Wave soldering equipment with high tin spraying accuracy

Abstract

The present invention relates to a wave soldering device with high tin spraying precision, wherein a conveying device of the wave soldering device with high tin spraying precision conveys a circuit board to be soldered, a flux spraying device sprays flux, and a heating device heats the soldering part of the circuit board to a wetting temperature. A plurality of tin expansion bars are arranged on a wave tin spraying plate in a slanting manner along the length direction of the wave tin spraying plate, and a gap is arranged between two adjacent tin expansion bars. At least one first nozzle is arranged on the tin expansion bar, and a gap is arranged between the upper surface of the tin expansion bar and the lower surface of the circuit board. When tin liquid is sprayed on the circuit board, the tin liquid contacts the pad surface at the bottom of the circuit board and the upper surface of the tin expansion bar. During the conveying process, the tin expansion bar has a pulling effect on the sprayed tin liquid along the conveying direction, so that the sprayed tin liquid diffuses along the length direction of the tin expansion bar, thereby improving the uniformity of spraying, the coverage area and the quality of spraying.

Description

Technical Field

[0001] The invention relates to the field of PCBA through-hole soldering equipment, and in particular to a wave soldering equipment with high tin spraying accuracy. Background Art

[0002] In the field of component welding processing of circuit boards, two methods are usually used: reflow soldering and wave soldering. Wave soldering is a process technology that uses pump pressure to form a solder wave of a specific shape on the surface of molten liquid solder. When the assembly with components inserted passes through the solder wave at a certain angle, a solder joint is formed in the pin soldering area. In the prior art, the nozzle of the tin spraying equipment can only cover the spraying area of ​​the circuit board along the conveying direction. The area between two adjacent nozzles on both sides of the circuit board along the conveying direction is prone to leakage, resulting in low welding accuracy.

[0003] Therefore, it is necessary to provide a wave soldering equipment with high tin spraying accuracy to solve the above problems. Summary of the invention

[0004] The invention relates to a wave soldering device with high tin spraying precision. The wave soldering device with high tin spraying precision arranges a tin expansion bar obliquely so that the tin liquid sprayed from the first nozzle on the tin expansion bar can be sprayed more evenly along the conveying direction on the circuit board. Then, during the conveying process, the tin expansion bar has a pulling effect on the sprayed tin liquid along the conveying direction, so that the sprayed tin liquid diffuses along the length direction of the tin expansion bar, thereby improving the uniformity of spraying and the coverage area, significantly improving the quality of spraying, thereby improving the precision of welding, and solving the problem in the prior art that the tin spraying device easily leaks spray in the area between two adjacent nozzles on both sides of the circuit board along the conveying direction, resulting in low welding precision.

[0005] To solve the above problems, the present invention provides a wave soldering device with high tin spraying accuracy, comprising:

[0006] A conveying device, the conveying device is used to convey the circuit board to be soldered;

[0007] A flux spraying device, which is arranged at one end of the conveying device and is used for spraying flux;

[0008] A heating device, which is arranged on the conveying device and is used to heat the soldering part of the circuit board sprayed with solder flux to a wetting temperature;

[0009] A tin spraying device, the tin spraying device comprises a base and a tin spraying unit, the base is arranged below the conveying device; the tin spraying unit comprises a wave tin spraying plate and a plurality of tin expansion strips; the wave tin spraying plate is arranged on the base, and the wave tin spraying plate is arranged as a long plate-shaped structure; a plurality of tin expansion strips are arranged on the wave tin spraying plate in sequence along the length direction of the wave tin spraying plate, and are located on the side of the wave tin spraying plate facing the circuit board, and a gap is arranged between two adjacent tin expansion strips; at least one first nozzle is arranged on the tin expansion strip, and the first nozzle is used to spray tin liquid; a gap is arranged between the upper surface of the tin expansion strip and the lower surface of the circuit board, and when tin liquid is sprayed on the circuit board, the tin expansion strip is used to diffuse the tin liquid on the circuit board along the length direction of the tin expansion strip; and,

[0010] A cooling device is arranged at the discharge end of the conveying device and is used for cooling the circuit board.

[0011] Furthermore, the tin expansion strip is configured as a strip structure, and the tin expansion strip is provided with three first nozzles along its length direction to improve the spraying efficiency. The distance between two adjacent first nozzles on each tin expansion strip is the same, and the distribution is uniform, so the spraying is uniform.

[0012] Furthermore, the inclination angle of the tin expansion strip relative to the length direction of the first wave tin spraying plate is set to 60°-70°, thereby increasing the coverage area and saving costs.

[0013] Furthermore, a plurality of the tin expansion strips are arranged in parallel, and the distance between two adjacent tin expansion strips is set to be the same, so that the spraying is uniform and the precision of the tin spraying is improved. The ratio of the distance between two adjacent tin expansion strips to the distance between the diameters of the first nozzles is between 1 / 3 and 3 / 4, so that the nozzles of two adjacent tin expansion strips overlap, so that every position of the circuit board can be sprayed.

[0014] Furthermore, the tin spray unit also includes two second nozzles, and a second nozzle is provided on the side opposite to the outermost tin expansion strips at both ends of the wave tin spray plate, and the second nozzle is located on the side of the end of the tin expansion strip farthest from the wave tin spray plate, thereby increasing the tin spray coverage area and thus improving the accuracy of tin spraying.

[0015] Furthermore, the flux spraying device includes a liquid storage tank, a nozzle unit and a collecting unit. The liquid storage tank is arranged below the conveying device, and the liquid storage tank is used to store the flux. The nozzle unit is movably arranged in the liquid storage tank, and the nozzle unit is used to spray the flux onto the circuit board. The collecting unit includes a liquid collecting bin, a first cooling plate, a second cooling plate and a top cover. The liquid collecting bin is arranged above the conveying device, and a liquid collecting tank is arranged in the liquid collecting bin. The first cooling plate and the second cooling plate are arranged vertically inclined, and the distance between the lower end of the first cooling plate and the lower end of the second cooling plate is greater than the distance between the upper end of the first cooling plate and the upper end of the second cooling plate. The lower ends of the first cooling plate and the second cooling plate are both arranged in the liquid collecting tank. One side of the top cover is connected to the upper end of the first cooling plate, and the other side of the top cover is connected to the upper end of the second cooling plate. The circuit board to be sprayed is located in the area enclosed by the first cooling plate and the second cooling plate. The first cooling plate, the second cooling plate and the top cover are used to liquefy excess flux and introduce it into the liquid collecting tank, which reduces the loss of consumables, significantly reduces costs, is beneficial to environmental protection, and can also save cleaning costs.

[0016] Furthermore, the top cover includes a third cooling plate and two fourth cooling plates, the third cooling plate is set to an inverted V-shaped structure, one side of the third cooling plate is connected to the upper end of the first cooling plate, and the other side of the third cooling plate is connected to the upper end of the second cooling plate, so as to improve the collection efficiency. The other two sides of the third cooling plate are each provided with a fourth cooling plate, and the fourth cooling plate is set to a triangular structure to improve the structural stability.

[0017] Further, the upper end of the first cooling plate is provided with a plurality of first connecting columns, which are spaced apart on the outer side of the upper end of the first cooling plate, and one side of the third cooling plate is connected to the first cooling plate through the first connecting columns and screws. The upper end of the second cooling plate is provided with a plurality of second connecting columns, which are spaced apart on the outer side of the upper end of the second cooling plate, and the other side of the third cooling plate is connected to the second cooling plate through the second connecting columns and screws. The inner side surface of the third cooling plate and the outer side surfaces of the first cooling plate and the second cooling plate are all provided with gaps to facilitate the collected flux to flow into the liquid collecting tank.

[0018] Furthermore, the top cover also includes a fifth cooling plate and a sixth cooling plate. The fifth cooling plate is arranged between the first cooling plate and the third cooling plate, and the sixth cooling plate is arranged between the second cooling plate and the third cooling plate. The inner side surface of the lower end of the fifth cooling plate is connected to the outer side surface of the upper end of the first cooling plate, and the outer side surface of the upper end of the fifth cooling plate is connected to the inner side surface of one side of the third cooling plate. The inner side surface of the lower end of the sixth cooling plate is connected to the outer side surface of the upper end of the second cooling plate, and the outer side surface of the upper end of the sixth cooling plate is connected to the inner side surface of the other side of the third cooling plate, thereby increasing the collection space, allowing the flux to be collected as completely as possible, and saving costs.

[0019] Furthermore, the liquid collecting bin includes a protective shell, a first liquid collecting plate and a second liquid collecting plate. The first liquid collecting plate is arranged below the first cooling plate, and the second liquid collecting plate is arranged below the second cooling plate. The first liquid collecting plate and the second liquid collecting plate are arranged in the same structure. The first liquid collecting plate includes a first side plate, a second side plate and a liquid collecting bottom plate, the first side plate is vertically arranged on one side of the liquid collecting bottom plate, the second side plate is vertically arranged on the other side of the liquid collecting bottom plate, and the first side plate is arranged parallel to the second side plate. The length of the first side plate is greater than the length of the second side plate, and the area enclosed by the first side plate, the second side plate and the liquid collecting bottom plate is the liquid collecting tank, which has a simple structure and is easy to install and disassemble. The protective shell cover is arranged on the periphery of the first liquid collecting plate and the second liquid collecting plate.

[0020] The present invention adopts the above-mentioned wave soldering equipment with high tin spraying accuracy, and compared with the prior art, its beneficial effects are as follows: the present invention relates to a wave soldering equipment with high tin spraying accuracy, and the wave soldering equipment with high tin spraying accuracy includes a conveying device, a flux spraying device, a heating device, a tin spraying device and a cooling device. The conveying device is used to convey the circuit board to be soldered. The flux spraying device is arranged at one end of the conveying device and is used to spray the flux. The heating device is arranged on the conveying device and is used to heat the soldering part of the circuit board sprayed with the flux to the wetting temperature. The tin spraying device includes a base and a tin spraying unit, and the base is arranged below the conveying device. The tin spraying unit includes a wave tin spraying plate and a plurality of tin expansion strips. The wave tin spraying plate is arranged on the base, and the wave tin spraying plate is arranged as a long plate-shaped structure. The plurality of tin expansion strips are arranged on the wave tin spraying plate in a tilted manner along the length direction of the wave tin spraying plate, and are located on the side of the wave tin spraying plate facing the circuit board, and a gap is arranged between two adjacent tin expansion strips. At least one first nozzle is arranged on the tin expansion strip, and the first nozzle is used to spray tin liquid. A gap is provided between the upper surface of the tin expansion bar and the lower surface of the circuit board. When the circuit board is sprayed with tin liquid, the tin liquid contacts the pad surface of the circuit board and the upper surface of the tin expansion bar, so that the tin liquid on the circuit board diffuses along the length direction of the tin expansion bar. A cooling device is provided at the discharge end of the conveying device, and is used to cool the circuit board. The wave soldering equipment with high tin spraying precision arranges the tin expansion bar at an angle so that the tin liquid sprayed from the first nozzle thereon can be sprayed more evenly along the conveying direction on the circuit board. Then, during the conveying process, the tin expansion bar has a pulling effect on the sprayed tin liquid along the conveying direction, so that the sprayed tin liquid diffuses along the length direction of the tin expansion bar, thereby improving the uniformity of spraying and the coverage area, significantly improving the quality of spraying, thereby improving the precision of welding, and solving the problem in the prior art that the tin spraying equipment easily leaks spray in the area between two adjacent nozzles on both sides of the circuit board along the conveying direction, resulting in low welding precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. The drawings described below are only drawings corresponding to some embodiments of the present invention.

[0022] Figure 1 It is a structural schematic diagram of an embodiment of a wave soldering equipment with high tin spraying accuracy of the present invention.

[0023] Figure 2 The figure is a schematic diagram of the internal structure of an embodiment of a wave soldering device with high tin spraying accuracy of the present invention.

[0024] Figure 3 It is a structural schematic diagram of an embodiment of the flux spraying device of the present invention.

[0025] Figure 4It is a schematic structural diagram of an embodiment of a nozzle unit of the present invention.

[0026] Figure 5 It is a schematic structural diagram of an embodiment of a collecting unit of the present invention.

[0027] Figure 6 It is a schematic cross-sectional structure diagram of an embodiment of a collecting unit of the present invention.

[0028] Figure 7 It is a structural schematic diagram of an embodiment of the first liquid collecting plate of the present invention.

[0029] Figure 8 It is a structural schematic diagram of an embodiment of the internal structure of the collection unit of the present invention.

[0030] Fig. 9 This is a schematic structural diagram from another perspective of an embodiment of the internal structure of the collection unit of the present invention.

[0031] Fig.10 It is a schematic structural diagram of an embodiment of the tin spraying device of the present invention.

[0032] Fig.11 It is a structural schematic diagram of an embodiment of a base of the present invention.

[0033] Fig.12 It is a structural schematic diagram of an embodiment of the tin spraying unit of the present invention.

[0034] Fig.13 It is a front view of an embodiment of the tin spray unit of the present invention.

[0035] Fig.14 for Fig.13 Enlarged schematic diagram of the local structure.

[0036] In the figure: 10. Wave soldering equipment with high tin spraying accuracy, 20. Conveying device, 30. Flux spraying device, 31. Liquid storage tank, 311. Liquid storage tank, 32. Nozzle unit, 321. Driving motor, 322. Driving wheel, 323. Driven wheel, 324. Belt, 325. Connector, 326. Support rod, 327. Clamp, 328. Nozzle, 33. Collecting unit, 331. Liquid collecting bin, 3311. Protective shell, 3312. First liquid collecting plate, a1. First side plate, a2. Second side plate, a3. Liquid collecting bottom plate, 3313. Second liquid collecting plate, 3314. Guide plate, 33 15. Liquid collecting tank, 3316. Guide groove, 3317. Guide pipe, 332. First cooling plate, 333. Second cooling plate, 334. Fifth cooling plate, 335. Sixth cooling plate, 336. Top cover, 3361. Third cooling plate, 3362. Fourth cooling plate, 337. First connecting column, 338. Second connecting column, 40. Heating device, 50. Tin spraying device, 51. Tin spraying unit, 511. First wave tin spraying plate, 512. Second nozzle, 513. Tin expansion bar, 5131. First nozzle, 52. Base, 521. Limiting block, 53 Tin spraying tank, 60. Cooling device. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0038] The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", "top" and "bottom", are only for reference to the orientation of the drawings. The directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0039] In the figures, structurally similar elements are denoted by the same reference numerals.

[0040] In this embodiment, please refer to Figure 1 , Figure 2The wave soldering equipment 10 with high tin spraying precision includes a conveying device 20, a flux spraying device 30, a heating device 40, a tin spraying device 50 and a cooling device 60. The conveying device 20 is used to convey the circuit board to be soldered. The conveying device 20 is arranged to tilt upward along the conveying direction. The flux spraying device 30, the heating device 40, the tin spraying device 50 and the cooling device 60 are arranged in sequence along the conveying direction of the conveying device 20 at intervals. The flux spraying device 30 is used to spray flux. The heating device 40 is arranged on the conveying device 20, and is used to heat the soldering part of the circuit board sprayed with flux to the wetting temperature. The tin spraying device 50 is used to spray tin on the circuit board and form solder joints. The cooling device 60 is arranged at the discharge end of the conveying device 20, and is used to cool the circuit board.

[0041] In this embodiment, please refer to Figure 3 The flux spraying device 30 is used to spray flux on the circuit board on the conveying device 20, and includes a liquid storage tank 311, a nozzle unit 32 and a collecting unit 33. The liquid storage tank 31 is arranged below the circuit board, and the liquid storage tank 31 is provided with a liquid storage tank 311, and the liquid storage tank 311 is used to store flux. The nozzle unit 32 is movably arranged in the liquid storage tank 311, and the nozzle 328 device is used to spray the flux onto the circuit board.

[0042] Please refer to Figure 4 The nozzle unit 32 includes a driving motor 321, a driving wheel 322, a driven wheel 323, a belt 324, a connecting piece 325, a support rod 326, a chuck 327 and a nozzle 328. A chute is provided on one side of the liquid storage tank 31, the driving motor 321 is provided at one end of the chute, the output shaft of the driving motor 321 is connected to the driving wheel 322, the driven wheel 323 is provided at the other end of the chute, and the driving wheel 322 and the driven wheel 323 are connected by a belt 324. One end of the connecting piece 325 is fixedly connected to the belt 324, and the other end of the connecting piece 325 passes through the chute and is located above the liquid storage tank 311. The support rod 326 is vertically provided at the other end of the connecting piece 325, and a chuck 327 is fixedly provided at the upper end of the supporting rod 326, and the chuck 327 is used to fix the nozzle 328. The driving motor 321 can drive the nozzle 328 to reciprocate in the liquid storage tank 31, thereby realizing the reciprocating spraying operation on the bottom of the circuit board.

[0043] In this embodiment, please refer to Figure 5 , Figure 6The collecting unit 33 includes a liquid collecting bin 331, a first cooling plate 332, a second cooling plate 333, a fifth cooling plate 334, a sixth cooling plate 335 and a top cover 336. The liquid collecting bin 331 is disposed above the conveying device 20, and a liquid collecting tank 3315 is disposed in the liquid collecting bin 331. The liquid collecting bin 331 includes a protective shell 3311, a first liquid collecting plate 3312, a second liquid collecting plate 3313 and two guide plates 3314. The first liquid collecting plate 3312 is disposed below the first cooling plate 332, the second liquid collecting plate 3313 is disposed below the second cooling plate 333, and the first liquid collecting plate 3312 and the second liquid collecting plate 3313 are both provided with a through liquid collecting tank 3315. A guide plate 3314 is connected to one end of the first liquid collecting plate 3312 and the second liquid collecting plate 3313, and another guide plate 3314 is connected to the other end of the first liquid collecting plate 3312 and the second liquid collecting plate 3313. A guide groove 3316 is arranged on the guide plate 3314. The collecting groove 3315 of the first liquid collecting plate 3312 and the collecting groove 3315 of the second liquid collecting plate 3313 are both connected to the guide groove 3316 of the guide plate 3314, which has a simple structure and saves costs. The protective shell 3311 is arranged on the periphery of the first liquid collecting plate 3312, the second liquid collecting plate 3313, and the guide plate 3314 to prevent the vaporized soldering flux from overflowing. A vent is arranged at the upper end of the protective shell 3311 for connecting a ventilator, which can drive the vaporized soldering flux to move upward, hit the pagoda overflow cover for liquefaction, and then collect the vaporized soldering flux to improve the collection efficiency. Among them, the pagoda-type overflow cover refers to the structure in which the first cooling plate 332, the second cooling plate 333, the fifth cooling plate 334, the sixth cooling plate 335 and the top cover 336 are overlapped.

[0044] For details, please refer to Figure 7 , the first liquid collecting plate 3312 is arranged in the same structure as the second liquid collecting plate 3313. The first liquid collecting plate 3312 includes a first side plate a1, a second side plate a2 and a liquid collecting bottom plate a3. The first side plate a1 is vertically arranged on one side of the liquid collecting bottom plate a3, and the second side plate a2 is vertically arranged on the other side of the liquid collecting bottom plate a3. The first side plate a1 is arranged in parallel with the second side plate a2. The length of the first side plate a1 is greater than the length of the second side plate a2. The area enclosed by the first side plate a1, the second side plate a2 and the liquid collecting bottom plate a3 is the liquid collecting tank 3315, which has a simple structure and is easy to install and disassemble. The vertical height of the first side plate a1 is greater than the vertical height of the second side plate a2. The first side plate a1 is screwed to the inner wall of the protective shell 3311 to improve the efficiency of installation and disassembly.

[0045] The guide plate 3314 is configured as an L-shaped plate structure, and the guide plate 3314 and the other inner side wall of the protective shell 3311 enclose a guide groove 3316 for guiding the collected solder flux to save costs. A guide pipe 3317 is provided on an inner side wall of the protective shell 3311 opposite to the guide plate 3314, one end of the guide pipe 3317 passes through the inner side wall of the protective shell 3311 and is located in the guide groove 3316, and the other end of the guide pipe 3317 is connected to the recovery equipment outside the protective shell 3311 to improve the efficiency of liquid collection.

[0046] Please refer to Figure 8 , Fig. 9 , the first cooling plate 332 and the second cooling plate 333 are arranged vertically and tilted, and the distance between the lower end of the first cooling plate 332 and the lower end of the second cooling plate 333 is greater than the distance between the upper end of the first cooling plate 332 and the upper end of the second cooling plate 333. The lower ends of the first cooling plate 332 and the second cooling plate 333 are both arranged in the liquid collecting tank 3315. One side of the top cover 336 is connected to the upper end of the first cooling plate 332, and the other side of the top cover 336 is connected to the upper end of the second cooling plate 333. The circuit board to be sprayed is located in the area enclosed by the first cooling plate 332 and the second cooling plate 333, and the first cooling plate 332, the second cooling plate 333 and the top cover 336 are used to liquefy the excess solder flux and introduce it into the liquid collecting tank 3315.

[0047] The top cover 336 includes a third cooling plate 3361 and two fourth cooling plates 3362. The third cooling plate 3361 is set to an inverted V-shaped structure. One side of the third cooling plate 3361 is connected to the upper end of the first cooling plate 332, and the other side of the third cooling plate 3361 is connected to the upper end of the second cooling plate 333, so as to improve the collection efficiency. A fourth cooling plate 3362 is set on both sides of the third cooling plate 3361, and the fourth cooling plate 3362 is set to a triangular structure to improve the structural stability.

[0048] The upper end of the first cooling plate 332 is provided with a plurality of first connecting posts 337, and the plurality of first connecting posts 337 are arranged at intervals on the outer side of the upper end of the first cooling plate 332. One side of the third cooling plate 3361 is connected to the first cooling plate 332 through the first connecting posts 337 and screws. The lower end of the third cooling plate 3361 and the upper end of the first cooling plate 332 have an overlapping area in the vertical direction, so that the airflow of the sprayed soldering flux must hit the third cooling plate 3361 and then flow out from the gap between the lower end of the third cooling plate 3361 and the upper end of the first cooling plate 332, which can ensure that the soldering flux can be attached to the board. At the same time, the liquefied soldering flux can flow down along the inner surface of the board and drip onto the next adjacent board for easy collection. The upper end of the second cooling plate 333 is provided with a plurality of second connecting pillars 338, which are arranged at intervals on the outer side of the upper end of the second cooling plate 333. The other side of the third cooling plate 3361 is connected to the second cooling plate 333 through the second connecting pillars 338 and screws. Gaps are provided between the inner side surface of the third cooling plate 3361 and the outer side surfaces of the first cooling plate 332 and the second cooling plate 333, so that the collected flux can flow into the collecting tank 3315.

[0049] The fifth cooling plate 334 is arranged between the first cooling plate 332 and the third cooling plate 3361, and the sixth cooling plate 335 is arranged between the second cooling plate 333 and the third cooling plate 3361. The inner side surface of the lower end of the fifth cooling plate 334 is connected to the outer side surface of the upper end of the first cooling plate 332, and the outer side surface of the upper end of the fifth cooling plate 334 is connected to the inner side surface of one side of the third cooling plate 3361. The inner side surface of the lower end of the sixth cooling plate 335 is connected to the outer side surface of the upper end of the second cooling plate 333, and the outer side surface of the upper end of the sixth cooling plate 335 is connected to the inner side surface of the other side of the third cooling plate 3361, so as to increase the collection space, so that the soldering flux is collected as completely as possible, and the cost is saved. The overlapping method between two adjacent fifth cooling plates 334 is the same as the overlapping method between the fifth cooling plate 334 and the first cooling plate 332, and the specific content can be referred to the above-mentioned related content. The fifth cooling plate 334 and the sixth cooling plate 335 are both set to at least one, and in this embodiment, one fifth cooling plate 334 and one sixth cooling plate 335 are set.

[0050] When the nozzle 328 sprays flux on the circuit board, part of the flux is not sprayed onto the circuit board and enters the collection unit 33, and the vaporized flux is liquefied on the first cooling plate 332, the second cooling plate 333, the fifth cooling plate 334, the sixth cooling plate 335 and the top cover 336, and then the liquefied flux is guided through the first cooling plate 332, the second cooling plate 333, the fifth cooling plate 334, and the sixth cooling plate 335 to flow into the liquid collecting tank 3315, and the collected flux is introduced into the external recycling equipment through the guide groove 3316 and the guide pipe 3317.

[0051] Please refer to Fig.10 , Fig.11 In this embodiment, the tin spraying device 50 includes a base 52 and a tin spraying unit 51. The lower side of the base 52 is set as a rectangular parallelepiped structure, the upper side of the base 52 is set as a prism-shaped structure, and both ends of the upper surface of the base 52 are provided with protruding limit blocks 521. The tin spraying unit 51 is clamped between the two limit blocks 521, and it is convenient to install and disassemble. The length direction of a wave of tin spraying plate 511 in the tin spraying unit 51 is perpendicular to the conveying direction of the conveying device 20, and the upper surface of the wave of tin spraying plate 511 is inclined to be arranged parallel to the lower surface of the circuit board, which can improve the accuracy of tin spraying.

[0052] Please refer to Fig.12 The tin-spraying unit 51 includes a wave tin-spraying plate 511, two second nozzles 512 and a plurality of tin-expanding strips 513. The wave tin-spraying plate 511 is configured as a long plate-shaped structure. The plurality of tin-expanding strips 513 are integrally formed with the wave tin-spraying plate 511, and the plurality of tin-expanding strips 513 are sequentially arranged on the wave tin-spraying plate 511 along the length direction of the wave tin-spraying plate 511 and are located on the side of the wave tin-spraying plate 511 facing the circuit board, and a gap is provided between two adjacent tin-expanding strips 513. A second nozzle 512 is provided on the opposite side of the outermost tin-expanding strips 513 at both ends of the wave tin-spraying plate 511, and the second nozzle 512 is located on the side of the tin-expanding strip 513 at the end far from the wave tin-spraying plate 511, so as to increase the coverage area of ​​the tin-spraying, thereby improving the precision of the tin-spraying.

[0053] Please refer to Fig.12 , Fig.13 , multiple tin expansion strips 513 are arranged in parallel, and the distance between two adjacent tin expansion strips 513 is set to be the same, so that the spraying is uniform and the precision of tin spraying is improved. Fig.14 As shown, the inclination angle r of the tin expansion strip 513 relative to the length direction of the first wave tin spraying plate 511 is set to 60°-70°, which increases the coverage area and saves costs. In this embodiment, the inclination angle r of the tin expansion strip 513 is set to 66°. The ratio of the distance between two adjacent tin expansion strips 513 and the diameter of the first nozzle 5131 is between 1 / 3 and 3 / 4, which can overlap the nozzles of two adjacent tin expansion strips 513, so that each position of the circuit board can be sprayed, and the material cost of the tin expansion strip 513 can also be saved. Among them, the distance between the two adjacent tin expansion strips 513 refers to the gap between the two adjacent tin expansion strips 513. In this embodiment, the ratio of the distance between two adjacent tin expansion strips 513 and the diameter of the first nozzle 5131 is selected to be 2 / 3.

[0054] At least one first nozzle 5131 is provided on the tin expansion bar 513, and the first nozzle 5131 is used to spray tin liquid. A gap is provided between the upper surface of the tin expansion bar 513 and the lower surface of the circuit board. When the circuit board is sprayed with tin liquid, the tin expansion bar 513 is used to diffuse the tin liquid on the circuit board along the length direction of the tin expansion bar 513. In this embodiment, the tin expansion bar 513 is configured as a strip structure, and the tin expansion bar 513 is provided with three first nozzles 5131 along its length direction to improve the efficiency of spraying. The distance between two adjacent first nozzles 5131 on each tin expansion bar 513 is the same, the distribution is uniform, and the spraying is uniform.

[0055] Please refer to Fig.10 , the tin spraying device 50 is also provided with a tin spraying tank 53 and a plurality of third nozzles along the conveying direction of the circuit board. The tin spraying tank 53 is fixedly arranged on the side of the base 52 away from the heating device 40 by bolts, and is convenient for installation and disassembly. A plurality of third nozzles are arranged in the tin spraying tank 53. When the tin liquid sprayed from the first nozzle 5131 and the second nozzle 512 adheres to the circuit board, the circuit board is conveyed to the top of the third nozzle along with the conveying device 20, and then the tin liquid is sprayed from the third nozzle to re-spray the circuit board, ensuring that all the soldering pads of the circuit board are sprayed in place and the spraying is more uniform. Moreover, the tin liquid sprayed from the third nozzle is only subjected to the vertical force, which plays a re-spraying role and can save costs. Of course, if the tin liquid sprayed from the first nozzle 5131 and the second nozzle 512 has met the welding requirements, the third nozzle can be closed to stop spraying, which significantly improves the compatibility of the equipment. The installation position and structure of the tin spraying tank 53 are drawn in the figure, and the third nozzle is not drawn in the figure.

[0056] Specifically, when the circuit board is being transported, the tin spraying device 50 sprays the tin liquid from the multiple first nozzles 5131. Since the tin expansion bar 513 is tilted, the tin liquid on the circuit board can be adjusted and filled in the opposite direction of the movement direction of the circuit board to ensure the coverage of the tin liquid. After the tin liquid is sprayed from the first nozzle and the second nozzle, it is subjected to a vertical upward force so that the tin liquid is sprayed below the pad of the circuit board. When the tin liquid is sprayed onto the pad, since the conveying device 20 is tilted upward, under the action of the deadweight of the tin liquid, there is a downward force, so that the tin liquid moves in the opposite direction of the conveying direction. The tin liquid contacts the lower surface of the pad of the circuit board and the upper surface of the tin expansion bar. The tin expansion bar has a traction effect on the sprayed tin liquid. Since the tin expansion bar is tilted, the tin liquid is also subjected to a force that diffuses on both sides along the conveying direction, so that the sprayed tin liquid diffuses along the length direction of the tin expansion bar, thereby improving the uniformity of the spraying, the coverage area and the quality of the spraying.

[0057] In this embodiment, the present invention relates to a wave soldering device with high tin spraying accuracy, and the wave soldering device with high tin spraying accuracy includes a conveying device, a flux spraying device, a heating device, a tin spraying device and a cooling device. The conveying device is used to convey the circuit board to be soldered. The flux spraying device is arranged at one end of the conveying device and is used to spray the flux. The heating device is arranged on the conveying device and is used to heat the soldering part of the circuit board sprayed with the flux to a wetting temperature. The tin spraying device includes a base and a tin spraying unit, and the base is arranged below the conveying device. The tin spraying unit includes a wave tin spraying plate and a plurality of tin expansion strips. The wave tin spraying plate is arranged on the base, and the wave tin spraying plate is arranged as a long plate-shaped structure. The plurality of tin expansion strips are arranged on the wave tin spraying plate in a tilted manner along the length direction of the wave tin spraying plate, and are located on the side of the wave tin spraying plate facing the circuit board, and a gap is arranged between two adjacent tin expansion strips. At least one first nozzle is arranged on the tin expansion strip, and the first nozzle is used to spray tin liquid. A gap is provided between the upper surface of the tin expansion bar and the lower surface of the circuit board. When the circuit board is sprayed with tin liquid, the tin liquid contacts the lower surface of the pad of the circuit board and the upper surface of the tin expansion bar, so that the tin liquid on the circuit board diffuses along the length direction of the tin expansion bar. A cooling device is provided at the discharge end of the conveying device, and is used to cool the circuit board. The wave soldering equipment with high tin spraying precision is configured by tilting the tin expansion bar so that the tin liquid sprayed from the first nozzle on it can be sprayed more evenly along the conveying direction on the circuit board. Then, during the conveying process, the tin expansion bar has a pulling effect on the sprayed tin liquid along the conveying direction, so that the sprayed tin liquid diffuses toward the gap area between two adjacent tin expansion bars, thereby improving the uniformity of spraying and the coverage area, significantly improving the quality of spraying, thereby improving the precision of welding, and solving the problem of low welding precision in the prior art due to the tin spraying equipment easily leaking the area between two adjacent nozzles on both sides of the conveying direction on the circuit board.

[0058] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A wave soldering equipment with high tin spraying accuracy, characterized in that: include: A conveying device, the conveying device is used to convey the circuit board to be soldered; A flux spraying device, which is arranged at one end of the conveying device and is used for spraying flux; A heating device, which is arranged on the conveying device and is used to heat the soldering part of the circuit board sprayed with solder flux to a wetting temperature; A tin spraying device, the tin spraying device comprises a base and a tin spraying unit, the base is arranged below the conveying device; the tin spraying unit comprises a wave tin spraying plate and a plurality of tin expansion strips; the wave tin spraying plate is arranged on the base, and the wave tin spraying plate is arranged as a long plate-shaped structure; a plurality of tin expansion strips are arranged on the wave tin spraying plate in sequence along the length direction of the wave tin spraying plate, and are located on the side of the wave tin spraying plate facing the circuit board, and a gap is arranged between two adjacent tin expansion strips; at least one first nozzle is arranged on the tin expansion strip, and the first nozzle is used to spray tin liquid; a gap is arranged between the upper surface of the tin expansion strip and the lower surface of the circuit board, and when tin liquid is sprayed on the circuit board, the tin expansion strip is used to diffuse the tin liquid on the circuit board along the length direction of the tin expansion strip; and, A cooling device is arranged at the discharge end of the conveying device and is used for cooling the circuit board.

2. The wave soldering equipment with high tin spraying accuracy according to claim 1, characterized in that: The tin expansion strip is configured as a strip structure, and the tin expansion strip is provided with three first nozzles along its length direction; and the distance between two adjacent first nozzles on each of the tin expansion strips is the same.

3. The wave soldering equipment with high tin spraying accuracy according to claim 1, characterized in that: The inclination angle of the tin expansion strip relative to the length direction of the first wave tin spraying plate is set to 60°-70°.

4. The wave soldering equipment with high tin spraying accuracy according to claim 1, characterized in that: The plurality of tin expansion bars are arranged in parallel, and the distance between two adjacent tin expansion bars is set to be the same; the ratio of the distance between two adjacent tin expansion bars to the diameter of the first nozzle is between 1 / 3 and 3 / 4.

5. The wave soldering equipment with high tin spraying accuracy according to claim 1, characterized in that: The tin spray unit also includes two second nozzles, and one second nozzle is provided on the opposite side of the outermost tin expansion strips at both ends of the first wave tin spray plate, and the second nozzle is located on the side of the end of the tin expansion strip far from the first wave tin spray plate.

6. The wave soldering equipment with high tin spraying accuracy according to claim 1, characterized in that: The flux spraying device includes a liquid storage tank, a nozzle unit and a collecting unit; the liquid storage tank is arranged below the conveying device, and the liquid storage tank is used to store the flux; the nozzle unit is movably arranged in the liquid storage tank, and the nozzle unit is used to spray the flux onto the circuit board; the collecting unit includes a liquid collecting bin, a first cooling plate, a second cooling plate and a top cover, the liquid collecting bin is arranged above the conveying device, and a liquid collecting bin is arranged in the liquid collecting bin; the first cooling plate and the second cooling plate are arranged vertically inclined, and the distance between the lower end of the first cooling plate and the lower end of the second cooling plate is greater than the distance between the upper end of the first cooling plate and the upper end of the second cooling plate; the lower ends of the first cooling plate and the second cooling plate are both arranged in the liquid collecting tank; one side of the top cover is connected to the upper end of the first cooling plate, and the other side of the top cover is connected to the upper end of the second cooling plate; the circuit board to be sprayed is located in the area enclosed by the first cooling plate and the second cooling plate, and the first cooling plate, the second cooling plate and the top cover are used to liquefy the excess flux and introduce it into the liquid collecting tank.

7. The wave soldering equipment with high tin spraying accuracy according to claim 6, characterized in that: The top cover includes a third cooling plate and two fourth cooling plates, the third cooling plate is arranged to be an inverted V-shaped structure, one side of the third cooling plate is connected to the upper end of the first cooling plate, and the other side of the third cooling plate is connected to the upper end of the second cooling plate; one fourth cooling plate is arranged on the other two sides of the third cooling plate, and the fourth cooling plates are arranged to be a triangular structure.

8. The wave soldering equipment with high tin spraying accuracy according to claim 7, characterized in that: A plurality of first connecting columns are provided at the upper end of the first cooling plate, and the plurality of first connecting columns are spaced apart on the outer side of the upper end of the first cooling plate, and one side of the third cooling plate is connected to the first cooling plate through the first connecting columns and screws; a plurality of second connecting columns are provided at the upper end of the second cooling plate, and the plurality of second connecting columns are spaced apart on the outer side of the upper end of the second cooling plate, and the other side of the third cooling plate is connected to the second cooling plate through the second connecting columns and screws; a gap is provided between the inner side surface of the third cooling plate and the outer side surfaces of the first cooling plate and the second cooling plate.

9. The wave soldering equipment with high tin spraying accuracy according to claim 8, characterized in that: The top cover also includes a fifth cooling plate and a sixth cooling plate, the fifth cooling plate is arranged between the first cooling plate and the third cooling plate, and the sixth cooling plate is arranged between the second cooling plate and the third cooling plate; the inner side surface of the lower end of the fifth cooling plate is connected to the outer side surface of the upper end of the first cooling plate, and the outer side surface of the upper end of the fifth cooling plate is connected to the inner side surface of one side of the third cooling plate; the inner side surface of the lower end of the sixth cooling plate is connected to the outer side surface of the upper end of the second cooling plate, and the outer side surface of the upper end of the sixth cooling plate is connected to the inner side surface of the other side of the third cooling plate.

10. The wave soldering equipment with high tin spraying accuracy according to claim 6, characterized in that: The liquid collecting bin includes a protective shell, a first liquid collecting plate and a second liquid collecting plate, the first liquid collecting plate is arranged below the first cooling plate, and the second liquid collecting plate is arranged below the second cooling plate; the first liquid collecting plate and the second liquid collecting plate have the same structure; the first liquid collecting plate includes a first side plate, a second side plate and a liquid collecting bottom plate, the first side plate is vertically arranged on one side of the liquid collecting bottom plate, the second side plate is vertically arranged on the other side of the liquid collecting bottom plate, and the first side plate is arranged parallel to the second side plate; the length of the first side plate is greater than the length of the second side plate, and the area enclosed by the first side plate, the second side plate and the liquid collecting bottom plate is the liquid collecting tank; the protective shell cover is arranged on the periphery of the first liquid collecting plate and the second liquid collecting plate.

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