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Welding structure and welding method for PCB and FPCB

A welding method and pad technology, applied in metallurgical bonding, electrical components, printed circuit manufacturing, etc., can solve the problems of poor circuit board welding effect and complicated welding process, and achieve simple and easy operation and alignment. Simple, efficient results

Active Publication Date: 2017-01-04
广州明美新能源股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to provide a kind of welding method and the welding structure of PCB and FPCB between realizing PCB and FPCB; Solve the problem that the soldering process that occurs in the prior art is complicated and the soldering effect of circuit board is not good

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  • Welding structure and welding method for PCB and FPCB
  • Welding structure and welding method for PCB and FPCB
  • Welding structure and welding method for PCB and FPCB

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Embodiment Construction

[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0052] A preferred embodiment of the present invention provides a method for realizing welding between a PCB and an FPCB. In this embodiment, the soldering pad on the FPCB to be welded is provided with a through hole for welding with the PCB. see figure 1 , figure 1 Realize the flowchart of the soldering method between PCB and FPCB for this embodiment, comprise the following steps:

[0053] S1. Fix the FPCB on the surface of the PCB through the circuit board carr...

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PUM

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Abstract

The invention discloses a welding method for a PCB and an FPCB. The welding method comprises the following steps of S1, enabling the FPCB to be fixedly attached to the surface of the PCB through a circuit board carrier, and enabling bonding pads in the attached position to be aligned and attached; S2, printing tin paste on the bonding pads of the attached FPCB and PCB through a steel net; S3, mounting electronic components on the corresponding bonding pads; and S4, putting the PCB and the FPCB which are attached together through the carrier into reflow soldering equipment to be heated to realize the welding of the PCB and the FPCB and the welding of the corresponding electronic components at the same time. The invention discloses a welding structure for the FCB and the FPCB. The welding between the FCB and the FPCB realized by the welding method and the welding structure has the advantages of high production efficiency, capability of reducing cost, and stable welding quality.

Description

technical field [0001] The invention relates to surface mount technology (SMT, Surface Mount Technology), in particular to a method for realizing welding between a PCB and an FPCB and a corresponding welding structure of the PCB and the FPCB. Background technique [0002] Circuit boards can be divided into two categories: PCB and FPCB; there are two types of current PCB and FPCB welding modes: [0003] Type 1: PCB and FPCB are soldered and connected by a soldering machine or a heat press: [0004] Disadvantages: 1) During the soldering process, the solder is prone to tin beads due to rapid heating and cooling, resulting in functional short circuits and easy burns on the protective film on the surface of the FPCB; 2) Poor consistency of solder joints and unstable quality; 3) PCB mounting components Offline welding with FPCB after welding is completed, which needs to be divided into two processes, so the production efficiency is low and the manufacturing cost is high; 4) It i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36H05K3/34
CPCH05K3/341H05K3/363H05K2203/04
Inventor 梁昌明欧志国朱全文
Owner 广州明美新能源股份有限公司
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