Electronic device assembly and its expansion component and heat dissipation module

Abstract

The present application provides an electronic device combination, an expansion assembly thereof and a heat dissipation module. The heat dissipation module comprises a flow guide housing and a fan. The flow guide housing comprises an input section, an output section and a connecting section connected between the input section and the output section. The extension direction of the input section and the extension direction of the output section form an included angle. The end of the input section and the end of the output section away from the connecting section are respectively inclined relative to the connecting section. The fan is accommodated in the connecting section.

Description

Technical Field

[0001] This case relates to electronic devices, expansion components, and heat dissipation modules. Background Technology

[0002] With the popularization of electronic products, users have increasingly diverse requirements for the performance of electronic devices. In order to meet the various needs of users, the number of electronic components in electronic devices is increasing. This has led to problems such as space configuration and heat dissipation within electronic devices. How to increase the configuration of electronic components in the limited space of electronic devices to improve performance, while also taking into account heat dissipation efficiency, is a problem that the inventors urgently want to solve. Summary of the Invention

[0003] This invention provides an expansion assembly, including a housing, a partition, multiple electronic components, and a heat dissipation module. The housing includes a base plate, a top plate, and an accommodating space between the base plate and the top plate. The partition is disposed within the accommodating space and parallel to the base plate, dividing the accommodating space into an upper partition and a lower partition. The electronic components are distributed in the upper and lower partitions, with one electronic component in the upper partition abutting against the partition. The heat dissipation module is disposed within the housing and includes a flow guide housing and a fan. The flow guide housing includes an input section and an output section connected together, the extension directions of the input section and the output section forming an angle. The flow guide housing is accommodated in the lower partition, and the output section abuts against the partition and one of the electronic components in the lower partition. The fan is disposed at the intersection of the input and output sections.

[0004] In some embodiments, the aforementioned base plate includes a port, the flow guide housing includes an edge that surrounds to form an open port, the edge abuts against the base plate, and the open mask covers the port.

[0005] In some embodiments, the aforementioned port includes a first port and a second port, with the first port corresponding to the position of the input segment and the second port corresponding to the position of the output segment.

[0006] In some embodiments, the aforementioned flow guide housing includes an inner surface facing the base plate, and the output section includes a first heat dissipation section and a second heat dissipation section. The inner surface has a first height between the first heat dissipation section and the opening, and the inner surface has a second height between the second heat dissipation section and the opening. The first height and the second height are different.

[0007] In some embodiments, the expansion component further includes heat dissipation fins disposed on the first heat dissipation section and the second heat dissipation section.

[0008] In some embodiments, the aforementioned first heat dissipation section abuts against the electronic component located in the lower partition, and the second heat dissipation section abuts against the partition corresponding to the position of the electronic component located in the upper partition.

[0009] In some embodiments, the first heat dissipation section is farther from the fan than the second heat dissipation section, and the first height is smaller than the second height.

[0010] In some embodiments, the aforementioned inner surface extends in an inclined direction toward the base plate between the first heat dissipation section and the second heat dissipation section.

[0011] In some embodiments, the aforementioned output segment further includes a third heat dissipation segment, the inner surface of which has a third height between the third heat dissipation segment and the opening, the third height being different from the first height and the second height.

[0012] In some embodiments, the aforementioned third heat dissipation section is closer to the fan than the first and second heat dissipation sections, and the third heat dissipation section abuts against another electronic component located in the lower compartment.

[0013] In some embodiments, the aforementioned third heat dissipation section is flush with the fan, and the third height is greater than the first height but less than the second height.

[0014] In some embodiments, the input section of the aforementioned flow guide housing includes an inlet section having a first end and a second end, the inner surface of the inlet section being inclined to the bottom plate, the second end being closer to the fan than the first end, and the height of the inner surface of the second end from the opening is greater than the height of the first end from the opening.

[0015] In some embodiments, the expansion component also includes heat dissipation fins disposed in the inlet section.

[0016] In some embodiments, the input section of the aforementioned flow guide housing further includes a confluence section located between the inlet section and the fan, with its inner surface having a second height from the opening, and the confluence section abutting against the partition.

[0017] In some embodiments, the aforementioned fan includes a housing having an air inlet and an air outlet perpendicular to each other, the air inlet facing inward and having a gap between it and the inward, and the air outlet facing the output section.

[0018] In some embodiments, the aforementioned inner surface corresponding to the fan has a second height from the opening.

[0019] In some embodiments, the aforementioned included angle is 90 degrees.

[0020] This application provides another expansion component, comprising a housing, a partition, multiple electronic components, and a heat dissipation module. The housing includes a base plate, a top plate, and an accommodating space between the base plate and the top plate. The partition is disposed within the accommodating space and parallel to the base plate, dividing the accommodating space into an upper partition and a lower partition. The electronic components are distributed across the upper and lower partitions, with one electronic component in the upper partition abutting against the partition. The heat dissipation module is disposed within the housing and includes a heat dissipation housing and a fan. The heat dissipation housing includes an input section and an output section connected in an L-shape. The heat dissipation housing is housed in the lower partition and fixed to the base plate, with the output section abutting against the partition and one of the electronic components in the lower partition. The fan is located at the intersection of the input and output sections.

[0021] This application also provides an electronic device assembly, including an expansion component and a main unit. The expansion component includes a first housing, a partition, multiple electronic components, a heat dissipation module, and a first connector. The main unit includes a second housing, a main circuit board, and a main connector. The first housing has a bottom plate, a top plate, and a first receiving space located between the bottom plate and the top plate, the top plate having an opening. The partition is disposed within the first receiving space and parallel to the bottom plate, dividing the first receiving space into an upper partition and a lower partition. The electronic components are distributed in the upper and lower partitions, with one of the electronic components in the upper partition abutting against the partition. The heat dissipation module is disposed within the housing and includes a heat dissipation housing and a fan. The heat dissipation housing includes an input section and an output section connected in an L-shape, the heat dissipation housing being received in the lower partition and fixed to the bottom plate, and the output section abutting against the partition and one of the electronic components in the lower partition. The fan is disposed at the intersection of the input section and the output section. The first connector is electrically connected to the first circuit board and protrudes from the opening into the top plate. The second housing has a second receiving space. The main circuit board is received within the second receiving space. The main connector is electrically connected to the main circuit board and is located on the surface of the second housing. When the main unit is installed in the expansion assembly, the second housing covers the top plate of the first housing and covers the opening, and the first connector is electrically connected to the main connector.

[0022] This application also provides a heat dissipation module, including a flow guide housing and a fan. The flow guide housing includes an input section, an output section, and a connecting section connecting the input section and the output section. The extension direction of the input section and the extension direction of the output section form an angle, and the ends of the input section and the output section away from the connecting section are respectively inclined relative to the connecting section. The fan is housed in the connecting section. Attached Figure Description

[0023] Figure 1 This is a perspective view of one embodiment of the electronic device assembly in this case.

[0024] Figure 2 An exploded perspective view of one embodiment of the electronic device assembly in this case. Figure 1 ;

[0025] Figure 3 An exploded perspective view of one embodiment of the electronic device assembly in this case. Figure 2 ;

[0026] Figure 4 For along Figure 1 A cross-sectional view drawn along section line 4-4;

[0027] Figure 5 This is a perspective view of an embodiment of an expansion component in the electronic device assembly of this case.

[0028] Figure 6 For along Figure 2 A cross-sectional view drawn along section line 6-6;

[0029] Figure 7 For along Figure 3 A cross-sectional view drawn along section line 7-7;

[0030] Figure 8 A partial structural diagram of one embodiment of the extended components in this case;

[0031] Figure 9 Partial structural exploded view of another embodiment of the extended component in this case. Figure 1 ;

[0032] Figure 10 Partial structural exploded view of another embodiment of the extended component in this case. Figure 2 ;

[0033] Figure 11 For along Figure 2 A schematic sectional view drawn along section line 11-11;

[0034] Figure 12 for Figure 11 A magnified view of a portion of point 12 selected in the center circle;

[0035] Figure 13 A perspective view of one embodiment of the heat dissipation module in the extended components of this case;

[0036] Figure 14 For along Figure 13 A cross-sectional view drawn using section line 14-14.

[0037] [Symbol Explanation]

[0038] E: Electronic devices

[0039] E1: Expansion Components

[0040] E2: Host

[0041] H: Shell

[0042] H1: First shell

[0043] H11: Top Plate

[0044] H111: Opening

[0045] H1111: First opening

[0046] H1112: Second opening

[0047] H112: Assembly slot

[0048] H113: Heat dissipation tube slot

[0049] H12: Base Plate

[0050] H121: Through port

[0051] H1211: First Exit

[0052] H1212: Second Exit

[0053] H13: First side

[0054] H14: Second side

[0055] H15: Third side

[0056] H16: Fourth side

[0057] H17: Waterproof cover plate

[0058] H2: Second shell

[0059] H21: First surface

[0060] H22: Second surface

[0061] A: Electronic components

[0062] A1: First circuit board

[0063] A2: First Connector

[0064] A3: Main Circuit Board

[0065] A4: Main Connector

[0066] A5: Second Circuit Board

[0067] A6: Battery

[0068] A7: Second Connector

[0069] A8: Disk Array

[0070] A9: Bus device

[0071] A10: Third Circuit Board

[0072] S: Storage space

[0073] S1: First accommodating space

[0074] S11: Upper partition

[0075] S12: Lower partition

[0076] S2: Second accommodating space

[0077] 10: Partition

[0078] 20: Waterproof parts

[0079] 30: Heat dissipation module

[0080] 30A: First heat dissipation module

[0081] 30B: Second heat dissipation module

[0082] 31: Fan

[0083] 311: Outer shell

[0084] 3111: Air Inlet

[0085] 3112: Air vent

[0086] 32: Heat pipe

[0087] 33: Flow guide shell

[0088] 331: Input segment

[0089] 3311: Entrance section

[0090] 3312: Convergence segment

[0091] 3313: First end

[0092] 3314: Second end

[0093] 332: Output segment

[0094] 3321: First heat dissipation section

[0095] 3322: Second heat dissipation section

[0096] 3323: Third heat dissipation section

[0097] 3324: Export Section

[0098] 333: Connecting Section

[0099] 334: Edge

[0100] 3341: Open Port

[0101] 335:Inside

[0102] 34: Heat dissipation fins

[0103] L1: First Height

[0104] L2: Second Altitude

[0105] L3: Third Altitude Detailed Implementation

[0106] See Figures 1 to 4 , Figure 1 This is a perspective view of one embodiment of the electronic device assembly in this case. Figure 2An exploded perspective view of one embodiment of the electronic device assembly in this case. Figure 1 ; Figure 3 An exploded perspective view of one embodiment of the electronic device assembly in this case. Figure 2 ; Figure 4 For along Figure 1 A cross-sectional view drawn using section line 4-4.

[0107] This invention provides an electronic device assembly comprising multiple overlapping electronic devices E. Each electronic device E includes a housing H and an electronic component A. Each housing H has a receiving space S, and the electronic component A is assembled within the receiving space S of each housing H. The electronic components A in adjacent housings H can form an electrical connection when the two housings H are overlapped and assembled. Therefore, the electronic device assembly eliminates the need for external wiring and utilizes the receiving spaces S of multiple electronic devices E to increase the number and types of assembled electronic components A, satisfying diverse electronic function expansion needs.

[0108] See Figure 4 In an electronic device assembly, each housing H and its internally configured electronic components A can be combined to form electronic devices E with different functional orientations. Electronic components A can be circuit boards, connectors, storage elements, or power supply elements with different functional orientations.

[0109] See Figure 1 In some embodiments, the electronic device assembly includes two electronic devices E, each of which includes a housing H. The following description uses an expansion component E1 and a main unit E2 as examples, but this is not a limitation of the present invention.

[0110] See Figure 4 For clarity, in some embodiments of the electronic device assembly that includes two electronic devices E, the housing H includes a first housing H1 and a second housing H2. The first housing H1 includes a first accommodating space S1, and the second housing H2 includes a second accommodating space S2. The first housing H1 is part of the expansion assembly E1, and the second housing H2 is part of the host E2.

[0111] See Figure 4 The electronic device assembly includes an expansion component E1 and a main unit E2. The expansion component E1 includes a first accommodating space S1, and the main unit E2 includes a second accommodating space S2. Different electronic components A are respectively disposed in the first accommodating space S1 and the second accommodating space S2. When the main unit E2 is assembled into the expansion component E1, the expansion component E1 and the main unit E2 are respectively abutted and electrically connected with one side of each other, thereby increasing the space in the electronic device assembly for assembling electronic components A and the functions that can be provided.

[0112] See Figure 3 and Figure 4In some embodiments, electronic component A includes a first circuit board A1 and a first connector A2 disposed in a first accommodating space S1 of expansion component E1, and a main circuit board A3 and a main connector A4 disposed in a second accommodating space S2 of host E2. In these embodiments, the main circuit board A3 may be a host board, and the first circuit board A1 may be various expansion circuit boards that can cooperate with the host board, but this invention is not limited thereto.

[0113] See Figure 3 and Figure 4 In these embodiments, the expansion component E1 includes a first housing H1, a first circuit board A1, and at least one first connector A2. The first housing H1 has a top plate H11 and a bottom plate H12 facing each other, forming a first accommodating space S1 between the top plate H11 and the bottom plate H12. The top plate H11 has an opening H111. The first circuit board A1 is disposed in the first accommodating space S1. The first connector A2 is electrically connected to the first circuit board A1, and the first connector A2 protrudes from the top plate H11 through the opening H111. It is worth noting that, as... Figure 3 The opening H111 shown is fitted with a plate corresponding to the outline shape of the opening H111. A through-hole is then provided on the plate for the first connector A2 to pass through, thereby preventing external moisture or dust from entering the interior of the first housing H1 through the opening H111. However, the opening H111 may also be without a plate so that different electronic components A inside the first housing H1 can pass through the opening H111. This invention is not limited to this.

[0114] See Figure 3 and Figure 4 The main unit E2 includes a second housing H2, a main circuit board A3, and at least one main connector A4. The second housing H2 has a first surface H21 and a second surface H22 facing each other, forming a second accommodating space S2 between the first surface H21 and the second surface H22. The main circuit board A3 is disposed in the second accommodating space S2. The main connector A4 is electrically connected to the main circuit board A3 and exposed on the second surface H22. When the main unit E2 is assembled into the expansion assembly E1, the second surface H22 of the second housing H2 covers the top plate H11 of the first housing H1 and covers the opening H111, and the first connector A2 is electrically connected to the main connector A4.

[0115] In this way, the main circuit board A3 of the host E2 is electrically connected to the first connector A2 of the expansion component E1 through the main connector A4, so that the host E2 can be electrically connected to the first circuit board A1 in the expansion component E1 to provide functional expansion, and the first accommodating space S1 and the second accommodating space S2 can be used together to increase the number and types of electronic components A, providing more diversified functions and meeting more diverse usage needs.

[0116] See Figures 1 to 4In some embodiments, the housing H of the expansion component E1 (i.e., the first housing H1) and the housing H of the main unit E2 (i.e., the second housing H2) are hexagonal cubic structures with corresponding external shapes. In these embodiments, the first housing H1 further includes a first side H13, a second side H14, a third side H15, and a fourth side H16 connected in sequence, which are respectively connected between the top plate H11 and the bottom plate H12 to form a first accommodating space S1. In these embodiments, the shape and size of the second surface H22 of the housing H (second housing H2) of the main unit E2 correspond to the shape and size of the top plate H11 and the bottom plate H12 of the first housing H1, thereby making the outer contours of the expansion component E1 and the main unit E2 flush and having an integral appearance after assembly. Furthermore, the position of the first connector A2 on the top plate H11 corresponds to the position of the main connector A4 on the second surface H22. In this way, when the expansion component E1 and the main unit E2 are overlapped, the first connector A2 can form an electrical connection with the main connector A4 to achieve the purpose of expansion.

[0117] See Figure 4 In some embodiments, the expansion component E1 further includes a partition 10, which is disposed parallel to the top plate H11 and the bottom plate H12 within the first accommodating space S1. Thus, the partition 10, located between the top plate H11 and the bottom plate H12, divides the first accommodating space S1 into an upper partition S11 and a lower partition S12. This allows the upper partition S11 and the lower partition S12 to be respectively configured with electronic components A of different functional orientations, providing more diversified functional expansion.

[0118] See Figure 4In some embodiments, electronic component A further includes a second circuit board A5, multiple batteries A6, and a second connector A7. In these embodiments, the first circuit board A1 is disposed on the upper partition S11 of the expansion component E1, the second circuit board A5 and each battery A6 are disposed on the lower partition S12 and electrically connected to each other, and the second connector A7 passes through the partition 10 and is electrically connected to the first circuit board A1 and the second circuit board A5. Thus, the electronic device assembly can be configured with a main circuit board A3, a first circuit board A1, and a second circuit board A5, providing diversified functional expansion. Furthermore, since the main circuit board A3 is electrically connected to the first circuit board A1, and the first circuit board A1 is electrically connected to the second circuit board A5 and each battery A6, the batteries A6 disposed in the first accommodating space S1 can simultaneously supply power to each electronic component A in both the first accommodating space S1 and the second accommodating space S2. Therefore, the second accommodating space S2 does not need to be equipped with batteries A6, increasing the flexibility of space utilization in the second accommodating space S2. It is worth noting that the first circuit board A1 and the second circuit board A5 can be replaced with circuit boards of different functional orientations depending on the usage requirements, such as bus circuit boards, display cards, network cards or disk array cards (RAID cards), but this case is not limited to this.

[0119] See Figure 2 In some embodiments, the expansion component E1 further includes a waterproof element 20, which is arranged around the opening H111. This ensures that external moisture cannot enter the first accommodating space S1 through the opening H111 of the expansion component E1, thus ensuring the waterproofness of the expansion component E1.

[0120] See Figure 5 In some embodiments, the first housing H1 has multiple openings H111. In these embodiments, the openings H111 include a first opening H1111 and a second opening H1112. The first opening H1111 is located in the middle of the top plate H11. Here, the middle position of the top plate H11 is not limited to the centroid of the top plate H11. The middle position of the top plate H11 means that the outer contour of the first opening H1111 does not abut against any of the first side H13, the second side H14, the third side H15, and the fourth side H16. In these embodiments, the first connector A2 is exposed through the first opening H1111.

[0121] See Figure 5 and Figure 6 The expansion component E1 of the electronic device assembly also includes a heat dissipation module 30 to dissipate heat from the internal electronic component A. In some embodiments, the heat dissipation module 30 includes a first heat dissipation module 30A and a second heat dissipation module 30B, with the first heat dissipation module 30A disposed near the top plate H11 (e.g., Figure 5 As shown), the second heat dissipation module 30B is positioned near the base plate H12 (as shown). Figure 6As shown in the figure, the heat dissipation module 30 effectively dissipates heat from the interior of the expansion component E1. It is worth noting that the expansion component E1 can be equipped with either the first heat dissipation module 30A or the second heat dissipation module 30B separately, or both the first heat dissipation module 30A and the second heat dissipation module 30B can be installed simultaneously; this invention is not limited to this.

[0122] See Figure 5 In some embodiments, the first heat dissipation module 30A includes a fan 31 and a heat pipe 32, the top plate H11 of the first housing H1 also includes an assembly slot H112, and the second opening H1112 is adjacent to any two of the first side H13, the second side H14, the third side H15, and the fourth side H16. See also Figure 5 A second opening H1112 is adjacent to the first side H13 and the second side H14. The assembly groove H112 is located at the position corresponding to the second opening H1112 and is recessed from the top plate H11 toward the bottom plate H12.

[0123] See Figure 5 and Figure 6 In these embodiments, the fan 31 of the first heat dissipation module 30A is disposed in the assembly slot H112. One end of the heat pipe 32 corresponds to the position of the fan 31, and the other end extends to the top plate H11 and corresponds to the position of the electronic component A inside the expansion component E1. In this way, the heat pipe 32 can absorb the heat generated by the electronic component A inside the expansion component E1 and conduct it to the position of the corresponding fan 31 for heat dissipation.

[0124] See Figure 5 and Figure 6 In some embodiments, the top plate H11 of the expansion component E1 further includes a heat dissipation groove H113. The heat dissipation groove H113 is recessed from the top plate H11 towards the bottom plate H12. One end of the heat dissipation groove H113 is connected to the second opening H1112, and the other end extends to the position of electronic component A of the expansion component E1. In this way, even if the top plate H11 of the expansion component E1 is equipped with heat dissipation pipes 32, the heat dissipation pipes 32 can still maintain their surface flatness because they are housed in the heat dissipation groove H113, ensuring that the host E2 can be stably assembled into the expansion component E1.

[0125] See Figure 4 and Figure 6 In some embodiments, the electronic component A of the electronic device assembly further includes a disk array A8. In these embodiments, the disk array A8 is housed within the upper partition S11 of the expansion component E1 and electrically connected to the first circuit board A1, and the disk array A8 is located between the assembly slot H112 and the third side H15. Here, the heat dissipation pipe 32 extends between the assembly slot H112 and the third side H15 to correspond to the position of the disk array A8, thereby effectively dissipating heat from the disk array A8.

[0126] See Figure 4 and Figure 6 In some embodiments, the number of disk arrays A8 is two. In these embodiments, the number of second openings H1112 on the top plate H11 and the number of first heat dissipation modules 30A are the same as the number of disk arrays A8. In these embodiments, the two disk arrays A8 are respectively assembled on both sides of the first circuit board A1 (e.g., Figure 4 This shows one of the disk arrays A8, where one second opening H1112 is adjacent to the first side H13 and the second side H14, and the other second opening H1112 is adjacent to the first side H13 and the fourth side H16. The heat dissipation pipes 32 of each first heat dissipation module 30A extend between the third side H15 and the two second openings H1112, thereby enabling the first heat dissipation module 30A to dissipate heat from the two disk arrays A8 housed in the upper partition S11.

[0127] See Figure 7 and Figure 8 , Figure 7 For along Figure 3 A cross-sectional view drawn along section line 7-7; Figure 8 This is a partial structural diagram of one embodiment of the extended components in this case. Figure 8 This is a schematic diagram of the first housing H1 without showing the top plate H11, revealing the configuration within the upper partition S11. In these embodiments, the electronic component A housed within the upper partition S11 of the electronic device assembly and electrically connected to the first circuit board A1 is a bus device A9 (e.g., a PCI-E card, a PCI-E interface graphics card, a PCI-E interface SSD, or other high-speed signal transmission device with a PCI-E interface). In these embodiments, the first heat dissipation module 30A includes a fan 31 housed within the upper partition S11, whereby the fan 31 is electrically connected to the first circuit board A1, and the fan 31 has an exhaust vent 3112 facing the bus device A9 to dissipate heat from the bus device A9.

[0128] See Figure 8 and Figure 9 In some embodiments where the first heat dissipation module 30A is housed in the upper partition S11 instead of in the second opening H1112, the first housing H1 does not include the assembly groove H112. In these embodiments, the first housing H1 also includes a waterproof cover plate H17. The shape and size of the waterproof cover plate H17 correspond to the shape and size of the second opening H1112. The waterproof cover plate H17 covers the second opening H1112, thereby sealing the second opening H1112 and ensuring the waterproofness of the first housing H1.

[0129] See Figures 10 to 12In some embodiments, the second heat dissipation module 30B is disposed within the lower partition S12 and can simultaneously dissipate heat from the electronic component A within both the upper partition S11 and the lower partition S12. In these embodiments, the electronic component A housed in the upper partition S11 abuts against the partition plate 10.

[0130] See Figures 10 to 12 The second heat dissipation module 30B includes a fan 31 and a flow guide housing 33. The flow guide housing 33 includes an input section 331 and an output section 332 connected to each other. The extension direction of the input section 331 and the extension direction of the output section 332 form an angle. The flow guide housing 33 is housed in the lower partition S12. The output section 332 abuts against the partition 10 and one of the electronic components A located in the lower partition S12. The fan 31 is disposed at the intersection of the input section 331 and the output section 332.

[0131] Therefore, when the fan 31 of the second heat dissipation module 30B is running, the airflow is introduced by the input section 331 of the airflow guide housing 33 and then output by the output section 332. The heat generated by the partition 10 that is pressed against by the output section 332 and the electronic component A located in the lower partition S12 can be discharged outside the expansion component E1 by the airflow. The second heat dissipation module 30B can simultaneously dissipate heat from the electronic component A housed in the upper partition S11 and the lower partition S12, reducing the space occupied by the heat dissipation structure or internal airflow guide device and improving the utilization rate of the internal space of the electronic device assembly.

[0132] See Figure 10 and cooperate Figure 13 In some embodiments, the input section 331 and output section 332 of the airflow guide housing 33 are connected in an L-shape. That is, the angle between the extending directions of the input section 331 and the output section 332 is 90 degrees. In this way, the position where the airflow is introduced into the second heat dissipation module 30B and the position where the airflow is discharged for heat dissipation are not on the same straight line, which can meet the position configuration requirements of different electronic components A in the lower partition S12.

[0133] See Figure 10 and Figure 13 In some embodiments, the airflow guide housing 33 includes a connecting section 333 located between the input section 331 and the output section 332, and the fan 31 is housed within the connecting section 333. In these embodiments, the ends of the input section 331 and the output section 332 furthest from the connecting section 333 are respectively inclined relative to the connecting section 333. This allows the connecting section 333 and the portions between the input section 331, the output section 332, and the connecting section 333 to be configured with a depth to collect and guide airflow, while the ends of the input section 331 and the output section 332 furthest from the connecting section 333 can be close to the assembly position of the airflow guide housing 33 to smoothly guide airflow input and output.

[0134] See Figure 10 and Figure 13In some embodiments, the flow guide housing 33 includes an edge 334 that surrounds an opening 3341. The input section 331, output section 332, and connecting section 333 are located within the opening 3341. In these embodiments, the base plate H12 of the first housing H1 of the expansion component E1 includes multiple openings H121. The flow guide housing 33 abuts against the base plate H12 of the first housing H1 with its edge 334, and the opening 3341 covers the openings H121. This allows airflow to smoothly enter and exit the flow guide housing 33 from the base plate H12 of the first housing H1, ensuring the flow guidance and heat dissipation effects of the flow guide housing 33.

[0135] See Figure 7 and cooperate Figure 10 In some embodiments, the opening H121 of the bottom plate H12 of the first housing H1 includes a plurality of first openings H1211 and a plurality of second openings H1212. The position of each first opening H1211 corresponds to the position of the input section 331, and the position of each second opening H1212 corresponds to the position of the output section 332, thereby ensuring the smooth flow of air into and out of the guide housing 33.

[0136] See Figures 12 to 14 In some embodiments, the flow guide housing 33 includes an inner surface 335. When the flow guide housing 33 is assembled onto the base plate H12 of the first housing H1, the inner surface 335 faces the base plate H12. The inner surface 335 is configured with different depths to abut against different electronic components A to simultaneously dissipate heat from multiple electronic components A. In these embodiments, the output section 332 includes a first heat dissipation section 3321 and a second heat dissipation section 3322. The inner surface 335 has a first height L1 between the first heat dissipation section 3321 and the opening 3341, and a second height L2 between the inner surface 335 and the second heat dissipation section 3322 and the opening 3341. The first height L1 and the second height L2 are different. In this way, the flow guide housing 33 can simultaneously contact the electronic components A located in the lower partition S12 and the upper partition S11 through the first heat dissipation section 3321 and the second heat dissipation section 3322, and can simultaneously dissipate heat from the electronic components A located in the upper partition S11 and the lower partition S12.

[0137] See Figure 12 and Figure 14In these embodiments, the first height L1 is less than the second height L2, meaning that the distance between the inner surface 335 and the first heat dissipation section 3321 and the opening 3341 is less than the distance between the inner surface 335 and the second heat dissipation section 3322 and the opening 3341. The first heat dissipation section 3321 is closer to the bottom plate H12 than the second heat dissipation section 3322. Therefore, the first heat dissipation section 3321 of the flow guide housing 33 abuts against the electronic component A located in the lower partition S12, and the second heat dissipation section 3322 abuts against the partition 10, with the position of the second heat dissipation section 3322 corresponding to the position of the electronic component A located in the upper partition S11.

[0138] See Figure 12 In embodiments where the electronic component A located within the upper partition S11 is a bus device A9, the bus device A9 abuts against the partition 10, and the second heat dissipation section 3322 of the flow guide housing 33 abuts against the partition 10 at the position corresponding to the bus device A9 to dissipate heat from the bus device A9. In these embodiments, the electronic component A of the expansion component E1 also includes a third circuit board A10, which is disposed in the lower partition S12 and parallel to and spaced apart from the second circuit board A5. The third circuit board A10 is closer to the base plate H12 than the second circuit board A5. Here, the first heat dissipation section 3321 of the flow guide housing 33 abuts against the third circuit board A10 to dissipate heat from the third circuit board A10. In this way, multiple electronic components A can be stacked in the lower partition S12 of the expansion component E1, and can still be adequately dissipated by the second heat dissipation module 30B, ensuring that each electronic component A can operate smoothly and reliably provide the expansion function of the expansion component E1.

[0139] See Figures 12 to 14 In some embodiments, the output section 332 of the flow guide housing 33 further includes a third heat dissipation section 3323. The first heat dissipation section 3321, the second heat dissipation section 3322 and the third heat dissipation section 3323 of the output section 332 are connected in sequence, and the output section 332 is connected to the fan 31 via the third heat dissipation section 3323. In this way, the gas enters from the input section 331 of the flow guide housing 33, then enters the fan 31, and is then discharged in sequence from the third heat dissipation section 3323, the second heat dissipation section 3322 and the first heat dissipation section 3321 of the output section 332. In this way, the electronic component A that is against the first heat dissipation section 3321, the second heat dissipation section 3322 and the third heat dissipation section 3323 can be cooled by the flow guide housing 33.

[0140] See Figures 12 to 14In some embodiments, the inner surface 335 of the flow guide housing 33 has a third height L3 between the third heat dissipation section 3323 and the opening 3341. The third height L3 is different from the first height L1 and the second height L2. Therefore, each electronic component A, which is cooled by the first heat dissipation section 3321, the second heat dissipation section 3322, and the third heat dissipation section 3323, can be located at different heights, but all are still adequately cooled by the flow guide housing 33. In these embodiments, the third heat dissipation section 3323 abuts against the second circuit board A5, but this invention is not limited to this.

[0141] See Figures 12 to 14 In some embodiments, the fan 31 is a centrifugal fan and includes a housing 311. The housing 311 has an air inlet 3111 and an air outlet 3112 that are perpendicular to each other. The third heat dissipation section 3323 of the output section 332 of the air guide housing 33 is flush with the air outlet 3112 of the fan 31. In this way, the airflow output from the air outlet 3112 of the fan 31 can smoothly enter the output section 332 through the third heat dissipation section 3323, thereby improving the smoothness of airflow.

[0142] See Figures 12 to 14 In some embodiments where the third heat dissipation section 3323 of the airflow guide housing 33 is flush with the fan 31, the third height L3 is greater than the first height L1 and less than the second height L2. This allows the gas entering the output section 332 from the fan 31 to accumulate in large quantities in the second heat dissipation section 3322 after passing through the third heat dissipation section 3323, significantly dissipating heat from the electronic component A at the corresponding position on the partition 10, and then being discharged through the first heat dissipation section 3321 closest to the base plate H12.

[0143] See Figures 12 to 14 In some embodiments, the input section 331 of the flow guide housing 33 includes an inlet section 3311 and a confluence section 3312 connected in sequence. The confluence section 3312 connects the inlet section 3311 and the connecting section 333 and is flush with the connecting section 333. In these embodiments, the fan 31 is disposed within the connecting section 333 with its air inlet 3111 facing the inner surface 335, and there is a gap between the air inlet 3111 of the fan 31 and the inner surface 335. Thus, gas is guided through the input section 331 of the flow guide housing 33 to enter the fan 31, allowing the fan 31 to generate an active airflow.

[0144] See Figures 12 to 14In some embodiments, the inner surface 335 of the flow guide housing 33 also has a second height L2 at the distance from the opening 3341 between the confluence section 3312 and the connecting section 333. This allows the confluence section 3312 to collect a large amount of gas introduced from the inlet section 3311 and input it into the fan 31, increasing the gas flow rate and heat dissipation efficiency through the flow guide housing 33. Furthermore, since the connecting section 333 also has a second height L2, when the flow guide housing 33 is assembled in the lower partition S12, the connecting section 333 can also abut against the partition 10, increasing the area of ​​the partition 10 abutting against the flow guide housing 33. This not only improves the support of the partition 10 but also enhances the heat dissipation efficiency of the electronic components A abutting against the partition 10.

[0145] See Figures 12 to 14 In some embodiments, the second heat dissipation module 30B further includes multiple heat dissipation fins 34, each heat dissipation fin 34 being disposed within the flow guide housing 33. In these embodiments, multiple heat dissipation fins 34 are respectively disposed within the first heat dissipation section 3321, the second heat dissipation section 3322, and the inlet section 3311 of the flow guide housing 33, and the heat dissipation fins 34 in the first heat dissipation section 3321, the second heat dissipation section 3322, and the inlet section 3311 are parallel and spaced apart from each other. This increases the contact area between the gas and the flow guide housing 33, improving heat dissipation efficiency.

[0146] See Figures 12 to 14 In some embodiments, the inlet section 3311 of the input section 331 of the flow guide housing 33 has a first end 3313 and a second end 3314. The second end 3314 is closer to the fan 31 and connected to the fan 31 than the first end 3313. The height of the inner surface 335 at the second end 3314 from the opening 3341 is greater than the height of the first end 3313 from the opening 3341. The first end 3313 and the second end 3314 are inclined, thereby making the inlet section 3311 inclined to the bottom plate H12. In this way, the inlet section 3311 extends inclined to the bottom plate H12, and gas is introduced through the first opening H1211 of the bottom plate H12, improving the smoothness of entering the flow guide housing 33.

[0147] See Figures 12 to 14 In some embodiments, the output section 332 of the flow guide housing 33 further includes an outlet section 3324, which is connected to and inclined to the first heat dissipation section 3321, thereby making the outlet section 3324 extend inclinedly to the base plate H12. In this way, the outlet section 3324 extends inclinedly to the base plate H12, and gas is introduced through the second port H1212 of the base plate H12, improving the smoothness of gas output from the flow guide housing 33.

[0148] See Figures 12 to 14In some embodiments, the inner surface 335 of the flow guide housing 33 extends in the direction between the first heat dissipation section 3321 and the second heat dissipation section 3322, inclined relative to the base plate H12. This ensures that the gas in the second heat dissipation section 3322, which is furthest from the opening 3341, can flow smoothly to the first heat dissipation section 3321, ensuring smooth airflow for heat dissipation.

[0149] Although this disclosure has been presented above with reference to some embodiments, it is not intended to limit the scope of this disclosure. Anyone skilled in the art can make modifications and refinements without departing from the spirit and scope of this disclosure. Therefore, the scope of patent protection in this case shall be determined by the scope defined in the appended claims.

Claims

1. An expansion component, characterized in that, include: A housing includes a bottom plate, a top plate, and an accommodating space located between the bottom plate and the top plate; A partition is disposed within the accommodating space and parallel to the bottom plate, dividing the accommodating space into an upper partition and a lower partition; Multiple electronic components are distributed in the upper and lower partitions, with one of the electronic components in the upper partition abutting against the partition. as well as A heat dissipation module, disposed within the housing, includes: A flow guide housing includes an input section and an output section connected together, the extension direction of the input section and the extension direction of the output section forming an angle, the flow guide housing being housed in a lower partition, and the output section abutting against the partition and one of the electronic components located in the lower partition; and A fan is located at the intersection of the input section and the output section.

2. The expansion component as claimed in claim 1, characterized in that, The base plate includes multiple openings, the flow guide housing includes an edge that surrounds to form an open opening, the edge abuts against the base plate, and the open mask covers the multiple openings.

3. The expansion component as described in claim 2, characterized in that, The plurality of ports includes a plurality of first ports and a plurality of second ports, wherein the plurality of first ports correspond to the position of the input segment and the plurality of second ports correspond to the position of the output segment.

4. The expansion component as described in claim 2, characterized in that, The flow guide housing includes an inner surface facing the base plate. The output section includes a first heat dissipation section and a second heat dissipation section. The inner surface has a first height between the first heat dissipation section and the opening, and the inner surface has a second height between the second heat dissipation section and the opening. The first height and the second height are different.

5. The expansion component as claimed in claim 4, characterized in that, It also includes multiple heat dissipation fins, which are disposed in the first heat dissipation section and the second heat dissipation section.

6. The expansion component as claimed in claim 4, characterized in that, The first heat dissipation section abuts against the electronic component located in the lower partition, and the second heat dissipation section abuts against the partition corresponding to the position of the electronic component located in the upper partition.

7. The expansion component as claimed in claim 4, characterized in that, The first heat dissipation section is farther away from the fan than the second heat dissipation section, and the first height is smaller than the second height.

8. The expansion component as claimed in claim 7, characterized in that, The inner surface extends in an inclined direction between the first heat dissipation section and the second heat dissipation section, which is inclined to the base plate.

9. The expansion component as claimed in claim 4, characterized in that, The output section also includes a third heat dissipation section, and the inner surface has a third height between the third heat dissipation section and the opening, the third height being different from the first height and the second height.

10. The expansion component as claimed in claim 9, characterized in that, The third heat dissipation section is closer to the fan than the first and second heat dissipation sections, and the third heat dissipation section abuts against another electronic component located in the lower compartment.

11. The expansion component as claimed in claim 9, characterized in that, The third heat dissipation section is flush with the fan, and its height is greater than the first height but less than the second height.

12. The expansion component as claimed in claim 4, characterized in that, The inlet section of the flow guide housing includes an inlet section having a first end and a second end. The inner surface of the inlet section is inclined to the bottom plate. The second end is closer to the fan than the first end, and the height of the inner surface at the second end from the opening is greater than the height of the first end from the opening.

13. The expansion component as claimed in claim 12, characterized in that, It also includes multiple heat dissipation fins located in the inlet section.

14. The expansion component as claimed in claim 13, characterized in that, The inlet section of the flow guide housing also includes a confluence section located between the inlet section and the fan, the inner surface of which has the second height at a distance from the opening, and the confluence section abuts against the partition.

15. The expansion component as claimed in claim 4, characterized in that, The fan includes a housing having an air inlet and an air outlet perpendicular to each other. The air inlet faces the inner surface and has a gap between it and the inner surface, while the air outlet faces the output section.

16. The expansion component as claimed in claim 15, characterized in that, The inner surface has the second height at the distance from the fan to the opening.

17. The expansion component as claimed in claim 1, characterized in that, The included angle is 90 degrees.

18. An expansion component, characterized in that, Include: A housing includes a bottom plate, a top plate, and an accommodating space located between the bottom plate and the top plate; A partition is disposed within the accommodating space and parallel to the bottom plate, dividing the accommodating space into an upper partition and a lower partition; Multiple electronic components are distributed in the upper and lower partitions, with one of the electronic components in the upper partition abutting against the partition; and A heat dissipation module, disposed within the housing, includes: A flow guide housing includes an input section and an output section connected in an L-shape. The flow guide housing is housed in the lower partition and fixed to the base plate, and the output section abuts against the partition and one of the electronic components located in the lower partition; and A fan is located at the intersection of the input section and the output section.

19. An electronic device assembly, characterized in that, include: An expansion component includes: A first housing has a bottom plate, a top plate, and a first receiving space located between the bottom plate and the top plate. The top plate has an opening, and a first circuit board is disposed in the first receiving space. A partition is disposed within the first accommodating space and parallel to the bottom plate, dividing the first accommodating space into an upper partition and a lower partition; Multiple electronic components are distributed in the upper and lower partitions, with one of the electronic components in the upper partition abutting against the partition. A heat dissipation module, disposed within the housing, includes: A flow guide housing includes an input section and an output section connected in an L-shape. The flow guide housing is housed in the lower partition and fixed to the base plate, and the output section abuts against the partition and one of the electronic components located in the lower partition; and A fan is positioned at the intersection of the input and output sections; and A first connector, electrically connected to the first circuit board and exposed through the opening in the top plate; and A host computer, including: A second housing having a second accommodating space; A main circuit board is housed within the second accommodating space; and A main connector is electrically connected to the main circuit board and is disposed on the surface of the second housing. When the main unit is installed in the expansion assembly, the second housing covers the top plate of the first housing and covers the opening, and the first connector is electrically connected to the main connector.

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