Alignment bonding device for manufacturing multi-layer flexible circuit boards

Abstract

The present invention discloses an alignment and bonding device for manufacturing multi-layer flexible circuit boards, which includes a clamping and alignment module, an adaptive clamping module, a gluing and bonding module, and a device leveling module; the clamping and alignment module is used to align the two wide sides of the multi-layer flexible circuit board; the adaptive clamping module includes a driving mechanism, a connecting mechanism, and a clamping mechanism, wherein the driving mechanism is used to provide transmission power for the adaptive clamping module, and the connecting mechanism cooperates with the driving mechanism to adapt to flexible circuit boards of different sizes. While the clamping mechanism clamps the flexible circuit board, it can also realize the stacking of multi-layer flexible circuit boards. The module is used to align the two long sides of the multi-layer flexible circuit board and perform adaptive fixing and clamping; the gluing and bonding module is used to complete the gluing and hot-melt bonding operations on the flexible circuit board; the device leveling module is used to balance the skew caused by uneven force during the gluing process.

Description

Technical Field

[0001] The invention belongs to the field of manufacturing multi-layer flexible circuit boards, and in particular relates to an alignment and bonding device for manufacturing multi-layer flexible circuit boards. Background Art

[0002] Unlike traditional circuit boards, flexible printed circuits (FPCs) are made from a flexible insulating substrate. They are lightweight, thin, and flexible. Therefore, FPCs can significantly reduce the weight and size of electronic products. They can be arranged to meet spatial requirements, allowing them to move and expand during use. They can withstand millions of dynamic flexes without damaging the onboard circuits. The emergence of FPCs addresses the need for higher density, smaller size, and higher reliability in electronic products.

[0003] However, with the rapid development of the electronics industry, single-layer flexible circuit boards are obviously not suitable for practical applications, and multi-layer flexible circuit boards have emerged as the times require. While meeting the needs of use, they ensure that the product remains small and portable. In the manufacturing process of multi-layer flexible circuit boards, including the production of single-sided boards and double-sided boards, both require a series of operations such as covering film application, gluing, and curing. However, in the current preparation process of multi-layer flexible circuit boards, manual lamination and gluing are often used, and the alignment of the holes between the board and the covering film, and between the boards, cannot be guaranteed. There is also the problem of uneven glue application during the gluing process. In the existing technology, it is impossible to fix flexible circuit board substrates of different sizes, and it does not have the characteristics of double-sided gluing, bonding and stacking integration, which greatly affects the production quality of flexible circuit boards and reduces production efficiency.

[0004] Based on the above problems, the present invention proposes an alignment and bonding device for manufacturing multi-layer flexible circuit boards, which includes a clamping alignment module, an adaptive clamping module, a gluing and bonding module and a device leveling module; the clamping alignment module is used to align the two wide sides of the multi-layer flexible circuit board; the adaptive clamping module includes a driving mechanism, a connecting mechanism and a clamping mechanism, wherein the driving mechanism is used to provide transmission power for the adaptive clamping module, and the connecting mechanism cooperates with the driving mechanism to adapt to flexible circuit boards of different sizes. While the clamping mechanism clamps the flexible circuit board, it can also realize the stacking of multi-layer flexible circuit boards, and is provided with a structure for assisting the clamping mechanism to flip the flexible circuit board to complete the double-sided gluing work. The module is used to align the two long sides of the multi-layer flexible circuit board and perform adaptive fixing and clamping; the gluing and bonding module is used to complete the gluing and hot-melt bonding operations on the flexible circuit board; the device leveling module is used to balance the skew caused by uneven force during the gluing process.

[0005] The above design enables the present invention to achieve adaptive clamping and alignment stacking, double-sided gluing, and balanced and integrated operation. This solves the problems of existing flexible circuit board manufacturing equipment, such as the inability to align and stack circuit boards of different sizes, double-sided gluing, and uneven gluing. This invention has excellent application prospects in the field of multi-layer flexible circuit board manufacturing. Summary of the Invention

[0006] To solve the above problems, the purpose of the present invention is to provide a multi-layer flexible circuit board manufacturing device that can adaptively clamp and align stacking, can apply glue on both sides, maintain balance during operation, is simple to operate and has an integrated process.

[0007] To achieve the above-mentioned object, the technical solution adopted by the present invention is: an alignment and bonding device for manufacturing multi-layer flexible circuit boards, characterized in that: the device includes a clamping and alignment module, an adaptive clamping module, a gluing and bonding module, and a device leveling module;

[0008] The clamping and alignment module includes a guide rail, a platform, a slide, a cylinder, a cylinder coupling, and a positioning rod; the guide rail is mounted on the upper surface of the platform via bolts; the slide is mounted on the slider of the guide rail via bolts; the cylinder is connected to the slide via the cylinder coupling; the positioning rod is fixedly mounted on the slide; the module is used to align the two wide sides of a multi-layer flexible circuit board;

[0009] The gluing and bonding module includes a slide rail, a slide plate, a slide rod, a work frame, a push cylinder, a gluing roller, and a hot welding gun; the slide plate is mounted on the slide rail; the slide rod is mounted on the top of the slide plate; the work frame is mounted on the slide rod; the gluing roller and the hot welding gun are connected to the work frame via the output end of the push cylinder; this module is used to complete the gluing and hot-melt bonding operations on the flexible circuit board;

[0010] The leveling module of the device includes a balancing platform, a variable distance block, a supporting rod, a support shell, a motor, a screw rod, a base plate and a flexible support rod; the balancing platform is fitted with the lower surface of the platform in the clamping and alignment module; the variable distance block is installed on the lower surface of the balancing platform; one end of the supporting rod is placed on the bottom of the variable distance block, and the other end is mounted on the bracket of the support shell; the motor is connected to the supporting rod through the screw rod; the base plate is connected to the platform in the clamping and alignment module through the flexible support rod; the module adjusts the inclination of the balancing platform by changing the spacing of the variable distance blocks, thereby balancing the skew caused by uneven force during the gluing process.

[0011] Furthermore, preferably, the adaptive clamping module includes a driving mechanism, a connecting mechanism, and a clamping mechanism; the driving mechanism is transmission-connected to the connecting mechanism; the connecting mechanism is equipped with a clamping mechanism; the module is used to align the two long sides of the multi-layer flexible circuit board and perform adaptive fixing and clamping;

[0012] The drive mechanism in the adaptive clamping module includes two mounting plates, a servo motor, and a one-way screw rod; one of the mounting plates is fixedly connected to the servo motor by a bolt, and the other mounting plate is connected to the one-way screw rod; one end of the one-way screw rod is fixedly connected to the output end of the servo motor; this mechanism is used to provide transmission power for the adaptive clamping module;

[0013] The connecting mechanism in the adaptive clamping module includes two support platforms, a mounting frame, a bidirectional screw and a connecting plate; the mounting frame is welded to the top of the support platform; the inner rings of the threaded holes of the two support platforms are provided with bidirectional screws, and the inner ring movable sleeves of the support platforms are provided with a connecting plate; the threaded holes of the connecting plate are threadedly connected to the unidirectional screw in the driving mechanism; this mechanism cooperates with the driving mechanism to adjust the spacing of the mounting frames to accommodate flexible circuit boards of different sizes;

[0014] The clamping mechanism in the adaptive clamping module includes a rotating shaft, a baffle, a placement plate, a one-way screw 2, a movable plate, a pressure plate, a push plate and a spring telescopic rod; the rotating shaft is rotatably connected to the mounting frame in the connecting mechanism; the baffle and the placement plate are fixedly connected to the two ends of the rotating shaft respectively; the inner ring rotating sleeve of the threaded hole of the placement plate is provided with a one-way screw 2, and the inner ring movable sleeve of the placement plate is provided with a movable plate; one end of the one-way screw 2 is fixedly connected to a pressure plate; one side of the movable plate is fixedly connected to a push plate; one side of the push plate is fixedly connected to the mounting frame in the connecting mechanism through a spring telescopic rod; this mechanism is used to clamp the flexible circuit board, and can also realize the stacking of multiple layers of flexible circuit boards by controlling the pulling and pulling of the movable plate.

[0015] Furthermore, as a preference, the outer ring of the rotating shaft is also provided with a limit plate and a spring; the limit plate is slidably connected to the rotating shaft; the two ends of the spring are respectively fixedly connected to the baffle and the limit plate in the clamping mechanism; and are used to assist the clamping mechanism in flipping the flexible circuit board to complete the double-sided gluing work.

[0016] Beneficial effects of the present invention:

[0017] The present invention proposes an alignment and bonding device for manufacturing multi-layer flexible circuit boards, which can align the two wide sides of the multi-layer flexible circuit board through the clamping alignment module; the driving mechanism in the adaptive clamping module is used to provide transmission power for the adaptive clamping module, and the connecting mechanism cooperates with the driving mechanism to adapt to flexible circuit boards of different sizes. While the clamping mechanism clamps the flexible circuit board, it can also realize the stacking of multi-layer flexible circuit boards, and is provided with a structure for assisting the clamping mechanism to flip the flexible circuit board to complete the double-sided gluing work, so that the adaptive clamping module can align the two long sides of the multi-layer flexible circuit board and perform adaptive fixing and clamping; the gluing and hot-melt bonding operations on the flexible circuit board are completed through the gluing and bonding module; the skewness caused by uneven force during the gluing process is balanced through the leveling module of the device.

[0018] The above design enables the present invention to achieve adaptive clamping and alignment stacking, double-sided gluing, and balanced and integrated operation. This solves the problems of existing flexible circuit board manufacturing equipment, such as the inability to align and stack circuit boards of different sizes, double-sided gluing, and uneven gluing. This invention has excellent application prospects in the field of multi-layer flexible circuit board manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the clamping and alignment module and the gluing and bonding module of the present invention;

[0020] Figure 2 It is a schematic diagram of the leveling module of the present invention;

[0021] Figure 3 Schematic diagram of the adaptive clamping module of the present invention;

[0022] Among them: 1. Guide rail; 2. Platform; 3. Slide; 4. Cylinder; 5. Cylinder coupling; 6. Positioning rod; 7. Slide rail; 8. Slide plate; 9. Slide rod; 10. Work stand; 11. Push cylinder; 12. Glue roller; 13. Hot welding gun; 14. Balancing table; 15. Pitch block; 16. Support rod; 17. Support shell; 18. Motor; 19. Screw; 20. Bottom plate; 21. Flexible support rod; 22. Mounting plate; 23. Servo motor; 24. One-way screw rod 1; 25. Support platform; 26. Mounting frame; 27. Two-way screw rod; 28. Connecting plate; 29. Rotating shaft; 30. Baffle; 31. Placement plate; 32. One-way screw rod 2; 33. Moving plate; 34. Press plate; 35. Push plate; 36. Spring telescopic rod; 37. Limit plate; 38. Spring. DETAILED DESCRIPTION

[0023] The present invention will be described in detail below with reference to the accompanying drawings. However, it should be understood that the accompanying drawings are provided only to help those skilled in the art further understand the present invention, but are not intended to limit the present invention in any form.

[0024] like Figure 1 、 Figure 2 、 Figure 3 As shown, the present invention proposes an alignment and bonding device for manufacturing a multi-layer flexible circuit board, characterized in that: the device includes a clamping and alignment module, an adaptive clamping module, a gluing and bonding module and a device leveling module;

[0025] The clamping and alignment module includes a guide rail 1, a platform 2, a slide 3, a cylinder 4, a cylinder coupling 5, and a positioning rod 6. The guide rail 1 is mounted on the upper surface of the platform 2 via bolts. The slide 3 is mounted on the slider of the guide rail 1 via bolts. The cylinder 4 is connected to the slide 3 via the cylinder coupling 5. The positioning rod 6 is fixedly mounted on the slide 3. This module is used to align the two wide edges of a multi-layer flexible circuit board.

[0026] The gluing and bonding module includes a slide rail 7, a slide plate 8, a slide rod 9, a work frame 10, a push cylinder 11, a gluing roller 12, and a hot welding gun 13; the slide plate 8 is mounted on the slide rail 7; the slide rod 9 is mounted on the top of the slide plate 8; the work frame 10 is arranged on the slide rod 9; the gluing roller 12 and the hot welding gun 13 are connected to the work frame 10 via the output end of the push cylinder 11; this module is used to complete the gluing and hot-melt bonding operations on the flexible circuit board;

[0027] The leveling module of the device includes a balancing platform 14, a variable distance block 15, a support rod 16, a support shell 17, a motor 18, a screw rod 19, a base plate 20 and a flexible support rod 21; the balancing platform 14 is fitted with the lower surface of the platform 2 in the clamping and alignment module; the variable distance block 15 is installed on the lower surface of the balancing platform 14; one end of the support rod 16 is placed on the bottom of the variable distance block 15, and the other end is mounted on the bracket of the support shell 17; the motor 18 is connected to the support rod 16 through the screw rod 19; the base plate 20 is connected to the platform 2 in the clamping and alignment module through the flexible support rod 21; the module adjusts the inclination of the balancing platform 14 by changing the spacing of the variable distance block 15, thereby balancing the skew caused by uneven force during the gluing process.

[0028] like Figure 3 As shown, the adaptive clamping module of the present invention includes a driving mechanism, a connecting mechanism and a clamping mechanism; the driving mechanism is transmission-connected to the connecting mechanism; the connecting mechanism is equipped with a clamping mechanism; the module is used to align the two long sides of the multi-layer flexible circuit board and perform adaptive fixing and clamping;

[0029] The drive mechanism in the adaptive clamping module includes two mounting plates 22, a servo motor 23, and a one-way screw rod 24; one of the mounting plates 22 is fixedly connected to the servo motor 23 by bolts, and the other mounting plate 22 is connected to a one-way screw rod 24; one end of the one-way screw rod 24 is fixedly connected to the output end of the servo motor 23; this mechanism is used to provide transmission power for the adaptive clamping module;

[0030] The connection mechanism in the adaptive clamping module includes two support platforms 25, a mounting bracket 26, a bidirectional screw 27 and a connecting plate 28; the mounting bracket 26 is welded to the top of the support platform 25; the inner rings of the threaded holes of the two support platforms 25 are provided with bidirectional screws 27, and the inner rings of the support platforms 25 are movably provided with a connecting plate 28; the threaded holes of the connecting plate 28 are threadedly connected to the unidirectional screw 24 in the driving mechanism; this mechanism cooperates with the driving mechanism to adjust the spacing of the mounting brackets 26 to accommodate flexible circuit boards of different sizes;

[0031] The clamping mechanism in the adaptive clamping module includes a rotating shaft 29, a baffle 30, a placing plate 31, a one-way screw 232, a movable plate 33, a pressure plate 34, a push plate 35 and a spring telescopic rod 36; the rotating shaft 29 is rotatably connected to the mounting bracket 26 in the connecting mechanism; the baffle 30 and the placing plate 31 are fixedly connected to the two ends of the rotating shaft 29 respectively; the inner ring of the threaded hole of the placing plate 31 is rotatably sleeved with a one-way screw 232, and the inner ring of the placing plate 31 is movably sleeved with a movable plate 33; one end of the one-way screw 232 is fixedly connected to the pressure plate 34; one side of the movable plate 33 is fixedly connected to the push plate 35; one side of the push plate 35 is fixedly connected to the mounting bracket 26 in the connecting mechanism through a spring telescopic rod 36; this mechanism is used to clamp the flexible circuit board and can also achieve stacking of multiple layers of flexible circuit boards by pulling and pulling the movable plate 33;

[0032] The outer ring of the rotating shaft 29 is also provided with a limit plate 37 and a spring 38; the limit plate 37 is slidably connected to the rotating shaft 29; the two ends of the spring 38 are respectively fixedly connected to the baffle 30 and the limit plate 37 in the clamping mechanism; and are used to assist the clamping mechanism in flipping the flexible circuit board to complete the double-sided gluing work.

[0033] The above describes specific embodiments of the present invention. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art may make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. The embodiments of this application and the features in the embodiments may be combined with each other in any manner unless there is a conflict.

Claims

1. An alignment bonding device for manufacturing a multi-layer flexible circuit board, characterized in that: The device includes a clamping and alignment module, an adaptive clamping module, a gluing and bonding module, and a device leveling module; The clamping and alignment module includes a guide rail, a platform, a slide, a cylinder, a cylinder coupling, and a positioning rod; the guide rail is mounted on the upper surface of the platform via bolts; the slide is mounted on the slider of the guide rail via bolts; the cylinder is connected to the slide via the cylinder coupling; the positioning rod is fixedly mounted on the slide; the module is used to align the two wide sides of a multi-layer flexible circuit board; The gluing and bonding module includes a slide rail, a slide plate, a slide rod, a work frame, a push cylinder, a gluing roller, and a hot welding gun; the slide plate is mounted on the slide rail; the slide rod is mounted on the top of the slide plate; the work frame is mounted on the slide rod; the gluing roller and the hot welding gun are connected to the work frame via the output end of the push cylinder; this module is used to complete the gluing and hot-melt bonding operations on the flexible circuit board; The leveling module of the device includes a balancing platform, a pitch-variable block, a supporting rod, a support shell, a motor, a screw rod, a base plate and a flexible support rod; the balancing platform is in contact with the lower surface of the platform in the clamping and alignment module; the pitch-variable block is installed on the lower surface of the balancing platform; one end of the supporting rod is placed on the bottom of the pitch-variable block, and the other end is mounted on the bracket of the support shell; the motor is connected to the supporting rod through the screw rod; the base plate is connected to the platform in the clamping and alignment module through the flexible support rod; This module adjusts the inclination of the balancing platform by changing the spacing of the variable distance blocks, thereby balancing the skew caused by uneven force during the gluing process.

2. The alignment and bonding device for manufacturing a multi-layer flexible circuit board according to claim 1, characterized in that: The adaptive clamping module includes a driving mechanism, a connecting mechanism, and a clamping mechanism; the driving mechanism is in transmission connection with the connecting mechanism; the connecting mechanism is equipped with a clamping mechanism; the module is used to align the two long sides of the multi-layer flexible circuit board and perform adaptive fixing and clamping; The drive mechanism in the adaptive clamping module includes two mounting plates, a servo motor, and a one-way screw rod; one of the mounting plates is fixedly connected to the servo motor by a bolt, and the other mounting plate is connected to the one-way screw rod; one end of the one-way screw rod is fixedly connected to the output end of the servo motor; this mechanism is used to provide transmission power for the adaptive clamping module; The connecting mechanism in the adaptive clamping module includes two support platforms, a mounting frame, a bidirectional screw and a connecting plate; the mounting frame is welded to the top of the support platform; the inner rings of the threaded holes of the two support platforms are provided with bidirectional screws, and the inner ring movable sleeves of the support platforms are provided with a connecting plate; the threaded holes of the connecting plate are threadedly connected to the unidirectional screw in the driving mechanism; this mechanism cooperates with the driving mechanism to adjust the spacing of the mounting frames to accommodate flexible circuit boards of different sizes; The clamping mechanism in the adaptive clamping module includes a rotating shaft, a baffle, a placement plate, a one-way screw rod 2, a movable plate, a pressure plate, a push plate and a spring telescopic rod; the rotating shaft is rotatably connected to the mounting frame in the connecting mechanism; the baffle and the placement plate are fixedly connected to both ends of the rotating shaft respectively; the inner ring of the threaded hole of the placement plate is rotatably sleeved with a one-way screw rod 2, and the inner ring movable sleeve of the placement plate is provided with a movable plate; one end of the one-way screw rod 2 is fixedly connected to the pressure plate; one side of the movable plate is fixedly connected to the push plate; one side of the push plate is fixedly connected to the mounting frame in the connecting mechanism through a spring telescopic rod; The mechanism is used to clamp the flexible circuit board and can also realize stacking of multiple layers of flexible circuit boards by controlling the pulling and drawing of the movable plate.

3. The alignment and bonding device for manufacturing a multi-layer flexible circuit board according to claim 2, wherein: The outer ring of the rotating shaft is also provided with a limit plate and a spring; the limit plate is slidably connected to the rotating shaft; the two ends of the spring are respectively fixedly connected to the baffle and the limit plate in the clamping mechanism; and are used to assist the clamping mechanism in flipping the flexible circuit board to complete the double-sided gluing work.

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