Encapsulation material for organic electronic device and organic electronic device comprising the same

Abstract

The present invention relates to an encapsulation material for an organic electronic device and an organic electronic device including the same. More specifically, the present invention relates to an encapsulation material for an organic electronic device and an organic electronic device including the same: the encapsulation material removes and blocks substances such as moisture and impurities that may cause defects, preventing them from approaching the organic electronic device, preventing interlayer delamination that may occur when moisture is removed, and at the same time, having excellent moisture resistance and heat resistance. When a thin film encapsulation process is performed, the organic electronic device and the encapsulation material have excellent adhesion under room temperature conditions.

Description

Technical Field

[0001] The present invention relates to an encapsulating material for an organic electronic device and an organic electronic device including the same. More specifically, the present invention relates to an encapsulating material for an organic electronic device and an organic electronic device including the same. The encapsulating material removes and blocks substances such as moisture and impurities that may cause defects, preventing them from approaching the organic electronic device. The encapsulating material prevents interlayer delamination that may occur when moisture is removed. Furthermore, the encapsulating material exhibits excellent moisture and heat resistance, and when a thin film encapsulation process is performed, excellent adhesion is achieved between the organic electronic device and the encapsulating material at room temperature. Background Art

[0002] An organic light-emitting diode (OLED) is a light-emitting diode whose light-emitting layer is composed of a thin film of organic compounds. It generates light through electroluminescence by passing an electric current through an organic fluorescent compound. These OLEDs typically achieve their primary colors using methods such as the three-color (red, green, and blue) independent pixel method, the color conversion method (CCM), and color filtering. Depending on the amount of organic matter contained in the luminescent material used, they are categorized as low-molecular-weight organic light-emitting diodes (OLEDs) and high-molecular-weight organic light-emitting diodes (OLEDs). Furthermore, they can be divided into passive and active drive methods based on their driving method.

[0003] Organic light-emitting diodes (OLEDs) offer the advantages of high efficiency, low voltage operation, and simple operation due to their self-luminescence, making them suitable for high-definition video. Furthermore, their applications in flexible displays and organic electronic devices, which utilize the flexibility of organic materials, are highly anticipated.

[0004] Organic light-emitting diodes (OLEDs) are manufactured by stacking organic compounds as a light-emitting layer in thin film form on a substrate. However, the organic compounds used in OLEDs are highly sensitive to impurities, oxygen, and moisture, and their properties are easily degraded by external exposure or penetration of moisture or oxygen. This degradation of organic compounds affects the OLED's light-emitting properties and shortens its lifespan. To prevent this, a thin-film encapsulation process is required to prevent oxygen, moisture, and other substances from entering the interior of organic electronic devices.

[0005] As mentioned above, the thin film encapsulation process is used to prevent degradation of the organic compound layers of the OLED. The object to be encapsulated is the OLED display panel, and the portion of the display panel to which the encapsulation material directly adheres is the substrate.

[0006] Conventionally, metal or glass cans were processed into a can shape with grooves, and a desiccant for absorbing moisture was placed in the grooves in powder form. However, this method had the problem of not being able to simultaneously achieve the following effects: removing moisture permeability to the encapsulated organic electronic device at the desired level; blocking moisture, impurities, and other substances that could cause problems from reaching the organic electronic device; and preventing interlayer delamination that could occur when removing moisture, while also achieving excellent moisture and heat resistance.

[0007] Furthermore, the thin film encapsulation process is generally performed at a relatively high temperature of approximately 40° C. to 60° C. in order to bond the encapsulation material for encapsulating the organic light emitting diode to each other (=encapsulation).

[0008] However, this method suffers from process inefficiencies: Setting the process temperature to approximately 40°C to 60°C requires raising the temperature, and then lowering it again to proceed to the next step. Furthermore, performing the thin-film encapsulation process at approximately 40°C to 60°C can cause warping due to differences in the coefficient of thermal expansion (CTE) between the substrate to which the encapsulation material is bonded and the metal material attached to impart rigidity.

[0009] Therefore, unlike in the past, it is necessary to develop the following technology: to achieve this in a way that can bond the packaging material to the substrate (glass) under room temperature conditions, and to exhibit excellent performance as a packaging material (moisture penetration length, volume expansion evaluation, heat resistance evaluation, durability evaluation) and adhesion, so that the bonded packaging material can function as a packaging material at room temperature.

[0010] Prior art literature

[0011] Patent Literature

[0012] Patent Document 1: Korean Patent Publication No. 10-2006-0030718 (Published on April 11, 2006) Summary of the Invention

[0013] The present invention is proposed to solve the problems mentioned above. The problem to be solved by the present invention is to provide the following packaging material for organic electronic devices and organic electronic devices including the same: remove and block substances such as moisture and impurities that cause defects so that they cannot approach the organic electronic devices, and do not cause interlayer delamination that may occur when moisture is removed. At the same time, it has excellent moisture resistance and heat resistance. When a thin film packaging process is performed, the organic electronic device and the packaging material have excellent adhesion under room temperature conditions.

[0014] In order to solve the above-mentioned problems, the encapsulating material for an organic electronic device of the present invention may include an encapsulating resin layer. The encapsulating resin layer includes an encapsulating resin, a tackifier, and a moisture absorbent.

[0015] As a preferred embodiment of the present invention, the encapsulation resin layer of the present invention can satisfy the following equations 1 and 2.

[0016] Relationship 1: 0.3μm≤BA≤2.0μm

[0017] Relationship 2: 5% ≤ C ≤ 45%

[0018] In the above-mentioned relationship 1, A is the initial indentation penetration length (μm) of the cured encapsulation resin layer measured at a pressure of 30 mN at a pressure increasing rate of 3 mN / sec at a temperature of 25°C using a nanoindenter; B is the indentation penetration length (μm) measured after the cured encapsulation resin layer is creep-treated at 25°C for 5 seconds after reaching a pressure of 30 mN; and in the above-mentioned relationship 2, C is the CIT measured by the following mathematical formula 1.

[0019] Mathematical formula 1:

[0020] In the above mathematical formula 1, A and B are defined as in the above relational formula 1.

[0021] Specifically, in the above relational expression 1, A and B are measured as follows.

[0022] At 25°C, the encapsulating resin layer formed by curing the encapsulating resin was pressed using a nanoindenter. The pressure was increased at a rate of 3 mN / sec to a maximum of 30 mN. A represents the indentation penetration length (μm) measured immediately after the nanoindenter pressure reached 30 mN. This is referred to as the initial indentation penetration length.

[0023] When the pressure reaches 30 mN and is maintained at 25°C, creep occurs in the encapsulating resin layer, increasing the penetration length. The penetration length measured 5 seconds after the creep occurs is called B.

[0024] As a preferred embodiment of the present invention, A in the above equations 1 and 2 may be 4.1 μm to 12.1 μm, and B may be 4.6 μm to 12.6 μm.

[0025] As another embodiment for solving the above-mentioned problem, the present invention provides a packaging material for an organic electronic device, which includes a packaging resin layer. The packaging resin layer is formed by including a packaging resin, a tackifier and a desiccant, and the packaging resin layer satisfies the following equations 3 and 4.

[0026] Relationship 3: 0.6μm≤ED≤3.0μm

[0027] Relationship 4: 3% ≤ F ≤ 40%

[0028] In the above-mentioned relationship 3, D is the initial indentation penetration length (μm) of the cured encapsulation resin layer measured at a pressure of 30 mN at a pressure increasing rate of 3 mN / sec at a temperature of 50°C using a nanoindenter, E is the indentation penetration length (μm) measured after the cured encapsulation resin layer is creep-treated at 50°C for 5 seconds after reaching a pressure of 30 mN, and in the above-mentioned relationship 4, F is the CIT measured by the following mathematical formula 2.

[0029] Mathematical formula 2:

[0030] In the above mathematical formula 2, D and E are defined as in the above relational formula 3.

[0031] Specifically, in the above relational expression 3, D and E are measured as follows.

[0032] The encapsulating resin layer formed by curing the encapsulating resin was pressed using a nanoindenter at 50°C, with the pressure increasing at a rate of 3 mN / sec to a maximum of 30 mN. D represents the indentation penetration length (μm) measured immediately after the nanoindenter pressure reaches 30 mN. This is referred to as the initial indentation penetration length.

[0033] When the pressure reaches 30 mN and is maintained at 50°C, creep occurs in the encapsulating resin layer, increasing the penetration length. The penetration length measured 5 seconds after the creep occurs is called E.

[0034] As a preferred embodiment of the present invention, D in the above equations 3 and 4 can be 4.6 μm to 12.6 μm, and E can be 5.1 μm to 13.1 μm.

[0035] As a preferred embodiment of the present invention, the encapsulation resin layer may further satisfy the following relational expression 5.

[0036] Equation 5:

[0037] In the above relational expression 5, A and B are as defined in the above relational expression 1, and D and E are as defined in the above relational expression 3.

[0038] As a preferred embodiment of the present invention, the encapsulation resin layer of the present invention may also satisfy the following relational expression 6.

[0039] Relationship 6: 0.5≤C / F≤2.0

[0040] In the above relational expression 6, C is defined as in the above relational expression 2, and F is defined as in the above relational expression 4.

[0041] As a preferred embodiment of the present invention, the encapsulation resin layer of the present invention may also satisfy the following relational expression 7.

[0042] Relationship 7: 1.1≤G / H≤4.0

[0043] In the above equation 7, G is the composite hardness (N / mm) of the cured encapsulating resin layer measured by a nanoindenter at a temperature of 25°C and a pressure increase rate of 3mN / sec to reach a pressure of 30mN. 2 ), H is the composite hardness (N / mm) measured by the same method at a temperature of 50°C 2 ).

[0044] As a preferred embodiment of the present invention, the above G can be 2.0N / mm 2 ~6.0N / mm 2 , the above H can be 0.5N / mm 2 ~3.5N / mm 2 .

[0045] As a preferred embodiment of the present invention, the encapsulating resin layer of the present invention may also satisfy the following conditions (1) and (2).

[0046] (1)100≤I≤300

[0047] (2)500≤J

[0048] In the above condition (1), I is the tack force (gf) of the cured encapsulating resin layer measured according to ASTM D2979 (Probe Tack Test).

[0049] In the above condition (2), J is the shear strength (gf / 6mm) of the cured encapsulating resin layer measured using a universal testing machine.

[0050] As a preferred embodiment of the present invention, the encapsulation resin layer of the present invention may include: a first encapsulation resin layer; and a second encapsulation resin layer formed on a side surface of the first encapsulation resin layer.

[0051] As a preferred embodiment of the present invention, the first encapsulating resin layer of the present invention may include 70 to 176 parts by weight of a tackifier and 6.0 to 11.2 parts by weight of a moisture absorbent relative to 100 parts by weight of the encapsulating resin.

[0052] As a preferred embodiment of the present invention, the second encapsulating resin layer of the present invention may include 57 to 107 parts by weight of a tackifier and 110 to 205 parts by weight of a moisture absorbent relative to 100 parts by weight of the encapsulating resin.

[0053] As a preferred embodiment of the present invention, the encapsulating resin of the present invention may include a compound represented by the following Chemical Formula 1.

[0054] Chemical formula 1:

[0055] In the above chemical formula 1, R 1 For hydrogen atoms, C3~C 10 Straight chain alkenyl or C4~C 10 wherein n is a rational number satisfying a weight average molecular weight of 30,000 to 1,550,000.

[0056] As a preferred embodiment of the present invention, the first encapsulation resin layer and the second encapsulation resin layer of the present invention may each independently further comprise at least one selected from a curing agent and an ultraviolet initiator.

[0057] As a preferred embodiment of the present invention, the first encapsulation resin layer of the present invention may include 28 to 52 parts by weight of a curing agent and 1.64 to 3.06 parts by weight of an ultraviolet initiator relative to 100 parts by weight of the encapsulation resin.

[0058] As a preferred embodiment of the present invention, the second encapsulating resin layer of the present invention may include 6.36 to 11.82 parts by weight of a curing agent and 1.27 to 2.37 parts by weight of an ultraviolet initiator relative to 100 parts by weight of the encapsulating resin.

[0059] As a preferred embodiment of the present invention, the curing agent of the first encapsulation resin layer of the present invention may include a bifunctional acrylate curing agent and a monofunctional acrylate curing agent.

[0060] As a preferred embodiment of the present invention, the curing agent of the second encapsulation resin layer of the present invention may include a bifunctional acrylate curing agent.

[0061] As a preferred embodiment of the present invention, the bifunctional acrylate curing agent may be a compound represented by the following Chemical Formula 2, and the monofunctional acrylate curing agent may be a compound represented by the following Chemical Formula 3.

[0062] Chemical formula 2:

[0063]

[0064] In the above Chemical Formula 2, A1 and A2 are each independently -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2-, or -CH2CH2CH2CH2CH2CH2CH2-.

[0065] Chemical formula 3:

[0066]

[0067] In the above Chemical Formula 3, A3 is -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2-, or -CH2CH2CH2CH2CH2CH2CH2-.

[0068] As a preferred embodiment of the present invention, the curing agent of the second encapsulation resin layer of the present invention may include the compound represented by the above Chemical Formula 2.

[0069] As a preferred embodiment of the present invention, the curing agent of the first encapsulation resin layer of the present invention may include the compound represented by Chemical Formula 2 and the compound represented by Chemical Formula 3 at a weight ratio of 1:5.25 to 1:9.75.

[0070] As a preferred embodiment of the present invention, the ratio of the thickness of the first encapsulation resin layer to the thickness of the second encapsulation resin layer can be 1:2.8 to 1:5.2.

[0071] As a preferred embodiment of the present invention, the thickness of the first encapsulation resin layer of the present invention may be 1 μm to 20 μm.

[0072] As a preferred embodiment of the present invention, the thickness of the second encapsulation resin layer of the present invention can be 30 μm to 60 μm.

[0073] In addition, the organic electronic device of the present invention may include: a substrate; an organic electronic device formed on at least one side of the substrate; and the encapsulation material for an organic electronic device of the present invention, used to encapsulate the organic electronic device.

[0074] Hereinafter, the terms used in the present invention will be described.

[0075] The term "dehumidifier" used in the present invention includes moisture-absorbing substances that can absorb moisture through physical or chemical bonding such as the interface and van der Waals force of the desiccant and whose composition does not change due to the adsorption of moisture, as well as moisture-absorbing substances that absorb moisture through chemical reactions and are converted into new substances.

[0076] Furthermore, the term "normal temperature" used in the present invention is 10°C to 40°C, preferably 15°C to 35°C, and more preferably 18°C ​​to 30°C.

[0077] The encapsulating material for organic electronic devices of the present invention effectively removes moisture that permeates while blocking oxygen, impurities, and moisture. This significantly prevents moisture from reaching the organic electronic device and significantly improves the lifespan and durability of the device. Furthermore, it prevents interlayer delamination, which can occur during moisture removal, and exhibits excellent moisture and heat resistance. Furthermore, during the thin-film encapsulation process of encapsulating the encapsulating material within the organic electronic device, excellent adhesion is achieved between the organic electronic device and the encapsulating material at room temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] Figure 1 FIG. 1 is a cross-sectional view of a packaging material for an organic electronic device according to a preferred embodiment of the present invention.

[0079] Figure 2 FIG. 1 is a cross-sectional view of an organic electronic device according to a preferred embodiment of the present invention.

[0080] Description of Reference Signs

[0081] 1: Substrate;

[0082] 2: Organic electronic devices;

[0083] 10: Packaging materials;

[0084] 11: first encapsulation resin layer;

[0085] 12: second encapsulation resin layer;

[0086] 20: metal layer;

[0087] 30: release layer;

[0088] 40': moisture absorbent;

[0089] 40": Desiccant. DETAILED DESCRIPTION

[0090] The following describes embodiments of the present invention in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be implemented in a variety of different embodiments and is not limited to the embodiments described herein. To clearly illustrate the present invention, portions not relevant to the description are omitted from the accompanying drawings. Throughout the specification, identical or similar structural elements are denoted by the same reference numerals.

[0091] Reference Figure 1 For illustration, the encapsulation material for an organic electronic device of the present invention may include an encapsulation resin layer 10 .

[0092] The encapsulating resin layer 10 of the present invention may include an encapsulating resin, a tackifier, and moisture absorbents 40 ′, 40 ″.

[0093] First, the encapsulation resin may include a pressure-sensitive adhesive composition, preferably, a polyolefin resin, and the polyolefin resin may include one or more of a poly (C2-C6) alkylene resin selected from polyethylene, polypropylene, polyisobutylene, etc., and a random copolymer resin formed by copolymerizing ethylene, propylene and / or diene compounds.

[0094] As a preferred example, the encapsulating resin may include a compound represented by the following Chemical Formula 1.

[0095] The encapsulating resin may include a compound represented by Chemical Formula 1 below.

[0096] Chemical formula 1:

[0097]

[0098] In the above chemical formula 1, R 1 For hydrogen atoms, C3~C 10 Straight chain alkenyl or C4~C 10 branched alkenyl, preferably, R 1 It is a hydrogen atom, a C4-C8 straight-chain alkenyl group, or a C4-C8 branched-chain alkenyl group.

[0099] And, since R in Chemical Formula 1 1 For hydrogen atoms, C3~C 10 Straight chain alkenyl or C4~C 10 The reliability can be better with the branched alkenyl group.

[0100] Furthermore, in Chemical Formula 1, n is a rational number that satisfies a weight average molecular weight of 30,000 g / mol to 1,550,000 g / mol. Preferably, n can be a rational number that satisfies a weight average molecular weight of 40,000 g / mol to 1,500,000 g / mol. If the weight average molecular weight is less than 30,000 g / mol, there is a problem of panel sagging caused by a decrease in modulus, there may be a problem of reduced heat resistance, there is a problem of reduced reliability due to reduced filling capacity of the hygroscopic agent, there is a problem of reduced mechanical properties, and there may be a problem of warping with the substrate due to volume expansion of the hygroscopic agent due to reduced elasticity. Furthermore, if the weight average molecular weight is greater than 1,550,000 g / mol, the adhesion is reduced, thereby having a problem of reduced adhesion to the substrate, and as the modulus increases, there is a problem of reduced adhesion to the panel.

[0101] The compound represented by Chemical Formula 1 may have a crystallization temperature of 100 to 140° C., preferably 110 to 130° C., and more preferably 115 to 125° C., when measured by the following measurement method.

[0102] Measurement method

[0103] The crystallization temperature (Tc) was measured by cooling from 200°C to -150°C at a rate of 10°C / min and analyzing the peak of the cooling curve of the heat flow measured by differential scanning calorimetry (DSC).

[0104] The tackifier may include, without limitation, adhesive resins commonly used in packaging materials for organic electronic devices, and preferably, may include one or more selected from hydrogenated petroleum resins, hydrogenated rosin resins, hydrogenated rosin ester resins, hydrogenated terpene resins, hydrogenated terpene-phenol resins, polymerized rosin resins, and polymerized rosin ester resins.

[0105] Next, the moisture absorbents 40 ′, 40 ″ may include, without limitation, moisture absorbents commonly used in the packaging of organic electronic devices. Preferably, they may include one or more of a moisture absorbent containing zeolite, titanium dioxide, zirconium dioxide, or montmorillonite as components, a metal salt, and a metal oxide. More preferably, they may include a metal oxide.

[0106] The metal oxide may include one or more metal oxides such as silicon dioxide (SiO2), aluminum oxide (Al2O3), lithium oxide (Li2O), sodium oxide (Na2O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO), organic metal oxides and phosphorus pentoxide (P2O5).

[0107] The metal salt may include sulfates such as lithium sulfate (Li2SO4), sodium sulfate (Na2SO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), cobalt sulfate (CoSO4), gallium sulfate (Ga2(SO4)3), titanium sulfate (Ti(SO4)2), or nickel sulfate (NiSO4), calcium chloride (CaCl2), magnesium chloride (MgCl2), strontium chloride (SrCl2), yttrium chloride (YCl3), copper chloride (CuCl2), fluorine One or more of metal halides such as cesium fluoride (CsF), tantalum fluoride (TaF5), niobium fluoride (NbF5), lithium bromide (LiBr), calcium bromide (CaBr2), cesium bromide (CeBr3), selenium bromide (SeBr4), vanadium bromide (VBr3), magnesium bromide (MgBr2), barium iodide (BaI2) or magnesium iodide (MgI2) and metal chlorates such as barium perchlorate (Ba(ClO4)2) or magnesium perchlorate (Mg(ClO4)2).

[0108] It is recommended to use a desiccant with a purity of 95% or more. If the purity is less than 95%, not only will the desiccant function be reduced, but the substances contained in the desiccant will act as impurities and cause defects in the packaging film. It may also affect organic electronic devices, but is not limited to this.

[0109] In addition, the encapsulating resin layer 10 of the present invention may further include one or more selected from a curing agent and an ultraviolet initiator.

[0110] The curing agent may include, without limitation, substances commonly used as curing agents. Preferably, it may include substances that can ensure sufficient crosslinking density of the encapsulation resin layer while acting as a crosslinking agent. More preferably, it may include one or more selected from a urethane acrylate curing agent with a weight average molecular weight of 100 g / mol to 1500 g / mol and an acrylate curing agent with a weight average molecular weight of 100 g / mol to 1500 g / mol. If the weight average molecular weight of the curing agent is less than 100 g / mol, the hardness increases, thereby reducing the panel adhesion and the adhesion to the substrate, and outgassing of the unreacted curing agent may occur. If the weight average molecular weight is greater than 1500 g / mol, the softness increases, thereby reducing the mechanical properties.

[0111] The UV initiator may include, without limitation, commonly used UV initiators. As a preferred example, the UV initiator may include one or more selected from the group consisting of monoacylphosphine, bisacylphosphine, α-hydroxyketone, α-aminoketone, phenylglyoxylate, and benzyldimethylketal.

[0112] Furthermore, the encapsulating resin layer 10 of the present invention satisfies the following Relational Expressions 1 and 2.

[0113] Relationship 1: 0.3μm≤BA≤2.0μm

[0114] In the above relationship 1, BA is preferably 0.58 μm ≤ BA ≤ 1.51 μm, more preferably 0.66 μm ≤ BA ≤ 1.34 μm, even more preferably 0.78 μm ≤ BA ≤ 1.28 μm, and most preferably 0.92 μm ≤ BA ≤ 1.10 μm.

[0115] In the above equation 1, A is the initial indentation penetration length (μm) of the cured encapsulating resin layer measured by a nanoindenter at a pressure increasing rate of 3 mN / sec to reach a pressure of 30 mN under temperature conditions.

[0116] In addition, in the above-mentioned relationship 1, B is the indentation penetration length (μm) measured after the cured encapsulation resin layer is kept creeping for 5 seconds at a temperature of 25°C after increasing the pressure at a pressure increase rate of 3 mN / sec to reach a pressure of 30 mN using a nanoindenter at a temperature of 25°C and an initial pressure of 0 mN.

[0117] BA shows the degree of deformation of the encapsulation resin layer due to pressure. If BA is less than 0.3μm, the degree of deformation is too small and the layer is strong. Then, when bonding is performed, there will be a problem of poor bonding quality due to insufficient filling of the height difference. If BA is greater than 2.0μm, the degree of deformation is too large, and there will be a problem of adhesive deformation due to insufficient resistance to the applied pressure.

[0118] Relationship 2: 5% ≤ C ≤ 45%

[0119] In the above relationship 2, preferably, C may satisfy 7%≤C≤40%, more preferably, C may satisfy 10%≤C≤35%, even more preferably, C may satisfy 12%≤C≤30%, and most preferably, C may satisfy 15%≤C≤25%.

[0120] In the above-mentioned relational expression 2, C is the CIT measured by the following mathematical expression 1.

[0121] Mathematical formula 1:

[0122] In the above mathematical formula 1, A and B are defined as in the above relational formula 1.

[0123] CIT is a creep property, which refers to the rate of change of penetration length over time when a specified load is applied.

[0124] If C is less than 5%, the low deformation rate against pressure may cause poor lamination quality. If C is greater than 45%, the high deformation rate against pressure may cause degradation during lamination.

[0125] In addition, in the above-mentioned equations 1 and 2, A can be 4.1μm to 12.1μm, preferably 4.5μm to 10.5μm, more preferably 5.5μm to 8.0μm, and even more preferably 5.7μm to 7.5μm. If A is less than 4.1μm, the peel strength will be reduced due to insufficient adhesion to the panel during bonding. If A is greater than 12.1μm, there will be problems such as adhesive aging due to product loading during storage and transportation.

[0126] Moreover, in the above-mentioned equations 1 and 2, B can be 4.6μm to 12.6μm, preferably 5.1μm to 10.7μm, more preferably 5.8μm to 8.5μm, and even more preferably 6.1μm to 8.0μm. If B is less than 4.6μm, there will be a problem of poor bonding quality due to insufficient filling of the height difference during bonding. If B is greater than 12.6μm, there will be a problem of deformation of the adhesive due to insufficient resistance to pressure.

[0127] As another embodiment of the present invention, the present invention provides an encapsulation material for an organic electronic device, which includes an encapsulation resin layer. The encapsulation resin layer is formed by including an encapsulation resin, a tackifier and a moisture absorbent. The encapsulation resin layer 10 satisfies the following equations 3 and 4.

[0128] Relationship 3: 0.6μm≤ED≤3.0μm

[0129] In the above relationship 3, preferably, ED may satisfy 0.67 μm≤ED≤1.9 μm, more preferably, ED may satisfy 0.75 μm≤ED≤1.6 μm, even more preferably, ED may satisfy 0.8 μm≤ED≤1.2 μm, and most preferably, ED may satisfy 0.83 μm≤ED≤0.9 μm.

[0130] In the above equation 3, D is the initial indentation penetration length (μm) of the cured encapsulating resin layer measured by a nanoindenter at a temperature of 50° C. and a pressure increase rate of 3 mN / sec to reach a pressure of 30 mN.

[0131] In the above-mentioned relationship 3, E is the indentation penetration length (μm) measured after the pressure is increased at a rate of 3 mN / sec to reach a pressure of 30 mN under the conditions of a temperature of 50°C and an initial pressure of 0 mN using a nanoindenter, and the cured encapsulation resin layer is kept creeping at a temperature of 50°C for 5 seconds.

[0132] If ED is less than 0.6 μm, the buffering effect against external forces is insufficient, resulting in panel pixel defects. If ED is greater than 3.0 μm, the heat resistance of the adhesive is insufficient, resulting in reduced reliability.

[0133] Relationship 4: 3% ≤ F ≤ 40%

[0134] In the above-mentioned relational expression 4, F is the CIT measured by the following mathematical expression 2.

[0135] Mathematical formula 2:

[0136] In the above mathematical formula 2, D and E are defined as in the above relational formula 3.

[0137] If F is less than 3%, the buffering effect against external forces is insufficient, causing the panel to crack. If F is greater than 40%, the resistance to temperature and pressure is insufficient, causing the panel to deform.

[0138] In the above relationship 4, preferably, F may satisfy 5%≤F≤35%, more preferably, F may satisfy 5%≤F≤30%, even more preferably, F may satisfy 7%≤F≤20%, and most preferably, F may satisfy 9%≤F≤14%.

[0139] In addition, in the above-mentioned equations 3 and 4, D can be 4.6μm to 12.6μm, preferably 5.3μm to 10.2μm, more preferably 6.0μm to 9.4μm, and even more preferably 6.9μm to 8.9μm. If D is less than 4.6μm, there is a problem of panel cracking due to high hardness. If D is greater than 12.6μm, there are problems such as adhesive aging due to product loading during storage and transportation.

[0140] Moreover, in the above-mentioned equations 3 and 4, E can be 5.1μm to 13.1μm, preferably 5.8μm to 11.2μm, more preferably 6.5μm to 9.7μm, and even more preferably 7.4μm to 8.8μm. If E is less than 5.1μm, there will be a problem of poor bonding quality due to insufficient filling of the height difference during bonding. If E is greater than 13.1μm, there will be a problem of adhesive deformation due to insufficient resistance to pressure.

[0141] Furthermore, the encapsulating resin layer 10 of the present invention may also satisfy the following Relational Expression 5.

[0142] Equation 5:

[0143] In the above relational expression 5, preferably, (ED) / (BA) can satisfy More preferably, (ED) / (BA) may satisfy More preferably, (ED) / (BA) may satisfy Most preferably, (ED) / (BA) satisfies

[0144] In the above relational expression 5, A and B are as defined in the above relational expression 1, and D and E are as defined in the above relational expression 3.

[0145] like Less than 0.7 may cause problems such as adhesive aging. When the ratio is greater than 2.0, there may be a problem of reduced high-temperature heat resistance.

[0146] Furthermore, the encapsulating resin layer 10 of the present invention may also satisfy the following Relationship 6.

[0147] Relationship 6: 0.5≤C / F≤2.0

[0148] In the above-mentioned relational expression 6, preferably, C / F may satisfy 0.8≤C / F≤1.9, more preferably, C / F may satisfy 1.0≤C / F≤1.8, even more preferably, C / F may satisfy 1.1≤C / F≤1.7, and most preferably, C / F may satisfy 1.2≤C / F≤1.6.

[0149] In the above relational expression 6, C is defined as in the above relational expression 2, and F is defined as in the above relational expression 4.

[0150] If C / F is less than 0.5, the panel may be deformed due to a decrease in high-temperature heat resistance. If C / F is greater than 2.0, the adhesive may be deformed and may cause aging problems due to insufficient resistance to pressure.

[0151] Furthermore, the encapsulating resin layer 10 of the present invention may also satisfy the following relational expression 7.

[0152] Relationship 7: 1.1≤G / H≤4.0

[0153] In the above relationship 7, preferably, G / H may satisfy 1.14≤G / H≤3.15, more preferably, G / H may satisfy 1.17≤G / H≤2.40, even more preferably, G / H may satisfy 1.19≤G / H≤1.88, and most preferably, G / H may satisfy 1.21≤G / H≤1.54.

[0154] In the above equation 5, G is the composite hardness (N / mm) of the cured encapsulating resin layer measured by a nanoindenter at a temperature of 25°C and a pressure increase rate of 3mN / sec to reach a pressure of 30mN. 2 ).

[0155] In the above equation 5, H is the composite hardness (N / mm) measured by the same method at a temperature of 50°C. 2 ).

[0156] If G / H is less than 1.1, insufficient filling of step differences during lamination may lead to poor lamination quality. If G / H is greater than 4.0, insufficient resistance to temperature may lead to adhesive deformation and aging problems.

[0157] In addition, in the above relational expression 5, G can be 1.0 N / mm 2 ~6.0N / mm 2 , preferably 1.12N / mm 2 ~4.5N / mm 2 , more preferably 1.22N / mm 2 ~2.1N / mm 2 , more preferably 1.30N / mm 2 ~1.8N / mm 2 , most preferably 1.38N / mm 2 ~1.6N / mm 2 , if G is less than 1.0N / mm 2 , there is a problem of adhesive deformation due to insufficient resistance to pressure. If G is greater than 6.0N / mm 2 , there is a problem of poor lamination quality due to panel damage and insufficient filling of height differences.

[0158] Furthermore, in the above relational expression 5, H can be 0.5 N / mm 2 ~3.5N / mm 2 , preferably 0.9N / mm 2 ~2.5N / mm 2 , more preferably 1.1 N / mm 2~2.0N / mm 2 , more preferably 1.2N / mm 2 ~1.7N / mm 2 , most preferably 1.22N / mm 2 ~1.55N / mm 2 , if H is less than 0.5N / mm 2 , the adhesive may deform and age poorly due to insufficient resistance to temperature. If H is greater than 3.5N / mm 2 , there may be a problem of reduced high temperature peel strength.

[0159] Furthermore, the encapsulating resin layer 10 of the present invention may also satisfy the following conditions (1) and (2).

[0160] (1)100≤I≤300

[0161] Preferably, the above-mentioned I may satisfy 150≤I≤250, and more preferably, the above-mentioned I may satisfy 180≤I≤230.

[0162] In the above condition (1), I is the adhesion (gf) of the cured encapsulation resin layer measured according to the ASTM D2979 standard (probe tack test). If I is less than 100, there is a problem of poor alignment due to slippage during the bonding process. If I is greater than 300, there is a problem of poor bonding during the bonding process due to the high tackiness of the encapsulation resin layer.

[0163] (2)500≤J

[0164] Preferably, the above-mentioned J may satisfy 1000≤J≤9000, and more preferably, the above-mentioned J may satisfy 4000≤J≤7000.

[0165] In the above condition (2), J is the shear strength of the cured encapsulating resin layer measured using a universal testing machine. If J is less than 500, the adhesive strength is reduced, resulting in problems such as poor alignment and surface peeling.

[0166] In addition, the encapsulation resin layer 10 of the present invention may include: a first encapsulation resin layer 11 ; and a second encapsulation resin layer 12 formed on one side of the first encapsulation resin layer 11 .

[0167] Furthermore, the room temperature laminating encapsulation material for organic electronic devices of the present invention may further include: a release layer 30 formed on the other side of the first encapsulation resin layer 11 ; and a metal layer 20 formed on one side of the second encapsulation resin layer 12 .

[0168] First, the first encapsulation resin layer 11 is a layer that is in direct contact with the organic electronic device (not shown), and may be formed by including an encapsulation resin, a tackifier, and a moisture absorbent 40 ″.

[0169] The encapsulation resin contained in the first encapsulation resin layer 11 may contain the same substance as the encapsulation resin mentioned above, the tackifier contained in the first encapsulation resin layer 11 may contain the same substance as the tackifier mentioned above, and the desiccant 40" contained in the first encapsulation resin layer 11 may contain the same substance as the desiccant mentioned above, preferably, may contain silicon dioxide (SiO2), thereby having excellent dehumidification performance, preventing the separation of the organic electronic device and the encapsulation material, and significantly increasing the durability of the organic electronic device. In addition, the shape or particle size of the desiccant 40" contained in the first encapsulation resin layer 11 is not limited. Preferably, the shape may be amorphous or spherical, and the average particle size may be 0.01μm to 10μm, preferably 0.1μm to 5μm, and more preferably 0.2μm to 1μm. If the average particle size is less than 0.01μm, there are problems with reliability and reduced adhesion due to reduced dispersion force. If the average particle size is greater than 10μm, there is a problem of black spots due to damage caused by protruding particles during the bonding process.

[0170] In addition, relative to 100 parts by weight of the encapsulation resin, the first encapsulation resin layer 11 of the present invention contains 70 parts by weight to 176 parts by weight of a tackifier, preferably, it can contain 72 parts by weight to 163 parts by weight of a tackifier, more preferably, it can contain 75 parts by weight to 149 parts by weight of a tackifier, and even more preferably, it can contain 80 parts by weight to 143 parts by weight of a tackifier. If less than 70 parts by weight of the tackifier is contained, there may be a problem of poor moisture resistance. If more than 176 parts by weight of the tackifier is contained, there may be problems of reduced durability and moisture resistance due to reduced elasticity (Brittle).

[0171] Furthermore, relative to 100 parts by weight of the encapsulation resin, the first encapsulation resin layer 11 of the present invention may contain 6.0 to 11.2 parts by weight of the desiccant 40", preferably, it may contain 6.5 to 9.8 parts by weight of the desiccant 40", more preferably, it may contain 6.7 to 8.3 parts by weight of the desiccant 40", and even more preferably, it may contain 6.8 to 7.5 parts by weight of the desiccant 40". If less than 6.0 parts by weight of the desiccant 40" is included, the durability of the organic electronic device may be reduced because the desired dehumidification effect in the first encapsulation resin layer 11 cannot be achieved. If more than 11.2 parts by weight of the desiccant 40" is included, the reliability of the organic electronic device may be reduced due to poor adhesion to the organic electronic device, such as adhesion and peel strength.

[0172] Furthermore, in addition to the encapsulating resin, the tackifier, and the moisture absorbent 40", the first encapsulating resin layer 11 of the present invention may further include at least one selected from a curing agent and an ultraviolet initiator. Preferably, the first encapsulating resin layer 11 may include a curing agent and an ultraviolet initiator.

[0173] The curing agent included in the first encapsulation resin layer 11 may include the same substances as the curing agents mentioned above. Preferably, it may include one or more selected from a bifunctional acrylate curing agent and a monofunctional acrylate curing agent. More preferably, it may include a bifunctional acrylate curing agent and a monofunctional acrylate curing agent. For example, preferably, it may include one or more selected from the compound represented by the following Chemical Formula 2 and the compound represented by the following Chemical Formula 3. More preferably, it may include the compound represented by the following Chemical Formula 2 and the compound represented by the following Chemical Formula 3.

[0174] Chemical formula 2:

[0175] In the above Chemical Formula 2, A1 and A2 are each independently -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2-, or -CH2CH2CH2CH2CH2CH2-, preferably -CH2-, -CH2CH2-, or -CH2CH2CH2CH2CH2-.

[0176] Chemical formula 3:

[0177] In the above Chemical Formula 3, A3 is -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2-, or -CH2CH2CH2CH2CH2CH2-, preferably -CH2-, -CH2CH2-, or -CH2CH2CH2CH2CH2-.

[0178] Furthermore, the curing agent included in the first encapsulation resin layer 11 may include the compound represented by Chemical Formula 2 and the compound represented by Chemical Formula 3 at a weight ratio of 1:5.25 to 1:9.75. Preferably, the curing agent may include the compound represented by Chemical Formula 2 and the compound represented by Chemical Formula 3 at a weight ratio of 1:6 to 1:9. More preferably, the curing agent may include the compound represented by Chemical Formula 2 and the compound represented by Chemical Formula 3 at a weight ratio of 1:6.75 to 1:8.25. Even more preferably, the curing agent may include the compound represented by Chemical Formula 2 and the compound represented by Chemical Formula 3 at a weight ratio of 1:7.12 to 1:7.88. If the weight ratio is less than 5.25, the reliability may be reduced due to the reduced adhesion under normal temperature conditions. If the weight ratio is greater than 9.75, the encapsulation material may have problems with aging and poor heat resistance.

[0179] Furthermore, relative to 100 parts by weight of the encapsulation resin, the first encapsulation resin layer 11 of the present invention may contain 28 to 52 parts by weight of a curing agent, preferably, 29 to 46 parts by weight of a curing agent, more preferably, 30 to 38 parts by weight of a curing agent, and even more preferably, 30 to 32 parts by weight of a curing agent. If less than 28 parts by weight of the curing agent is contained, the target gel fraction and modulus cannot be achieved, and there may be a problem of reduced elasticity. If more than 52 parts by weight of the curing agent is contained, there may be problems of poor panel bonding and reduced adhesion to the panel due to high modulus and hardness.

[0180] The ultraviolet initiator included in the first encapsulation resin layer 11 may include the same substance as the aforementioned ultraviolet initiator.

[0181] Furthermore, relative to 100 parts by weight of the encapsulation resin, the first encapsulation resin layer 11 of the present invention may contain 1.64 to 3.06 parts by weight of an ultraviolet initiator, preferably, 1.75 to 2.83 parts by weight of an ultraviolet initiator, more preferably, 1.84 to 2.48 parts by weight of an ultraviolet initiator, and even more preferably, 1.95 to 2.26 parts by weight of an ultraviolet initiator. If the amount of ultraviolet initiator is less than 1.64 parts by weight, the heat resistance may be poor due to poor ultraviolet curing. If the amount of ultraviolet initiator is greater than 3.06 parts by weight, the heat resistance may be poor due to reduced curing density.

[0182] Next, the second encapsulation resin layer 12 is a layer that is in direct contact with the metal layer 20 and may be formed by including an encapsulation resin, a tackifier, and a moisture absorbent 40 ′.

[0183] The encapsulating resin included in the second encapsulating resin layer 12 may include the same material as the encapsulating resin mentioned above. The tackifier included in the second encapsulating resin layer 12 may include the same material as the tackifier mentioned above. The moisture absorber 40' included in the second encapsulating resin layer 12 may include the same material as the moisture absorber mentioned above, preferably calcium oxide (CaO). This has the advantage of stably absorbing moisture through a chemical reaction rather than physical absorption. Furthermore, the shape and particle size of the moisture absorber 40' included in the second encapsulating resin layer 12 are not limited. Preferably, the shape may be amorphous or spherical, and the average particle size may be 0.1 μm to 20 μm, preferably 0.5 μm to 10 μm, and more preferably 1.5 μm to 4 μm. If the average particle size is less than 0.1 μm, reliability and adhesion may be reduced due to reduced dispersion. If the average particle size is greater than 20 μm, damage caused by protruding particles during the lamination process may cause black spots.

[0184] In addition, relative to 100 parts by weight of the encapsulation resin, the second encapsulation resin layer 12 of the present invention may contain 57 parts by weight to 107 parts by weight of a tackifier, preferably, it may contain 65 parts by weight to 99 parts by weight of a tackifier, more preferably, it may contain 73 parts by weight to 90 parts by weight of a tackifier, and even more preferably, it may contain 77 parts by weight to 86 parts by weight of a tackifier. If less than 57 parts by weight of the tackifier is contained, there may be a problem of poor moisture resistance. If more than 107 parts by weight of the tackifier is contained, there may be problems of reduced durability and moisture resistance due to reduced elasticity.

[0185] Furthermore, the second encapsulation resin layer 12 of the present invention may contain 110 to 205 parts by weight of the desiccant 40' relative to 100 parts by weight of the encapsulation resin, preferably 126 to 190 parts by weight of the desiccant 40', more preferably 141 to 174 parts by weight of the desiccant 40', and most preferably 149 to 166 parts by weight of the desiccant 40'. If the amount of the desiccant 40' is less than 110 parts by weight, the durability of the organic electronic device may be reduced due to the inability to achieve the desired dehumidification effect in the second encapsulation resin layer 12. If the amount of the desiccant 40' is greater than 205 parts by weight, the adhesive properties may be significantly reduced and the volume may expand excessively upon moisture absorption, resulting in the encapsulation resin layer 10 including the first encapsulation resin layer 11 and the second encapsulation resin layer 12 and / or the second encapsulation resin layer 12 and the first encapsulation resin layer 11 being warped in the organic electronic device, allowing moisture to quickly penetrate therebetween and shortening the life of the organic electronic device.

[0186] Furthermore, in addition to the encapsulating resin, the tackifier and the moisture absorbent 40 ′, the second encapsulating resin layer 12 of the present invention may further include at least one selected from a curing agent and an ultraviolet initiator. Preferably, the second encapsulating resin layer 12 may further include a curing agent and an ultraviolet initiator.

[0187] The curing agent included in the second encapsulation resin layer 12 may include the same substance as the aforementioned curing agent, and preferably, may include the compound represented by the above-mentioned Chemical Formula 2.

[0188] Furthermore, relative to 100 parts by weight of the encapsulation resin, the second encapsulation resin layer 12 of the present invention may contain 6.3 to 11.7 parts by weight of a curing agent, preferably, 7.2 to 10.8 parts by weight of a curing agent, more preferably, 8.1 to 10.0 parts by weight of a curing agent, more preferably, 8.5 to 9.5 parts by weight of a curing agent. If less than 6.3 parts by weight of a curing agent is contained, the target gel fraction and modulus cannot be achieved, and there may be a problem of reduced elasticity. If more than 11.7 parts by weight of a curing agent is contained, there may be problems of poor panel bonding, reduced adhesion to the panel, and reduced wettability due to high modulus and hardness.

[0189] The ultraviolet initiator included in the second encapsulation resin layer 12 may include the same substances as the aforementioned ultraviolet initiators.

[0190] Furthermore, relative to 100 parts by weight of the encapsulation resin, the second encapsulation resin layer 12 of the present invention may contain 1.27 to 2.37 parts by weight, preferably, 1.45 to 2.21 parts by weight of an ultraviolet initiator, more preferably, 1.63 to 2.14 parts by weight of an ultraviolet initiator, and even more preferably, 1.81 to 2.11 parts by weight of an ultraviolet initiator. If the amount of ultraviolet initiator is less than 1.27 parts by weight, the heat resistance may be poor due to poor ultraviolet curing. If the amount of ultraviolet initiator is greater than 2.37 parts by weight, the heat resistance may be poor due to reduced curing density.

[0191] Furthermore, the first encapsulation resin layer 11 and the second encapsulation resin layer 12 may have a thickness ratio of 1:2.8 to 1:5.2, preferably 1:3.2 to 1:4.8, more preferably 1:3.6 to 1:4.4, and even more preferably 1:3.8 to 1:4.2. If the thickness ratio is less than 1:2.8, the reliability may be poor due to moisture. If the thickness ratio is greater than 1:5.2, the increased thickness may reduce the photocuring efficiency, resulting in reduced heat resistance and reliability due to reduced curing density.

[0192] Moreover, the thickness of the first encapsulation resin layer 11 of the present invention can be 1 μm to 30 μm, preferably 7 μm to 13 μm, more preferably 8 μm to 12 μm, and even more preferably 9 μm to 11 μm. The thickness of the second encapsulation resin layer 12 of the present invention can be 15 μm to 70 μm, preferably 28 μm to 52 μm, more preferably 32 μm to 48 μm, and most preferably 36 μm to 44 μm.

[0193] Furthermore, the first encapsulating resin layer 11 and the second encapsulating resin layer 12 may be encapsulating resin layers in a dry state or encapsulating resin layers in a cured state.

[0194] The metal layer 20 of the present invention may include one or more selected from iron (Fe), bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), chromium (Cr) and alloys thereof.

[0195] As a preferred example, it includes a metal plate made of stainless steel containing bismuth, tin, indium, silver, copper, zinc, antimony, nickel, chromium, etc. More preferably, it can be a metal plate containing an alloy (containing inevitable impurities in addition to nickel and iron), and the above alloy contains 34 weight percent to 38 weight percent of nickel and the remainder is iron.

[0196] Furthermore, the thickness of the metal layer 20 may be 60 μm to 150 μm, preferably 70 μm to 120 μm, and more preferably 75 μm to 105 μm.

[0197] In the release layer 30 of the present invention, a release sheet material commonly used in the art can be used as a release sheet (linersheet) material. As a preferred example, it can include one or more selected from polyethylene terephthalate (PET), paper, polyimide (PI) and polyester (PE).

[0198] Furthermore, the thickness of the release layer 30 may be 15 μm to 75 μm, preferably 25 μm to 60 μm, and more preferably 35 μm to 55 μm.

[0199] Furthermore, refer to Figure 2 The organic electronic device of the present invention may include: a substrate 1; an organic electronic device 2 formed on at least one side of the substrate 1; and an encapsulating material 10 for an organic electronic device that can be bonded at room temperature and is used to encapsulate the organic electronic device 2.

[0200] Preferably, the substrate 1 may be a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, and a bendable flexible polymer film.

[0201] The organic electronic device 2 formed on at least one side of the substrate 1 can be formed by forming a lower electrode as a thin film on the substrate 1, laminating an n-type semiconductor layer, an active layer, a p-type semiconductor layer, and an upper electrode on the upper side, and then etching the layer. Alternatively, the organic electronic device 2 can be formed by preparing a separate substrate and then placing it on the substrate 1. The specific method for forming the organic electronic device 2 on the substrate 1 can be a conventional method known in the art and is not particularly limited in the present invention. The organic electronic device 2 can be an organic light-emitting diode.

[0202] Next, the encapsulation material 10 for organic electronic devices that can be bonded under room temperature conditions of the present invention is used to encapsulate the organic electronic device 2. The specific method of the above-mentioned encapsulation can be a well-known common method, and the present invention is not particularly limited thereto. As a non-limiting example thereof, in a state where the first encapsulation resin layer 11 of the encapsulation material 10 for organic electronic devices is in direct contact with the organic electronic device 2, heat and / or pressure can be applied to the organic electronic device 2 formed on the substrate 1 using a vacuum stamping machine or a vacuum laminator. In addition, heat can be applied to cure the encapsulation material 10 for organic electronic devices, and in the case of an encapsulation material including a light-curing encapsulation resin, the curing process can be further performed by moving to a chamber irradiated with light.

[0203] Hereinafter, the present invention will be described by way of the following examples. In this case, the following examples are provided only for the purpose of illustrating the invention, and the scope of protection of the present invention is not limited to the following examples.

[0204] Example 1: Preparation of encapsulation materials for organic electronic devices

[0205] (1) Preparation of the first encapsulation resin layer

[0206] A mixture was prepared by mixing 82 parts by weight of a tackifier, 31 parts by weight of a curing agent, 2 parts by weight of an ultraviolet initiator, and 7 parts by weight of a moisture absorbent with respect to 100 parts by weight of the encapsulating resin.

[0207] In this case, the compound represented by the following chemical formula 1-1 was used as the encapsulating resin, SU-525 (Kolon Industries, Ltd., Korea) was used as the tackifier, and the compound represented by the following chemical formula 2-1 and the compound represented by the following chemical formula 3-1 were mixed at a weight ratio of 1:7.5 as the curing agent. Irgacure TPO (Ciba) was used as the UV initiator, and silica with an average particle size of 0.5 μm was used as the moisture absorbent.

[0208] The prepared mixture was adjusted to a viscosity of 600 cps at 20°C, passed through a capsule filter to remove foreign matter, and then coated on a 38 μm thick heavy-peel antistatic release polyethylene terephthalate (REL382, Toray) using a slot die coater. Afterwards, the solvent was removed by drying at 160°C to prepare a first encapsulation resin layer with a final thickness of 10 μm.

[0209] Chemical formula 1-1:

[0210] In the above chemical formula 1-1, the above R 1 isoprene, and n is a rational number satisfying the weight average molecular weight of the compound represented by Chemical Formula 1-1 of 400,000 g / mol.

[0211] Chemical formula 2-1:

[0212] Chemical formula 3-1:

[0213] (2) Preparation of the second encapsulation resin layer

[0214] A mixture was prepared by mixing 82 parts by weight of a tackifier, 9 parts by weight of a curing agent, 2 parts by weight of an ultraviolet initiator, and 158 parts by weight of a moisture absorbent with respect to 100 parts by weight of the encapsulating resin.

[0215] In this case, the compound represented by the following chemical formula 1-1 is used as the encapsulation resin, SU-525 (Kolon Industries, Ltd., South Korea) is used as the tackifier, the compound represented by the following chemical formula 2-1 is used as the curing agent, the photoinitiator (irgacure) TPO (Ciba Corporation) is used as the ultraviolet initiator, and calcium oxide with an average particle size of 3 μm is used as the moisture absorbent.

[0216] The prepared mixture was adjusted to a viscosity of 600 cps at 20°C, passed through a capsule filter to remove foreign matter, and then coated on a 36 μm thick heavy-peel antistatic release polyethylene terephthalate (TG65R, SKC) using a slot die coater. Afterwards, the solvent was removed by drying at 160°C to prepare a second encapsulation resin layer with a final thickness of 40 μm.

[0217] Chemical formula 1-1:

[0218] In the above chemical formula 1-1, the above R 1 isoprene, and n is a rational number satisfying the weight average molecular weight of the compound represented by Chemical Formula 1-1 of 400,000 g / mol.

[0219] Chemical formula 2-1:

[0220] (3) Preparation of packaging materials

[0221] The first encapsulating resin layer and the second encapsulating resin layer were bonded together so as to face each other and passed through a laminating roll at a temperature of 70° C., thereby preparing an encapsulating material.

[0222] Example 2: Preparation of encapsulation materials for organic electronic devices

[0223] An encapsulating material was prepared by the same method as in Example 1. However, unlike Example 1, only 18 parts by weight of the compound represented by the above Chemical Formula 3-1 was used as a curing agent for the first encapsulating resin layer to prepare the encapsulating material.

[0224] Comparative Example 1: Preparation of encapsulation materials for organic electronic devices

[0225] (1) Preparation of the first encapsulation resin layer

[0226] A mixture was prepared by mixing 43 parts by weight of a random copolymer of a copolymerized diene compound, 133 parts by weight of a first tackifier, 133 parts by weight of a second tackifier, 33 parts by weight of a curing agent, 4 parts by weight of an ultraviolet initiator, and 36 parts by weight of a moisture absorbent with respect to 100 parts by weight of an encapsulating resin.

[0227] In this case, the compound represented by Chemical Formula 1-1 was used as the encapsulating resin, SU-90 (Kolon Industries, Ltd., Korea) was used as the first tackifier, and SU-100 (Kolon Industries, Ltd., Korea) was used as the second tackifier. The compound represented by Chemical Formula 2-1 was used as the curing agent, photoinitiator (irgacure) TPO (Ciba) was used as the UV initiator, and silica with an average particle size of 0.5 μm was used as the moisture absorbent.

[0228] A first encapsulating resin layer was prepared by the same method as in Example 1 using the prepared mixture.

[0229] (2) Preparation of the second encapsulation resin layer

[0230] A mixture was prepared by mixing 43 parts by weight of a random copolymer of a copolymerized diene compound, 67 parts by weight of a first tackifier, 267 parts by weight of a second tackifier, 48 parts by weight of a curing agent, 5 parts by weight of an ultraviolet initiator, and 529 parts by weight of a moisture absorbent with respect to 100 parts by weight of an encapsulating resin.

[0231] In this case, the compound represented by the following chemical formula 1-1 is used as the encapsulation resin, SU-90 (Kolon Industries, Ltd., Korea) is used as the first tackifier, SU-640 (Kolon Industries, Ltd., Korea) is used as the second tackifier, the compound represented by the following chemical formula 2-1 is used as the curing agent, photoinitiator (irgacure) TPO (Ciba) is used as the ultraviolet initiator, and calcium oxide with an average particle size of 3 μm is used as the moisture absorbent.

[0232] A second encapsulating resin layer was prepared using the prepared mixture in the same manner as in Example 1.

[0233] Comparative Example 2: Preparation of an encapsulation material for an organic electronic device - Preparation of an encapsulation material with a single layer structure

[0234] A mixture was prepared by mixing 67 parts by weight of a tackifier, 7 parts by weight of a curing agent, 2 parts by weight of an ultraviolet initiator, and 19 parts by weight of a moisture absorbent with respect to 100 parts by weight of polyisobutylene B15 (BASF).

[0235] In this case, SU-90 (Kolon Industries, Ltd., Korea) was used as a thickener, a compound represented by the following chemical formula 2-1 was used as a curing agent, photoinitiator (irgacure) TPO (Ciba) was used as an ultraviolet initiator, and calcium oxide with an average particle size of 3 μm was used as a moisture absorbent.

[0236] The prepared mixture was adjusted to a viscosity of 600 cps at 20°C, passed through a capsule filter to remove foreign matter, and then coated on a 38 μm thick heavy-peel antistatic release polyethylene terephthalate (REL382, Toray) using a slot die coater. After drying at 160°C to remove the solvent, a single-layer encapsulation resin layer with a final thickness of 50 μm was prepared.

[0237] Comparative Example 3: Preparation of encapsulation materials for organic electronic devices

[0238] An encapsulating material was prepared by the same method as in Comparative Example 1. However, unlike Comparative Example 1, SU-640 (Kolon Industries, Ltd., Korea) was used as the second tackifier for the first encapsulating resin layer instead of SU-100 (Kolon Industries, Ltd., Korea).

[0239] Comparative Example 4: Preparation of encapsulation materials for organic electronic devices

[0240] A packaging material was prepared by the same method as in Comparative Example 2. However, unlike Comparative Example 2, 3 parts by weight of a curing agent was used to prepare the packaging material.

[0241] Comparative Example 5: Preparation of encapsulation materials for organic electronic devices

[0242] An encapsulating material was prepared by the same method as in Comparative Example 1. However, unlike Comparative Example 1, 267 parts by weight of the first tackifier and 67 parts by weight of the second tackifier were used per 100 parts by weight of the encapsulating resin of the second encapsulating resin layer.

[0243] In this case, SU-90 (Kolon Industries, Ltd., Korea) was used as the first tackifier, and SU-640 (Kolon Industries, Ltd., Korea) was used as the second tackifier instead of SU-100 (Kolon Industries, Ltd., Korea).

[0244] Comparative Example 6: Preparation of encapsulation materials for organic electronic devices

[0245] (1) Preparation of the first encapsulation resin layer

[0246] A mixture was prepared by mixing 135 parts by weight of a tackifier, 35 parts by weight of a curing agent, 2 parts by weight of an ultraviolet initiator, and 8 parts by weight of a moisture absorbent with respect to 100 parts by weight of the encapsulating resin.

[0247] In this case, the compound represented by the following chemical formula 1-1 is used as the encapsulating resin, SU-100 (Kolon Industries, Ltd., South Korea) is used as the tackifier, the compound represented by the above chemical formula 3-1 is used as the curing agent, photoinitiator (irgacure) TPO (Ciba Corporation) is used as the ultraviolet initiator, and silica with an average particle size of 0.5 μm is used as the moisture absorbent.

[0248] A first encapsulating resin layer was prepared by the same method as in Example 1 using the prepared mixture.

[0249] (2) Preparation of the second encapsulation resin layer

[0250] A mixture was prepared by mixing 82 parts by weight of a tackifier, 5 parts by weight of a curing agent, 2 parts by weight of an ultraviolet initiator, and 155 parts by weight of a moisture absorbent with respect to 100 parts by weight of the encapsulating resin.

[0251] In this case, the compound represented by the following chemical formula 1-1 is used as the encapsulation resin, SU-525 (Kolon Industries, Ltd., South Korea) is used as the tackifier, the compound represented by the above chemical formula 2-1 is used as the curing agent, the photoinitiator (irgacure) TPO (Ciba Company) is used as the ultraviolet initiator, and calcium oxide with an average particle size of 3 μm is used as the moisture absorbent.

[0252] Experimental Example 1

[0253] The following physical properties were measured for the packaging materials prepared in the above-described Examples and Comparative Examples and are shown in Table 1 below.

[0254] 1-1. Evaluation of moisture permeability of packaging materials

[0255] The packaging materials prepared according to the Examples and Comparative Examples were cut into 95mm x 95mm pieces. After removing the protective film from a 100mm x 100mm piece of alkali-free glass, the test piece was adjusted so that it was 2.5mm inward from the edges of the four sides of the alkali-free glass and attached using a roll laminator heated to 65°C. After removing the release film remaining on the attached test piece, another 100mm x 100mm piece of alkali-free glass was placed over it and laminated for 1 minute using a vacuum laminator at 25°C (room temperature) to produce bubble-free samples after lamination. The samples after lamination were observed under a microscope in a reliability chamber at a temperature of 85°C and a relative humidity of 85%, with the length of water penetration per 1000 hours.

[0256] 1-2. Evaluation of volume expansion of packaging materials

[0257] After removing the release film from the encapsulation materials prepared according to the Examples and Comparative Examples, the materials were attached to a 50μm-thick SUS plate cut into 30mm×20mm sections using a roll laminator heated to approximately 65°C. The attached test piece was cut to size using a knife according to the SUS size and then attached to a 40mm×30mm piece of 0.5T alkali-free glass using a roll laminator heated to 65°C. After confirming that the test piece adhered seamlessly between the glass and the SUS, the test piece was observed at 100-hour intervals for 1000 hours in a reliability chamber maintained at 85°C and 85% relative humidity. The height change of the test piece relative to the SUS at the hygroscopic site was then observed using an optical microscope.

[0258] The observation results show that when the height change of the hygroscopic part is less than 12μm, it is indicated by ◎; when the height change of the hygroscopic part is 12μm to 14μm, it is indicated by ○; when the height change of the hygroscopic part is 14μm to 16μm, it is indicated by △; when the height change of the hygroscopic part is greater than 16μm, it is indicated by ×.

[0259] 1-3. Evaluation of heat resistance of packaging materials

[0260] The packaging material prepared according to the embodiment and the comparative example was cut into a size of 50mm×80mm, and the second packaging resin layer from which the release polyethylene terephthalate was removed was attached to a 60mm×150mm 0.08T nickel alloy using a roll laminator at 80°C. The first packaging resin layer from which the release polyethylene terephthalate remaining on the attached test piece was removed was attached to a 30mm×70mm 0.5T alkali-free glass using a roll laminator at 25°C. After the test piece attached to the glass was vertically fixed in a chamber at a temperature of 100°C, a 1kg pendulum was hung to determine whether it flowed. In this case, when the evaluation result was normal, it was indicated by ○, and when there was even a little flow, it was indicated by ×.

[0261] 1-4. Glass Adhesion Evaluation

[0262] For the packaging materials prepared according to the embodiments and comparative examples, an adhesion measuring tape (7475, TESA) was laminated on the upper surface of the packaging material using a 2 kg hand roller. The packaging material was cut into a size of 25 mm in width × 120 mm in length. The lower surface of the packaging material was laminated on alkali-free glass at a temperature of 80°C. The sample was left at room temperature for 30 minutes, and the glass adhesion was measured using a universal testing machine (UTM) at a speed of 300 mm / min.

[0263] 1-5. Evaluation of metal adhesion

[0264] For the packaging materials prepared according to the embodiments and comparative examples, at a temperature of 80°C, the second packaging resin layer from which the release polyethylene terephthalate was removed was laminated on a nickel alloy sheet with a thickness of 80 μm, and an adhesion measuring tape (7475, TESA) was laminated on the first packaging resin layer from which the release polyethylene terephthalate was removed. After the packaging material was cut into a size of 25 mm in width × 120 mm in length, the prepared packaging material was placed at a temperature of 25°C for 30 minutes, and the metal adhesion was measured using a universal testing machine at a speed of 300 mm / min.

[0265] Experimental Example 2

[0266] On a substrate with an ITO pattern, a stacked organic light-emitting diode (OLED) (hole transport layer NPD / thickness 800 Å, light-emitting layer Alq3 / thickness 300 Å, electron injection layer LiF / thickness 10 Å, cathode Al+Liq / thickness 1000 Å) was deposited. The encapsulation materials according to the examples and comparative examples were then laminated onto the fabricated device at room temperature to produce a green OLED unit test piece. The following physical properties were evaluated for the test piece and are shown in Table 1.

[0267] 2-1. Durability Evaluation of Organic Light-Emitting Devices Based on Moisture Permeation of Encapsulation Materials

[0268] For the packaging materials prepared according to the embodiments and comparative examples, the pixel shrinkage and dark spot generation and / or growth in the light-emitting portion were observed in 100-hour units using a ×100 digital microscope in an environment with a temperature of 85°C and a relative humidity of 85%. The time required for pixel shrinkage to occur by more than 50% and / or dark spot generation was measured.

[0269] In this case, when pixel shrinkage occurs by more than 50% and the time required for dark spot generation is more than 1000 hours, it is indicated by ◎; when pixel shrinkage occurs by more than 50% and the time required for dark spot generation is less than 1000 hours and more than 800 hours, it is indicated by ○; when pixel shrinkage occurs by more than 50% and the time required for dark spot generation is less than 800 hours and more than 600 hours, it is indicated by △; when pixel shrinkage occurs by more than 50% and the time required for dark spot generation is less than 600 hours, it is indicated by ×.

[0270] 2-2. Durability evaluation of packaging materials

[0271] The encapsulating materials prepared according to the Examples and Comparative Examples were observed for 1000 hours at 100-hour intervals in a reliability chamber maintained at 85°C and 85% relative humidity. The results were then examined using an optical microscope to assess the presence of physical damage, such as interface separation between the organic electronic device and the encapsulating material, cracks or bubbles within the encapsulating film, and separation between the encapsulating layers. No abnormalities were indicated by a circle (○). Any abnormalities, such as interface separation, cracks or bubbles within the encapsulating film, or separation between the first and second encapsulating resin layers, were indicated by an x.

[0272] Experimental Example 3

[0273] The 50 μm-thick encapsulating materials prepared in the above-described examples and comparative examples were cut into sheets measuring 40 mm wide by 90 mm long. The second encapsulating resin layer, with the release polyethylene terephthalate (PET) removed, was then attached to glass using a roll laminator at 60°C (conditions: 60°C, gap 2 mm, speed 1). The composite hardness, indentation penetration length before creep and after creep for 5 seconds, and CIT (creep properties) of the first encapsulating resin layer, with the release polyethylene terephthalate (PET) removed, were then measured at 25°C and 50°C using a nanoindenter (Picodentor HM500, Fischel) under the following measurement conditions. The results are shown in Table 1.

[0274] Measurement conditions

[0275] Initial pressure: 0mN

[0276] Final pressure: 30mN

[0277] Pressure increase speed: 3mN / second

[0278] Ball Tip size: 2mm

[0279] Experimental Example 4

[0280] The 50 μm-thick second encapsulating resin layer (removed from the release-type polyethylene terephthalate) of the encapsulating materials prepared in Examples and Comparative Examples was attached to glass using a roll laminator at 60°C. The adhesion of the first encapsulating resin layer (removed from the release-type polyethylene terephthalate) was then measured using a probe tack tester (SurTA, Chemilab) under the following measurement conditions. The results are shown in Table 1.

[0281] Measurement conditions

[0282] Probe Tip size: 12.7mm

[0283] Load speed: 0.1 mm / s (when a load of 50 gf is applied, maintained for 5 seconds)

[0284] Return speed: 0.5mm / second

[0285] Experimental Example 5

[0286] For the packaging material with a thickness of 50 μm prepared by the embodiment and the comparative example, punching is performed in a manner having a circular diameter of 6 mm. The release polyethylene terephthalate attached to the second packaging resin layer of the packaging material is removed, and the second packaging resin layer is laminated on a metal plate (thickness: 0.08 mm) cut into a width × length of 40 mm × 150 mm using a roll laminator at 60°C. In addition, the release polyethylene terephthalate attached to the first packaging resin layer of the packaging material is removed, and the first packaging resin layer is laminated on an alkali-free glass (size: width × length of 50 mm × 100 mm) using a roll laminator at 25°C. Thereafter, after fixing the glass using a universal testing machine (OTT-0006, OrientalTM), the metal plate is pulled upward, and the shear strength is measured under the following measurement conditions and is shown in the following Table 1.

[0287] Measurement conditions

[0288] Peeling mode: 180° peeling

[0289] Measuring speed: 5mm / second

[0290] Peeling length: 50mm (10 seconds)

[0291] Experimental Example 6

[0292] 6-1. Evaluation of adhesion at room temperature

[0293] For the encapsulating materials prepared according to the Examples and Comparative Examples, the second encapsulating resin layer, after removing the release polyethylene terephthalate (PET) liner, was attached to a 0.08 mm thick nickel alloy sheet (metal layer) using a roll laminator at 80°C. The attached test piece was cut into a size of 25 mm wide by 150 mm long. The first encapsulating resin layer, after removing the release polyethylene terephthalate (PET) liner, was then attached to alkali-free glass using a roll laminator at 25°C. The sheets were then left at room temperature (25°C) for 30 minutes. The room-temperature adhesive strength was measured using a universal testing machine at a speed of 300 mm / min, and is shown in Table 1. To be considered excellent at room temperature, the room-temperature adhesive strength should be 6000 gf / 25 mm or greater.

[0294] 6-2. Room temperature adhesion evaluation

[0295] For the encapsulating materials prepared according to the Examples and Comparative Examples, the second encapsulating resin layer, after removing the release polyethylene terephthalate (PET) liner, was attached to a 0.08 mm thick nickel alloy sheet (metal layer) using a roll laminator at 80°C. The attached test piece was cut into a size of 95 mm x 95 mm. The first encapsulating resin layer, after removing the release polyethylene terephthalate (PET) liner, was then attached to alkali-free glass using a roll laminator at 25°C. The presence of bubble traps was evaluated by optical microscopy and is shown in Table 1. No abnormalities are indicated by a circle (○), while the presence of bubble traps is indicated by an "×."

[0296] Table 1

[0297]

[0298]

[0299] Those skilled in the art can easily implement simple modifications or variations of the present invention, and such modifications or variations are all included in the scope of the present invention.

Claims

1. A packaging material for an organic electronic device, characterized in that: comprising a first encapsulating resin layer and a second encapsulating resin layer formed on one side of the first encapsulating resin layer, The first encapsulation resin layer and the second encapsulation resin layer respectively include an encapsulation resin, a tackifier, a curing agent and a moisture absorbent. The curing agent of the first encapsulating resin layer includes a compound represented by the following chemical formula 2 and a compound represented by the following chemical formula 3. The curing agent of the second encapsulation resin layer includes a compound represented by the following Chemical Formula 2: Chemical formula 2: In the above Chemical Formula 2, A1 and A2 are each independently -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2-, or -CH2CH2CH2CH2CH2CH2CH2-, Chemical formula 3: In the above chemical formula 3, A3 is -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2- or -CH2CH2CH2CH2CH2CH2- The first encapsulating resin layer comprises 70 to 176 parts by weight of a tackifier, 28 to 31 parts by weight of a curing agent, and 6.8 to 7.5 parts by weight of a moisture absorbent relative to 100 parts by weight of the encapsulating resin. The encapsulation resin layer satisfies the following equations 1 and 2: Relationship 1: 0.3μm≤BA≤2.0μm; Relationship 2: 5％≤C≤45％， In the above equation 1, A is the initial indentation penetration length of the cured encapsulation resin layer measured by a nanoindenter at a temperature of 25°C and a pressure increase rate of 3mN / sec to reach a pressure of 30mN. B is the indentation penetration length measured after the cured encapsulation resin layer is creep-bound at 25°C for 5 seconds after reaching a pressure of 30mN. The unit of penetration length is μm. In the above equation 2, C is the indentation creep CIT measured by the following mathematical equation 1: Mathematical formula 1: In the above mathematical formula 1, A and B are defined as in the above relational formula 1, The above-mentioned A is 4.1 μm to 12.1 μm, and the above-mentioned B is 4.6 μm to 12.6 μm.

2. The encapsulation material for an organic electronic device according to claim 1, wherein The encapsulation resin layer also satisfies the following equation 5: Equation 5: In the above equation 5, A and B are defined as in the above equation 1. D is the initial indentation penetration length of the cured encapsulation resin layer measured by a nanoindenter at a temperature of 50°C and a pressure increase rate of 3mN / sec to reach a pressure of 30mN. E is the indentation penetration length measured after the cured encapsulation resin layer is kept creeping at 50°C for 5 seconds after reaching a pressure of 30mN. The unit of penetration length is μm.

3. The encapsulation material for an organic electronic device according to claim 1, wherein The encapsulation resin layer also satisfies the following equation 6: Equation 6: 0.5≤C / F≤2.0, In the above equation 6, C is as defined in the above equation 2, and F is the indentation creep CIT measured by the following mathematical equation 2: Mathematical formula 2: In the above mathematical formula 2, D is the initial indentation penetration length of the solidified encapsulation resin layer measured at a pressure of 30 mN at a pressure increasing rate of 3 mN / sec at a temperature of 50°C using a nanoindenter, and E is the indentation penetration length measured after the solidified encapsulation resin layer is kept in creep at 50°C for 5 seconds after the pressure reaches 30 mN. The unit of penetration length is μm.

4. The encapsulation material for an organic electronic device according to claim 1, wherein The encapsulation resin layer also satisfies the following equation 7: Equation 7: 1.1≤G / H≤4.0, In the above equation 7, G is the composite hardness of the cured encapsulation resin layer measured by a nanoindenter at a temperature of 25°C and a pressure increase rate of 3mN / sec to a pressure of 30mN, and H is the composite hardness measured by the same method at a temperature of 50°C. The unit of composite hardness is N / mm 2 .

5. The encapsulation material for an organic electronic device according to claim 4, wherein: The above G is 2.0N / mm 2 ~6.0N / mm 2 , the above H is 0.5N / mm 2 ~3.5N / mm 2 .

6. The encapsulation material for an organic electronic device according to claim 1, wherein The encapsulating resin layer also satisfies the following conditions (1) and (2): (1)100≤I≤300； (2)500≤J， In the above condition (1), I is the adhesion of the cured encapsulating resin layer measured according to the ASTM D2979 standard, i.e., the probe tack test, and the unit of adhesion is gf, In the above condition (2), J is the shear strength of the cured encapsulating resin layer measured using a universal testing machine, and the unit of shear strength is gf / 6mm.

7. The encapsulation material for an organic electronic device according to claim 1, wherein The second encapsulating resin layer includes 57 to 107 parts by weight of a tackifier and 110 to 205 parts by weight of a moisture absorbent relative to 100 parts by weight of the encapsulating resin.

8. The encapsulation material for an organic electronic device according to claim 1, wherein The encapsulating resin includes a compound represented by the following Chemical Formula 1: Chemical formula 1: In the above chemical formula 1, R 1 For hydrogen atoms, C3~C 10 Straight chain alkenyl or C4~C 10 wherein n is a rational number satisfying a weight average molecular weight of 30,000 to 1,550,000.

9. The encapsulation material for an organic electronic device according to claim 1, wherein The first encapsulating resin layer and the second encapsulating resin layer each independently further contain an ultraviolet initiator.

10. The encapsulation material for an organic electronic device according to claim 9, wherein The first encapsulating resin layer contains 1.64 to 3.06 parts by weight of an ultraviolet initiator relative to 100 parts by weight of the encapsulating resin. The second encapsulating resin layer includes 6.36 to 11.82 parts by weight of a curing agent and 1.27 to 2.37 parts by weight of an ultraviolet initiator relative to 100 parts by weight of the encapsulating resin.

11. The encapsulation material for an organic electronic device according to claim 1, wherein The curing agent of the first encapsulating resin layer includes the compound represented by Chemical Formula 2 and the compound represented by Chemical Formula 3 at a weight ratio of 1:5.25 to 1:9.

75.

12. The encapsulation material for an organic electronic device according to claim 1, wherein The ratio of the thickness of the first encapsulating resin layer to the thickness of the second encapsulating resin layer is 1:2.8 to 1:5.

2.

13. The encapsulation material for an organic electronic device according to claim 10, wherein: The thickness of the first encapsulation resin layer is 1 μm to 20 μm. The second encapsulating resin layer has a thickness of 30 μm to 60 μm.

14. A packaging material for an organic electronic device, characterized in that: comprising a first encapsulating resin layer and a second encapsulating resin layer formed on one side of the first encapsulating resin layer, The first encapsulation resin layer and the second encapsulation resin layer respectively include an encapsulation resin, a tackifier, a curing agent and a moisture absorbent. The curing agent of the first encapsulating resin layer includes a compound represented by the following chemical formula 2 and a compound represented by the following chemical formula 3. The curing agent of the second encapsulation resin layer includes a compound represented by the following Chemical Formula 2: Chemical formula 2: In the above Chemical Formula 2, A1 and A2 are each independently -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2-, or -CH2CH2CH2CH2CH2CH2CH2-, Chemical formula 3: In the above chemical formula 3, A3 is -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2- or -CH2CH2CH2CH2CH2CH2- The first encapsulating resin layer comprises 70 to 176 parts by weight of a tackifier, 28 to 31 parts by weight of a curing agent, and 6.8 to 7.5 parts by weight of a moisture absorbent relative to 100 parts by weight of the encapsulating resin. The encapsulation resin layer satisfies the following equations 3 and 4: Relationship 3: 0.6μm≤ED≤3.0μm; Equation 4: 3％≤F≤40％， In the above equation 3, D is the initial indentation penetration length of the cured encapsulation resin layer measured by a nanoindenter at a temperature of 50°C and a pressure increase rate of 3mN / sec to reach a pressure of 30mN. E is the indentation penetration length measured after the cured encapsulation resin layer is creep-deformed at 50°C for 5 seconds after reaching a pressure of 30mN. The unit of penetration length is μm. In the above equation 4, F is the indentation creep CIT measured by the following mathematical equation 2: Mathematical formula 2: In the above mathematical formula 2, D and E are defined as in the above relational formula 3, The above-mentioned D is 4.6 μm to 12.6 μm, and the above-mentioned E is 5.1 μm to 13.1 μm.

15. An organic electronic device, characterized in that: include: substrate; an organic electronic device formed on at least one side of the substrate; as well as The encapsulating material for an organic electronic device according to any one of claims 1 to 14, which is used to encapsulate the organic electronic device.

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