A wear-resistant PCB board structure

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a wear-resistant PCB board structure, comprising: a substrate, the substrate comprising a semi-cured layer and a core board, and copper foils are installed on the upper and lower surfaces of the substrate; a card board, the cross section of the card board is an inverted L-shape, the lower end surface of the card board is installed in cooperation with the side edge of the upper surface of the substrate, and the side plate of the card board away from the substrate extends to the surface of the copper foil away from the substrate; the wear-resistant PCB board structure, through the design of the substrate and the glue injection path between the card board and the copper foil, can structurally use the card board and the substrate to fix the copper foil to the edge, can package and protect the side of the copper foil, fill the glue injection path with colloid through the glue injection hole, can use the colloid to bond and fix the substrate, the copper foil and the card board together, under the structural combination of the card board and the substrate, can reduce the use of the adhesive between the substrate and the copper foil, thereby reducing the thickness of the adhesive layer between the copper foil and the substrate.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit boards, in particular to a wear-resistant PCB board structure. Background Art

[0002] PCB board is a printed circuit board, which is the support body of electronic components and the carrier of electrical connection. PCB board can be divided into single-sided board, double-sided board and multi-layer board. PCB board is mainly composed of substrate and copper foil.

[0003] When manufacturing PCB boards, adhesive is used to cover copper foil on the surface of the substrate. The sides of the copper foil in the existing PCB boards and the sides of the substrate are exposed to the external environment. The sides of the copper foil are easy to wear. When the sides of the copper foil are severely worn, it will affect the normal use of the PCB board. At the same time, under the action of external force, the sides of the copper foil are easy to separate from the substrate. When manufacturing PCB boards, in order to enhance the peeling strength of the copper foil, the adhesive layer between the copper foil and the substrate needs to reach a certain thickness. When the thickness of the adhesive layer is large, the consumption of the adhesive will increase, and the overall size of the PCB board will increase. In addition, the thickness of the adhesive layer will affect the design of the through hole between the copper foil and the core board of the substrate and the transmission of signals. Summary of the invention

[0004] In order to solve the problem that the side of the copper foil in the above existing PCB board is easy to wear, when the side of the copper foil is seriously worn, it will affect the normal use of the PCB board, and when subjected to external force, the side of the copper foil is easy to separate from the substrate. When manufacturing the PCB board, in order to enhance the peeling strength of the copper foil, the adhesive layer between the copper foil and the substrate needs to reach a certain thickness. When the thickness of the adhesive layer is large, the consumption of the adhesive will increase, and the overall size of the PCB board will increase. In addition, the thickness of the adhesive layer will affect the design of the through hole between the copper foil and the core board of the substrate and the transmission of the signal. The present invention is implemented by the following technical scheme: A wear-resistant PCB board structure, comprising:

[0005] A substrate, the substrate comprising a semi-cured layer and a core board, and copper foils are mounted on the upper and lower surfaces of the substrate;

[0006] A cardboard, wherein the cross section of the cardboard is an inverted L-shape, the lower end surface of the cardboard is mounted in cooperation with the side edge of the upper surface of the substrate, the side plate of the cardboard away from the substrate extends to the surface of the copper foil away from the substrate, the copper foil is fixed to the surface of the substrate by the cardboard, and the side edge of the copper foil is sealed at the same time;

[0007] The glue injection path is located between the copper foil and the substrate. The glue injection path extends along the positions of the substrate, the cardboard and the side edges of the copper foil to the surface of the copper foil away from the substrate. The substrate is provided with a glue injection hole inside, and the glue injection hole is communicated with the glue injection path. By using the glue injection path, an adhesive layer can be formed between the substrate and the copper foil. At the same time, the cardboard and the substrate are fixed by the colloid, and the cardboard and the copper foil are bonded together, thereby reducing the thickness of the adhesive layer between the substrate and the copper foil.

[0008] Furthermore, the matching installation end surfaces of the card plate and the base plate are both provided with glue grooves, the glue grooves are communicated with the glue injection channel, and the card plate can be fixed in the base plate by filling the glue into the glue grooves.

[0009] Furthermore, a plurality of slots are provided on the side of the glue groove, and the slots extend to the inside of the substrate and the card board. The design of the slots can form glue columns in the slots when the glue groove is filled with colloid, thereby increasing the bonding strength between the card board and the substrate.

[0010] Furthermore, a vacuum channel is provided inside the substrate, and the vacuum channel is connected to the glue injection channel through a vacuum hole. By using the vacuum channel and the vacuum hole, a vacuum pump can be used to discharge the air between the copper foil and the substrate, so that the colloid can form an adhesive layer between the copper foil and the substrate.

[0011] Furthermore, the vacuum hole is funnel-shaped, and the small end of the vacuum hole is connected to the glue injection channel. Through the glue injection channel and the vacuum hole, an adhesive layer is formed between the substrate and the copper foil. The funnel-shaped design of the vacuum hole can increase the bonding strength between the adhesive layer and the substrate.

[0012] Furthermore, it also includes a wear-resistant layer, which covers the lower surface of the copper foil on the lower side of the substrate, the side surfaces of the substrate and the cardboard, and the upper surface of the cardboard.

[0013] Furthermore, the raw material composition of the wear-resistant layer includes: 15-20 parts of butadiene, 12-15 parts of acrylonitrile, 10-15 parts of epoxy acrylate, 15-18 parts of corundum powder, 2-3 parts of vulcanizer, 3-5 parts of softener, 12-15 parts of fiber reinforcement material, the vulcanizer is magnesium oxide and polyol, and the fiber reinforcement material is glass fiber.

[0014] Furthermore, the raw material composition of the wear-resistant layer also includes 3-5 parts of a tackifier and 4-6 parts of a flame retardant. The tackifier is selected from coumarone-indene resin and terpene resin, and the flame retardant is selected from antimony oxide and tricresyl phosphate.

[0015] Furthermore, the method for preparing the wear-resistant layer includes:

[0016] S1, taking butadiene and acrylonitrile, processing butadiene and acrylonitrile by low-temperature emulsion polymerization, and adding a softener and a vulcanizing agent during the emulsion polymerization process;

[0017] S2, taking corundum powder and fiber reinforcement material, adding them to the latex solution after low-temperature emulsion polymerization, and heating and mixing, the heating temperature is 135-155°C;

[0018] S3, cooling the latex solution after mixing in step S2 to 65-75° C., adding epoxy acrylate, tackifier, and flame retardant, and stirring and mixing for 10-15 minutes to obtain a wear-resistant coating liquid;

[0019] S4, coating the wear-resistant coating liquid prepared in step S3 on the surface of the copper foil. When the wear-resistant coating liquid cools to room temperature, a wear-resistant layer can be formed on the surface of the copper foil.

[0020] Furthermore, the upper surface of the copper foil on the upper side of the substrate is coated with a solder resist layer.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The wear-resistant PCB board structure can use the card board and the base board to fix the copper foil and seal the edges of the copper foil through the design of the glue injection path between the base board, the card board and the copper foil, and can encapsulate and protect the side of the copper foil. The colloid is filled into the glue injection path through the glue injection hole, and the base board, the copper foil and the card board can be bonded and fixed together by the colloid. Under the structural combination of the card board and the base board, the amount of adhesive used between the base board and the copper foil can be reduced, thereby reducing the thickness of the bonding layer between the copper foil and the base board, while ensuring the bonding effect between the copper foil and the base board, and the copper foil will not delaminate, and the copper foil has high peeling resistance.

[0023] 2. The wear-resistant PCB board structure can improve the wear resistance and scratch resistance of the PCB surface by coating a wear-resistant layer on the lower surface of the lower copper foil, the side surface of the substrate and the outer surface of the card board, and preparing the coating raw materials of the wear-resistant layer using butadiene, acrylonitrile, epoxy acrylate, corundum powder, vulcanizer, softener and fiber reinforcement material. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the internal cross-sectional structure of the PCB board of the present invention Figure 1 ;

[0025] Figure 2 Schematic diagram of the internal cross-sectional structure of the PCB board of the present invention Figure 2 ;

[0026] Figure 3 For the present invention Figure 2 Schematic diagram of the structure at A in the middle;

[0027] Figure 4 It is a schematic diagram of the internal cross-sectional structure of the substrate of the present invention.

[0028] In the figure: 1, substrate; 11, semi-cured layer; 12, core board; 2, copper foil; 3, adhesive layer; 4, card board; 5, glue injection channel; 51, glue injection hole; 6, glue groove; 7, vacuum channel; 71, vacuum hole; 8, wear-resistant layer; 9, solder mask layer. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The embodiment of the wear-resistant PCB board structure is as follows:

[0031] Embodiment 1:

[0032] See also Figure 1-Figure 4 , a wear-resistant PCB board structure, comprising:

[0033] The substrate 1 comprises a semi-cured layer 11 and a core board 12 , and copper foils 2 are mounted on the upper and lower surfaces of the substrate 1 .

[0034] The cross section of the card board 4 is an inverted L shape. The lower end surface of the card board 4 is installed in cooperation with the side edge of the upper surface of the substrate 1. The side plate of the card board 4 away from the substrate 1 extends to the surface of the copper foil 2 away from the substrate 1. The copper foil 2 is fixed to the surface of the substrate 1 by the card board 4, and the side edge of the copper foil 2 is sealed at the same time.

[0035] The glue injection path 5 is located between the copper foil 2 and the substrate 1. The glue injection path 5 extends along the sides of the substrate 1, the card board 4 and the copper foil 2 to the surface of the copper foil 2 away from the substrate 1. The substrate 1 is provided with a glue injection hole 51, which is communicated with the glue injection path 5. The glue injection path 5 can be used to form an adhesive layer 3 between the substrate 1 and the copper foil 2. At the same time, the card board 4 and the substrate 1 are fixed by the colloid, and the card board 4 and the copper foil 2 are bonded together, thereby reducing the thickness of the adhesive layer 3 between the substrate 1 and the copper foil 2.

[0036] A glue groove 6 is provided in the mating installation end faces of the card board 4 and the substrate 1. The glue groove 6 is communicated with the glue injection channel 5. The card board 4 can be fixed in the substrate 1 by filling the glue into the glue groove 6. A plurality of slot holes are provided on the side of the glue groove 6. The slot holes extend to the interior of the substrate 1 and the card board 4. The design of the slot holes can form glue columns in the slot holes when the glue groove 6 is filled with glue, thereby increasing the bonding strength between the card board 4 and the substrate 1.

[0037] A vacuum channel 7 is provided inside the substrate 1, and the vacuum channel 7 is connected to the glue injection channel 5 through a vacuum hole 71. By utilizing the vacuum channel 7 and the vacuum hole 71, a vacuum device can be used to discharge the air between the copper foil 2 and the substrate 1, so that the colloid forms an adhesive layer 3 between the copper foil 2 and the substrate 1. The vacuum hole 71 is funnel-shaped, and the small end of the vacuum hole 71 is connected to the glue injection channel 5. Through the glue injection channel 5 and the vacuum hole 71, an adhesive layer 3 is formed between the substrate 1 and the copper foil 2. The funnel-shaped design of the vacuum hole 71 can increase the bonding strength between the adhesive layer 3 and the substrate 1.

[0038] The upper surface of the copper foil 2 on the upper side of the substrate 1 is coated with a solder resist layer 9 .

[0039] Embodiment 2:

[0040] See also Figure 1-Figure 4 , a wear-resistant PCB board structure, comprising:

[0041] A substrate 1, the substrate 1 comprises a semi-cured layer 11 and a core board 12, and copper foils 2 are mounted on the upper and lower surfaces of the substrate 1;

[0042] A card plate 4, the cross section of which is an inverted L-shape, the lower end surface of the card plate 4 is mounted in cooperation with the side edge of the upper surface of the substrate 1, the side plate of the card plate 4 away from the substrate 1 extends to the surface of the copper foil 2 away from the substrate 1, the card plate 4 is used to fix the copper foil 2 on the surface of the substrate 1, and the side edge of the copper foil 2 is sealed;

[0043] The glue injection path 5 is located between the copper foil 2 and the substrate 1. The glue injection path 5 extends along the sides of the substrate 1, the card board 4 and the copper foil 2 to the surface of the copper foil 2 away from the substrate 1. The substrate 1 is provided with a glue injection hole 51, which is communicated with the glue injection path 5. The glue injection path 5 can be used to form an adhesive layer 3 between the substrate 1 and the copper foil 2. At the same time, the card board 4 and the substrate 1 are fixed by the colloid, and the card board 4 and the copper foil 2 are bonded together, thereby reducing the thickness of the adhesive layer 3 between the substrate 1 and the copper foil 2.

[0044] The wear-resistant layer 8 covers the lower surface of the copper foil 2 on the lower side of the substrate 1 , the side surfaces of the substrate 1 and the card board 4 , and the upper surface of the card board 4 .

[0045] Embodiment three:

[0046] The raw materials of the wear-resistant layer 8 include: 15 parts of butadiene, 12 parts of acrylonitrile, 10 parts of epoxy acrylate, 15 parts of corundum powder, 2 parts of vulcanizer, 3 parts of softener, and 12 parts of fiber reinforcement material. The vulcanizer is magnesium oxide and polyol, and the fiber reinforcement material is glass fiber.

[0047] The raw material composition of the wear-resistant layer 8 also includes 3 parts of a tackifier and 4 parts of a flame retardant. The tackifier is selected from coumarone-indene resin and terpene resin, and the flame retardant is selected from antimony oxide and tricresyl phosphate.

[0048] The preparation method of the wear-resistant layer 8 comprises:

[0049] S1, taking butadiene and acrylonitrile, processing butadiene and acrylonitrile by low-temperature emulsion polymerization, and adding a softener and a vulcanizing agent during the emulsion polymerization process;

[0050] S2, taking corundum powder and fiber reinforcement material, adding them to the latex solution after low-temperature emulsion polymerization, and heating and mixing, the heating temperature is 135°C;

[0051] S3, cooling the latex solution after mixing in step S2 to 65° C., adding epoxy acrylate, tackifier, and flame retardant, and stirring and mixing for 10 minutes to obtain a wear-resistant coating liquid;

[0052] S4, coating the wear-resistant coating liquid prepared in step S3 on the surface of the copper foil 2. When the wear-resistant coating liquid cools to room temperature, a wear-resistant layer 8 can be formed on the surface of the copper foil 2.

[0053] Embodiment 4:

[0054] The raw materials of the wear-resistant layer 8 include: 20 parts of butadiene, 15 parts of acrylonitrile, 15 parts of epoxy acrylate, 18 parts of corundum powder, 3 parts of vulcanizer, 5 parts of softener, and 15 parts of fiber reinforcement material. The vulcanizer is magnesium oxide and polyol, and the fiber reinforcement material is glass fiber.

[0055] The raw material composition of the wear-resistant layer 8 also includes 5 parts of a tackifier and 6 parts of a flame retardant. The tackifier is selected from coumarone-indene resin and terpene resin, and the flame retardant is selected from antimony oxide and tricresyl phosphate.

[0056] The preparation method of the wear-resistant layer 8 comprises:

[0057] S1, taking butadiene and acrylonitrile, processing butadiene and acrylonitrile by low-temperature emulsion polymerization, and adding a softener and a vulcanizing agent during the emulsion polymerization process;

[0058] S2, taking corundum powder and fiber reinforcement material, adding them to the latex solution after low-temperature emulsion polymerization, and heating and mixing, the heating temperature is 155°C;

[0059] S3, cooling the latex solution after mixing in step S2 to 75° C., adding epoxy acrylate, tackifier, and flame retardant, and stirring and mixing for 15 minutes to obtain a wear-resistant coating liquid;

[0060] S4, coating the wear-resistant coating liquid prepared in step S3 on the surface of the copper foil 2. When the wear-resistant coating liquid cools to room temperature, a wear-resistant layer 8 can be formed on the surface of the copper foil 2.

[0061] By processing butadiene and acrylonitrile using a low-temperature emulsion polymerization method, a nitrile rubber substrate with high wear resistance can be formed. Before the nitrile rubber is formed, a vulcanizer and a softener are added to make the nitrile rubber substrate in an emulsion state, and then corundum powder and fiber reinforcement materials are added to the emulsion to further enhance the wear resistance of the substrate. Finally, the viscosity enhancer and flame retardant added can increase the viscosity and flame retardancy of the emulsion. Epoxy acrylate can further polymerize corundum powder, fiber reinforcement materials and the nitrile rubber substrate. When the emulsion is coated to form a wear-resistant layer 8, the scratch resistance of the surface of the wear-resistant layer 8 can be improved.

[0062] The anti-delamination and wear-resistant principle of the wear-resistant PCB board structure:

[0063] When manufacturing a PCB board, the copper foil 2 is placed on the upper and lower surfaces of the substrate 1, and the card board 4 is installed at the side of the substrate 1. At this time, a glue injection path 5 is formed between the substrate 1 and the copper foil 2, between the substrate 1 and the side surfaces of the card board 4 and the copper foil 2, and between the card board 4 and the copper foil 2. The vacuum pump is connected to the vacuum path 7, the glue injection device is connected to the glue injection hole 51, and the glue is injected into the glue injection hole 51 using the glue injection device.

[0064] The colloid enters between the substrate 1 and the copper foil 2 to form an adhesive layer 3. The colloid will fill the glue injection channel 5. The colloid will enter the glue groove 6 and the slot hole at the same time, forming a glue layer that drives the glue column between the card board 4 and the substrate 1. Part of the colloid will enter the vacuum hole 71. In this way, the copper foil 2 can be fixed on the surface of the substrate 1 by using the colloid, and the card board 4 can be fixed on the surface of the substrate 1 at the same time. The side edges of the copper foil 2 are sealed and fixed by using the card board 4 to prevent the copper foil 2 from delaminating.

[0065] After the substrate 1, the card board 4 and the copper foil 2 are assembled and installed, a wear-resistant coating is coated on the side surface of the substrate 1, the outer side surface of the card board 4 and the surface of the lower copper foil 2 to form a wear-resistant layer 8, and the wear-resistant layer 8 is used to protect the outer surface of the PCB board from wear.

[0066] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wear-resistant PCB board structure, characterized in that: include: A substrate (1), wherein copper foils (2) are mounted on the upper and lower surfaces of the substrate (1); A card board (4), wherein the cross section of the card board (4) is an inverted L-shape, the lower end surface of the card board (4) is mounted in cooperation with the side edge of the upper surface of the substrate (1), and the side plate of the card board (4) away from the substrate (1) extends to the surface of the copper foil (2) away from the substrate (1); A glue injection path (5) is located between the copper foil (2) and the substrate (1), and the glue injection path (5) extends along the positions of the substrate (1), the cardboard (4) and the side edges of the copper foil (2) to the surface of the copper foil (2) away from the substrate (1). A glue injection hole (51) is provided inside the substrate (1), and the glue injection hole (51) is communicated with the glue injection path (5).

2. The wear-resistant PCB board structure according to claim 1, wherein: A glue groove (6) is provided in the matching installation end surfaces of the clamping plate (4) and the base plate (1), and the glue groove (6) is communicated with the glue injection channel (5).

3. The wear-resistant PCB board structure according to claim 2, wherein: A plurality of slot holes are provided on the side of the glue groove (6), and the slot holes extend to the inside of the base plate (1) and the card plate (4).

4. The wear-resistant PCB board structure according to any one of claims 1 to 3, wherein: A vacuum channel (7) is provided inside the substrate (1), and the vacuum channel (7) is connected to the glue injection channel (5) via a vacuum hole (71).

5. The wear-resistant PCB board structure according to claim 4, wherein: The vacuum hole (71) is funnel-shaped, and the small end of the vacuum hole (71) is connected to the glue injection channel (5). Through the glue injection channel (5) and the vacuum hole (71), an adhesive layer (3) is formed between the substrate (1) and the copper foil (2).

6. The wear-resistant PCB board structure according to claim 5, wherein: It also includes a wear-resistant layer (8), which covers the lower surface of the copper foil (2) on the lower side of the substrate (1), the side surfaces of the substrate (1) and the card board (4), and the upper surface of the card board (4).

7. The wear-resistant PCB board structure according to claim 6, wherein: The raw material composition of the wear-resistant layer (8) includes: 15-20 parts of butadiene, 12-15 parts of acrylonitrile, 10-15 parts of epoxy acrylate, 15-18 parts of corundum powder, 2-3 parts of vulcanizing agent, 3-5 parts of softening agent, and 12-15 parts of fiber reinforcement material.

8. The wear-resistant PCB board structure according to claim 7, wherein: The raw material composition of the wear-resistant layer (8) also includes 3-5 parts of a tackifier and 4-6 parts of a flame retardant.

9. The wear-resistant PCB board structure according to claim 8, wherein: The preparation method of the wear-resistant layer (8) comprises: S1, taking butadiene and acrylonitrile, processing butadiene and acrylonitrile by low-temperature emulsion polymerization, and adding a softener and a vulcanizing agent during the emulsion polymerization process; S2, taking corundum powder and fiber reinforcement material, adding them to the latex solution after low-temperature emulsion polymerization, and heating and mixing, the heating temperature is 135-155°C; S3, cooling the latex solution after mixing in step S2 to 65-75° C., adding epoxy acrylate, tackifier, and flame retardant, and stirring and mixing for 10-15 minutes to obtain a wear-resistant coating liquid; S4, coating the wear-resistant coating liquid obtained in step S3 on the surface of the copper foil (2); when the wear-resistant coating liquid cools to room temperature, a wear-resistant layer (8) can be formed on the surface of the copper foil (2).

10. The wear-resistant PCB board structure according to claim 5 or 6, wherein: The upper surface of the copper foil (2) on the upper side of the substrate (1) is coated with a solder resist layer (9).

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