114results about "Metallurgical bonding" patented technology

The invention discloses an automatic screw welding device, and belongs to the field of welding devices.The automatic screw welding device comprises a case, a welding cavity is formed in the case, an auxiliary observation mechanism is arranged on the inner wall of one side of the welding cavity, a case door is movably connected to one side face of the case, and a dustproof feeding assembly is fixedly connected to the inner side face of the case door; a base plate clamping and fixing assembly is fixedly connected to the position, close to the middle, of the bottom end face of the welding cavity, a welding robot is arranged on one side of the base plate clamping and fixing assembly, a material taking robot is arranged on the other side of the base plate clamping and fixing assembly, and an impurity collecting mechanism is arranged below the base plate clamping and fixing assembly. The base plate clamping and fixing assembly specifically comprises two side plates oppositely fixed to the bottom end face of the welding cavity, and a supporting frame is rotationally connected between the two side plates. According to the multi-angle welding device, the angle of the fixed base plate can be adjusted on the horizontal plane and the vertical plane according to needs, then multi-angle more comprehensive welding can be conveniently conducted on the welding position, and the welding effect is improved.

The invention discloses a high-precision surface mounting device for intelligent electric meter production, and relates to the technical field of electric meter production, the high-precision surface mounting device comprises a device main body and a surface mounting part, and the surface mounting part is used for mounting an electronic component on a circuit board brushed with solder paste. The electric push rods on the two sides of the storage box are connected with the lower pressing plate in the middle, supporting rods are driven to ascend and descend in the ascending and descending process of the electric push rods, then a first piston plate moves in the storage box, and a worker can place solder paste into the storage box at a time; at the moment, solder paste at the bottom of the storage box is extruded downwards under the action of a first piston plate, contact between the solder paste and air is reduced, the quality of the solder paste is guaranteed, a gap exists between the bottom of the storage box and the top of a conveying assembly in cooperation with the conveying assembly, the phenomenon that the solder paste overflows in the tin soldering process is avoided, the solder paste printing time is shortened, and the labor cost is reduced; meanwhile, the amount of residual solder paste at the bottom of the solder paste printing assembly is reduced, and the solder paste printing quality is improved.

A power module and an auxiliary supporting device adapted thereto are provided. The auxiliary supporting device is used to maintain a first circuit board in a vertical state on a second circuit board. The auxiliary supporting device includes a first plate and a second plate. The first plate is parallel to and fixed to the first circuit board. The second plate is extended from the first plate in a direction away from the first circuit board. A bottom edge of the second plate is disposed on a surface of the second circuit board facing the first circuit board. The auxiliary supporting device is universally suitable for different combinations between the first plate and the second plate without the need of customized tool.

The invention relates to the field of visual identification, and discloses a full-automatic visual printer solder paste intelligent adding method based on visual interaction identification, which comprises the following steps: collecting a visual image in a solder paste working area, and carrying out feature extraction analysis on solder paste in the image; the distribution condition of the solder paste is determined according to the analysis result, the solder paste storage areas are classified, the solder paste is intelligently added according to the real-time weight data of the solder paste, and finally a solder paste distribution sequence table of the solder paste spot welding head is generated. The solder paste in the solder paste storage area in the full-automatic visual printing machine can be visually analyzed, the solder paste adding scheme is generated based on the visual analysis result, and the phenomenon that the printing machine cannot maintain normal printing due to the small solder paste amount is prevented.

An insulating metal substrate (1) for a power semiconductor device is specified, comprising:-a metal base (2),-a dielectric layer (3) arranged on the metal base (2),-an electrically conductive layer (4) arranged on the dielectric layer (3), and-a reinforcement structure (5), the reinforcement structure (5) being arranged in a peripheral region of the insulating metal substrate (1), the peripheral region at least partially surrounds the central region of the insulating metal substrate (1). Further, a method for manufacturing an insulating metal substrate is specified.

The application discloses an active metal brazing substrate material containing aluminum element and a manufacturing method thereof. The substrate material comprises a ceramic substrate layer, a first brazing layer, a second brazing layer and a conductive metal layer which are sequentially stacked. The first brazing layer comprises a first metal composite material containing metal silver (Ag), metal copper (Cu) and a first active metal component. The content of silver is not less than 50 parts by weight based on the total weight of the first metal composite material being 100 parts by weight. The second brazing layer comprises a second metal composite material containing metal aluminum (Al), metal copper (Cu) and a second active metal component, and does not contain metal silver. The content of aluminum is not less than 40 parts by weight based on the total weight of the second metal composite material being 100 parts by weight. The total thickness of the first and second brazing layers is not less than 12 microns, and the thickness of the first brazing layer is not less than 5 microns. In this way, the amount of silver is effectively reduced, the brazing temperature is reduced to below 900 DEG C, the influence of high temperature on the metal performance is reduced, and the material and process costs are reduced.

The present invention relates to the field of visual recognition, and discloses a method for intelligently adding solder paste to a fully automatic visual printer based on visual interactive recognition, comprising the following steps: collecting visual images in a solder paste working area, and performing feature extraction and analysis on the solder paste in the image, determining the distribution of the solder paste in combination with the analysis results, and classifying the solder paste storage area, and then performing intelligent addition processing on the solder paste in combination with the real-time weight data of the solder paste, and finally generating a solder paste distribution sequence table for a solder paste spot welding head. The present invention can perform visual analysis on the solder paste in the solder paste storage area in the fully automatic visual printer, and generate a solder paste addition plan based on the visual analysis results, thereby preventing the printer from being unable to maintain normal printing due to a small amount of solder paste.

The invention discloses an active metal brazing substrate material containing an aluminum element and a manufacturing method of the active metal brazing substrate material. The substrate material comprises a ceramic substrate layer, a first hard welding layer, a second hard welding layer and a conductive metal layer which are stacked in sequence. The first brazing layer includes a first metal composite material including metallic silver (Ag), metallic copper (Cu), and a first active metal component. Based on 100 parts by weight of the total weight of the first metal composite material, the content of silver is not less than 50 parts by weight. The second braze layer includes a second metal composite material including metallic aluminum (Al), metallic copper (Cu), and a second active metal component, and does not include metallic silver. Based on 100 parts by weight of the total weight of the second metal composite material, the content of aluminum is not less than 40 parts by weight. The total thickness of the first and second braze layers is not less than 12 microns and the thickness of the first braze layer is not less than 5 microns. Therefore, the use amount of silver is effectively reduced, the brazing temperature is reduced to below 900 DEG C, the influence of high temperature on the metal performance is reduced, and meanwhile, the material and manufacturing cost is reduced.

The present invention relates to a laser welding apparatus including a lower jig, a laser welding unit configured to weld a metal and another metal to each other, the metal being disposed at an upper surface of a PCB disposed on the lower jig, and an upper jig configured to support at least one of at least a part of the upper surface of the PCB, at least a part of an upper surface of the metal, and at least a part of an upper surface of the another metal, wherein the upper jig is fixed such that the vertical position of the upper jig is constant, or when the upper jig is moved upwards and downwards, the upper jig is configured to be fixed at a specific position, and a welding method using the same. A laser welding apparatus capable of performing welding while vibrating a PCB and a welding method using the same are also disclosed.

The invention relates to the technical field of the electronic manufacturing industry, in particular to a lead-free wave welding hole blowing machining process control method and application thereof. By limiting the copper deposition degumming treatment rate to be 0.15-0.6 mg / cm < 2 >, it is guaranteed that the backlight grade of the hole wall after copper deposition is larger than or equal to 9, organic matter and pollutants of the hole wall can be effectively removed, the hole wall has proper roughness and activity, the binding force of a copper deposition layer and the hole wall is enhanced, and the hole metallization reliability is improved. During copper electroplating treatment, the current density is set to be 15-25 ASF, the time is controlled to be 20-22 minutes, a copper layer can be evenly and compactly deposited, it is guaranteed that the hole copper thickness reaches the standard, and the conductivity and mechanical performance are improved. And finally, performing windowing treatment on the solder-resisting PTH hole, and by virtue of a reasonable windowing design, assisting solder to be smoothly filled during wave soldering, reducing hole blowing and pseudo soldering, and remarkably improving the welding quality and the production yield.

A bonded body, which is a bonded body provided with a ceramic substrate and a copper plate bonded to the ceramic substrate via a bonding layer, characterized in that the copper plate has a surface perpendicular to the direction in which the ceramic substrate and the copper plate are bonded, and in that the proportion of the number of copper grains having a long diameter of more than 400 μm is 0% to 5% in three regions of 5 mm x 5 mm contained in the surface. The bonding temperature is preferably 800°C or lower. Furthermore, the proportion of the number of copper grains having a long diameter of more than 400 μm is preferably 1% or lower.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A method of manufacturing a printed wiring assembly "PWA" on a substrate, is provided herein. The method includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.

The invention provides a solder paste mixed printing method for a bare chip and an SMT device, and relates to the technical field of electronic assembly.The solder paste mixed printing method for the bare chip and the SMT device comprises the following steps that a first steel mesh and a second steel mesh are designed and processed according to a preset bare chip area and a preset surface mounting element area; printing solder paste in a predetermined bare chip area by using a first steel mesh and first solder paste; a second steel mesh and second solder paste are used for printing solder paste in a preset surface mounting element area; wherein the second steel mesh is provided with a protection structure, and the protection structure can prevent the second steel mesh from making contact with or damaging the solder paste printed in the preset bare chip area in the printing process. By adopting a two-time solder paste printing process and utilizing the second steel mesh with a special protection structure, the problems that in the prior art, the solder paste printing requirements of a bare chip and an SMT device cannot be met at the same time, solder paste damage is easily caused, the number of welding defects is large, the process is complex, and the cost is high are solved.

The application provides a kind of semi-automatic wire threading welding method, comprising the following steps: S1, the steel sheet in the welding device is placed on the spring on the base pin and positioned on the upper part of the base;S2, the steel sheet is adjusted to the required height by the steel sheet adjusting stud;S3, manually rotate the base adjusting stud to make the bottom cover plate assembly move downward, when the bottom cover plate assembly contacts the silver-plated wire on the steel sheet, the steel sheet will thread the silver-plated wire through the printed board pad hole;S4, the steel sheet continues to move downward with the base adjusting stud, the silver-plated wire slowly passes through the printed board, and when the base adjusting stud fits the bottom cover plate assembly, the steel sheet and the base together, the silver-plated wire length is the required length for product welding after the stud is tightened.The semi-automatic wire threading welding method can adapt to mass production welding, save one person's serial work time to complete the whole process, and improve production efficiency.

According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550° C. and not more than 650° C. in the heating process.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

The invention discloses a multi-layer wiring ceramic circuit board bonding process, which comprises the following steps of: completing processing of a bottom layer circuit of a single-layer circuit board, and electroplating and thickening a metal bonding pad for multi-layer welding on the basis of bottom layer metal; printing ink on the bonding surface, polishing the ink and the thickening layer to be in an equal-height state by adopting a polishing process, exposing and developing the ink, and then baking and curing; carrying out surface metallization treatment on the cured ceramic circuit board; performing electron beam plating of a gold-tin solder on the metal surface of the thickening layer on the metallized ceramic substrate; the bonding surfaces of different single-layer circuit boards subjected to solder thickening are face-to-face, high-precision alignment stacking and fixing are carried out through equipment, and reflow soldering is carried out at the highest temperature of 300 DEG C. The method has the advantages that an electroplating thickening mode is matched with an ink screen printing mode, the insulation effect between different circuits can be effectively achieved, and the problem of welding flux flowing short circuit possibly caused in the subsequent welding process is avoided.

The invention relates to the technical field of circuit board surface assembly production lines, and discloses a circuit board printing production line which at least comprises soldering tin printing equipment, soldering tin detection equipment and a board storage connection table. The board storage connection table comprises a conveying mechanism, a board storage mechanism, a first sensor and a control unit; the conveying mechanism comprises a first conveying structure, a second conveying structure and a third conveying structure which are sequentially arranged in the conveying direction. The plate storage mechanism comprises a storage frame; the first sensor is configured to sense the circuit board conveyed to the third conveying structure; after the control unit receives a defect signal fed back by the soldering tin detection equipment and a first induction signal fed back by the first inductor, the control unit can control the second conveying structure and the third conveying structure to reversely convey the circuit board until the first inductor stops feeding back the first induction signal to the control unit, and the storage frame ascends; and the supporting structure of the storage rack upwards ejects the circuit board returned to the second conveying structure away from the second conveying structure and stores the circuit board.

The invention belongs to the technical field of FPC board welding, and particularly relates to a welding device based on an FPC board and a component, the welding device comprises a thermocompression welding device, a placing table, a negative pressure mechanism arranged on the placing table and used for adsorbing the FPC board, and a door frame used for controlling a welding head to move, a hole is formed in the placing table, and an exhaust fan is arranged in the hole; a liquid feeding conical head is arranged in the placing table, the tip end of the liquid feeding conical head extends into the hole, a plugging ball is movably installed at the tip end of the liquid feeding conical head, a liquid nitrogen storage tank is arranged in the placing table, and a liquid feeding assembly is arranged in the placing table and used for extracting liquid nitrogen in the liquid nitrogen storage tank and feeding the liquid nitrogen into the liquid feeding conical head; by driving the contamination block to scratch the blocking ball, a small amount of liquid nitrogen is gasified to generate cold air flow, the cold air flow and the exhaust fan form collaborative cooling, the temperature of a plate body is stabilized, thermal stress deformation is avoided, the defects of insufficient soldering, partial soldering, continuous tin soldering and the like are effectively overcome, and the welding quality is greatly improved.

The application discloses a soldering jig for manufacturing a circuit board and relates to the technical field of circuit board soldering.The soldering jig comprises a tin brushing auxiliary part, an assembling partition is installed on the tin brushing auxiliary part, and the assembling partition is used for positioning a patch device; a pressing stabilizing part is installed on the assembling partition; a spacing gasket part is slidingly inserted into the assembling partition; and the spacing gasket part is used for keeping the gap between the patch device and the circuit board.The assembling partition and the pressing stabilizing part can be used for limiting each patch device and keeping the stability during soldering, and the structure can be used for facilitating subsequent heating and soldering work and stable transfer by limiting the patch device and keeping the stability, so as to solve the problems of poor stability of the soldering jig for manufacturing a circuit board during the transfer of the circuit board, easy shaking and displacement of the patch device and inconvenient keeping of the soldering gap of the patch device.

A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.

An insulated metal substrate (1) for a power semiconductor device is specified, comprising - a metal base (2), - a dielectric layer (3) arranged on the metal base (2), - an electrically conductive layer (4) arranged on the dielectric layer (3), and - a reinforcement structure (5), wherein - the reinforcement structure (5) is arranged in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). Furthermore, a method for producing an insulated metal substrate is specified.

To provide a method of adjusting a distribution position of flux on a circuit board.SOLUTION: A method of adjusting a distribution position of flux on a circuit board includes steps of: preparing a circuit board provided with flux covering a plurality of solder points distributed on a surface; performing optical position alignment work of sending the circuit board into a work region, imaging the circuit board by using an optical imaging lens, and outputting positional information after calculation; performing laser cleaning work of generating a laser beam by using a laser oscillator, removing excessive flux around the plurality of solder points on the basis of the positional information, and leaving only flux distributed on top surfaces of the solder points; and performing automatic optical inspection work for determining whether the circuit board is nondefective or defective. By the steps, flux having the same distribution region is formed on the top surfaces of the plurality of solder points on the circuit board, and successive soldering quality is improved. If there is remaining flux, the remaining flux can be completely removed via a reflow furnace in the subsequent step, and a step of cleaning excessive flux on the circuit board can be omitted.SELECTED DRAWING: Figure 1

The invention provides a welding fixing device, automatic welding equipment and a welding method, relates to the technical field of circuit board welding, and aims to solve the technical problem that a circuit board with a slender bonding pad cannot be attached to a welding strip in the welding process. The fixing device comprises two clamping plates for clamping the circuit board. Each clamping plate is provided with a first end face used for clamping a circuit board and a second end face opposite to the first end face. Each clamping plate is provided with at least one first groove formed in the first end face, and the first grooves are matched with the circuit board; each clamping plate is provided with at least one welding part formed on the second end face, the welding part comprises a through hole and a second groove connected with the through hole, the through hole corresponds to the first bonding pad, the groove bottom of the second groove is provided with a second plane, and the second plane is used for fixing a welding strip; the groove bottom of the first groove is provided with a first plane, the first plane and the second plane have a common plane, and the flatness of the common plane is smaller than 0.01. By means of the welding fixing device, the welding qualification rate can be guaranteed.

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to an integrated circuit board installation jig which comprises a jig platform assembly, the jig platform assembly is of a rectangular hollow structure, first air cylinders are installed on the two sides of the outer wall of the jig platform assembly in an embedded mode, and the output ends of the first air cylinders are in transmission connection with positioning plates. A positioning groove is formed in the outer wall of the positioning plate, the integrated circuit board body and the steel mesh are lifted through the material lifting slopes, finally, after the two ends of the integrated circuit board body and the two ends of the steel mesh are movably clamped to the inner walls of the limiting grooves, the integrated circuit board body, the steel mesh and the positioning groove are arranged on the same horizontal plane, and then the output end of a first air cylinder is used for pushing the positioning plate; the other two ends of the integrated circuit board body and the other two ends of the steel mesh are movably clamped through the positioning grooves so that the integrated circuit board body and the steel mesh in the stacked state can be aligned in the solder paste printing stage, and printing deviation is prevented.

A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

The application discloses a tin paste smearing device for PCB processing and relates to the technical field of tin paste printing. The device comprises a supporting mechanism and further comprises an anti-oxidation storage mechanism connected with the supporting mechanism, which comprises a material box provided with tin paste holes corresponding to the circuit board pins at the bottom. The anti-oxidation storage mechanism is installed to make the material fully filled in the tin paste holes, guarantee the material amount of the welding points, and isolate the tin paste from the air to avoid tin paste oxidation. The anti-residue discharging mechanism and the tin paste deformation control mechanism are installed to push the tin paste out of the tin paste holes, avoid the friction between the tin paste and the tin paste holes, and prevent the tin paste from being left, and at the same time, the circuit board is lowered synchronously during discharging to avoid the tin paste from leaving the welding points and affecting the element welding qualification rate. The tin paste anti-shortage mechanism is installed to separate the tin paste from the discharging rod after the tin paste is pushed out, avoid the discharging rod from taking away part of the tin paste, and prevent the uneven tin paste amount of multiple welding points from affecting the qualification rate.

The invention discloses a solder paste smearing device convenient for machining and clamping a multi-form circuit board, and belongs to the technical field of circuit board machining, the solder paste smearing device comprises an equipment box, the upper surface of the equipment box is in bolted connection with a working frame, and the upper surface of the working frame is fixedly connected with a motor; transverse electric sliding rails are fixedly connected to the inner walls of the left side and the right side of the working frame; and the material box is fixedly connected to the back surface of the equipment box. When the solder paste smearing device convenient for machining and clamping of the multi-form circuit board works, a workpiece is placed on a working frame, a motor is started at the moment, the motor drives a long pin to rotate, then a long plate drives a push plate to synchronously descend under the action of the long pin and a stand column, and when the push plate descends, a cross rod and a movable plate can be pushed, so that the workpiece is clamped; the movable plate drives the pressing rods to move towards the middle of the working frame, the pressing rods are distributed on the side face of the movable plate at equal intervals, and therefore the pressing rods can abut against all positions of the workpiece under the action of the movable plate and the reset spring, and the workpiece can be stabilized conveniently.