A heat dissipation device and a heat dissipation system for a Hall thruster

Abstract

The present application discloses a heat dissipation device and a heat dissipation system for a Hall thruster, comprising: a heat dissipation frame (11) having a hollow cavity, the hollow cavity being used to place a heat source, a groove structure being provided on the bottom surface of the hollow cavity, a heat conducting column (14) being provided on the bottom surface of the hollow cavity based on the groove structure, the heat conducting column (14) being used to conduct heat between the heat dissipation frame (11); a first heat dissipation fin (12) being detachably provided on the outer edge of the heat dissipation frame (11); and a second heat dissipation fin (13) being in a cavity structure and being detachably connected to the heat conducting column (14) on the back surface of the bottom surface of the hollow cavity. The heat dissipation device and heat dissipation system proposed in the present application can solve the technical problems existing in the prior art of low heat dissipation efficiency and difficulty in flexible configuration of heat dissipation structures.

Description

Technical Field

[0001] The present application relates to the field of vacuum heat transfer technology, and in particular to a heat dissipation device and a Hall thruster heat dissipation system. Background Art

[0002] Hall thrusters are a common type of electric thruster, widely deployed on various spacecraft. They operate at high temperatures, exceeding 400°C, severely impacting the thruster's magnetic circuit performance and mechanical stability. Conventional excitation and magnetic conductive materials cannot withstand these temperatures. Substituting high-temperature-resistant magnetic materials significantly increases cost and design complexity, and inevitably results in a significantly reduced lifespan.

[0003] Traditional Hall thruster heat dissipation typically involves designing only the thruster's internal heat conduction structure. Heat dissipation in a vacuum is accomplished through heat radiation from the outer wall. While heat generation remains constant, the outer wall temperature remains high. This cooling method can only alter the thruster head temperature distribution to a limited extent, resulting in low heat dissipation efficiency and ineffectiveness in reducing the overall thruster temperature, thus impacting the thruster's magnetic circuit performance and mechanical stability.

[0004] Furthermore, once a traditional Hall thruster's heat dissipation structure is determined, it's difficult to modify it. It can't be flexibly adjusted to meet the cooling requirements of different operating conditions. For example, spacecraft require different weight and heat dissipation structures during ground testing and on-orbit verification. Different satellite designs also require different weight and heat dissipation structures. Traditional Hall thruster heat dissipation structures struggle to meet these on-demand configuration requirements. Summary of the Invention

[0005] The embodiments of the present application provide a heat dissipation device and a Hall thruster heat dissipation system to solve the technical problems existing in the prior art of low heat dissipation efficiency and difficulty in flexible configuration of heat dissipation structures.

[0006] The present invention provides a heat dissipation device for dissipating heat in a vacuum environment, comprising:

[0007] The heat dissipation frame 11 is made of metal and has a hollow cavity for accommodating a heat source. A groove structure is provided on the bottom surface of the hollow cavity. A heat conducting column 14 is provided on the bottom surface of the hollow cavity toward the groove structure. The heat conducting column 14 is used to conduct heat to the heat dissipation frame 11.

[0008] A first heat sink 12, made of metal, is detachably disposed on the outer edge of the heat sink frame 11;

[0009] The second heat sink 13 is made of metal and has a cavity structure. The back surface of the bottom surface of the hollow cavity is detachably connected to the heat conducting column 14 .

[0010] Optionally, the heat dissipation skeleton 11 is a cylindrical cavity, the second heat dissipation fin 13 is a cylindrical cavity, and the first heat dissipation fin 12 is an annular fin.

[0011] Optionally, the heat-conducting pillars 14 and the heat dissipation frame 11 are integrally formed.

[0012] Optionally, at least one notch is provided on the first heat sink 12 for accommodating other components of the Hall thruster.

[0013] Optionally, the second heat sink 13 has a through hole at the bottom of its cavity, so that it can be detachably connected to the heat conducting column 14 based on the through hole.

[0014] Optionally, the side surface of the heat dissipation skeleton 11 is a hollow structure, and the surface roughness of the outer surface of the heat dissipation skeleton 11 is less than a first threshold.

[0015] The present application also provides a Hall thruster heat dissipation system, including:

[0016] The heat dissipation device as described above;

[0017] The inner magnetic pole 2 is arranged outside the hollow cavity of the heat dissipation device and adjacent to the heat-conducting column 14 of the heat dissipation device;

[0018] The outer magnetic pole 3 is arranged on the outer side wall of the heat dissipation frame 11 of the heat dissipation device based on the housing 5, and there is a gap between the outer magnetic pole 3 and the outer surface of the heat dissipation frame 11;

[0019] The magnetic guide block 4 is arranged between the outer wall of the bottom surface of the heat dissipation frame 11 and the outer magnetic pole 3;

[0020] The ceramic channel 6 is installed in the hollow cavity of the heat dissipation device and is in contact with the inner wall of the heat dissipation frame 11;

[0021] The outer shell 5 is used to accommodate and fix the inner magnetic pole 2, the outer magnetic pole 3 and the magnetic guide block 4.

[0022] Optionally, a gap is left between the inner magnetic pole 2 , the outer magnetic pole 3 and the outer surface of the heat dissipation skeleton 11 .

[0023] Optionally, a heat insulating sheet 7 is provided between the inner magnetic pole 2 , the outer magnetic pole 3 and the heat dissipation frame 11 .

[0024] The heat dissipation device and the Hall thruster heat dissipation system of the embodiments of the present application can solve the technical problems of low heat dissipation efficiency and difficulty in flexible configuration of heat dissipation structures in the prior art.

[0025] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0027] Figure 1 This is an example of a cross-sectional view of the heat dissipation device structure according to an embodiment of the present application;

[0028] Figure 2 This is an example of a heat dissipation frame of the heat dissipation device according to an embodiment of the present application;

[0029] Figure 3 This is an example of the heat dissipation device structure according to an embodiment of the present application;

[0030] Figure 4 This is an example of a front view of a heat dissipation device according to an embodiment of the present application;

[0031] Figure 5 This is an example of the top heat sink of the heat dissipation device according to an embodiment of the present application;

[0032] Figure 6 This is an example of the heat dissipation system structure of the Hall thruster according to the embodiment of the present application;

[0033] Figure 7 This is an example of a cross-section of a Hall thruster heat dissipation system according to an embodiment of the present application. DETAILED DESCRIPTION

[0034] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0035] The present application provides a heat dissipation device for heat dissipation in a vacuum environment, such as Figures 1-4 As shown, including:

[0036] The heat dissipation frame 11 is made of metal and has a hollow cavity for placing a heat source. A groove structure is provided on the bottom surface of the hollow cavity. A heat conducting column 14 is provided toward the bottom surface of the hollow cavity based on the groove structure. The heat conducting column 14 is used to conduct heat between the heat dissipation frame 11.

[0037] A first heat sink 12, made of metal, is detachably disposed on the outer edge of the heat sink frame 11;

[0038] The second heat sink 13 is made of metal and has a cavity structure. The back surface of the bottom surface of the hollow cavity is detachably connected to the heat conducting column 14 .

[0039] In some examples, the heat sink skeleton 11 is a cylindrical cavity, the second heat sink 13 is a cylindrical cavity, and the first heat sink 12 is an annular sheet. In this example, the following description is based on the side of the hollow cavity as the bottom surface and the side of the first heat sink 12 as the top surface. The corresponding first heat sink 12 is the top heat sink and the second heat sink 13 is the bottom heat sink. Figure 2 As shown, a groove structure is provided on the bottom surface of the hollow cavity, a heat-conducting column 14 is provided on the bottom surface of the hollow cavity based on the groove structure, and an opening (such as a threaded hole) is provided on one side of the bottom surface of the heat-conducting column 14 for detachably connecting the second heat sink 13.

[0040] In a vacuum environment, due to the lack of air convection, heat can only be radiated from the surface of the heat sink into the air. Therefore, the surface area of the heat sink determines its heat dissipation efficiency. In the embodiment of the present application, the heat sink frame 11 transfers heat from the heat source to the top and bottom heat sinks. At the same time, the heat sink frame 11, the top and bottom heat sinks radiate heat into the air.

[0041] For example, the heat source can be placed within the hollow cavity of the heat sink frame 11. The top heat sink 12 is an annular fin, and the bottom heat sink 13 is a hollow cavity, both of which expand the surface area of the heat sink frame 11, thereby improving the heat dissipation efficiency of the heat sink. In the embodiment of the present application, the top and bottom heat sinks are both detachably connected to the heat sink frame 11, so that heat sinks with different heat dissipation efficiencies can be assembled according to different application requirements by using top and bottom heat sinks of different weights and sizes.

[0042] In some embodiments, the heat conducting pillars 14 are integrally formed with the heat dissipation frame 11. The heat conducting pillars 14 can be integrally formed with the heat dissipation frame 11 by casting to achieve higher heat transfer efficiency.

[0043] In some embodiments, the side surfaces of the heat sink frame 11 are hollowed out to prevent the heat sink frame 11 from generating induced currents in space. The surface roughness of the outer surface of the heat sink frame 11 is less than a first threshold. Smoothing the outer surface of the heat sink frame 11 to a surface roughness less than the first threshold can reduce heat radiation through the outer surface of the heat sink frame 11, thereby protecting other devices in contact with the outer surface of the heat sink frame 11.

[0044] In some embodiments, the second heat sink 13 has a through hole at the bottom of its cavity, so that it can be detachably connected to the heat conducting column 14 based on the through hole. Specifically, the second heat sink 13 (bottom heat sink) is also a cylindrical cavity, and a hole is formed on the bottom surface of the cylindrical cavity for connecting with the heat dissipation frame 11. Figure 1 The bottom heat sink expands the surface area of external radiation through the cylindrical cavity. The bottom heat sink can be connected to the heat conducting column 14 through the threaded hole.

[0045] In some embodiments, as Figure 5 As shown, the first heat sink 12 is provided with at least one notch for accommodating other components of the Hall thruster. In some specific examples, the inner ring of the first heat sink 12 is thickened and perforated, connecting to the heat sink frame 11 through the holes. In some embodiments, the heat sink frame 11, the first heat sink 12, and the second heat sink 13 are all made of metal. Metal has excellent thermal conductivity, thus ensuring efficient heat transfer.

[0046] The embodiment of the present application also proposes a Hall thruster heat dissipation system, such as Figure 6 、 Figure 7 As shown, including:

[0047] The heat dissipation device as described above;

[0048] The inner magnetic pole 2 is arranged outside the hollow cavity of the heat dissipation device and adjacent to the heat-conducting column 14 of the heat dissipation device;

[0049] The outer magnetic pole 3 is arranged on the outer side wall of the heat dissipation frame 11 of the heat dissipation device based on the housing 5, and there is a gap between the outer magnetic pole 3 and the outer surface of the heat dissipation frame 11;

[0050] The magnetic guide block 4 is arranged between the outer wall of the bottom surface of the heat dissipation frame 11 and the outer magnetic pole 3;

[0051] The ceramic channel 6 is installed in the hollow cavity of the heat dissipation device and is in contact with the inner wall of the heat dissipation frame 11;

[0052] The outer shell 5 is used to accommodate and fix the inner magnetic pole 2, the outer magnetic pole 3 and the magnetic guide block 4.

[0053] In the specific embodiment of the present application, the ceramic channel 6 is installed within the cavity of the heat sink frame 11 and is in contact with the inner surface of the heat sink frame 11. The inner magnetic pole 2, outer magnetic pole 3, and magnetic guide block 4 are installed outside the cavity of the heat sink frame 11, with gaps formed between the inner magnetic pole 2, outer magnetic pole 3 and the outer surface of the heat sink frame 11. The magnetic guide block 4 is in contact with the outer surface of the heat sink frame 11. The outer shell 5 is a hollow cavity for accommodating and fixing the inner magnetic pole 2, outer magnetic pole 3, and magnetic guide block 4.

[0054] In the embodiment of the present application, the inner magnetic pole 2, the outer magnetic pole 3, and the magnetic guide block 4 are used to guide the magnetic field lines of the Hall thruster. The ceramic channel 6 is a high-energy particle collision channel and is the main heat source of the Hall thruster. The ceramic channel 6 is in contact with the inner surface of the heat dissipation frame 11, which can transfer the heat in the ceramic channel 6 to the heat dissipation frame 11, and the heat dissipation frame 11 transfers the heat to the top heat sink through the side. Figure 6 The top heat sink radiates heat into the space. The heat sink frame 11 transfers heat to the bottom heat sink through the heat conducting columns 14, and the bottom heat sink radiates heat into the space.

[0055] In some embodiments, as Figure 7 As shown, a gap is left between the inner magnetic pole 2, the outer magnetic pole 3, and the outer surface of the heat sink skeleton 11. In a vacuum environment, heat conduction from the heat sink skeleton 11 to the inner magnetic pole 2 and the outer magnetic pole 3 can be eliminated, thereby achieving the technical effect of protecting the magnetic structure of the Hall thruster.

[0056] In some embodiments, a heat shield 7 is provided between the inner magnetic pole 2, the outer magnetic pole 3 and the heat dissipation frame 11. The heat shield 7 can reduce the heat transfer from the heat dissipation frame 11 to the inner magnetic pole 2 and the outer magnetic pole 3.

[0057] refer to Figure 7 For example, when assembling the Hall thruster cooling system, the top heat sink (first heat sink 12) and bottom heat sink (second heat sink 13) can be left uninstalled. Instead, the ceramic channel 6 is installed in the heat sink frame 11. The inner and outer magnetic poles 2, 3, and magnetic guide block 4 are secured in the housing 5. The heat sink frame 11 is then fitted to the inner and outer magnetic poles 2, 3, and magnetic guide block 4. After assembly, top and bottom heat sinks of varying sizes and weights can be selected based on space requirements, heat dissipation requirements, and weight requirements.

[0058] In the embodiment of the present application, top heat sinks and bottom heat sinks are arranged on the heat dissipation frame, which increases the surface area of the heat dissipation device for external heat radiation, thereby improving the heat dissipation efficiency of the heat dissipation device; in addition, the top heat sinks and bottom heat sinks are detachable from the heat dissipation frame, so that top heat sinks and bottom heat sinks of different weights and sizes can be arranged for heat dissipation devices with different weights and heat requirements, thereby solving the technical problems of low heat dissipation efficiency and difficulty in flexible configuration of heat dissipation structures in the prior art.

[0059] It should be noted that, in the various embodiments of the present application, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0060] The serial numbers of the above embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0061] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are protected by this application.

Claims

1. A Hall thruster heat dissipation system, characterized in that: include: A heat dissipation device, comprising: A heat dissipation frame (11) is made of metal and has a hollow cavity for placing a heat source. A groove structure is provided on the bottom surface of the hollow cavity. A heat conducting column (14) is provided on the bottom surface of the hollow cavity toward the groove structure. The heat conducting column (14) is used to conduct heat with the heat dissipation frame (11). A first heat sink (12) made of metal, detachably disposed on the outer edge of the heat dissipation frame (11); A second heat sink (13) is made of metal and has a cavity structure, and is detachably connected to the heat conducting column (14) based on the back surface of the bottom surface of the hollow cavity; The heat dissipation frame (11) is a cylindrical cavity, the second heat dissipation fin (13) is a cylindrical cavity, and the first heat dissipation fin (12) is an annular fin; An inner magnetic pole (2) is arranged outside the hollow cavity of the heat dissipation device and adjacent to a heat-conducting column (14) of the heat dissipation device; An outer magnetic pole (3) is arranged on the outer side wall of the heat dissipation frame (11) of the heat dissipation device based on the housing (5), with a gap between the outer magnetic pole (3) and the outer surface of the heat dissipation frame (11); A magnetic guide block (4) is arranged between the outer wall of the bottom surface of the heat dissipation frame (11) and the outer magnetic pole (3); A ceramic channel (6) is installed in the hollow cavity of the heat dissipation device and is in contact with the inner wall of the heat dissipation frame (11); The outer shell (5) is used to accommodate and fix the inner magnetic pole (2), the outer magnetic pole (3) and the magnetic guide block (4).

2. The Hall thruster heat dissipation system according to claim 1, characterized in that: A gap is left between the inner magnetic pole (2), the outer magnetic pole (3) and the outer surface of the heat dissipation frame (11).

3. The Hall thruster heat dissipation system according to claim 1, wherein: A heat insulating sheet (7) is provided between the inner magnetic pole (2), the outer magnetic pole (3) and the heat dissipation frame (11).

4. The heat dissipation device according to claim 1, wherein: The heat-conducting column (14) and the heat-dissipating frame (11) are integrally formed.

5. The heat dissipation device according to claim 1, wherein: At least one notch is provided on the first heat sink (12) for accommodating other components of the Hall thruster.

6. The heat dissipation device according to claim 1, wherein: The second heat sink (13) has a through hole at the bottom of its cavity, so that it can be detachably connected to the heat conducting column (14) based on the through hole.

7. The heat dissipation device according to claim 1, wherein: The side surface of the heat dissipation frame (11) is a hollow structure, and the surface roughness of the outer surface of the heat dissipation frame (11) is less than a first threshold value.

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