Front electrode assembly, front electrode assembly and semiconductor process apparatus

Abstract

This invention provides a front electrode assembly. A semiconductor process apparatus includes a process chamber and two parallel support rods fixedly disposed within the process chamber. A first wafer boat, carrying a wafer, is supported on the two support rods. The front electrode assembly includes a first reset contact mechanism disposed on each support rod. The first reset contact mechanism has a movable wafer boat contact surface, which is capable of contacting the bottom of the first wafer boat when it rests on the support rod. This allows a first power supply component of the semiconductor process apparatus to provide radio frequency signals to the first wafer boat through the first reset contact mechanisms on the two support rods. This invention avoids the electrode structures on the support rods or wafer boat being coated, ensuring the stability of the electrical contact between the support rods and the wafer boat. This invention also provides a front electrode assembly and a semiconductor process apparatus.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process equipment, and more specifically, to a front electrode assembly, a front electrode assembly, and a semiconductor process equipment. Background Technology

[0002] Plasma-enhanced chemical vapor deposition (PECVD) equipment is an important piece of equipment in semiconductor production lines for performing plasma-enhanced chemical vapor deposition processes on silicon wafers. In a high-temperature chamber, glow discharge ionization is used to ionize the process gas, which undergoes a series of complex chemical reactions to form a silicon nitride film on the surface of the silicon wafer, thereby reducing the reflectivity of the front surface of the battery and passivating the surface.

[0003] Plasma-enhanced chemical vapor deposition (PECVD) equipment mainly includes a process chamber, a graphite boat, and a vacuum pressure control and program control system. The graphite boat is a crucial carrier structure for ensuring the wafer reaction environment. The process chamber houses power supply components to feed the process radio frequency (RF) current to the graphite boat. The electrical contact performance between the graphite boat and the power supply components, as well as the quality of the RF current, directly affects the ion deposition process effect and wafer throughput.

[0004] Currently, most mainstream plasma-enhanced chemical vapor deposition (PECVD) technologies employ a single graphite boat deposition process. However, with technological advancements and the demand for high-capacity equipment, this technology is gradually evolving towards larger diameter tubes and dual-boat structures. Regardless of whether it's a single-boat or dual-boat structure, in practical applications, the electrodes used to feed radio frequency signals to the graphite boat are constantly exposed to high temperatures and the deposition process environment. If a gap exists in the contact between the electrode and the graphite boat, a silicon nitride film will adhere to the electrode surface, leading to poor contact with the graphite boat and causing problems such as arcing. Regular maintenance and cleaning of the electrodes are necessary to restore normal operation.

[0005] Electrode coating often leads to a decrease in process capacity and customer satisfaction. Therefore, how to avoid electrode coating problems in order to ensure the stability of equipment operation and wafer capacity has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0006] The present invention aims to provide a front electrode assembly, a front electrode assembly and a semiconductor process apparatus, wherein the front electrode assembly can prevent the electrode structure on the support rod or the crystal boat from being coated, thereby ensuring the stability of the electrical contact between the support rod and the crystal boat.

[0007] To achieve the above objectives, as one aspect of the present invention, a front electrode assembly is provided for a semiconductor process apparatus. The semiconductor process apparatus includes a process chamber and two support rods fixedly disposed in the process chamber and parallel to each other. A first wafer boat carrying a wafer is supported on the two support rods. The front electrode assembly includes a first reset contact mechanism disposed on each of the support rods. The first reset contact mechanism has a movable wafer boat contact surface, and the wafer boat contact surface is capable of contacting the bottom of the first wafer boat when the first wafer boat rests on the support rod, so that a first power supply component of the semiconductor process apparatus can provide radio frequency signals to the first wafer boat through the first reset contact mechanisms on the two support rods.

[0008] Optionally, the first reset contact mechanism includes a fixing structure, a first contact element, and a plurality of first elastic connectors. The fixing structure is used to fix the first contact element on the corresponding support rod. The top of the first contact element has the crystal boat contact surface. The bottom of the first contact element is connected to the fixing structure through a plurality of first elastic connectors. The first elastic connectors are used to support the first contact element with elastic force and electrically connect the first contact element to the fixing structure.

[0009] Optionally, the front electrode assembly further includes multiple insulating spacers, which are used to be sleeved on the support rod, and the fixing structure is fixedly mounted on the corresponding insulating spacer. The insulating spacers are used to insulate the fixing structure from the support rod.

[0010] Optionally, the first contact is plate-shaped, and the fixing structure includes a fixing base and a conductive cylinder. The conductive cylinder is sleeved on the insulating spacer. The top of the fixing base has a mating plane opposite to the bottom surface of the first contact, and the bottom of the fixing base has a mating cylindrical surface corresponding to the shape of the outer wall of the conductive cylinder. The fixing base is fixedly connected to the conductive cylinder, and the mating cylindrical surface contacts the outer surface of the conductive cylinder. A plurality of first elastic connecting members are disposed between the bottom surface of the first contact and the mating plane. The first power supply component is used to provide radio frequency signals to the first crystal boat through the conductive cylinder, the fixing base, the first elastic connecting members, and the first contact.

[0011] Optionally, the fixing structure further includes a positioning vertical plate, a positioning horizontal plate, and a positioning pin. The positioning vertical plate and the positioning horizontal plate are both fixedly mounted on the conductive cylinder. The positioning vertical plate extends in a direction perpendicular to the extension of the support rod, and the positioning horizontal plate extends in a direction parallel to the extension of the support rod. The positioning horizontal plate is used to contact the bottom of the fixing seat and support the fixing seat.

[0012] A first pin hole is formed on the positioning vertical plate, extending through the support rod along its extension direction. A second pin hole is formed on the side of the fixing seat facing the positioning vertical plate, extending along the support rod's extension direction. The positioning pin passes through the first pin hole and the second pin hole in sequence to fix the fixing seat to the conductive cylinder.

[0013] Optionally, the first reset contact mechanism includes an insulating cylinder and a self-resetting structure. The insulating cylinder is sleeved on the support rod and can rotate relative to the support rod about its axis. The self-resetting structure is fixedly disposed on the insulating cylinder. The self-resetting structure has an electrical contact portion and an abutment portion. The electrical contact portion has the crystal boat contact surface, and the abutment portion has a boat foot contact surface. The mass of the electrical contact portion is greater than the mass of the abutment portion, so that the first reset contact mechanism can rotate in its natural state until the abutment portion faces the opposite side of the support rod and the boat foot contact surface faces upward.

[0014] The bottom of the first crystal boat has at least one pair of boat feet corresponding to the plurality of first reset contact mechanisms. When the first crystal boat lands on the support rod, the at least one pair of boat feet can contact the boat foot contact surfaces of the corresponding two abutment portions and press down the two abutment portions, so that the electrical contact portions of the corresponding two self-resetting structures rotate until the crystal boat contact surfaces contact the bottom surface of the first crystal boat.

[0015] As a second aspect of the invention, a front electrode assembly is provided for a semiconductor process apparatus, the semiconductor process apparatus including a process chamber and two support rods fixedly disposed in the process chamber and parallel to each other, a first wafer carrier supported on the two support rods, the front electrode assembly including a second reset contact mechanism and a contact electrode, the contact electrode being disposed on the support rods, the second reset contact mechanism being disposed at the bottom of the first wafer carrier, the second reset contact mechanism having a movable electrode contact surface, the electrode contact surface being able to contact the contact electrode when the first wafer carrier falls on the support rods, so that a first power supply component of the semiconductor process apparatus can provide radio frequency signals to the first wafer carrier through the contact electrode and the second reset contact mechanism, and the electrode contact surface being able to return to its initial position in a direction away from the first wafer carrier when the first wafer carrier is lifted away from the support rods.

[0016] Optionally, the second reset contact mechanism includes a second contact and a plurality of second elastic connectors. The bottom of the second contact has the electrode contact surface, and the top of the second contact is connected to the bottom of the first crystal boat through the second elastic connectors. The second elastic connectors are used to electrically connect the second contact to the first crystal boat and to hold the second contact at an initial position at a preset distance from the bottom of the first crystal boat by means of elasticity.

[0017] As a third aspect of the present invention, a semiconductor process apparatus is provided, including a process chamber, a first power supply assembly, a first crystal boat, and two parallel support rods disposed in the process chamber, wherein the first crystal boat carrying the wafer is supported on the two support rods, and the semiconductor process apparatus further includes the aforementioned front electrode assembly.

[0018] Optionally, the support rod extends in the direction from the furnace opening side to the furnace tail side, and the semiconductor process equipment further includes a rear electrode assembly, which includes an electrode driving mechanism, a second power supply assembly and a pair of rear electrodes. The rear electrodes and the electrode driving mechanism are disposed in the process chamber and located on the furnace tail side.

[0019] The second crystal boat includes a pair of electrode clamping mechanisms. The electrode driving mechanism is used to drive the two rear electrodes to be inserted into the two electrode clamping mechanisms in a one-to-one correspondence after the second crystal boat is placed on the support rod, so that the electrode clamping mechanisms clamp the rear electrodes. The second power supply component is used to provide radio frequency signals to the second crystal boat through the two rear electrodes.

[0020] Optionally, the second crystal boat further includes multiple connecting rods, multiple mounting pieces, and two sets of connecting blocks. The multiple mounting pieces extend in a vertical direction parallel to the support rods and are spaced apart in a horizontal direction perpendicular to the support rods. Each mounting piece has at least one slot for fixing a wafer. The mounting piece also has multiple connecting holes that correspond one-to-one with the multiple connecting rods. The connecting rods pass through the connecting holes at corresponding positions of the multiple mounting pieces in sequence to fix the multiple mounting pieces together.

[0021] The two sets of connecting blocks are spaced apart along the height direction. The position of the electrode clamping mechanism corresponds one-to-one with the position of the two sets of connecting blocks. The electrode clamping mechanism is located between two adjacent mounting pieces and electrically connects the two mounting pieces. The remaining two adjacent mounting pieces are electrically connected at corresponding positions through a connecting block of the corresponding set.

[0022] Optionally, the electrode clamping mechanism includes an elastic element and a pair of clamping blocks. The side of the clamping block opposite to the rear electrode is hinged to the two corresponding mounting pieces. The elastic element is located on the side of the clamping block opposite to the rear electrode, and the height of the elastic element is between the height of the hinge point between the two clamping blocks and the mounting pieces. Both clamping blocks have mating notches on the side facing each other. The elastic element is used to push the two clamping blocks to rotate by elastic force, so that the two clamping blocks open towards the side facing the rear electrode. The electrode driving mechanism can drive the rear electrode to move towards the corresponding electrode clamping mechanism, so that the end of the rear electrode enters between the two clamping blocks and pushes the sidewall of the mating notch of the clamping block, so that the side of the two clamping blocks facing the rear electrode closes, and the inner surface of the mating notch of the two clamping blocks makes mating contact with the surface of the rear electrode.

[0023] Optionally, the rear electrode includes an electrode head, an extension rod, and a connecting portion. The extension rod is connected between the electrode head and the connecting portion. The electrode driving mechanism is used to drive the connecting portion to move the extension rod and the electrode head closer to or away from the corresponding electrode clamping mechanism.

[0024] Optionally, the electrode head includes a cylindrical portion, a first rectangular portion, and a second rectangular portion. The first rectangular portion is connected between the cylindrical portion and the second rectangular portion. The side of the second rectangular portion facing away from the cylindrical portion is fixedly connected to the extension rod. The diameter of the cylindrical portion is greater than the height of the first rectangular portion, and the top and bottom surfaces of the first rectangular portion are transitionally connected to the cylindrical surface of the cylindrical portion. The top surface of the second rectangular portion is higher than the top surface of the first rectangular portion, and the bottom surface of the second rectangular portion is lower than the bottom surface of the first rectangular portion. The mating notch of the clamping block corresponds to the shape of the cylindrical portion and the first rectangular portion, and the surface of the second rectangular portion facing the cylindrical portion can contact the surfaces of the two clamping blocks after the two clamping blocks are closed on the side facing the rear electrode.

[0025] Optionally, the rear electrode further includes a protective sleeve that covers the surface of the electrode head for contact with the electrode clamping mechanism.

[0026] Optionally, the electrode clamping mechanism further includes at least one gap pad, which is disposed between at least one side of the clamping block and the mounting piece on the corresponding side.

[0027] Optionally, the process chamber further includes at least one anti-rotation component, and at least one end of at least one of the support rods is fixedly connected to the cavity of the process chamber through the anti-rotation component;

[0028] The anti-rotation assembly includes a fixed housing, a pressure plate, and an inner liner. The fixed housing has a fixing groove, and the inner liner is disposed in the fixing groove to accommodate the end of the support rod. The pressure plate is fixedly disposed on the fixed housing and is used to press the inner liner toward the bottom of the fixing groove so that the inner liner clamps the support rod.

[0029] In the semiconductor process equipment provided by the present invention, the front electrode assembly includes a first reset contact mechanism disposed on each support rod. The first reset contact mechanism has a movable resettable crystal boat contact surface, so that when the first crystal boat falls on the first reset contact mechanism and presses down on the crystal boat contact surface, the crystal boat contact surface can be tightly attached to the bottom surface of the first crystal boat under the reset function of the first reset contact mechanism. This ensures the stability of the circuit connection of the first power supply component providing radio frequency signals to the first crystal boat through the support rod and the first reset contact mechanism on it. At the same time, it avoids the gap between the crystal boat contact surface at the top of the first reset contact mechanism and the bottom surface of the first crystal boat, thereby preventing the crystal boat contact surface or the bottom surface of the first crystal boat from being coated due to exposure to the process environment. This improves the reliability of the semiconductor process equipment, extends the maintenance cycle of the semiconductor process equipment, and ensures the production capacity of the semiconductor process equipment.

[0030] Alternatively, a second reset contact mechanism can be provided at the bottom of the first crystal boat. The second reset contact mechanism has a movable reset electrode contact surface. When the first crystal boat is placed on two support rods, the support rods overcome the reset action of the second reset contact mechanism and press the electrode contact surface upwards to retract it towards the first crystal boat. At this time, even if the first crystal boat tilts, under the reset action of the second reset contact mechanism, the electrode contact surface can still press downwards onto the contact electrode on the support rod and fully fit with the contact electrode on the support rod. This ensures the stability of the circuit connection of the first power supply component providing radio frequency signals to the first crystal boat through the support rod and its contact electrode. At the same time, it avoids gaps between the electrode contact surface and the contact electrode, thereby preventing the electrode contact surface or contact electrode from being coated due to exposure to the process environment. This ensures the stability of the electrical contact between the support rod and the first crystal boat, thereby improving the reliability of the semiconductor process equipment, extending the maintenance cycle of the semiconductor process equipment, and ensuring the production capacity of the semiconductor process equipment. Attached Figure Description

[0031] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the following detailed description to explain the invention, but do not constitute a limitation thereof. In the drawings:

[0032] Figure 1 This is a partial structural schematic diagram of the semiconductor process equipment provided in an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the first reset contact mechanism in the front electrode assembly provided in an embodiment of the present invention;

[0034] Figure 3 yes Figure 2 A cross-sectional view of the first reset contact mechanism;

[0035] Figure 4 This is a schematic diagram of the connection relationship between the second crystal boat and the rear electrode in the semiconductor process equipment provided in this embodiment of the invention;

[0036] Figures 5 to 6 This is a schematic diagram illustrating the connection principle between the electrode clamping mechanism and the rear electrode in the semiconductor process equipment provided in this embodiment of the invention.

[0037] Figure 7 This is a schematic diagram of the anti-rotation component in the semiconductor process equipment provided in an embodiment of the present invention;

[0038] Figure 8 This is a schematic diagram of the structure of the semiconductor process equipment provided in an embodiment of the present invention;

[0039] Figure 9 This is a schematic diagram of the structure of the semiconductor process equipment after the crystal boat is placed, according to an embodiment of the present invention;

[0040] Figure 10 This is a schematic diagram of the structure of the second reset contact mechanism in the second electrode assembly provided in an embodiment of the present invention;

[0041] Figure 11 yes Figure 10 A cross-sectional view of the second reset contact mechanism;

[0042] Figure 12 This is a schematic diagram showing the connection relationship between the second reset contact mechanism and the first crystal boat in the semiconductor process equipment provided in this embodiment of the invention;

[0043] Figure 13 This is a schematic diagram showing the connection relationship between the second reset contact mechanism and the first crystal boat in the semiconductor process equipment provided in this embodiment of the invention.

[0044] Explanation of reference numerals in the attached figures:

[0045] 10: First Crystal Boat 20: Support Rod

[0046] 21: Insulating spacer 200: First reset contact mechanism

[0047] 210: Fixed structure; 211: Fixed base

[0048] 212: Conductive cylinder; 213: Positioning cross plate

[0049] 214: Positioning vertical plate; 215: Positioning pin

[0050] 220: First contact element; 230: First elastic connector

[0051] 30: Second Crystal Boat; 31: Mounting Piece

[0052] 32: Hinge rod; 33: Spacer block

[0053] 34: Connecting block; 35: Electrode clamping mechanism

[0054] 310: Clamping block; 320: Gap pad block

[0055] 330: Elastic element; 40: Rear electrode

[0056] 410: Electrode head; 411: Second rectangular section

[0057] 412: First rectangular part; 413: Cylindrical part

[0058] 420: Extension rod; 430: Connecting part

[0059] 440: Protective cover; 50: Anti-rotation component

[0060] 51: Fixed housing 52: Pressing plate

[0061] 53: Inner bushing; 55: First fixing screw

[0062] 54: Second fixing screw Detailed Implementation

[0063] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0064] To address the aforementioned technical problems, as one aspect of the present invention, a front electrode assembly is provided for use in semiconductor process equipment, such as... Figure 1 As shown, the semiconductor process equipment includes a process chamber and two parallel support rods 20 fixedly disposed in the process chamber 1. A first wafer boat 10 (i.e., a graphite boat) carrying the wafer is supported on the two support rods 20. Figure 2 , Figure 3 , Figures 8 to 13As shown, the front electrode assembly includes a first reset contact mechanism 200 disposed on each support rod 20. The first reset contact mechanism 200 has a movable crystal boat contact surface, and the crystal boat contact surface is able to contact the bottom of the first crystal boat 10 when the first crystal boat 10 is placed on the support rod 20, so that the first power supply component (not shown) of the semiconductor process equipment can provide radio frequency signals to the first crystal boat 10 through the first reset contact mechanism 200 on the two support rods 20.

[0065] The front electrode assembly provided by the present invention includes a first reset contact mechanism 200 disposed on each support rod 20. The first reset contact mechanism 200 has a movable resettable crystal boat contact surface, so that when the first crystal boat 10 falls on the first reset contact mechanism 200 and presses down on the crystal boat contact surface, the crystal boat contact surface can be tightly attached to the bottom surface of the first crystal boat 10 under the reset function of the first reset contact mechanism 200. This ensures the stability of the circuit connection of the first power supply component to provide radio frequency signals to the first crystal boat 10 through the support rod 20 and the first reset contact mechanism 200 thereon. At the same time, it avoids the gap between the crystal boat contact surface at the top of the first reset contact mechanism 200 and the bottom surface of the first crystal boat 10, thereby preventing the crystal boat contact surface or the bottom surface of the first crystal boat 10 from being coated due to exposure to the process environment. This improves the reliability of the semiconductor process equipment, extends the maintenance cycle of the semiconductor process equipment, and ensures the production capacity of the semiconductor process equipment.

[0066] As an optional embodiment of the present invention, the first reset contact mechanism 200 drives the crystal boat contact surface to reset by elastic force, specifically, as shown in the figure. Figures 2 to 3 As shown, the first reset contact mechanism 200 includes a fixing structure 210, a first contact member 220, and a plurality of first elastic connectors 230. The fixing structure 210 is used to fix the first contact member 220 on the corresponding support rod 20. The top of the first contact member 220 has a crystal boat contact surface. The bottom of the first contact member 220 is connected to the fixing structure 210 through a plurality of first elastic connectors 230. The first elastic connectors 230 are used to support the first contact member 220 with elastic force and electrically connect the first contact member 220 to the fixing structure 210.

[0067] As an optional embodiment of the present invention, such as Figures 1 to 3 As shown, the front electrode assembly also includes multiple insulating sleeves 21. The insulating sleeves 21 are used to be sleeved on the support rod 20. The fixing structure 210 is fixedly installed on the corresponding insulating sleeve 21. The insulating sleeves 21 are used to insulate and separate the fixing structure 210 (and the parts of the crystal boat such as the peripheral foot placed on the support rod 20) from the support rod 20.

[0068] As an optional embodiment of the present invention, such as Figure 2 , Figure 3As shown, the first contact 220 is plate-shaped, and the fixing structure 210 includes a fixing base 211 and a conductive cylinder 212. The conductive cylinder 212 is sleeved on the insulating spacer 21. The top of the fixing base 211 has a mating plane A opposite to the bottom surface of the first contact 220, and the bottom of the fixing base 211 has a mating cylindrical surface B corresponding to the shape of the outer wall of the conductive cylinder 212. The fixing base 211 is fixedly connected to the conductive cylinder 212, and the mating cylindrical surface B is in contact with the outer surface of the conductive cylinder 212. A plurality of first elastic connecting members 230 are disposed between the bottom surface of the first contact 220 and the mating plane A. The first power supply assembly is used to provide radio frequency signals to the first crystal boat 10 through the conductive cylinder 212, the fixing base 211, the first elastic connecting members 230 and the first contact 220.

[0069] In this embodiment of the invention, the fixing structure 210 includes a fixing base 211 and a conductive cylinder 212. The conductive cylinder 212 can be stably fitted onto the insulating sleeve 21. The fixing base 211 can provide a mating plane A on the top that is opposite to the bottom surface of the first contact member 220, thereby ensuring the stability of the first contact member 220.

[0070] As an optional embodiment of the present invention, the insulating sleeve 21 is made of ceramic material.

[0071] Preferably, the first reset contact mechanism 200 on each support rod 20 is disposed on the insulating sleeve 21 near the furnace opening side.

[0072] As an optional embodiment of the present invention, such as Figure 2 , Figure 3 As shown, the fixing structure 210 also includes a positioning vertical plate 214, a positioning horizontal plate 213, and a positioning pin 215. The positioning vertical plate 214 and the positioning horizontal plate 213 are both fixedly mounted on the conductive cylinder 212. The positioning vertical plate 214 extends in a direction perpendicular to the extension of the support rod 20, and the positioning horizontal plate 213 extends in a direction parallel to the extension of the support rod 20. The positioning horizontal plate 213 is used to contact the bottom of the fixing seat 211 and support the fixing seat 211. A first pin hole is formed on the positioning vertical plate 214, extending through the positioning vertical plate 214 in a direction extending along the support rod 20. A second pin hole is formed on the side of the fixing seat 211 facing the positioning vertical plate 214, extending in a direction extending along the support rod 20. The positioning pin 215 passes through the first pin hole and the second pin hole in sequence to fix the fixing seat 211 and the conductive cylinder 212.

[0073] As an optional embodiment of the present invention, such as Figure 3 As shown, the first elastic connector 230 is a spring.

[0074] To improve the stability of the fixed connection between the bottom end of the first elastic connector 230 and the fixed base 211, preferably, as follows: Figure 3As shown, multiple spring positioning annular grooves are formed on the mating plane A of the fixed base 211, and the bottom ends of multiple first elastic connectors 230 are fixedly arranged in the multiple spring positioning annular grooves one by one.

[0075] As another optional embodiment of the present invention, such as Figures 8 to 13 As shown, the first reset contact mechanism 200 includes an insulating cylinder 240 and a self-resetting structure 250. The insulating cylinder 240 is sleeved on the support rod 20 and can rotate relative to the support rod 20 about its axis. The self-resetting structure 250 is fixedly mounted on the insulating cylinder 240. Figure 11 As shown, the self-resetting structure 250 has an electrical contact portion 251 and an abutment portion 252. The electrical contact portion 251 has a boat-shaped contact surface, and the abutment portion 252 has a boat-foot contact surface. The mass of the electrical contact portion 251 is greater than the mass of the abutment portion 252, so that the first reset contact mechanism 200 can rotate in its natural state until the abutment portion 252 faces the support rod 20 on the opposite side and the boat-foot contact surface faces upward (i.e., Figure 9 , Figure 10 , Figure 11 (The state shown).

[0076] The bottom of the first crystal boat 10 has at least one pair of boat feet 11 corresponding to each of the plurality of first reset contact mechanisms 200. When the first crystal boat 10 rests on the support rod 20, the at least one pair of boat feet 11 can contact the boat foot contact surfaces of the corresponding two abutment portions 252, and press down the two abutment portions 252, causing the electrical contact portions 251 of the corresponding two self-resetting structures 250 to rotate until the crystal boat contact surface contacts the bottom surface of the first crystal boat 10. Figure 12 , Figure 13 The situation is shown.

[0077] As an optional embodiment of the present invention, such as Figure 11 As shown, the self-repositioning structure 250 also includes a clamping part 253, which is sleeved on the insulating cylinder 240. The electrical contact part 251 and the abutment part 252 are both fixedly mounted on the clamping part 253.

[0078] As an optional embodiment of the present invention, such as Figure 11 As shown, a slit 254 extending along the extension direction of the support rod 20 is formed on the clamping part 253 so that the clamping part 253 breaks at the slit 254 position.

[0079] As a second aspect of the present invention, a front electrode assembly is provided for a semiconductor process apparatus. The semiconductor process apparatus includes a process chamber and two support rods 20 fixedly disposed in the process chamber and parallel to each other. A first wafer boat 10 (i.e., a graphite boat) carrying a wafer is supported on the two support rods 20. The front electrode assembly includes a second reset contact mechanism and a contact electrode. The contact electrode is disposed on the support rods 20, and the second reset contact mechanism is disposed at the bottom of the first wafer boat 10. The second reset contact mechanism has a movable electrode contact surface. The electrode contact surface can contact the contact electrode when the first wafer boat 10 falls on the support rods 20, so that a first power supply component of the semiconductor process apparatus can provide radio frequency signals to the first wafer boat 10 through the contact electrode and the second reset contact mechanism. The electrode contact surface can return to its initial position in a direction away from the first wafer boat 10 when the first wafer boat 10 is lifted away from the support rods 20.

[0080] In this invention, a second reset contact mechanism can be provided at the bottom of the first crystal boat 10. The second reset contact mechanism has a movable reset electrode contact surface. When the first crystal boat 10 is placed on two support rods 20, the support rods 20 overcome the reset action of the second reset contact mechanism and press the electrode contact surface upward to shrink it toward the first crystal boat 10. At this time, even if the first crystal boat 10 tilts, under the reset action of the second reset contact mechanism, the electrode contact surface can press downward onto the contact electrode on the support rod 20 and fully fit with the contact electrode on the support rod 20. This ensures the stability of the circuit connection of the first power supply component to provide radio frequency signals to the first crystal boat 10 through the support rod 20 and its contact electrode. At the same time, it avoids gaps between the electrode contact surface and the contact electrode, thereby avoiding the electrode contact surface or contact electrode from being coated due to exposure to the process environment. This ensures the stability of the electrical contact between the support rod 20 and the first crystal boat 10, thereby improving the reliability of the semiconductor process equipment, extending the maintenance cycle of the semiconductor process equipment, and ensuring the production capacity of the semiconductor process equipment.

[0081] As an optional embodiment of the present invention, the second reset contact mechanism drives the crystal boat contact surface to reset by elastic force. Specifically, the second reset contact mechanism includes a second contact member and a plurality of second elastic connectors. The bottom of the second contact member has an electrode contact surface, and the top of the second contact member is connected to the bottom of the first crystal boat 10 through the second elastic connectors. The second elastic connectors are used to electrically connect the second contact member to the first crystal boat 10 and to hold the second contact member at an initial position at a preset distance from the bottom of the first crystal boat 10 by elastic force.

[0082] As a third aspect of the present invention, a semiconductor process apparatus is provided, including a process chamber, a first power supply component, a first wafer boat 10, and two parallel support rods 20 disposed in the process chamber. The first wafer boat 10, which carries the wafer, is supported on the two support rods 20. The semiconductor process apparatus also includes a front electrode assembly provided in the embodiments of the present invention.

[0083] In the semiconductor process equipment provided by the present invention, the front electrode assembly includes a first reset contact mechanism 200 disposed on each support rod 20. The first reset contact mechanism 200 has a movable resetable crystal boat contact surface, so that when the first crystal boat 10 falls on the first reset contact mechanism 200 and presses down on the crystal boat contact surface, the crystal boat contact surface can be tightly attached to the bottom surface of the first crystal boat 10 under the reset function of the first reset contact mechanism 200. This ensures the stability of the circuit connection of the first power supply component to provide radio frequency signals to the first crystal boat 10 through the support rod 20 and the first reset contact mechanism 200 thereon. At the same time, it avoids the gap between the crystal boat contact surface at the top of the first reset contact mechanism 200 and the bottom surface of the first crystal boat 10, thereby avoiding the crystal boat contact surface or the bottom surface of the first crystal boat 10 from being coated due to exposure to the process environment. This improves the reliability of the semiconductor process equipment, extends the maintenance cycle of the semiconductor process equipment, and ensures the production capacity of the semiconductor process equipment.

[0084] Alternatively, a second reset contact mechanism can be provided at the bottom of the first crystal boat 10. The second reset contact mechanism has a movable reset electrode contact surface. When the first crystal boat 10 is placed on the two support rods 20, the support rods 20 overcome the reset action of the second reset contact mechanism and press the electrode contact surface upward to shrink it toward the first crystal boat 10. At this time, even if the first crystal boat 10 tilts, under the reset action of the second reset contact mechanism, the electrode contact surface can press downward onto the contact electrode on the support rod 20 and fully fit with the contact electrode on the support rod 20. This ensures the stability of the circuit connection of the first power supply component to provide radio frequency signals to the first crystal boat 10 through the support rod 20 and its contact electrode. At the same time, it avoids gaps between the electrode contact surface and the contact electrode, thereby preventing the electrode contact surface or contact electrode from being coated due to exposure to the process environment. This ensures the stability of the electrical contact between the support rod 20 and the first crystal boat 10, thereby improving the reliability of the semiconductor process equipment, extending the maintenance cycle of the semiconductor process equipment, and ensuring the production capacity of the semiconductor process equipment.

[0085] As an optional embodiment of the present invention, the support rod 20 is made of silicon carbide.

[0086] In existing semiconductor process equipment, when a dual-boat structure is used (i.e., two boats are placed spaced apart on the support rod 20 along its extension direction and are processed together), typically only the front boat (the graphite boat near the furnace opening) receives radio frequency signals through electrodes on the support rod 20. A retractable electrode is installed inside the process chamber to extend and make electrical contact with the rear boat (the graphite boat near the furnace tail) after it enters the process chamber. However, this retractable electrode and the rear boat typically have a rigid contact, and gaps inevitably form between their contact surfaces. This causes silicon nitride film to adhere to the surface of the retractable electrode, resulting in poor contact with the boat.

[0087] To solve the above-mentioned technical problems, as a preferred embodiment of the present invention, such as Figure 1 , Figures 4 to 6 As shown, the support rod 20 extends along the furnace opening side (i.e., Figure 8 , Figure 9 The left side of the intermediate process chamber 1 points towards the furnace tail side (i.e. Figure 8 , Figure 9 Extending in the right direction of the process chamber 1, the semiconductor process equipment also includes a rear electrode assembly, which includes an electrode driving mechanism, a second power supply assembly and a pair of rear electrodes 40. The rear electrodes 40 and the electrode driving mechanism are disposed in the process chamber and located on the furnace tail side.

[0088] The second crystal boat 30 includes a pair of electrode clamping mechanisms 35. The electrode driving mechanism is used to drive the two rear electrodes 40 to be inserted into the two electrode clamping mechanisms 35 in a corresponding manner after the second crystal boat 30 is placed on the support rod 20, so that the electrode clamping mechanisms 35 clamp the rear electrodes 40. The second power supply component is used to provide radio frequency signals to the second crystal boat 30 through the two rear electrodes 40.

[0089] In this embodiment of the invention, the second crystal boat 30 includes a pair of electrode clamping mechanisms 35. After the electrode driving mechanism drives the two rear electrodes 40 to extend to the furnace opening side and insert into the two electrode clamping mechanisms 35, the electrode clamping mechanisms 35 can clamp the rear electrodes 40, thereby preventing the contact surface between the electrode clamping mechanism 35 and the rear electrodes 40 from contacting the chamber environment and being coated, thereby further ensuring the stability of the electrical contact between the crystal boat and the electrodes.

[0090] As an optional embodiment of the present invention, such as Figure 1 , Figure 4As shown, the second crystal boat 30 also includes multiple connecting rods, multiple mounting pieces 31, and two sets of connecting blocks 34. The multiple mounting pieces 31 extend in a vertical direction parallel to the support rod 20 and are spaced apart in a horizontal direction perpendicular to the support rod 20. Each mounting piece 31 has at least one slot for fixing a wafer. The mounting pieces 31 also have multiple connecting holes that correspond one-to-one with the multiple connecting rods. The connecting rods pass through the connecting holes at corresponding positions of the multiple mounting pieces 31 in sequence to fix the multiple mounting pieces 31 together.

[0091] Two sets of connecting blocks 34 are spaced apart along the height direction. The position of the electrode clamping mechanism 35 corresponds one-to-one with the position of the two sets of connecting blocks 34. The electrode clamping mechanism 35 is located between two adjacent mounting pieces 31 and electrically connects the two mounting pieces 31. The remaining two adjacent mounting pieces 31 are electrically connected at corresponding positions through a connecting block 34 of the corresponding set.

[0092] Optionally, such as Figure 4 As shown, a spacer block 33 is also fitted on the connecting rod. The spacer block 33 is used to maintain the distance between two adjacent mounting pieces 31 (the connecting rod is covered by the spacer block 33 and is not shown in the figure).

[0093] As an optional embodiment of the present invention, such as Figure 1 , Figure 4 as well as Figure 5 As shown, the electrode clamping mechanism 35 includes an elastic member 330 and a pair of clamping blocks 310. The side of the clamping blocks 310 facing away from the rear electrode 40 is hinged to two corresponding mounting pieces 31. The elastic member 330 is located on the side of the clamping blocks 310 facing away from the rear electrode 40, and the height of the elastic member 330 is between the height of the hinge between the two clamping blocks 310 and the mounting pieces 31. Both clamping blocks 310 have mating notches on the side facing each other. The elastic member 330 is used to push the two clamping blocks 310 to rotate by elastic force, so that the two clamping blocks 310 open on the side facing the rear electrode 40. The electrode driving mechanism can drive the rear electrode 40 to move toward the corresponding electrode clamping mechanism 35, so that the end of the rear electrode 40 enters between the two clamping blocks 310 and pushes the sidewall of the mating notch of the clamping blocks 310, so that the side of the two clamping blocks 310 facing the rear electrode 40 closes, and the inner surface of the mating notch of the two clamping blocks 310 makes mating contact with the surface of the rear electrode 40.

[0094] In this embodiment of the invention, an elastic element 330 is provided on the side of the clamping block 310 opposite to the rear electrode 40. The elastic element 330 can push the clamping block 310 outward with elastic force, thereby allowing the electrode clamping mechanism 35 to open naturally without contacting the rear electrode 40. When the rear electrode 40 extends, the end of the rear electrode 40 pushes the sidewalls of the mating notches of the two clamping blocks 310, causing the two clamping blocks 310 to rotate and press down the elastic element 330, thereby automatically clamping the rear electrode 40. Furthermore, the inner surface of the mating notch of the clamping block 310 is in contact with the surface of the rear electrode 40, so that when the rear electrode 40 enters between the two clamping blocks 310, the mating notches of the two clamping blocks 310 can cover the part of the rear electrode 40 entering the electrode clamping mechanism 35 from the top and bottom, thereby fully protecting this part of the surface and preventing the surface of the rear electrode 40 from being coated.

[0095] As an optional embodiment of the present invention, such as Figures 4 to 6 As shown, the rear electrode 40 includes an electrode head 410, an extension rod 420, and a connecting part 430. The extension rod 420 is connected between the electrode head 410 and the connecting part 430. The electrode driving mechanism is used to drive the connecting part 430 to move the extension rod 420 and the electrode head 410 closer to or away from the corresponding electrode clamping mechanism 35.

[0096] As an optional embodiment of the present invention, the elastic element 330 is a high-temperature resistant circular arc spring.

[0097] As a preferred embodiment of the present invention, such as Figures 4 to 6 As shown, the electrode head 410 includes a cylindrical portion 413, a first rectangular portion 412, and a second rectangular portion 411. The first rectangular portion 412 is connected between the cylindrical portion 413 and the second rectangular portion 411. The side of the second rectangular portion 411 facing away from the cylindrical portion 413 is fixedly connected to the extension rod 420. The diameter of the cylindrical portion 413 is greater than the height of the first rectangular portion 412, and the top and bottom surfaces of the first rectangular portion 412 are transitionally connected to the cylindrical surface of the cylindrical portion 413. The top surface of the second rectangular portion 411 is higher than the top surface of the first rectangular portion 412, and the bottom surface of the second rectangular portion 411 is lower than the bottom surface of the first rectangular portion 412. The mating notch of the clamping block 310 corresponds to the shape of the cylindrical portion 413 and the first rectangular portion 412, and the surface of the second rectangular portion 411 facing the cylindrical portion 413 can contact the surfaces of the two clamping blocks 310 after the two clamping blocks 310 are closed on the side facing the rear electrode 40.

[0098] In this embodiment of the invention, the electrode head 410 includes a cylindrical portion 413, a first rectangular portion 412, and a second rectangular portion 411. The mating notch of the clamping block 310 corresponds to the shape of the cylindrical portion 413 and the first rectangular portion 412. Thus, when the head of the electrode head 410 enters the electrode clamping mechanism 35, it first contacts the clamping block 310 through the arc surface, which facilitates the guiding docking between the electrode head 410 and the electrode clamping mechanism 35. The rectangular surfaces of the first rectangular portion 412 and the second rectangular portion 411 can provide a larger contact area, ensuring good conductivity between the electrode head 410 and the electrode clamping mechanism 35.

[0099] As an optional embodiment of the present invention, the second rectangular portion 411 has a threaded hole on the side opposite to the cylindrical portion 413, and the end of the extension rod 420 facing the electrode head 410 has an external thread. The end of the extension rod 420 is screwed into the threaded hole to fix the second rectangular portion 411 and the extension rod 420 together.

[0100] To reduce machine maintenance costs, as a preferred embodiment of the present invention, such as Figures 5 to 6 As shown, the rear electrode 40 also includes a protective sleeve 440, which covers the surface of the electrode head 410 for contact with the electrode clamping mechanism 35.

[0101] In this embodiment of the invention, the rear electrode 40 also includes a protective sleeve 440, which is in contact with the electrode clamping mechanism 35. Therefore, after long-term use, only the worn protective sleeve 440 needs to be replaced, which reduces the maintenance cost of replacing the rear electrode 40.

[0102] Preferably, the protective cover 440 is made of a high-temperature resistant and wear-resistant conductive material.

[0103] As a preferred embodiment of the present invention, such as Figures 4 to 6 As shown, the electrode clamping mechanism 35 also includes at least one gap pad 320, which is disposed between at least one side of the clamping block 310 and the mounting piece 31 on the corresponding side.

[0104] In this embodiment of the invention, the electrode clamping mechanism 35 is essentially a replacement for a connecting block 34. To ensure a good electrical connection between the mounting pieces 31 on both sides, the electrode clamping mechanism 35 needs to contact the mounting pieces 31 on both sides. In this embodiment of the invention, the electrode clamping mechanism 35 also includes at least one gap pad 320, which can reduce the width required for the clamping block 310, the electrode head 410 and the protective sleeve 440 while satisfying the electrical connection of the mounting pieces 31 on both sides, thereby reducing the material cost of the electrode structure.

[0105] Optionally, such as Figures 5 to 6As shown, the electrode clamping mechanism 35 also includes a hinge rod 32. A plurality of first hinge holes are formed on the mounting plate 31 corresponding to the electrode clamping mechanism 35, a second hinge hole is formed on the clamping block 310, and a pair of third hinge holes are formed on the gap pad 320. The clamping block 310 is hinged to the mounting plate 31 by the hinge rod 32, which passes through the corresponding second hinge hole and the third hinge hole and is inserted into the corresponding first hinge hole at both ends.

[0106] To prevent the crystal boat from sliding due to the rotation of the support rod 20, as a preferred embodiment of the present invention, such as Figure 1 , Figure 7 As shown, the process chamber also includes at least one anti-rotation component 50, and at least one end of at least one support rod 20 is fixedly connected to the cavity of the process chamber through the anti-rotation component 50.

[0107] The anti-rotation assembly 50 includes a fixed housing 51, a pressure plate 52, and an inner sleeve 53. The fixed housing 51 has a fixing groove, and the inner sleeve 53 is disposed in the fixing groove to accommodate the end of the support rod 20. The pressure plate 52 is fixedly disposed on the fixed housing 51 and is used to press the inner sleeve 53 toward the bottom of the fixing groove so that the inner sleeve 53 clamps the support rod 20.

[0108] As an optional embodiment of the present invention, such as Figure 7 As shown, the anti-rotation assembly 50 also includes a first fixing screw 55, and the side of the pressure plate 52 is fixedly connected to the fixed housing 51 by the first fixing screw 55.

[0109] As an optional embodiment of the present invention, the inner hole of the inner bushing 53 is an elliptical hole, and the major axis of the cross-section of the elliptical hole of the inner bushing 53 extends in the horizontal direction, so that the inner bushing 53 shrinks and deforms in the vertical direction under the pressure of the pressure plate 52.

[0110] As an optional embodiment of the present invention, such as Figure 7 As shown, the anti-rotation assembly 50 also includes a second fixing screw 54. A fixing through hole is formed on the pressure plate 52, and a fixing threaded hole is formed on the inner bushing 53. The second fixing screw 54 passes through the fixing through hole and is screwed into the fixing threaded hole to fix the pressure plate 52 and the inner bushing 53.

[0111] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A front electrode assembly for a semiconductor process apparatus, said semiconductor process apparatus comprising a process chamber and two support rods fixedly arranged in said process chamber and parallel to each other, a first wafer boat carrying wafers being supported on both of said support rods, characterized in that, The front electrode assembly includes a first reset contact mechanism disposed on each of the support rods. The first reset contact mechanism has a movable boat contact surface, and the boat contact surface is capable of contacting the bottom of the first boat when the first boat rests on the support rod. Thus, when the first boat rests on the first reset contact mechanism and presses down on the boat contact surface, the boat contact surface can be tightly attached to the bottom surface of the first boat under the reset function of the first reset contact mechanism, so that the first power supply component of the semiconductor process equipment can provide radio frequency signals to the first boat through the first reset contact mechanisms on the two support rods.

2. The front electrode assembly according to claim 1, wherein The first reset contact mechanism includes a fixed structure, a first contact element, and a plurality of first elastic connectors. The fixed structure is used to fix the first contact element on the corresponding support rod. The top of the first contact element has the crystal boat contact surface. The bottom of the first contact element is connected to the fixed structure through a plurality of first elastic connectors. The first elastic connectors are used to support the first contact element with elastic force and electrically connect the first contact element to the fixed structure.

3. The front electrode assembly according to claim 2, wherein The front electrode assembly also includes multiple insulating sleeves, which are used to be sleeved on the support rod. The fixing structure is fixedly mounted on the corresponding insulating sleeve, and the insulating sleeve is used to insulate the fixing structure from the support rod.

4. The front electrode assembly according to claim 3, wherein The first contact is plate-shaped. The fixing structure includes a fixing base and a conductive cylinder. The conductive cylinder is sleeved on the insulating spacer. The top of the fixing base has a mating plane opposite to the bottom surface of the first contact. The bottom of the fixing base has a mating cylindrical surface corresponding to the shape of the outer wall of the conductive cylinder. The fixing base is fixedly connected to the conductive cylinder, and the mating cylindrical surface contacts the outer surface of the conductive cylinder. A plurality of first elastic connecting members are disposed between the bottom surface of the first contact and the mating plane. The first power supply component is used to provide radio frequency signals to the first crystal boat through the conductive cylinder, the fixing base, the first elastic connecting members, and the first contact.

5. The front electrode assembly according to claim 4, wherein The fixing structure also includes a positioning vertical plate, a positioning horizontal plate, and a positioning pin. The positioning vertical plate and the positioning horizontal plate are both fixedly mounted on the conductive cylinder. The positioning vertical plate extends in a direction perpendicular to the extension of the support rod, and the positioning horizontal plate extends in a direction parallel to the extension of the support rod. The positioning horizontal plate is used to contact the bottom of the fixing seat and support the fixing seat. A first pin hole is formed on the positioning vertical plate, extending through the support rod along its extension direction. A second pin hole is formed on the side of the fixing seat facing the positioning vertical plate, extending along the support rod's extension direction. The positioning pin passes through the first pin hole and the second pin hole in sequence to fix the fixing seat to the conductive cylinder.

6. The front electrode assembly according to claim 1, wherein The first reset contact mechanism includes an insulating cylinder and a self-resetting structure. The insulating cylinder is sleeved on the support rod and can rotate relative to the support rod about the axis of the support rod. The self-resetting structure is fixedly disposed on the insulating cylinder. The self-resetting structure has an electrical contact part and an abutment part. The electrical contact part has the crystal boat contact surface, and the abutment part has the boat foot contact surface. The mass of the electrical contact part is greater than the mass of the abutment part, so that the first reset contact mechanism can rotate in its natural state until the abutment part faces the opposite side of the support rod and the boat foot contact surface faces upward. The bottom of the first crystal boat has at least one pair of boat feet corresponding to the plurality of first reset contact mechanisms. When the first crystal boat lands on the support rod, the at least one pair of boat feet can contact the boat foot contact surfaces of the corresponding two abutment portions and press down the two abutment portions, so that the electrical contact portions of the corresponding two self-resetting structures rotate until the crystal boat contact surfaces contact the bottom surface of the first crystal boat.

7. A front electrode assembly for a semiconductor process apparatus, said semiconductor process apparatus comprising a process chamber and two support rods fixedly arranged in said process chamber and parallel to each other, a first wafer boat carrying wafers being supported on both of said support rods, characterized in that, The front electrode assembly includes a second reset contact mechanism and a contact electrode. The contact electrode is disposed on the support rod, and the second reset contact mechanism is disposed at the bottom of the first crystal boat. The second reset contact mechanism has a movable electrode contact surface. The electrode contact surface can contact the contact electrode when the first crystal boat falls onto the support rod. Under the reset action of the second reset contact mechanism, the electrode contact surface can press down onto the contact electrode on the support rod and fully fit the contact electrode on the support rod, so that the first power supply component of the semiconductor process equipment can provide radio frequency signals to the first crystal boat through the contact electrode and the second reset contact mechanism. The electrode contact surface can return to its initial position in a direction away from the first crystal boat when the first crystal boat is lifted away from the support rod.

8. The front electrode assembly of claim 7, wherein The second reset contact mechanism includes a second contact and a plurality of second elastic connectors. The bottom of the second contact has the electrode contact surface, and the top of the second contact is connected to the bottom of the first crystal boat through the second elastic connectors. The second elastic connectors are used to electrically connect the second contact to the first crystal boat and to hold the second contact at an initial position at a preset distance from the bottom of the first crystal boat by means of elasticity.

9. A semiconductor processing apparatus comprising a process chamber, a first power supply assembly, a first wafer boat, and two support rods disposed in the process chamber parallel to each other, a first wafer boat carrying wafers supported on the two support rods, characterized in that, The semiconductor process equipment further includes the front electrode assembly as described in any one of claims 1 to 6 or the front electrode assembly as described in claim 7 or 8.

10. The semiconductor process apparatus according to claim 9, wherein The support rod extends in the direction from the furnace opening side to the furnace tail side. The semiconductor process equipment also includes a rear electrode assembly, which includes an electrode driving mechanism, a second power supply assembly, and a pair of rear electrodes. The rear electrodes and the electrode driving mechanism are disposed in the process chamber and located at the furnace tail side. The second crystal boat includes a pair of electrode clamping mechanisms. The electrode driving mechanism is used to drive the two rear electrodes to be inserted into the two electrode clamping mechanisms in a one-to-one correspondence after the second crystal boat is placed on the support rod, so that the electrode clamping mechanisms clamp the rear electrodes. The second power supply component is used to provide radio frequency signals to the second crystal boat through the two rear electrodes.

11. The semiconductor process apparatus according to claim 10, wherein The second crystal boat also includes multiple connecting rods, multiple mounting pieces, and two sets of connecting blocks. The multiple mounting pieces extend in a vertical direction parallel to the support rods and are spaced apart in a horizontal direction perpendicular to the support rods. Each mounting piece has at least one slot for fixing a wafer. The mounting piece also has multiple connecting holes that correspond one-to-one with the multiple connecting rods. The connecting rods pass through the connecting holes at corresponding positions of the multiple mounting pieces in sequence to fix the multiple mounting pieces together. The two sets of connecting blocks are spaced apart along the height direction. The position of the electrode clamping mechanism corresponds one-to-one with the position of the two sets of connecting blocks. The electrode clamping mechanism is located between two adjacent mounting pieces and electrically connects the two mounting pieces. The remaining two adjacent mounting pieces are electrically connected at corresponding positions through a connecting block of the corresponding set.

12. The semiconductor process apparatus according to claim 11, wherein The electrode clamping mechanism includes an elastic element and a pair of clamping blocks. The clamping blocks are hinged to the two corresponding mounting pieces on the side opposite to the rear electrode. The elastic element is located on the side of the clamping blocks opposite to the rear electrode, and the height of the elastic element is between the height of the hinge points of the two clamping blocks and the mounting pieces. Both clamping blocks have mating notches on the side facing each other. The elastic element is used to push the two clamping blocks to rotate by elastic force, so that the two clamping blocks open towards the side facing the rear electrode. The electrode driving mechanism can drive the rear electrode to move towards the corresponding electrode clamping mechanism, so that the end of the rear electrode enters between the two clamping blocks and pushes the sidewall of the mating notch of the clamping block, so that the side of the two clamping blocks facing the rear electrode closes, and the inner surface of the mating notch of the two clamping blocks makes mating contact with the surface of the rear electrode.

13. The semiconductor process apparatus according to claim 12, wherein The rear electrode includes an electrode head, an extension rod, and a connecting part. The extension rod is connected between the electrode head and the connecting part. The electrode driving mechanism is used to drive the connecting part to move the extension rod and the electrode head closer to or away from the corresponding electrode clamping mechanism.

14. The semiconductor process apparatus according to claim 13, wherein The electrode head includes a cylindrical portion, a first rectangular portion, and a second rectangular portion. The first rectangular portion is connected between the cylindrical portion and the second rectangular portion. The side of the second rectangular portion facing away from the cylindrical portion is fixedly connected to the extension rod. The diameter of the cylindrical portion is greater than the height of the first rectangular portion, and the top and bottom surfaces of the first rectangular portion are transitionally connected to the cylindrical surface of the cylindrical portion. The top surface of the second rectangular portion is higher than the top surface of the first rectangular portion, and the bottom surface of the second rectangular portion is lower than the bottom surface of the first rectangular portion. The mating notch of the clamping block corresponds to the shape of the cylindrical portion and the first rectangular portion, and the surface of the second rectangular portion facing the cylindrical portion can contact the surfaces of the two clamping blocks after the two clamping blocks are closed on the side facing the rear electrode.

15. The semiconductor process apparatus according to claim 13, wherein The rear electrode also includes a protective sleeve that covers the surface of the electrode head for contact with the electrode clamping mechanism.

16. The semiconductor process apparatus according to claim 12, wherein The electrode clamping mechanism further includes at least one gap pad, which is disposed between at least one side of the clamping block and the mounting piece on the corresponding side.

17. The semiconductor process apparatus according to any one of claims 9 to 16, wherein The process chamber further includes at least one anti-rotation component, and at least one end of at least one of the support rods is fixedly connected to the cavity of the process chamber through the anti-rotation component; The anti-rotation assembly includes a fixed housing, a pressure plate, and an inner liner. The fixed housing has a fixing groove, and the inner liner is disposed in the fixing groove to accommodate the end of the support rod. The pressure plate is fixedly disposed on the fixed housing and is used to press the inner liner toward the bottom of the fixing groove so that the inner liner clamps the support rod.

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