A wiring method of a diamond wire saw

By adopting a coarse-diameter diamond wire saw and a high-tension wire running method, the problems of easy wire breakage and incomplete wire falling to the bottom of the main roller groove by diamond wire saw wiring are solved, improving silicon wafer production efficiency and quality, and requiring no equipment modification and low cost.

CN116572409BActive Publication Date: 2025-12-23JINWAN GAOJING SOLAR ENERGY TECH CO LTD +1
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Patent Information

Application Number
CN202310490170.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-05-04
Publication Date
2025-12-23
Estimated Expiration
2043-05-04

AI Technical Summary

Technical Problem

The existing wiring method of diamond wire saws is prone to wire breakage and incomplete diamond wire falling to the bottom of the main roller groove, which affects production efficiency and silicon wafer quality.

Method used

The method of using coarse-diameter diamond wire and high-tension wire running ensures that the diamond wire falls completely into the bottom of the main roller groove by selecting appropriate coarse-diameter diamond wire and cutting tension, and avoids wire breakage during the wiring process, including steps such as fixing, cutting, connecting and heating.

Benefits of technology

This effectively avoids the phenomenon of diamond wire breaking or not falling completely to the bottom of the main roller groove during the wiring process, improving silicon wafer production efficiency and quality, while requiring no equipment modification and basically not increasing costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a wiring method of a diamond wire saw, which comprises the following steps: determining a cutting tension N and a wire diameter D of a diamond wire T according to parameters of a main roller; selecting a coarse-diameter diamond wire T1 according to the wire diameter D of the diamond wire T and fixing the coarse-diameter diamond wire T1 on a main shaft of a take-up wheel; fixing a wire end of the coarse-diameter diamond wire T1 on a rear end of the main roller; starting the main roller to run the wire according to a wire running tension, forming a first local dense wire net; removing the diamond wire that does not fall into a wire groove of the main roller to form a second local dense wire net and fixing the second local dense wire net; continuing to start the main roller to rotate, forming a large-range dense wire net, and pulling out the wire end of the coarse-diameter diamond wire T1 and fixing the wire end of the coarse-diameter diamond wire T1 on a main shaft of a pay-off wheel; after a heat engine is completed, connecting the wire end of the diamond wire T with the wire end of the coarse-diameter diamond wire T1 at a pay-off end, starting the main roller to rotate, running the diamond wire T to the take-up wheel at the cutting tension N, fixing the diamond wire T on the main shaft of the take-up wheel, starting the heat engine, and completing wiring. The application improves the production efficiency and quality of silicon wafers.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic silicon wafer production, in particular to a wiring method of diamond wire saw. BACKGROUND

[0002] Under the influence of the increasingly expanding industrial scale in China, the supply of energy is becoming more and more nervous, solar energy is a kind of renewable energy, in recent years, the photovoltaic industry using solar energy to generate electricity develops very rapidly. Amorphous silicon and crystalline silicon are important raw materials for solar cell production, which are widely used to produce solar photovoltaic silicon wafers.

[0003] Photovoltaic silicon wafer is an important part of solar cell panel, and its production is mainly realized through wire cutting process. The wire cutting process includes: placing the silicon rod on the corresponding cutting platform, and the diamond wire saw is in the form of dense wire mesh reciprocating movement, and the cutting movement is formed between the cutting silicon rod, so as to realize the purpose of cutting out the photovoltaic silicon wafer.

[0004] Before cutting, the diamond wire saw needs to be arranged on the specific main roller to form a dense wire mesh. Affected by the outer diameter of the diamond wire, the running tension and the type of the main roller wire groove, the diamond wire is prone to breakage and the diamond wire does not completely fall to the bottom of the main roller wire groove, which seriously affects the production efficiency and the quality of the silicon wafer.

[0005] The rapid development of photovoltaic industry requires continuous improvement of the production efficiency of silicon wafer, and the quality of the cutting is also getting higher and higher. The existing wiring method of diamond wire saw cannot meet the requirements of the existing process production. Therefore, we propose a wiring method of diamond wire saw for photovoltaic silicon wafer. SUMMARY

[0006] In order to overcome the shortcomings of the prior art, the present application provides a wiring method of diamond wire saw, which solves the technical problems of easy breakage of the existing wiring method of diamond wire saw and easy occurrence of the phenomenon that the diamond wire does not completely fall to the bottom of the main roller wire groove, thereby effectively avoiding the phenomenon that the diamond wire is easy to break and the diamond wire does not completely fall to the bottom of the main roller wire groove during wiring, and further improving the production efficiency and the quality of the silicon wafer.

[0007] To solve the above problems, the technical scheme adopted by the present application is as follows:

[0008] A wiring method of diamond wire saw, comprising the following steps:

[0009] According to the parameters of the main roller, the cutting tension N and the wire diameter D of the diamond wire T are determined;

[0010] According to the wire diameter D of the diamond wire T, the coarse wire diameter diamond wire T1 is selected;

[0011] Fix the thick diameter diamond wire T1 bobbin on the spindle of the take-up wheel;

[0012] Rotate the spindle of the take-up wheel, pull out the thick diameter diamond wire T1 wire head, pass through the first guide roller, and then fix the thick diameter diamond wire T1 wire head on the rear end of the main roller;

[0013] According to the cutting tension, set the running tension, and start the main roller to run according to the running tension to form a first local dense wire mesh;

[0014] Stop the rotation of the main roller, cut off the thick diameter diamond wire T1 that does not fall into the main roller wire groove at the front end of the first local dense wire mesh to form a second local dense wire mesh, and fix the front end of the second local dense wire mesh;

[0015] Continue to start the rotation of the main roller to form a large range dense wire mesh, remove the fixation at the front end of the large range dense wire mesh, and pull out the thick diameter diamond wire T1 wire head from the front end of the large range dense wire mesh, pass through the second guide roller, and then fix it on the spindle of the pay-off wheel;

[0016] According to the cutting tension, set the thermal cutting tension to perform thermal cutting, and after completing the thermal cutting, cut off the thick diameter diamond wire T1 at the pay-off end;

[0017] Fix the diamond wire T bobbin on the spindle of the pay-off wheel, pull out the diamond wire T wire head to connect with the thick diameter diamond wire T1 wire head at the pay-off end, start the rotation of the main roller, run the diamond wire T of the pay-off wheel to the take-up wheel at the cutting tension N, cut off the diamond wire T at the take-up end, remove the thick diameter diamond wire T1 bobbin, fix the diamond wire T on the spindle of the take-up wheel, start the thermal machine, and complete the wiring.

[0018] As a preferred embodiment of the present application, when selecting the thick diameter diamond wire T1 according to the wire diameter D of the diamond wire T, it includes:

[0019] Select a diamond wire with a wire diameter that is 2-3 μm larger than the wire diameter D of the diamond wire T as the thick diameter diamond wire T1.

[0020] As a preferred embodiment of the present application, when setting the running tension according to the cutting tension, it includes:

[0021] Add 0.3-0.5 N to the cutting tension N as the running tension.

[0022] As a preferred embodiment of the present application, after starting the main roller to run according to the running tension, it includes:

[0023] Gently push the coarse diameter diamond wire T1 with a blade, and make the coarse diameter diamond wire T1 fall into the adjacent main roller wire groove gradually to form the first local dense wire net.

[0024] As a preferred embodiment of the present application, when forming the first local dense wire net, it comprises:

[0025] When the number of the coarse diameter diamond wire T1 to be fallen into the adjacent main roller wire groove is greater than 20, it is considered that the first local dense wire net is formed.

[0026] As a preferred embodiment of the present application, when fixing the front end of the second local dense wire net, it comprises:

[0027] Fix 2-3 coarse diameter diamond wires T1 at the front end of the second local dense wire net.

[0028] As a preferred embodiment of the present application, when setting the thermal cutting tension according to the cutting tension to heat the thermal cutter, it comprises:

[0029] Set the thermal cutting tension to 1.3-1.4 times of the cutting tension N.

[0030] As a preferred embodiment of the present application, when connecting the wire head of the diamond wire T with the wire head of the coarse diameter diamond wire T1 at the pay-off end, it comprises:

[0031] Connect the wire head of the diamond wire T with the wire head of the coarse diameter diamond wire T1 at the pay-off end by knotting, soldering with a soldering iron or twisting.

[0032] As a preferred embodiment of the present application, when passing through the first guide wheel, it comprises:

[0033] Pass through the first wire guide wheel, the first tension wheel and the first guide wheel in sequence.

[0034] The first guide wheel comprises the first wire guide wheel, the first tension wheel and the first guide wheel.

[0035] As a preferred embodiment of the present application, when passing through the second guide wheel, it comprises:

[0036] Pass through the second guide wheel, the second tension wheel and the second wire guide wheel in sequence.

[0037] The second guide wheel comprises the second wire guide wheel, the second tension wheel and the second guide wheel.

[0038] Compared with the prior art, the present application has the following beneficial effects:

[0039] (1) The present invention adopts a method of laying coarse diameter diamond wire and running wire with high tension, which effectively avoids the phenomenon that the diamond wire is easy to break and cannot fall completely to the bottom of the main roller groove during the wiring process, thereby improving the production efficiency and quality of silicon wafers.

[0040] (2) The wiring method provided by the present invention does not require modification of the equipment involved in the wiring of diamond wire saw, thereby solving the technical problems of easy breakage of diamond wire and incomplete fall to the bottom of the main roller groove without increasing the cost.

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0042] Figure 1 - This is a step diagram of the wiring method of the diamond wire saw according to an embodiment of the present invention;

[0043] Figure 2 - This is a schematic diagram of the diamond wire running process according to an embodiment of the present invention;

[0044] Figure 3 - is a top view of the dense wire mesh on the main roller in an embodiment of the present invention.

[0045] Explanation of reference numerals in the attached diagram: 1. Silicon rod; 2. Main roller; 3. Take-up reel; 4. Pay-off reel; 5. First guide roller; 6. First tension roller; 7. First guide roller; 8. Second guide roller; 9. Second tension roller; 10. Second guide roller; 11. Front end of main roller; 12. Rear end of main roller. Detailed Implementation

[0046] The wiring method for diamond wire saws provided by this invention, such as... Figure 1 As shown, it includes the following steps:

[0047] Step S1: Determine the cutting tension N and the wire diameter D of the diamond wire T based on the parameters of the main roller 2;

[0048] Step S2: Select a thicker diameter diamond wire T1 based on the wire diameter D of the diamond wire T;

[0049] Step S3: Fix the spool of thick-diameter diamond wire T1 onto the main shaft of the take-up reel 3;

[0050] Step S4: Rotate the main shaft of the take-up reel 3, pull out the end of the thick-diameter diamond wire T1, pass it around the first guide wheel, and fix the end of the thick-diameter diamond wire T1 on the rear end of the main roller 2.

[0051] Step S5: Set the running tension according to the cutting tension, and start the main roller 2 to run the wire according to the running tension to form the first local dense wire mesh;

[0052] Step S6: stop the rotation of the main roller 2, cut off the coarse diameter diamond wire T1 in front of the first local densely arranged wire net that does not fall into the wire groove of the main roller, form a second local densely arranged wire net, and fix the front end of the second local densely arranged wire net;

[0053] Step S7: continue to start the rotation of the main roller 2, form a large range densely arranged wire net, remove the fixation of the front end of the large range densely arranged wire net, and pull out the wire head of the coarse diameter diamond wire T1 from the front end of the large range densely arranged wire net, bypass the second guide roller, and fix it on the main shaft of the wire reel 4;

[0054] Step S8: set the thermal cutting tension according to the cutting tension, heat the thermal machine, and cut off the coarse diameter diamond wire T1 at the wire releasing end after the thermal machine is completed;

[0055] Step S9: fix the diamond wire T spool on the main shaft of the wire reel 4, connect the wire head of the diamond wire T with the wire head of the coarse diameter diamond wire T1 at the wire releasing end, start the rotation of the main roller 2, run the diamond wire T of the wire reel 4 to the wire collecting reel 3 at the cutting tension N, cut off the diamond wire T at the wire collecting end, remove the coarse diameter diamond wire T1 spool, fix the diamond wire T on the main shaft of the wire collecting reel 4, start the thermal machine, and complete the wiring.

[0056] The main principle of the present application is as follows:

[0057] (1) After determining the cutting tension N and the wire diameter D of the diamond wire T through the parameters of the main roller 2, the appropriate coarse diameter diamond wire T1 can be selected according to the wire diameter D of the diamond wire T, so that when the wire head of the diamond wire T is connected with the wire head of the coarse diameter diamond wire T1, the coarse diameter diamond wire T1 has all fallen to the groove bottom of the main roller wire groove, and the diamond wire T has a smaller wire diameter than the coarse diameter diamond wire T1, so that when the diamond wire T runs under the traction of the coarse diameter diamond wire T1, it can completely fall to the groove bottom of the main roller wire groove;

[0058] (2) Since the wire diameter D of the diamond wire T is determined by the parameters of the main roller 2, which includes the groove width of the main roller wire groove, the appropriate coarse diameter diamond wire T1 can be selected according to the wire diameter D of the diamond wire T, which can effectively avoid the mismatch between the wire diameter of the selected coarse diameter diamond wire T1 and the groove width of the main roller wire groove, so that it cannot completely fall to the groove bottom of the main roller wire groove;

[0059] (3) First, the wiring is completed by the coarse diameter diamond wire T1, and then the wiring of the diamond wire T is completed by the traction of the coarse diameter diamond wire T1. First, since a larger diameter diamond wire is used, a larger tension can be used for running, so that under the action of the large tension, the diamond wire can completely fall to the groove bottom of the main roller wire groove. When the diamond wire T is pulled to run, a smaller tension is used to run, so that the diamond wire T can completely fall to the groove bottom of the main roller wire groove, and the diamond wire T can be prevented from being easily broken when running due to excessive tension.

[0060] In the step S1, the parameters of the main roller 2 include the outer diameter, the main roller wire groove width, the main roller wire groove pitch, the round angle, etc.

[0061] In the step S2, when selecting the coarse diameter diamond wire T1 according to the wire diameter D of the diamond wire T, it includes:

[0062] The diamond wire with the wire diameter 2-3 μm larger than the wire diameter D of the diamond wire T is selected as the coarse diameter diamond wire T1.

[0063] Specifically, the wire diameter of the coarse diameter diamond wire T1 is only 2-3 μm larger than that of the diamond wire T, so that the coarse diameter diamond wire T1 is still matched with the main roller wire groove width and can completely fall to the bottom of the main roller wire groove. In addition, when running the wire with a larger tension (N+0.3-0.5 N), the wire diameter of 2-3 μm can withstand the large tension and is not prone to breakage during the wire running process.

[0064] In the step S3, the wire head of the coarse diameter diamond wire T1 is fixed on the rear end 12 of the main roller by adhesive tape. The position of the rear end 12 of the main roller is shown in Figure 3 .

[0065] In the step S5, when setting the running tension according to the cutting tension, it includes:

[0066] The running tension is 0.3-0.5 N larger than the cutting tension N.

[0067] Specifically, the running tension of N+0.3-0.5 N can ensure that the coarse diameter diamond wire T1 completely falls to the bottom of the main roller wire groove during the wire running process.

[0068] Preferably, the running tension is 0.3 N larger than the cutting tension N. The running tension of N+0.3 N can ensure that the coarse diameter diamond wire T1 completely falls to the bottom of the main roller wire groove during the wire running process, and the risk of breakage is lower compared with the running tension of N+0.5 N.

[0069] In the step S5, after starting the main roller 2 to run according to the running tension, it includes:

[0070] The coarse diameter diamond wire T1 is gently pushed by the blade, so that the coarse diameter diamond wire T1 gradually falls into the adjacent main roller wire groove to form a first local dense wire net.

[0071] In the step S5, when forming the first local dense wire net, it includes:

[0072] When the number of the coarse diameter diamond wire T1 falling into the adjacent main roller wire groove is greater than 20, it is considered that the first local dense wire net is formed.

[0073] Specifically, when the number of diamond wires falling into the wire slot of the adjacent main roller is greater than 20, the step of the diamond wire gradually running in front of the main roller 2 is basically consistent when the coarse-diameter diamond wire T1 continues to run, so that the coarse-diameter diamond wire T1 can fall into the wire slot of the adjacent main roller in turn.

[0074] In the step S6, the diamond wire in the first local densely-wired network before the front end is the diamond wire of the coarse-diameter diamond wire T1 that has not fallen into the wire slot of the main roller, because the diamond wire at the beginning is too far away from the wire slot of the main roller to be pushed into the wire slot of the main roller by the blade, and the diamond wire at the beginning can only be cut off. After the diamond wire at the beginning is removed, the coarse-diameter diamond wire T1 in the second local densely-wired network formed after the removal falls into the wire slot of the main roller.

[0075] In the step S6, the fixing of the front end of the second local densely-wired network includes:

[0076] The 2-3 coarse-diameter diamond wires T1 in the front end of the second local densely-wired network are fixed.

[0077] Specifically, the fixing of the front end of the second local densely-wired network is to maintain the current tension state of the second local densely-wired network, so that the coarse-diameter diamond wire T1 running subsequently can fall into the wire slot of the main roller when the main roller 2 continues to rotate, and a large-scale densely-wired network is formed. In addition, when the large-scale densely-wired network is formed, the coarse-diameter diamond wire T1 runs to the front end 11 of the main roller, and the position of the front end 11 of the main roller is as shown in FIG. 8. Figure 3

[0078] In the step S7, the removal of the fixing of the front end of the large-scale densely-wired network is the removal of the fixing of the front end of the second local densely-wired network, and after the fixing is removed, the diamond wire T1 at the head of the large-scale densely-wired network can be pulled out.

[0079] In the step S8, the hot cutting of the hot cutter according to the setting of the hot cutting tension includes:

[0080] The hot cutting tension of the hot cutter is set to 1.3-1.4 times of the cutting tension N.

[0081] Further, the hot cutting time is 5-10 min.

[0082] Specifically, the hot cutting with large tension can further ensure that the coarse-diameter diamond wire T1 falls to the bottom of the wire slot of the main roller, and the running of the diamond wire T1 is smoother, so that the diamond wire T1 can fall to the bottom of the wire slot of the main roller when the diamond wire T1 is pulled and run subsequently, and the running of the diamond wire T1 is smoother, so that the problem of easy breaking of the diamond wire T1 is avoided.

[0083] ​Preferably, the thermomechanical cutting tension is set to 1.4 times the cutting tension N. A thermomechanical cutting tension of 1.4 times N can achieve better wire dropping effect, while also being within the tolerable range of the thick-diameter diamond wire T1.

[0084] In step S9 above, when connecting the diamond wire T-end to the thicker diameter diamond wire T1 end at the pay-off end, the following steps are included:

[0085] Connect the T-end of the diamond wire to the T1-end of the thicker diameter diamond wire at the unwinding end by knotting, soldering, or twisting.

[0086] In step S9 above, the warm-up time is 2-3 minutes. After the wiring is completed, the crystal rod 1 can be cut normally.

[0087] In step S4 above, as Figure 2 As shown, when passing around the first guide wheel, it includes:

[0088] It passes sequentially around the first guide wheel 5, the first tension wheel 6, and the first guide wheel 7;

[0089] The first guide wheel includes a first guide wheel 5, a first tension wheel 6, and a first guide wheel 7.

[0090] In step S7 above, as Figure 2 As shown, when passing the second guide wheel, the following steps are included:

[0091] It passes sequentially around the second guide wheel 8, the second tension wheel 9, and the second guide wheel 10;

[0092] The second guide wheel includes a second guide wheel 8, a second tension wheel 9, and a second guide wheel 10.

[0093] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0094] (1) The present invention adopts a method of laying coarse diameter diamond wire and running wire with high tension, which effectively avoids the phenomenon that the diamond wire is easy to break and cannot fall completely to the bottom of the main roller groove during the wiring process, thereby improving the production efficiency and quality of silicon wafers.

[0095] (2) The wiring method provided by the present invention does not require modification of the equipment involved in the wiring of diamond wire saw, thereby solving the technical problems of easy breakage of diamond wire and incomplete fall to the bottom of the main roller groove without increasing the cost.

[0096] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A wiring method for a diamond wire saw, characterized in that, Includes the following steps: Based on the parameters of the main roller, determine the cutting tension N and the wire diameter D of the diamond wire T; A coarse-diameter diamond wire T1 is selected based on the wire diameter D of the diamond wire T; wherein, a diamond wire with a wire diameter 2-3 μm larger than the wire diameter D of the diamond wire T is selected as the coarse-diameter diamond wire T1. Fix the thick-diameter diamond wire T1 spool onto the main shaft of the take-up reel; Rotate the main shaft of the take-up reel to pull out the head of the coarse diameter diamond wire T1, pass it around the first guide wheel, and fix the head of the coarse diameter diamond wire T1 on the rear end of the main roller; The running tension is set according to the cutting tension, wherein the running tension is 0.3-0.5 Newtons added to the cutting tension N. The main roller is started to run the yarn according to the running tension to form a first local dense yarn network; wherein, the first local dense yarn network is considered to be formed after the number of coarse diameter diamond wires T1 falling into the groove of the adjacent main roller is greater than 20. Stop the rotation of the main roller, cut off the thick-diameter diamond wire T1 that did not fall into the main roller groove at the front end of the first local dense wire mesh to form a second local dense wire mesh, and fix the front end of the second local dense wire mesh. Continue to start the main roller to rotate, forming a large-area dense wire mesh. Remove the fixing at the front end of the large-area dense wire mesh, and pull out the head of the coarse-diameter diamond wire T1 from the front end of the large-area dense wire mesh. After passing around the second guide wheel, fix it on the main shaft of the pay-off wheel. The heat-engine cutting tension is set according to the cutting tension to perform heat-engine operation. After heat-engine operation is completed, the thick-diameter diamond wire T1 at the wire feeding end is cut off. The heat-engine cutting tension is set to 1.3-1.4 times the cutting tension N. Fix the diamond wire T spool to the main shaft of the pay-off reel, pull out the diamond wire T end and connect it to the coarse diameter diamond wire T1 end at the pay-off end, start the main roller to rotate, and use the cutting tension N to run the diamond wire T from the pay-off reel to the take-up reel, cut the diamond wire T at the take-up end, remove the coarse diameter diamond wire T1 spool, fix the diamond wire T to the main shaft of the take-up reel, turn on the heat generator, and complete the wiring.

2. The wiring method for a diamond wire saw according to claim 1, characterized in that, After starting the main roller to run the yarn according to the running tension, the process includes: The coarse-diameter diamond wire T1 is gently moved with a blade, causing it to gradually fall into the adjacent main roller groove, forming the first local dense wire mesh.

3. The wiring method for a diamond wire saw according to claim 1, characterized in that, When fixing the front end of the second local dense wiring network, the following steps are included: Fix the 2-3 thick-diameter diamond wires T1 at the front end of the second local dense wiring network.

4. The wiring method for a diamond wire saw according to claim 1, characterized in that, When connecting the diamond wire T-head to the thicker diameter diamond wire T1 head at the wire feeding end, the following steps are included: The diamond wire T-end is connected to the thicker diameter diamond wire T1 end at the unwinding end by knotting, soldering, or twisting.

5. The wiring method for a diamond wire saw according to claim 1, characterized in that, When passing around the first guide wheel, including: It passes sequentially around the first guide wheel, the first tension wheel, and the first guide wheel; The first guide wheel includes the first guide wheel, the first tension wheel, and the first guide wheel.

6. The wiring method for a diamond wire saw according to claim 1, characterized in that, When navigating around the second guide wheel, including: It passes sequentially around the second guide wheel, the second tension wheel, and the second guide wheel; The second guide wheel includes the second guide wheel, the second tension wheel, and the second guide wheel.

Citation Information

Patent Citations

  • Silicon wafer cutting system

    CN108972924A

  • Three-roller direct drive type diamond wire slicing machine

    CN111300672A