An ultra-high vacuum sample stage and integrated low-temperature transport measurement stage

Abstract

The present invention discloses an ultra-high vacuum sample stage and an integrated low-temperature transport measurement stage, comprising a sample measurement stage adapted for sample transfer using a vacuum flag-shaped sample holder, a flexible microprobe for multi-port electrical measurement, and a needle-feeding cam mechanism to prevent overdrive. The stage also includes an ultra-high vacuum cross-connect for integrated use, sealed with a vacuum electrical connection mechanism for outputting electrical signals, a probe drive mechanism for providing torque, an external vacuum cooling source, and the output end of the ultra-high vacuum multi-dimensional displacement stage. The present invention has the characteristics of not obstructing the core area of the sample, being easily docked with an ultra-high vacuum system, and being adaptable to multi-dimensional displacement. It can achieve nearly lossless and stable electrical connection between the probe and the sample in situ in a vacuum, while effectively supporting coordinated regulation of multiple fields and dimensions.

Description

Technical Field

[0001] The present invention belongs to the field of ultra-high vacuum low-temperature equipment, and relates to an ultra-high vacuum sample stage and an integrated low-temperature transport measurement stage. Background Art

[0002] Low-dimensional quantum materials possess atomic-scale structures and novel electrical, magnetic, optical properties, and quantum effects, which are of great significance for the development of new quantum devices and applications. However, while low-dimensional structures create a series of novel physical properties, they are also very sensitive and fragile, and are easily oxidized and contaminated by the external environment, resulting in performance degradation or even structural damage. Therefore, low-dimensional quantum materials and their devices usually need to be prepared and measured in a vacuum environment. Only in an ultra-high vacuum environment can the interference of environmental noise be effectively isolated, intermolecular interactions be reduced, and an ideal low-temperature environment be achieved. Only then can the atomically clean surface and stable structure be maintained for a long time, thereby enabling the measurement of their intrinsic quantum transport properties.

[0003] Currently, in situ transport measurements are primarily performed using vacuum probe stations based on multiple independent probes or integrated multi-probe systems. Limited by the stringent requirements of ultrahigh vacuum systems for transmission mechanisms, monitoring methods, and component materials, the former utilizes ultrahigh vacuum three-dimensional translation stages or ultrahigh vacuum-compatible stepper motors to precisely drive independent probes toward the device electrodes. However, due to the rigid contact between the probes and the device, high precision is required for motion control and real-time monitoring. Overdriving the probes can easily damage both the device and the probes, and the devices also present numerous challenges, such as complex and difficult to manipulate structures, large size, and limited adaptability to external fields, along with a narrow temperature range. While the latter utilizes a more compact multi-probe integration solution, the probes are often separated from the sample stage or intersect with the sample stage plane, resulting in sample surface obstruction and limited motion. Therefore, existing in situ transport measurement techniques have significant limitations for high-throughput measurements of device transport properties and for simultaneous physical property manipulation using external fields such as light, magnetism, and force. This significantly restricts the exploration and development of low-dimensional quantum physics principles and device prototypes. Summary of the Invention

[0004] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide an ultra-high vacuum sample stage and an integrated low-temperature transport measurement stage, which can effectively protect the sample surface interface while achieving an almost lossless and stable electrical connection between the probe and the sample in situ, thereby enabling efficient and high-precision measurement of the transport properties of the sample.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] An ultra-high vacuum sample stage, comprising a sample measurement stage and a probe platform;

[0007] The probe platform is arranged above one side of the front end of the sample measuring platform, and a sample is arranged on the other side of the front end of the sample measuring platform;

[0008] The probe platform has multiple shoulder-limiting shafts at the bottom that pass through the sample measurement platform. The shoulder-limiting shafts are slidably connected to the sample measurement platform. The shoulders of the shoulder-limiting shafts are located below the sample measurement platform. An elastic component is provided between the shoulders and the bottom of the sample measurement platform. The elastic component always applies a force to keep the probe platform and the sample measurement platform close to each other.

[0009] The sample measuring platform is located in a hollow area directly below the center of the probe platform. A rotating shaft is rotatably connected between the two side walls of the hollow area of the sample measuring platform. A cam mechanism is provided on the rotating shaft, and the cam mechanism contacts the center of the bottom of the probe platform.

[0010] The probe platform is provided with a circuit board, on which a plurality of flexible microprobes are arranged. The needle tips of the flexible microprobes extend from the probe platform and extend toward the top surface of the sample below. When the probe platform is at the lowest point, the needle tips of the flexible microprobes contact the top of the sample.

[0011] Preferably, the cam mechanism includes a top plate, which is nested on the rotating shaft near the side area, and the side is an arc surface; a circular wheel is connected to the bottom center of the probe platform, and the top surface of the top plate contacts the bottom of the circumference of the circular wheel.

[0012] Furthermore, a convex block is provided at the bottom center of the probe platform, the bottom of the convex block is connected to a circular wheel shaft, and the two ends of the circular wheel shaft are rotatably connected to a circular wheel, and the bottom of the circumference of the two circular wheels is in contact with the top surface of the top plate.

[0013] Preferably, the flexible microprobe is made of gold, beryllium copper or stainless steel.

[0014] Preferably, a sample holder slot is provided on one side of the sample measuring platform where the sample is arranged, a flag-shaped sample holder is slidably connected in the sample holder slot, and a fixing device for fixing the flag-shaped sample holder is provided on the sample measuring platform.

[0015] Furthermore, the fixing device adopts an elastic sample fixing pressing piece, one end of which is fixed on the sample measuring table, and the other end is pressed on the top surface of the flag-shaped sample holder.

[0016] An ultra-high vacuum integrated low-temperature transport measurement platform, comprising an ultra-high vacuum cross-connect;

[0017] The four channels of the ultra-high vacuum cross-connect are respectively sealed and connected to a vacuum electrical connection mechanism, a probe driving mechanism, a vacuum external cooling source and an output end of the ultra-high vacuum multi-dimensional translation stage, and the ultra-high vacuum cross-connect is provided with the ultra-high vacuum sample stage;

[0018] The vacuum electrical connection mechanism is connected to the circuit board, and the output end of the probe driving mechanism is connected to the rotating shaft.

[0019] Preferably, the probe driving mechanism includes a vacuum outer handwheel, a vacuum inner shaft, a coupling, a steel wire flexible shaft, a driven shaft and a second gear connected in sequence, a first gear is provided on the rotating shaft, and the first gear and the second gear are meshed to form a gear pair.

[0020] Preferably, the rear end of the sample measuring platform is sequentially connected with a docking fixture, a cryogenic tube and a cryogenic cold head, and the cryogenic cold head is connected with a vacuum external cooling source.

[0021] Furthermore, a heat sink support is nested on the cryogenic tube, a cable channel is provided on the heat sink support, and the vacuum electrical connection mechanism includes an ultra-high vacuum cable, which passes through the cable channel and is connected to the circuit board.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The flexible microprobe used in the present invention is elastic and cantilevered, with certain pressure relief properties. Combined with a precise lifting and inserting cam mechanism, it can achieve flexible contact with the electrode contacts on the sample surface to avoid scratching and damaging the sample. In addition, the flexible microprobe is located on the side of the sample as a whole, minimizing the obstruction of the sample above, and can be compatible with light, scanning probes, etc. to perform in-situ regulation of sample properties. Multiple flexible microprobes can obtain micron-level needle tip diameters and needle tip spacing through common processing methods, and then multiple probes can be set according to demand for multi-port measurement. The probe platform uses a cam mechanism on the rotating shaft to move up and down. Through analytical geometric relationships and transmission ratio calculations, the motion relationship equation between the rotation angle of the rotating shaft and the lifting displacement of the probe platform can be obtained, achieving quantitative and precise control of the probe approaching the sample, and achieving almost lossless and stable electrical connection between the probe and the sample in situ, thereby enabling efficient and high-precision measurement of the transport properties of the sample.

[0024] Furthermore, when the rotating shaft drives the top plate to rotate and the probe platform drops to the lowest point, the circular wheel is exactly tangent to the arc portion of the top plate. Even if the rotating shaft continues to rotate in this direction, the circular wheel will continue to be tangent to the arc portion of the top plate to maintain a horizontal height, thereby effectively limiting damage to the sample and probe caused by over-driving the probe.

[0025] Furthermore, the sample and probe platform are set in the same sample measurement table, and each functional mechanism is connected to the ultra-high vacuum four-way. After docking with the ultra-high vacuum multi-dimensional translation stage, the overall XYZ three-dimensional motion and axial rotation can be realized while maintaining the contact between the sample electrode and the probe, thereby realizing multi-field and multi-dimensional coordinated regulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of the ultra-high vacuum integrated low-temperature transport measurement platform of the present invention;

[0027] Figure 2This is a schematic structural diagram of the ultra-high vacuum sample stage of the present invention from a first perspective;

[0028] Figure 3 This is a schematic structural diagram of the ultra-high vacuum sample stage of the present invention from a second viewing angle;

[0029] Figure 4 This is a geometrical analysis diagram of the needle-feeding cam mechanism of the present invention;

[0030] Figure 5 This is a schematic diagram of an application example of the present invention in which optical, magnetic and electric fields are coordinated to control each other.

[0031] Among them: 1. Ultra-high vacuum cross-piece; 2. Docking flange position; 3. Transport flange position; 3-1. Ultra-high vacuum electrical feedthrough; 3-1a Vacuum external terminal; 3-1b Vacuum internal terminal; 3-2. Ultra-high vacuum cable; 4. Drive flange position; 4-1. Ultra-high vacuum rotary feedthrough; 4-1a. Vacuum external handwheel; 4-1b. Vacuum internal shaft; 4-2. Coupling; 4-3. Steel wire flexible shaft; 4-4. Driven shaft; 4-5. Second rolling bearing; 4-6. Gear pair; 5. Cryogenic flange position; 5-1. Cryogenic cold head; 5-2. Cryogenic catheter; 5-3. Heat sink support; 5-3a. Cable channel; 5-3b. Drive channel; 6. Sample measurement table; 6-1. Sample holder; 6- 2. Transport probe mechanism; 6-3. Docking fixture; 7. Flag-shaped sample holder; 8. Sample; 8-1. Electrode contact; 601. Sample holder slot; 602. Sample fixing plate; 603. Rotating shaft; 604. First rolling bearing; 605. Top plate; 605a. Plate surface; 605b. Arc surface; 606. Probe platform; 607. Round wheel shaft; 608. Round wheel; 609. Shoulder limit shaft; 610. Sliding bushing; 611. Return spring; 612. Circuit board; 613. Flexible microprobe; 614. Printed circuit; 001. Ultra-high vacuum multi-dimensional translation stage; 002. Ultra-high vacuum transport measurement cavity; 003. Electromagnet; 004. Ultra-high vacuum optical window. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the accompanying drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0035] like Figure 1 As shown, the ultra-high vacuum integrated low-temperature transport and measurement platform described in the present invention includes an ultra-high vacuum four-way 1. The ultra-high vacuum four-way 1 is provided with four standard ultra-high vacuum CF flanges and their connecting cavities, wherein the docking flange position 2 is sealedly connected to other specific ultra-high vacuum cavities through the ultra-high vacuum multi-dimensional translation stage, the transport flange position 3 is sealedly connected to the vacuum electrical connection mechanism, the drive flange position 4 is sealedly connected to the probe drive mechanism, and the low-temperature flange position 5 is sealedly connected to the low-temperature connection mechanism.

[0036] An ultra-high vacuum sample stage is provided in the ultra-high vacuum cross-port 1. The ultra-high vacuum sample stage includes a sample measurement stage 6, a sample holder 6-1 is provided on one side of the front end thereof, and is configured to carry a standard flag-shaped sample holder 7 for vacuum sample transfer, and a transport probe mechanism 6-2 is provided on the other side; its right end is connected to the docking fixture 6-3 by screws.

[0037] The sample measuring platform 6, the standard flag-shaped sample holder 7 and the docking fixture 6-3 are made of oxygen-free copper with good thermal conductivity to efficiently transmit low temperatures.

[0038] like Figure 2 As shown, the sample holder 6-1 is provided with a sample holder slot 601, and a sample fixing pressure piece 602 connected by screws is symmetrically arranged above it; the flag-shaped sample holder 7 carrying the sample 8 can be inserted into the sample holder slot 601 and pressed by the elastic sample fixing pressure piece 602. One end of the sample fixing pressure piece 602 is fixed to the sample holder 6-1 by a bolt, and the other end is pressed on the top surface of the flag-shaped sample holder 7 to prevent it from loosening and falling off when the sample measuring platform 6 is axially rotated.

[0039] The transport probe mechanism 6-2 is provided with a flexible micro multi-probe and a needle-entry cam mechanism, such as Figure 3As shown, the needle-feeding cam mechanism is provided with a rotating shaft 603 and a first rolling bearing 604, a top plate 605, a probe platform 606, a round wheel shaft 607 and a round wheel 608, a shoulder-limiting shaft 609 and a sliding bushing 610, and a reset spring 611; the two ends of the rotating shaft 603 are respectively concentrically matched with the first rolling bearing 604 embedded in the sample measurement platform 6 body, and its shaft body horizontally penetrates the sample measurement platform 6 body; the top plate 605 is embedded and fixed in the middle of the shaft body of the rotating shaft 603 near the side area, and the side surface is an arc surface, the plate surface 605a of the top plate 605 protrudes from the shaft body of the rotating shaft 603 in one direction, and its arc surface 605b It is concentric with and has the same diameter as the rotating shaft 603, and the surfaces of the two are tangential to each other for a smooth transition. A first gear is provided on the rotating shaft 603. The probe platform 606 is fixedly connected to the circular wheel shaft 607. Two circular wheels 608 are concentrically fitted at each end of the circular wheel shaft 607. The surfaces of the circular wheels 608 are always tangential to the surface of the top plate 605. The ends of the four shouldered limiting shafts 609 are threadedly connected to the four corners of the probe platform 606. After the shaft body and the sliding bushing 610 are concentrically fitted, the whole body vertically penetrates the sample measurement platform 6 and can slide vertically therein. A return spring 611 is installed between the shaft shoulder and the sample measurement platform 6 and is compressed by both.

[0040] like Figure 4 As shown, the motion equation of the height difference H between the center of the rotating shaft 603 and the upper surface of the probe platform 606 in the needle-entry cam mechanism and the rotation angle α of the top plate 605 is analyzed as follows:

[0041] H1=Rcos(α)

[0042] H2=Lsin(α)

[0043] H3=rcos(α)

[0044] H=H0+H1+H2+H3

[0045]

[0046]

[0047] Among them, H0 is the height difference between the upper surface of the probe platform 606 and the center of the circular wheel shaft 607; H1 is the height difference between the center of the circular wheel shaft 607 and the tangent point between the circular wheel 608 and the top plate 605; H2 is the height difference between the tangent point between the circular wheel 608 and the top plate 605 and the tangent point between the top plate 605 and the rotating shaft 603; H3 is the height difference between the tangent point between the top plate 605 and the rotating shaft 603 and the center of the rotating shaft 603; R is the radius of the circular wheel 608; r is the radius of the rotating shaft 603; L is the straight-line distance between the tangent point between the circular wheel 608 and the top plate 605 and the tangent point between the top plate 605 and the rotating shaft 603; L0 is the horizontal distance between the tangent point between the circular wheel 608 and the top plate 605 and the center of the rotating shaft. Therefore, when the rotation angle of the top plate 605 is Δα, the rising / falling height ΔH of the probe platform 606 is H(Δα), and then by driving the top plate 605 to rotate a specified angle, the needle insertion stroke can be quantitatively and accurately controlled.

[0048] The circular wheel 608 uses an ultra-high vacuum compatible oil-free bearing and can roll axially around the circular wheel shaft 607 to reduce the friction between the tangential surfaces of the top plate 605 and the circular wheel 608 when the top plate 605 drives the circular wheel 608 to rise and fall.

[0049] The shoulder limit shaft 609 and the sliding bushing 610 are made of ultra-high vacuum compatible materials with low friction coefficient, such as polytetrafluoroethylene, graphite, high-purity soft metal, etc., so that the shoulder limit shaft 609 can maintain smooth sliding.

[0050] The flexible micro multi-probe is provided with a circuit board 612 and eight flexible microprobes 613. The circuit board 612 is connected to the probe platform 606 by screws and has eight independent printed circuits 614 printed on it. The tips of the flexible microprobes 613 are cantilevered and suspended near the sample 8 and directly above the target sample electrode contact 8-1. The tips of all flexible microprobes 613 are coplanar, and the other ends are respectively connected to the conductive circuits on the circuit board by soldering. When the probe platform 606 descends to the lowest point, the tips of all flexible microprobes 613 simultaneously make contact with the corresponding electrode contacts 8-1 of the target sample.

[0051] The substrate of the circuit board 612 is made of an insulating material compatible with ultra-high vacuum, such as polyimide, ceramic, etc.;

[0052] The flexible microprobe 613 is made of ultra-high vacuum compatible plastic gold, beryllium copper, stainless steel and the like, and the diameter of the cantilever tip is 20 microns to achieve good flexibility of the probe tip.

[0053] The ultra-high vacuum integrated low-temperature transport measurement platform also includes a vacuum electrical connection mechanism, which is provided with an ultra-high vacuum electrical feedthrough 3-1 and an ultra-high vacuum cable 3-2. The ultra-high vacuum electrical feedthrough 3-1 is located at the vacuum external terminal 3-1a and is electrically connected to the vacuum internal terminal 3-1b. One end of the ultra-high vacuum cable 3-2 is connected to the vacuum internal terminal 3-1b by soldering, and the other end is connected to the printed circuit 614 on the circuit board 612 by soldering.

[0054] The ultra-high vacuum integrated low-temperature transport measurement platform also includes a probe drive mechanism, which is provided with an ultra-high vacuum rotary feedthrough 4-1, a coupling 4-2, a steel wire flexible shaft 4-3, a driven shaft 4-4 and a second rolling bearing 4-5, and a gear pair 4-6. The ultra-high vacuum rotary feedthrough 4-1 drives the shaft 4-1b located inside the vacuum to rotate through the handwheel 4-1a located outside the vacuum, and is successively connected to the steel wire flexible shaft 4-3 and the driven shaft 4-4 through the coupling 4-2; the driven shaft 4-4 is concentrically matched with the second rolling bearing 4-5 embedded in the body of the sample measurement platform 6, and a second gear is provided at one end of the driven shaft 4-4, and the first gear and the second gear are meshed to form a gear pair 4-6.

[0055] The ultra-high vacuum integrated low-temperature transport and measurement platform also includes a low-temperature connection mechanism, which is provided with a low-temperature cold head 5-1, a low-temperature tube 5-2, and a heat sink support 5-3. The low-temperature cold head 5-1 is connected to the vacuum external cold source; the low-temperature tube 5-2 is a hollow oxygen-free copper tube, one end of which is connected to the low-temperature cold head 5-1 by a screw, and the other end is connected to the docking fixture 6-3 by a screw; the heat sink support 5-3 is an oxygen-free copper sleeve, fixedly connected to the middle part of the low-temperature tube 5-2, and is provided with a cable channel 5-3a and a drive channel 5-3b, through which the ultra-high vacuum cable 3-2 and the steel wire flexible shaft 4-3 respectively pass.

[0056] like Figure 5 As shown, based on the structure of the ultra-high vacuum integrated low-temperature transport measurement platform, in an application example with coordinated control of optical, magnetic, and electric fields, the ultra-high vacuum in-situ low-temperature transport measurement under multi-field control is achieved by the following method:

[0057] The ultra-high vacuum integrated low-temperature transport measurement platform is sealedly connected to the ultra-high vacuum multi-dimensional translation stage 001 (with XYZ three-dimensional and axial rotational motion) through the docking flange position 2. In this embodiment, the ultra-high vacuum multi-dimensional translation stage 001 adopts an ultra-high vacuum four-dimensional translation stage with XYZ three-dimensional and axial rotational motion. The ultra-high vacuum multi-dimensional translation stage 001 is further sealedly connected to the ultra-high vacuum transport measurement cavity 002; the ultra-high vacuum transport measurement cavity 002 is sealedly connected to the magnetic field measurement cavity, and electromagnets 003 are respectively provided on both sides of the magnetic field measurement cavity, and an ultra-high vacuum optical window 004 is provided on the top of the magnetic field measurement cavity.

[0058] The sample measurement platform 6 is driven by the ultra-high vacuum multi-dimensional displacement platform 001 to move backward, so that the sample holder 6-1 is aligned with the vacuum interconnected sample transfer channel horizontally arranged on the ultra-high vacuum transport measurement cavity 002, and the flag-shaped sample holder 7 carrying the sample 8 is transferred from the specific ultra-high vacuum cavity through this channel using the ultra-high vacuum sample transfer rod; the sample measurement platform 6 continues to move backward into the measurement channel horizontally arranged backward on the ultra-high vacuum transport measurement cavity 002, and moves the sample 8 to the horizontal magnetic field area between the two magnetic poles of the electromagnet 003 and directly below the ultra-high vacuum optical window 004; the low-temperature flange position 5 is sealed with a vacuum external cold source (such as a liquid helium Dewar), and the low temperature is transferred to the sample measurement platform 6 through the low-temperature cold head 5-1 and the low-temperature conduit 5-2 to achieve the target low temperature condition of <10K.

[0059] By rotating the ultra-high vacuum rotary feedthrough 4-1, the torque is transmitted to the top plate 605 through the coupling 4-2, the steel wire flexible shaft 4-3, the driven shaft 4-4, the gear pair 4-6, and the rotating shaft 603, and the rotation is converted into a vertical lifting motion of the probe platform 606 through the circular wheel 608 and the shoulder limit shaft 609, thereby driving the flexible microprobe 613 to move downward and establish an electrical connection with the sample electrode contact 8-1. Its electrical transmission signal is output to the transport measurement source meter outside the vacuum through the flexible microprobe 613, the printed circuit 614, the ultra-high vacuum cable 3-2, and the ultra-high vacuum electrical feedthrough 3-1. At this time, the magnetic field control is applied to the sample through the electromagnet 003, the optical control is applied to the sample through the ultra-high vacuum optical window 004, and the ultra-high vacuum multi-dimensional translation stage 001 is used to change the interaction angle between the sample and the external field, thereby realizing ultra-high vacuum in-situ low-temperature transport measurement under the coordinated control of light, magnetism, and electric fields.

[0060] It is worth mentioning that the coordinated control of magnetic, optical and electric fields is only an application example of the present invention. According to the needs of research and application, the present invention can also be combined with various other external fields and surface modification and other physical property control means to achieve ultra-high vacuum in-situ transport measurements under richer external field coordinated control. For example, thanks to the characteristics of the present invention that it will not block the core area of the sample, is easy to dock with the vacuum system and is adaptable to multi-dimensional displacement, the present invention can be docked with an ultra-high vacuum scanning probe microscope system, and can synchronously measure the changes in its transport properties when the scanning probe is used to manipulate atoms on the sample surface, apply stress fields, apply local electric fields, etc.; the present invention can be docked with an ultra-high vacuum molecular beam epitaxy system, and can monitor the relationship between process indicators such as film thickness and deposition rate and the electrical properties of the sample in real time during thin film deposition; the present invention can be docked with an ultra-high vacuum ion implantation system, and can in situ study the effects of the type and amount of injected doping elements on the transport properties of the sample.

[0061] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0062] It should be understood that the above description is for illustrative purposes only and is not intended to be limiting. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but rather with reference to the preceding claims and the full scope of equivalents to which such claims are entitled. For the purpose of completeness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the preceding claims is not a disclaimer of such subject matter, nor should it be considered that the applicants did not consider such subject matter to be part of the disclosed inventive subject matter.

Claims

1. An ultra-high vacuum sample stage, characterized in that: It includes a sample measurement platform (6) and a probe platform (606); The probe platform (606) is arranged above one side of the front end of the sample measuring platform (6), and a sample (8) is arranged on the other side of the front end of the sample measuring platform (6); The bottom of the probe platform (606) adopts a plurality of shoulder-limiting shafts (609) passing through the sample measuring platform (6), the shoulder-limiting shafts (609) are slidably connected to the sample measuring platform (6), the shoulders of the shoulder-limiting shafts (609) are located below the sample measuring platform (6), and an elastic component is provided between the shoulder and the bottom of the sample measuring platform (6), and the elastic component always gives the probe platform (606) and the sample measuring platform (6) a force to approach each other; The sample measuring platform (6) is located in a hollow area directly below the center of the probe platform (606). A rotating shaft (603) is rotatably connected between two side walls of the hollow area of the sample measuring platform (6). A cam mechanism is provided on the rotating shaft (603), and the cam mechanism contacts the bottom center of the probe platform (606). The probe platform (606) is provided with a circuit board (612), and a plurality of flexible microprobes (613) are provided on the circuit board (612). The needle tips of the flexible microprobes (613) extend from the probe platform (606) and extend toward the top surface of the sample (8) below. When the probe platform (606) is at the lowest point, the tip of the flexible microprobe (613) contacts the top of the sample (8); The cam mechanism includes a top plate (605), which is nested on the rotating shaft (603) near the side area, and the side area is an arc surface; a circular wheel (608) is connected to the center of the bottom of the probe platform (606), and the top surface of the top plate (605) contacts the bottom of the circumference of the circular wheel (608); A protrusion is provided at the center of the bottom of the probe platform (606), the bottom of the protrusion is connected to a circular wheel shaft (607), a circular wheel (608) is rotatably connected to the circular wheel shaft (607), and the bottom of the circumference of the circular wheel (608) contacts the top surface of the top plate (605).

2. The ultra-high vacuum sample stage according to claim 1, characterized in that: The material of the flexible microprobe (613) is gold, beryllium copper or stainless steel.

3. The ultra-high vacuum sample stage according to claim 1, characterized in that: A sample holder slot (601) is provided on one side of the sample measuring platform (6) where the sample is provided. A flag-shaped sample holder (7) is slidably connected in the sample holder slot (601). A fixing device for fixing the flag-shaped sample holder (7) is provided on the sample measuring platform (6).

4. The ultra-high vacuum sample stage according to claim 3, characterized in that: The fixing device adopts an elastic sample fixing pressing piece (602), one end of which is fixed on the sample measuring table (6) and the other end is pressed on the top surface of the flag-shaped sample holder (7).

5. An ultra-high vacuum integrated low-temperature transport measurement platform, characterized in that: Including ultra-high vacuum cross-connect (1); The four channels of the ultra-high vacuum four-way (1) are respectively sealed and connected with a vacuum electrical connection mechanism, a probe driving mechanism, a vacuum external cold source and an output end of the ultra-high vacuum multi-dimensional displacement stage, and the ultra-high vacuum four-way (1) is provided with an ultra-high vacuum sample stage according to any one of claims 1 to 4; The vacuum electrical connection mechanism is connected to the circuit board (612), and the output end of the probe drive mechanism is connected to the rotating shaft (603).

6. The ultra-high vacuum integrated low-temperature transport measurement platform according to claim 5, characterized in that: The probe drive mechanism comprises a vacuum outer hand wheel (4-1a), a vacuum inner shaft (4-1b), a coupling (4-2), a steel wire flexible shaft (4-3), a driven shaft (4-4) and a second gear which are connected in sequence; a first gear is provided on the rotating shaft (603); the first gear and the second gear are meshed to form a gear pair (4-6).

7. The ultra-high vacuum integrated low-temperature transport measurement platform according to claim 5, characterized in that: The rear end of the sample measuring platform (6) is sequentially connected to a docking fixture (6-3), a cryogenic conduit (5-2) and a cryogenic cold head (5-1), and the cryogenic cold head (5-1) is connected to a vacuum external cooling source.

8. The ultra-high vacuum integrated low-temperature transport measurement platform according to claim 7, characterized in that: A heat sink support (5-3) is nested on the cryogenic catheter (5-2), a cable channel (5-3a) is provided on the heat sink support (5-3), and the vacuum electrical connection mechanism comprises an ultra-high vacuum cable (3-2), which passes through the cable channel (5-3a) and is connected to the circuit board (612).

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