Bulk Transistor Material Forming Device

Abstract

The present invention discloses a bulk transistor material forming device, comprising: a material conveying device arranged on a support body, including: a crystal feeding track; a full cut-off device for removing a certain height of the pins of the transistor; a partial pin cutting device; a first kicking device for forming a kicking structure on the middle pin of the transistor; and a second kicking device for forming a kicking structure on the two side pins of the transistor; a defective product screening device for detecting and removing defective products; a material conveying device for automatically conveying a material box, a controller communicating with the full cut-off device, the partial pin cutting device, the first kicking device, the second kicking device, the defective product screening device and the automatic material conveying device; the controller can selectively control at least one or more of the full cut-off device, the partial pin cutting device, the first kicking device and the second kicking device to be turned on. The bulk transistor material forming device proposed by the present invention improves the production efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of transistor processing and forming, and more specifically, relates to a forming device for bulk transistors. Background Art

[0002] With the rapid increase in domestic demand, the processing demand for IGBTs, that is, insulated gate bipolar transistors, is also increasing. The processing of traditional IGBT materials uses manual methods, and the overall processing sequence is encapsulation feeding, leg cutting and bending, and manual discharging; Insulated gate bipolar transistors are common electronic components in current production and life. Currently, the processing procedure of cutting and bending the legs of the materials to be processed is generally carried out manually by workers, with low production efficiency and unable to meet the requirements of automated production methods.

[0003] The above information disclosed in this background art is only used to increase the understanding of the background art of this application. Therefore, it may include prior art that is not known to ordinary technicians in this field. Summary of the Invention

[0004] In view of the above technical problems existing in the forming of transistor materials in the prior art, the present invention proposes a new type of forming device for bulk transistor materials, which can achieve a completely automated structure of transistor materials and improve production efficiency.

[0005] To achieve the above invention / design purpose, the present invention is implemented by the following technical solutions:

[0006] A forming device for bulk transistor materials, comprising:

[0007] A support body for supporting the crystal forming device;

[0008] A feeding device arranged on the support body;

[0009] A material conveying device arranged on the support body, which includes: a crystal feeding track, and the material conveying device can drive the material conveyed from the feeding device to move along the crystal feeding track;

[0010] A crystal forming device group assembled on the top of the support body, horizontally straddling above the crystal conveying track, including: arranged in sequence along the crystal conveying direction:

[0011] A full leg cutting device for completely removing a certain height of the pins of the transistor;

[0012] A partial leg cutting device for removing a certain height of some pins of the transistor;

[0013] A first kicking device for forming a kicking structure on the middle pin of the transistor;

[0014] and a second kicking device, used for forming a kicking structure for the pins on both sides of the transistor;

[0015] Defective product screening device, used to detect defective products and remove defective crystals;

[0016] The material conveying device comprises:

[0017] A material rack, on the top of which a plurality of inclined material boxes are arranged;

[0018] Block the limiting component to lock or unlock the material box;

[0019] The lifting platform can be raised and lowered, can rise to the top of the material frame and support the material box that slides down from one side of the material frame, and can descend to transfer the material box when the material box is full;

[0020] A material box conveying device is arranged on the lifting platform so that the material box is input to the lifting platform or the material box is output from the lifting platform;

[0021] a controller communicating with the full pin cutting device, the partial pin cutting device, the first kicking device and the second kicking device, the defective product screening device and the automatic material conveying device;

[0022] The controller can selectively control at least one or more of the full-foot cutting device, the partial foot cutting device, the first kicking device and the second kicking device to open.

[0023] Compared with the prior art, the advantages and positive effects of the present invention are:

[0024] The bulk transistor material forming device of the present invention feeds the transistors to each crystal forming device group for forming, and then automatically enters the material conveying device for lowering and transportation, all without manual participation, thus realizing the full automation of transistor material processing, forming and conveying, and improving production efficiency;

[0025] Moreover, when forming the pins of the transistor, whether the transistor pins are fully cut or partially cut, or the pins are kicked, the corresponding forming device is used to accurately control the forming, which improves the forming accuracy of the transistor material compared with the manual forming method;

[0026] In addition, the bulk transistor material molding device in the present invention is provided with a plurality of different types of molding devices when it is set up. When using, the user can selectively open one or several molding devices according to needs to mold different types of transistor structures, thereby realizing diversified molding.

[0027] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 It is the overall structure diagram of the bulk transistor material forming device in the embodiment of the present invention;

[0030] Figure 2 It is the overall structure of the full-cutting device of the bulk transistor material forming device in the embodiment of the present invention Figure 1 ;

[0031] Figure 3 It is the overall structure of the full-cutting device of the bulk transistor material forming device in the embodiment of the present invention Figure 2 ;

[0032] Figure 4 It is the structural decomposition diagram of the full-cutting moving die and the full-cutting static die of the full-cutting device of the bulk transistor material forming device in the embodiment of the present invention;

[0033] Figure 5 It is the structural schematic diagram of the full-cutting moving die of the full-cutting device of the bulk transistor material forming device in the embodiment of the present invention;

[0034] Figure 6 It is the overall structure of the pin part cutting device of the bulk transistor material forming device in the embodiment of the present invention Figure 1 ;

[0035] Figure 7 It is the overall structure of the pin part cutting device of the bulk transistor material forming device in the embodiment of the present invention Figure 2 ;

[0036] Figure 8 It is the structural schematic diagram of the induction limit structure of the pin part cutting device of the bulk transistor material forming device in the embodiment of the present invention;

[0037] Figure 9 It is the structural decomposition diagram of the cutting moving knife and the cutting static knife of the pin part cutting device of the bulk transistor material forming device in the embodiment of the present invention;

[0038] Figure 10 It is the structural schematic diagram of the cutting moving knife of the pin part cutting device of the bulk transistor material forming device in the embodiment of the present invention;

[0039] Figure 11Schematic diagram of the overall structure of the first kicking device of the bulk transistor material forming device in the embodiment of the present invention Figure 1 ;

[0040] Figure 12 Schematic diagram of the overall structure of the first kicking device of the bulk transistor material forming device in the embodiment of the present invention Figure 2 ;

[0041] Figure 13 Schematic diagram of the structure of the elastic material pressing structure of the first kicking device of the bulk transistor material forming device in the embodiment of the present invention;

[0042] Figure 14 Exploded view of the structure of the elastic material pressing structure of the first kicking device of the bulk transistor material forming device in the embodiment of the present invention;

[0043] Figure 15 Schematic diagram of the structure of the material pressing and forming of the first kicking device of the bulk transistor material forming device in the embodiment of the present invention;

[0044] Figure 16 Schematic diagram of the structure of the kicking moving die of the first kicking device of the bulk transistor material forming device in the embodiment of the present invention;

[0045] Figure 17 Schematic diagram of the structure of the material pressing and forming of the second kicking device of the bulk transistor material forming device in the embodiment of the present invention;

[0046] Figure 18 Schematic diagram of the structure of the second kicking moving die of the second kicking device of the bulk transistor material forming device in the embodiment of the present invention;

[0047] Figure 19 Schematic diagram of the structure of the material conveying device of the bulk transistor material forming device in the embodiment of the present invention;

[0048] Figure 20 Top view of the material conveying device of the bulk transistor material forming device in the embodiment of the present invention;

[0049] Figure 21 Schematic diagram of the structure of the lifting mechanism of the material conveying device of the bulk transistor material forming device in the embodiment of the present invention;

[0050] Figure 22 Schematic diagram of the structure of the lifting mechanism of the material conveying device of the bulk transistor material forming device transporting the material box;

[0051] Figure 23 Schematic diagram of the structure of the material box conveying device of the material conveying device of the bulk transistor material forming device in the embodiment of the present invention;

[0052] Figure 24 This is a schematic structural diagram of the misaligned material screening device of the bulk transistor material forming device in the embodiment of the present invention. Embodiment

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0054] The present invention provides a bulk transistor material forming device, including:

[0055] A support body 900 for supporting the crystal forming device;

[0056] A feeding device 820 arranged on the support body 900; the feeding device is a flexible feeding tray, which is mainly used to achieve flexible feeding. The feeding device can directly adopt the feeding tray structure in the prior art and will not be elaborated here.

[0057] A material conveying device 830 arranged on the support body, which includes: a crystal feeding track, and the material conveying device can drive the material conveyed from the feeding device to move along the crystal feeding track;

[0058] The material conveying device 830 can select existing structures such as existing linear vibrating feeding devices and will not be elaborated here.

[0059] A crystal forming device group assembled on the top of the support body 900, horizontally straddling above the crystal conveying track, including: arranged in sequence along the transistor material conveying direction:

[0060] A full cut-off device 200 for completely removing a certain height of the pins of the transistor;

[0061] A partial pin cutting device 300 for removing a certain height of some pins of the transistor

[0062] A first kicking device 400 for forming a kicking structure on the middle pin of the transistor;

[0063] And a second kicking device 490 for forming a kicking structure on the two side pins of the transistor;

[0064] A defective product screening device 810 for detecting defective products and removing defective crystals;

[0065] A material conveying device 600;

[0066] In order to realize the transfer of crystal materials on the crystal conveying track, in some embodiments of the present application, an intermediate transfer channel is also provided, which is connected between the crystal conveying track and the material conveying device 600 to transfer the formed crystal material to the material conveying device 600 .

[0067] In order to realize the automatic sliding of crystal materials, the middle transfer channel is arranged at an angle.

[0068] The material conveying device 600 comprises:

[0069] A material rack, on top of which a plurality of inclined material boxes 640 are arranged;

[0070] Blocking the limiting component to lock or unlock the material box 640;

[0071] The lifting platform 610 can be raised and lowered, can rise to the top of the material frame and receive and support the material box 640 that slides down from one side of the material frame, and can descend to transfer the material box 640 when the material box 640 is full;

[0072] A material box conveying device is arranged on the lifting platform 610 so that the material box 640 is input to the lifting platform 610 or the material box 640 is output from the lifting platform 610;

[0073] The controller, the full pin cutting device 200, the pin partial cutting device 300, the first kicking device 400 and the second kicking device 490, the defective product screening device 810 and the material conveying device 600 communicate;

[0074] The controller can selectively control at least one or more of the full-foot cutting device 200 , the partial foot cutting device 300 , the first kicking device 400 , and the second kicking device 490 to be turned on.

[0075] When the bulk transistor material forming device of the present invention is used, the material is conveyed by the feeding device, and is conveyed forward by the crystal conveying track of the material conveying device, and enters the full-foot cutting device 200. When the full-foot cutting station is reached, the transistor can be fully foot-cut by the full-foot cutting device 200;

[0076] The transistor material can also continue to be transported forward and enter the position of the pin part cutting device 300, and the pin part cutting device 300 can cut off part of the transistor pins;

[0077] Or continue to transport forward to the position of the first kicking device 400 to form a kicking for the pin at the middle position of the transistor;

[0078] And when entering the position of the second kicking device 490, the kicking is formed for the pins on both sides of the transistor.

[0079] An inclined intermediate transfer channel is provided at the end of the crystal conveying track. The transistors conveyed out from the crystal conveying track enter the material box 640 located on the lifting table 610 at the position corresponding to the end of the inclined intermediate transfer channel through the inclined intermediate transfer channel. The formed materials are continuously conveyed to this material box 640. After a period of time, this material box 640 is filled. At this time, the lifting table 610 located below it drives it to move downward and transfers it to the material box docking and conveying device 660;

[0080] The lifting table 610 continues to rise to the top position of the material frame. At this time, the blocking and limiting component 650 is opened, and another material box slides down to contact the lifting table. The material box conveying device 630 operates to convey the material box 640 onto the lifting table 610. At this time, the transistor material continues to slide down to this material box 640, and the cycle continues continuously to automatically convey the material outwards to achieve the automatic conveyance of the transistor material.

[0081] In the bulk transistor material forming device in this embodiment, the transistor material forming process completely does not require manual participation. From the feeding of the transistors to the forming by each crystal forming device group, and then automatically entering the material conveying device for downward transfer, no manual participation is required, realizing the complete automation of the processing and forming and conveyance of the transistor material, and improving the production operation efficiency;

[0082] Moreover, when forming the pins of the transistors, whether fully cutting, partially cutting, or kicking the pins of the transistors, precise control of the forming is achieved through the corresponding forming devices. Compared with the manual forming method, the forming accuracy of the transistor material is improved;

[0083] In addition, in the bulk transistor material forming device in this embodiment, when setting, a plurality of different types of forming devices are provided. When the user uses it, one or several of the forming devices can be selectively turned on according to the needs to form different types of transistor structures;

[0084] That is, during forming, the controller can selectively control any one or more of the full-cut pin device, partial pin cutting device, first kicking device, and second kicking device to be turned on and started, meeting the user's use requirements for forming a variety of different types and realizing diversified forming.

[0085] The full-cut pin device can completely cut off the pins at the bottom of the transistors;

[0086] The full-cut pin base 100 is used to support the pin cutting device. The full-cut pin base 100 constitutes the basis of the entire pin cutting device and is used to support and fix the function of the full-cut pin device.

[0087] The full-cut foot mechanism comprises: a full-cut static die 210, in which a sliding cavity 211 is formed;

[0088] In some embodiments of the present application, the sliding cavity 211 is arranged along the length direction of the full-cut static mold 210 from one end to the other end of the full-cut static mold 210, and the full-cut static mold 210 can select a full-cut static mold seat.

[0089] Full cutting die 220;

[0090] The full-cutting movable die driving mechanism 230 is connected to the full-cutting movable die 220, and drives the full-cutting movable die 220 to move, so that the full-cutting movable die 220 acts and cooperates with the full-cutting static die 210 to cut the pins of the transistors transported therebetween. The full-cutting movable die driving mechanism 230 can also drive the full-cutting movable die 220 to slide into the sliding cavity 211 and to pull and slide back and forth in the sliding cavity 211.

[0091] In some embodiments of the present application, the full-cut movable die 220 is a full-cut movable die rod, which is arranged opposite to the full-cut static die 210. The full-cut movable die driving mechanism 230 is a full-cut driving cylinder.

[0092] The pins of the transistor are set up during transportation. When the transistor is transported to the position between the full-cutting movable mold 220 and the full-cutting static mold 210, the full-cutting movable mold driving mechanism 230 can be controlled to move, driving the full-cutting movable mold 220 to move, and the full-cutting movable mold 220 moves into the sliding cavity 211 to achieve the cutting of all the pins of the transistor.

[0093] Since the full-cutting movable mold 220 is slidably inserted in the sliding cavity 211, the pins cut off by the full-cutting movable mold 220 will enter the sliding cavity 211 under the push of the full-cutting movable mold 220, and will be pushed out of the sliding cavity 211 by the full-cutting movable mold 220 when the full-cutting movable mold 220 slides forward in the sliding cavity 211.

[0094] The full-cut height adjustment mechanism 240 can be used to adjust the height of the full-cut foot mechanism, and the structure includes:

[0095] A full-cut power element 241 is mounted on the full-cut foot base 100;

[0096] The full-cut foot power element is a full-cut foot adjustment motor, which is used to provide power for height adjustment.

[0097] The full-cut linear module is connected to the full-cut power element 241 in a transmission manner and can convert the rotation of the full-cut power element 241 into up and down linear motion;

[0098] The connecting component 243 connects the full-cutting linear module and the foot-cutting mechanism, and can drive the foot-cutting mechanism to move up and down under the drive of the full-cutting linear module to change the height position of the foot-cutting mechanism.

[0099] The full-cutting foot power component operates, driving the full-cutting foot linear module connected to it. The full-cutting foot linear module moves up and down to drive the connecting component 243 connected to it and the full-cutting foot mechanism connected to the connecting component 243 to move up and down, so as to adjust the height position of the full-cutting foot mechanism.

[0100] The height of the pins of the transistor conveyed from the crystal feeding device is fixed and conveyed forward on the crystal feeding device, and its height is non-adjustable. In order to adjust the cutting height of the pins of the transistor, in this embodiment, the height of the full-cutting foot mechanism is set to be adjustable.

[0101] If the height of the pins to be cut off of the transistor to be cut increases, the full-cutting foot mechanism needs to be moved downward. If the height of the pins to be cut off of the transistor to be cut decreases, the full-cutting foot mechanism can be moved upward, so as to meet the usage requirements for cutting pins of different heights of the transistor and improve the versatility of the entire foot-cutting device.

[0102] In some embodiments of the present application, the full-cutting linear module is a lead screw nut linear module.

[0103] In some embodiments of the present application, the full-cutting moving die 220 further includes:

[0104] The full-cutting sliding seat 261 has openings at the top and both ends, and a full-cutting sliding groove is recessed in the full-cutting sliding seat 261;

[0105] The full-cutting cover plate 262 is buckled at the top opening and is fixedly connected to the full-cutting sliding seat 261. A full-cutting moving die sliding space is formed by enclosing the full-cutting cover plate 262 and the full-cutting sliding seat 261;

[0106] The full-cutting moving die 220 is arranged in the full-cutting moving die sliding space. The full-cutting moving die 220 can slide in the full-cutting moving die sliding space. The formed full-cutting moving die sliding space can play a role in limiting and guiding the sliding of the full-cutting moving die 220.

[0107] At the same time, the full-cutting sliding seat 261 can also play a role in carrying and supporting the full-cutting moving die 220.

[0108] The full-cutting static die rod 270 has one end fixed to the top of the full-cutting static die 210 and the other end extending to the top of the full-cutting cover plate 262 and being fixedly connected to the full-cutting cover plate 262. Its position relative to the full-cutting cover plate 262 is adjustable.

[0109] A long hole is formed in the full-cutting static die rod 270, and a threaded hole is provided in the full-cutting cover plate 262. When connecting, the full-cutting static die rod 270 can be pressed and fixed on the full-cutting cover plate 262 by screwing a bolt through the long hole into the threaded hole.

[0110] During adjustment, the bolt can be rotated to move the full-cut static die rod 270 relative to the screw through the long hole to change its position. After the adjustment is in place, it can be locked and fixed with the bolt.

[0111] It is connected to the full-cut cover plate 262 through the full-cut static die rod 270. The full-cut static die rod 270 and the full-cut static die 210 are connected to realize the connection and fixation between the full-cut static die 210 and the full-cut sliding seat 261, so as to realize the support and fixation of the full-cut static die 210.

[0112] A receiving groove is arranged on the full-cut static die 210, and the full-cut static die rod 270 is arranged in the receiving groove.

[0113] In some embodiments of the present application, the connecting member 243 is a connecting seat.

[0114] In some embodiments of the present application, the full-cut moving die driving mechanism 230 is a full-cut cylinder, which is connected to the full-cut moving die 220 through a cylinder connecting block 290.

[0115] The cylinder connecting block 290 is connected to the cylinder rod. The full-cut moving die 220 includes a full-cut die body, a vertical convex portion extending from the end of the full-cut die body, and a horizontal convex portion connected to the vertical convex portion. An insertion portion is formed between the full-cut die body, the vertical convex portion and the horizontal convex portion. The insertion portion is an insertion groove, and there are 2, which are symmetrically arranged on both sides of the full-cut die body.

[0116] The cylinder connecting block 290 includes a cylinder body block, and cylinder convex portions bent from both sides of its end. The cylinder convex portions are used for insertion into the insertion portion. A receiving portion is formed between the cylinder convex portions and the cylinder body block. During connection, the horizontal convex portion is inserted into the receiving portion, and the cylinder convex portions are correspondingly inserted into the insertion portion.

[0117] In some embodiments of the present application, an inclined slope 221 is formed at one end of the full-cut moving die 220 close to the full-cut static die 210, and the full-cut moving die cutting edge 222 is formed at the intersection of the inclined slope 221 and the bottom surface of the full-cut moving die 220.

[0118] In some embodiments of the present application, a first opening portion communicating with the sliding cavity 211 is formed at one end of the full-cut static die 210 close to the full-cut moving die 220, and a second opening portion communicating with the sliding cavity 211 is formed at the end far from the full-cut moving die 220. The second opening portion and the first opening portion are oppositely arranged. A third opening portion communicating with the second opening portion is further formed at the bottom of the full-cut static die 210.

[0119] Through the provided first opening and second opening, it is convenient for the full-cut moving die 220 to be inserted into the full-cut stationary die 210 and slide.

[0120] In some embodiments of the present application, to achieve the collection of trimming waste, the trimming device in this embodiment further includes: a first waste collection box 280, which is arranged below the second opening end of the full-cut stationary die 210, connected to the full-cut stationary die 210, and its height position relative to the full-cut stationary die 210 is adjustable.

[0121] Both the top and bottom of the first waste collection box 280 have openings. It includes two side walls. When the two side walls are connected to the full-cut stationary die 210, they are respectively attached to both sides of the full-cut stationary die 210, and its openings correspond to the positions below the second opening and the third opening, so as to facilitate receiving the dropped waste leads.

[0122] Adjusting long holes are opened on the side walls of the first waste collection box 280, and locking threaded holes are opened on the full-cut stationary die 210. The first waste collection box 280 is screwed to the locking threaded holes through adjusting bolts. During adjustment, it slides up and down relative to the adjusting bolts through the adjusting long holes. After sliding in place, the adjusting bolts are locked to press and position the first waste collection box 280.

[0123] To enable the waste leads to quickly slide to the bottom of the first waste collection box 280, the bottom wall of the first waste collection box 280 can be arranged in a sloping manner from top to bottom.

[0124] Due to the fast trimming operation on the production line, the first waste collection box 280 may be filled in a short time, and the first waste collection box 280 is fixed to the full-cut stationary die 210, which is not convenient for disassembly. To facilitate waste collection, in some embodiments of the present application, the trimming mechanism is further provided with a second waste collection box 291. The second waste collection box 291 is located below the first waste collection box 280 to collect the materials that fall from the opening at the bottom of the first waste collection box 280.

[0125] The second waste collection box 291 is placed on a body. When the waste inside it is full, the second waste collection box 291 can be taken out and emptied.

[0126] The trimming support 310 is used to support the trimming device; the full-trimming base body forms the basis of the entire trimming device and is used to achieve the support and fixation of the entire trimming device.

[0127] The trimming mechanism includes: a trimming moving knife 320, and the trimming moving knife 320 includes:

[0128] The cutting-off body 311, at least one cutting-off part 312 protruding from one end of the cutting-off body 311, the cutting-off part 312 being used to cut the pins of the transistor, and clearance parts 313 being formed on both sides of the cutting-off part 312 for avoiding the pins of the transistor that are not to be cut.

[0129] In some embodiments of the present application, the cutting-off body 311 is a cutting-off body block, and the cutting-off part 312 protrudes from one end of the cutting-off body block. The cutting-off part 312 is mainly used to perform the cutting action on the pins of the transistor.

[0130] The stationary cutting knife 330 is disposed opposite to the movable cutting knife 320, and a cutting knife cavity 331 for inserting the movable cutting knife 320 is formed inside it.

[0131] In some embodiments of the present application, the cutting knife cavity 331 is arranged to penetrate from one end to the other end of the stationary cutting knife 330 along the length direction of the stationary cutting knife 330. The stationary cutting knife 330 can be selected as a stationary cutting die base.

[0132] The cutting knife cavity 331 can be a rectangular cavity, and the movable cutting knife 320 is a rectangular movable cutting knife block, which can be inserted inside the cutting knife cavity 331.

[0133] The driving mechanism 340 for the movable knife is connected to the movable cutting knife 320, drives the movable cutting knife 320 to move towards the stationary cutting knife 330 to cut off some of the pins arranged between the stationary cutting knife 330 and the movable cutting knife 320, and pushes out the cut-off waste pins by the sliding of the movable cutting knife 320 relative to the cutting knife cavity 331.

[0134] When the transistor is transported to the position between the movable cutting knife 320 and the stationary cutting knife 330, the power driving mechanism can be controlled to act, and the movable cutting knife 320 moves. The protruding cutting-off part 312 on the movable cutting knife 320 cuts the pins corresponding to its position, while the pins that do not need to be cut are avoided by the clearance parts 313 on both sides and will not be cut. In this way, when the movable cutting knife 320 moves relative to the stationary cutting knife 330, partial cutting of the pins of the transistor is achieved.

[0135] Specifically, when setting, the number of the cutting-off parts 312 can be arranged corresponding to the number of pins to be cut off, so that they are in position correspondence with the pins for cutting.

[0136] Since the movable cutting knife 320 is slidably inserted into the cutting knife cavity 331 in the stationary cutting knife 330, the partial pins cut off by the movable cutting knife 320 will enter the cutting knife cavity 331 under the pushing of the movable cutting knife 320, and slide forward under the pushing action of the movable cutting knife 320, and finally are pushed off and separated from the cutting knife cavity 331.

[0137] In some embodiments of the present application, the cutting foot portion 312 is a cutting foot protrusion extending from the end face of the cutting foot body 311. The end of the cutting foot protrusion is a cutting foot inclined surface 3121 arranged obliquely. The cutting foot blade 314 is formed at the intersection of the cutting foot inclined surface 3121 and the bottom surface of the cutting foot protrusion.

[0138] When cutting the pins of a transistor, the cutting foot portion 312 can move towards the side of the stationary cutting foot blade 330, so as to cut the pin located between the stationary cutting foot blade 330 and the moving cutting foot blade 320 from the bottom through the cutting foot blade 314 on the cutting foot portion 312 above it, and remove some pins of the transistor.

[0139] In one embodiment of the moving cutting foot blade 320 in some embodiments of the present application: One cutting foot protrusion is formed at one end of the cutting foot body 311, and the clearance portions 313 are correspondingly formed on both sides of the one cutting foot protrusion.

[0140] By providing one cutting foot protrusion, a cutting operation can be performed on one pin at the bottom of the transistor, while the clearance portions 313 on both sides of the cutting foot protrusion can avoid the pins on both sides of the transistor, realizing the removal of the middle pin.

[0141] In some embodiments of the present application, a plurality of cutting foot protrusions arranged along the length direction of the cutting foot body 311 are formed at one end of the cutting foot body 311, and the clearance portions 313 are formed on both sides of each cutting foot protrusion.

[0142] In some embodiments of the present application, it further includes:

[0143] A height adjustment device 350, connected to the cutting mechanism, for adjusting the height of the cutting mechanism. The structure of the height adjustment device 350 is the same as that of the full cutting height adjustment mechanism 240. The height adjustment device 350 includes a linear movement module 352.

[0144] The height adjustment device 350 drives the cutting mechanism to move up and down to change the height of the cutting mechanism.

[0145] By using the height adjustment device 350, the height of the cutting mechanism can be changed so that it can cut pins of different heights.

[0146] In some embodiments of the present application, an induction limit structure is arranged on the cutting foot support 310 and the linear movement module 352. The induction limit structure includes:

[0147] An induction sheet arranged on the linear movement module 352;

[0148] The first sensing element 362 and the second sensing element 363 which are arranged at the upper and lower ends of the pin-cutting support 310 to sense and detect the sensing sheet;

[0149] And a limiting element 364 arranged at the top of the pin-cutting body 311.

[0150] Both the first sensing element 362 and the second sensing element 363 are groove-type photoelectric switches.

[0151] Soft limiting is achieved through the photoelectric switch, and hard limiting is achieved through the limiting element 364.

[0152] In some embodiments of the present application, it further includes:

[0153] The moving knife seat 322 has openings at the top and both ends;

[0154] The moving knife cover plate is buckled at the top opening and is fixedly connected to the moving knife seat 322, and a moving knife sliding space is formed between it and the moving knife seat 322;

[0155] The pin-cutting static knife 330 includes: a static knife die bar 332, one end of which is fixed at the top of the pin-cutting static knife 330, and the other end extends to the top of the moving knife cover plate and is fixedly connected to the moving knife cover plate.

[0156] The pin-cutting moving knife 320 is arranged in the moving knife sliding space. The pin-cutting moving knife 320 can slide in the moving knife sliding space, and the formed moving knife sliding space can limit and guide the sliding of the pin-cutting moving knife 320.

[0157] At the same time, the moving knife seat 322 can also support the pin-cutting moving knife 320.

[0158] In some embodiments of the present application, the moving knife driving mechanism 340 is a power cylinder, which is clamped to the pin-cutting moving knife 320 through a cylinder connection block 341.

[0159] . A clamping groove and a clamping protrusion are provided on the cylinder connection block 341, and a clamping protrusion cooperating with the clamping groove and a clamping groove cooperating with the clamping protrusion are arranged on the pin-cutting moving knife 320. The two are clamped and fixed together through the cooperation of the clamping groove and the clamping protrusion, and the cooperation of the clamping protrusion and the clamping groove.

[0160] In some embodiments of the present application, one end of the pin-cutting static knife 330 close to the pin-cutting moving knife 320 forms a first opening part communicating with the pin-cutting cavity 331, and the end far from the pin-cutting moving knife 320 forms a second opening part communicating with the pin-cutting cavity 331. The second opening part and the first opening part are arranged opposite to each other, and a third opening part communicating with the second opening part is further formed at the bottom of the pin-cutting static knife 330.

[0161] Through the provided first opening and second opening, it is convenient for the cutting blade 320 to be inserted into the stationary cutting blade 330 and slide.

[0162] In some embodiments of the present application, it further includes: a first waste box 371, which is arranged below the stationary cutting blade 330 and is connected to the stationary cutting blade 330.

[0163] Both the top and bottom of the first waste box 371 have openings. It includes two side walls. When the two side walls are connected to the stationary cutting blade 330, they are respectively attached to both sides of the stationary cutting blade 330, and its openings correspond to the positions below the second opening and the third opening, so as to facilitate receiving the dropped waste pins.

[0164] To enable the waste pins to quickly slide to the bottom of the first waste box 371, the bottom wall of the first waste box 371 can be arranged in a sloping manner from top to bottom.

[0165] In some embodiments of the present application, the cutting mechanism is further provided with a second waste collection box, which is located below the first waste box 371 to collect the materials dropped from the opening at the bottom of the first waste box 371.

[0166] A kick base 410 for supporting the kicking device;

[0167] In some embodiments of the present application, the kick base 410 includes:

[0168] A horizontal kick mounting plate and a vertical kick mounting plate arranged on one side of the horizontal kick mounting plate perpendicular to the horizontal kick mounting plate.

[0169] A kicking mechanism, which can be used to form the kick of the pins of the transistor through the kicking mechanism.

[0170] Specifically, it includes: a kicking moving die 420, and the kicking moving die 420 includes:

[0171] A moving die body, and a pressing portion 422 is formed to protrude outward from the end of the moving die body. At least two pressing portions 422 are provided, and avoidance portions 423 are formed on both sides of each pressing portion 422.

[0172] A pressing material forming portion is formed on one side of the pressing portion 422;

[0173] A kicking stationary die 430, which is arranged opposite to the kicking moving die 420, and a pressing material forming and cooperating portion for cooperating with the pressing material forming portion is formed at its end face.

[0174] In the moving die body of this embodiment, a plurality of pressing parts 422 are separately formed at one end thereof. By cooperating with the kicker static die 430 through the plurality of pressing parts 422, when bending the pins of the transistor, the kicker structures of a plurality of transistors can be formed at one time. And through the avoidance parts 423 at both sides of the pressing parts 422, the pins that do not need to be bent on both sides can be correspondingly avoided, and the kicker structures of the middle pins of a plurality of transistors can be formed at one time, greatly improving the production operation efficiency.

[0175] The moving die driving device 440 is connected to the kicker moving die 420 and can drive the kicker moving die 420 to move toward the kicker static die 430 side. The moving die driving device 440 provides the power for the movement of the kicker moving die 420.

[0176] The elastic pressure feeding structure 450 is assembled on the moving die body and is used to position the top surface and pins of the transistor by cooperating with the kicker static die 430;

[0177] When forming the kicker, the moving die driving device 440 drives the kicker moving die 420 to act and drives the pressing parts 422 to move close to the kicker static die 430. When the kicker moving die 420 moves to the first position, the elastic pressure feeding structure 450 and the kicker static die 430 respectively press on both sides of the top surface of the transistor and the bottom of the pins to position the transistor;

[0178] When the kicker moving die 420 moves to the second position, the pressing and forming part and the pressing and forming cooperation part of the pressing part above it are used to extrude the pins to form the kicker, and the elastic pressure feeding structure 450 maintains its position at the first position through its own elasticity.

[0179] In some embodiments of the present application, the elastic pressure feeding structure 450 includes a pressure feeding and positioning component 451, and the pressure feeding and positioning component 451 includes:

[0180] A pressure feeding body part 452;

[0181] A sliding part 453 is formed at the bottom of the pressure feeding body part 452 and is slidably arranged in the sliding long groove 425 of the moving die body; A sliding long groove 425 is opened at the bottom of the moving die body, and the bottom of the sliding long groove 425 is open and both ends are closed.

[0182] The sliding part 453 is a sliding protrusion formed at the bottom of the pressure feeding body part 452, and it is inserted into the sliding long groove 425 and can slide along the sliding long groove 425.

[0183] A positioning part is arranged at one end of the pressure feeding body part 452 away from the sliding part 453, and the positioning part is a positioning plate piece transversely connected to the end of the pressure feeding body part 452.

[0184] The positioning part includes:

[0185] The first positioning and pressing part 454 is used to press tightly on the top surface of the transistor;

[0186] The first positioning and pressing part 454 is the first positioning and pressing surface formed at the bottom surface of the positioning plate member.

[0187] The second positioning and pressing part 455 is used to abut and press tightly against the side surface of the pin of the static transistor;

[0188] The second positioning and abutting part is the second positioning and abutting side surface at the side part of the positioning plate member.

[0189] One end of the elastic member 456 abuts against the sliding part 453, and the other end abuts against the wall of the sliding long groove 425.

[0190] The elastic member 456 is a spring, which abuts against the sliding part 453, and can provide an elastic force for the blanking and positioning component 451, so that it can abut and press tightly and position the transistor.

[0191] Since the blanking and positioning component 451 can slide relative to the sliding long groove 425, and an elastic member 456 is arranged at the end to elastically support it, it can be adapted to different models of transistors, can position different models of transistors, adapt to different models of transistors, and improves the versatility of the kicking device.

[0192] For example, during layout, the pins of the crystal changer can be arranged at the middle position, or near the left position, or near the right position. The blanking and positioning component 451 in this embodiment is movable along the moving direction of the kicking moving die 420. Therefore, even if the pin setting position changes, the blanking and positioning component 451 can maintain the positioning effect on the pin by changing its position in the sliding long groove.

[0193] When the transistor is being transported, it is placed on the transport channel of the crystal transport device and transported forward, with the pins of the transistor facing up. When it is transported to the position between the kicking moving die 420 and the kicking static die 430, the pins can be bent by the action of the kicking moving die 420.

[0194] Specifically, when forming the kicking, the driving device 440 of the moving die acts to drive the kicking moving die 420 connected to the driving device 440 of the moving die to move. When the kicking moving die 420 moves to the first position, the kicking moving die 420 does not contact and cooperate with the kicking static die 430. At this time, the blanking and positioning component 451 has moved in place. The blanking and positioning component 451 presses on one side of the top surface of the transistor through the first positioning and pressing part 454, and the kicking static die 430 presses on the other side of the top surface of the transistor to tightly press the top surface of the transistor;

[0195] The second positioning and pressing part 455 and the side surface of the kicker stationary mold 430 are respectively pressed on both sides of the bottom of the pin of the transistor to position the transistor pin.

[0196] The blanking and positioning component 451 and the kicker stationary mold 430 fix the pin to form a fulcrum, which can prevent deformation in places where molding is not required during molding.

[0197] After moving to the first position, the blanking and forming part and the blanking and forming mating part of the kicker moving mold 420 and the kicker stationary mold 430 are not in contact. At this time, the kicker moving mold 420 continues to move towards the side of the kicker stationary mold 430. Since the blanking and positioning component 451 has already abutted against the side of the pin and is elastic and can move relative to the moving mold body 421, when the kicker moving mold 420 continues to move, the blanking and positioning component 451 remains in its original position and does not continue to move, so as to maintain the positioning of the transistor by cooperating with the kicker stationary mold 430, thereby ensuring the bending effect and accuracy of the pins of the transistor.

[0198] When moving to the second position, the blanking and forming part on the moving mold body 421 fits and cooperates with the kicker stationary mold 430 and presses the pin of the transistor located between the blanking and forming part and the blanking and forming mating part to bend the pin to form the kicker structure.

[0199] The blanking and positioning component 451 is elastic, so that when the kicker moving mold 420 moves towards the side of the kicker stationary mold 430 to extrude and form the pin, it can not move with the kicker moving mold 420 and will not interfere with the forming of the kicker by the kicker moving mold 420.

[0200] In some embodiments of the present application, the kicker moving mold 420 further includes a moving mold connecting member 483. The moving mold connecting member 483 is connected to the moving mold driving device 440 and the moving mold body 421, and the position of the moving mold connecting member 483 relative to the moving mold body 421 is adjustable.

[0201] The moving mold connecting member 483 is a moving mold connecting rod, and the moving mold driving device 440 is a moving mold driving cylinder, which is connected to the moving mold connecting member 483 through a connecting block.

[0202] In some embodiments of the present application, card slots with side openings are formed on both sides of the end of the moving mold connecting rod, and a protruding clamping protrusion is also formed at its end. The clamping protrusion is in the shape of a straight line.

[0203] The connecting block includes a block body and a protruding part at the end of the block body for being clamped into the two side card slots. An adapting slot for clamping the clamping protrusion is formed between the protruding part and the block body.

[0204] The connecting block and the moving die connecting member 483 are clamped and fitted by the clamping protrusions and clamping grooves respectively cooperating with the fitting grooves and the protruding portions. An assembly groove is formed on the kicking moving die 420. The moving die connecting member 483 is located in the assembly groove and is fixedly connected to the kicking moving die 420 through locking screws.

[0205] During operation, the moving die driving device 440 drives the moving die connecting member 483 and the kicking moving die 420 to move synchronously.

[0206] A moving die adjusting hole is provided on the moving die connecting member 483, and a locking hole is provided on the kicking stationary die 430. The moving die connecting member 483 is locked into the locking hole through a bolt and is pressed and fixed. During adjustment, its position is changed by moving the moving die adjusting hole relative to the bolt, and it can be locked after reaching the position.

[0207] In some embodiments of the present application, the material pressing and forming part includes:

[0208] The first material pressing and forming part and the second material pressing and forming part arranged in sequence on one side of the pressing part 422;

[0209] The material pressing and forming matching part includes:

[0210] Arranged in sequence on the end face of the kicking stationary die 430:

[0211] The first material pressing and forming matching part, which is adaptively matched with the first material pressing and forming part;

[0212] The second material pressing and forming matching part, which is adaptively matched with the second material pressing and forming part.

[0213] In some embodiments of the present application, the first material pressing and forming part is the first inclined surface or the first vertical surface arranged at a position on one side of the pressing part 422;

[0214] The second material pressing and forming part 2 is the second inclined surface or the second vertical surface arranged on the pressing part 422.

[0215] Whether the first material pressing and forming part 1 adopts the first inclined surface or the first vertical surface structure is mainly set according to the pin structure to be formed.

[0216] In some embodiments of the present application, the first material pressing and forming part is the first inclined surface, arranged on the lower side of the pressing part 422, and the second material pressing and forming part is the second vertical surface, located above the first inclined surface.

[0217] The first material pressing and forming matching part is also correspondingly set to the first material pressing and forming inclined surface and the second material pressing and forming vertical surface adapted to it.

[0218] In some embodiments of the present application, to realize the adjustment of the shoulder height of the kicking of the pins, the kicking device further includes:

[0219] A kick height adjusting device 460, connected to the kick device, for adjusting the height of the kick device;

[0220] In some embodiments of the present application, the kick height adjusting device 460 includes: a kick power component 461, assembled on the kick base 410;

[0221] The kick power component 461 is a kick motor, for providing the power for height adjustment.

[0222] A kick linear module 462, drivingly connected to the kick power component 461, capable of moving up and down under the drive of the kick power component 461;

[0223] A kick connecting piece 463, connecting the kick linear movement module and the kick mechanism, capable of driving the kick mechanism to move up and down under the drive of the kick linear module 462, so as to change the height of the pin kick shoulder formed by the kick mechanism.

[0224] The kick power component 461 acts, driving the kick linear module 462 connected thereto to act, driving the kick connecting piece 463 connected thereto and the kick mechanism connected to the kick connecting piece 463 to move up and down through the up and down movement of the kick linear module 462, so as to realize the adjustment of the height position of the kick mechanism.

[0225] The height of the kick mechanism can be changed by the height adjusting device, so that kicks of different heights can be formed.

[0226] If the height of the kick shoulder of the transistor needs to be increased, the kick mechanism needs to be moved downward. If the height of the kick shoulder of the kick needs to be decreased, the kick mechanism can be moved upward, so as to form a kick structure with different shoulder heights, improving the versatility of the entire kick device.

[0227] In some embodiments of the present application,

[0228] The kick linear module 462 includes:

[0229] A kick screw rod, connected to the output end of the kick power component 461;

[0230] A kick nut, in threaded cooperation with the kick screw rod;

[0231] A kick nut seat, fixedly connected to the kick nut and the kick connecting piece 463;

[0232] A kick guiding assembly, formed between the kick nut seat and the kick base 410, for limiting the up and down movement of the kick nut seat relative to the kick base 410.

[0233] In some embodiments of the present application, the kick guiding assembly includes a slideway provided on the kick nut seat and a slide rail arranged between the kick bases 410. Through the cooperation of the slideway and the slide rail, the kick nut seat can only move up and down along the kick base 410.

[0234] During adjustment, the kick screw is driven to rotate by the kick power component 461 to drive the kick nut to move. The kick nut drives the kick nut seat, the kick connecting piece 463 and the kick mechanism to move up and down.

[0235] In some embodiments of the present application, an induction limit structure is arranged on the kick base 410 and the kick linear module 462. The induction limit structure includes:

[0236] A kick limit piece 471 arranged on the kick linear module 462;

[0237] A first kick induction element 472 and a second kick induction element 473 arranged at the upper and lower ends of the kick mechanism to sense and detect the kick limit piece 471;

[0238] And a kick limit member 474 arranged at the top of the kick body.

[0239] Both the first kick induction element 472 and the second kick induction element 473 are groove-shaped photoelectric switches. One is arranged at the upper end position of the vertical kick mounting plate, and the other is arranged at the lower end position of the vertical kick mounting plate to respectively perform induction limit on the upper limit position and the lower limit position where the kick nut seat moves to.

[0240] Soft limit of the kick nut seat is achieved through the photoelectric switch, and hard limit of the kick nut seat is achieved through the kick limit member 474.

[0241] In some embodiments of the present application, the kick moving die 420 further includes:

[0242] A kick moving die seat 481, which is connected to the kick connecting piece 463, and the kick stationary die 430 is fixedly connected above it;

[0243] A kick cover body 482, which is assembled on the kick moving die seat 481, and a kick sliding cavity for the sliding of the moving die connecting piece 483 is formed between it and the kick moving die seat 481.

[0244] The kick connecting piece 463 is slidably arranged in the kick sliding cavity. The kick moving die 420 can slide in the kick sliding cavity. Through the formed kick sliding cavity, the sliding limit and guiding effects on the kick connecting piece 463 can be achieved.

[0245] At the same time, the skirting movable mold base 481 can also realize the bearing and supporting function of the skirting movable knife and the skirting connecting piece 463.

[0246] In some embodiments of the present application, the skirting connector 463 is a skirting connector seat, which includes a first connecting part and a second connecting part, the first connecting part is perpendicular to the second connecting part, the first connecting part is fixedly connected to the skirting movable mold seat 481, and the second connecting part is fixedly connected to the skirting nut seat.

[0247] The second kicking device 490 has the same structure as the first kicking device except that the movable mold body has a different structure. Specifically, the second kicking device 490 includes:

[0248] The second movable mold body 491 has an escape space 492 formed inwardly thereon. Material pressing portions 493 are formed on both sides of each of the escape spaces 492 . There are at least two material pressing portions 493 .

[0249] The pressing portion 493 has a first pressing surface 4931 and a second pressing surface 4932 .

[0250] The second kickboard static mold 495 has the same structure as the kickboard static mold of the first kickboard device, and is provided with a pressing fitting part on the top, which has the same structure as the pressing molding fitting part and has a surface that fits with the first pressing surface 4931 and the second pressing surface 4932.

[0251] In some embodiments of the present application, two escape spaces 492 are formed inwardly on the second movable mold body 491, and three pressing portions 493 protruding from the escape spaces are formed correspondingly. This structure can be used to simultaneously form kick plates for the pins on both sides of two transistors.

[0252] During molding, the middle pressing portion 493 presses the pins of two transistors at the same time, and the pressing portions 493 on both sides press the other pins of the two transistors respectively, and the middle avoiding space 492 avoids the pins that are not pressed.

[0253] The second kicking device 490 can be used to form a kicking structure for the pins on both sides of multiple transistors at one time, thereby improving production efficiency.

[0254] The material conveying device is used to receive the material in the intermediate transfer channel and transport the processed crystal material outward. The top of the material frame of the material conveying device is formed with a receiving area 510 and a conveying component placement area 520;

[0255] The accommodating area 510 and the conveying component placement area 520 are arranged in parallel at the top position of the material rack 500 .

[0256] The lifting mechanism is arranged inside the material frame and includes:

[0257] Lifting platform 610;

[0258] Lifting drive device 620, connected to the lifting platform 610 through a transmission device, for driving the lifting platform 610 to move up and down;

[0259] Driven by the lifting drive device 620, when the lifting platform 610 moves upward, it can move to the accommodating area 510 at the top position.

[0260] Conveyor roller channel 530, arranged in the conveying component placement area 520, fixedly connected to the material rack body 500, and the conveyor roller channel 530 is arranged obliquely toward the accommodating area 510 side;

[0261] Material box group, including a plurality of material boxes 640, arranged along the length direction of the material rack body on the conveyor roller channel 530;

[0262] The plurality of material boxes 640 arranged on the conveyor roller channel 530 are arranged in parallel on the material rack body. The material box 640 located on the lifting platform is used to receive the formed transistor materials on the production line, and the plurality of material boxes 640 located on its side are empty material boxes 640. After the material box 640 in the accommodating area 510 is full, it will slide along the obliquely arranged conveyor roller channel 530 to the position of the lifting platform 610 in the accommodating area 510. The empty material box 640 located above it will automatically slide down under the action of gravity and continue to be used to receive the formed materials.

[0263] Material box transfer device 630, arranged on the lifting platform 610, for receiving the material box 640 conveyed to the lifting platform 610 or conveying the material box 640 on the lifting platform 610 outward;

[0264] To ensure that the material box 640 can be transferred onto the lifting platform 610 or conveyed out from the lifting platform 610, the material box transfer device 630 arranged on the lifting platform 610 is used to transmit power to the material box 640 and drive it to move.

[0265] Blocking and limiting component 650, for locking or unlocking the material box 640 close to the accommodating area 510;

[0266] In some embodiments of the present application, the blocking and limiting component 650 is a blocking and limiting cylinder, which is arranged at both sides of the material rack body. When the cylinder rod of the blocking and limiting cylinder extends, it will abut against the side of the material box 640 to prevent it from slipping. When the cylinder rod of the blocking and limiting cylinder retracts, the limit on the material box 640 is eliminated. At this time, the material box 640 can move downward along the obliquely arranged conveyor roller channel 530.

[0267] The lifting table 610 moves to the accommodating area 510 under the drive of the lifting drive device 620. The lifting table 610 is docked with the conveying roller channel 530, and the blocking and limiting component 650 acts to unlock the material box 640 so that the material box 640 located on the conveying roller channel 530 slides down onto the lifting table 610 under the action of gravity. After the material box is filled with materials, the lifting table 610 moves downward, driving the material box 640 for transportation.

[0268] The formed transistor materials will fall into the material box 640 on the lifting table. As the transistor materials are continuously placed into this material box 640, the material box 640 is filled. At this time, the lifting drive device 620 can act to drive the lifting table 610 to move downward and transport it outwards to the bottom position of the material rack body, realizing the automatic transportation of the full material box 640 without manual participation in handling and transportation, improving the operation efficiency.

[0269] After the transportation is completed, the lifting table moves upward to the accommodating area 510 to be docked with the conveying roller. The blocking and limiting component 650 acts to release the locking of the material box 640, and the material box 640 slides down onto the material box conveying device 630 of the lifting table under the action of gravity. The material box conveying device 630 completely conveys the material box 640 onto the lifting table and continues to receive materials in a cycle.

[0270] In some embodiments of the present application, to further improve the automation level of material transportation, a material box docking and conveying device 660 is also correspondingly provided, which is used to receive and transport the material box 640 conveyed from the material box conveying device 630.

[0271] To achieve control, a controller is also provided in this embodiment.

[0272] In some embodiments of the present application, the material box docking and conveying device 660 can directly select an existing AGV cart, which can directly move to the position of the lifting table 610 at the bottom of the material rack body according to the navigation route built in the controller, and the material box conveying device 630 directly conveys the material box 640 onto the AGV cart for transportation.

[0273] In some embodiments of the present application, the material rack body includes:

[0274] A supporting component 540; the supporting component 540 is a supporting bottom plate.

[0275] A material frame 550, assembled on the supporting component 540;

[0276] The peripheral plate member 560 is arranged around the material frame 550. An accommodation space is formed among the supporting member 540, the material frame 550 and the peripheral member, and the lifting mechanism is arranged in the accommodation space. An avoidance inlet and outlet is formed on the peripheral plate member 560.

[0277] In some embodiments of the present application, the conveying roller channel 530 is composed of a plurality of conveying roller members 531 arranged along the length direction of the material frame 550. Each conveying roller member 531 is horizontally arranged on the top of the material frame 550 and fixedly connected to both sides of the material frame 550.

[0278] The heights of the plurality of conveying roller members 531 gradually decrease corresponding to the direction from far away from the accommodating area 510 to close to the accommodating area 510, that is, the heights of the plurality of conveying roller members 531 gradually become smaller, so as to form an inclined conveying roller channel 530, enabling the material box 640 to automatically slide down under the action of gravity.

[0279] In some embodiments of the present application, the transmission device includes:

[0280] A lead screw nut transmission device, and the lead screw nut transmission device includes:

[0281] A lead screw 671;

[0282] A nut 672, threadedly connected to the lead screw 671 and fixedly connected to the lifting table 610;

[0283] A sliding guide rail 673, one end of which is fixedly connected to the supporting member 540, and the other end is fixedly connected to the top of the material frame 550 through a connecting plate 674. The end of the lead screw 671 is rotatably connected to the connecting plate 674.

[0284] The lifting table 610 is slidably arranged on the sliding guide rail 673;

[0285] A gear transmission device, including a first transmission gear, which is in transmission connection with the lifting drive device 620;

[0286] A second transmission gear 675, assembled on the lead screw 671, and the second transmission gear 675 meshes with the first transmission gear.

[0287] The lifting drive device 620 is a lifting drive motor, and the lifting drive motor is in transmission connection with the first transmission gear.

[0288] When the lifting platform 610 moves, the lifting drive device 620 drives the first transmission gear to rotate. The first transmission gear drives the second transmission gear 675 to rotate. The second transmission gear 675 drives the lead screw 671 to rotate, and finally drives the nut 672 threadedly engaged with the lead screw 671 to move linearly. The nut 672 is fixed to the lifting platform 610, thereby enabling the lifting platform 610 to move linearly up and down to realize the adjustment of the up and down height of the lifting platform 610.

[0289] In some embodiments of the present application, it further includes:

[0290] A vertical support member 680, a bent portion is formed on the vertical support member 680, and a plurality of notch portions 681 arranged along the height direction of the bent member are provided on the bent portion;

[0291] A first height detection element 682 is arranged at a position close to the upper part of the vertical support member 680;

[0292] A second height detection element 683 is arranged at a position close to the lower part of the vertical support member 680;

[0293] A lifting platform detection element 611 is arranged on the lifting platform 610 for cooperating with the notch portion 681, the first height detection element 682 and the second height detection element 683.

[0294] The first height detection element 682 is a first height photoelectric detection switch, the second height detection element 683 is a second height photoelectric detection switch, and the lifting platform detection element 611 is a lifting platform 610 photoelectric detection switch.

[0295] When the lifting platform 610 moves upward to the position where the first height detection element 682 is located, the first height detection element 682 senses the lifting platform detection element 611 and transmits a signal to the controller to control the lifting platform 610 to decelerate through the controller, preventing the lifting platform 610 from colliding with the top frame at too fast an upward movement speed and causing damage.

[0296] When the lifting platform 610 moves downward to the position of the second height detection element 683, the second height detection element 683 senses the lifting platform detection element 611 and transmits a signal to the controller, and the controller controls the lifting mechanism to decelerate.

[0297] The lifting platform detection element 611 can move up and down with the lifting platform 610. When the lifting platform 610 moves to the position of the notch portion 681, the lifting platform detection element 611 will detect it to detect the lifting height of the lifting platform 610 in real time.

[0298] In some embodiments of the present application, the material box conveying device 630 includes:

[0299] The material conveying power component 631. In some embodiments of the present application, the material conveying power component 631 is a material conveying motor.

[0300] The main material conveyor belt assembly is connected to the material conveying power component 631. It includes a driving output pulley 632, a driving input pulley, and a main conveyor belt. The driving input pulley is connected to the material conveying power component 631, and the main conveyor belt is connected between the driving input pulley and the driving output pulley 632.

[0301] The transmission rod 633 is connected to the driving output pulley 632;

[0302] The transmission rod 633 is driven to rotate by the driving output pulley 632.

[0303] There are 2 sets of driven material conveyor belt assemblies 634, symmetrically arranged on both sides of the lifting table 610. Each driven material conveyor belt assembly 634 includes a driven input pulley 6341, and the driven input pulley 6341 is connected to the transmission rod 633.

[0304] The driven material conveyor belt assembly 634 further includes a driven output pulley and a driven conveyor belt. The driven conveyor belt is wound around the driven input pulley 6341 and the driven output pulley.

[0305] In some embodiments of the present application, it further includes:

[0306] There are 2 guide wheel frames 635, symmetrically assembled on the lifting table 610;

[0307] On each guide wheel frame 635, a guide support roller group 636 is assembled. The guide support roller group 636 includes a plurality of guide support rollers. The plurality of guide support rollers are arranged in sequence along the length direction of the driven conveyor belt of the driven material conveyor belt assembly 634 and support the bottom of the driven conveyor belt.

[0308] The material arranged on the driven conveyor belt is supported by the guide support rollers.

[0309] In some embodiments of the present application, a limiting structure is provided on the guide wheel frame 635. The limiting structure includes:

[0310] A partition member 691 horizontally connected between the 2 guide wheel frames 635;

[0311] The partition member 691 is a blocking and limiting rod, which is used to achieve hard limitation of the material box 640.

[0312] And limiting induction sensors 692 respectively arranged on the 2 guide wheel frames 635.

[0313] The limit sensing sensor is used to achieve soft limit for the movement of the material box 640, preventing the material box 640 from falling off the animal material conveyor belt assembly 634.

[0314] In some embodiments of the present application, support feet cups 693 and caster assemblies 694 are provided at the bottom of the supporting member 540, and the height of the support feet cups 693 relative to the supporting member 540 is adjustable.

[0315] The support feet cup 693 includes a support cup body, on which a nut 672 sleeve is provided, a screw rod is fixed at the bottom of the supporting member 540, the screw rod is screwed into the nut 672 sleeve, and when the height needs to be adjusted, the support cup body is rotated to change its height relative to the supporting member 540.

[0316] When the support feet cup 693 is required to support the device, the support feet cup 693 is adjusted to a higher position so that its height is higher than that of the casters.

[0317] When the device needs to be moved, the support feet cup 693 is adjusted to a lower position so that its height is lower than that of the casters.

[0318] To achieve the screening of misfed materials, a misfed material screening device 700 is further provided in this embodiment, which includes:

[0319] A camera detection component,

[0320] A material rejection mechanism 750, which includes:

[0321] A support base 760;

[0322] A driving device 752, arranged on the support base 760;

[0323] A linear transmission device 753, connected to the driving device 752, capable of converting the rotation of the driving device 752 into linear motion;

[0324] A material rejection element 754, used to clamp unqualified transistors, connected to the linear transmission device 753, capable of moving along the conveying direction of the transistors under the drive of the linear transmission device 753 and automatically opening and closing to clamp the transistors;

[0325] The material rejection element 754 includes a material rejection power cylinder 7541 and a clamping clip 7542 connected to the material rejection power cylinder 7541.

[0326] The material rejection cylinder can directly select an existing jaw cylinder, and the clamping clip 7542 is fixedly assembled on the jaw cylinder and opens and closes under its drive to grab materials.

[0327] A controller, communicating with the detection camera 740, the driving device 752 and the material rejection element 754.

[0328] The transistor will move to the position corresponding to the detection camera 740 and take a photo here. This position is a known position and distance pre-stored in the controller. When a defective product is detected, the controller controls the driving device 752 to drive the material rejection element 754 to move this distance to grab the transistor.

[0329] The cartridge 755 is arranged below the material rejection mechanism 750 for placing the detected transistors.

[0330] When the transistor detection device in this embodiment is in use, the detection camera 740 takes a photo of each transistor conveyed by the transistor conveying track, and the photo information is transmitted to the controller. Then, the controller analyzes and compares according to the prior art method described in the background art to determine whether the transistor is a defective or incorrect material.

[0331] In this embodiment, the defective product screening device 810 has the same structure as the wrong material screening device 700, and the only difference is the detection parameters extracted from the captured photos.

[0332] When the detection parameters are different, the controller's image analysis module can obtain the corresponding detection parameters. For example, when screening for wrong transistors, the controller obtains the character information on the transistors in the photo or the external contour information of the transistors.

[0333] When screening for defective transistors, the controller only needs to obtain the pin length information of the transistors.

[0334] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, for those of ordinary skill in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions required to be protected by the present invention.

Claims

1. A bulk transistor material forming device, It is characterized in that Included are: A support body, used to support the crystal forming device; A feeding device, arranged on the support body; A material conveying device is arranged on the support body, and includes: a crystal feeding track, and the material conveying device can drive the material conveyed from the feeding device to move along the crystal feeding track; The crystal forming device group is mounted on the top of the support body and laterally spans above the crystal conveying track, and includes: The full pin cutting device is used to completely remove a certain height of the transistor pins, including: Fully cut foot base; The full-cut foot mechanism comprises: a full-cut static die, a sliding cavity is formed inside the die; Full cutting die; A full-cutting movable die driving mechanism is connected to the full-cutting movable die, drives the full-cutting movable die to move, cooperates with the full-cutting static die to perform a foot cutting action, and drives the full-cutting movable die to slide in the sliding cavity; A full-cut height adjustment mechanism is mounted on the full-cut foot base, connected to the full-cut foot mechanism, and can drive the full-cut foot mechanism to rise and fall to change the height position of the full-cut foot mechanism; A pin part cutting device is used to remove a certain height of part of the pins of the transistor; A first kicking device is used to form a kicking structure for the middle pin of the transistor; and a second kicking device, used for forming a kicking structure for the pins on both sides of the transistor; Defective product screening device, used to detect defective products and remove defective transistor materials; The material conveying device comprises: A material rack, on the top of which a plurality of inclined material boxes are arranged; Block the limiting component to lock or unlock the material box; The lifting platform can be raised and lowered, can rise to the top of the material frame and support the material box that slides down from one side of the material frame, and can descend to transfer the material box when the material box is full; A material box conveying device is arranged on the lifting platform so that the material box is input to the lifting platform or the material box is output from the lifting platform; a controller communicating with the full pin cutting device, the partial pin cutting device, the first kicking device and the second kicking device, the defective product screening device and the material conveying device; The controller can selectively control at least one or more of the full-foot cutting device, the partial foot cutting device, the first kicking device and the second kicking device to open.

2. The bulk transistor material forming device according to claim 1, It is characterized in that Also included is: a wrong material screening device, the wrong material screening device includes: A camera detection component for taking pictures of transistors transported through the crystal transport track; Material rejection mechanism, including: Supporting substrate; A driving device, arranged on the supporting base; A linear transmission device, connected to the driving device, capable of converting the rotation of the driving device into linear motion; A material rejection element, used to clamp unqualified transistors, is connected to the linear transmission device, and can move along the conveying direction of the transistors under the drive of the linear transmission device and clamp the transistors by automatically opening and closing; A material box, arranged below the material rejection mechanism, for placing the detected transistors; The controller includes an image analysis and processing module, which can perform image analysis and processing on the photos taken by the detection camera assembly, extract the parameters to be detected in the photos, and compare them with the standard parameter values pre-stored in the controller to determine whether the transistor is qualified.

3. The bulk transistor material forming device according to claim 1, characterized in that, the pin partial cutting device includes: a pin cutting support body for supporting the pin cutting device; a pin cutting mechanism, including: a pin cutting moving knife, and the pin cutting moving knife includes: a pin cutting body, at least one pin cutting part protruding from one end of the pin cutting body, the pin cutting part is used for cutting the pins of the transistor, and avoidance parts for avoiding the pins of the transistors that are not cut are formed on both sides of the pin cutting part; a pin cutting static knife, which is arranged opposite to the pin cutting moving knife, and a pin cutting cavity for inserting the pin cutting moving knife is formed inside it; a moving knife driving mechanism, which is connected to the pin cutting moving knife, drives the pin cutting moving knife to move towards the pin cutting static knife to cut off part of the pins arranged between the pin cutting static knife and the pin cutting moving knife, and pushes out the cut waste pin material by sliding the pin cutting moving knife relative to the pin cutting cavity.

4. The bulk transistor material forming device according to claim 1, characterized in that, the first kicking device, a kicking base body for supporting the kicking device; a kicking mechanism, including: a kicking moving die, and the kicking moving die includes: a moving die body, a pressing part protruding outward from the end of the moving die body, at least 2 pressing parts are provided, avoidance parts are formed on both sides of each pressing part, and a material pressing and forming part is formed on each pressing part; a kicking static die, which is arranged opposite to the kicking moving die, and a material pressing and forming cooperation part for cooperating with the material pressing and forming part is formed on its end face; a moving die driving device, which is connected to the kicking moving die and can drive the kicking moving die to move towards the kicking static die side; an elastic material pressing structure, which is assembled on the moving die body and is used for positioning the top surface and pins of the transistor by cooperating with the kicking static die.

5. The bulk transistor material forming device according to claim 4, characterized in that, the elastic material pressing structure includes: a material pressing and positioning component, and the material pressing and positioning component includes: a material pressing body part; a sliding part, which is formed at the bottom of the material pressing body part and is slidably arranged in the sliding long groove of the moving die body; an elastic part, one end of which abuts against the sliding part, and the other end abuts against the wall of the sliding long groove; a positioning part, which is arranged at one end of the material pressing body part far from the sliding part, and the positioning part includes: a first positioning and pressing part for pressing tightly on the top surface of the transistor; a second positioning and pressing part for abutting and pressing tightly on the side surface of the pins of the static transistor.

6. The bulk transistor material forming device according to claim 5, characterized in that, the material pressing and forming part includes: a first material pressing and forming part and a second material pressing and forming part arranged in sequence on one side of the pressing part; the material pressing and forming cooperation part includes: arranged in sequence on the end face of the kicking static die: a first material pressing and forming cooperation part, which is adaptively matched with the first material pressing and forming part; a second material pressing and forming cooperation part, which is adaptively matched with the second material pressing and forming part.

7. The bulk transistor material forming device according to claim 1, characterized in that, the second kicking device includes: a second moving die body, a relief space is recessed in the second moving die body, and pressing parts are formed on both sides of each relief space. At least 2 pressing parts are arranged, and the pressing part has a first pressing surface and a second pressing surface; a second kicking static die, which has the same structure as the kicking static die of the first kicking device, is provided with a pressing material matching part above, has the same structure as the pressing material forming matching part, and has surfaces matching the first pressing surface and the second pressing surface.

8. The bulk transistor material forming device according to claim 1, characterized in that, it includes: a lifting mechanism, and the lifting mechanism includes a lifting table; a receiving area and a conveying component placement area are formed at the top of the material rack body; a lifting driving device, which is connected to the lifting table through a transmission device and is used to drive the lifting table to move up and down; a conveying roller channel, which is arranged in the conveying component placement area and is inclined towards the receiving area; a material box conveying device, which is arranged on the lifting table and is used to receive the material box conveyed to the lifting table or convey the material box on the lifting table outwards; a material box group, which includes a plurality of material boxes and is arranged on the conveying roller channel along the length direction of the material frame; wherein, when conveying the material box, the lifting table moves to the receiving area under the drive of the lifting driving device, the lifting table is docked with the conveying roller channel, and the blocking and limiting component acts to unlock the material box so that the material box located on the conveying roller channel slides down to the lifting table under the action of gravity, and the lifting table moves up and down to drive the material box for conveying.

9. The bulk transistor material forming device according to claim 1, characterized in that, the material box conveying device includes: a material conveying power component; a main material conveyor belt assembly, which is connected to the material conveying power component and includes a main output pulley; a transmission rod, which is connected to the main output pulley; two groups of slave material conveyor belt assemblies, which are symmetrically arranged on both sides of the lifting table, and each slave material conveyor belt assembly includes a slave input pulley, and the slave input pulley is connected to the transmission rod.

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