Power modules and frequency converters

Abstract

This application relates to a power module and a frequency converter. The power module includes a frame and a power module mounted on the frame. The power module also includes a heat exchanger disposed on the frame, having a first side and a second side disposed opposite to each other along a first direction. The power module includes a diode unit and an IGBT unit, with the diode unit disposed on the first side of the heat exchanger and the IGBT unit disposed on the second side. The heat exchanger is configured to perform heat exchange between the diode unit and the IGBT unit using a cooling liquid. By disposing of the diode unit and the IGBT unit in the power module on the first and second sides of the heat exchanger, respectively, this application enables simultaneous heat exchange between the diode unit and the IGBT unit using the heat exchanger, thereby improving heat exchange efficiency. Furthermore, since the heat exchanger uses a cooling liquid for heat exchange, it can further improve heat exchange efficiency with a smaller volume, thus improving the protection level.

Description

Technical Field

[0001] This application relates to the field of frequency converter technology, and in particular to power modules and frequency converters. Background Technology

[0002] A frequency converter is a power control device that uses frequency conversion technology and microelectronics to control an AC motor by changing the frequency of the motor's power supply. Most frequency converters in this field use air cooling for heat dissipation; however, as the power rating of frequency converters continues to increase, the heat exchange efficiency of air cooling is relatively low and cannot meet the demands of actual operating conditions. Summary of the Invention

[0003] Based on this, a power module and frequency converter that can improve heat exchange efficiency are provided to adapt to higher capacity frequency converters and meet the heat dissipation requirements of frequency converters.

[0004] One aspect of this application provides a power module, including a frame and a power module mounted on the frame;

[0005] The power module further includes a heat exchanger disposed on the frame, the heat exchanger having a first side and a second side disposed opposite to each other along a first direction;

[0006] The power module includes diode units and IGBT units;

[0007] A diode unit is disposed on the first side of the heat exchanger; and

[0008] An IGBT unit is disposed on the second side of the heat exchanger;

[0009] The heat exchanger is configured to exchange heat between the diode unit and the IGBT unit using a cooling liquid.

[0010] In one embodiment, the IGBT unit is configured as a surface-mount structure.

[0011] In one embodiment, the diode unit is configured as a surface-mount structure.

[0012] In one embodiment, the power module further includes a supporting capacitor;

[0013] The frame has an accommodating space, and the supporting capacitor is mounted on the frame and located within the accommodating space.

[0014] In one embodiment, the supporting capacitor has a body portion and a connecting portion;

[0015] The connecting portion is provided on the body portion along the second direction to connect with the frame;

[0016] The second direction is perpendicular to the first direction.

[0017] In one embodiment, the power module further includes a capacitor busbar; the capacitor busbar is electrically connected to the supporting capacitor;

[0018] Here, a plane perpendicular to the second direction is defined as a reference plane, and the positive and negative busbars of the capacitors are symmetrically arranged with the reference plane as the center.

[0019] The second direction is perpendicular to the first direction.

[0020] In one embodiment, the power module further includes a DC connection bus;

[0021] The DC connection is electrically connected between the diode unit and the capacitor busbar.

[0022] In one embodiment, the power module further includes a DC connection bus;

[0023] The DC connection is electrically connected between the IGBT unit and the capacitor busbar.

[0024] In one embodiment, the power module further includes a housing;

[0025] The housing is disposed over the power module along the first direction and is connected to the frame.

[0026] In another aspect of this application, a frequency converter is also provided, including the power module described above.

[0027] The aforementioned power module and frequency converter, wherein the power module includes at least a frame, a power module, and a heat exchanger. By placing the diode unit and IGBT unit in the power module on the first and second sides of the heat exchanger respectively, heat exchange between the diode unit and the IGBT unit can be performed simultaneously by means of the heat exchanger, thereby improving heat exchange efficiency. Moreover, the heat exchanger uses a cooling liquid for heat exchange, which can further improve heat exchange efficiency with a smaller volume and improve the protection level. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a power module according to an embodiment of this application from one perspective;

[0029] Figure 2 This is a schematic diagram of the structure of a power module according to an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the power module of one embodiment of this application from another perspective.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100. Power module; 110. Frame; 111. Upper beam; 120. Power module; 121. Diode unit; 122. IGBT unit; 130. Heat exchanger; 131. First side; 132. Second side; 140. Support capacitor; 141. Terminal block; 150. Capacitor busbar; 160. DC connection busbar; 165. Unit output busbar; 170. Housing; 180. Drive module; 190. Output copper busbar; x, First direction; z, Second direction. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0039] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0040] To facilitate understanding of the technical solution of this application, before proceeding with a detailed explanation, the power module and frequency converter in the relevant technologies will be described first.

[0041] A variable-frequency drive (VFD) is a power control device that uses frequency conversion technology and microelectronics to control an AC motor by changing the frequency of its power supply. Medium and high-voltage power units are used in fields requiring energy conservation and improved production processes, such as power, metallurgy, water supply, petroleum, chemical, and coal industries. Since the 1980s, VFD technology has been widely adopted as an energy-saving technology in major industrialized countries. In China, high-voltage VFDs began to be used in a few industries such as power and metallurgy in the late 1990s. Currently, high-voltage VFD speed control has become the mainstream speed control method for high-voltage AC motors. The energy-saving effects of using high-voltage VFD systems in new projects and technological upgrading projects are significant, with substantial progress made in power, reliability, efficiency, and cost.

[0042] As the power of power electronic devices continues to increase and the capacity of frequency converters continues to improve, the design of their heat dissipation systems has become a critical issue. The quality of the frequency converter's heat dissipation system design directly affects whether the frequency converter can operate safely and stably for extended periods. Most of the heat generated by a frequency converter comes from its power devices, which are inherently sensitive to temperature changes. For example, as the power dissipation of IGBTs increases, if the heat dissipation system is insufficient, the chip temperature may reach or even exceed the junction temperature, leading to IGBT failure.

[0043] Among them, IGBT (Insulated Gate Bipolar Transistor) is a composite semiconductor device composed of MOSFET (Insulated Gate Field Effect Transistor) and BJT (Bipolar Junction Transistor). As the core of the inverter's main circuit, the selection of power switching devices is particularly important. Due to its advantages such as high input impedance, high operating speed, low on-state voltage drop, strong current carrying capacity, and ease of driving, IGBT has been widely used and is a relatively ideal fully controllable device. The turn-on and turn-off of the IGBT are controlled by the gate voltage. When a positive voltage is applied to the gate, a channel is formed in the MOSFET, providing base current to the PNP transistor, thereby turning on the IGBT. + Injecting the region into N - The number of holes (minority carriers) in the region paired with N - The N-region is modulated to reduce its resistance, enabling the IGBT with a high blocking voltage to have a low on-state voltage drop. When a negative voltage is applied to the gate, the channel in the MOSFET disappears, the base current of the PNP transistor is cut off, and the IGBT is turned off.

[0044] The heat dissipation methods in related technologies mostly employ air cooling. However, with the increasing integration of power modules and the continuous improvement of power levels, traditional air cooling faces the challenge of quickly dissipating large amounts of heat within limited space. Furthermore, high-power devices require relatively large fans, leading to increased noise, dust, and air pressure, thus reducing system stability. Therefore, traditional forced air cooling is increasingly unable to meet the heat dissipation requirements of high-power IGBT modules. Air-cooled inverters in related technologies generally have a capacity of less than 17MW, making it difficult to meet the operating conditions of inverters with capacities exceeding 17MW.

[0045] The inventors discovered that water has a high specific heat capacity, and water-cooled radiators are relatively small and quiet. Furthermore, water's thermal conductivity is much higher than that of air. Therefore, it is necessary to propose a power module and frequency converter that can improve heat dissipation using water cooling.

[0046] For ease of description, the accompanying drawings only show structures relevant to embodiments of this application.

[0047] Figure 1 This is a schematic diagram of the power module 100 from one perspective in one embodiment of the present application;

[0048] Figure 2 A schematic diagram of the power module 120 in one embodiment of this application is shown.

[0049] See Figure 1 and combined Figure 2 An embodiment of this application provides a power module 100, including a frame 110 and a power module 120 mounted on the frame 110. The power module 100 also includes a heat exchanger 130 disposed on the frame 110, the heat exchanger 130 having a first side 131 and a second side 132 disposed opposite each other along a first direction x. The power module 120 includes a diode unit 121 and an IGBT unit 122, the diode unit 121 being disposed on the first side 131 of the heat exchanger 130 and the IGBT unit 122 being disposed on the second side 132 of the heat exchanger 130. The heat exchanger 130 is configured to exchange heat between the diode unit 121 and the IGBT unit 122 using a cooling liquid.

[0050] The power module 100, by placing the diode unit 121 and IGBT unit 122 from the power module 120 on the first side 131 and the second side 132 of the heat exchanger 130 respectively, can simultaneously exchange heat between the diode unit 121 and the IGBT unit 122 via the heat exchanger 130, thereby improving heat exchange efficiency. Furthermore, since the heat exchanger 130 uses a cooling liquid for heat exchange, it can further improve heat exchange efficiency with a smaller volume, thus enhancing the protection level.

[0051] It should be noted that the IGBT units 122 are combined to form an inverter circuit, and the diode units 121 are combined to form a rectifier circuit. This rectifier-inverter electrical structure not only optimizes the size and improves heat dissipation efficiency but also reduces costs. In the embodiments of this application, the power module 120 consists of two IGBT units 122 and three diode units 121. Exemplarily, the heat exchanger 130 is a water-cooled radiator.

[0052] like Figure 2 As shown, in some embodiments, the IGBT unit 122 is configured as a surface-mount structure. A surface-mount structure is a power semiconductor device structure using a surface-mount package. When installed, the surface-mount IGBT unit 122 is mounted on the side surface of the heat exchanger 130, with the IGBT unit 122 in close contact with the side surface of the heat exchanger 130. Understandably, the body of the IGBT unit 122 remains in contact with the side surface of the heat exchanger 130, without any gaps or distance, greatly improving heat exchange efficiency. Simultaneously, devices using surface-mount packaging generally have a smaller volume, further reducing the size of the power module 120. Exemplarily, the IGBT unit 122 is fixed to the second side 132 of the heat exchanger 130 by a bolt assembly.

[0053] like Figure 2 As shown, in some embodiments, the diode unit 121 is configured as a surface-mount structure. A surface-mount structure is a power semiconductor device structure using a surface-mount package. When installed, the surface-mount diode unit 121 is mounted on the side surface of the heat exchanger 130, with the diode unit 121 in close contact with the side surface of the heat exchanger 130. Understandably, the body of the diode unit 121 remains in contact with the side surface of the heat exchanger 130, without any gaps or distances, significantly improving heat exchange efficiency. Simultaneously, devices using surface-mount packaging generally have a smaller size, further reducing the size of the power module 120. Exemplarily, the diode unit 121 is fixed to the first side 131 of the heat exchanger 130 by a bolt assembly.

[0054] Figure 3 This is a schematic diagram of the power module 100 from another perspective in one embodiment of the present application.

[0055] Combination Figure 1 and Figure 3As shown, in some embodiments, the power module 100 further includes a supporting capacitor 140. The frame 110 has an accommodating space, and the supporting capacitor 140 is mounted on the frame 110 and located within the accommodating space. Thus, fixing the supporting capacitor 140 within the accommodating space on the frame 110 not only makes the installation more stable but also makes reasonable use of the space of the frame 110, making the entire power module 100 more compact and the component layout more rational. Specifically, in some embodiments, the supporting capacitor 140 has a body portion and a connecting portion. The connecting portion is disposed along a second direction z on the body portion to connect with the frame 110. The second direction z is perpendicular to the first direction x. Thus, by using the connecting portion disposed along the second direction z on the body portion, it can be more reliably fixed to the frame 110 without damaging the body portion of the supporting capacitor 140. Specifically, there are two connecting portions, which are respectively disposed at intervals at both ends of the body portion along the second direction z. Thus, the supporting capacitor 140 can be fixed in the second direction z by means of two connecting portions, further ensuring the stability of the fixation. For example, the connecting parts are fixed to the frame 110 by means of bolt assemblies. Specifically, multiple connecting parts are fixedly connected to the upper beam 111 and the lower beam of the frame 110, respectively.

[0056] like Figure 3 As shown, in some embodiments, the power module 100 further includes a capacitor busbar 150, which is electrically connected to the supporting capacitor 140. A plane perpendicular to the second direction z is defined as a reference plane, and the positive and negative busbars of the capacitor busbar 150 are symmetrically arranged around the reference plane. The second direction z is perpendicular to the first direction x. Understandably, the positive and negative busbars of the capacitor busbar 150 are arranged with one positive and one negative. This ensures electrical safety distance while making the structural layout of the positive and negative busbars of the capacitor busbar 150 more compact and reasonable, thereby further reducing the size of the power module 100. Specifically, the supporting capacitor 140 has protruding terminals 141, and the positive and negative busbars of the capacitor busbar 150 are respectively mounted on the terminals 141.

[0057] For the IGBT 122 dynamic parameter test platform, the stray inductance of the commutation circuit during the device's switching transients, often simply referred to as the test platform stray inductance, is a crucial factor affecting device parameters. Different stray inductances have a significant impact on the IGBT 122's turn-on and turn-off characteristics. Under the same operating conditions, an increase in the circuit stray inductance will slow down the IGBT 122's turn-on speed, reduce the collector current rise rate, significantly decrease the turn-on transient current spike, and reduce current unevenness. For example... Figure 3As shown, in some embodiments, the power module 120 further includes a DC connection bus 160 electrically connected between the IGBT unit 122 and the capacitor bus 150. Thus, by stacking the DC connection buses 160 vertically, the current flows overlap and are opposite, ensuring that the stray inductance meets the requirements, and also providing more suitable operating space. Specifically, the IGBT unit 122 is electrically connected to the capacitor bus 150 via a set of positive and negative DC connection buses 160. In some embodiments, the power module 120 further includes a DC connection bus 160 electrically connected between the diode unit 121 and the capacitor bus 150. This further ensures that the stray inductance meets the requirements. Specifically, the diode unit 121 is electrically connected to the capacitor bus 150 via a set of positive and negative DC connection buses 160.

[0058] It should be noted that the DC connection bus 160 is used for internal connection of the power module 120. The power module 100 also includes an AC connection bus and a unit output bus 165, which are used for connection with external devices. Specifically, after the IGBT unit 122 and diode unit 121 are installed on the heat exchanger 130, the DC connection bus 160, AC connection bus, and unit output bus 165 are installed. This satisfies the current-carrying load, has a smaller stray inductance, more reliable insulation, and relatively lower cost. Furthermore, the power module 100 also includes an output copper bus 190, which is connected to the unit output bus 165.

[0059] Please refer to it again. Figure 1 In some embodiments, the power module 100 further includes a housing 170. The housing 170 covers the power module 120 along a first direction x and is connected to the frame 110. Thus, the housing 170 provides protection for the power module 120, and by housing the power module 120 within the space between the housing 170 and the frame 110, the power module 100 becomes modular, making efficient use of space, reducing size, and facilitating maintenance and repair. Furthermore, a heat exchanger 130 is also housed between the housing 170 and the frame 110. This ensures reliable heat dissipation for the IGBT unit 122 and the diode unit 121 by the heat exchanger 130, while also making efficient use of the space within the housing 170, further reducing the size of the power module 100.

[0060] The drive module 180 serves as the interface between the controller and the power devices, providing isolation, reliable drive capability, and protection functions. The high-performance drive module 180 not only enables the IGBT unit 122 to quickly switch between the cutoff and saturation regions, improving the efficiency of the power electronic converter system, but also allows the IGBT unit 122 to promptly exit the fault state when it fails, reducing damage to the IGBT unit 122 and thus extending its service life. Figure 3 As shown, in some embodiments, the power module 100 further includes a drive module 180, which is configured to drive the IGBT unit 122 to turn on and off. Specifically, the drive module 180 is mounted on the frame 110 by means of a bolt assembly. It should be noted that the modules and units in the power module 100 are connected by means of copper busbars.

[0061] Based on the same inventive concept, another aspect of this application provides a frequency converter, including the aforementioned power module 100. The frequency converter primarily improves the flexibility of AC motor power supply, i.e., it can change the frequency and amplitude, thus changing the period of the moving magnetic field and achieving smooth control of the motor speed. The frequency converter mainly includes a rectifier circuit, intermediate circuit, inverter circuit, control circuit, and protection circuit. The IGBT unit 122 is the core component of the frequency converter, and its main function is to invert DC to AC for the load. The power module 100 provided in this embodiment, by utilizing a heat exchanger 130 to simultaneously dissipate heat from both the IGBT unit 122 and the diode unit 121, significantly improves the heat dissipation efficiency of the power module 100. Consequently, the frequency converter using the aforementioned power module 100 also achieves improved heat dissipation efficiency, meeting the frequency converter's heat dissipation requirements.

[0062] Combination Figures 1 to 3 As shown in the embodiments of this application, the power module 100 and inverter are provided. The power module 100, by placing the diode unit 121 and IGBT unit 122 from the power module 120 on the first side 131 and the second side 132 of the heat exchanger 130 respectively, can simultaneously exchange heat between the diode unit 121 and the IGBT unit 122 via the heat exchanger 130, thereby improving heat exchange efficiency, increasing power density, and optimizing circuit allocation. Furthermore, the heat exchanger 130 utilizes a cooling liquid for heat exchange, further improving heat exchange efficiency and enhancing protection levels with a smaller volume. It should be noted that the IGBT unit 122 is combined to form an inverter circuit, and the diode unit 121 is combined to form a rectifier circuit. This rectifier-inverter electrical structure not only optimizes the size and improves heat dissipation efficiency but also reduces costs.

[0063] The surface-mount IGBT unit 122 and diode unit 121 maintain contact with the side surface of the heat exchanger 130, eliminating gaps and distances and significantly improving heat exchange efficiency. Simultaneously, surface-mount devices generally have a smaller size, further reducing the size of the power module 120. The connection portion of the supporting capacitor 140 can be more reliably fixed to the frame 110 without damaging the body of the supporting capacitor 140. The positive and negative busbars of the capacitor busbar 150 are arranged with one positive and one negative, ensuring electrical safety distances while making the structural layout of the positive and negative busbars of the capacitor busbar 150 more compact and rational, further reducing the size of the power module 100. The IGBT unit 122 is electrically connected to the capacitor busbar 150 via a set of positive and negative DC busbars 160, and the diode unit 121 is electrically connected to the capacitor busbar 150 via another set of positive and negative DC busbars 160. The current flows overlap and are opposite, which ensures that the stray inductance meets the requirements and that the operating space is more suitable. The housing 170, which covers the power module 120 along the first direction x, provides protection for the power module 120.

[0064] The space between the housing 170 and the frame 110, as well as the accommodating space of the frame 110 itself, allows for the planning and layout of the installation of other modular components such as the power module 120 and the heat exchanger 130. This modularity of the power module 100 allows for independent installation, disassembly, and maintenance of each module, resulting in a more aesthetically pleasing design, efficient use of space, reduced size, and easier maintenance and repair. Inverters using the aforementioned power module 100 also exhibit improved heat dissipation efficiency, meeting the inverter's cooling requirements.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A power module, characterized in that, Includes a frame and a power module mounted on the frame; The power module further includes a heat exchanger disposed on the frame, the heat exchanger having a first side and a second side disposed opposite to each other along a first direction; The power module includes diode units and IGBT units; A diode unit is disposed on the first side of the heat exchanger. The diode unit is constructed as a surface mount structure, and the diode unit is in close contact with the side surface of the heat exchanger. An IGBT unit is disposed on the second side of the heat exchanger. The IGBT unit is constructed as a surface mount structure. The surface mount IGBT unit is disposed on the side surface of the heat exchanger by a mounting method, and the IGBT unit and the side surface of the heat exchanger are in close contact. The heat exchanger is configured to exchange heat between the diode unit and the IGBT unit using a cooling liquid. The power module further includes a supporting capacitor; the frame has an accommodating space, the supporting capacitor is mounted on the frame and located within the accommodating space; the supporting capacitor has a body portion and two connecting portions; the two connecting portions are spaced apart from each other at both ends of the body portion along a second direction to connect with the frame; the second direction is perpendicular to the first direction; The power module further includes a capacitor busbar; the capacitor busbar is electrically connected to the supporting capacitor; wherein, a plane perpendicular to the second direction is defined as a reference plane, and the positive and negative busbars of the capacitor busbar are symmetrically arranged with the reference plane as the center; the second direction is perpendicular to the first direction; the IGBT unit is electrically connected to the capacitor busbar through a set of positive and negative DC connection bars, and the diode unit is electrically connected to the capacitor busbar through a set of positive and negative DC connection bars.

2. The power module according to claim 1, characterized in that, The connecting parts are fixedly connected to the upper beam and the lower beam of the frame, respectively.

3. The power module according to claim 1, characterized in that, The supporting capacitor has protruding terminals, and the positive and negative terminals of the capacitor busbar are respectively mounted on the terminals.

4. The power module according to claim 1, characterized in that, The power module also includes an AC connection bus and a unit output bus, which are used to connect and conduct with external devices.

5. The power module according to claim 4, characterized in that, The power module also includes an output copper busbar, which is connected to the unit output busbar.

6. The power module according to claim 1, characterized in that, The power module also includes a drive module configured to drive the IGBT unit to turn on and off.

7. The power module according to any one of claims 1, characterized in that, The power module also includes a housing; The housing is disposed over the power module along the first direction and is connected to the frame.

8. A frequency converter, characterized in that, Includes the power module as described in any one of claims 1-7.

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