SMT patching process

Abstract

The invention discloses an SMT patching process which comprises the following steps: S1, silk screening: patching a circuit board to the lower surface of a steel screen after an optical camera detectsthat the circuit board is free of errors, then printing soldering paste or patch leaked glue to a welding plate of a PCB through a screening printer to be prepared for welding of components; S2, gluedispensing: dropping glue to a fixed position of the circuit board after the step of silk screening by means of action of a glue dispenser, wherein the electric components are fixed to the circuit board; and S3, pasting: feeding the circuit board after the step of glue dispensing to a chip mounter. The SMT patching process has the beneficial effects that influence of environmental factors is avoided by controlling the environmental factors in the whole process technology well, so that the viscosity of solder paste can be improved; meanwhile, metal powder in the solder paste is changed to overcome the condition that original cooling speed is small and the surface of the solder paste is not steady; and furthermore, the quality of the circuit board is enhanced.

Description

technical field [0001] The invention relates to a patching technology of a circuit board, in particular to an SMT patching process. Background technique [0002] Since entering the 21st century, China's electronic information product manufacturing industry has accelerated its pace of development and has become a pillar industry of the national economy. With the rapid development of the electronic manufacturing industry, China's surface mount technology and industry have also developed rapidly, and the overall scale is also the largest. The forefront of the world, the pursuit of miniaturization of electronic products, the perforated components used in the past can no longer be reduced, resulting in more and more stringent technical requirements for soldering, the quality of solder paste in the process of silk screen printing, placement and reflow soldering determines the SMT production Efficiency and quality, solder paste is mixed together by metal powder and flux according t...

AI Technical Summary

Problems solved by technology

[0002] Since entering the 21st century, China's electronic information product manufacturing industry has accelerated its pace of development and has become a pillar industry of the national economy. With the rapid development of the electronic manufacturing industry, China's surface mount technology and industry have also developed rapidly, and the overall scale is also the largest. The forefront of the world, the pursuit of miniaturization of electronic products, the perforated components used in the past can no longer be reduced, resulting in more and more stringent technical requirements for soldering, the quality of solder paste in the process of silk screen printing, placement and reflow soldering determines the SMT production Efficiency and quality, solder paste is mixed together by metal powder and flux according to a certain ratio to provide adhesion to the fixing of electrical components on the circuit board, and its viscosity requirements are relatively high, but it affects the viscosity of solder paste There are many factors. How to control the viscosity of solder paste by controlling the comprehensive factors of the external environment has not been accurately concluded. The difference is that the melting point, heat resistance and cooling speed of solder paste are different due to the different metal powder components of the solder paste. Factors will affect the soldering quality of the circuit board

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