A limiting device for soldering chip diodes

Abstract

The present invention belongs to the field of diode processing and relates to a limiting steering technology, which is used to solve the problem that the existing limiting device for diode welding cannot automatically identify and adjust the positive and negative poles of the diode. Specifically, it is a limiting device for patch diode welding, comprising a working platform, a first limiting plate, a second limiting plate and a first slide groove are fixedly installed on the top of the working platform, an electric push rod is fixedly installed on the side of the first limiting plate close to the second limiting plate, a transverse plate is fixedly installed on the output end of the electric push rod, a first slider is fixedly installed on the bottom of the transverse plate, and the bottom of the first slider is slidably connected to the first slide groove; the present invention can automatically clamp the diode through the limiting mechanism, and the wedge-shaped opening on the clamping block is conducive to clamping the diode between the two clamping blocks, and the diode is clamped by the reaction force of the spring, and then the diode is fixed, and the diode can be directly pulled out after welding is completed.

Description

Technical Field

[0001] The invention belongs to the field of diode processing, relates to a limiting steering technology, and specifically is a limiting device for soldering chip diodes. Background Art

[0002] A diode is an electronic device made of semiconductor material. It has unidirectional conductivity. That is, when a forward voltage is applied to the anode of the diode, the diode is turned on. When a reverse voltage is applied to the anode and cathode, the diode is cut off. Therefore, the conduction and cutoff of the diode are equivalent to the on and off of a switch.

[0003] The positive and negative poles of SMD diodes are distinguished. If the circuit is connected randomly during use, the finished product will not work properly. If the positive and negative poles of the diode used for rectification are reversed, the entire sample will be damaged, causing certain losses. In order to avoid serious consequences caused by operating errors of SMD diodes; the existing diode positive and negative pole distinction work relies on manual identification during welding, which is too inefficient, and long-term identification work will cause fatigue, dizziness, etc., which leads to a decrease in the accuracy of the diode positive and negative pole distinction. Once the positive and negative poles of the diode are welded incorrectly, the entire sample will be damaged.

[0004] In response to the above technical problems, this application proposes a solution. Summary of the Invention

[0005] The object of the present invention is to provide a limiting device for soldering chip diodes, which is used to solve the problem that the existing limiting devices for soldering diodes cannot automatically identify and adjust the positive and negative poles of the diodes.

[0006] The technical problem to be solved by the present invention is: how to provide a limit device for soldering a chip diode that can automatically identify and adjust the positive and negative poles of the diode.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] A limiting device for soldering chip diodes comprises a working platform, wherein a first limiting plate, a second limiting plate and a first slide groove are fixedly mounted on the top of the working platform, an electric push rod is fixedly mounted on the side of the first limiting plate close to the second limiting plate, a transverse plate is fixedly mounted on the output end of the electric push rod, a first slider is fixedly mounted on the bottom of the transverse plate, the bottom of the first slider is slidably connected to the first slide groove, a straight plate is fixedly mounted on the side of the transverse plate away from the electric push rod, a first metal sheet is fixedly mounted on one end of the straight plate away from the transverse plate, and evenly distributed racks are fixedly mounted on the back of the straight plate; a second metal sheet is fixedly mounted on the side of the second limiting plate close to the first limiting plate;

[0009] The top surface of the working platform is movably connected to a rotating shaft through a bearing, a rotating roller is fixedly installed on the outer surface of the rotating shaft, a gear is fixedly installed on the outer surface of the rotating roller, the gear is meshed with a rack, and a limiting mechanism is provided on the top of the rotating shaft;

[0010] A processor is also provided on the top surface of the working platform, and the processor is communicatively connected with the acquisition module, the rotation analysis module and the controller.

[0011] As a preferred embodiment of the present invention, the limiting mechanism includes a mounting bracket, the front end of the mounting bracket is a welding end, a dividing line is provided in the middle of the top surface of the mounting bracket, a through hole is opened in the middle of the mounting bracket, grooves are opened on both sides of the through hole, the inner top wall and the inner bottom wall of the groove are fixedly installed with a second slide groove, the two adjacent sides of the second slide grooves are movably connected with a second slider, a clamping block is fixedly installed between the adjacent sides of the two second sliders, two symmetrical springs are fixedly installed between the side faces of the clamping block and the inner wall of the groove, a wedge-shaped opening is opened on the top of the clamping block away from the spring, a connecting block is fixedly installed on the inner bottom wall of the through hole, and a supporting plate is fixedly installed on the top of the connecting block.

[0012] As a preferred embodiment of the present invention, the acquisition module includes a camera arranged above the limiting mechanism. After the SMD diode is inserted between the two clamping blocks, the SMD diode is imaged by the camera and the captured image is sent to the rotation analysis module.

[0013] The rotation analysis module is used to automatically analyze the polarity of the SMD diode after receiving the image.

[0014] As a preferred embodiment of the present invention, the specific process of the rotation analysis module automatically analyzing the polarity of the patch diode includes: dividing the received image with the dividing line as the boundary to obtain a first analysis image and a second analysis image, performing grayscale analysis on the first analysis image: randomly dividing the first analysis image into a plurality of analysis areas, enlarging the analysis area into a pixel grid image and performing grayscale transformation to obtain the grayscale value of the pixel grid in the analysis area, summing and averaging the grayscale values of the pixel grid in the analysis area to obtain the grayscale expression value of the analysis area, forming a grayscale set of the plurality of grayscale expression values, performing variance calculation on the grayscale set to obtain a first grayscale coefficient of the first analysis image; performing grayscale analysis on the second analysis image to obtain a second grayscale coefficient, and comparing the first grayscale coefficient with the second grayscale coefficient:

[0015] If the first grayscale coefficient is greater than the second grayscale coefficient, the polarity of the SMD diode corresponding to the first analysis image is marked as negative;

[0016] If the first grayscale coefficient is smaller than the second grayscale coefficient, the model of the SMD diode corresponding to the first analysis image is marked as positive;

[0017] If the first grayscale coefficient is equal to the second grayscale coefficient, the rotation analysis is determined to have failed, and the analysis areas of the first analysis image and the second analysis image are re-divided for grayscale analysis; it is determined whether the positive terminal of the mounting bracket corresponds to the positive terminal of the chip diode and the rotation of the limiting mechanism is controlled based on the determination result.

[0018] As a preferred embodiment of the present invention, the specific process of performing rotation control on the limiting mechanism includes:

[0019] If the positive terminal of the mounting bracket corresponds to the positive terminal of the SMD diode, the rotation analysis module sends a welding signal to the processor;

[0020] If the positive terminal of the mounting bracket does not correspond to the positive terminal of the chip diode, the rotation analysis module sends a steering signal to the processor. After receiving the steering signal, the processor sends the steering signal to the controller. After receiving the steering signal, the controller controls the electric push rod to extend, and the transverse plate and the straight plate move transversely to the right. The rack and the gear drive the limit mechanism to rotate 180 degrees counterclockwise until the first metal sheet contacts the second metal sheet, and the detection circuit of the second metal sheet is connected. The controller sends a welding signal to the processor. After welding is completed, the chip diode is removed from the limiting mechanism, and the rotation analysis module sends a reset signal to the processor. After receiving the reset signal, the processor sends the reset signal to the controller. After receiving the reset signal, the controller controls the electric push rod to retract, and the transverse plate and the straight plate move transversely to the left. The rack and the gear drive the limit mechanism to rotate 180 degrees clockwise.

[0021] As a preferred embodiment of the present invention, the working method of the limit device for soldering chip diodes includes the following steps:

[0022] Step 1: Insert the SMD diode between the two clamps through the wedge-shaped opening until the bottom of the SMD diode contacts the top surface of the support plate. During the insertion process, the SMD diode separates the two clamps and the reaction force of the spring clamps the SMD diode.

[0023] Step 2: Use the camera to capture an image of the SMD diode, use the rotation analysis module to analyze the polarity of the SMD diode, and determine whether the positive terminal of the mounting bracket corresponds to the positive terminal of the SMD diode;

[0024] Step 3: When the positive terminal of the mounting frame corresponds to the positive pole of the SMD diode, welding is performed directly; when the positive terminal of the mounting frame does not correspond to the positive pole of the SMD diode, the electric push rod is extended to drive the straight plate and the cross plate to move horizontally, and the rack and gear drive the limit mechanism to rotate 180 degrees before welding;

[0025] Step 4: After welding is completed, remove the SMD diode from the limit mechanism, retract the electric push rod, and reset the limit mechanism through the rack and gear.

[0026] The present invention has the following beneficial effects:

[0027] The rotating analysis module can automatically analyze the polarity of the diode after it is fixed. The positive and negative poles of the diode can be distinguished by the difference in appearance between the positive and negative poles, and then the positive and negative ends of the diode are matched. If there is a mismatch, the diode is turned to avoid the phenomenon of reversed positive and negative poles causing damage to the entire sample. At the same time, it reduces the pressure on the staff. When welding the diode, just insert the diode between the two clamps. The operation is simple and convenient.

[0028] The diode can be automatically clamped by the limiting mechanism. The wedge-shaped opening on the clamping block is conducive to clamping the diode between the two clamping blocks. The diode is clamped by the reaction force of the spring, thereby fixing the diode. After welding is completed, the diode can be directly pulled out.

[0029] The steering of the limit mechanism can be automatically controlled by the electric push rod rack, gear and controller. After the positive and negative poles of the diode are identified, the extension or retraction of the electric push rod can drive the limit mechanism to rotate counterclockwise or clockwise, thereby welding the correct polarity of the diode. The polarity identification and the steering of the limit mechanism are automatically handled by the processor and controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 This is a structural front view of embodiment 1 of the present invention;

[0032] Figure 2 This is a front cross-sectional view of the limiting mechanism structure of Example 1 of the present invention;

[0033] Figure 3 A top view of the gear structure of embodiment 1 of the present invention;

[0034] Figure 4 This is a system block diagram of Embodiment 2 of the present invention;

[0035] Figure 5This is a flow chart of the method of embodiment 3 of the present invention.

[0036] In the figure: 1. working platform; 2. rotating shaft; 3. rotating roller; 4. gear; 5. limiting mechanism; 501. mounting frame; 502. through hole; 503. groove; 504. second slide; 505. second slider; 506. block; 507. spring; 508. connecting block; 509. supporting plate; 6. first limiting plate; 7. second limiting plate; 8. first slide; 9. electric push rod; 10. transverse plate; 11. first slider; 12. straight plate; 13. first metal sheet; 14. rack; 15. second metal sheet. DETAILED DESCRIPTION

[0037] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention. Example

[0038] like Figure 1-3 As shown, a limiting device for soldering chip diodes includes a working platform 1, a first limiting plate 6, a second limiting plate 7 and a first slide 8 are fixedly installed on the top of the working platform 1, an electric push rod 9 is fixedly installed on the side of the first limiting plate 6 close to the second limiting plate 7, a transverse plate 10 is fixedly installed on the output end of the electric push rod 9, a first slider 11 is fixedly installed on the bottom of the transverse plate 10, the bottom of the first slider 11 is slidably connected to the first slide 8, a straight plate 12 is fixedly installed on the side of the transverse plate 10 away from the electric push rod 9, a first metal sheet 13 is fixedly installed on the end of the straight plate 12 away from the transverse plate 10, and a Evenly distributed racks 14; a second metal sheet 15 is fixedly installed on the side of the second limit plate 7 near the first limit plate 6, the first metal sheet 13 and the second metal sheet 15 are at the same height, and the second metal sheet 15 is connected in series with a detection circuit. When the detection circuit is turned on, the electric push rod 9 stops extending, which is convenient for controlling the extension distance of the electric push rod 9; the rack 14, gear 4 and controller of the electric push rod 9 can automatically control the steering of the limit mechanism 5. After the positive and negative poles of the diode are identified, the extension or retraction of the electric push rod 9 can drive the limit mechanism 5 to rotate counterclockwise or clockwise, and then weld the correct polarity of the diode.

[0039] The top surface of the working platform 1 is movably connected to a rotating shaft 2 through a bearing. A roller 3 is fixedly installed on the outer surface of the rotating shaft 2. A gear 4 is fixedly installed on the outer surface of the rotating roller 3. The gear 4 is engaged with the rack 14. A limiting mechanism 5 is set on the top of the rotating shaft 2.

[0040] The limiting mechanism 5 includes a mounting frame 501, the front end of the mounting frame 501 is a welding end, a dividing line is provided in the middle of the top surface of the mounting frame 501, a through hole 502 is provided in the middle of the mounting frame 501, and grooves 503 are provided on both sides of the through hole 502. Second slide grooves 504 are fixedly installed on the inner top wall and the inner bottom wall of the groove 503, and the adjacent sides of the two second slide grooves 504 are movably connected with second sliders 505. A clamping block 506 is fixedly installed between the adjacent sides of the two second sliders 505, and two symmetrical springs 507 are fixedly installed between the side of the clamping block 506 and the inner wall of the groove 503. The outer ring of the spring 507 is fixedly connected to the groove 5 03. A gap is left between the inner walls of the spring 507 to prevent the spring 507 from contacting the inner wall of the groove 503 when it is extended and contracted, thereby generating unnecessary friction and reducing equipment wear. A wedge-shaped opening is provided on the top of the clamping block 506 away from the spring 507. The wedge-shaped opening on the clamping block 506 is conducive to clamping the diode between the two clamping blocks 506. A connecting block 508 is fixedly installed on the inner bottom wall of the through hole 502, and a support plate 509 is fixedly installed on the top of the connecting block 508. The limiting mechanism 5 can automatically clamp the diode, clamp the diode by the reaction force of the spring 507, and then fix the diode. After welding is completed, the diode can be directly pulled out. Example

[0041] The positive and negative poles of SMD diodes are distinguished. If the circuit is connected randomly during use, the finished product will not work properly. If the positive and negative poles of the diode used for rectification are reversed, the entire sample will be damaged. After the diode is processed, its positive and negative poles are usually distinguished in appearance. Common ways of distinguishing include: the end with a notch is the negative pole; the end with a horizontal bar is the negative pole; the end with a white double bar is the negative pole; the end in the direction of the triangular arrow is the negative pole. The following technical solution automatically identifies the polarity of the diode based on the difference in appearance.

[0042] like Figure 4 As shown, a processor is also provided on the top surface of the working platform 1, and the processor is communicatively connected to the acquisition module, the rotation analysis module and the controller;

[0043] The acquisition module includes a camera mounted above the limiting mechanism 5. Cameras can be categorized as digital or analog. A digital camera converts analog video signals generated by a video acquisition device into digital signals, which are then stored in a computer. Analog cameras, on the other hand, require a specific video capture card to convert the analog signals into digital form and compress them before they can be transferred to a computer for use. After inserting the SMD diode between the two card blocks 506, the camera captures the SMD diode and sends the captured image to the rotation analysis module.

[0044] The rotation analysis module is used to automatically analyze the polarity of the SMD diode after receiving the image: the received image is divided into a first analysis image and a second analysis image with a dividing line as the boundary, and the first analysis image is subjected to grayscale analysis: the first analysis image is randomly divided into several analysis areas, the analysis area is enlarged into a pixel grid image and grayscale transformation is performed to obtain the grayscale value of the pixel grid in the analysis area, and the white and black are divided into several levels according to the logarithmic relationship, which is called "grayscale level", generally ranging from 0 to 255, white is 255, black is 0, so the black and white picture is also called grayscale image, which has a wide range of uses in the fields of medicine and image recognition; the grayscale of the pixel grid in the analysis area is analyzed. The grayscale expression value of the analysis area is obtained by summing and averaging the values, and a plurality of grayscale expression values are grouped into a grayscale set. The variance of the grayscale set is calculated to obtain the first grayscale coefficient of the first analysis image; the second analysis image is subjected to grayscale analysis to obtain the second grayscale coefficient. It should be noted that, regardless of which of the above-mentioned appearance distinction methods is used, the deviation of the grayscale expression values between the analysis areas corresponding to the cathode of the diode is greater than that of the anode. Therefore, the discreteness of the grayscale expression values of the analysis area can be analyzed to match the cathode of the diode with the first analysis image or the second analysis image; the first grayscale coefficient is compared with the second grayscale coefficient: if the first grayscale coefficient is greater than the second grayscale coefficient, The polarity of the chip diode corresponding to the first analysis image is marked as the negative pole; if the first grayscale coefficient is less than the second grayscale coefficient, the model of the chip diode corresponding to the first analysis image is marked as the positive pole; if the second grayscale coefficient is equal to the second grayscale coefficient, it is determined that the rotation analysis has failed, and the analysis areas of the first analysis image and the second analysis image are re-divided for grayscale analysis; it is determined whether the positive terminal of the mounting bracket 501 corresponds to the positive pole of the chip diode: if they correspond, the rotation analysis module sends a welding signal to the processor; if not, the rotation analysis module sends a steering signal to the processor, and the processor sends the steering signal to the controller after receiving the steering signal, and the controller controls the circuit after receiving the steering signal. The push rod 9 extends, the transverse plate 10 and the straight plate 12 move transversely to the right, and the limit mechanism 5 is driven to rotate 180 degrees counterclockwise through the rack 14 and the gear 4 until the first metal sheet 13 contacts the second metal sheet 15, and the detection circuit of the second metal sheet 15 is connected, and the controller sends a welding signal to the processor; after welding is completed, the SMD diode is removed from the limit mechanism 5, and the rotation analysis module sends a reset signal to the processor. After receiving the reset signal, the processor sends the reset signal to the controller. After receiving the reset signal, the controller controls the electric push rod 9 to retract, and the transverse plate 10 and the straight plate 12 move transversely to the left, and the limit mechanism 5 is driven to rotate 180 degrees clockwise through the rack 14 and the gear 4;After the diode is fixed, the polarity of the diode is automatically analyzed. The positive and negative poles of the diode are distinguished by the difference in appearance. The positive and negative poles of the diode are then matched. If there is a mismatch, the diode is turned to avoid the phenomenon of reversed positive and negative poles causing damage to the entire sample. At the same time, the pressure on the staff is reduced. When welding the diode, the diode can be inserted between the two clamping blocks 506. The operation is simple and convenient. Example

[0045] like Figure 5 As shown, a working method of a limit device for soldering a chip diode includes the following steps:

[0046] Step 1: Insert the SMD diode between the two clamping blocks 506 through the wedge-shaped opening until the bottom of the SMD diode contacts the top surface of the support plate 509. During the insertion process, the SMD diode separates the two clamping blocks 506, and the reaction force of the spring 507 is used to clamp the SMD diode. The wedge-shaped opening on the clamping block 506 facilitates the insertion of the diode between the two clamping blocks 506. The reaction force of the spring 507 clamps the diode, thereby fixing the diode. After welding is completed, the diode can be directly pulled out;

[0047] Step 2: Use the camera to capture an image of the SMD diode, and use the rotation analysis module to analyze the polarity of the SMD diode to determine whether the positive terminal of the mounting frame 501 corresponds to the positive terminal of the SMD diode. This avoids the phenomenon of the entire sample being damaged due to the reversed positive and negative terminals, and at the same time reduces the pressure on the staff.

[0048] Step 3: When the positive terminal of the mounting frame 501 corresponds to the positive electrode of the SMD diode, welding is performed directly; when the positive terminal of the mounting frame 501 does not correspond to the positive electrode of the SMD diode, the electric push rod 9 is extended to drive the straight plate 12 and the cross plate to move horizontally, and the rack 14 and the gear 4 drive the limit mechanism 5 to rotate 180 degrees before welding. The polarity identification and the rotation of the limit mechanism 5 are automatically processed by the processor and the controller.

[0049] Step 4: After the welding is completed, the SMD diode is removed from the limiting mechanism 5, the electric push rod 9 is recovered, and the limiting mechanism 5 is driven to reset through the rack 14 and the gear 4 to complete the welding work of the entire SMD diode.

[0050] A limiting device for soldering chip diodes. When in operation, the chip diode is inserted between two clamping blocks 506 through a wedge-shaped opening until the bottom of the chip diode contacts the top surface of a support plate 509. During the insertion process, the chip diode separates the two clamping blocks 506, and the chip diode is clamped by the reaction force of a spring 507. The chip diode is imaged by a camera, and the polarity of the chip diode is analyzed by a rotation analysis module to determine whether the positive terminal of the mounting frame 501 corresponds to the positive pole of the chip diode. When the positive terminal of the mounting frame 501 corresponds to the positive pole of the chip diode, welding is directly performed. When the positive terminal of the mounting frame 501 does not correspond to the positive pole of the chip diode, an electric push rod 9 is extended to drive the straight plate 12 and the cross plate to move horizontally, and the rack 14 and the gear 4 drive the limiting mechanism 5 to rotate 180 degrees before welding.

[0051] The above content is merely an example and explanation of the structure of the present invention. Those skilled in the art may make various modifications or additions to the described specific embodiments or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the scope of protection of the present invention.

[0052] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0053] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A limiting device for soldering chip diodes, comprising a working platform (1), characterized in that: The working platform (1) is fixedly mounted with a first limit plate (6), a second limit plate (7) and a first slide groove (8) on the top, the first limit plate (6) is fixedly mounted with an electric push rod (9) on the side close to the second limit plate (7), the output end of the electric push rod (9) is fixedly mounted with a transverse plate (10), the bottom of the transverse plate (10) is fixedly mounted with a first slider (11), the bottom of the first slider (11) is slidably connected to the first slide groove (8), the side of the transverse plate (10) away from the electric push rod (9) is fixedly mounted with a straight plate (12), one end of the straight plate (12) away from the transverse plate (10) is fixedly mounted with a first metal sheet (13), and the back of the straight plate (12) is fixedly mounted with evenly distributed racks (14); the second limit plate (7) is fixedly mounted with a second metal sheet (15) on the side close to the first limit plate (6); The top surface of the working platform (1) is movably connected to a rotating shaft (2) via a bearing, a rotating roller (3) is fixedly mounted on the outer surface of the rotating shaft (2), a gear (4) is fixedly mounted on the outer surface of the rotating roller (3), the gear (4) is meshed with a rack (14), and a limiting mechanism (5) is provided on the top of the rotating shaft (2); The top surface of the working platform (1) is also provided with a processor, and the processor is communicatively connected to the acquisition module, the rotation analysis module and the controller; The limiting mechanism (5) includes a mounting frame (501), the front end of the mounting frame (501) is a welding end, a dividing line is provided in the middle of the top surface of the mounting frame (501), a through hole (502) is provided in the middle of the mounting frame (501), grooves (503) are provided on both sides of the through hole (502), and second slide grooves (504) are fixedly installed on the inner top wall and the inner bottom wall of the groove (503), and the adjacent sides of the two second slide grooves (504) are movably connected with the second slide grooves (504). A block (505) is fixedly installed between the adjacent sides of the two second sliders (505), two symmetrical springs (507) are fixedly installed between the side of the block (506) and the inner wall of the groove (503), a wedge-shaped opening is opened on the top of the block (506) away from the spring (507), a connecting block (508) is fixedly installed on the inner bottom wall of the through hole (502), and a supporting plate (509) is fixedly installed on the top of the connecting block (508).

2. A limiting device for soldering chip diodes according to claim 1, characterized in that: The acquisition module includes a camera arranged above the limiting mechanism (5); after the patch diode is inserted between the two clamping blocks (506), the camera is used to capture an image of the patch diode and the captured image is sent to the rotation analysis module; The rotation analysis module is used to automatically analyze the polarity of the SMD diode after receiving the image.

3. A limiting device for soldering a chip diode according to claim 2, characterized in that: The specific process of the rotation analysis module automatically analyzing the polarity of the patch diode includes: dividing the received image with the dividing line as the boundary to obtain a first analysis image and a second analysis image, performing grayscale analysis on the first analysis image: randomly dividing the first analysis image into several analysis areas, enlarging the analysis area into a pixel grid image and performing grayscale transformation to obtain the grayscale value of the pixel grid in the analysis area, summing and averaging the grayscale values of the pixel grid in the analysis area to obtain the grayscale performance value of the analysis area, forming a grayscale set of several grayscale performance values, and performing variance calculation on the grayscale set to obtain a first grayscale coefficient of the first analysis image; performing grayscale analysis on the second analysis image to obtain a second grayscale coefficient, and comparing the first grayscale coefficient with the second grayscale coefficient: If the first grayscale coefficient is greater than the second grayscale coefficient, the polarity of the patch diode corresponding to the first analysis image is marked as negative; If the first grayscale coefficient is smaller than the second grayscale coefficient, the model of the SMD diode corresponding to the first analysis image is marked as positive; If the second grayscale coefficient is equal to the second grayscale coefficient, the rotation analysis is determined to have failed, and the analysis areas of the first analysis image and the second analysis image are re-divided for grayscale analysis; and whether the positive terminal of the mounting frame (501) corresponds to the positive terminal of the chip diode is determined, and the limiting mechanism (5) is rotationally controlled based on the determination result.

4. A limiting device for soldering chip diodes according to claim 3, characterized in that: The specific process of performing rotation control on the limiting mechanism (5) includes: If the positive terminal of the mounting frame (501) corresponds to the positive terminal of the patch diode, the rotation analysis module sends a welding signal to the processor; If the positive terminal of the mounting frame (501) does not correspond to the positive terminal of the chip diode, the rotation analysis module sends a steering signal to the processor. After receiving the steering signal, the processor sends the steering signal to the controller. After receiving the steering signal, the controller controls the electric push rod (9) to extend, the transverse plate (10) and the straight plate (12) to move transversely to the right, and drives the limit mechanism (5) to rotate counterclockwise by 180 degrees through the rack (14) and the gear (4) until the first metal sheet (13) and the second metal sheet (15) are in contact, and the detection circuit of the second metal sheet (15) is connected, and the controller sends a welding signal to the processor. After welding is completed, the chip diode is removed from the limit mechanism (5), and the rotation analysis module sends a reset signal to the processor. After receiving the reset signal, the processor sends the reset signal to the controller. After receiving the reset signal, the controller controls the electric push rod (9) to retract, the transverse plate (10) and the straight plate (12) to move transversely to the left, and drives the limit mechanism (5) to rotate clockwise by 180 degrees through the rack (14) and the gear (4).

5. A limiting device for soldering a chip diode according to any one of claims 1 to 4, characterized in that: The working method of the limiting device for soldering chip diodes comprises the following steps: Step 1: Insert the chip diode between the two clamping blocks (506) through the wedge-shaped opening until the bottom of the chip diode contacts the top surface of the support plate (509). During the insertion process, the chip diode separates the two clamping blocks (506) and the reaction force of the spring (507) is used to clamp the chip diode; Step 2: photographing the chip diode through a camera, analyzing the polarity of the chip diode through a rotation analysis module, and determining whether the positive terminal of the mounting frame (501) corresponds to the positive electrode of the chip diode; Step 3: When the positive terminal of the mounting frame (501) corresponds to the positive electrode of the SMD diode, welding is directly performed; when the positive terminal of the mounting frame (501) does not correspond to the positive electrode of the SMD diode, the electric push rod (9) is extended to drive the straight plate (12) and the transverse plate (10) to move horizontally, and the rack (14) and the gear (4) drive the limiting mechanism (5) to rotate 180 degrees before welding; Step 4: After the welding is completed, the SMD diode is removed from the limiting mechanism (5), the electric push rod (9) is recovered, and the limiting mechanism (5) is driven to reset through the rack (14) and the gear (4).

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