23results about "Metallurgical bonding" patented technology

A power module and an auxiliary supporting device adapted thereto are provided. The auxiliary supporting device is used to maintain a first circuit board in a vertical state on a second circuit board. The auxiliary supporting device includes a first plate and a second plate. The first plate is parallel to and fixed to the first circuit board. The second plate is extended from the first plate in a direction away from the first circuit board. A bottom edge of the second plate is disposed on a surface of the second circuit board facing the first circuit board. The auxiliary supporting device is universally suitable for different combinations between the first plate and the second plate without the need of customized tool.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

The application provides a kind of semi-automatic wire threading welding method, comprising the following steps: S1, the steel sheet in the welding device is placed on the spring on the base pin and positioned on the upper part of the base;S2, the steel sheet is adjusted to the required height by the steel sheet adjusting stud;S3, manually rotate the base adjusting stud to make the bottom cover plate assembly move downward, when the bottom cover plate assembly contacts the silver-plated wire on the steel sheet, the steel sheet will thread the silver-plated wire through the printed board pad hole;S4, the steel sheet continues to move downward with the base adjusting stud, the silver-plated wire slowly passes through the printed board, and when the base adjusting stud fits the bottom cover plate assembly, the steel sheet and the base together, the silver-plated wire length is the required length for product welding after the stud is tightened.The semi-automatic wire threading welding method can adapt to mass production welding, save one person's serial work time to complete the whole process, and improve production efficiency.

A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

The invention belongs to the technical field of FPC board welding, and particularly relates to a welding device based on an FPC board and a component, the welding device comprises a thermocompression welding device, a placing table, a negative pressure mechanism arranged on the placing table and used for adsorbing the FPC board, and a door frame used for controlling a welding head to move, a hole is formed in the placing table, and an exhaust fan is arranged in the hole; a liquid feeding conical head is arranged in the placing table, the tip end of the liquid feeding conical head extends into the hole, a plugging ball is movably installed at the tip end of the liquid feeding conical head, a liquid nitrogen storage tank is arranged in the placing table, and a liquid feeding assembly is arranged in the placing table and used for extracting liquid nitrogen in the liquid nitrogen storage tank and feeding the liquid nitrogen into the liquid feeding conical head; by driving the contamination block to scratch the blocking ball, a small amount of liquid nitrogen is gasified to generate cold air flow, the cold air flow and the exhaust fan form collaborative cooling, the temperature of a plate body is stabilized, thermal stress deformation is avoided, the defects of insufficient soldering, partial soldering, continuous tin soldering and the like are effectively overcome, and the welding quality is greatly improved.

The application discloses a soldering jig for manufacturing a circuit board and relates to the technical field of circuit board soldering.The soldering jig comprises a tin brushing auxiliary part, an assembling partition is installed on the tin brushing auxiliary part, and the assembling partition is used for positioning a patch device; a pressing stabilizing part is installed on the assembling partition; a spacing gasket part is slidingly inserted into the assembling partition; and the spacing gasket part is used for keeping the gap between the patch device and the circuit board.The assembling partition and the pressing stabilizing part can be used for limiting each patch device and keeping the stability during soldering, and the structure can be used for facilitating subsequent heating and soldering work and stable transfer by limiting the patch device and keeping the stability, so as to solve the problems of poor stability of the soldering jig for manufacturing a circuit board during the transfer of the circuit board, easy shaking and displacement of the patch device and inconvenient keeping of the soldering gap of the patch device.

The application discloses a tin paste smearing device for PCB processing and relates to the technical field of tin paste printing. The device comprises a supporting mechanism and further comprises an anti-oxidation storage mechanism connected with the supporting mechanism, which comprises a material box provided with tin paste holes corresponding to the circuit board pins at the bottom. The anti-oxidation storage mechanism is installed to make the material fully filled in the tin paste holes, guarantee the material amount of the welding points, and isolate the tin paste from the air to avoid tin paste oxidation. The anti-residue discharging mechanism and the tin paste deformation control mechanism are installed to push the tin paste out of the tin paste holes, avoid the friction between the tin paste and the tin paste holes, and prevent the tin paste from being left, and at the same time, the circuit board is lowered synchronously during discharging to avoid the tin paste from leaving the welding points and affecting the element welding qualification rate. The tin paste anti-shortage mechanism is installed to separate the tin paste from the discharging rod after the tin paste is pushed out, avoid the discharging rod from taking away part of the tin paste, and prevent the uneven tin paste amount of multiple welding points from affecting the qualification rate.

According to one embodiment of the present invention, a brazing filler material for bonding a ceramic substrate and a metal plate to each other is characterized by having an endothermic peak within the range of from 550°C to 700°C in the temperature raising step in the DSC curve as determined by a differential scanning calorimeter (DSC). It is preferable that the brazing filler material contains Ag, Cu and Ti. In addition, it is preferable that the brazing filler material has two or more endothermic peaks within the range of from 550°C to 650°C in the temperature raising step.

The invention provides circuit board welding equipment and a production process thereof, and relates to the technical field of circuit board welding. The circuit board welding equipment comprises a welding workbench, the upper surface of the welding workbench is fixedly connected with a welding operation box body, the front side of the welding operation box body is rotationally connected with a closed front door plate, and an opening and closing assembly is arranged between the closed front door plate and the welding operation box body. According to the welding device, a second servo motor is started, an output shaft of the second servo motor drives a bidirectional threaded rod to rotate, and a first threaded block and a second threaded block are close to each other, so that an upper closed partition plate and a lower closed partition plate are close to each other and make contact with a square rotating plate, and the interior of a welding operation box is divided into a front space and a rear space; the welding space on the rear side is in a closed state, air in the front side space cannot enter the rear side space, it is guaranteed that welding operation is not affected by the air, and the welding quality of the circuit board is improved.

An image sensor mounted on a printed circuit board is installed in a camera. A holder comprises a first rail with a first printed circuit board and a second rail with a second printed circuit board, and the holder is fixed to a lens mount of the camera. The holder can be attached to imperviously hold the image sensor, and the image sensor can be elastically supported while impervious. A gripper grasps the image sensor near the holder and aligns it to an oriented position relative to the lens mount. The image sensor can be moved into the oriented position after an image has been directed to the image sensor to generate a processed image for determining relative orientation.The printed image sensor board is soldered or glued to the first and / or second printed circuit board in such a way that the holder holds the image sensor securely, so that the holder is immovable in its aligned position.

The invention relates to the technical field of PCB welding, in particular to PCB welding equipment which comprises a preheating system, a vacuum heating furnace, a cooling system, a platform assembly and a transfer assembly, a feeding port and a discharging port are formed in the two sides of the vacuum heating furnace respectively, the feeding port is communicated with the preheating system, the discharging port is communicated with the cooling system, and the vacuum heating furnace is communicated with the platform assembly. The platform assembly is arranged in the vacuum heating furnace, a plurality of bearing seats are arranged in the vacuum heating furnace, the bearing seats are connected with the platform assembly, the transfer assembly is arranged in the vacuum heating furnace, and the transfer assembly transports a plurality of PCBs from the preheating system to the bearing seats. And the plurality of PCBs are transported to a cooling system from the bearing seat. According to the invention, the plurality of PCBs are transported to the bearing seat, and then the plurality of PCBs are subjected to vacuum reflow soldering at the same time, so that the situation that the soldering speed is slowed down due to one-board one-soldering is avoided, and the processing efficiency of the PCBs is improved.

An insulated metal substrate (1) for a power semiconductor device is provided. The insulated metal substrate (1) includes a metal base (2), a dielectric layer (3) disposed on the metal base (2), a conductive layer (4) disposed on the dielectric layer (3), and a reinforcing structure (5), the reinforcing structure (5) being disposed in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). A method for manufacturing the insulated metal substrate is also provided.

The invention relates to a calibration tool (1) for calibration for a selective welding device (100), comprising a workpiece carrier unit (2) for receiving at least one or more workpieces (3) and at least one workpiece, such as a printed circuit board (4), and at least one measuring unit (3a). Wherein the measuring unit (3a) is designed as a distance measuring unit (5), which can be accommodated within the workpiece carrier unit (2) for calibrating a distance (2b) of a bearing surface (2a) of the workpiece carrier unit (2) to at least one welding tip (6) of the welding unit (101); or is designed as at least one temperature measuring unit (7) which can be accommodated within the workpiece carrier unit (2) for calibrating at least one heating power of the preheating unit (102); the welding unit (101) is designed as a workpiece carrier unit (2) or as at least one wave height measuring unit (8) which can be accommodated within the workpiece carrier unit (2) in order to calibrate a wave height (9) at at least one welding tip (6) of the welding unit (101).

The invention discloses a welding jig for circuit board manufacturing, and relates to the technical field of circuit board welding. Comprising a tin brushing auxiliary part, and an assembly separator is mounted on the tin brushing auxiliary part and used for positioning a patch device; a downward pressing stabilizing piece is mounted on the assembly separating piece; a spacing gasket piece is inserted into the assembly separator in a sliding manner; the spacing gasket piece is used for keeping a gap between the patch device and the circuit board; by the adoption of the assembly partition piece and the pressing stabilizing piece, all patch devices can be conveniently limited, the stability during welding is kept, meanwhile, by means of the mode of limiting the patch devices and keeping the stability, subsequent heating welding work can be conveniently conducted, and transferring is more stable; the problems that an existing welding jig for circuit board manufacturing is poor in stability when a circuit board is transferred, patch devices are prone to shaking and displacement, and welding gaps of the patch devices are inconvenient to maintain are solved.

An insulated metal substrate (1) for a power semiconductor device is specified, comprising —a metal base (2), —a dielectric layer (3) arranged on the metal base (2), —an electrically conductive layer (4) arranged on the dielectric layer (3), and —a reinforcement structure (5), wherein —the reinforcement structure (5) is arranged in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). Furthermore, a method for producing an insulated metal substrate is specified.

The present invention relates to a laser welding apparatus and a welding method using the same. The laser welding apparatus includes a lower jig, a laser welding unit that welds a metal arranged on an upper surface of a PCB arranged on the lower jig to another metal, and an upper jig that supports at least one of at least a part of the upper surface of the PCB, at least a part of the upper surface of the metal, and at least a part of the upper surface of the other metal. The upper jig may be fixed so that its vertical position is constant, or may be fixed at a specific position when the upper jig moves up and down. The present invention also relates to a laser welding apparatus that can weld a PCB while vibrating it, and a welding method using the same.

The application relates to the technical field of circuit board welding printing equipment, and discloses a reflow soldering device for PCB processing, which comprises a support, a positioning seat for positioning a circuit board body is fixedly arranged at the top of the support, a fixed plate is fixedly connected to the bottom of the positioning seat, and a fixed ring is fixedly sleeved at the top of the fixed plate. In the application, the tin paste on the sidewall of the bottom end of the inserted pin in the electroplating through hole is scraped and reserved through the inner wall of the communicating hole on the fixed ring, the shearing mechanism is used to remove the tin paste of the excess length of the pin which is difficult to flow into the electroplating through hole, the tin paste of the part is prevented from causing additional pollution of the reflow furnace, the amount of the tin paste in the electroplating through hole is ensured to be sufficient, secondary pin trimming is not needed, the scraped tin paste is attached to the pin through the expansion of the elastic diaphragm before shearing in cooperation with the adjusting mechanism and the shearing mechanism, the pin is fixed, the stability of the trimming process is ensured, and the pin is covered with sufficient tin paste.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A method for adjusting flux distribution positions on a circuit board is provided. The method includes: preparing a circuit board with a plurality of soldering joints distributed on its surface and applying a layer of flux to cover the soldering joints; performing optical alignment by transferring the circuit board to a working area, capturing an image of the circuit board with an optical camera, and calculating position information; performing laser cleaning by utilizing a laser generator to emit laser light and remove excess flux around the soldering joints based on the position information, leaving flux only on the top surfaces of the soldering joints; and conducting automated optical inspection to verify whether the circuit board is defective. This method ensures precise flux distribution on the solder joints' top surfaces, enhancing the quality and reliability of subsequent soldering processes.

An insulated metal substrate (1) for a power semiconductor device is provided. The insulated metal substrate (1) includes a metal base (2), a dielectric layer (3) disposed on the metal base (2), a conductive layer (4) disposed on the dielectric layer (3), and a reinforcing structure (5), the reinforcing structure (5) being disposed in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). A method for manufacturing the insulated metal substrate is also provided.

Embodiments of this application provide a circuit board assembly, a manufacturing method, and an electronic device. The circuit board assembly includes a flexible printed circuit board and a printed circuit board, a pad for disposing a welding piece is provided on the printed circuit board, the flexible printed circuit board includes a main body and a welding part disposed on an inner wall of a through hole of the main body, the through hole includes a recessing part and a connection segment connected to a bottom wall of the recessing part, the recessing part is disposed on a side that is of the connection segment and that is away from the pad, and an end that is of the connection segment and that is away from the recessing part faces the pad, so that the welding piece overflows into the recessing part through the connection segment, and welds the welding part to the pad. The circuit board assembly of this application reduces welding difficulty and a risk of poor welding of the flexible printed circuit board and the printed circuit board.

To provide a method of adjusting a distribution position of flux on a circuit board.SOLUTION: A method of adjusting a distribution position of flux on a circuit board includes steps of: preparing a circuit board provided with flux covering a plurality of solder points distributed on a surface; performing optical position alignment work of sending the circuit board into a work region, imaging the circuit board by using an optical imaging lens, and outputting positional information after calculation; performing laser cleaning work of generating a laser beam by using a laser oscillator, removing excessive flux around the plurality of solder points on the basis of the positional information, and leaving only flux distributed on top surfaces of the solder points; and performing automatic optical inspection work for determining whether the circuit board is nondefective or defective. By the steps, flux having the same distribution region is formed on the top surfaces of the plurality of solder points on the circuit board, and successive soldering quality is improved. If there is remaining flux, the remaining flux can be completely removed via a reflow furnace in the subsequent step, and a step of cleaning excessive flux on the circuit board can be omitted.SELECTED DRAWING: Figure 1

The application discloses a small-distance wave crest material and a welding method thereof. The small-distance wave crest material comprises a circuit board, a mounting material mounted on one side surface of the circuit board, and a wave crest material comprising a plurality of inserts welded on the side surface of the circuit board on which the mounting material is mounted. The distance between the mounting material and the wave crest material is not more than 1 mm. The above structure can prevent material welding short circuit and save the circuit board surface welding area.