44results about "Metallurgical bonding" patented technology

A power module and an auxiliary supporting device adapted thereto are provided. The auxiliary supporting device is used to maintain a first circuit board in a vertical state on a second circuit board. The auxiliary supporting device includes a first plate and a second plate. The first plate is parallel to and fixed to the first circuit board. The second plate is extended from the first plate in a direction away from the first circuit board. A bottom edge of the second plate is disposed on a surface of the second circuit board facing the first circuit board. The auxiliary supporting device is universally suitable for different combinations between the first plate and the second plate without the need of customized tool.

An insulating metal substrate (1) for a power semiconductor device is specified, comprising:-a metal base (2),-a dielectric layer (3) arranged on the metal base (2),-an electrically conductive layer (4) arranged on the dielectric layer (3), and-a reinforcement structure (5), the reinforcement structure (5) being arranged in a peripheral region of the insulating metal substrate (1), the peripheral region at least partially surrounds the central region of the insulating metal substrate (1). Further, a method for manufacturing an insulating metal substrate is specified.

The application discloses an active metal brazing substrate material containing aluminum element and a manufacturing method thereof. The substrate material comprises a ceramic substrate layer, a first brazing layer, a second brazing layer and a conductive metal layer which are sequentially stacked. The first brazing layer comprises a first metal composite material containing metal silver (Ag), metal copper (Cu) and a first active metal component. The content of silver is not less than 50 parts by weight based on the total weight of the first metal composite material being 100 parts by weight. The second brazing layer comprises a second metal composite material containing metal aluminum (Al), metal copper (Cu) and a second active metal component, and does not contain metal silver. The content of aluminum is not less than 40 parts by weight based on the total weight of the second metal composite material being 100 parts by weight. The total thickness of the first and second brazing layers is not less than 12 microns, and the thickness of the first brazing layer is not less than 5 microns. In this way, the amount of silver is effectively reduced, the brazing temperature is reduced to below 900 DEG C, the influence of high temperature on the metal performance is reduced, and the material and process costs are reduced.

The present invention relates to a laser welding apparatus including a lower jig, a laser welding unit configured to weld a metal and another metal to each other, the metal being disposed at an upper surface of a PCB disposed on the lower jig, and an upper jig configured to support at least one of at least a part of the upper surface of the PCB, at least a part of an upper surface of the metal, and at least a part of an upper surface of the another metal, wherein the upper jig is fixed such that the vertical position of the upper jig is constant, or when the upper jig is moved upwards and downwards, the upper jig is configured to be fixed at a specific position, and a welding method using the same. A laser welding apparatus capable of performing welding while vibrating a PCB and a welding method using the same are also disclosed.

The invention relates to the technical field of the electronic manufacturing industry, in particular to a lead-free wave welding hole blowing machining process control method and application thereof. By limiting the copper deposition degumming treatment rate to be 0.15-0.6 mg / cm < 2 >, it is guaranteed that the backlight grade of the hole wall after copper deposition is larger than or equal to 9, organic matter and pollutants of the hole wall can be effectively removed, the hole wall has proper roughness and activity, the binding force of a copper deposition layer and the hole wall is enhanced, and the hole metallization reliability is improved. During copper electroplating treatment, the current density is set to be 15-25 ASF, the time is controlled to be 20-22 minutes, a copper layer can be evenly and compactly deposited, it is guaranteed that the hole copper thickness reaches the standard, and the conductivity and mechanical performance are improved. And finally, performing windowing treatment on the solder-resisting PTH hole, and by virtue of a reasonable windowing design, assisting solder to be smoothly filled during wave soldering, reducing hole blowing and pseudo soldering, and remarkably improving the welding quality and the production yield.

A bonded body, which is a bonded body provided with a ceramic substrate and a copper plate bonded to the ceramic substrate via a bonding layer, characterized in that the copper plate has a surface perpendicular to the direction in which the ceramic substrate and the copper plate are bonded, and in that the proportion of the number of copper grains having a long diameter of more than 400 μm is 0% to 5% in three regions of 5 mm x 5 mm contained in the surface. The bonding temperature is preferably 800°C or lower. Furthermore, the proportion of the number of copper grains having a long diameter of more than 400 μm is preferably 1% or lower.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

The application provides a kind of semi-automatic wire threading welding method, comprising the following steps: S1, the steel sheet in the welding device is placed on the spring on the base pin and positioned on the upper part of the base;S2, the steel sheet is adjusted to the required height by the steel sheet adjusting stud;S3, manually rotate the base adjusting stud to make the bottom cover plate assembly move downward, when the bottom cover plate assembly contacts the silver-plated wire on the steel sheet, the steel sheet will thread the silver-plated wire through the printed board pad hole;S4, the steel sheet continues to move downward with the base adjusting stud, the silver-plated wire slowly passes through the printed board, and when the base adjusting stud fits the bottom cover plate assembly, the steel sheet and the base together, the silver-plated wire length is the required length for product welding after the stud is tightened.The semi-automatic wire threading welding method can adapt to mass production welding, save one person's serial work time to complete the whole process, and improve production efficiency.

A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

The invention relates to the technical field of circuit board surface assembly production lines, and discloses a circuit board printing production line which at least comprises soldering tin printing equipment, soldering tin detection equipment and a board storage connection table. The board storage connection table comprises a conveying mechanism, a board storage mechanism, a first sensor and a control unit; the conveying mechanism comprises a first conveying structure, a second conveying structure and a third conveying structure which are sequentially arranged in the conveying direction. The plate storage mechanism comprises a storage frame; the first sensor is configured to sense the circuit board conveyed to the third conveying structure; after the control unit receives a defect signal fed back by the soldering tin detection equipment and a first induction signal fed back by the first inductor, the control unit can control the second conveying structure and the third conveying structure to reversely convey the circuit board until the first inductor stops feeding back the first induction signal to the control unit, and the storage frame ascends; and the supporting structure of the storage rack upwards ejects the circuit board returned to the second conveying structure away from the second conveying structure and stores the circuit board.

The invention belongs to the technical field of FPC board welding, and particularly relates to a welding device based on an FPC board and a component, the welding device comprises a thermocompression welding device, a placing table, a negative pressure mechanism arranged on the placing table and used for adsorbing the FPC board, and a door frame used for controlling a welding head to move, a hole is formed in the placing table, and an exhaust fan is arranged in the hole; a liquid feeding conical head is arranged in the placing table, the tip end of the liquid feeding conical head extends into the hole, a plugging ball is movably installed at the tip end of the liquid feeding conical head, a liquid nitrogen storage tank is arranged in the placing table, and a liquid feeding assembly is arranged in the placing table and used for extracting liquid nitrogen in the liquid nitrogen storage tank and feeding the liquid nitrogen into the liquid feeding conical head; by driving the contamination block to scratch the blocking ball, a small amount of liquid nitrogen is gasified to generate cold air flow, the cold air flow and the exhaust fan form collaborative cooling, the temperature of a plate body is stabilized, thermal stress deformation is avoided, the defects of insufficient soldering, partial soldering, continuous tin soldering and the like are effectively overcome, and the welding quality is greatly improved.

The application discloses a soldering jig for manufacturing a circuit board and relates to the technical field of circuit board soldering.The soldering jig comprises a tin brushing auxiliary part, an assembling partition is installed on the tin brushing auxiliary part, and the assembling partition is used for positioning a patch device; a pressing stabilizing part is installed on the assembling partition; a spacing gasket part is slidingly inserted into the assembling partition; and the spacing gasket part is used for keeping the gap between the patch device and the circuit board.The assembling partition and the pressing stabilizing part can be used for limiting each patch device and keeping the stability during soldering, and the structure can be used for facilitating subsequent heating and soldering work and stable transfer by limiting the patch device and keeping the stability, so as to solve the problems of poor stability of the soldering jig for manufacturing a circuit board during the transfer of the circuit board, easy shaking and displacement of the patch device and inconvenient keeping of the soldering gap of the patch device.

A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.

To provide a method of adjusting a distribution position of flux on a circuit board.SOLUTION: A method of adjusting a distribution position of flux on a circuit board includes steps of: preparing a circuit board provided with flux covering a plurality of solder points distributed on a surface; performing optical position alignment work of sending the circuit board into a work region, imaging the circuit board by using an optical imaging lens, and outputting positional information after calculation; performing laser cleaning work of generating a laser beam by using a laser oscillator, removing excessive flux around the plurality of solder points on the basis of the positional information, and leaving only flux distributed on top surfaces of the solder points; and performing automatic optical inspection work for determining whether the circuit board is nondefective or defective. By the steps, flux having the same distribution region is formed on the top surfaces of the plurality of solder points on the circuit board, and successive soldering quality is improved. If there is remaining flux, the remaining flux can be completely removed via a reflow furnace in the subsequent step, and a step of cleaning excessive flux on the circuit board can be omitted.SELECTED DRAWING: Figure 1

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to an integrated circuit board installation jig which comprises a jig platform assembly, the jig platform assembly is of a rectangular hollow structure, first air cylinders are installed on the two sides of the outer wall of the jig platform assembly in an embedded mode, and the output ends of the first air cylinders are in transmission connection with positioning plates. A positioning groove is formed in the outer wall of the positioning plate, the integrated circuit board body and the steel mesh are lifted through the material lifting slopes, finally, after the two ends of the integrated circuit board body and the two ends of the steel mesh are movably clamped to the inner walls of the limiting grooves, the integrated circuit board body, the steel mesh and the positioning groove are arranged on the same horizontal plane, and then the output end of a first air cylinder is used for pushing the positioning plate; the other two ends of the integrated circuit board body and the other two ends of the steel mesh are movably clamped through the positioning grooves so that the integrated circuit board body and the steel mesh in the stacked state can be aligned in the solder paste printing stage, and printing deviation is prevented.

The application discloses a tin paste smearing device for PCB processing and relates to the technical field of tin paste printing. The device comprises a supporting mechanism and further comprises an anti-oxidation storage mechanism connected with the supporting mechanism, which comprises a material box provided with tin paste holes corresponding to the circuit board pins at the bottom. The anti-oxidation storage mechanism is installed to make the material fully filled in the tin paste holes, guarantee the material amount of the welding points, and isolate the tin paste from the air to avoid tin paste oxidation. The anti-residue discharging mechanism and the tin paste deformation control mechanism are installed to push the tin paste out of the tin paste holes, avoid the friction between the tin paste and the tin paste holes, and prevent the tin paste from being left, and at the same time, the circuit board is lowered synchronously during discharging to avoid the tin paste from leaving the welding points and affecting the element welding qualification rate. The tin paste anti-shortage mechanism is installed to separate the tin paste from the discharging rod after the tin paste is pushed out, avoid the discharging rod from taking away part of the tin paste, and prevent the uneven tin paste amount of multiple welding points from affecting the qualification rate.

The invention discloses a multifunctional electric appliance circuit board welding maintenance support, and relates to the technical field of circuit board welding maintenance, and the multifunctional electric appliance circuit board welding maintenance support comprises a double-belt lifting device, an elastic supporting and fixing device, an elastic conveying device, a flexible workbench and a self-adaptive frame. The elastic supporting and fixing device can adapt to electric appliances with different base shapes through deformation of the multiple elastic belts, so that the bearing function is achieved, and then the fixing function is achieved through self-adaptive deformation of the self-adaptive clamping mechanism. According to the compliant workbench, two-stage lifting is achieved through the compliant mechanism and the hydraulic lifting mechanism, the lifting transposition function is achieved, and then the welding function of an electric appliance circuit board is achieved through the welding mechanism. According to the double-belt lifting device, a left belt and a right belt are tensioned through movement of a tensioning wheel, so that the left belt wheel and the right belt wheel rotate asynchronously, the front-back and left-right inclination function of the elastic supporting and fixing device is achieved, and therefore the posture of an electric appliance circuit board can adapt to actual welding work.

According to one embodiment of the present invention, a brazing filler material for bonding a ceramic substrate and a metal plate to each other is characterized by having an endothermic peak within the range of from 550°C to 700°C in the temperature raising step in the DSC curve as determined by a differential scanning calorimeter (DSC). It is preferable that the brazing filler material contains Ag, Cu and Ti. In addition, it is preferable that the brazing filler material has two or more endothermic peaks within the range of from 550°C to 650°C in the temperature raising step.

This invention provides a manual solder paste printing device, including a base, a stencil height adjustment device, a squeegee sliding and height adjustment device, a stencil clamp, and a squeegee. The stencil height adjustment device is connected to the base and is movable relative to the base along a first direction. The stencil clamp is fixed to the stencil height adjustment device and is used to mount the stencil. The squeegee sliding and height adjustment device is connected to the stencil height adjustment device and is movable relative to the stencil height adjustment device along a second direction. The squeegee is fixed to the squeegee sliding and height adjustment device and is able to drive the squeegee to move along the first direction, and the squeegee can contact the stencil. The solder paste coating thickness of this invention is uniform, improving the consistency and stability of manual operation.

This application discloses an active metal bonding substrate material and its manufacturing method. The substrate material comprises a ceramic substrate layer, a first bonding layer, a second bonding layer, and a conductive metal layer stacked sequentially. The first bonding layer comprises a first metal composite material containing silver (Ag), copper (Cu), and a first active metal component. Based on a total weight of 100 parts by weight of the first metal composite material, the silver content is not less than 50 parts by weight. The second bonding layer comprises a second metal composite material containing a low-melting-point metal component, copper, and a second active metal component, but does not contain silver. The melting point of the low-melting-point metal component is between 130°C and 350°C. Based on a total weight of 100 parts by weight of the second metal composite material, the low-melting-point metal component content is between 10 and 40 parts by weight. This effectively reduces the amount of silver used and lowers the bonding temperature to below 900°C, thereby reducing the impact of high temperatures on metal properties and simultaneously reducing material and process costs.

The invention provides circuit board welding equipment and a production process thereof, and relates to the technical field of circuit board welding. The circuit board welding equipment comprises a welding workbench, the upper surface of the welding workbench is fixedly connected with a welding operation box body, the front side of the welding operation box body is rotationally connected with a closed front door plate, and an opening and closing assembly is arranged between the closed front door plate and the welding operation box body. According to the welding device, a second servo motor is started, an output shaft of the second servo motor drives a bidirectional threaded rod to rotate, and a first threaded block and a second threaded block are close to each other, so that an upper closed partition plate and a lower closed partition plate are close to each other and make contact with a square rotating plate, and the interior of a welding operation box is divided into a front space and a rear space; the welding space on the rear side is in a closed state, air in the front side space cannot enter the rear side space, it is guaranteed that welding operation is not affected by the air, and the welding quality of the circuit board is improved.

An image sensor mounted on a printed circuit board is installed in a camera. A holder comprises a first rail with a first printed circuit board and a second rail with a second printed circuit board, and the holder is fixed to a lens mount of the camera. The holder can be attached to imperviously hold the image sensor, and the image sensor can be elastically supported while impervious. A gripper grasps the image sensor near the holder and aligns it to an oriented position relative to the lens mount. The image sensor can be moved into the oriented position after an image has been directed to the image sensor to generate a processed image for determining relative orientation.The printed image sensor board is soldered or glued to the first and / or second printed circuit board in such a way that the holder holds the image sensor securely, so that the holder is immovable in its aligned position.

The invention relates to the technical field of PCB welding, in particular to PCB welding equipment which comprises a preheating system, a vacuum heating furnace, a cooling system, a platform assembly and a transfer assembly, a feeding port and a discharging port are formed in the two sides of the vacuum heating furnace respectively, the feeding port is communicated with the preheating system, the discharging port is communicated with the cooling system, and the vacuum heating furnace is communicated with the platform assembly. The platform assembly is arranged in the vacuum heating furnace, a plurality of bearing seats are arranged in the vacuum heating furnace, the bearing seats are connected with the platform assembly, the transfer assembly is arranged in the vacuum heating furnace, and the transfer assembly transports a plurality of PCBs from the preheating system to the bearing seats. And the plurality of PCBs are transported to a cooling system from the bearing seat. According to the invention, the plurality of PCBs are transported to the bearing seat, and then the plurality of PCBs are subjected to vacuum reflow soldering at the same time, so that the situation that the soldering speed is slowed down due to one-board one-soldering is avoided, and the processing efficiency of the PCBs is improved.

An insulated metal substrate (1) for a power semiconductor device is provided. The insulated metal substrate (1) includes a metal base (2), a dielectric layer (3) disposed on the metal base (2), a conductive layer (4) disposed on the dielectric layer (3), and a reinforcing structure (5), the reinforcing structure (5) being disposed in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). A method for manufacturing the insulated metal substrate is also provided.

The invention relates to a method for adjusting the distribution position of soldering flux on a circuit board, which comprises the following steps of: preparing the circuit board, distributing a plurality of soldering points on the surface of the circuit board, arranging a layer of soldering flux on the circuit board, and covering the soldering points with the soldering flux; optical alignment operation is carried out, the circuit board is sent to an operation area, an optical photographic lens is used for shooting the circuit board, and position information is output after operation; laser clearing operation is carried out, a laser generator is used for generating laser rays, redundant scaling powder around the multiple welding points is removed according to position information, and only the scaling powder is distributed on the top faces of the welding points; and performing automatic optical inspection operation to judge whether the circuit board is a good product or a defective product, so that the scaling powder with the same distribution area is accurately formed on the top surfaces of multiple welding points on the circuit board, the subsequent welding quality is improved, and residual scaling powder can be completely removed after the circuit board passes through a reflow oven in a subsequent process, so that the production efficiency is improved. And the procedure of cleaning redundant soldering flux on the circuit board is omitted.

The application belongs to the technical field of circuit board manufacturing, and particularly relates to an integrated circuit board mounting jig, which comprises a jig platform assembly. The jig platform assembly is a hollow structure in a rectangular shape. First air cylinders are embedded and mounted on both sides of the outer wall of the jig platform assembly. The output end of each first air cylinder is drivingly connected with a positioning plate. A positioning groove is formed in the outer wall of the positioning plate. The integrated circuit board body and the steel mesh are lifted by a lifting slope. After the two ends of the integrated circuit board body and the steel mesh are movably clamped on the inner wall of the limiting groove, the integrated circuit board body, the steel mesh and the positioning groove are arranged in the same horizontal position. The output end of the first air cylinder is used to push the positioning plate, so that the positioning groove movably clamps the other two ends of the integrated circuit board body and the steel mesh. The position alignment is used for the integrated circuit board body and the steel mesh in the stacking state to perform the tin paste printing stage, so as to prevent the printing deviation.

The invention relates to the technical field of circuit board welding and printing equipment, and discloses reflow soldering equipment for PCB (printed circuit board) processing, which comprises a bracket, a positioning seat for positioning a circuit board body is fixedly arranged at the top of the bracket, a fixing plate is fixedly connected to the bottom of the positioning seat, and a fixing ring is fixedly connected to the top of the fixing plate in a sleeving manner. Solder paste on the side wall of the bottom end of the pin inserted into the electroplating through hole is scraped and reserved through the inner wall of the communicating hole in the fixing ring, and the solder paste which is communicated with the redundant pin and is difficult to flow back into the electroplating through hole subsequently is removed through the shearing mechanism, so that extra pollution of a reflow furnace caused by the solder paste of the part is avoided; the device has the advantages that the device is simple in structure and convenient to operate, sufficient solder paste in the electroplating through holes is guaranteed, subsequent secondary pin trimming is not needed, the elastic membrane is expanded to attach the scraped solder paste to the pins in cooperation with the adjusting mechanism and the shearing mechanism before shearing, the pins are fixed in cooperation, and stability of the trimming process and coating of sufficient solder paste on the pins are guaranteed.

The invention relates to a calibration tool (1) for calibration for a selective welding device (100), comprising a workpiece carrier unit (2) for receiving at least one or more workpieces (3) and at least one workpiece, such as a printed circuit board (4), and at least one measuring unit (3a). Wherein the measuring unit (3a) is designed as a distance measuring unit (5), which can be accommodated within the workpiece carrier unit (2) for calibrating a distance (2b) of a bearing surface (2a) of the workpiece carrier unit (2) to at least one welding tip (6) of the welding unit (101); or is designed as at least one temperature measuring unit (7) which can be accommodated within the workpiece carrier unit (2) for calibrating at least one heating power of the preheating unit (102); the welding unit (101) is designed as a workpiece carrier unit (2) or as at least one wave height measuring unit (8) which can be accommodated within the workpiece carrier unit (2) in order to calibrate a wave height (9) at at least one welding tip (6) of the welding unit (101).

The invention discloses a welding jig for circuit board manufacturing, and relates to the technical field of circuit board welding. Comprising a tin brushing auxiliary part, and an assembly separator is mounted on the tin brushing auxiliary part and used for positioning a patch device; a downward pressing stabilizing piece is mounted on the assembly separating piece; a spacing gasket piece is inserted into the assembly separator in a sliding manner; the spacing gasket piece is used for keeping a gap between the patch device and the circuit board; by the adoption of the assembly partition piece and the pressing stabilizing piece, all patch devices can be conveniently limited, the stability during welding is kept, meanwhile, by means of the mode of limiting the patch devices and keeping the stability, subsequent heating welding work can be conveniently conducted, and transferring is more stable; the problems that an existing welding jig for circuit board manufacturing is poor in stability when a circuit board is transferred, patch devices are prone to shaking and displacement, and welding gaps of the patch devices are inconvenient to maintain are solved.

An insulated metal substrate (1) for a power semiconductor device is specified, comprising —a metal base (2), —a dielectric layer (3) arranged on the metal base (2), —an electrically conductive layer (4) arranged on the dielectric layer (3), and —a reinforcement structure (5), wherein —the reinforcement structure (5) is arranged in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). Furthermore, a method for producing an insulated metal substrate is specified.