Chip disassembly device for optoelectronic products and use method thereof

Abstract

The present invention is applicable to the field of optoelectronic product maintenance and provides a chip disassembly device for optoelectronic products and a method of use, comprising: a mounting frame, a first electric telescopic rod is provided on the mounting frame, a rotating second threaded rod drives a moving block threadedly connected to the first electric telescopic rod to move to one side, the moving moving block drives the second electric telescopic rod fixed thereon to move, the moving second electric telescopic rod drives the mounting plate on its movable end to move, the moving mounting plate drives the heating block and the suction pipe fixed thereon to move to one side, the heating block and the suction pipe are moved to the soldering point of the chip, the soldering point is heated by the heating block, so that the solder at the soldering point melts, causing the chip to loosen, and then the molten solder is sucked by the suction pipe, so that the solder enters the storage tube through the connecting tube, and finally the chip is removed by the pulling force generated by the downward movement of the suction cup below, the chip on the circuit board is removed by the machine, and the efficiency of repairing the circuit board is higher.

Description

Technical Field

[0001] The present invention belongs to the field of optoelectronic product maintenance, and in particular relates to a chip disassembly device for optoelectronic products and a use method thereof. Background Art

[0002] Optoelectronic products convert light into electricity, electricity into light, and multiple photoelectric conversions through electrical properties. Chips refer to integrated circuits manufactured on the surface of circuits, also known as integrated circuits. Another type is miniaturized, consisting of independent semiconductor devices and passive components integrated into a substrate or circuit board.

[0003] When optoelectronic products are damaged, it is mostly because the components or chips on the circuit board are damaged. Since optoelectronic circuit boards are expensive, the damaged chips need to be replaced. When replacing, the chip welding points need to be cleaned first, the solder at the welding points needs to be melted, and then the chip needs to be removed and disassembled manually. Manual operation not only easily causes damage to other parts of the circuit board, but also greatly reduces the maintenance efficiency of the circuit board. Summary of the Invention

[0004] The present invention provides a chip disassembly device for optoelectronic products and a use method thereof, aiming to solve the problem of slow chip disassembly efficiency when repairing circuit boards.

[0005] The present invention is implemented as follows: a chip disassembly device for optoelectronic products, comprising:

[0006] A mounting frame is provided on the mounting frame, wherein a first electric telescopic rod is fixedly mounted on the movable end of the first electric telescopic rod, a fixing plate is fixedly mounted on the fixing plate, and a suction cup is fixedly mounted on the fixing plate, and the chip is adsorbed by the suction cup. A sliding assembly connected to the first electric telescopic rod is installed on the mounting frame, and the suction cup can be moved by the sliding assembly. A clamping assembly is installed on the mounting frame, and the circuit board is fixed by the clamping assembly;

[0007] A first threaded rod is provided on one side of the mounting frame, and both end shafts of the first threaded rod are rotatably connected to a second support block supporting the first threaded rod. The second support block is fixedly mounted on the mounting frame, and a connecting plate is fixedly mounted on the mounting frame. A driving assembly connected to the first threaded rod is mounted on the connecting plate, and the first threaded rod is driven to rotate by the driving assembly.

[0008] The first threaded rod is threadedly connected to the second slide, and a mounting plate is provided under the second slide. A heating block for heating the soldering point is installed on the mounting plate. A suction pipe fixedly mounted to the mounting plate is provided on one side of the heating block, and the solder is adsorbed through the suction pipe. A moving component for pushing the mounting plate to move is installed on the second slide, and an extraction component connected to the driving component is installed on the connecting plate, and the extraction component is fixedly mounted to the suction pipe.

[0009] Furthermore, the sliding assembly includes two symmetrically arranged first sliding bars on the mounting frame, both ends of the first sliding bars are fixedly mounted with first support blocks supporting them, the first support blocks are fixedly mounted on the mounting frame, the mounting frame is provided with a first slide plate slidably connected to the first sliding bars on both sides, the first slide plate is provided with a strip-shaped through-groove, a third sliding bar is fixedly mounted in the strip-shaped through-groove, the third sliding bar is sleeved with a sliding block slidably connected in the strip-shaped through-groove, and the sliding block is fixedly mounted to the fixed end of the first electric telescopic rod.

[0010] Furthermore, the clamping assembly includes two relatively arranged limit support frames on the mounting frame, one side limit support frame is fixedly installed on the side wall of the mounting frame, and the other side wall of the mounting frame is provided with multiple circular holes, and a connecting column is slidably connected to the circular hole, one end of the connecting column is fixedly installed on the limit support frame on the other side, and a compression spring mounted on the connecting column is abutted between the side wall of the mounting frame and the limit support frame.

[0011] Furthermore, the drive assembly includes a second servo motor fixedly mounted on the connecting plate, a second support frame fixedly mounted on the connecting plate, a cylinder rotatably connected to the upper portion of the second support frame, one end of the cylinder being fixedly mounted to the output shaft of the second servo motor, and the rotating shaft of the first threaded rod extending to the other side of the second support block and a transmission belt being installed between the first threaded rod and the other end of the cylinder.

[0012] The movable block is fixedly mounted on the second slide, and the movable block is fixedly mounted on the second slide, and the movable block is fixedly mounted on the second slide. The movable block has a movable end in the through-groove. The movable block has a second electric telescopic rod fixedly mounted on the movable block, and the movable end of the second electric telescopic rod is fixedly mounted on the mounting plate. A sliding groove is provided on one side of the mounting frame, and a second sliding rod is fixedly mounted in the sliding groove. The second slide extends away from the first threaded rod into the sliding groove and is slidably connected to the second sliding rod. The second slide extends away from the first threaded rod to the outside of the mounting frame and is fixedly mounted on the support plate, and the first servo motor is fixedly mounted on the support plate, and the output shaft of the first servo motor extends to the other side of the mounting frame and is fixedly mounted on the movable end of the second threaded rod, and the mounting frame is provided with a strip groove for movement of the output shaft of the first servo motor.

[0013] Furthermore, the extraction component includes an incomplete gear fixedly mounted on the rotating shaft of the second servo motor, a rectangular gear ring meshing with the incomplete gear is mounted on the incomplete gear, a prismatic rod is fixedly mounted on both sides of the rectangular gear ring, a first support frame is slidably connected to the prismatic rod for supporting it, the first support frame is fixedly mounted on the connecting plate, a piston cylinder is fixedly mounted on the connecting plate, a piston block is slidably connected inside the piston cylinder, a piston rod extending outside the piston cylinder is fixedly mounted on one side of the piston block, and the end of the piston rod away from the piston block is fixedly mounted to the prismatic rod.

[0014] Furthermore, a storage cylinder is fixedly installed on the connecting plate, an exhaust pipe is fixedly installed between the side wall of the piston cylinder and the storage cylinder, an exhaust pipe is fixedly installed at one end of the piston cylinder, and a one-way valve is fixedly installed on both the exhaust pipe and the exhaust pipe. A connecting pipe is fixedly installed on one side of the storage cylinder, and the end of the connecting pipe away from the storage cylinder is fixedly installed on the mounting plate.

[0015] The method for disassembling an optoelectronic product chip using a disassembly device comprises the following steps:

[0016] Step 1: Pull the connecting column to one side, place the circuit board with the chip to be removed between the two limit support frames, loosen the connecting column, and compress the spring to push the limit support frame on one side tightly against the circuit board;

[0017] Step 2: Manually adjust the position of the first electric telescopic rod so that it is located below the chip to be removed. The movable end of the first electric telescopic rod drives the suction cup upward so that the suction cup rests against the chip, and the movable end of the first electric telescopic rod moves downward for a distance.

[0018] Step 3: The installation plate moves and drives the heating block to move to the solder joint of the chip. The heating block moves downward to heat the solder joint, causing the solder at the solder joint to melt, causing the chip to loosen.

[0019] Step 4: Use the straw to absorb the molten solder, allowing the solder to enter the storage tube through the connecting tube, and finally remove the chip through the pulling force generated by the downward movement of the suction cup below.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The first threaded rod rotates, and the rotating first threaded rod drives the second slide with the thread on it to move to one side, and the first servo motor runs, and the output shaft of the first servo motor drives the second threaded rod fixed thereon to rotate, and the rotating second threaded rod drives the moving block threadedly connected thereto to move to one side, and the moving moving block drives the second electric telescopic rod fixed thereon to move, and the moving second electric telescopic rod drives the mounting plate on its movable end to move, and the moving mounting plate drives the heating block and the straw fixed thereon to move to one side, and moves the heating block and the straw to the solder joints of the chip, and heats the solder joints by the heating block, so that the solder at the solder joints melts, causing the chip to loosen, and then the molten solder is sucked by the straw, so that the solder enters the storage tube through the connecting tube, and finally the chip is removed by the pulling force generated by the downward movement of the suction cup below, and the chip on the circuit board is removed by the machine, which makes the circuit board repair more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure provided by the present invention.

[0025] Figure 2 It is a schematic diagram of the enlarged structure of the position limiting support frame provided by the present invention.

[0026] Figure 3 It is a schematic diagram of the enlarged structure of the first slide provided by the present invention.

[0027] Figure 4 It is a schematic diagram of the enlarged structure of the rectangular gear ring provided by the present invention.

[0028] Figure 5 It is a schematic diagram of the enlarged structure of the transmission belt provided by the present invention.

[0029] Figure 6 It is a schematic diagram of the moving block amplification structure provided by the present invention.

[0030] Figure 7 It is a schematic diagram of the enlarged structure of the second sliding bar provided by the present invention.

[0031] Reference numerals:

[0032] 1. Mounting frame; 2. Limit support frame; 3. First support block; 4. First sliding rod; 5. First slide plate; 6. Sliding block; 7. First electric telescopic rod; 8. Suction cup; 9. Connecting column; 10. Compression spring; 11. Connecting plate; 12. Support plate; 13. First servo motor; 14. Second sliding rod; 15. Second support block; 16. First threaded rod; 17. Second slide plate; 18. Third support block; 19. Second threaded rod; 20. Second servo motor; 21. Piston cylinder; 22. Rectangular gear ring; 23. Prismatic rod; 24. First support frame; 25. Exhaust pipe; 26. One-way valve; 27. Exhaust pipe; 28. Storage cylinder; 29. ​​Connecting pipe; 30. Third sliding rod; 31. Transmission belt; 32. Second support frame; 33. Incomplete gear; 34. Mounting plate; 35. Heating block; 36. Suction pipe; 37. Moving block; 38. Second electric telescopic rod. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] In order to effectively illustrate the embodiments of the present invention, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0035] See also Figure 1-7 The present invention provides a chip disassembly device and a method for use for optoelectronic products to solve the problem of slow chip disassembly efficiency when repairing circuit boards.

[0036] See also Figure 1 、 Figure 3 The embodiment of the present invention provides a chip disassembly device for optoelectronic products and a method for using the device, including:

[0037] The mounting frame 1 is provided with a first electric telescopic rod 7, a fixed plate is fixedly installed on the movable end of the first electric telescopic rod 7, a suction cup 8 is fixedly installed on the fixed plate, and the chip is adsorbed by the suction cup 8. A sliding component connected to the first electric telescopic rod 7 is installed on the mounting frame 1, and the suction cup 8 can be moved by the sliding component.

[0038] The sliding assembly includes two symmetrically arranged first sliding bars 4 on the mounting frame 1, and first support blocks 3 supporting the first sliding bars 4 are fixedly installed at both ends of the first sliding bars 4. The first support blocks 3 are fixedly installed on the mounting frame 1. The mounting frame 1 is provided with a first slide plate 5 slidably connected to the first sliding bars 4 on both sides. A strip-shaped through-groove is provided on the first slide plate 5, and a third sliding bar 30 is fixedly installed in the strip-shaped through-groove. The third sliding bar 30 is sleeved with a sliding block 6 slidably connected to the strip-shaped through-groove, and the sliding block 6 is fixedly installed to the fixed end of the first electric telescopic rod 7.

[0039] The arrangement is such that the sliding block 6 can move linearly along the third sliding bar 30 through the bar-shaped through-groove and the third sliding bar 30 fixed therein, and the sliding block 6 can be more stable during the sliding process. The first sliding bars 4 fixed on both sides can make the first slide plate 5 slide back and forth thereon, and the first sliding bars 4 on both sides make the sliding of the first slide plate 5 more comfortable.

[0040] A clamping assembly is installed on the mounting frame 1, and the circuit board is fixed by the clamping assembly.

[0041] See also Figure 1 、 Figure 3The clamping assembly includes two relatively arranged limit support frames 2 on the mounting frame 1, one side of the limit support frame 2 is fixedly installed with the side wall of the mounting frame 1, and the other side wall of the mounting frame 1 is provided with a plurality of circular holes, and a connecting column 9 is slidably connected to the circular hole. One end of the connecting column 9 is fixedly installed with the limit support frame 2 on the other side, and a compression spring 10 sleeved on the connecting column 9 is in contact between the side wall of the mounting frame 1 and the limit support frame 2.

[0042] Specifically, when in use, pull the connecting column 9 to one side. The moving connecting column 9 drives the support frame 2 fixed to it to move to one side. The moving support frame 2 pushes the compression spring 10 to compress. The circuit board whose chip needs to be removed is placed between the two support frames 2. Loosen the connecting column 9. The compressed compression spring 10 pushes the support frame 2 back to its original position and compresses the circuit board in the middle. The circuit board is fixed by squeezing the support frames 2 on both sides toward the middle.

[0043] A first threaded rod 16 is provided on one side of the mounting frame 1, and the rotating shafts at both ends of the first threaded rod 16 are rotatably connected to second support blocks 15 that support it. The second support block 15 is fixedly mounted on the mounting frame 1, and a connecting plate 11 is fixedly mounted on the mounting frame 1. A driving assembly connected to the first threaded rod 16 is mounted on the connecting plate 11, and the first threaded rod 16 is driven to rotate by the driving assembly.

[0044] See also Figure 1 、 Figure 4 、 Figure 5 The driving assembly includes a second servo motor 20 fixedly mounted on the connecting plate 11, a second support frame 32 fixedly mounted on the connecting plate 11, a cylinder rotatably connected to the upper portion of the second support frame 32, one end of the cylinder is fixedly mounted to the output shaft of the second servo motor 20, the rotating shaft of the first threaded rod 16 extends to the other side of the second support block 15 and a transmission belt 31 is installed between the other end of the cylinder.

[0045] In detail, the second servo motor 20 is running, and the output shaft of the second servo motor 20 drives the cylinder fixed to it to rotate. The rotating cylinder drives the first threaded rod 16 on one side to rotate through the transmission belt 31 installed thereon, and the rotation of the first threaded rod 16 causes the second slide 17 threadedly connected thereto to move to one side.

[0046] Among them, a plurality of support plates for supporting the second servo motor 20 are fixedly installed at the bottom thereof, and the support plates are fixedly installed on the connecting plate 11. The second servo motor 20 is fixed by the support plates, so that the operation of the second servo motor 20 is more stable. A circular hole is opened on the second support frame 32, and a ball bearing for supporting the cylinder is fixedly installed in the circular hole. The ball bearing makes the rotation of the cylinder more stable.

[0047] A second slide 17 is threadedly connected to the first threaded rod 16, and a mounting plate 34 is provided below the second slide 17. A heating block 35 for heating the soldering point is installed on the mounting plate 34. A suction pipe 36 is provided on one side of the heating block 35 and is fixedly mounted on the mounting plate 34. The solder is adsorbed by the suction pipe 36. A moving component for pushing the mounting plate 34 to move is installed on the second slide 17.

[0048] See also Figure 1 、 Figure 6 、 Figure 7 The moving assembly includes a through slot on the second slide 17, a second threaded rod 19 is provided on the through slot, both ends of the second threaded rod 19 are rotatably connected to a third support block 18 supporting it, the third support block 18 is fixedly mounted on the second slide 17, the second threaded rod 19 is threadedly connected to a moving block 37 sliding in the through slot, a second electric telescopic rod 38 is fixedly mounted on the moving block 37, the movable end of the second electric telescopic rod 38 is fixedly mounted on the mounting plate 34, a slide slot is provided on one side of the mounting frame 1, and the slide slot A second slide bar 14 is fixedly installed, and the second slide plate 17 extends into the slide groove on the side away from the first threaded rod 16 and is slidably connected to the second slide bar 14. The side of the second slide plate 17 away from the first threaded rod 16 extends to the outside of the mounting frame 1 and is fixedly installed with a support plate 12. A first servo motor 13 is fixedly installed on the support plate 12. The output shaft of the first servo motor 13 extends to the other side of the mounting frame 1 and is fixedly installed with the movable end of the second threaded rod 19. A strip groove is provided on the mounting frame 1 for the output shaft of the first servo motor 13 to move.

[0049] The first threaded rod 16 is set to rotate, and the rotating first threaded rod 16 drives the second slide plate 17 threaded thereon to move to one side, and the first servo motor 13 is running. The output shaft of the first servo motor 13 drives the second threaded rod 19 fixed thereon to rotate, and the rotating second threaded rod 19 drives the moving block 37 threadedly connected thereto to move to one side, and the moving moving block 37 drives the second electric telescopic rod 38 fixed thereon to move, and the moving second electric telescopic rod 38 drives the mounting plate 34 on its movable end to move, and the moving mounting plate 34 drives the heating block 35 and the suction pipe 36 fixed thereon to move to one side, and moves the heating block 35 and the suction pipe 36 to the solder joint of the chip, and heats the solder joint by the heating block 35, so that the solder at the solder joint melts, causing the chip to loosen, and then the molten solder is sucked by the suction pipe 36, so that the solder enters the storage tube 28 through the connecting pipe 29, and finally the chip is removed by the pulling force generated by the downward movement of the suction cup 8 below.

[0050] An extraction assembly connected to the driving assembly is mounted on the connecting plate 11 , and the extraction assembly is fixedly mounted to the suction tube 36 .

[0051] See also Figure 1 、 Figure 4 、 Figure 5 The extraction component includes an incomplete gear 33 fixedly mounted on the rotating shaft of the second servo motor 20, and a rectangular gear ring 22 meshing with the incomplete gear 33 is sleeved on the incomplete gear 33, and a prismatic rod 23 is fixedly mounted on both sides of the rectangular gear ring 22, and a first support frame 24 supporting the prismatic rod 23 is slidably connected to the prismatic rod 23, and the first support frame 24 is fixedly mounted on the connecting plate 11, and a piston cylinder 21 is fixedly mounted on the connecting plate 11, and a piston block is slidably connected in the piston cylinder 21, and a piston rod extending to the outside of the piston cylinder 21 is fixedly mounted on one side of the piston block, and the end of the piston rod away from the piston block is fixedly mounted on the prismatic rod 23.

[0052] Specifically, the second servo motor 20 is running, and the output shaft of the second servo motor 20 drives the incomplete gear 33 fixed thereon to rotate. When the rotating incomplete gear 33 engages with the teeth above the rectangular gear ring 22, the rotating incomplete gear 33 pushes the rectangular gear ring 22 to move to one side, and when the incomplete gear 33 rotates to engage with the teeth below the rectangular gear ring 22, the rotating incomplete gear 33 pushes the rectangular gear ring 22 to move to the other side. The moving rectangular gear ring 22 drives the prismatic rod 23 fixed thereon to move back and forth. Of course, the first support frame 24 supported on both sides enables the rectangular gear ring 22 to move stably left and right. Because the prismatic rod 23 is a rectangular structure, the rectangular gear ring 22 will not flip when moving back and forth and will always move in a straight line.

[0053] A storage cylinder 28 is fixedly mounted on the connecting plate 11, an exhaust pipe 27 is fixedly mounted between the side wall of the piston cylinder 21 and the storage cylinder 28, an exhaust pipe 25 is fixedly mounted on one end of the piston cylinder 21, and a one-way valve 26 is fixedly mounted on both the exhaust pipe 27 and the exhaust pipe 25. A connecting pipe 29 is fixedly mounted on one side of the storage cylinder 28, and the end of the connecting pipe 29 away from the storage cylinder 28 is fixedly mounted to the mounting plate 34.

[0054] See also Figure 1 、 Figure 5 、 Figure 6 A storage cylinder 28 is fixedly mounted on the connecting plate 11, an exhaust pipe 27 is fixedly mounted between the side wall of the piston cylinder 21 and the storage cylinder 28, an exhaust pipe 25 is fixedly mounted on one end of the piston cylinder 21, and a one-way valve 26 is fixedly mounted on both the exhaust pipe 27 and the exhaust pipe 25. A connecting pipe 29 is fixedly mounted on one side of the storage cylinder 28, and the end of the connecting pipe 29 away from the storage cylinder 28 is fixedly mounted to the mounting plate 34.

[0055] In detail, the prismatic rod 23 moves back and forth, and the moving prismatic rod 23 pushes the piston rod fixed thereto to move back and forth, and the moving piston rod drives the fixed piston block to move back and forth to suck air. Through the fixed storage cylinder 28 and the connected connecting tube 29, the suction tube 36 can extract the solder on the circuit board into the storage cylinder 28, and the one-way valve 26 fixedly installed on the outlet pipe 25 allows the outlet pipe 25 to only discharge air, and the one-way valve 26 fixedly installed on the exhaust pipe 27 allows the exhaust pipe 27 to only exhaust air.

[0056] The method for disassembling an optoelectronic product chip using the disassembly device described in the above embodiment includes the following steps:

[0057] Step 1: Pull the connecting column 9 to one side, place the circuit board with the chip to be removed between the two limit support frames 2, release the connecting column 9, and compress the spring 10 to push the limit support frame 2 on one side tightly against the circuit board;

[0058] Step 2: Manually adjust the position of the first electric telescopic rod 7 so that the first electric telescopic rod 7 is located below the chip to be removed. The movable end of the first electric telescopic rod 7 drives the suction cup 8 to move upward so that the suction cup 8 rests against the chip, and the movable end of the first electric telescopic rod 7 moves downward for a distance.

[0059] Step three: the mounting plate 34 moves to drive the heating block 35 to move to the solder joint of the chip, and the heating block 35 moves downward to heat the solder joint, so that the solder at the solder joint melts, causing the chip to loosen;

[0060] Step four: the pipette 36 absorbs the molten solder, allowing the solder to enter the storage cylinder 28 through the connecting tube 29, and finally removes the chip by the pulling force generated by the downward movement of the suction cup 8 below.

[0061] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip disassembly device for optoelectronic products, characterized in that: include A mounting frame (1), wherein the mounting frame (1) is provided with a first electric telescopic rod (7), a fixed plate is fixedly installed on the movable end of the first electric telescopic rod (7), a suction cup (8) is fixedly installed on the fixed plate, and a chip is adsorbed by the suction cup (8), a sliding component connected to the first electric telescopic rod (7) is installed on the mounting frame (1), and the suction cup (8) can be moved by the sliding component, and a clamping component is installed on the mounting frame (1), and the circuit board is fixed by the clamping component; A first threaded rod (16) is provided on one side of the mounting frame (1), and the rotating shafts at both ends of the first threaded rod (16) are rotatably connected to second support blocks (15) supporting the first threaded rod (16), and the second support block (15) is fixedly mounted on the mounting frame (1). A connecting plate (11) is fixedly mounted on the mounting frame (1), and a driving assembly connected to the first threaded rod (16) is mounted on the connecting plate (11), and the first threaded rod (16) is driven to rotate by the driving assembly; A second slide plate (17) is threadedly connected to the first threaded rod (16), a mounting plate (34) is provided below the second slide plate (17), a heating block (35) for heating the solder joint is installed on the mounting plate (34), a suction pipe (36) fixedly mounted to the mounting plate (34) is provided on one side of the heating block (35), and the solder is adsorbed by the suction pipe (36), a moving component for pushing the mounting plate (34) to move is installed on the second slide plate (17), an extraction component connected to the driving component is installed on the connecting plate (11), and the extraction component is fixedly mounted to the suction pipe (36); The driving assembly comprises a second servo motor (20) fixedly mounted on the connecting plate (11), a second support frame (32) fixedly mounted on the connecting plate (11), a cylinder rotatably connected to the upper portion of the second support frame (32), one end of the cylinder being fixedly mounted to the output shaft of the second servo motor (20), a rotating shaft of the first threaded rod (16) extending to the other side of the second support block (15) and a transmission belt (31) being mounted between the other end of the cylinder; The extraction component includes an incomplete gear (33) fixedly mounted on the rotating shaft of the second servo motor (20), a rectangular gear ring (22) meshing with the incomplete gear (33) is sleeved on the incomplete gear (33), a prismatic rod (23) is fixedly mounted on both sides of the rectangular gear ring (22), a first support frame (24) supporting the prismatic rod (23) is slidably connected to the prismatic rod (23), the first support frame (24) is fixedly mounted on the connecting plate (11), a piston cylinder (21) is fixedly mounted on the connecting plate (11), a piston block is slidably connected in the piston cylinder (21), a piston rod extending to the outside of the piston cylinder (21) is fixedly mounted on one side of the piston block, and an end of the piston rod away from the piston block is fixedly mounted to the prismatic rod (23); A storage cylinder (28) is fixedly mounted on the connecting plate (11), an exhaust pipe (27) is fixedly mounted between the side wall of the piston cylinder (21) and the storage cylinder (28), an exhaust pipe (25) is fixedly mounted on one end of the piston cylinder (21), and a one-way valve (26) is fixedly mounted on both the exhaust pipe (27) and the exhaust pipe (25), a connecting pipe (29) is fixedly mounted on one side of the storage cylinder (28), and an end of the connecting pipe (29) away from the storage cylinder (28) is fixedly mounted on the mounting plate (34).

2. The chip disassembly device for optoelectronic products according to claim 1, characterized in that: The sliding assembly includes two symmetrically arranged first sliding rods (4) on the mounting frame (1), both ends of the first sliding rods (4) are fixedly mounted with first support blocks (3) supporting the first sliding rods (4), the first support blocks (3) are fixedly mounted on the mounting frame (1), the mounting frame (1) is provided with a first slide plate (5) slidably connected to the first sliding rods (4) on both sides, the first slide plate (5) is provided with a strip-shaped through-groove, a third sliding rod (30) is fixedly mounted in the strip-shaped through-groove, the third sliding rod (30) is sleeved with a sliding block (6) slidably connected in the strip-shaped through-groove, and the sliding block (6) is fixedly mounted to the fixed end of the first electric telescopic rod (7).

3. The chip disassembly device for optoelectronic products according to claim 2, characterized in that: The clamping assembly includes two limiting support frames (2) arranged opposite to each other on the mounting frame (1), one side of the limiting support frame (2) is fixedly mounted on the side wall of the mounting frame (1), and the other side wall of the mounting frame (1) is provided with a plurality of circular holes, and a connecting column (9) is slidably connected to the circular hole, one end of the connecting column (9) is fixedly mounted on the limiting support frame (2) on the other side, and a compression spring (10) sleeved on the connecting column (9) is in contact between the side wall of the mounting frame (1) and the limiting support frame (2).

4. The chip disassembly device for optoelectronic products according to claim 3, characterized in that: The moving assembly includes a through slot provided on the second slide (17), a second threaded rod (19) is provided on the through slot, both ends of the second threaded rod (19) are rotatably connected to a third support block (18) supporting the second threaded rod (19), the third support block (18) is fixedly mounted on the second slide (17), the second threaded rod (19) is threadedly connected to a moving block (37) sliding in the through slot, a second electric telescopic rod (38) is fixedly mounted on the moving block (37), the movable end of the second electric telescopic rod (38) is fixedly mounted on the mounting plate (34), a slide slot is provided on one side of the mounting frame (1), and a fixed support block (38) is fixedly mounted in the slide slot. A second slide bar (14) is provided, the second slide plate (17) extends into the slide groove on the side away from the first threaded rod (16) and is slidably connected to the second slide bar (14), the second slide plate (17) extends to the outside of the mounting frame (1) on the side away from the first threaded rod (16) and is fixedly mounted with a support plate (12), a first servo motor (13) is fixedly mounted on the support plate (12), the output shaft of the first servo motor (13) extends to the other side of the mounting frame (1) and is fixedly mounted with the movable end of the second threaded rod (19), and a strip groove is provided on the mounting frame (1) for the output shaft of the first servo motor (13) to move.

5. The method for disassembling an optoelectronic product chip using the disassembly equipment according to claim 4, wherein: The following steps are involved: Step 1: Pull the connecting column (9) to one side, place the circuit board with the chip to be removed between the two limit support frames (2), loosen the connecting column (9), and compress the spring (10) to push the limit support frame (2) on one side tightly against the circuit board; Step 2: Manually adjust the position of the first electric telescopic rod (7) so that the first electric telescopic rod (7) is located below the chip to be removed, the movable end of the first electric telescopic rod (7) drives the suction cup (8) to move upward, so that the suction cup (8) is against the chip, and the movable end of the first electric telescopic rod (7) moves downward a certain distance; Step 3: The mounting plate (34) moves to drive the heating block (35) to move to the solder joint of the chip, and the heating block (35) moves downward to heat the solder joint, so that the solder at the solder joint melts, causing the chip to loosen; Step 4: The suction pipe (36) sucks the molten solder, allowing the solder to enter the storage tube (28) through the connecting tube (29), and finally the chip is removed by the pulling force generated by the downward movement of the lower suction cup (8).

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