58results about "Metallurgical bonding" patented technology

A power module and an auxiliary supporting device adapted thereto are provided. The auxiliary supporting device is used to maintain a first circuit board in a vertical state on a second circuit board. The auxiliary supporting device includes a first plate and a second plate. The first plate is parallel to and fixed to the first circuit board. The second plate is extended from the first plate in a direction away from the first circuit board. A bottom edge of the second plate is disposed on a surface of the second circuit board facing the first circuit board. The auxiliary supporting device is universally suitable for different combinations between the first plate and the second plate without the need of customized tool.

An insulating metal substrate (1) for a power semiconductor device is specified, comprising:-a metal base (2),-a dielectric layer (3) arranged on the metal base (2),-an electrically conductive layer (4) arranged on the dielectric layer (3), and-a reinforcement structure (5), the reinforcement structure (5) being arranged in a peripheral region of the insulating metal substrate (1), the peripheral region at least partially surrounds the central region of the insulating metal substrate (1). Further, a method for manufacturing an insulating metal substrate is specified.

The application discloses an active metal brazing substrate material containing aluminum element and a manufacturing method thereof. The substrate material comprises a ceramic substrate layer, a first brazing layer, a second brazing layer and a conductive metal layer which are sequentially stacked. The first brazing layer comprises a first metal composite material containing metal silver (Ag), metal copper (Cu) and a first active metal component. The content of silver is not less than 50 parts by weight based on the total weight of the first metal composite material being 100 parts by weight. The second brazing layer comprises a second metal composite material containing metal aluminum (Al), metal copper (Cu) and a second active metal component, and does not contain metal silver. The content of aluminum is not less than 40 parts by weight based on the total weight of the second metal composite material being 100 parts by weight. The total thickness of the first and second brazing layers is not less than 12 microns, and the thickness of the first brazing layer is not less than 5 microns. In this way, the amount of silver is effectively reduced, the brazing temperature is reduced to below 900 DEG C, the influence of high temperature on the metal performance is reduced, and the material and process costs are reduced.

The present invention relates to the field of visual recognition, and discloses a method for intelligently adding solder paste to a fully automatic visual printer based on visual interactive recognition, comprising the following steps: collecting visual images in a solder paste working area, and performing feature extraction and analysis on the solder paste in the image, determining the distribution of the solder paste in combination with the analysis results, and classifying the solder paste storage area, and then performing intelligent addition processing on the solder paste in combination with the real-time weight data of the solder paste, and finally generating a solder paste distribution sequence table for a solder paste spot welding head. The present invention can perform visual analysis on the solder paste in the solder paste storage area in the fully automatic visual printer, and generate a solder paste addition plan based on the visual analysis results, thereby preventing the printer from being unable to maintain normal printing due to a small amount of solder paste.

The present invention relates to a laser welding apparatus including a lower jig, a laser welding unit configured to weld a metal and another metal to each other, the metal being disposed at an upper surface of a PCB disposed on the lower jig, and an upper jig configured to support at least one of at least a part of the upper surface of the PCB, at least a part of an upper surface of the metal, and at least a part of an upper surface of the another metal, wherein the upper jig is fixed such that the vertical position of the upper jig is constant, or when the upper jig is moved upwards and downwards, the upper jig is configured to be fixed at a specific position, and a welding method using the same. A laser welding apparatus capable of performing welding while vibrating a PCB and a welding method using the same are also disclosed.

The invention relates to the technical field of the electronic manufacturing industry, in particular to a lead-free wave welding hole blowing machining process control method and application thereof. By limiting the copper deposition degumming treatment rate to be 0.15-0.6 mg / cm < 2 >, it is guaranteed that the backlight grade of the hole wall after copper deposition is larger than or equal to 9, organic matter and pollutants of the hole wall can be effectively removed, the hole wall has proper roughness and activity, the binding force of a copper deposition layer and the hole wall is enhanced, and the hole metallization reliability is improved. During copper electroplating treatment, the current density is set to be 15-25 ASF, the time is controlled to be 20-22 minutes, a copper layer can be evenly and compactly deposited, it is guaranteed that the hole copper thickness reaches the standard, and the conductivity and mechanical performance are improved. And finally, performing windowing treatment on the solder-resisting PTH hole, and by virtue of a reasonable windowing design, assisting solder to be smoothly filled during wave soldering, reducing hole blowing and pseudo soldering, and remarkably improving the welding quality and the production yield.

A bonded body, which is a bonded body provided with a ceramic substrate and a copper plate bonded to the ceramic substrate via a bonding layer, characterized in that the copper plate has a surface perpendicular to the direction in which the ceramic substrate and the copper plate are bonded, and in that the proportion of the number of copper grains having a long diameter of more than 400 μm is 0% to 5% in three regions of 5 mm x 5 mm contained in the surface. The bonding temperature is preferably 800°C or lower. Furthermore, the proportion of the number of copper grains having a long diameter of more than 400 μm is preferably 1% or lower.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A method of manufacturing a printed wiring assembly "PWA" on a substrate, is provided herein. The method includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.

The invention provides a solder paste mixed printing method for a bare chip and an SMT device, and relates to the technical field of electronic assembly.The solder paste mixed printing method for the bare chip and the SMT device comprises the following steps that a first steel mesh and a second steel mesh are designed and processed according to a preset bare chip area and a preset surface mounting element area; printing solder paste in a predetermined bare chip area by using a first steel mesh and first solder paste; a second steel mesh and second solder paste are used for printing solder paste in a preset surface mounting element area; wherein the second steel mesh is provided with a protection structure, and the protection structure can prevent the second steel mesh from making contact with or damaging the solder paste printed in the preset bare chip area in the printing process. By adopting a two-time solder paste printing process and utilizing the second steel mesh with a special protection structure, the problems that in the prior art, the solder paste printing requirements of a bare chip and an SMT device cannot be met at the same time, solder paste damage is easily caused, the number of welding defects is large, the process is complex, and the cost is high are solved.

The application provides a kind of semi-automatic wire threading welding method, comprising the following steps: S1, the steel sheet in the welding device is placed on the spring on the base pin and positioned on the upper part of the base;S2, the steel sheet is adjusted to the required height by the steel sheet adjusting stud;S3, manually rotate the base adjusting stud to make the bottom cover plate assembly move downward, when the bottom cover plate assembly contacts the silver-plated wire on the steel sheet, the steel sheet will thread the silver-plated wire through the printed board pad hole;S4, the steel sheet continues to move downward with the base adjusting stud, the silver-plated wire slowly passes through the printed board, and when the base adjusting stud fits the bottom cover plate assembly, the steel sheet and the base together, the silver-plated wire length is the required length for product welding after the stud is tightened.The semi-automatic wire threading welding method can adapt to mass production welding, save one person's serial work time to complete the whole process, and improve production efficiency.

According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550° C. and not more than 650° C. in the heating process.

A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

The invention relates to the technical field of circuit board surface assembly production lines, and discloses a circuit board printing production line which at least comprises soldering tin printing equipment, soldering tin detection equipment and a board storage connection table. The board storage connection table comprises a conveying mechanism, a board storage mechanism, a first sensor and a control unit; the conveying mechanism comprises a first conveying structure, a second conveying structure and a third conveying structure which are sequentially arranged in the conveying direction. The plate storage mechanism comprises a storage frame; the first sensor is configured to sense the circuit board conveyed to the third conveying structure; after the control unit receives a defect signal fed back by the soldering tin detection equipment and a first induction signal fed back by the first inductor, the control unit can control the second conveying structure and the third conveying structure to reversely convey the circuit board until the first inductor stops feeding back the first induction signal to the control unit, and the storage frame ascends; and the supporting structure of the storage rack upwards ejects the circuit board returned to the second conveying structure away from the second conveying structure and stores the circuit board.

The invention belongs to the technical field of FPC board welding, and particularly relates to a welding device based on an FPC board and a component, the welding device comprises a thermocompression welding device, a placing table, a negative pressure mechanism arranged on the placing table and used for adsorbing the FPC board, and a door frame used for controlling a welding head to move, a hole is formed in the placing table, and an exhaust fan is arranged in the hole; a liquid feeding conical head is arranged in the placing table, the tip end of the liquid feeding conical head extends into the hole, a plugging ball is movably installed at the tip end of the liquid feeding conical head, a liquid nitrogen storage tank is arranged in the placing table, and a liquid feeding assembly is arranged in the placing table and used for extracting liquid nitrogen in the liquid nitrogen storage tank and feeding the liquid nitrogen into the liquid feeding conical head; by driving the contamination block to scratch the blocking ball, a small amount of liquid nitrogen is gasified to generate cold air flow, the cold air flow and the exhaust fan form collaborative cooling, the temperature of a plate body is stabilized, thermal stress deformation is avoided, the defects of insufficient soldering, partial soldering, continuous tin soldering and the like are effectively overcome, and the welding quality is greatly improved.

The application discloses a soldering jig for manufacturing a circuit board and relates to the technical field of circuit board soldering.The soldering jig comprises a tin brushing auxiliary part, an assembling partition is installed on the tin brushing auxiliary part, and the assembling partition is used for positioning a patch device; a pressing stabilizing part is installed on the assembling partition; a spacing gasket part is slidingly inserted into the assembling partition; and the spacing gasket part is used for keeping the gap between the patch device and the circuit board.The assembling partition and the pressing stabilizing part can be used for limiting each patch device and keeping the stability during soldering, and the structure can be used for facilitating subsequent heating and soldering work and stable transfer by limiting the patch device and keeping the stability, so as to solve the problems of poor stability of the soldering jig for manufacturing a circuit board during the transfer of the circuit board, easy shaking and displacement of the patch device and inconvenient keeping of the soldering gap of the patch device.

A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.

An insulated metal substrate (1) for a power semiconductor device is specified, comprising - a metal base (2), - a dielectric layer (3) arranged on the metal base (2), - an electrically conductive layer (4) arranged on the dielectric layer (3), and - a reinforcement structure (5), wherein - the reinforcement structure (5) is arranged in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). Furthermore, a method for producing an insulated metal substrate is specified.

To provide a method of adjusting a distribution position of flux on a circuit board.SOLUTION: A method of adjusting a distribution position of flux on a circuit board includes steps of: preparing a circuit board provided with flux covering a plurality of solder points distributed on a surface; performing optical position alignment work of sending the circuit board into a work region, imaging the circuit board by using an optical imaging lens, and outputting positional information after calculation; performing laser cleaning work of generating a laser beam by using a laser oscillator, removing excessive flux around the plurality of solder points on the basis of the positional information, and leaving only flux distributed on top surfaces of the solder points; and performing automatic optical inspection work for determining whether the circuit board is nondefective or defective. By the steps, flux having the same distribution region is formed on the top surfaces of the plurality of solder points on the circuit board, and successive soldering quality is improved. If there is remaining flux, the remaining flux can be completely removed via a reflow furnace in the subsequent step, and a step of cleaning excessive flux on the circuit board can be omitted.SELECTED DRAWING: Figure 1

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to an integrated circuit board installation jig which comprises a jig platform assembly, the jig platform assembly is of a rectangular hollow structure, first air cylinders are installed on the two sides of the outer wall of the jig platform assembly in an embedded mode, and the output ends of the first air cylinders are in transmission connection with positioning plates. A positioning groove is formed in the outer wall of the positioning plate, the integrated circuit board body and the steel mesh are lifted through the material lifting slopes, finally, after the two ends of the integrated circuit board body and the two ends of the steel mesh are movably clamped to the inner walls of the limiting grooves, the integrated circuit board body, the steel mesh and the positioning groove are arranged on the same horizontal plane, and then the output end of a first air cylinder is used for pushing the positioning plate; the other two ends of the integrated circuit board body and the other two ends of the steel mesh are movably clamped through the positioning grooves so that the integrated circuit board body and the steel mesh in the stacked state can be aligned in the solder paste printing stage, and printing deviation is prevented.

A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

The application discloses a tin paste smearing device for PCB processing and relates to the technical field of tin paste printing. The device comprises a supporting mechanism and further comprises an anti-oxidation storage mechanism connected with the supporting mechanism, which comprises a material box provided with tin paste holes corresponding to the circuit board pins at the bottom. The anti-oxidation storage mechanism is installed to make the material fully filled in the tin paste holes, guarantee the material amount of the welding points, and isolate the tin paste from the air to avoid tin paste oxidation. The anti-residue discharging mechanism and the tin paste deformation control mechanism are installed to push the tin paste out of the tin paste holes, avoid the friction between the tin paste and the tin paste holes, and prevent the tin paste from being left, and at the same time, the circuit board is lowered synchronously during discharging to avoid the tin paste from leaving the welding points and affecting the element welding qualification rate. The tin paste anti-shortage mechanism is installed to separate the tin paste from the discharging rod after the tin paste is pushed out, avoid the discharging rod from taking away part of the tin paste, and prevent the uneven tin paste amount of multiple welding points from affecting the qualification rate.

The invention discloses a multifunctional electric appliance circuit board welding maintenance support, and relates to the technical field of circuit board welding maintenance, and the multifunctional electric appliance circuit board welding maintenance support comprises a double-belt lifting device, an elastic supporting and fixing device, an elastic conveying device, a flexible workbench and a self-adaptive frame. The elastic supporting and fixing device can adapt to electric appliances with different base shapes through deformation of the multiple elastic belts, so that the bearing function is achieved, and then the fixing function is achieved through self-adaptive deformation of the self-adaptive clamping mechanism. According to the compliant workbench, two-stage lifting is achieved through the compliant mechanism and the hydraulic lifting mechanism, the lifting transposition function is achieved, and then the welding function of an electric appliance circuit board is achieved through the welding mechanism. According to the double-belt lifting device, a left belt and a right belt are tensioned through movement of a tensioning wheel, so that the left belt wheel and the right belt wheel rotate asynchronously, the front-back and left-right inclination function of the elastic supporting and fixing device is achieved, and therefore the posture of an electric appliance circuit board can adapt to actual welding work.

According to one embodiment of the present invention, a brazing filler material for bonding a ceramic substrate and a metal plate to each other is characterized by having an endothermic peak within the range of from 550°C to 700°C in the temperature raising step in the DSC curve as determined by a differential scanning calorimeter (DSC). It is preferable that the brazing filler material contains Ag, Cu and Ti. In addition, it is preferable that the brazing filler material has two or more endothermic peaks within the range of from 550°C to 650°C in the temperature raising step.

This invention provides a manual solder paste printing device, including a base, a stencil height adjustment device, a squeegee sliding and height adjustment device, a stencil clamp, and a squeegee. The stencil height adjustment device is connected to the base and is movable relative to the base along a first direction. The stencil clamp is fixed to the stencil height adjustment device and is used to mount the stencil. The squeegee sliding and height adjustment device is connected to the stencil height adjustment device and is movable relative to the stencil height adjustment device along a second direction. The squeegee is fixed to the squeegee sliding and height adjustment device and is able to drive the squeegee to move along the first direction, and the squeegee can contact the stencil. The solder paste coating thickness of this invention is uniform, improving the consistency and stability of manual operation.

The embodiment of the present application provides a flexible circuit board, a package connection structure, a package base and an optical semiconductor device, wherein the flexible circuit board includes: a dielectric layer; a conductive circuit, which is arranged on the dielectric layer and has a first terminal thereon, and the first terminal is used to weld with the first pad of the conductive wiring to form a welding area; the conductive circuit has an outer buffer zone, the outer buffer zone is adjacent to the boundary of the welding area, and the outer buffer zone extends outside the welding area, wherein the line width of the outer buffer zone gradually increases toward the direction close to the boundary of the welding area. This effectively alleviates the sudden change of impedance at the boundary of the welding area, ensures the stability and continuity of impedance, is conducive to reducing the return loss, reduces the signal reflectivity, ensures the integrity of the high-frequency signal, and enables the signal to maintain a high transmission rate.

This application discloses an active metal bonding substrate material and its manufacturing method. The substrate material comprises a ceramic substrate layer, a first bonding layer, a second bonding layer, and a conductive metal layer stacked sequentially. The first bonding layer comprises a first metal composite material containing silver (Ag), copper (Cu), and a first active metal component. Based on a total weight of 100 parts by weight of the first metal composite material, the silver content is not less than 50 parts by weight. The second bonding layer comprises a second metal composite material containing a low-melting-point metal component, copper, and a second active metal component, but does not contain silver. The melting point of the low-melting-point metal component is between 130°C and 350°C. Based on a total weight of 100 parts by weight of the second metal composite material, the low-melting-point metal component content is between 10 and 40 parts by weight. This effectively reduces the amount of silver used and lowers the bonding temperature to below 900°C, thereby reducing the impact of high temperatures on metal properties and simultaneously reducing material and process costs.

The invention provides circuit board welding equipment and a production process thereof, and relates to the technical field of circuit board welding. The circuit board welding equipment comprises a welding workbench, the upper surface of the welding workbench is fixedly connected with a welding operation box body, the front side of the welding operation box body is rotationally connected with a closed front door plate, and an opening and closing assembly is arranged between the closed front door plate and the welding operation box body. According to the welding device, a second servo motor is started, an output shaft of the second servo motor drives a bidirectional threaded rod to rotate, and a first threaded block and a second threaded block are close to each other, so that an upper closed partition plate and a lower closed partition plate are close to each other and make contact with a square rotating plate, and the interior of a welding operation box is divided into a front space and a rear space; the welding space on the rear side is in a closed state, air in the front side space cannot enter the rear side space, it is guaranteed that welding operation is not affected by the air, and the welding quality of the circuit board is improved.

An image sensor mounted on a printed circuit board is installed in a camera. A holder comprises a first rail with a first printed circuit board and a second rail with a second printed circuit board, and the holder is fixed to a lens mount of the camera. The holder can be attached to imperviously hold the image sensor, and the image sensor can be elastically supported while impervious. A gripper grasps the image sensor near the holder and aligns it to an oriented position relative to the lens mount. The image sensor can be moved into the oriented position after an image has been directed to the image sensor to generate a processed image for determining relative orientation.The printed image sensor board is soldered or glued to the first and / or second printed circuit board in such a way that the holder holds the image sensor securely, so that the holder is immovable in its aligned position.

A method and apparatus for automatically designing a steel mesh opening of a QFN device, and an electronic device and a storage medium. The method comprises: for a target device that has been subjected to QFN device verification, acquiring, as device parameters of the target device, a device pin height and a device appearance size in a device specification, a pin pad length, a pin pad width and a pad outer edge size of the target device on a PCB in ECAD data, and a preset pin pad steel mesh thickness and a preset pin bottom soldering tin thickness (S1); on the basis of the pin pad length and the pin pad width, determining a pin pad steel mesh opening parameter calculation model of the target device (S2); and on the basis of the device parameters of the target device and the pin pad steel mesh opening parameter calculation model, determining a pin pad steel mesh opening design result of the target device (S3). The method can accurately design a steel mesh opening for a QFN device, and can improve the quality of steel meshes and the welding quality, ensure product reliability, and reduce repair costs.