Mounting device, mounting method, and substrate height measurement method

Abstract

The mounting device includes: a lifting device that raises and lowers a holding member holding an element relative to a substrate; a contact detection unit that detects contact between the holding member or the element held by the holding member and the substrate; and a control unit that sets the mounting height of the element according to the substrate height. When the holding member holding the element is lowered to the mounting height by the lifting device and contact is detected, the holding of the element is released and mounting is performed. In the above mounting device, the control unit obtains the height of the holding member when the holding member is lowered by the lifting device and contact is detected, and measures the substrate height based on the height of the holding member.

Description

Technical Field

[0001] This specification discloses an installation device, an installation method, and a substrate height measurement method. Background Art

[0002] Conventionally, in an installation device for mounting components on a substrate, a device for measuring the height of the upper surface of the substrate, that is, the substrate height, has been proposed (for example, refer to Patent Document 1). This installation device includes a sensor such as a laser displacement sensor. The substrate height is measured by the sensor at the moment when the substrate is first loaded, and the components are mounted on the substrate based on the stroke determined according to the substrate height.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2009-27015 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In the above installation device, a dedicated sensor is provided to measure the substrate height, which increases the cost. In addition, in a laser displacement sensor, when the laser irradiates the boundary portion of electrodes, wirings, etc. formed on the substrate, the degree of reflection and scattering changes, and sometimes the substrate height is misrecognized.

[0008] The main object of the present disclosure is to suppress an increase in cost and measure the substrate height with high precision.

[0009] Technical Means for Solving the Problems

[0010] The present disclosure adopts the following means to achieve the above main object.

[0011] The installation device of the present disclosure includes: a lifting device that lifts and lowers a holding member holding a component relative to a substrate; a contact detection unit that detects contact between the holding member or the component held by the holding member and the substrate; and a control unit that sets the installation height of the component according to the substrate height. When the holding member holding the component is lowered to the installation height by the lifting device and the contact is detected, the holding of the component is released and installation is performed. The gist of the installation device is that the control unit obtains the height of the holding member when the holding member is lowered by the lifting device and the contact is detected, and measures the substrate height based on the height of the holding member.

[0012] In the mounting device of the present disclosure, the height of the holding member when the holding member is lowered by the lifting device and contact is detected is obtained, and the height of the contact position is derived based on the height of the holding member, thereby measuring the substrate height. Thus, it is possible to measure the substrate height using the contact detection unit that detects the contact of the element with the substrate when mounting the element. Therefore, it is possible to measure the substrate height with high precision without being affected by light reflection or the like. In addition, there is no need to add a dedicated detection unit for measuring the substrate height, so an increase in cost can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural diagram showing an outline of the structure of the mounting device 10.

[0014] Figure 2 It is a structural diagram showing an outline of the structure of the mounting head 40.

[0015] Figure 3 It is a structural diagram showing an outline of the structure of the mounting head 40.

[0016] Figure 4 It is an explanatory diagram showing a state of switching the flow state of air.

[0017] Figure 5 It is an explanatory diagram showing the electrical connection relationship of the mounting device 10.

[0018] Figure 6 It is a flowchart showing an example of an element mounting process program.

[0019] Figure 7 It is a flowchart showing an example of element mounting in the height measurement mode.

[0020] Figure 8 It is an explanatory diagram showing an example of the measurement position of the substrate height.

[0021] Figure 9 It is a flowchart showing an example of element mounting in the normal mode.

[0022] Figure 10 It is an explanatory diagram showing an example of a state of setting the mounting height.

[0023] Figure 11 It is a flowchart showing an example of element mounting in the additional measurement mode.

[0024] Figure 12 It is a structural diagram showing an outline of the structure of the mounting device 10A of a modified example.

[0025] Figure 13 It is a flowchart showing element mounting in the height measurement mode of a modified example.

[0026] Figure 14 It is a flowchart of component mounting in the normal mode showing a modified example.

[0027] Figure 15 It is a schematic structural diagram showing the structure of the mounting device 10B of the modified example.

[0028] Figure 16 It is an explanatory diagram showing the position of the mounting head 40 of the mounting device 10B in the vertical direction. Detailed implementation mode

[0029] Next, embodiments of the present disclosure will be described with reference to the accompanying drawings. Figure 1 It is a schematic structural diagram showing the structure of the mounting device 10. Figure 2 , Figure 3 It is a schematic structural diagram showing the structure of the mounting head 40. Figure 4 It is an explanatory diagram showing the state of switching the air flow state.

[0030] Figure 5 It is an explanatory diagram showing the electrical connection relationship of the mounting device 10. In addition, Figure 1 The left - right direction is the X - axis direction, the front - rear direction is the Y - axis direction, and the up - down direction is the Z - axis direction.

[0031] As Figure 1 shown, the mounting device 10 includes a substrate transfer device 14, a component supply device 16, an XY robot 30, a mounting head 40, and a control device 100 (refer to Figure 5 ). The substrate transfer device 14 transfers the substrate S from left to right respectively through two sets of conveyor units arranged front - to - back. The component supply device 16 is configured as a tape feeder that supplies components by sending out a tape having receiving portions for receiving components formed at predetermined intervals. In addition to these, the mounting device 10 further includes a component camera 26 that photographs the component picked up by the mounting head 40 from below, a mark camera 28 provided on the mounting head 40 and used for photographing reference marks and the like marked on the substrate S from above, and the like.

[0032] The XY robot 30 includes an X - axis slider 32 and a Y - axis slider 36. The Y - axis slider 36 is mounted on a pair of left - right Y - axis guide rails 35 provided along the front - rear direction (Y - axis direction) at the upper part of the main body frame 12, and moves along the Y - axis guide rails 35 by the drive of a Y - axis motor 37 (refer to Figure 5 ). The X - axis slider 32 is mounted on an X - axis guide rail 31 provided along the left - right direction (X - axis direction) on the lower surface of the Y - axis slider 36, and moves along the X - axis guide rail 31 by the drive of an X - axis motor 33 (refer to Figure 5) is driven to move along the X-axis guide rail 31. The XY robot 30 can move the mounting head 40 to any position on the XY plane by the movement of the X-axis slider 32 and the Y-axis slider 36.

[0033] As Figure 2 , Figure 3 shown, the mounting head 40 includes: a frame 41 mounted on the X-axis slider 32; a head body 42 with a plurality of nozzle holders 70 arranged at predetermined angles (e.g., 30 degrees) intervals in the circumferential direction; and nozzles 60 mounted on each nozzle holder 70. In addition, the mounting head 40 includes: an R-axis motor 44 that rotates the head body 42 to rotate (revolve) the plurality of nozzle holders 70; a Q-axis motor 46 that rotates (rotates) the plurality of nozzle holders 70; and a lifting device 50 that raises and lowers the nozzle holders 70. In addition, the mounting head 40 includes a negative pressure supply device 80 that supplies negative pressure to the nozzles 60 and a positive pressure supply device 90 that supplies positive pressure to the nozzle holders 70.

[0034] The head body 42 includes: a shaft portion 42a rotatably supported by the frame 41; and a holder holding portion 42b formed in a cylindrical shape with a larger diameter than the shaft portion 42a and holding the plurality of nozzle holders 70 so as to be able to move up and down in the Z-axis direction. When the R-axis motor 44 is driven, the shaft portion 42a and the holder holding portion 42b rotate, whereby the plurality of nozzle holders 70 rotate (revolve). In addition, the head body 42 has: a gear 43 supported to be rotatable relative to the shaft portion 42a coaxially with the shaft portion 42a; and a gear 47 that rotates along with the rotation of the gear 43. The gear 43 meshes with a gear 45 mounted on the rotation shaft of the Q-axis motor 46, and the gear 47 meshes with a gear 70a mounted on each nozzle holder 70. When the Q-axis motor 46 is driven, each nozzle holder 70 and the nozzles 60 assembled to each nozzle holder 70 all rotate (rotate) in the same rotation direction by the same rotation amount (rotation angle). In addition, a spring 71 is disposed between the lower surface of the gear 70a and the upper surface of the holder holding portion 42b. The spring 71 applies a force to the nozzle holder 70 upward in the Z-axis direction. The nozzle holder 70 is a cylindrical member, and a first air passage 72a and a second air passage 75a are formed inside.

[0035] As Figure 2As shown, the lifting device 50 includes: a linear motor 51; and a Z-axis slider 52 that can be lifted in the Z-axis direction by the drive of the linear motor 51. A engaging portion 52a that can engage (abut) with the upper end portion 70b of the nozzle holder 70 is formed on the Z-axis slider 52. The lifting device 50 lifts the nozzle holder 70 by lifting the Z-axis slider 52 in a state where the engaging portion 52a engages with the upper end portion 70b of the nozzle holder 70 located at a predetermined lifting position among the plurality of nozzle holders 70. Along with this, the nozzle 60 also lifts. In addition, the plurality of nozzle holders 70 revolve by the drive of the R-axis motor 44, and thus are sequentially moved to the lifting position.

[0036] The negative pressure supply device 80 is a device that supplies negative pressure from a negative pressure source 81 such as a vacuum pump to the plurality of nozzles 60 respectively mounted on the plurality of nozzle holders 70. As Figure 3 shown, the negative pressure supply device 80 includes a negative pressure source 81, a negative pressure introduction passage 83, an atmosphere introduction passage 85, and a switching valve 87. In addition, a plurality of switching valves 87 are provided corresponding to the plurality of nozzle holders 70 respectively. The negative pressure introduction passage 83 is formed to be connected to the negative pressure source 81, passes through the inside of the frame 41 and the center of the shaft portion 42a, and extends radially from the center of the holder holding portion 42b, and is communicated with the first air passage 72a of each nozzle holder 70 via the switching valve 87. The atmosphere introduction passage 85 is opened at the lower end of the holder holding portion 42b in a manner of communicating with a positive pressure source (atmosphere), and a plurality of them are formed to pass through the inside of the holder holding portion 42b and communicate with the first air passage 72a of each nozzle holder 70 via the switching valve 87. The switching valve 87 includes: a shaft-shaped spool valve 88 that is inserted into a spool valve hole penetrating vertically in the holder holding portion 42b and has a reduced diameter portion at approximately the center; and a spool valve drive mechanism 89 that moves the spool valve 88 up and down (see Figure 5 ). For the switching valve 87, air can flow around the reduced diameter portion of the spool valve 88 in the spool valve hole, and by moving the spool valve 88 up and down, it is selectively switched which one of the negative pressure introduction passage 83 and the atmosphere introduction passage 85 communicates with the first air passage 72a. The spool valve drive mechanism 89 is configured, for example, as a mechanism that moves a rod (not shown) mounted on the spool valve 88 up and down.

[0037] The positive pressure supply device 90 is a device that supplies positive pressure from a positive pressure source 91 such as a compressor to the second air passages 75a respectively provided in the plurality of nozzle holders 70. As Figure 3As shown, the positive pressure supply device 90 includes a positive pressure source 91, a flow sensor 92, and a positive pressure introduction passage 93. The flow sensor 92 is a sensor that detects the presence or absence of air flow in the second air passage 75a. As will be described later, based on the detection of air flow by the flow sensor 92, it is possible to detect the contact between the nozzle 60 or the component adsorbed by the nozzle 60 and the substrate S. The positive pressure introduction passage 93 is formed to be connected to the positive pressure source 91 via the flow sensor 92, passes through the inside of the frame 41 and the inside of the shaft portion 42a, extends radially outward in the cage holding portion 42b, and communicates with the second air passage 75a.

[0038] Use Figure 4 Details of the structures of the nozzle holder 70 and the nozzle 60 will be described. In addition, Figure 4 (A) shows a state where the nozzle 60 is not pressed into the nozzle holder 70 side, Figure 4 (B) shows a state where the nozzle 60 is pressed into the nozzle holder 70 side. The nozzle 60 includes: a hollow nozzle portion 61, a holding ring 62 having an inner diameter larger than the outer diameter of the nozzle portion 61, and a pin 63. The nozzle portion 61 can adsorb a component by supplying a negative pressure to the internal passage 61a. The nozzle portion 61 is formed with a plurality of through holes 61b penetrating in the vertical direction at equal intervals on the upper end and in the circumferential direction, and a pair of long holes 61c penetrating in the radial direction are formed on the side wall. The holding ring 62 is inserted with the nozzle portion 61 in a slidable manner in the vertical direction, and a flange portion is formed at the lower end, and a pair of through holes penetrating in the radial direction are formed on the side wall. The pin 63 is disposed to penetrate a pair of long holes 61c of the nozzle portion 61 and a pair of through holes of the holding ring 62 in the radial direction ( Figure 4 the left-right direction in the figure), and is held so as to be movable up and down relative to the pair of long holes 61c and not movable up and down relative to the pair of through holes of the holding ring 62. Therefore, the pin 63 holds the nozzle portion 61 in such a manner as to allow the nozzle portion 61 to move up and down relative to the holding ring 62 and prevent the nozzle portion 61 from falling off the holding ring 62.

[0039] The nozzle holder 70 includes an outer cylinder 72, a pressure ring 73, a spring 74, an inner cylinder 75, a spring 76, and a valve 77. The outer cylinder 72 has a nozzle 60 installed at its lower end and the inner cylinder 75 inserted therein, and a gap extending vertically in a cylindrical shape between the inner peripheral surface and the outer peripheral surface of the inner cylinder 75 is formed as the above-mentioned first air passage 72a. In addition, the outer cylinder 72 has a leakage hole 72b penetrating radially through the side wall above the nozzle 60. The pressure ring 73 has an inner diameter larger than the outer diameter of the outer cylinder 72, and the outer cylinder 72 is inserted therein. The spring 74 uses a protrusion formed on the outer peripheral surface of the outer cylinder 72 as a spring seat and applies a downward force to the upper end surface of the pressure ring 73. Although not shown in the figure, the outer cylinder 72 is formed with an inverted L-shaped slit extending upward from the lower end and buckling in the circumferential direction. When the nozzle 60 is installed on the nozzle holder 70, the nozzle 60 is inserted into the outer cylinder 72 in such a way that the pin 63 enters the slit of the outer cylinder 72, and then the nozzle 60 is rotated circumferentially, so that the pin 63 moves to the extended end of the slit and engages with the slit. In this state, due to the acting force of the spring 74, the pressure ring 73 presses the pin 63 protruding outward from the outer cylinder 72 from above, thereby preventing the pin 63 from disengaging from the slit of the outer cylinder 72, and thus holding the nozzle 60.

[0040] The inner cylinder 75 is a bottomed cylindrical member with a closed lower end, forms an internal space extending in the vertical direction as the above-mentioned second air passage 75a, and has a flange portion 75b and an opening 75d. The flange portion 75b protrudes from the outer peripheral surface and abuts against and engages with a portion of the inner peripheral surface of the outer cylinder 72 that becomes narrower from below, restricting the movement of the inner cylinder 75 relative to the outer cylinder 72. A plurality of through holes 75c penetrating in the vertical direction are formed at equal intervals in the circumferential direction on the flange portion 75b when viewed from above. The opening 75d penetrates the inner cylinder 75 in the radial direction.

[0041] The valve 77 is a cylindrical switching valve disposed between the outer cylinder 72 and the inner cylinder 75 for switching the connection between the leakage hole 72b of the outer cylinder 72 and the opening 75d of the inner cylinder 75. The valve 77 is formed with an outer diameter capable of sliding on the inner peripheral surface of the outer cylinder 72 and an inner diameter capable of sliding on the outer peripheral surface of the inner cylinder 75, and its lower end abuts against the upper end of the nozzle portion 61 and moves up and down integrally with the nozzle portion 61. The valve 77 is formed with a through hole 77a penetrating in the vertical direction and a communication hole 77b penetrating in the radial direction and capable of connecting the second air passage 75a (opening 75d) inside the inner cylinder 75 and the leakage hole 72b of the outer cylinder 72. For the through hole 77a, the upper end communicates with the first air passage 72a, and the lower end communicates with the through hole 61b of the nozzle portion 61. The negative pressure or positive pressure (atmosphere) supplied from the first air passage 72a is introduced into the internal passage 61a through the through hole 77a and the through hole 61b. The spring 76 uses a protrusion formed on the outer peripheral surface of the inner cylinder 75 as a spring seat and applies a downward force to the valve 77 and the nozzle portion 61.

[0042] While the component adsorbed to the nozzle portion 61 is not in contact with the substrate S, the valve 77 is pressed downward by the force of the spring 76 and becomes Figure 4 the state of (A). In this state, the positions of the communication hole 77b of the valve 77 and the opening 75d of the inner cylinder 75 are vertically offset. Therefore, the valve 77 cuts off the communication between the leakage hole 72b and the opening 75d. Therefore, the positive pressure supplied from the positive pressure source 91 does not flow to the outside from the second air passage 75a. Thus, the flow sensor 92 does not detect the flow of air and does not detect contact. On the other hand, if the nozzle holder 70 is lowered by the lifting device 50 so that the component adsorbed to the nozzle portion 61 comes into contact with the substrate S, the nozzle portion 61 is pressed upward (toward the nozzle holder 70 side) against the force of the spring 76. When the amount of this pressing reaches a predetermined amount, it becomes Figure 4 the state of (B). In this state, the leakage hole 72b of the outer cylinder 72 and the opening 75d of the inner cylinder 75 are communicated through the communication hole 77b of the valve 77. Therefore, the air (positive pressure) supplied to the second air passage 75a from the positive pressure source 91 flows out to the outside from the leakage hole 72b. Therefore, the flow sensor 92 can detect the flow of air in the second air passage 75a, thereby detecting the contact between the component and the substrate S.

[0043] As Figure 5 shown, the control device 100 is configured as a microprocessor centered on the CPU 101. In addition to the CPU 101, it also includes a ROM 102, an HDD 103, a RAM 104, an input / output interface 105, etc. They are connected via a bus 106. Image signals from the component camera 26 and the mark camera 28, detection signals from the X-axis position sensor 34 that detects the position of the X-axis slider 32, the Y-axis position sensor 38 that detects the position of the Y-axis slider 36, the Z-axis position sensor 53 that detects the position of the Z-axis slider 52, and the detection signal from the flow sensor 92 are input to the control device 100 via the input / output interface 105. On the other hand, control signals to the substrate transfer device 14, control signals to the component supply device 16, drive signals to the XY robot 30 (X-axis motor 33, Y-axis motor 37), and drive signals to the mounting head 40 (R-axis motor 44, Q-axis motor 46, linear motor 51, spool drive mechanism 89) are output from the control device 100 via the input / output interface 105.

[0044] Next, the operation of picking up a component by the mounting head 40 and mounting the component on the substrate S in the mounting device 10 configured as described above will be described. Figure 6FIG. 0 is a flowchart showing an example of a component mounting process, which is executed by, for example, a CPU 101 that has received a job from a management device (not shown). In addition, the job includes various information such as the type of component to be mounted on the substrate S, the mounting order, the production quantity of the substrate S, the component dimensions such as the component height of the mounted component, the mounting position, the dimensions such as the thickness of the substrate S, and the height of the upper surface (mounting surface) in terms of design.

[0045] When starting the component mounting process, the CPU 101 loads and holds the substrate S (S100) by the substrate transfer device 14, and sends out a tape by the component supply device 16 to cause the suction nozzle 60 of the mounting head 40 to pick up (adsorb) the component supplied to the supply position (S105). Next, the CPU 101 moves the mounting head 40 above the component camera 26, and the component camera 26 photographs the component adsorbed to each suction nozzle 60 and processes its image to correct the mounting position of the component in a manner that eliminates the position deviation of the component (S110).

[0046] Next, the CPU 101 determines whether it is the time to measure the substrate height at the start of mounting on the substrate S (measurement time at the start of mounting) (S115). If the CPU 101 determines that it is the measurement time at the start of mounting, it performs component mounting in a height measurement mode where the height of the substrate S, i.e., the substrate height, is measured while mounting the component (S120). In addition, if the CPU 101 determines that it is not the measurement time at the start of mounting, it determines whether the additional measurement condition for additionally measuring the substrate height during the mounting of the component on the substrate S is satisfied (S125). If it determines that the additional measurement condition is satisfied, it performs component mounting in the additional measurement mode (S135). On the other hand, if the CPU 101 determines in S125 that the additional measurement condition is not satisfied, it performs component mounting in the normal mode where the substrate height is not measured and the component is mounted as usual (S130). In addition, the details of each process for component mounting and the additional measurement condition will be described later.

[0047] If the CPU 101 performs component mounting in S120, S130, or S135, it determines whether there are other components that have been picked up (adsorbed) by each nozzle 60 of the mounting head 40 (S140). If it is determined that there are other components, the process returns to S115 for processing. In this embodiment, from the start of mounting on one substrate S until the mounting of more than a predetermined number of 3 components is completed, it is determined in S115 that it is the measurement time at the start of mounting, and component mounting in the height measurement mode is performed in S120. In addition, if the CPU 101 determines in S140 that there are no components that have been picked up by each nozzle 60 of the mounting head 40, it determines whether there is a next component to be mounted on the substrate S (S145). If it is determined that there is a next component, the process returns to S105 for processing. On the other hand, if the CPU 101 determines that there is no next component, it releases the holding of the substrate S by the substrate transfer device 14 and removes the substrate S (S150), and determines whether there is a next substrate S (S155). If the CPU 101 determines that there is a next substrate S, the process returns to S100 for processing. If the CPU 101 determines that there is no next substrate S, this process ends.

[0048] Figure 7 It is a flowchart showing an example of component mounting in the height measurement mode. Figure 8 It is an explanatory diagram showing an example of the measurement position of the substrate height. The CPU 101 first obtains the component height (thickness) of the component adsorbed on the nozzle 60 and the designed substrate height of the substrate S from the job (S200), and sets the target mounting height when mounting the component based on the obtained substrate height (S210). In addition, the information on the component height is not limited to obtaining from the job. For example, when the mounting head 40 is equipped with a side camera capable of photographing the side of the component adsorbed on the nozzle 60, the CPU 101 can also process the image of the side camera to obtain the component height. Next, the CPU 101 lowers the nozzle 60 to the mounting height at a low speed slower than the normal speed described later in component mounting in the normal mode (S220), and waits to detect the contact with the substrate S (S230). In S230, as described above, based on the detection signal from the flow sensor 92, the contact between the component adsorbed on the nozzle 60 and the substrate S is detected.

[0049] If the CPU 101 detects contact in S230, it obtains the front-end position of the nozzle 60 as the nozzle height based on the position of the Z-axis slider 52 detected by the Z-axis position sensor 53 (S240). Further, the CPU 101 mounts the component on the substrate S by releasing the adsorption of the component and raising the nozzle 60 (S250). Next, the CPU 101 measures the substrate height based on the obtained nozzle height and the component height of the mounted component (S260). The CPU 101 uses the height derived by subtracting the component height from the nozzle height as the substrate height. Then, the CPU 101 registers the substrate height corresponding to the measurement position of the substrate height, i.e., the mounting position (XY position) of the component, in the HDD 103 or the like (S270), and ends this process.

[0050] Here, the mounting positions of a predetermined number of components are determined as positions of three or more points including a plurality of points as close as possible to the outer edge and at least one point close to the center in the upper surface of the rectangular substrate S. In the present embodiment, as shown by the Figure 8 × mark, the mounting positions are determined in such a way that the upper surface of the substrate is divided into lattice point positions such as positions near the four corners, midpoints near the four corners or positions slightly deviated from the midpoints, and the position at the center of the substrate. For example, nine mounting positions are determined, with three points in each of the X-axis direction and the Y-axis direction. In addition, the mounting positions are not limited to nine points. There may be five points in each of the X-axis direction and the Y-axis direction, totaling 25 points. If there is no position corresponding to the × mark, the mounting position closest to the × mark may be determined. Further, the lattice points may be determined as positions where the intervals in the X-axis direction and the Y-axis direction are appropriately changed according to the substrate size. In addition, during the operation, the mounting order is determined in such a way that the components are mounted first from these mounting positions. In this way, the mounting positions of a predetermined number of components are determined as the measurement positions of the substrate height. Therefore, the number of components for which component mounting is performed in the height measurement mode can be reduced, and the substrate height can be measured without deviation from the substrate S.

[0051] Figure 9 It is a flowchart showing an example of component mounting in the normal mode. First, the CPU 101 obtains a plurality of substrate heights from the HDD 103 or the like based on the target mounting positions of the components adsorbed on the nozzle 60 in the XY-axis directions (S300). In S300, at least three substrate heights are obtained in ascending order of the distance between the target mounting position and the measurement position corresponding to the substrate height. Next, the CPU 101 generates a hypothetical plane based on the obtained substrate heights and corrects the mounting height of the component indicated in the operation based on the hypothetical plane, thereby setting the target mounting height (S310).

[0052] For example, the CPU 101 obtains the substrate heights at three points near the installation position as multiple positions, and based on the substrate heights at the three points and the measurement positions, a virtual plane passing through the three points is obtained by a known method, and the substrate height at the installation position of the component is derived from the virtual plane. Figure 10 This is an explanatory diagram showing an example of the situation where the installation height is set. In this example, for the installation position P(X, Y) indicated by the black circle, a virtual plane is obtained using the substrate heights measured at three × marks (P1, P2, P3) surrounded by a quadrilateral frame, and the substrate height at the installation position of the component is derived. That is, the virtual plane is obtained using the respective substrate heights H1, H2, H3 at the three measurement positions P1(X1, Y1), P2(X2, Y2), P3(X3, Y3), and the substrate height at the installation position P(X, Y) is derived and the installation height is set. Such a method is described, for example, in Japanese Patent Application Laid-Open No. 2009-27015, and thus the description is omitted. In addition, it is not limited to only including three nearby points, and the substrate height at the installation position can also be derived from a virtual plane including other points. For example, all the measured measurement positions ( Figure 10 nine points, the above-mentioned 25 points, etc.) can also be used. In such a case, it can also be generated using the distance reciprocal weighting method with the reciprocal of the distance from the installation position of the component as the weighting coefficient. Of course, the distance reciprocal weighting method or the like can also be used when deriving the substrate height at the installation position from the substrate heights at three points.

[0053] In Figure 10 the example where the distance reciprocal weighting method is used, the CPU 101 calculates the distances D1, D2, D3 between the installation position P and the respective measurement positions P1, P2, P3, and calculates the weighting coefficients α1, α2, α3 by dividing each distance by the total distance through the following formulas (1) to (3). Then, the CPU 101 multiplies the substrate heights H1, H2, H3 at the measurement positions P1, P2, P3 by the weighting coefficients α1, α2, α3 respectively according to the following formula (4) and adds their products to calculate the substrate height H at the installation position P. In addition, the CPU 101 can also multiply the substrate heights H1 to Hn at n points including points other than the three nearby points by the weighting coefficients α1 to αn of the distance reciprocal weighting method and add their products as described above to calculate the substrate height H. In addition, there are sometimes cases where the substrate height at the installation position P outside the measurement position (lattice points) is derived due to restrictions on the installation order of components, etc. In this case, the CPU 101 can also use the distance reciprocal weighting method to derive the substrate height at the installation position. That is, the CPU 101 can also derive the substrate height at the installation position outside the lattice by the distance reciprocal weighting method and derive the substrate height at the installation position inside the lattice by a virtual plane or the like.

[0054] α1 = D1 / (D1 + D2 + D3) · · · (1)

[0055] α2 = D2 / (D1 + D2 + D3) · · · (2)

[0056] α3 = D3 / (D1 + D2 + D3) · · · (3)

[0057] H = α1 * H1 + α2 * H2 + α3 * H3 · · · (4)

[0058] Here, when the actual substrate height is higher than the designed substrate height, the load applied to the component during installation becomes higher, and there is a concern about component breakage. In the present embodiment, based on the measurement result of the substrate height, the substrate height at the installation position can be obtained and corrected in a manner that increases the component height, so this concern can be prevented. In addition, when the actual substrate height is lower than the designed substrate height, there is a concern about installation defects such as positional deviation and lack where the component does not correctly contact the upper surface of the substrate S, or a contact detection error. In the present embodiment, based on the measurement result of the substrate height, the substrate height at the installation position can be obtained and corrected in a manner that decreases the installation height, so this concern can be prevented. Thus, even if the actual substrate height is different from the designed substrate height due to warping of the substrate S or the like, the CPU 101 can appropriately set the installation height of the component.

[0059] Next, the CPU 101 lowers the nozzle 60 to the target installation height at a normal speed (S320) and waits to detect contact with the substrate S (S330). If the CPU 101 detects contact with the substrate S in S330, it releases the adsorption of the component and raises the nozzle 60 (S340), thereby installing the component on the substrate S and ending this process.

[0060] When installing components in such a normal mode, sometimes the CPU 101 determines in S125 that the additional measurement condition is satisfied. The additional measurement condition can be, for example, a condition that is satisfied when installing a component near a predetermined component such as an easily breakable component or a component that requires high precision before installing the predetermined component. In addition, the additional measurement condition can also be other conditions. For example, it can also be a condition that is satisfied whenever the number of installed components reaches a constant number, or a condition that is satisfied when an operator indicates additional measurement using an operation panel (not shown), etc. In addition, the operator can also use the operation panel or the like to set whether to perform additional measurement.

[0061] Figure 11It is a flowchart showing an example of component mounting in the additional measurement mode. First, the CPU 101 executes the processes of S300 to S330 in the same manner as component mounting in the normal mode. That is, the CPU 101 sets the mounting height of the component according to the measured substrate height, lowers the nozzle 60 to this mounting height at the normal speed, and waits for detecting the contact with the substrate S. Next, the CPU 101 executes the processes of S240 to S270 in the same manner as component mounting in the height measurement mode. That is, the substrate height is measured based on the nozzle height and the component height when detecting the contact with the substrate S, and is registered corresponding to the measurement position (mounting position). Thus, in the additional measurement mode, based on the measured substrate height, the nozzle 60 is lowered at the normal speed, so that it is possible to suppress the case where the lowering takes time and the efficiency is reduced. In addition, since the measurement parts of the substrate height can be increased, the setting accuracy of the mounting height in the following mounting process can be further improved. For example, when the CPU 101 mounts a component near the above-mentioned predetermined component, it additionally measures the substrate height, so that it is possible to obtain the substrate height at a position closer to the predetermined component and set the mounting height when mounting the predetermined component more accurately. Therefore, the mounting device 10 can mount the predetermined component more appropriately.

[0062] Here, the correspondence between the structural elements of the present embodiment and the structural elements of the present disclosure is clarified. The mounting device 10 of the present embodiment corresponds to the mounting device of the present disclosure, the nozzle 60 corresponds to the holding member, the lifting device 50 corresponds to the lifting device, the flow sensor 92 corresponds to the contact detection unit, and the control device 100 corresponds to the control unit. In the present embodiment, by explaining the operation of the control device 100, an example of the substrate height measurement method and the mounting method of the present disclosure is clarified.

[0063] In the mounting device 10 of the present embodiment described above, the nozzle height when the nozzle 60 is lowered and the contact with the substrate S is detected is obtained, and the substrate height is measured based on the nozzle height and the component height. Thereby, it is possible to measure the substrate height with high precision without being affected by light reflection or the like. In addition, since there is no need to add a dedicated sensor for measuring the substrate height, an increase in cost can be suppressed.

[0064] In addition, in the mounting device 10, component mounting (measurement mounting process) in the height measurement mode is performed from the start of mounting to a predetermined number of components, and after mounting the predetermined number of components, component mounting (normal mounting process) in the normal mode is performed. Therefore, it is not necessary to secure the time for height measurement before starting the mounting on the substrate S, and the component mounting can be started quickly. In addition, by measuring the substrate height during the mounting, the delay of the mounting process can be suppressed.

[0065] In addition, in the mounting device 10, during component mounting in the normal mode, the nozzle 60 is lowered at the normal speed, and during component mounting in the height measurement mode, the nozzle 60 is lowered at a low speed slower than the normal speed. Therefore, it is possible to prevent the situation where the component violently collides with the substrate S due to warping of the substrate S or the like in a state where the substrate height cannot be measured in advance, resulting in component breakage.

[0066] In addition, in the mounting device 10, after mounting a predetermined number of components, if the additional measurement condition is satisfied, component mounting (measurement and mounting process) in the additional measurement mode is also performed. Therefore, it is possible to increase the measurement positions of the substrate height and improve the setting accuracy of the mounting height.

[0067] In addition, in the mounting device 10, the mounting positions of a predetermined number of components are determined as the lattice points that divide the upper surface of the substrate S into a lattice pattern. Therefore, it is possible to make the predetermined number as small as possible, and it is possible to obtain the substrate height without deviation and appropriately set the mounting height of the components.

[0068] In addition, it goes without saying that the present disclosure is not limited to the above-described embodiments and can be implemented in various ways as long as it belongs to the technical scope of the present disclosure.

[0069] In the above-described embodiment, when the additional measurement condition of the substrate height is satisfied in S125 of the component mounting processing program, component mounting in the additional measurement mode is performed in S135, but it is not limited thereto. For example, S135 is omitted, and component mounting in the height measurement mode of S120 may also be performed when the additional measurement condition of the substrate height is satisfied. In this case, the nozzle 60 is always lowered at a low speed when measuring the substrate height. In addition, not limited to performing additional measurement of the substrate height, S125 may also be omitted without performing additional measurement.

[0070] In the above-described embodiment, in the height measurement mode, the nozzle 60 is lowered at a speed lower than that in the normal mode, but it is not limited thereto, and the nozzle 60 may be lowered at the same normal speed as in the normal mode. Alternatively, it may be that the mounting of several components from the start of the height measurement mode is performed at a low speed, and the mounting of the remaining components until the predetermined number is reached is performed at the normal speed.

[0071] In the above-described embodiment, the mounting positions of the predetermined number of components mounted in the height measurement mode are the lattice points, but it is not limited thereto, and as long as it is a position that divides the upper surface of the substrate into a plurality of regions, for example, it may also be a staggered position.

[0072] The mounting device 10 may also be configured as follows in the above-described embodiment. Figure 12It is a structural diagram showing an outline of the structure of the mounting device 10A representing a modified example. The mounting device 10A includes a first mounting unit 11A on the front side and a second mounting unit 11B on the rear side. In addition, in the modified example, the same reference numerals are given to the same structures as those in the embodiment, and detailed descriptions thereof are omitted. The first mounting unit 11A includes a substrate transfer device 14, a component supply device 16, a component camera 26, a marking camera 28, a first mounting head 40A, and the like. The second mounting unit 11B similarly includes a substrate transfer device 14, a component supply device 16, a component camera 26, a marking camera 28, a second mounting head 40B, and the like. That is, the first mounting unit 11A and the second mounting unit 11B have the same structure. In addition, both the first mounting head 40A and the second mounting head 40B are configured in the same manner as the mounting head 40. That is, the first mounting head 40A includes, in addition to a plurality of first suction nozzles 60A (first holding members) and a first lifting device 50A that raises and lowers the first suction nozzles 60A, a sensor that detects contact between the first suction nozzles 60A and the substrate S, a sensor that detects the height of the first suction nozzles 60A, and the like. In addition, the second mounting head 40B includes, in addition to a plurality of second suction nozzles 60B (second holding members) and a second lifting device 50B that raises and lowers the second suction nozzles 60B, a sensor that detects contact between the second suction nozzles 60B and the substrate S, a sensor that detects the height of the second suction nozzles 60B, and the like. In addition, the height reference Z0(1) of the first lifting device 50A is determined, for example, as the upper surface of the conveyor frame of the front substrate transfer device 14, and the height reference Z0(2) of the second lifting device 50B is determined, for example, as the upper surface of the conveyor frame of the rear substrate transfer device 14. The height references Z0(1) and (2) of both are the same height in design, but sometimes a slight error ΔZ occurs due to assembly errors, dimensional errors, etc. of the conveyor frame.

[0073] In this mounting device 10A, the first mounting unit 11A picks up components supplied from the front component supply device 16 by the first suction nozzles 60A and mounts the components on the substrate S transported by the front substrate transfer device 14 and the rear substrate transfer device 14. In addition, the second mounting unit 11B picks up components supplied from the rear component supply device 16 by the second suction nozzles 60B and mounts the components on the substrate S transported by the front substrate transfer device 14 and the rear substrate transfer device 14. The content of the present disclosure can be applied to the mounting device 10A having such a structure to measure the substrate height. Figure 13It is a flowchart showing component mounting in the height measurement mode of the modified example. First, the CPU 101 of the control device 100 of the mounting device 10A controls the first mounting head 40A in such a way that the first mounting head 40A mounts components on the substrate S carried by the front or rear substrate transfer device 14 while measuring the substrate height, and obtains a first measurement result (S400). That is, the CPU 101 measures the substrate height based on the height of the first nozzle 60A when the first nozzle 60A is lowered by the first lifting device 50A and the contact with the substrate S is detected, and the component height, and obtains a first measurement result corresponding to the measurement position. For example, in S400, the substrate height is measured while mounting a part of the above-mentioned predetermined number of components.

[0074] Next, the CPU 101 reflects the error ΔZ of the above height reference Z0 in the first measurement result and derives a first correction result (S410). This first correction result is derived in order to use the substrate height of the first measurement result for the control of the second mounting head 40B (second lifting device 50B). Then, the control device 100 controls the second mounting head 40B (second lifting device 50B) based on the first correction result, and controls the second mounting head 40B in such a way that the second mounting head 40B mounts components while measuring the substrate height, and obtains a second measurement result (S420). Next, the control device 100 reflects the error ΔZ in the second measurement result and derives a second correction result (S430), and ends this process. This second correction result is derived in order to use the substrate height of the second measurement result for the control of the first mounting head 40A (first lifting device 50A). In S420, the CPU 101 measures the substrate height based on the height of the second nozzle 60B when the second nozzle 60B is lowered by the second lifting device 50B and the contact with the substrate S is detected, and the component height, and obtains a second measurement result corresponding to the measurement position. For example, in S420, the substrate height is measured while mounting the remaining components except the above-mentioned part of the predetermined number. In addition, the CPU 101 may also return to S400 again to measure the substrate height according to the value of the predetermined number. For example, when the predetermined number is 25 (25 positions), the CPU 101 measures the substrate height of 10 positions in S400, for example, measures the substrate height of 10 positions in S420, and returns to S400 again to measure the substrate height of the remaining 5 positions. At this time, the control device 100 may control the first mounting head 40A (first lifting device 50A) based on the substrate height of the first measurement result and the substrate height of the second correction result.

[0075] In addition, Figure 14This is a flowchart of component mounting in the normal mode representing a modified example. The CPU 101 determines whether it is component mounting by the first mounting head 40A (S500). If the CPU 101 determines that it is the first mounting head 40A, it controls the lowering of the first nozzle 60A by the first lifting device 50A of the first mounting head 40A based on the first measurement result and the second correction result to mount the component (S510). In addition, the details of component mounting are the same as those of Figure 9 the processing, so the description is omitted. Further, if the control device 100 determines in S500 that it is not the first mounting head 40A, i.e., it is component mounting by the second mounting head 40B, it controls the lowering of the second nozzle 60B by the second lifting device 50B of the second mounting head 40B based on the first correction result and the second measurement result to mount the component (S520). Thus, in the modified example, the substrate height is measured using the first mounting head 40A (the first lifting device 50A) and the second mounting head 40B (the second lifting device 50B) respectively, so the substrate height can be measured efficiently. In addition, the first mounting head 40A and the second mounting head 40B use the respective measurement results and the correction results obtained by reflecting the error ΔZ on the measurement result of the object side to perform component mounting, so the measurement results of the two heads can be effectively utilized to properly mount the components. Further, the mounting device 10A is configured such that at least the first mounting head 40A is equipped with a sensor for detecting the contact between the first nozzle 60A and the substrate S, and the first measurement result can be corrected and used by the second mounting head 40B (the second lifting device 50B).

[0076] In addition, the mounting device 10 can also be configured as follows. Figure 15 This is a schematic structural diagram showing the structure of the mounting device 10B in the modified example, Figure 16 and this is an explanatory diagram showing the position of the mounting head 40 of the mounting device 10B in the vertical direction. The XY robot 30B of the mounting device 10B includes an X-axis slider 32B, a Y-axis slider 36, and a Z-axis slider 39. The X-axis slider 32B is mounted on an X-axis guide rail 31B provided on the front surface of the Y-axis slider 36. The Z-axis slider 39 is mounted on the front surface of the X-axis slider 32B and is slidably mounted on a Z-axis guide rail 39a extending in the vertical direction, and moves in the vertical direction by the drive of a Z-axis motor (not shown). In the mounting device 10B, the mounting head 40 is mounted on the Z-axis slider 39. In addition, a housing 49 is mounted on the Z-axis slider 39, which extends rearward from the lower part of the Z-axis slider 39 to the rear side of the X-axis slider 32B and reaches the rear of the Y-axis slider 36. The housing 49 houses the wirings, piping, etc. of the devices mounted on the X-axis slider 32B and the Z-axis slider 39, and moves together with the Z-axis slider 39.

[0077] In the mounting device 10A, when the Z-axis slider 39 is in the normal position (upper position), as shown in (A) of Figure 16 , the height from a predetermined height reference to the lower surface of the mounting head 40 becomes Hhi. In addition, when the control device 100 drives and controls the Z-axis motor to move the Z-axis slider 39 to a position lower than the normal position, as shown in (B) of Figure 16 , the height from the height reference to the lower surface of the mounting head 40 becomes Hlo. The content of the present disclosure can be applied to the mounting device 10B having such a structure to measure the substrate height. That is, in each of the state where the mounting head 40 is in the normal position and the state where the mounting head 40 is in the lower position, the substrate height can be measured based on the nozzle height and the component height when the nozzle 60 is lowered and the contact with the substrate S is detected. When the mounting head 40 is in the lower position, compared with the case where it is in the normal position, the arrival position when the nozzle 60 is lowered is lower, so the range in which the substrate height can be measured can be enlarged.

[0078] In the above-described embodiment, the substrate height is measured by lowering the nozzle 60 that adsorbs the component, but it is not limited thereto. The substrate height can also be measured by lowering the nozzle 60 that does not adsorb the component, and the substrate height can be measured in a so-called empty mounting. In such a case, before the substrate S is carried in and the component mounting is started, the nozzle 60 that does not adsorb the component is lowered, and the substrate height can be measured based on the nozzle height when the contact with the substrate S is detected. In addition, the predetermined number of measurement positions may be the same positions as the component mounting positions, but it is preferably a position where no solder or the like is provided. In addition, the process of measuring the substrate height by the nozzle 60 that does not adsorb the component can also be performed during the mounting process. That is, it may be that after the mounting of the components adsorbed by each nozzle 60 is completed, and before the mounting head 40 starts to move toward the component supply device 16 side in order to adsorb the next component, the nozzle 60 is lowered to additionally perform height measurement.

[0079] In the above-described embodiment, the lifting position where the lifting device 50 lifts and lowers the nozzle 60 (nozzle holder 70) is one position, but it is not limited thereto. Two or more lifting devices 50 that operate independently of each other may be provided, and the nozzle 60 can be lifted and lowered to two or more lifting positions. If such a structure is adopted, the substrate height can be measured and collected quickly. In addition, one lifting device 50 can be used to mount the component with the nozzle 60 in the normal mode of component mounting, and another lifting device 50 can be used to lower the nozzle 60 that does not adsorb the component to additionally measure the substrate height and the like.

[0080] In the mounting apparatus 10 of the above-described embodiment, in which a plurality of mounting lines are arranged along the conveyance direction of the substrate, the measurement result of the substrate height may be utilized as follows. For example, the measurement result of the substrate height measured by at least one mounting apparatus 10 on the upstream side in the conveyance direction may be output to the mounting apparatus 10 on the downstream side, and the mounting apparatus 10 on the downstream side may mount components on the substrate S based on this measurement result. That is, the measurement result of the substrate height measured by the mounting apparatus 10 on the upstream side may be shared and utilized in the mounting apparatus 10 on the downstream side. Further, regions for measuring the substrate height may be assigned to several mounting apparatuses 10, and information on the substrate height in the total region of the substrate S may be generated based on the measurement results of the respective mounting apparatuses 10.

[0081] In the above-described embodiment, the flow sensor 92 detects the flow rate of the air flowing in the second air passage 75a to detect the contact between the nozzle 60 (component) and the substrate S. However, the present invention is not limited thereto, and the contact may be detected by detecting at least one of the flow rate and the pressure.

[0082] Here, the mounting apparatus of the present disclosure may be configured as follows. For example, in the mounting apparatus of the present disclosure, the control unit may execute a measurement mounting process from the start of mounting components on the substrate until a predetermined number of three or more components are mounted, and execute a normal mounting process after the measurement mounting process ends. In the measurement mounting process, if the contact is detected, the holding of the component is released and the component is mounted, and the substrate height is measured based on the height of the holding member and the height of the component. In the normal mounting process, the mounting height is set based on the substrate height measured by the predetermined number of components, and the remaining components of the substrate are mounted based on the mounting height. In this way, it is not necessary to secure time for height measurement before the start of mounting, and the mounting of components can be started promptly. Further, since the measurement mounting process is executed from the start of mounting until a predetermined number of components are mounted, and then the normal mounting process is executed, the delay of the mounting process can be suppressed by measuring the substrate height during mounting.

[0083] Alternatively, in the mounting apparatus of the present disclosure, the control unit may lower the holding member at a normal speed in the normal mounting process and lower the holding member at a low speed slower than the normal speed in the measurement mounting process. In this way, it is possible to prevent the component from violently colliding with the substrate due to warping of the substrate or the like in a state where the actual substrate height cannot be obtained.

[0084] Alternatively, in the mounting device of the present disclosure, even after the above-described measurement mounting process ends, the control unit executes the above-described measurement mounting process in place of the normal mounting process when a predetermined height measurement condition is satisfied. In this way, it is possible to increase the measurement positions of the substrate height and improve the setting accuracy of the mounting height.

[0085] Alternatively, in the mounting device of the present disclosure, the mounting positions of the above-described predetermined number of components are each determined to be positions that are lattice points dividing the upper surface of the substrate into a lattice pattern. In this way, it is possible to make the predetermined number as small as possible and appropriately set the mounting height of the components.

[0086] The mounting method of the present disclosure is a method of mounting components on a substrate, and its gist includes: a contact detection step of detecting contact between the component held by the holding member and the substrate; a measurement mounting step of, from the start of mounting the component on the substrate until three or more predetermined numbers of components are mounted, if contact is detected by the contact detection step, releasing the holding of the component and performing mounting, and measuring the substrate height based on the height of the holding member and the height of the component; and a normal mounting step of, after the measurement mounting step ends, setting the mounting height of the component based on the substrate height measured by the above-described predetermined number of components, and mounting the remaining components of the substrate based on the mounting height.

[0087] The substrate height measurement method of the present disclosure is a substrate height measurement method of a mounting device, the mounting device including: a lifting device that lifts and lowers a holding member holding a component relative to a substrate; and a contact detection unit that detects contact between the holding member or the component held by the holding member and the substrate, sets the mounting height of the component based on the substrate height, and if the holding member holding the component is lowered to the mounting height by the lifting device and contact is detected, releases the holding of the component and performs mounting. The gist of the substrate height measurement method is to obtain the height of the holding member when the holding member is lowered by the lifting device and contact is detected, and measure the substrate height based on the height of the holding member.

[0088] In the mounting method and substrate height measurement method of the present disclosure, similar to the above-described mounting device, it is possible to accurately measure the substrate height without being affected by light reflection or the like. In addition, since there is no need to add a dedicated detection unit for measuring the substrate height, an increase in cost can be suppressed. In the mounting method and substrate height measurement method, various modes of the above-described mounting device can also be adopted, and steps for realizing the functions of the above-described mounting device can also be added.

[0089] Industrial Applicability

[0090] The present invention can be used in a mounting apparatus for mounting components on a substrate.

[0091] Description of Reference Numerals

[0092] 10, 10A, 10B: Mounting apparatus; 11A: First mounting unit; 11B: Second mounting unit; 12: Main body frame; 14: Substrate transfer device; 16: Component supply device; 26: Part camera; 28: Mark camera; 30, 30B: XY robot; 31, 31B: X-axis guide rail; 32, 32B: X-axis slider; 33: X-axis motor; 34: X-axis position sensor; 35: Y-axis guide rail; 36: Y-axis slider; 37: Y-axis motor; 38: Y-axis position sensor; 39: Z-axis slider; 39a: Z-axis guide rail; 40: Mounting head; 40A: First mounting head; 40B: Second mounting head; 41: Frame; 42: Head main body; 42a: Shaft portion; 42b: Cage holding portion; 43: Gear; 44: R-axis motor; 45: Gear; 46: Q-axis motor; 47: Gear; 49: Housing; 50: Lifting device; 50A: First lifting device; 50B: Second lifting device; 51: Linear motor; 52: Z-axis slider; 52a: Engaging portion; 53: Z-axis position sensor; 60: Nozzle; 60A: First nozzle; 60B: Second nozzle; 61: Nozzle portion; 61a: Internal passage; 61b: Through hole; 61c: Long hole; 62: Retaining ring; 63: Pin; 70: Nozzle holder; 70a: Gear; 70b: Upper end portion; 71: Spring; 72: Outer cylinder; 72a: First air passage; 72b: Leakage hole; 73: Pressure ring; 74: Spring; 75: Inner cylinder; 75a: Second air passage; 75b: Flange portion; 75c: Through hole; 75d: Opening; 76: Spring; 77: Valve; 77a: Through hole; 77b: Communication hole; 80: Negative pressure supply device; 81: Negative pressure source; 83: Negative pressure introduction passage; 85: Atmosphere introduction passage; 87: Switching valve; 88: Slide valve; 89: Slide valve drive mechanism; 90: Positive pressure supply device; 91: Positive pressure source; 92: Flow sensor; 93: Positive pressure introduction passage; 100: Control device; 101: CPU; 102: ROM; 103: HDD; 104: RAM; 105: Input / output interface; 106: Bus; S: Substrate

Claims

1. An installation device, comprising: a lifting device that lifts and lowers a holding member holding an element relative to a substrate; a contact detection unit that detects contact between the holding member or the element held by the holding member and the substrate by detecting the air flow rate; and a control unit that sets the installation height of the element according to the substrate height, and if the holding member holding the element is lowered to the installation height by the lifting device and the contact is detected, releases the holding of the element and performs installation, wherein the control unit obtains the height of the holding member when the holding member is lowered by the lifting device and the contact is detected, and measures the substrate height based on the height of the holding member; the outer cylinder on which the holding member is mounted and the inner cylinder inside the outer cylinder move relative to each other through the contact, and the positive pressure in the air passage supplied into the inner cylinder flows to the outside, whereby the contact detection unit detects the air flow rate in the air passage; the control unit executes a measurement installation process from the start of installing the element on the substrate until a predetermined number of 3 or more elements are installed, and executes a normal installation process after the measurement installation process ends; in the measurement installation process, if the contact is detected, the holding of the element is released and installation is performed, and the substrate height is measured based on the height of the holding member and the height of the element; in the normal installation process, the installation height is set according to the substrate height measured by the predetermined number of elements, and the remaining elements of the substrate are installed based on the installation height; the control unit executes the measurement installation process instead of the normal installation process even after the measurement installation process ends when a predetermined height measurement condition is satisfied; the predetermined height measurement condition is a condition that is satisfied when an element near the predetermined element is installed before the installation of the predetermined element, and the predetermined element is at least one of an element that is easily damaged and an element that requires high precision.

2. The installation device according to claim 1, wherein the control unit lowers the holding member at a normal speed in the normal installation process, and lowers the holding member at a low speed slower than the normal speed in the measurement installation process.

3. The installation device according to claim 1, wherein the installation positions of the respective predetermined number of elements are determined to be positions that become lattice points dividing the upper surface of the substrate into a lattice shape.

4. The installation device according to any one of claims 1 to 3, wherein the installation device includes a first lifting device that lifts and lowers a first holding member holding an element relative to a substrate and a second lifting device that lifts and lowers a second holding member holding an element relative to the substrate as the lifting device; the contact detection unit detects contact between the first holding member or the element held by the first holding member and the substrate. The control unit obtains the height of the first holding member when the first holding member is lowered by the first lifting device and the contact is detected by the contact detection unit, and controls the lifting of the second holding member by the second lifting device based on the height of the first holding member.

5. An installation method for mounting components on a substrate, wherein, the installation method includes: a contact detection step of detecting the contact between the component held by the holding member and the substrate by detecting the air flow rate; a measurement installation step of, from the start of mounting the component on the substrate until three or more predetermined numbers of components are mounted, if contact is detected by the contact detection step, releasing the holding of the component and performing the mounting, and measuring the substrate height based on the height of the holding member and the height of the component; and a normal installation step of, after the measurement installation step is completed, setting the installation height of the component according to the substrate height measured by the predetermined number of components, and mounting the remaining components of the substrate based on the installation height, in the contact detection step, the outer cylinder on which the holding member is mounted and the inner cylinder inside the outer cylinder move relative to each other through the contact, and the positive pressure in the air passage supplied into the inner cylinder flows to the outside, whereby the contact detection unit detects the air flow rate in the air passage, in the installation method, even after the measurement installation step is completed, the measurement installation step is executed instead of the normal installation step when a predetermined height measurement condition is satisfied, the predetermined height measurement condition is a condition that is satisfied when components near the predetermined component are mounted before the mounting of the predetermined component, and the predetermined component is at least one of a component that is easily damaged and a component that requires high precision.

6. A substrate height measurement method, which is a substrate height measurement method of an installation device, the installation device including: a lifting device that lifts and lowers a holding member that holds a component relative to a substrate; and a contact detection unit that detects the contact between the holding member or the component held by the holding member and the substrate by detecting the air flow rate, sets the installation height of the component according to the substrate height, and if the holding member holding the component is lowered to the installation height by the lifting device and the contact is detected, releases the holding of the component and performs the mounting, and the outer cylinder on which the holding member is mounted and the inner cylinder inside the outer cylinder move relative to each other through the contact, and the positive pressure in the air passage supplied into the inner cylinder flows to the outside, whereby the contact detection unit detects the air flow rate in the air passage, wherein, in the substrate height measurement method, the height of the holding member when the holding member is lowered by the lifting device and the contact is detected is obtained, and the substrate height is measured based on the height of the holding member, in the substrate height measurement method, a measurement installation process is executed from the start of mounting the component on the substrate until three or more predetermined numbers of components are mounted, and a normal installation process is executed after the measurement installation process is completed. In the measurement mounting process, if the contact is detected, the holding of the component is released and the mounting is performed, and the substrate height is measured based on the height of the holding member and the height of the component. In the normal mounting process, the mounting height is set according to the substrate height measured by the predetermined number of components, and the remaining components of the substrate are mounted based on the mounting height. In the substrate height measurement method, even after the measurement mounting process ends, if the predetermined height measurement condition is satisfied, the measurement mounting process is executed instead of the normal mounting process. The predetermined height measurement condition is a condition that is satisfied when a component near the predetermined component is mounted before the predetermined component is mounted, and the predetermined component is at least one of a component that is easily damaged and a component that requires high precision.

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