An ultrasonic flaw detection probe

Abstract

This invention discloses an ultrasonic flaw detection probe, belonging to the field of detection probe technology. The probe includes a wedge shell, a wedge, a sound-absorbing block, and a crystal. The side of the wedge shell that contacts the workpiece being inspected has the same surface shape as the workpiece. The sound-absorbing block is disposed on the side of the wedge shell near the workpiece, and the wedge is disposed within the sound-absorbing block. The crystal is disposed on the side of the sound-absorbing block that contacts the wedge. The ultrasonic flaw detection probe of this invention has a shape that perfectly fits the inspection surface of the workpiece. The probe has high technical parameter accuracy and high sensitivity for detecting fatigue defects within a certain range, facilitating error-free operation by operators on-site. This ensures good ultrasonic flaw detection coupling performance and improves the crack detection rate of the component. The reasonable probe design simplifies on-site operation and greatly improves work efficiency. The tight fit of the mating surfaces ensures probe stability, enabling accurate location, quantification, and characterization of detected defects, resulting in high flaw detection accuracy and resolution.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of detection probe, in particular to an ultrasonic flaw detection probe. BACKGROUND

[0002] The rail vehicle hook pull ring generates fatigue cracks in the operation of the vehicle, and the hook pull ring of the in-service vehicle needs to be detected without disassembly. Since the crack occurs near the chamfer position of the pull ring, the initial detection is carried out by using a transverse wave oblique probe to scan the outer circular surface of the pull ring to detect the position near the chamfer. Since the crack often occurs at the R angle root of the pull ring, the reflection wave is very close to the R angle inherent wave and is difficult to distinguish, thereby causing misjudgment and missed detection.

[0003] The patent document with publication number CN108008021A discloses an ultrasonic guided wave oblique probe for rail flaw detection and a flaw detection method thereof. The probe includes a shell, an acoustic absorption filler, at least one piezoelectric unit, and at least one interface. Each piezoelectric unit is arranged in the shell and includes a wedge, a piezoelectric wafer, a cable, and a damping block. The piezoelectric wafer is a thickness vibration mode piezoelectric ceramic sheet. One surface of the wedge is at an angle with the horizontal plane. One surface of the piezoelectric wafer perpendicular to the vibration direction is flatly attached to the surface of the wedge. The damping block is tightly attached to the other surface of the piezoelectric wafer perpendicular to the vibration direction. The acoustic absorption filler fills the empty space in the shell except the piezoelectric unit. The interface is arranged on one surface of the shell and connected with the piezoelectric wafer through the cable. The piezoelectric wafer adopts the thickness vibration mode, has high signal-to-noise ratio, low cost, is convenient to popularize, and can be used for rail head and rail bottom flaw detection with long single detection distance.

[0004] The above ultrasonic guided wave oblique probe is mainly used for detecting the planar structure on the rail, and is difficult to be applied to the arc-shaped structure such as the hook pull ring. Therefore, there is an urgent need for an ultrasonic flaw detection probe suitable for the hook pull ring. SUMMARY

[0005] To solve the above technical problems, the present application provides an ultrasonic flaw detection probe, which completely covers the fatigue crack prone area in the scanning range, thereby realizing convenient flaw detection scanning without the influence of inherent wave reflection caused by any size of the workpiece, and greatly improving the crack detection accuracy.

[0006] To achieve the above purpose, the present application provides the following solutions:

[0007] The application provides an ultrasonic flaw detection probe, which comprises a wedge shell, a wedge, an acoustic absorption block and a wafer; the side of the wedge shell, which is in contact with a workpiece to be detected, is identical in shape to the surface of the workpiece to be detected; the acoustic absorption block is arranged on the side of the wedge shell close to the workpiece to be detected; the wedge is arranged in the acoustic absorption block; the wafer is arranged on the side of the acoustic absorption block in contact with the wedge-shaped block, and the wafer is in contact with the wedge-shaped block.

[0008] Optionally, the refraction angle of the probe is 68°, and the frequency is 5 MHz.

[0009] Optionally, the incidence angle of the probe is 30.5°.

[0010] Optionally, the distance from the refraction angle incidence point to the tangent point is 10.52 mm.

[0011] Optionally, the horizontal distance from the fatigue crack area to the tangent point is 3.5 mm.

[0012] Optionally, the size of the wafer is 5 mm x 10 mm.

[0013] Optionally, the contact surface of the wedge and the workpiece to be detected is a semicircular surface.

[0014] The application has the following technical effects relative to the prior art:

[0015] The ultrasonic flaw detection probe in the application has the following advantages: the probe shape is completely fitted to the detection surface of the workpiece to be detected, the technical parameters of the probe are designed with high precision, the flaw detection sensitivity for fatigue defects generated within a certain range is high, the on-site operation of the operator is convenient and error-free, the ultrasonic flaw detection coupling performance is ensured to be perfect, the crack detection rate of the component is improved, the probe design is reasonable, the on-site operation is simplified, the work efficiency is greatly improved, the joint surface is tightly fitted to ensure the stability of the probe, the detected defects can be accurately positioned, quantified and qualitatively analyzed, the flaw detection precision is high, and the resolution is high. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below only show some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0017] Fig. 1 It is a structure diagram of the ultrasonic flaw detection probe of the application being fitted to the detection surface of the workpiece to be detected.

[0018] Fig. 2 It is a sectional structure diagram of the ultrasonic flaw detection probe of the application being fitted to the workpiece to be detected.

[0019] Fig. 3 This is a schematic diagram of the structure of a physical standard test block;

[0020] Fig. 4 This is a reflection diagram of the defect wave;

[0021] Fig. 5 This is a schematic diagram illustrating the detection effect of the ultrasonic flaw detection probe of the present invention.

[0022] Explanation of reference numerals in the attached diagram: 1. Workpiece to be inspected; 2. Sound-absorbing block; 3. Wedge shell; 4. Crystal; 5. Wedge; 6. Incident ray; 7. Refractive ray; 8. Artificial defect; 9. Inspection surface; 10. Probe;

[0023] α, angle of incidence; β, angle of refraction;

[0024] H, distance from the incident point to the tangent point; L, horizontal distance from the fatigue crack zone to the tangent point. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] like Figs. 1 to 5 As shown, this embodiment provides an ultrasonic flaw detection probe. The probe 10 includes a wedge shell 3, a wedge 5, a sound-absorbing block 2, and a wafer 4. The side of the wedge shell 3 that contacts the workpiece 1 being inspected has the same surface shape as the workpiece 1 being inspected. The sound-absorbing block 2 is disposed on the side of the wedge shell 3 close to the workpiece 1 being inspected. The wedge 5 is disposed inside the sound-absorbing block 2. The wafer 4 is disposed on the side of the sound-absorbing block 2 that contacts the wedge block, and the wafer 4 is in contact with the wedge block.

[0027] In this specific embodiment, the non-contact surfaces of the wedge shell 3 and the workpiece 1 being tested are configured as planar structures, and the contact surfaces of the wedge shell 3 and the workpiece 1 being tested are tangentially configured as a plane and a semi-circular arc surface, ensuring that the wedge shell 3 and the surface of the workpiece 1 being tested are completely in contact.

[0028] The wedge shell 3 has an internal cavity, and the sound-absorbing block 2 is placed inside the cavity. A wire hole is provided on one side of the wedge shell 3, which is connected to the cavity. The wire hole is used to pass through the wire, which is used to supply power to the chip 4.

[0029] The wedge 5 is provided with a wedge-shaped groove on the side facing the workpiece 1 to be detected, the wedge 5 is arranged in the wedge-shaped groove, and the wedge 5 is in close contact with the wedge-shaped groove. One side of the wedge-shaped groove is provided with a groove, and the wafer 4 is arranged in the groove. The depth of the groove is the same as the thickness of the wafer 4, so that the wafer 4 can tightly adhere to the wedge 5, and the ultrasonic wave emitted by the wafer 4 can be transmitted out through the wedge 5. In a more specific embodiment, the size of the wafer 4 is 5mm×10mm.

[0030] The contact surface of the wedge 5 and the workpiece 1 to be detected is arranged as a semicircular arc surface, and the workpiece detection part is arranged in a rotating and left-right sliding scanning mode, which can expand the scanning range. Especially, this method can be used only when the defect area prone to be generated in the pull ring is not very certain.

[0031] In the specific embodiment, the probe 10 is in perfect contact with the detection surface 9, the angle of the probe 10 is selected to enable the scanning coverage area to completely cover the fatigue crack area (within 4mm from the edge of the corner), the incidence angle α of the probe 10 is 30.5°, the refraction angle β is 68°, the frequency is 5MHz, the distance H from the refraction angle β incidence point to the tangent point is 10.52mm, and the horizontal distance L from the fatigue crack area to the tangent point is 3.5mm.

[0032] In the specific embodiment, the ultrasonic flaw detection probe 10 is specially designed to match the shape of the detection surface 9 and the excessive circular arc part of the pull ring, to avoid the influence of the pull ring R corner inherent wave on flaw detection, to provide on-site flaw detection operability, and to minimize the influence of human factors. The scanning range completely covers the fatigue crack area, thereby realizing convenient flaw detection scanning without the influence of inherent wave reflection caused by any workpiece shape and size, and greatly improving the crack detection accuracy.

[0033] It should be noted that, for those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application, and any reference signs in the claims should not be regarded as limiting the claims.

[0034] The principles and implementation modes of the present application are described in the specific examples in the specification, and the above embodiment descriptions are only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation modes and application ranges will be changed. In view of the above, the content of the specification should not be understood as a limitation of the present application.

Claims

1. An ultrasonic flaw detection probe characterized by comprising: The probe comprises a wedge shell, a wedge, an acoustic absorption block and a wafer; the side of the wedge shell in contact with the workpiece to be detected is the same as the surface shape of the workpiece to be detected; the acoustic absorption block is arranged on the side of the wedge shell close to the workpiece to be detected, the wedge is arranged in the acoustic absorption block, and the wafer is arranged on the side of the acoustic absorption block in contact with the wedge, and the wafer is in contact with the wedge; The fatigue crack area is within 4 mm from the edge of the corner; The wedge is located between the wafer and the fatigue crack area; The wafer is located on the side of the fatigue crack area away from the corner edge, so that the ultrasonic waves emitted by the wafer can completely cover the fatigue crack area; The ultrasonic waves emitted by the wafer can be transmitted through the wedge, and the refracted rays of the ultrasonic waves after refraction on the detection surface fall in the fatigue crack area and have a spacing from the corner edge; The contact surface of the wedge shell and the workpiece to be detected adopts a tangent plane and a semicircular surface, so that the wedge shell and the surface of the workpiece to be detected are completely fitted, the side of the semicircular surface of the wedge shell facing the workpiece to be detected is provided with a wedge-shaped groove, the wedge is arranged in the wedge-shaped groove, and the wedge is fitted with the wedge-shaped groove, one side of the wedge-shaped groove is provided with a groove, the wafer is arranged in the groove, the depth of the groove is the same as the thickness of the wafer, and the fatigue crack area is located directly below the plane of the workpiece to be detected.

2. The probe for ultrasonic inspection according to claim 1, characterized by The refraction angle of the probe is 68°, and the frequency is 5 MHz.

3. The probe for ultrasonic inspection according to claim 1, characterized by The incidence angle of the probe is 30.5°.

4. The probe for ultrasonic inspection according to claim 1, characterized by The distance from the refraction angle incidence point to the tangent point is 10.52 mm.

5. The probe for ultrasonic inspection according to claim 1, characterized by The horizontal distance from the fatigue crack area to the tangent point is 3.5 mm.

6. The probe for ultrasonic inspection according to claim 1, characterized by The size of the wafer is 5 mm x 10 mm.

7. The probe for ultrasonic inspection according to claim 1, characterized by The contact surface of the wedge and the workpiece to be detected is a semicircular surface.

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