 3% of the mass of the mixed powder;

[0093] (2.3) The green body prepared in (2.2) is dried, degummed, sintered, crushed, and classified to obtain a polymeric abrasive. Among them, the drying temperature is 80 °C; the degumming temperature is 400 °C, and the degumming duration is 120 min; the sintering temperature is 600 °C, and the sintering duration is 240 min; the dehydrogenation temperature is 200 °C, and the dehydrogenation duration is 60 min;

[0094] The obtained polymeric abrasive has micro-crushing characteristics and a multi-micro-edge structure. The average particle size of the polymeric abrasive is 20 μm, and the content of super-hard micropowder is 25% of the total mass of the super-hard micropowder and the binder powder;

[0095] (3) Prepare a composite electroplated single-layer polymeric abrasive diamond wire:

[0096] (3.1) Pretreatment:

[0097] The metal wire is pickled and washed with water in sequence by spraying to remove rust and oil on the surface;

[0098] (3.2) Sand electroplating:

[0099] During the process of the metal wire moving in a Roll-to-Roll manner, the polymeric abrasive is electroplated on the metal wire by means of roller brush plating. Among them, the moving speed is 10 mm / min. During sand electroplating, the current density is 8 kA / m 2 , and the roller brush rotation speed is 350 r / min;

[0100] (3.3) Post-treatment:

[0101] The metal wire after sand electroplating is ultrasonically cleaned, dried, and dehydrogenated in an annealing furnace in sequence to obtain a composite electroplated single-layer polymeric abrasive diamond wire.

[0102] The composite electroplated single-layer polymeric abrasive diamond wire prepared by the above method has a skin-core structure and is composed of a metal wire and a single-layer polymeric abrasive electroplated on its surface. The average embedding depth of the polymeric abrasive is 40% of the average particle size of the polymeric abrasive, and the plating strength is 950 KPa.

[0103] An application of a composite electroplated single-layer polymeric abrasive diamond wire uses the composite electroplated single-layer polymeric abrasive diamond wire prepared above to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a polysilicon rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the cutting times are 50 times;

[0104] When cutting high-hard and brittle semiconductor wafers, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 1 m / kg, the wafering efficiency of the high-hard and brittle semiconductor wafer is 280 wafers / kg, the thickness deviation of the cut high-hard and brittle semiconductor wafer is 5 μm, the average surface roughness of the cut high-hard and brittle semiconductor wafer is 200 μm, and the average subsurface damage depth of the cut high-hard and brittle semiconductor wafer is 3 μm.

[0105] Comparative Example 1

[0106] A preparation method of a composite electroplated single-layer polymeric abrasive diamond wire is as follows:

[0107] (1) Prepare raw materials:

[0108] Metal wire: a steel wire with a diameter of 30 μm;

[0109] Superhard micropowder: single crystal diamond with an average particle size of 3 μm;

[0110] Binder powder: silica inorganic powder with an average particle size of 0.1 μm;

[0111] Binder: UV resin;

[0112] (2) Prepare polymeric abrasive:

[0113] (2.1) Use the wet ball milling method to uniformly mix the superhard micropowder and the binder powder to obtain a mixed powder;

[0114] (2.2) After adding the binder to the mixed powder prepared in (2.1), use photocuring to form a green body, wherein the mass of the binder is 3% of the mass of the mixed powder;

[0115] (2.3) Dry, degum, sinter, crush, and classify the green body prepared in (2.2) to obtain polymeric abrasive, wherein the drying temperature is 80 °C; the degumming temperature is 400 °C, and the degumming duration is 120 min; the sintering temperature is 600 °C, and the sintering duration is 240 min; the dehydrogenation temperature is 200 °C, and the dehydrogenation duration is 60 min;

[0116] The prepared polymeric abrasive has micro-crushing characteristics and a multi-micro-edge structure, the average particle size of the polymeric abrasive is 20 μm, and the content of the superhard micropowder is 25% of the total mass of the superhard micropowder and the binder powder;

[0117] (3) Prepare a composite electroplated single-layer polymeric abrasive diamond wire:

[0118] (3.1) Pretreatment:

[0119] Spray the metal wire with acid and water in sequence to remove rust and oil on the surface;

[0120] (3.2) Upper sand plating:

[0121] During the process of the metal wire in Roll-to-Roll routing, the polymeric abrasive is plated on the metal wire by means of roller brush plating. Among them, the routing speed is 10 mm / min. During upper sand plating, the current density is 8 kA / m 2 , and the roller brush rotation speed is 350 r / min;

[0122] (3.3) Post-treatment:

[0123] The metal wire after upper sand plating is successively subjected to ultrasonic cleaning, drying, and hydrogen removal in an annealing furnace to obtain a composite electroplated single-layer polymeric abrasive diamond wire.

[0124] The composite electroplated single-layer polymeric abrasive diamond wire prepared by the above method has a skin-core structure and is composed of a metal wire and a single-layer polymeric abrasive plated on its surface. The average embedding depth of the polymeric abrasive is 40% of the average particle size of the polymeric abrasive, and the plating strength is 580 KPa.

[0125] An application of a composite electroplated single-layer polymeric abrasive diamond wire uses the above-prepared composite electroplated single-layer polymeric abrasive diamond wire to cut and process a high-hard and brittle semiconductor ingot with a Mohs hardness exceeding 8.5. Among them, the semiconductor ingot is a polysilicon ingot, the ingot size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0126] When cutting and processing the high-hard and brittle semiconductor ingot, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 3.2 m / / kg, the ingot slicing efficiency of the high-hard and brittle semiconductor ingot is 100 pieces / kg, the slicing thickness deviation of the high-hard and brittle semiconductor ingot is 12 μm, the average surface roughness of the sliced surface of the high-hard and brittle semiconductor ingot is 480 μm, and the average subsurface damage depth of the sliced surface of the high-hard and brittle semiconductor ingot is 21 μm.

[0127] Example 2

[0128] A preparation method of a composite electroplated single-layer polymeric abrasive diamond wire, the specific steps are as follows:

[0129] (1) Prepare raw materials:

[0130] Metal wire: a steel wire with a diameter of 35 μm;

[0131] Superhard micropowder: polycrystalline diamond with an average particle size of 4 μm;

[0132] Binder powder: a mixture of inorganic powder and active metal powder with a mass ratio of 5:1. Among them, the inorganic powder is silicon nitride with an average particle size of 0.5 μm, and the active metal powder is Cu with an average particle size of 0.1 μm;

[0133] Binder: polyvinyl acetate;

[0134] (2) Preparation of polymeric abrasive:

[0135] (2.1) Uniformly mix superhard micropowder and binder powder by wet ball milling to obtain a mixed powder;

[0136] (2.2) After adding a binder to the mixed powder obtained in (2.1), form a green body by hot pressing, wherein the mass of the binder is 1% of the mass of the mixed powder;

[0137] (2.3) Subject the green body obtained in (2.2) to drying, debinding, sintering, crushing, and classification to obtain polymeric abrasive, wherein the drying temperature is 80 °C; the debinding temperature is 400 °C, and the debinding time is 30 min; the sintering temperature is 600 °C, and the sintering time is 240 min; the dehydrogenation temperature is 200 °C, and the dehydrogenation time is 60 min;

[0138] The obtained polymeric abrasive has micro-fracture characteristics and a multi-micro-edge structure. The average particle size of the polymeric abrasive is 30 μm, and the content of the superhard micropowder is 50% of the total mass of the superhard micropowder and the binder powder;

[0139] (3) Preparation of a composite electroplated single-layer polymeric abrasive diamond wire:

[0140] (3.1) Pretreatment:

[0141] Pickle and wash the metal wire in sequence by spraying to remove rust and oil on the surface;

[0142] (3.2) Sand electroplating:

[0143] During the process of the metal wire moving in a Roll-to-Roll manner, electroplate the polymeric abrasive on the metal wire by roller brush plating, wherein the moving speed is 10 mm / min. During sand electroplating, the current density is 15 kA / m 2 , and the roller brush rotation speed is 350 r / min;

[0144] (3.3) Post-treatment:

[0145] Sequentially subject the metal wire after sand electroplating to ultrasonic cleaning, drying, and dehydrogenation in an annealing furnace to obtain a composite electroplated single-layer polymeric abrasive diamond wire.

[0146] The composite electroplated single-layer polymeric abrasive diamond wire prepared by the above method has a skin-core structure and is composed of a metal wire and a single-layer polymeric abrasive plated on its surface. The average embedding depth of the polymeric abrasive is 40% of the average particle size of the polymeric abrasive, and the plating strength is 810 KPa.

[0147] Application of a composite electroplated single-layer polymeric abrasive diamond wire. The composite electroplated single-layer polymeric abrasive diamond wire prepared above is used for cutting and processing a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a sapphire crystal rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0148] When cutting and processing the high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 1.5 m / kg, the wafering efficiency of the high-hard and brittle semiconductor crystal rod is 300 wafers / kg, the thickness deviation of the slices of the high-hard and brittle semiconductor crystal rod is 10 μm, the average surface roughness of the slices of the high-hard and brittle semiconductor crystal rod is 250 μm, and the average subsurface damage depth of the slices of the high-hard and brittle semiconductor crystal rod is 5 μm.

[0149] Example 3

[0150] A preparation method of a composite electroplated single-layer polymeric abrasive diamond wire, the specific steps are as follows:

[0151] (1) Prepare raw materials:

[0152] Metal wire: a steel wire with a diameter of 60 μm;

[0153] Superhard micropowder: cubic boron nitride with an average particle size of 5 μm;

[0154] Binder powder: a mixture of inorganic powder and active metal powder with a mass ratio of 4:1. Among them, the inorganic powder is alumina with an average particle size of 1 μm, and the active metal powder is Al with an average particle size of 0.5 μm;

[0155] Binder: polyvinyl alcohol;

[0156] (2) Prepare polymeric abrasive:

[0157] (2.1) Use the wet ball milling method to mix the superhard micropowder and the binder powder evenly to obtain a mixed powder;

[0158] (2.2) After adding the binder to the mixed powder prepared in (2.1), use the hot pressing method to make a green body. Among them, the mass of the binder is 1% of the mass of the mixed powder;

[0159] (2.3) The green body prepared in (2.2) is dried, degummed, sintered, crushed, and classified to obtain polymeric abrasive. Among them, the drying temperature is 100 °C; the degumming temperature is 450 °C, and the degumming duration is 60 min; the sintering temperature is 750 °C, and the sintering duration is 200 min; the dehydrogenation temperature is 200 °C, and the dehydrogenation duration is 120 min;

[0160] The obtained composite abrasive has micro-crushing characteristics and a multi-micro-edge structure. The average particle size of the composite abrasive is 30 μm, and the content of superhard micropowder is 50% of the total mass of the superhard micropowder and the binder powder;

[0161] (3) Prepare a composite electroplated single-layer composite abrasive diamond wire:

[0162] (3.1) Pretreatment:

[0163] Pickle and wash the metal wire in sequence by spraying to remove rust and oil on the surface;

[0164] (3.2) Sand electroplating:

[0165] During the process of the metal wire moving in a Roll-to-Roll manner, electroplate the composite abrasive on the metal wire by using roller brush electroplating. Among them, the moving speed of the wire is 10 mm / min. During sand electroplating, the current density is 15 kA / m 2 , and the rotational speed of the roller brush is 350 r / min;

[0166] (3.3) Post-treatment:

[0167] Sequentially perform ultrasonic cleaning, drying, and hydrogen removal in an annealing furnace on the metal wire after sand electroplating to obtain a composite electroplated single-layer composite abrasive diamond wire.

[0168] The composite electroplated single-layer composite abrasive diamond wire prepared by the above method has a skin-core structure and is composed of a metal wire and a single-layer composite abrasive plated on its surface. The average embedding depth of the composite abrasive is 45% of the average particle size of the composite abrasive, and the plating strength is 705 KPa.

[0169] An application of a composite electroplated single-layer composite abrasive diamond wire. Use the composite electroplated single-layer composite abrasive diamond wire prepared above to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a single-crystal silicon carbide rod, the size of the crystal rod is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0170] When cutting and processing the high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer composite abrasive diamond wire is 2 m / kg, the slicing efficiency of the high-hard and brittle semiconductor crystal rod is 250 slices / kg, the slicing thickness deviation of the high-hard and brittle semiconductor crystal rod is 10 μm, the average surface roughness of the sliced surface of the high-hard and brittle semiconductor crystal rod is 300 μm, and the average subsurface damage depth of the sliced surface of the high-hard and brittle semiconductor crystal rod is 5 μm.

[0171] Example 4

[0172] A preparation method of a composite electroplated single-layer composite abrasive diamond wire, and the specific steps are as follows:

[0173] (1) Prepare raw materials:

[0174] Metal wire: tungsten wire with a diameter of 30 μm;

[0175] Superhard micropowder: a mixture of single-crystal and polycrystalline diamond with an average particle size of 8 μm and a mass ratio of 1:1;

[0176] Binder powder: a mixture of inorganic powder and active metal powder with a mass ratio of 7:1, where the inorganic powder is zirconia with an average particle size of 2 μm and the active metal powder is Ti with an average particle size of 1.5 μm;

[0177] Binder: polyvinyl acetal;

[0178] (2) Prepare polymeric abrasive:

[0179] (2.1) Use the dry powder mixing method to mix the superhard micropowder and the binder powder evenly to obtain a mixed powder;

[0180] (2.2) After adding the binder to the mixed powder prepared in (2.1), use the hot pressing method to form a green body, where the mass of the binder is 6% of the mass of the mixed powder;

[0181] (2.3) Subject the green body prepared in (2.2) to drying, debinding, sintering, crushing, and grading to obtain the polymeric abrasive, where the drying temperature is 100 °C; the debinding temperature is 450 °C and the debinding duration is 90 min; the sintering temperature is 1100 °C and the sintering duration is 60 min; the dehydrogenation temperature is 200 °C and the dehydrogenation duration is 180 min;

[0182] The obtained polymeric abrasive has micro-crushing characteristics and a multi-micro-edge structure. The average particle size of the polymeric abrasive is 60 μm, and the content of the superhard micropowder is 50% of the total mass of the superhard micropowder and the binder powder;

[0183] (3) Prepare a composite electroplated single-layer polymeric abrasive diamond wire:

[0184] (3.1) Pretreatment:

[0185] Spray the metal wire with acid and water in sequence to remove rust and oil on the surface;

[0186] (3.2) Sand plating:

[0187] During the process of the metal wire running in a Roll-to-Roll manner, use the roller brush plating method to deposit the polymeric abrasive on the metal wire, where the running speed is 15 mm / min. During sand plating, the current density is 20 kA / m 2 , and the roller brush rotation speed is 450 r / min;

[0188] (3.3) Post-treatment:

[0189] The metal wire after upper sand plating is successively subjected to ultrasonic cleaning, drying, and hydrogen removal in an annealing furnace to obtain a composite electroplated single-layer polymeric abrasive diamond wire.

[0190] The composite electroplated single-layer polymeric abrasive diamond wire prepared by the above method has a skin-core structure and is composed of a metal wire and a single-layer polymeric abrasive coated on its surface. The average embedding depth of the polymeric abrasive is 50% of the average particle size of the polymeric abrasive, and the plating strength is 675 KPa.

[0191] An application of a composite electroplated single-layer polymeric abrasive diamond wire uses the above-prepared composite electroplated single-layer polymeric abrasive diamond wire to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a polysilicon rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0192] When cutting and processing the high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 1.5 m / kg, the slicing efficiency of the high-hard and brittle semiconductor crystal rod is 200 pieces / kg, the slicing thickness deviation of the high-hard and brittle semiconductor crystal rod is 12 μm, the average surface roughness of the sliced surface of the high-hard and brittle semiconductor crystal rod is 400 μm, and the average subsurface damage depth of the sliced surface of the high-hard and brittle semiconductor crystal rod is 7 μm.

[0193] Example 5

[0194] A preparation method of a composite electroplated single-layer polymeric abrasive diamond wire, the specific steps are as follows:

[0195] (1) Prepare raw materials:

[0196] Metal wire: tungsten wire with a diameter of 35 μm;

[0197] Superhard micropowder: a mixture of single-crystal diamond and cubic boron nitride with an average particle size of 10 μm and a mass ratio of 1:1;

[0198] Binder powder: a mixture of inorganic powder and active metal powder with a mass ratio of 8:1, where the inorganic powder is titanium oxide with an average particle size of 2 μm, and the active metal powder is Fe with an average particle size of 2 μm;

[0199] Binder: polyvinyl butyral;

[0200] (2) Prepare polymeric abrasive:

[0201] (2.1) Use the dry powder mixing method to mix the superhard micropowder and the binder powder evenly to obtain a mixed powder;

[0202] (2.2) After adding a binder to the mixed powder obtained in (2.1), a green body is made by hot pressing. Among them, the mass of the binder is 6% of the mass of the mixed powder;

[0203] (2.3) The green body obtained in (2.2) is dried, degummed, sintered, crushed, and classified to obtain polymeric abrasives. Among them, the drying temperature is 150 °C; the degumming temperature is 550 °C, and the degumming duration is 90 min; the sintering temperature is 1100 °C, and the sintering duration is 60 min; the dehydrogenation temperature is 200 °C, and the dehydrogenation duration is 180 min;

[0204] The obtained polymeric abrasives have micro-crushing characteristics and a multi-micro-edge structure. The average particle size of the polymeric abrasives is 60 μm, and the content of super-hard micropowder is 60% of the total mass of the super-hard micropowder and the binder powder;

[0205] (3) Preparation of a composite electroplated single-layer polymeric abrasive diamond wire:

[0206] (3.1) Pretreatment:

[0207] The metal wire is pickled and washed by spraying in sequence to remove rust and oil stains on the surface;

[0208] (3.2) Sand electroplating:

[0209] During the process of the metal wire moving in a Roll-to-Roll manner, the polymeric abrasives are electroplated on the metal wire by roller brush plating. Among them, the moving speed is 15 mm / min. During sand electroplating, the current density is 25 kA / m 2 , and the roller brush rotation speed is 500 r / min;

[0210] (3.3) Post-treatment:

[0211] The metal wire after sand electroplating is ultrasonically cleaned, dried, and dehydrogenated in an annealing furnace in sequence to obtain a composite electroplated single-layer polymeric abrasive diamond wire.

[0212] The composite electroplated single-layer polymeric abrasive diamond wire obtained by the above method has a skin-core structure and is composed of a metal wire and a single layer of polymeric abrasives electroplated on its surface. The average embedding depth of the polymeric abrasives is 50% of the average particle size of the polymeric abrasives, and the electroplating strength is 635 KPa.

[0213] An application of a composite electroplated single-layer polymeric abrasive diamond wire uses the above-obtained composite electroplated single-layer polymeric abrasive diamond wire to cut and process a high-hard and brittle semiconductor wafer with a Mohs hardness exceeding 8.5. Among them, the semiconductor wafer is a sapphire wafer, the wafer size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the cutting times are 50 times;

[0214] When cutting high-hard and brittle semiconductor wafers, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 1.8 m / kg, the wafering efficiency of the high-hard and brittle semiconductor wafer is 160 wafers / kg, the thickness deviation of the sliced high-hard and brittle semiconductor wafer is 12 μm, the average surface roughness of the sliced high-hard and brittle semiconductor wafer is 550 μm, and the average subsurface damage depth of the sliced high-hard and brittle semiconductor wafer is 9 μm.

[0215] Example 6

[0216] A preparation method of a composite electroplated single-layer polymeric abrasive diamond wire is as follows:

[0217] (1) Prepare raw materials:

[0218] Metal wire: tungsten wire with a diameter of 60 μm;

[0219] Superhard micropowder: a mixture of polycrystalline diamond and cubic boron nitride with an average particle size of 10 μm and a mass ratio of 1:1;

[0220] Binder powder: a mixture of inorganic powder and active metal powder with a mass ratio of 8:1, wherein the inorganic powder is cerium oxide with an average particle size of 2 μm, and the active metal powder is Mg with an average particle size of 2 μm;

[0221] Binder: a mixture of UV resin and polyvinyl alcohol with a mass ratio of 1:1;

[0222] (2) Prepare polymeric abrasive:

[0223] (2.1) Use the dry powder mixing method to mix the superhard micropowder and the binder powder evenly to obtain a mixed powder;

[0224] (2.2) After adding the binder to the mixed powder prepared in (2.1), use the hot pressing method to make a green body, wherein the mass of the binder is 6% of the mass of the mixed powder;

[0225] (2.3) Dry, degum, sinter, crush, and classify the green body prepared in (2.2) to obtain polymeric abrasive, wherein the drying temperature is 150 °C; the degumming temperature is 550 °C, and the degumming duration is 30 min; the sintering temperature is 1100 °C, and the sintering duration is 60 min; the dehydrogenation temperature is 200 °C, and the dehydrogenation duration is 180 min;

[0226] The prepared polymeric abrasive has micro-crushing characteristics and a multi-micro-edge structure. The average particle size of the polymeric abrasive is 60 μm, and the content of the superhard micropowder is 75% of the total mass of the superhard micropowder and the binder powder;

[0227] (3) Prepare a composite electroplated single-layer polymeric abrasive diamond wire:

[0228] (3.1) Pretreatment:

[0229] Pickle and wash the metal wire in a spraying manner successively to remove rust and oil stains on the surface;

[0230] (3.2) Sanding plating:

[0231] During the process of the metal wire walking in a Roll-to-Roll manner, polymer abrasive is plated on the metal wire by means of roller brush plating. Among them, the walking speed is 25 mm / min. When sanding plating, the current density is 30 kA / m 2 , and the roller brush rotation speed is 500 r / min;

[0232] (3.3) Post-treatment:

[0233] Successively carry out ultrasonic cleaning, drying and hydrogen removal in an annealing furnace on the metal wire after sanding plating to obtain a composite electroplated single-layer polymer abrasive diamond wire.

[0234] The composite electroplated single-layer polymer abrasive diamond wire prepared by the above method has a skin-core structure and is composed of a metal wire and a single-layer polymer abrasive plated on its surface. The average embedding depth of the polymer abrasive is 50% of the average particle size of the polymer abrasive, and the plating strength is 600 KPa.

[0235] An application of a composite electroplated single-layer polymer abrasive diamond wire. Use the composite electroplated single-layer polymer abrasive diamond wire prepared above to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a single-crystal silicon carbide rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0236] When cutting and processing the high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer polymer abrasive diamond wire is 2.9 m / / kg, the slicing efficiency of the high-hard and brittle semiconductor crystal rod is 110 pieces / kg, the slicing thickness deviation of the high-hard and brittle semiconductor crystal rod is 15 μm, the average surface roughness of the sliced surface of the high-hard and brittle semiconductor crystal rod is 600 μm, and the average subsurface damage depth of the sliced surface of the high-hard and brittle semiconductor crystal rod is 10 μm.

[0237] The best embodiments of the present invention have been illustrated. All changes or modifications made by those of ordinary skill in the art will not depart from the scope of the present invention. The parts not involved in the present invention are the same as those in the prior art or can be implemented by using the prior art.

Claims

1. A composite electroplated single-layer polymeric abrasive diamond wire, characterized in that, It has a core-shell structure, which consists of a metal wire and a single-layer polymeric abrasive coated on its surface. The polymeric abrasive has micro-crushing characteristics and a multi-micro-edge structure; The polymeric abrasive is mainly composed of superhard micropowder and binder powder, and the binder powder contains active metal powder; The metal wire is a steel wire or a tungsten wire with a diameter between 30 and 60 μm; the particle size of the polymeric abrasive is between 20 and 60 μm; the particle size of the superhard micropowder is between 3 and 10 μm, and the content of the superhard micropowder is 25 to 75% of the total mass of the superhard micropowder and the binder powder; the particle size of the binder powder is between 0.1 and 2 μm; the binder powder is a mixture of inorganic powder and active metal powder with a mass ratio of 4:1 to 8:

1. The inorganic powder is one or more of silicon dioxide, silicon nitride, alumina, zirconia, titanium oxide and cerium oxide, and the active metal powder is one or more of Ag, Cu, Al, Ti, Fe and Mg; The preparation steps of the polymeric abrasive are as follows: (1) Mixing: Mix the superhard micropowder and the binder powder evenly to obtain a mixed powder; (2) Forming: After adding a binder to the mixed powder, form a green body; the mass of the binder is 1 to 6% of the mass of the mixed powder; (3) Granulating the green body to obtain the polymeric abrasive; The embedding depth of the polymeric abrasive is 40 to 50% of the particle size of the polymeric abrasive.

2. The composite electroplated single-layer polymeric abrasive diamond wire according to claim 1, wherein The superhard micropowder is one or more of single-crystal diamond, polycrystalline diamond and cubic boron nitride.

3. A composite electroplated single-layer polymeric abrasive diamond wire according to claim 2, characterized in that In step (1), the superhard micropowder and the binder powder are mixed evenly to obtain a mixed powder by wet ball milling or dry powder mixing method; In step (2), the green body is formed by photocuring method or hot pressing method; The binder is one or more of UV resin, polyvinyl acetate, polyvinyl alcohol and polyvinyl acetal; In step (3), granulating the green body to obtain the polymeric abrasive means that the green body is dried, debinded, sintered, crushed and classified to obtain the polymeric abrasive.

4. A method for preparing a composite electroplated single-layer polymeric abrasive diamond wire according to any one of claims 1 to 3, characterized in that, During the Roll-to-Roll wire routing process of the metal wire, sand electroplating is performed on the metal wire to obtain a composite electroplated single-layer polymeric abrasive diamond wire; sand electroplating means electroplating the polymeric abrasive on the metal wire by means of roller brush plating; the wire routing speed is 10 - 25 mm / min; during sand electroplating, the current density is 8 - 30 kA / m 2 , and the roller brush rotation speed is 350 - 500 r / min.

5. The method according to claim 4, wherein Before sand plating on the metal wire, the metal wire is pretreated, and the pretreatment is to pickle and wash the metal wire by spraying in turn; after sand plating on the metal wire, the metal wire is post-treated, and the post-treatment is to ultrasonically clean, dry and dehydrogenate the metal wire in turn.

6. An apparatus for preparing a composite electroplated single-layer polymeric abrasive diamond wire according to any one of claims 1 to 3, characterized in that, It includes a transmission device and a sand plating device; the transmission device is used to drive the metal wire to run in a Roll-to-Roll manner; the sand plating device is used to coat the polymeric abrasive on the metal wire by roller brush plating.

7. The device according to claim 6, characterized in that It also includes a pretreatment device and a post-treatment device. The pretreatment device, the sand plating device and the post-treatment device are arranged in sequence along the running direction of the metal wire. The pretreatment device is used to pickle and wash the metal wire by spraying in turn, and the post-treatment device is used to ultrasonically clean, dry and dehydrogenate the metal wire in turn.

8. The device according to claim 7, characterized in that, The transmission device consists of a fixed wheel (1), a tension wheel (2), a guide wheel group, a turning wheel group and a driving wheel (15); the guide wheel group consists of two guide wheels (3) arranged up and down, and the two are respectively located on the upper and lower sides of the metal wire; the turning wheel group consists of two turning wheels (6) arranged up and down, and the two are both located on the left or right side of the metal wire; The pretreatment device consists of a pickling spray head group, a water washing spray head group and a liquid tank (7); the pickling spray head group consists of two pickling spray heads (4) arranged vertically, which are respectively located on the upper and lower sides of the metal wire; the water washing spray head group consists of two water washing spray heads (5) arranged vertically, which are respectively located on the upper and lower sides of the metal wire; The sanding and electroplating device consists of an electroplating bath (10), a round roller brush group, a power supply (9) and a nickel plate (11); the round roller brush group consists of two round roller brushes (8) arranged horizontally in parallel, which are respectively located on the front and rear sides of the metal wire, and the middle distance is less than the diameter of the metal wire to ensure complete contact between the metal wire and the round roller brush; the round roller brush (8) is immersed in the electroplating bath (10), and the immersion depth is 1 / 10 - 1 / 6 of the diameter of the round roller brush (8); the nickel plate (11) is located in the electroplating bath (10); The post-treatment device consists of an ultrasonic water tank (12), a drying head group and an annealing furnace (14); the drying head group consists of two drying heads (13) arranged vertically, which are respectively located on the upper and lower sides of the metal wire.

9. The device according to claim 8, characterized in that The number of fixed wheels (1) is one, the number of tensioning wheels (2) is two, the number of guide wheel groups is eight, the number of steering wheel groups is three, the number of pickling spray head groups is two, the number of water washing spray head groups is one, the number of liquid tanks (7) is one, the number of sanding and electroplating devices is two, the number of ultrasonic water tanks (12) is one, the number of drying head groups is one, the number of annealing furnaces (14) is one, and the number of driving wheels (15) is two; The fixed wheel (1), the first tensioning wheel, the first guide wheel group, the first pickling spray head group, the second pickling spray head group, the water washing spray head group, the second guide wheel group, the first steering wheel group, the third guide wheel group, the first sanding and electroplating device, the fourth guide wheel group, the second steering wheel group, the fifth guide wheel group, the second sanding and electroplating device, the sixth guide wheel group, the third steering wheel group, the seventh guide wheel group, the ultrasonic water tank (12), the drying head group, the eighth guide wheel group, the second tensioning wheel, the first driving wheel and the second driving wheel are arranged in sequence along the direction of the metal wire; The first steering wheel group and the second steering wheel group are located on the left and right sides, the first steering wheel group and the third steering wheel group are located on the same side, and the first steering wheel group, the second steering wheel group and the third steering wheel group are arranged in sequence from top to bottom; The first pickling spray head group, the second pickling spray head group and the water washing spray head group are located above the liquid tank (7), and the second driving wheel is located in the annealing furnace (14); In each sanding and electroplating device, the number of electroplating baths (10) is one, the number of round roller brush groups is three and they are arranged in sequence along the direction of the metal wire, the number of power supplies (9) is one, the number of nickel plates (11) is one, and the positive pole of the power supply (9) is connected to the nickel plate (11) while the negative pole is connected to the steering wheel (6) closest to it.

10. Application of a composite electroplated single-layer polymeric abrasive diamond wire according to any one of claims 1 to 3, characterized in that, For the cutting process of high-hard and brittle semiconductor wafers, the Mohs hardness of the high-hard and brittle semiconductor wafers exceeds 8.5; when cutting the high-hard and brittle semiconductor wafers, the wire consumption of the composite electroplated single-layer polymer abrasive diamond wire is 1.0 - 2.9 m / kg.

Images