A thermally conductive powder modifier and preparation method thereof and thermally conductive potting glue
By using vinyl long-chain alkoxysilane containing siloxane links as a thermal powder modifier in the silicone thermal potting glue, the problem of poor compatibility between the thermal powder and silicone oil is solved, and the thermal conductivity is improved and stability, achieving efficient modification of thermally conductive potting adhesives.
Patent Information
- Application Number
- CN202310123842.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-02-16
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2043-02-16
AI Technical Summary
The thermal powder and silicone oil in existing silicone thermal potting glue have poor compatibility, which causes the thermal powder to settle and thicken after long-term placement of the finished product, affecting service life and thermal conductivity.
Using vinyl long-chain alkoxysilane containing siloxane links as the thermal powder modifier, it is prepared by transesterification and condensation reaction, reducing the viscosity of the thermal potting glue, improving the thermal conductivity and slowing down the thermal powder Settling and cleavage to improve storage stability.
It effectively reduces the viscosity of thermally conductive potting, improves thermal conductivity, reduces the dielectric constant, slows down the settlement of thermally conductive powder and the emergence of plate junctions, and improves the storage stability of thermally conductive potting.
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Figure SMS_1
Abstract
Description
Technical Field
[0001] The utility model relates to the field of production of organic silicon thermal conductive materials, in particular to a preparation method of a thermal conductive powder modifier. Background Art
[0002] Silicone thermally conductive potting compound, also known as potting silicone or electronic silicone, is widely used in the electrical field, electronic integration field, electrical packaging field and electric vehicle field, etc., which helps to improve the safety and service life of electrical and electronic devices.
[0003] Silicone oil and inorganic thermal conductive powder are used in the production of organic silicone thermal conductive potting adhesive. The use of thermal conductive powder can ensure that the finished organic silicone thermal conductive potting adhesive has a higher thermal conductivity. In order to improve the compatibility of thermal conductive powder and silicone oil, the thermal conductive powder needs to be modified. Commonly used thermal conductive powder modifiers include alkoxysilane, stearic acid and titanate.
[0004] However, when the thermally conductive powder modified by the above modifier is actually used, it is found that its compatibility with silicone oil is still not excellent. In particular, the finished silicone thermal conductive potting glue produced therefrom will cause the thermal conductive powder in the silicone thermal conductive potting glue to settle and thicken when left for a long time, affecting its use and thermal conductivity. Utility Model Content
[0005] The purpose of the utility model is to provide a method for preparing a thermally conductive powder modifier, which can solve one or more of the above problems.
[0006] According to one aspect of the utility model, a thermally conductive powder modifier is provided, comprising a vinyl long-chain alkoxysilane containing a siloxane chain segment.
[0007] The beneficial effect of the thermally conductive powder modifier is as follows: after testing, the thermally conductive powder modifier can be applied to the modification of thermally conductive powders and can be applied to the preparation of thermally conductive potting glue to reduce the viscosity of the thermally conductive potting glue obtained, improve its thermal conductivity and heat dissipation performance, reduce the dielectric constant, slow down the sedimentation and agglomeration of thermally conductive powders in the thermally conductive potting glue, and improve the storage stability of the thermally conductive potting glue.
[0008] According to one aspect of the utility model, a method for preparing a thermally conductive powder modifier is provided, comprising the following steps:
[0009] Vinyl alkoxysilane is synthesized by transesterification reaction using vinyl trimethoxysilane or vinyl triethoxysilane as substrate;
[0010] The vinyl long-chain alkoxysilane containing siloxane segments is obtained by the condensation reaction of the monohydroxy silicone oil and the vinyl alkoxysilane.
[0011] The beneficial effects of the preparation method of the thermally conductive powder modifier are as follows: the method can obtain a thermally conductive powder modifier suitable for thermally conductive powder modification, and the thermally conductive powder modifier prepared by the method can be applied to the preparation of thermally conductive potting glue to reduce the viscosity of the prepared thermally conductive potting glue, improve its thermal conductivity and heat dissipation performance, reduce the dielectric constant, slow down the occurrence of sedimentation and agglomeration of thermally conductive powder in the thermally conductive potting glue, and improve the storage stability of the thermally conductive potting glue.
[0012] In some embodiments, a method for preparing a thermally conductive powder modifier comprises the following steps:
[0013] Add R2OH and solvent into a first container under nitrogen protection, heat the first container to a first temperature of 50°C to 80°C, add the catalyst while stirring at the first temperature, and the stirring time is 0.5h to 1h;
[0014] Dilute Vi-Si-(OR1)3 with a solvent in a second container to obtain a Vi-Si-(OR1)3 solution, and dropwise add the Vi-Si-(OR1)3 solution into the first container after stirring for 3 to 10 hours, so that the first container can undergo an ester exchange reaction:
[0015] Vi-Si-(OR1)3+ R2OH←→Vi-Si-(OR2)3+ R1OH,
[0016] Obtaining Vi-Si-(OR2)3 and R1OH, wherein the Vi-Si-(OR1)3 is vinyl trimethoxysilane or vinyl triethoxysilane, and the Vi-Si-(OR2)3 is vinyl alkoxysilane;
[0017] After the addition of the Vi-Si-(OR1)3 solution is completed, the first container is heated to a second temperature of 100°C to 120°C, and the first container is kept at the second temperature for 2h to 5h to evaporate R1OH and part of the solvent.
[0018] After the first heat preservation, the first container is cooled to 50°C-70°C, and then the monohydroxy silicone oil solution is added dropwise to the first container for 1h-2h. After the addition, a second heat preservation is performed for 2h-5h to allow the condensation reaction to proceed in the first container:
[0019] Vi-Si-(OR2)3+ OH-Si(CH3)2-O-[ Si(CH3)2-O] m - Si(CH3)3←→Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] mSi(CH3)3,
[0020] Obtain Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3, the OH-Si(CH3)2-O-[Si(CH3)2-O] m - Si(CH3)3 is a monohydroxy silicone oil, the Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3 is a vinyl long-chain alkoxysilane containing siloxane segments;
[0021] After the second heat preservation, the first container is heated to 110° C. to 130° C., and R2OH and the remaining solvent are distilled off to obtain a thermally conductive powder modifier.
[0022] In the preparation method of the thermal conductive powder modifier, it is possible to ensure that Vi-Si-(OR1)3 and R2OH undergo an effective transesterification reaction, and it is possible to ensure that Vi-Si-(OR2)3 and OH-Si(CH3)2-O-[Si(CH3)2-O] m - Si(CH3)3 effectively undergoes condensation reaction to ensure
[0023] And through multiple timely heating, R1OH, R2OH and solvent are eliminated as much as possible to effectively improve the purity of the obtained thermal conductive powder modifier.
[0024] In some embodiments, the catalyst is a basic material.
[0025] In some embodiments, the R2OH is n-decanol, n-dodecyl alcohol or n-octanol.
[0026] In some embodiments, the R1OH is methanol.
[0027] In some embodiments, the viscosity of the monohydroxy silicone oil is 10 cps to 50 cps.
[0028] According to one aspect of the utility model, a thermally conductive potting adhesive is provided, using the thermally conductive powder modifier according to claim 1 or 2.
[0029] The beneficial effects of the thermally conductive potting glue are as follows: after testing, the viscosity of the thermally conductive potting glue can be effectively reduced, the thermal conductivity and heat dissipation performance can be effectively improved, the dielectric constant can be reduced, the sedimentation and agglomeration of the thermally conductive powder in the thermally conductive potting glue can be slowed down, and the storage stability can be enhanced.
[0030] In some embodiments, the formula of the thermally conductive potting compound includes component A and component B.
[0031] The component A comprises 45 to 55 parts by weight of vinyl silicone oil, 540 to 560 parts by weight of thermally conductive powder, 4 to 6 parts by weight of the thermally conductive powder modifier and 1.5 to 2.5 parts by weight of a catalyst;
[0032] The component B comprises 45-55 parts by weight of vinyl silicone oil, 5-7 parts by weight of hydrogenated silicone oil, 540-560 parts by weight of thermally conductive powder, 4-6 parts by weight of the thermally conductive powder modifier and 0.8-1.2 parts by weight of an inhibitor;
[0033] The component A and the component B are mixed in a weight ratio of 0.8-1.2:0.8-1.2 and cured at 70-90° C. for 30 minutes or more. DETAILED DESCRIPTION
[0034] The utility model is further described in detail below in conjunction with the accompanying drawings.
[0035] Example 1
[0036] The first container is preferably a four-necked reaction bottle, the second container is preferably a flask, R2OH is preferably n-octanol, the solvent is preferably water, the catalyst is preferably NaOH, and Vi-Si-(OR1)3 is preferably vinyltrimethoxysilane.
[0037] A method for preparing a thermally conductive powder modifier comprises the following steps:
[0038] R2OH and solvent are added into the first container under nitrogen protection, and the first container is heated to a first temperature of about 50°C. Then, the catalyst is added under stirring at the first temperature for about 0.5 h.
[0039] Dilute Vi-Si-(OR1)3 with a solvent in a second container to obtain a Vi-Si-(OR1)3 solution, and dropwise add the Vi-Si-(OR1)3 solution into the first container after stirring for about 3 hours, so that the first container can undergo an ester exchange reaction:
[0040] Vi-Si-(OR1)3+ R2OH←→Vi-Si-(OR2)3+ R1OH,
[0041] Vi-Si-(OR2)3 and R1OH are obtained, wherein Vi-Si-(OR2)3 is mostly vinyl alkoxysilane and R1OH is mostly methanol;
[0042] After the addition of Vi-Si-(OR1)3 solution is completed, the temperature of the first container is raised to a second temperature of about 120°C, and the first container is kept warm for about 2 hours at the second temperature to evaporate R1OH and part of the solvent.
[0043] The first container after the first heat preservation is cooled to about 50°C, and then a monohydroxy silicone oil solution with a viscosity of 20 cps is added dropwise into the first container for about 1 hour. After the addition is completed, a second heat preservation is performed for about 2 hours to allow the condensation reaction to proceed in the first container:
[0044] Vi-Si-(OR2)3+ OH-Si(CH3)2-O-[ Si(CH3)2-O] m - Si(CH3)3←→Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3, where OH-Si(CH3)2-O-[Si(CH3)2-O] m - Si(CH3)3 refers to the above monohydroxy silicone oil, obtaining Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3, Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3 is mostly vinyl long-chain alkoxysilane containing siloxane chain segments.
[0045] After the second heat preservation, the first container is heated to about 120° C., and R2OH and the remaining solvent are distilled off to obtain a thermally conductive powder modifier.
[0046] Example 2
[0047] The first container is preferably a four-necked reaction bottle, the second container is preferably a flask, R2OH is preferably n-decanol, the solvent is preferably water, the catalyst is preferably KOH, and Vi-Si-(OR1)3 is preferably vinyltriethoxysilane.
[0048] A method for preparing a thermally conductive powder modifier comprises the following steps:
[0049] R2OH and solvent are added into the first container under nitrogen protection, and the first container is heated to a first temperature of about 60°C. Then, the catalyst is added while stirring at the first temperature for about 1 hour.
[0050] Dilute Vi-Si-(OR1)3 with a solvent in a second container to obtain a Vi-Si-(OR1)3 solution, and dropwise add the Vi-Si-(OR1)3 solution into the first container after stirring for about 5 hours, so that the first container can undergo an ester exchange reaction:
[0051] Vi-Si-(OR1)3+ R2OH←→Vi-Si-(OR2)3+ R1OH,
[0052] Vi-Si-(OR2)3 and R1OH are obtained, wherein Vi-Si-(OR2)3 is mostly vinyl alkoxysilane and R1OH is mostly methanol;
[0053] After the addition of Vi-Si-(OR1)3 solution is completed, the temperature of the first container is raised to a second temperature of about 130°C, and the first container is kept warm for about 5 hours at the second temperature to evaporate R1OH and part of the solvent.
[0054] The first container after the first heat preservation is cooled to about 60°C, and then a monohydroxy silicone oil solution with a viscosity of 10 cps is added dropwise into the first container for about 2 hours. After the addition is completed, a second heat preservation of about 5 hours is performed to allow the condensation reaction to proceed in the first container:
[0055] Vi-Si-(OR2)3+ OH-Si(CH3)2-O-[ Si(CH3)2-O] m - Si(CH3)3←→Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3, where OH-Si(CH3)2-O-[Si(CH3)2-O] m - Si(CH3)3 refers to the above monohydroxy silicone oil, obtaining Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3, Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3 is mostly vinyl long-chain alkoxysilane containing siloxane chain segments.
[0056] After the second heat preservation, the first container is heated to about 130° C., and R2OH and the remaining solvent are distilled off to obtain a thermally conductive powder modifier.
[0057] Example 3
[0058] The first container is preferably a four-necked reaction bottle, the second container is preferably a flask, R2OH is preferably n-dodecyl alcohol, the solvent is preferably water, the catalyst is preferably NaOH, and Vi-Si-(OR1)3 is preferably vinyltrimethoxysilane.
[0059] A method for preparing a thermally conductive powder modifier comprises the following steps:
[0060] R2OH and solvent are added into the first container under nitrogen protection, and the first container is heated to a first temperature of about 60°C. Then, the catalyst is added while stirring at the first temperature for about 1 hour.
[0061] Dilute Vi-Si-(OR1)3 with a solvent in a second container to obtain a Vi-Si-(OR1)3 solution, and dropwise add the Vi-Si-(OR1)3 solution into the first container after stirring for about 2 hours, so that the first container can undergo an ester exchange reaction:
[0062] Vi-Si-(OR1)3+ R2OH←→Vi-Si-(OR2)3+ R1OH,
[0063] Vi-Si-(OR2)3 and R1OH are obtained, wherein Vi-Si-(OR2)3 is mostly vinyl alkoxysilane and R1OH is mostly methanol;
[0064] After the addition of Vi-Si-(OR1)3 solution is completed, the temperature of the first container is raised to a second temperature of about 110°C, and the first container is kept warm for about 4 hours at the second temperature to evaporate R1OH and part of the solvent.
[0065] The first container after the first heat preservation is cooled to about 60°C, and then a monohydroxy silicone oil solution with a viscosity of 30 cps is added dropwise into the first container for about 2 hours. After the addition is completed, a second heat preservation of about 4 hours is performed to allow the condensation reaction to proceed in the first container:
[0066] Vi-Si-(OR2)3+ OH-Si(CH3)2-O-[ Si(CH3)2-O] m - Si(CH3)3←→Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3, where OH-Si(CH3)2-O-[Si(CH3)2-O] m - Si(CH3)3 refers to the above monohydroxy silicone oil, obtaining Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3, Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3 is mostly vinyl long-chain alkoxysilane containing siloxane chain segments.
[0067] After the second heat preservation, the first container is heated to about 110° C., and R2OH and the remaining solvent are distilled off to obtain a thermally conductive powder modifier.
[0068] Example 4
[0069] The first container is preferably a four-necked reaction bottle, the second container is preferably a flask, R2OH is preferably n-octanol, the solvent is preferably water, the catalyst is preferably KOH, and Vi-Si-(OR1)3 is preferably vinyltriethoxysilane.
[0070] A method for preparing a thermally conductive powder modifier comprises the following steps:
[0071] R2OH and solvent are added into the first container under nitrogen protection, and the first container is heated to a first temperature of about 60°C. Then, the catalyst is added while stirring at the first temperature for about 1 hour.
[0072] Dilute Vi-Si-(OR1)3 with a solvent in a second container to obtain a Vi-Si-(OR1)3 solution, and dropwise add the Vi-Si-(OR1)3 solution into the first container after stirring for about 5 hours, so that the first container can undergo an ester exchange reaction:
[0073] Vi-Si-(OR1)3+ R2OH←→Vi-Si-(OR2)3+ R1OH,
[0074] Vi-Si-(OR2)3 and R1OH are obtained, wherein Vi-Si-(OR2)3 is mostly vinyl alkoxysilane and R1OH is mostly methanol;
[0075] After the addition of Vi-Si-(OR1)3 solution is completed, the temperature of the first container is raised to a second temperature of about 130°C, and the first container is kept warm for about 5 hours at the second temperature to evaporate R1OH and part of the solvent.
[0076] The first container after the first heat preservation is cooled to about 60°C, and then a monohydroxy silicone oil solution with a viscosity of 50 cps is added dropwise into the first container for about 2 hours. After the addition is completed, a second heat preservation is performed for about 5 hours to allow the condensation reaction to proceed in the first container:
[0077] Vi-Si-(OR2)3+ OH-Si(CH3)2-O-[ Si(CH3)2-O] m - Si(CH3)3←→Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3,
[0078] Among them OH-Si(CH3)2-O-[Si(CH3)2-O] m- Si(CH3)3 refers to the above monohydroxy silicone oil, obtaining Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3, Vi-Si(OR2)2-O-Si(CH3)2-O-[ Si(CH3)2-O] m Si(CH3)3 is mostly vinyl long-chain alkoxysilane containing siloxane chain segments.
[0079] After the second heat preservation, the first container is heated to about 130° C., and R2OH and the remaining solvent are distilled off to obtain a thermally conductive powder modifier.
[0080] Example 5
[0081] The thermally conductive powder modifiers obtained by the preparation methods of the thermally conductive powder modifiers disclosed in Examples 1 to 4 all contain vinyl long-chain alkoxysilane with siloxane chain segments, and the thermally conductive powder modifiers can be used in the preparation of thermally conductive potting adhesives.
[0082] The thermally conductive powder modifiers obtained in Examples 1 to 4 can all be applied to the formulation of the following thermally conductive potting adhesive.
[0083] The formula of the thermally conductive potting compound includes component A and component B which are stored separately.
[0084] Component A comprises 45 to 55 parts by weight of vinyl silicone oil, 540 to 560 parts by weight of thermally conductive powder, 4 to 6 parts by weight of the thermally conductive powder modifier, and 1.5 to 2.5 parts by weight of a catalyst. Preferably, the vinyl silicone oil is preferably 50 parts by weight, the thermally conductive powder is preferably 550 parts by weight, the thermally conductive powder modifier is preferably 5 parts by weight, and the catalyst is preferably 2 parts by weight.
[0085] Component B includes 45-55 parts by weight of vinyl silicone oil, 5-7 parts by weight of hydrogenated silicone oil, 540-560 parts by weight of thermally conductive powder, 4-6 parts by weight of the thermally conductive powder modifier, and 0.8-1.2 parts by weight of an inhibitor. Preferably, the vinyl silicone oil is preferably 50 parts by weight, the hydrogenated silicone oil is preferably 6 parts by weight, the thermally conductive powder is preferably 550 parts by weight, the thermally conductive powder modifier is preferably 5 parts by weight, and the inhibitor is preferably 1 part by weight.
[0086] Component A and component B are mixed in a weight ratio of 0.8-1.2:0.8-1.2, and cured at 70-90° C. for 30 minutes or more. Preferably, component A and component B are mixed in a weight ratio of 1:1, and cured at 80° C. for 30 minutes.
[0087] Example 6
[0088] The thermally conductive powder modifier prepared in Examples 1 to 4 was applied to the thermally conductive potting glue formula disclosed in Example 5 to obtain the thermally conductive potting glue, and the performance tests were performed respectively.
[0089] The performance tests were also carried out on the thermally conductive potting adhesives obtained by the formulations disclosed in the following comparative examples.
[0090] Comparative Example 1
[0091] This comparative example provides a thermally conductive potting adhesive formula, including component A and component B which are stored independently.
[0092] Component A contains 50 parts by weight of vinyl silicone oil, 550 parts by weight of thermally conductive powder, 5 parts by weight of a commercially available thermally conductive powder modifier KH560 (the main component of which is γ-glycidyloxypropyltrimethoxysilane), and 2 parts by weight of a catalyst.
[0093] Component B contains 50 parts by weight of vinyl silicone oil, 6 parts by weight of hydrogenated silicone oil, 550 parts by weight of thermally conductive powder, 5 parts by weight of a commercially available thermally conductive powder modifier KH560 (the main component of which is γ-glycidyloxypropyltrimethoxysilane), and 1 part by weight of an inhibitor.
[0094] Component A and component B were mixed in a weight ratio of 1:1 and cured at 80°C for 30 minutes.
[0095] Comparative Example 2
[0096] This comparative example provides a thermally conductive potting adhesive formula, including component A and component B which are stored independently.
[0097] Component A contains 50 parts by weight of vinyl silicone oil, 550 parts by weight of thermally conductive powder, 5 parts by weight of a commercially available thermally conductive powder modifier A-171 (the main component of which is vinyl trimethoxysilane), and 2 parts by weight of a catalyst.
[0098] Component B contains 50 parts by weight of vinyl silicone oil, 6 parts by weight of hydrogenated silicone oil, 550 parts by weight of thermally conductive powder, 5 parts by weight of a commercially available thermally conductive powder modifier A-171, and 1 part by weight of an inhibitor.
[0099] Component A and component B were mixed in a weight ratio of 1:1 and cured at 80°C for 30 minutes.
[0100] The above test results are summarized in Table 1 below.
[0101] Table 1 Test results
[0102]
[0103] From the test results in Table 1, we can see that
[0104] The thermally conductive powder modifier suitable for thermally conductive powder modification obtained by the method disclosed in Examples 1 to 4 can be effectively used in the preparation of thermally conductive potting glue, and effectively reduce the viscosity of the thermally conductive potting glue obtained by the method, improve the thermal conductivity and heat dissipation performance of the thermally conductive potting glue, reduce the dielectric constant of the thermally conductive potting glue, slow down the sedimentation and agglomeration of thermally conductive powder in the thermally conductive potting glue, thereby improving the storage stability of the thermally conductive potting glue.
[0105] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. A thermally conductive powder modifier, characterized in that: Including vinyl long chain alkoxysilane containing siloxane chain segments, The preparation method of the thermally conductive powder modifier is characterized by comprising the following steps: Vinyl alkoxysilane is synthesized by transesterification reaction using vinyl trimethoxysilane or vinyl triethoxysilane as substrate. Add R2OH and solvent into a first container under nitrogen protection, heat the first container to a first temperature of 50°C to 80°C, add the catalyst while stirring at the first temperature, and the stirring time is 0.5h to 1h; Dilute Vi-Si-(OR1)3 with a solvent in a second container to obtain a Vi-Si-(OR1)3 solution, and dropwise add the Vi-Si-(OR1)3 solution into the first container after stirring for 3 to 10 hours, so that the first container can undergo an ester exchange reaction: Vi-Si-(OR1)3 + R2OH←→Vi-Si-(OR2)3 + R1OH, Obtain Vi-Si-(OR2)3 and R1OH, wherein the Vi-Si-(OR1)3 is vinyl trimethoxysilane or vinyl triethoxysilane, the R2OH is n-decanol, n-dodecyl alcohol or n-octanol, and the Vi-Si-(OR2)3 is vinyl alkoxysilane; A vinyl long-chain alkoxysilane containing a siloxane segment is obtained by a condensation reaction of monohydroxy silicone oil and the vinyl alkoxysilane. After the addition of the Vi-Si-(OR1)3 solution is completed, the first container is heated to a second temperature of 100°C to 120°C, and the first container is kept at the second temperature for 2h to 5h to evaporate R1OH and part of the solvent. After the first heat preservation, the first container is cooled to 50°C-70°C, and then the monohydroxy silicone oil solution is added dropwise to the first container for 1h-2h. After the addition, a second heat preservation is performed for 2h-5h to allow the condensation reaction to proceed in the first container: Vi-Si-(OR2)3+OH-Si(CH3)2-O-[Si(CH3)2-O] m -Si(CH3)3←→Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Yes(CH3)3, Obtain Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3, the OH-Si(CH3)2-O-[Si(CH3)2-O] m -Si(CH3)3 is a monohydroxy silicone oil, and the Vi-Si(OR2)2-O-Si(CH3)2-O-[Si(CH3)2-O] m Si(CH3)3 is a vinyl long-chain alkoxysilane containing siloxane segments; After the second heat preservation, the first container is heated to 110° C. to 130° C., and R2OH and the remaining solvent are distilled off to obtain a thermally conductive powder modifier.
2. A thermally conductive powder modifier according to claim 1, characterized in that: The catalyst is a basic material.
3. A thermally conductive powder modifier according to claim 1, characterized in that: The R1OH is methanol.
4. A thermally conductive powder modifier according to claim 1, characterized in that: The viscosity of the monohydroxy silicone oil is 10cps-50cps.
5. A thermally conductive potting adhesive, characterized in that: The thermally conductive powder modifier according to claim 1 is used.
6. The thermally conductive potting adhesive according to claim 5, characterized in that: The formula of the thermal conductive potting glue includes component A and component B. The component A comprises 45 to 55 parts by weight of vinyl silicone oil, 540 to 560 parts by weight of thermally conductive powder, 4 to 6 parts by weight of the thermally conductive powder modifier and 1.5 to 2.5 parts by weight of a catalyst; The component B comprises 45-55 parts by weight of vinyl silicone oil, 5-7 parts by weight of hydrogenated silicone oil, 540-560 parts by weight of thermally conductive powder, 4-6 parts by weight of the thermally conductive powder modifier and 0.8-1.2 parts by weight of an inhibitor; The component A and the component B are mixed in a weight ratio of 0.8-1.2:0.8-1.2 and cured at 70-90° C. for 30 minutes or more.