Head for holding a substrate and substrate processing apparatus

Abstract

The present application provides a configuration that mitigates the risk to the mounting mechanism of the holding member when the substrate collides with the holding member. An embodiment provides a head for holding a polygonal substrate, the head having: a substrate support surface whose shape corresponds to the shape of the polygonal substrate; a holding member disposed outside each side of the substrate support surface; and a holding guide rail that supports the holding member, the holding member having an engagement surface that extends in a direction perpendicular to the substrate support surface, the engagement surface of the holding member engaging with the holding guide rail.

Description

Technical Field

[0001] This application relates to a head for holding a substrate and a substrate processing apparatus. This application claims priority based on Japanese Patent Application No. 2020-182844, filed on October 30, 2020. The entire disclosure of the specification, claims, drawings, and abstract of Japanese Patent Application No. 2020-182844 is incorporated herein by reference. Background Technology

[0002] In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) equipment is used to planarize the surface of the substrate. The substrates used in the manufacture of semiconductor devices are mostly circular. Furthermore, not limited to semiconductor devices, the planarization requirements are also very high when planarizing the surfaces of quadrilateral substrates such as CCL (Copper Cladding Laminate), PCB (Printed Circuit Board), photomask substrates, and display panels. In addition, the requirements for planarizing the surfaces of packaging substrates such as PCBs that house electronic components are also very high.

[0003] Furthermore, the size of circular semiconductor substrates is determined by specifications (such as SEMI specifications). However, since the sizes of quadrilateral substrates such as CCL (copper foil substrate), PCB (printed circuit board) substrates, photomask substrates, and display panels are not determined by specifications, substrates of various sizes exist. In recent years, from the perspective of component manufacturing efficiency, there has been a trend towards larger substrate sizes.

[0004] Existing technical documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-179015

[0006] Patent Document 2: US Patent No. 6019670

[0007] Patent Document 3: Japanese Patent Application Publication No. 2020-019115 Summary of the Invention

[0008] When CMP polishing a quadrilateral substrate, the substrate is held by a polishing head and pressed against a polishing pad supported on a polishing table. The polishing head and polishing table rotate to polish the substrate. A holding member holds the substrate in a predetermined position within the polishing head to prevent the substrate from jumping out during polishing. During polishing, the sides of the quadrilateral substrate may collide with the holding member. The larger size and weight of the quadrilateral substrate can adversely affect the mounting mechanism of the holding member when it collides with the holding member. Therefore, one object of this application is to provide a structure that reduces the risk to the mounting mechanism of the holding member when the substrate collides with it.

[0009] [Problem-solving methods]

[0010] One embodiment provides a head for holding a polygonal substrate, comprising: a substrate support surface, the shape of which corresponds to the shape of the polygonal substrate; a holding member disposed on the outer side of each side of the substrate support surface; and a holding guide supporting the holding member, the holding member having an engaging surface extending in a direction perpendicular to the substrate support surface, the engaging surface of the holding member engaging with the holding guide. Attached Figure Description

[0011] Figure 1 This is a top view showing the overall configuration of a substrate processing apparatus according to one embodiment.

[0012] Figure 2 This is a perspective view that schematically illustrates the configuration of a grinding assembly according to one embodiment.

[0013] Figure 3 This is a detailed cross-sectional view showing the structure of the head in one embodiment.

[0014] Figure 4 This is a view of one embodiment from the grinding table side.

[0015] Figure 5 It is an enlarged representation Figure 3 The cross-sectional view shown is a cross-sectional view of the retaining part.

[0016] Figure 6 It is an enlarged representation Figure 3 The cross-sectional view shown is a perspective view of the retaining part.

[0017] Figure 7 This is a top view of the lower outer casing as seen from above, representing one implementation method.

[0018] Figure 8 This is a schematic diagram of one embodiment of the retaining member viewed from above (the side that holds the guide rail).

[0019] Figure 9 yes Figure 8 The diagram shows a partial cross-sectional view of a single retaining member.

[0020] Figure 10 From Figure 8 The cross-sectional view shown is taken along the direction of arrow BB-BB.

[0021] Figure 11 This is a cross-sectional view showing the retaining part in one embodiment. Detailed Implementation

[0022] Hereinafter, embodiments of the head and substrate processing apparatus equipped with the head of the present invention will be described with reference to the accompanying drawings. In the drawings, the same or similar elements are labeled with the same or similar reference numerals, and repeated descriptions of the same or similar elements are omitted in the descriptions of various embodiments. Furthermore, the features shown in the various embodiments can be applied to other embodiments as long as they do not contradict each other.

[0023] Figure 1 This is a top view showing the overall configuration of a substrate processing apparatus 1000 according to one embodiment. Figure 1 The substrate processing apparatus 1000 shown includes a loading assembly 100, a conveying assembly 200, a polishing assembly 300, a drying assembly 500, and an unloading assembly 600. In the illustrated embodiment, the conveying assembly 200 has two conveying modules 200A and 200B, and the polishing assembly 300 has two polishing modules 300A and 300B. In one embodiment, these components can be formed independently. By forming these components independently and by arbitrarily combining the number of components, substrate processing apparatuses 1000 with different configurations can be easily formed. Furthermore, the substrate processing apparatus 1000 includes a control device 900, through which each component of the substrate processing apparatus 1000 is controlled. In one embodiment, the control device 900 can be configured as a general-purpose computer equipped with input / output devices, arithmetic devices, storage devices, etc.

[0024] <Loading Components>

[0025] The loading assembly 100 is used to introduce a substrate WF (unprocessed material) before grinding and cleaning into a substrate processing apparatus 1000. In one embodiment, the loading assembly 100 includes a plurality of transport rollers 202 for transporting the substrate WF. The transport rollers 202 are mounted on a roller shaft 204. By rotating the transport rollers 202 via the roller shaft 204, the substrate WF on the transport rollers 202 can be transported to a predetermined direction. Figure 1 (The middle direction is left). In one embodiment, the loading assembly 100 may also include an ID reader configured to read the ID of the received substrate. In another embodiment, the loading assembly 100 may also include a sensor for detecting the presence of a substrate WF located at a predetermined position on the conveying roller 202.

[0026] In the illustrated embodiment, the conveying mechanism of the loading assembly 100 includes: a plurality of conveying rollers 202; and a plurality of roller shafts 204 on which the conveying rollers 202 are mounted. Figure 1 In the illustrated embodiment, three conveying rollers 202 are mounted on each roller shaft 204. The substrate WF is disposed on the conveying roller 202, and is conveyed by the rotation of the conveying roller 202. The mounting position of the conveying roller 202 on the roller shaft 204 can be arbitrary, as long as it can stably convey the substrate WF. However, since the conveying roller 202 will contact the substrate WF, it should be positioned so that the conveying roller 202 contacts an area where there is no problem even if it comes into contact with the substrate WF being processed. In one embodiment, the conveying roller 202 of the loading assembly 100 may be made of a conductive polymer. In one embodiment, the conveying roller 202 is electrically grounded via the roller shaft 204, etc. This is to prevent the substrate WF from becoming charged and being damaged. In addition, in one embodiment, an ionizer (not shown) may be provided in the loading assembly 100 to prevent the substrate WF from becoming charged.

[0027] <Transfer Components>

[0028] Figure 1 The substrate processing apparatus 1000 shown includes two conveying components 200A and 200B. The two conveying components 200A and 200B may have the same configuration, therefore, they will be described together as conveying component 200 below.

[0029] The illustrated conveying assembly 200 includes a plurality of conveying rollers 202 for conveying substrates WF. By rotating the conveying rollers 202, the substrates WF on the conveying rollers 202 can be conveyed in a predetermined direction. The conveying rollers 202 of the conveying assembly 200 can be formed of either a conductive polymer or a non-conductive polymer. The conveying rollers 202 are mounted on roller shafts 204 and driven by a motor via gears. In one embodiment, the conveying assembly 200 may include a sensor for detecting the presence of a substrate WF located at a predetermined position on the conveying rollers 202.

[0030] In one embodiment, the conveying assembly 200 may include a transfer mechanism for delivering a substrate on the conveying roller 202 to the polishing assembly 300, or for receiving a substrate from the polishing assembly 300. The transfer mechanism may be a push rod 230 that lifts the substrate on the conveying roller 202. The push rod 230 may be, for example, a push rod similar to or the same as the push rod disclosed in Japanese Patent Application Publication No. 2020-019115.

[0031] In one embodiment, the conveying assembly 200 has a cleaning mechanism for cleaning a substrate moving on a conveying roller 202. The cleaning mechanism may include a cleaning nozzle 284 for spraying cleaning fluid toward the substrate moving on the conveying roller 202. Regarding the cleaning nozzle 284, for example, a cleaning nozzle that is the same as or similar to the cleaning nozzle disclosed in Japanese Patent Application Publication No. 2020-019115 may be used.

[0032] <Grinding Components>

[0033] Figure 2 This is a perspective view that schematically illustrates the configuration of a grinding assembly 300 according to one embodiment. Figure 1 The substrate processing apparatus 1000 shown includes two polishing components 300A and 300B. Since the two polishing components 300A and 300B can have the same configuration, they will be described together as polishing component 300 below.

[0034] like Figure 2 As shown, the polishing assembly 300 includes: a polishing table 350; and a head 302 that forms a polishing head for holding a substrate, which is the object to be polished, and pressing it onto the polishing table 350. The polishing table 350 is connected to a polishing table rotary motor (not shown) disposed below it via a table spindle 351 and can rotate about its table spindle 351. A polishing pad 352 is attached to the upper surface of the polishing table 350, and the surface 352a of the polishing pad 352 forms the polishing surface of the substrate. In one embodiment, the polishing pad 352 may also be attached via a layer that is easily peeled off from the polishing table 350. Such a layer is, for example, a silicon layer, a fluoropolymer resin layer, etc., and may also be as described in, for example, Japanese Patent Application Publication No. 2014-176950.

[0035] A polishing slurry supply nozzle 354 is provided above the polishing table 350, through which polishing slurry can be supplied to the polishing pad 352 on the polishing table 350. Furthermore, as... Figure 2 As shown, a passage 353 for supplying polishing fluid is provided in the polishing table 350 and the table spindle 351. The passage 353 connects to the opening 355 on the surface of the polishing table 350. At the position corresponding to the opening 355 of the polishing table 350, a through hole 357 is formed in the polishing pad 352, and the polishing fluid is supplied to the surface of the polishing pad 352 through the passage 353 from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352. In addition, there may be one or more openings 355 of the polishing table 350 and through holes 357 of the polishing pad 352. Furthermore, although the positions of the openings 355 of the polishing table 350 and through holes 357 of the polishing pad 352 are arbitrary, in one embodiment they are arranged near the center of the polishing table 350.

[0036] In one embodiment, the grinding assembly 300 includes an atomizer 358 for spraying liquid or a mixture of liquid and gas toward the grinding pad 352 (see reference). Figure 1 ), but did not indicate in Figure 2 The liquid ejected from atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen.

[0037] The head 302 is connected to a head shaft 18, which is movable up and down relative to the swing arm 360 via a vertical movement mechanism 319. This vertical movement of the head shaft 18 allows the entire head 302 to be positioned relative to the swing arm 360. The head shaft 18 can be rotated by a head rotation motor (not shown). Rotation of the head shaft 18 allows the head 302 to rotate around the head shaft 18 as a center. A rotary joint 323 is mounted on the upper end of the head shaft 18.

[0038] In addition, various abrasive pads are available on the market, such as SUBA800 (“SUBA” is a registered trademark) manufactured by Nitta Haas Co., Ltd., IC-1000, IC-1000 / SUAB400 (double-layer fabric); and Surfin xxx-5, Surfin 000, etc. (“surfin” is a registered trademark) manufactured by Fujimi Incorporated. SUBA800, Surfin xxx-5, and Surfin000 are nonwoven fabrics with fibers fixed in polyurethane resin, while IC-1000 is a rigid polyurethane foam (single-layer). Polyurethane foam is porous (multi-porous), and its surface has many micro-pits or pores.

[0039] The head 302 serves as a substrate that can maintain a quadrilateral shape on its lower surface. The swing arm 360 is configured to rotate around the support shaft 362. By rotating the swing arm 360, the head 302 can move between the substrate junction position of the aforementioned transport module 200 and above the polishing table 350. By lowering the head shaft 18, the head 302 can be lowered to press the substrate onto the surface (polishing surface) 352a of the polishing pad 352. At this time, the head 302 and the polishing table 350 are rotated respectively, and polishing fluid is supplied to the polishing pad 352 from the polishing fluid supply nozzle 354 provided above the polishing table 350 and / or from the opening 355 provided on the polishing table 350. In this way, the substrate surface can be polished by pressing it against the polishing surface 352a of the polishing pad 352. In substrate WF polishing, the swing arm 360 can also be fixed or swung so that the head 302 passes through the center of the polishing pad 352 (to cover the through hole 357 of the polishing pad 352).

[0040] The up-and-down motion mechanism 319 that enables the head shaft 18 and head 302 to move up and down includes: a bridge 28 that supports the head shaft 18 for rotation via a bearing 321; a ball screw 32 mounted on the bridge 28; a support platform 29 supported by a support column 130; and an AC servo motor 38 mounted on the support platform 29. The support platform 29 supporting the AC servo motor 38 is fixed to the swing arm 360 via the support column 130.

[0041] The ball screw 32 includes a helical shaft 32a connected to the servo motor 38, and a nut 32b screwed into the helical shaft 32a. The head shaft 18 is capable of moving up and down integrally with the bridge 28. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, thereby causing the head shaft 18 and the head 302 to move up and down. The grinding assembly 300 includes a distance sensor 70, which serves as a position detection unit that detects the distance from the bridge 28 to the lower surface, i.e., the position of the bridge 28. By detecting the position of the bridge 28 through the distance sensor 70, the position of the head 302 can be detected. The distance sensor 70, together with the ball screw 32 and the servo motor 38, constitutes the up-and-down motion mechanism 319. Alternatively, the distance sensor 70 can also be a laser sensor, an ultrasonic sensor, an overcurrent sensor, or a linear displacement sensor. Furthermore, the various devices in the grinding module, such as the ranging sensor 70 and the servo motor 38, are configured to be controlled by the control device 900.

[0042] Next, the head 302 in the grinding assembly 300 of one embodiment will be described. Figure 3 This is a detailed structural cross-sectional view of the head 302 in one embodiment. Figure 3 Equivalent to Figure 2 The cross-sectional view shown is cut along arrow AA-AA from head 302. Figure 4 This is a diagram of an observation head 302 from the side of the grinding table 350, representing one embodiment.

[0043] Figure 3 In the illustrated embodiment, the head 302 includes a head body 2 and a retaining portion 380. The head body 2 includes a quadrilateral plate-shaped upper member 303; an intermediate member 304 mounted on the lower surface of the upper member 303; and a lower member 306 mounted on the lower surface of the intermediate member 304. The retaining portion 380 is mounted on the outer periphery of the upper member 303. The upper member 303 is connected to the head shaft 18 by bolts 308 or the like. Furthermore, the intermediate member 304 is connected to the upper member 303 by bolts 309 or the like. The lower member 306 is connected to the upper member 303 by bolts 310 or the like. The upper member 303, the intermediate member 304, and the lower member 306 may be formed of metal or plastic materials. In one embodiment, the upper member 303 is formed of stainless steel (SUS), and the intermediate member 304 and the lower member 306 are formed of plastic materials.

[0044] like Figure 3 As shown, an elastic membrane 4, in contact with the back side of the substrate WF, is mounted on the lower surface of the lower member 306. In other words, the elastic membrane 4 forms a support surface for the substrate in the head 302. The support surface of the substrate of the elastic membrane 4 is the same size as or slightly larger than the substrate held in the head 302. The elastic membrane 4 is mounted on the lower surface of the lower member 306 by three concentric retainers 316 (the central part is a thin cylindrical member, and the two around it are square annular members). The retainers 316 are fixed to the lower member 306 by bolts 311, etc., and the elastic membrane 4 can be mounted on the lower surface of the lower member 306 by the retainers 316 and the lower member 306 clamping the elastic membrane 4. The elastic membrane 4 is divided into multiple parts by partition walls 4a. In one embodiment, the elastic membrane (diaphragm) 4 is formed of a rubber material with excellent strength and durability, such as ethylene propylene diene monomer (EPDM), polyurethane rubber, or silicone rubber. In one embodiment, the elastic membrane (diaphragm) 4 can be formed from a rubber material using a mold.

[0045] like Figure 3 As shown, the lower surface of the elastic membrane 4 and the lower component 306 divides the space into a central chamber 5, a undulating chamber 6, an intermediate chamber 7, an outer chamber 8, and an edge chamber 9. The central chamber 5, undulating chamber 6, intermediate chamber 7, outer chamber 8, and edge chamber 9 are connected by flow paths (not shown), and fluid is supplied to each chamber via these flow paths. The internal pressure of each chamber (6, 7, 8, 9) can be independently controlled. Therefore, when polishing the substrate WF, the contact pressure on the polishing pad 352 can be controlled according to each zone of the substrate WF.

[0046] In addition, such as Figure 4 As shown, the elastic membrane 4 has a plurality of vacuum adsorption holes 315 connected to the wave chamber 6 for vacuum adsorption of the substrate WF onto the head 302. One embodiment is as follows: Figure 4 As shown, there are eight vacuum adsorption holes 315. The vacuum adsorption holes 315 are connected to a passage (not shown) and to a vacuum source. The substrate WF can be vacuum adsorbed relative to the elastic film 4 of the head 302 through the vacuum adsorption holes 315.

[0047] Figure 5 It is an enlarged representation Figure 3 The cross-sectional view shown is a cross-sectional view of the holding part 380. Figure 6 It is an enlarged representation Figure 3The cross-sectional view shown is a perspective view of the retaining portion 380. As shown, the retaining portion 380 is provided on the outer periphery of the upper member 303. As shown, an upper outer shell 402 is connected to the lower surface of the outer periphery of the upper member 303. In one embodiment, the upper outer shell 402 can be fixed to the upper member 303 by bolts or the like via a sealing gasket. A lower outer shell 404 is provided on the lower surface of the upper outer shell 402. In one embodiment, the upper outer shell 402 and the lower outer shell 404 are integrally square annular members and can be formed of polyphenylene sulfide (PPS) resin. A cylindrical cylinder 406 is divided inside the lower outer shell 404. A diaphragm 408 is disposed in the cylinder 406. In one embodiment, the diaphragm 408 is formed of rubber material. The diaphragm 408 is fixed by being sandwiched between the upper outer shell 402 and the lower outer shell 404. The internal space of the cylinder 406 is divided into an upper space and a lower space by the diaphragm 408. A piston 410 is disposed within a diaphragm 408 of the lower housing 404. One end of the piston 410 contacts the underside of the diaphragm 408. Furthermore, the other end of the piston 410 extends from the underside of the lower housing 404 and contacts a retaining support rail 412. In one embodiment, the piston 410 may be formed of PPS resin.

[0048] Figure 7 This is a top view of the lower housing 404 as seen from above. In one embodiment, a plurality of cylinders 406 are formed in the lower housing 404, and a diaphragm 408 and a piston 410 are disposed in each cylinder 406. Figure 7 This indicates that multiple cylinders 406 are formed in the lower outer casing 404, and diaphragms 408 are disposed in each cylinder 406. As shown, by using cylinders 406, diaphragms 408, and pistons 410 of the same shape, the cost of manufacturing these components can be reduced. For example, even when manufacturing head bodies 2 of different sizes, the same diaphragms 408 and pistons 410 can still be used, and the number used can be varied according to the size of the head body 2.

[0049] The upper housing 402 is provided with a passage 403. The passage 403 is connected to a fluid source. Fluid (e.g., air or nitrogen) can be supplied from the fluid source through the passage 403 to the upper space of the cylinder 406 in the lower housing 404. When fluid is supplied to the upper space of the cylinder 406, the diaphragm 408 expands downward, causing the piston 410 to move downward. The downward movement of the piston 410 enables the retaining support rail 412 to move downward.

[0050] In one implementation, such as Figure 5 , Figure 6As shown, a belt 414 is mounted from the outer side of the upper housing 402, passing through the outer side of the retaining support rail 412. The belt 414 allows the retaining support rail 412 to move relative to the lower housing 404 and prevents grinding fluid or the like from entering the space between the lower housing 404 and the retaining support rail 412.

[0051] As shown in the figure, a retaining guide rail 416 is mounted on the lower surface of the retaining support guide rail 412. In one embodiment, as shown in the figure, a sealing gasket 415 made of rubber or the like is disposed between the retaining support guide rail 412 and the retaining guide rail 416. As shown in the figure, a retaining member 3 is mounted on the lower surface of the retaining guide rail 416. Figure 6 As shown, the retaining support rail 412, retaining guide rail 416, and retaining member 3 can be fixed by bolts 417. The retaining support rail 412 and retaining guide rail 416 are square annular members. In one embodiment, the retaining support rail 412 and retaining guide rail 416 are made of stainless steel (SUS), and the retaining member 3 is made of stainless steel (SUS), ceramic, PPS resin, polyvinyl chloride resin, etc. As described above, the retaining support rail 412 moves downward by means of the piston 410 in the lower housing 404, thereby moving the retaining member 3 downward.

[0052] In one embodiment, the retaining member 3 is as follows Figure 4 As shown, it is a slender, rectangular, plate-like component. Figure 4 In the illustrated embodiment, the retaining member 3 consists of four plate-like members disposed on the outer sides of each side of the quadrilateral head body 2. As shown, the retaining member 3 is positioned on the outer sides of each side of the quadrilateral support surface corresponding to the shape of the quadrilateral base plate. In the illustrated embodiment, the elongated retaining member 3 has a fan-shaped end. Therefore, as... Figure 4 As shown, by combining four retaining members 3, the entire corner portion of the head body 2 can be surrounded by the retaining members 3. Furthermore, in one embodiment, as... Figure 4 As shown, the retaining member 3 has multiple slots 3a. Figure 4 The retaining member 3 shown has a groove 3a extending from the inside to the outside of the head 302. The groove 3a forms a channel for the passage of grinding fluid such as slurry during grinding. The size and number of grooves 3a are arbitrary, and there may also be no grooves 3a.

[0053] Figure 8 This is a schematic diagram of the retaining member 3 of one embodiment, viewed from above (the side of retaining guide rail 416). Figure 9 yes Figure 8 The figure shows a partial cross-sectional view of a single retaining member 3. As shown, each of the four plate-shaped retaining members 3 has bolt holes 419 for fixing the retaining member 3 to the retaining support guide rail 412 and for bolts 417 to enter the retaining guide rail 416. Furthermore, as... Figure 8As shown, the retaining member 3 is provided with a pin hole 421 for mounting a positioning pin 423 for positioning the retaining member 3 on the retaining support guide rail 412 and the retaining guide rail 416. Figure 10 From Figure 8 The image shows a partial cross-sectional view taken along the direction of arrow BB-BB. In one embodiment, the pin hole 421 and the locating pin 423 may also be omitted.

[0054] In one implementation, such as Figure 5 , Figure 9 , Figure 10 As shown, the retaining member 3 has a protrusion 425 protruding toward the retaining guide rail 416. Alternatively, the protrusion 425 of the retaining member 3 protrudes perpendicularly from the plate surface of the plate-shaped retaining member 3. The protrusion 425 of the retaining member 3 has an engaging surface 427 that contacts the side surface of the retaining guide rail 416. The engaging surface 427 of the retaining member 3 is configured to face toward the retaining guide rail 416. In other words, the engaging surface 427 of the retaining member 3 is configured to face away from the center of the head 302. Alternatively, the engaging surface 427 may also extend in a direction perpendicular to the surface of the substrate or the support substrate. When the retaining member 3 is fixed to the retaining support guide rail 412 and the retaining guide rail 416, the engaging surface 427 of the retaining member 3 is configured to contact the inner side surface of the retaining guide rail 416 when viewed from the center of the head 302.

[0055] like Figure 8 , Figure 9 As shown, the protrusion 425 and engaging surface 427 of the retaining member 3 are provided along the length of the retaining member 3, which is approximately the entire plate. The protrusion 425 and engaging surface 427 of the retaining member 3 are preferably provided at the end of the retaining member 3, even before the bolt hole 419 at the very end.

[0056] During substrate grinding, the substrate is held below the elastic membrane 4 of the head 302, and the head 302 and grinding table 350 are rotated while being pressed against the grinding surface on the grinding table 350. The holding member 3 restricts the lateral movement of the substrate relative to the head 302 during grinding to prevent the substrate from jumping out laterally from the head 302. During substrate grinding, due to the rotation of the head 302 and grinding table 350, the side of the substrate collides with the holding member 3. When the substrate collides with the holding member 3, a lateral force is applied to the holding member 3. Since the holding member 3 in the above embodiment has an engagement surface 427 that contacts the holding guide 416, the lateral force applied to the holding member 3 is transmitted from the engagement surface 427 to the holding guide 416. If the holding member 3 does not have the engagement surface 427, the lateral force applied to the holding member 3 will be transmitted to the holding guide 416 through the bolt 417. In this case, a large force will be applied to the bolt 417, causing the bolt 417 to loosen. However, in the retaining member 3 of the embodiments of this disclosure, since the lateral force applied to the retaining member 3 is transmitted from the engaging surface 427 to the retaining guide 416, the force transmitted to the bolt 417 can be reduced. Therefore, in the above embodiments, the risk of bolt 417 loosening can be reduced.

[0057] In the illustrated embodiment, the retaining member 3 has an engaging surface 427 that contacts the inner side of the retaining guide 416. However, other configurations are also possible, as long as the lateral force applied to the retaining member 3 can be transmitted towards the retaining guide 416. For example, the retaining member 3 may have a protrusion, and the retaining guide 416 may have a recess corresponding to the protrusion of the retaining member 3. This allows the force to be transmitted through the interlocking surfaces, thus achieving the same effect. Alternatively, the retaining member 3 may have a recess, while the retaining guide 416 may have a protrusion.

[0058] Figure 11 This is a cross-sectional view showing the holding part 380 in one embodiment. Figure 11 The retaining member shown includes a first layer 3b and a second layer 3c. The first layer 3b and the second layer 3c of the retaining member 3 can be made of different materials. As mentioned above, the retaining member 3 can be formed of stainless steel (SUS), ceramic, PPS resin, polyvinyl chloride resin, etc., but for example, the first layer 3b can also be formed of high-rigidity stainless steel (SUS), and the second layer 3c can be formed of PPS resin. Alternatively, the second layer 3c can be formed of ceramic, which has higher rigidity than resin. The first layer 3b and the second layer 3c of the retaining member 3 can be bonded together with an adhesive such as epoxy resin. In addition, a concave-convex structure can be provided at the joint surface of the first layer 3b and the second layer 3c of the retaining member 3 to form resistance to lateral impacts.

[0059] In one embodiment, the head 302 includes a stop guide device that guides the retaining member 3 to move vertically and supports the retaining member 3 to prevent lateral movement. In one embodiment, such as... Figure 5 , Figure 6 As shown, the retaining support rail 412, retaining guide rail 416, and retaining member 3 are supported and guided by the support roller 450 and can move in the vertical direction. As shown, a support pad 418 is fixed to the inner side of the retaining support rail 412. As shown, with the support pad 418 fixed to the retaining support rail 412 in contact with and supported by the support roller 450, the retaining support rail 412, retaining guide rail 416, and retaining member 3 can move in the vertical direction. Alternatively, in one embodiment, a small gap can be maintained between the support pad 418 fixed to the retaining support rail 412 and the support roller 450. In one embodiment, the support pad 418 can be formed of PPS resin, vinyl chloride resin, PEEK resin, etc.

[0060] like Figure 5 , Figure 6 As shown, a retaining support frame 420 is fixed to the lower component 306 of the head body 2. Figure 6 As shown, the retaining support 420 is fixed to the lower component 306 by bolts 422. Figure 5 , Figure 6 As shown, a sealing gasket 415 is sandwiched between the lower member 306 and the retaining support frame 420. As illustrated, the sealing gasket 415 extends from the area between the lower member 306 and the retaining support frame 420 to the area between the retaining support guide 412 and the retaining guide 416. Furthermore, the sealing gasket 415 can also be said to extend from the head body 2 through the retaining portion 380. Therefore, the sealing gasket 415 prevents grinding fluid and the like from intruding into the head 302 from between the head body 2 and the retaining portion 380.

[0061] like Figure 6 As shown, a shaft 424 is fixed to the retaining support frame 420. The support roller 450 is supported by the shaft 424 and is rotatable. In one embodiment, a plurality of support rollers 450 are provided along each side of the square annular retaining portion 380.

[0062] Furthermore, in the above embodiment, the rotational force of the head shaft 18 is transmitted to the upper member 303, the intermediate member 304, and the lower member 306. Moreover, the rotational force is transmitted from the retaining support frame 420 fixed to the lower member 306 to the support roller 450, and from the support roller 450 to the retaining portion 380 via the support pad 418. Therefore, the rotational force of the head body 2 of the head 302 is transmitted to the retaining portion 380 via the support roller 450.

[0063] Furthermore, in the above embodiment, fluid is supplied to the cylinder 406 through the passage 403, and the piston 410 is driven by the diaphragm 408, thereby causing the retaining member 3 to move vertically and press against the grinding pad 352. Moreover, the pressing pressure of the retaining member 3 relative to the grinding pad 352 can be controlled by the fluid pressure supplied to the cylinder 406. In the above embodiment, when the retaining member 3 moves vertically, it is guided by the support roller 450. Therefore, the resistance between the support roller 450 and the support pad 418 can be reduced.

[0064] <Drying Components>

[0065] The drying assembly is a device used to dry the substrate (WF). Figure 1 In the substrate processing apparatus 1000 shown, the drying assembly 500 dries the substrate WF that has been polished by the polishing assembly 300 and cleaned in the cleaning section of the transport assembly 200. For example... Figure 1 As shown, the drying component 500 is positioned downstream of the conveying component 200.

[0066] The drying assembly 500 includes a conveying roller 202 for conveying the substrate WF. In one embodiment, the conveying roller 202 of the drying assembly 500 may be made of a conductive polymer. The conveying roller 202 is electrically grounded via a roller shaft 204 or the like. This is to prevent the substrate WF from becoming charged and being damaged. Furthermore, in one embodiment, an ionizer (not shown) may be provided in the drying assembly 500 to prevent the substrate WF from becoming charged. In one embodiment, the drying assembly 500 may also include a sensor for detecting the presence of the substrate WF at a predetermined position on the conveying roller 202.

[0067] In this embodiment, the drying assembly 500 has a nozzle 530 for spraying gas toward the substrate WF being conveyed on the conveying roller 202. The gas may be, for example, compressed air or nitrogen. Regarding the nozzle 530 of the drying assembly 500, a nozzle that is the same as or similar to the nozzle disclosed in Japanese Patent Application Publication No. 2020-019115 may be used.

[0068] <Uninstall Components>

[0069] The unloading component 600 is used to move the substrate WF, which has undergone grinding and cleaning, out of the substrate processing apparatus 1000. Figure 1 In the substrate processing apparatus 1000 shown, the unloading assembly 600 receives the substrate after it has been dried by the drying assembly 500. Figure 1 As shown, the unloading component 600 is configured downstream of the drying component 500.

[0070] Figure 1In the illustrated embodiment, the unloading assembly 600 includes a plurality of transport rollers 202 for transporting the substrate WF. Rotating the transport rollers 202 allows the substrate on the transport rollers 202 to be transported in a predetermined direction. In one embodiment, the transport rollers 202 of the unloading assembly 600 may be made of a conductive polymer. In another embodiment, the transport rollers 202 are electrically grounded via roller shafts 204, etc. This is to prevent the substrate WF from becoming charged and being damaged. Furthermore, in one embodiment, an ionizer (not shown) may be provided in the unloading assembly 600 to prevent the substrate WF from becoming charged. In one embodiment, the unloading assembly 600 may also include a sensor for detecting the presence of a substrate WF located at a predetermined position on the transport rollers 202.

[0071] Figure 1 The substrate processing apparatus 1000 shown includes two conveying components 200 and a polishing component 300, but it may also include one conveying component 200 and one polishing component 300, or even three or more. Furthermore, as described above, the loading component 100, the conveying component 200, the polishing component 300, the drying component 500, and the unloading component 600 may each be configured as independent components.

[0072] The following technical concepts were grasped from the above implementation methods.

[0073] [Method 1] According to Method 1, a head for holding a polygonal substrate is provided, the head having: a substrate support surface, the shape of which corresponds to the shape of the polygonal substrate; a holding member disposed on the outer side of each side of the substrate support surface; and a holding guide rail supporting the holding member, the holding member having an engaging surface extending in a direction perpendicular to the substrate support surface, the engaging surface of the holding member engaging with the holding guide rail.

[0074] [Method 2] According to Method 2, in the head of Method 1, the retaining member is fixed to the retaining guide rail by bolts.

[0075] [Method 3] According to Method 3, in the head of Method 1 or 2, when viewed from the center of the head, the engaging surface of the retaining member engages with the inner side of the retaining guide.

[0076] [Method 4] According to Method 4, in the head of any of Methods 1 to 3, the retaining member has a first layer and a second layer, the first layer and the second layer being formed of different materials.

[0077] [Method 5] According to Method 5, a retaining member is provided for use in a head for retaining a polygonal substrate. The retaining member has a plate-shaped member and a engaging surface extending in a direction perpendicular to the plate surface. The engaging surface of the retaining member is configured such that when the retainer is mounted on the head, the engaging surface engages with a retaining guide that supports the retaining member.

[0078] [Method 6] According to Method 6, in the retaining member of Method 5, the retaining member has bolt holes for fixing to the retaining guide rail by bolts.

[0079] [Method 7] According to Method 7, in the retaining member of Method 5 or 6, the plate-like member has a first layer and a second layer, the first layer and the second layer being formed of different materials.

[0080] [Method 8] According to Method 8, a substrate processing apparatus is provided for processing a polygonal substrate, comprising: a head as described in any one of Methods 1-4; and a polishing table for supporting a polishing pad.

[0081] Symbol Explanation

[0082] 2 main bodies

[0083] 3 retaining components

[0084] 4. Elastic membrane

[0085] 100 Loading Components

[0086] 200 conveyor components

[0087] 300 grinding components

[0088] 302 heads

[0089] 350 grinding table

[0090] 352 Grinding Pad

[0091] 380 Maintenance Department

[0092] 412 Retaining support rail

[0093] 416 Keeping Rail

[0094] 417 bolts

[0095] 418 support pad

[0096] 419 bolt holes

[0097] 420 retaining support frame

[0098] 421 pin hole

[0099] 423 sales

[0100] 425 convex part

[0101] 427 kcal face

[0102] 500 drying unit

[0103] 600 Uninstall Component

[0104] 900 control device

[0105] 1000 substrate processing device

[0106] WF substrate

Claims

1. A head for holding a polygonal substrate, characterized in that, have: A substrate support surface, the shape of which corresponds to the shape of a polygonal substrate; Retaining members, the retaining members being disposed on the outer sides of each side of the substrate support surface; and A retaining guide rail supports the retaining member. The retaining member is fixed to the retaining guide rail by bolts. The retaining member has an engaging surface extending in a direction perpendicular to the support surface of the substrate. The engaging surface of the retaining member engages with the retaining guide rail. Viewed from the center of the head, the engaging surface of the retaining member is positioned inside the bolt. The retaining member has a protrusion that protrudes toward the retaining guide rail, and the protrusion has the engaging surface.

2. The head as described in claim 1, characterized in that, Viewed from the center of the head, the engaging surface of the retaining member engages with the inner side of the retaining guide rail.

3. The head as described in claim 1 or 2, characterized in that, The retaining member has a first layer and a second layer, which are formed of different materials.

4. A retaining member used in a head for retaining a polygonal substrate, characterized in that, The retaining member has a plate-shaped component. The retaining member has an engaging surface extending in a direction perpendicular to the plate surface. The engaging surface of the retaining member is configured such that, when the retaining member is installed in the head, the engaging surface engages with the retaining guide rail supporting the retaining member. The retaining member has bolt holes for fixing to the retaining guide rail by bolts. Viewed from the center of the head, the engaging surface of the retaining member is positioned inside the bolt hole. The retaining member has a protrusion that protrudes toward the retaining guide rail, and the protrusion has the engaging surface.

5. The retaining member as claimed in claim 4, characterized in that, The plate-shaped member has a first layer and a second layer, which are formed of different materials.

6. A substrate processing apparatus for processing polygonal substrates, characterized in that, have: The head as described in claim 1 or 2; and A grinding table, used to support a grinding pad.

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