Silicon wafer feeding machine

Abstract

This invention provides a silicon wafer feeding machine, comprising a feeding body, a transmission unit, a loading unit, and a transfer unit. The transmission unit includes a first transmission mechanism and a second transmission mechanism. On one hand, the integrated first and second transmission mechanisms within the feeding body enable simultaneous unloading of empty silicon wafer baskets and loading of loaded silicon wafer baskets at the same location, significantly improving efficiency and reducing the impact on silicon wafer processing efficiency. Simultaneously, the transfer unit receives empty silicon wafer baskets from the first transmission mechanism and transfers them to a third transmission mechanism for silicon wafer loading, and receives loaded silicon wafer baskets from the third transmission mechanism and transfers them to the second transmission mechanism, thereby realizing a continuous conveying cycle of input, loading, and output of empty silicon wafer baskets, further improving silicon wafer supply efficiency.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and in particular to a silicon wafer feeding machine. Background Technology

[0002] Silicon wafers are an indispensable material in the photovoltaic industry. In recent years, the rapid development of my country's photovoltaic installation market has effectively boosted the demand for photovoltaic raw materials, including silicon wafers. This, in turn, places higher demands on the production capacity of silicon wafer processing companies.

[0003] Upgrading each processing step on the silicon wafer production line is an effective way to improve silicon wafer processing efficiency, but the efficiency of the silicon wafers supplied to the production line cannot be ignored. If the silicon wafer supply efficiency is low, the silicon wafer processing efficiency will also decrease accordingly.

[0004] In existing technologies, AGVs typically retrieve empty silicon wafer baskets from downstream workstations on the processing line and transport them upstream of the silicon wafer supply equipment. Then, they retrieve baskets containing silicon wafers from downstream of the supply equipment and finally transport them back upstream of the processing line. This process significantly reduces silicon wafer supply efficiency. This is mainly due to two factors: firstly, the AGVs need to move between upstream and downstream of the supply equipment, wasting time; secondly, the non-overlapping time between unloading and loading silicon wafer baskets also wastes time. These factors lead to reduced silicon wafer supply efficiency, which may consequently reduce silicon wafer processing efficiency. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention discloses a silicon wafer feeding machine.

[0006] To achieve the above objectives, this application provides a silicon wafer feeding machine, comprising:

[0007] The feeding body has a conveying channel inside for transporting silicon wafer baskets;

[0008] The transmission unit includes at least one first transmission mechanism and at least one second transmission mechanism disposed within the transmission channel; the first transmission mechanism and the second transmission mechanism are arranged along the length direction of the transmission channel;

[0009] The feeding unit includes a feeding support and at least one third transmission mechanism disposed on the feeding support;

[0010] A transfer unit is located between the loading unit and the transmission unit to receive an empty silicon wafer basket transmitted by the first transmission mechanism and transfer it to the third transmission mechanism for silicon wafer loading, and to receive a loaded silicon wafer basket transmitted by the third transmission mechanism and transfer it to the second transmission mechanism.

[0011] Beneficial Effects: The silicon wafer feeding machine provided by this invention includes a feeding body, a transmission unit, a loading unit, and a transfer unit. The transmission unit includes a first transmission mechanism and a second transmission mechanism. On one hand, the integrated first and second transmission mechanisms within the feeding body enable simultaneous unloading of empty silicon wafer baskets and loading of loaded silicon wafer baskets at the same location, significantly improving efficiency and reducing the impact on silicon wafer processing efficiency. Simultaneously, the transfer unit receives empty silicon wafer baskets from the first transmission mechanism and transfers them to the third transmission mechanism for silicon wafer loading, and receives loaded silicon wafer baskets from the third transmission mechanism and transfers them to the second transmission mechanism, thereby realizing a continuous conveying cycle of input, loading, and output of empty silicon wafer baskets, further improving silicon wafer supply efficiency. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a silicon wafer feeding machine.

[0013] Figure 2 This is a cross-sectional view of a silicon wafer feeding machine.

[0014] Figure 3 This is a top view of the first conveying component.

[0015] Figure 4 This is a schematic diagram of the structure of the first conveying component.

[0016] Figure 5 This is a side view of the second side panel.

[0017] Figure 6 This is a schematic diagram of the ferry unit.

[0018] Figure 7 This is a cross-sectional view of the ferry unit.

[0019] Figure 8 This is a structural diagram of the lifting mechanism without the lifting support.

[0020] Figure 9 This is a structural schematic diagram of the lifting component.

[0021] Figure 10 This is a cross-sectional view of the lifting mechanism without the lifting support.

[0022] Figure 11 This is a schematic diagram of the transition mechanism.

[0023] Figures 1 to 11The reference numerals in the attached drawings are as follows: feeding body 1, conveying channel 11, first channel 111, second channel 112, side door 12, transmission unit 2, first transmission mechanism 21, first conveying assembly 211, support body 2111, conveying bracket 21111, transverse bracket 21112, support bracket 21113, mounting side plate 2112, first side plate 21121, second side plate 21122, chute 211221, conveying wheel set 2113, drive shaft 21131, drive wheel 21132, driven shaft 21133, driven wheel 21134, conveyor belt 2114, power source 2115, threaded part 2116, second transmission mechanism 22, second conveying assembly 221, feeding unit 3, feeding support 31, third transmission mechanism 32, and... The following components are included: three conveying components 321, a transfer unit 4, a lifting mechanism 41, a lifting main body 411, a rear part of the main body 4111, a rear part 41111, a side part 41112, a top part of the main body 4112, a bottom part of the main body 4113, a front part of the main body 4114, a groove-shaped space 4115, a gap 4116, a lifting component 412, a sliding part 4121, a sliding groove 41211, a connecting part 4122, a lead screw through hole 41221, a stepped structure 41222, a mounting slot 41223, a lifting drive component 413, a drive motor 4131, a lead screw 4132, a lead screw nut 4133, a lifting bracket 414, a lifting column 415, a fourth transmission mechanism 42, a fourth conveying component 421, an air purification device 5, a transition mechanism 6, a transition bracket 61, and a transition roller 62. Implementation

[0024] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings and embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0025] like Figure 1 and Figure 2 As shown, this embodiment provides a silicon wafer feeding machine. The silicon wafer feeding machine includes a feeding body 1, a transmission unit 2, a feeding unit 3, and a transfer unit 4.

[0026] The feeding body 1 contains a conveying channel 11 for transporting silicon wafer baskets. Specifically, the feeding body 1 adopts a frame structure made of profiles. By covering the outer frame of the frame structure with a metal plate or a transparent rigid plate, a transverse conveying channel 11 is formed inside the feeding body 1. The length direction of the conveying channel 11 is consistent with the length direction of the feeding body 1. Of course, for the frame structure feeding body 1, its side can be designed as a push-pull or rotating side door 12 to facilitate access to the conveying channel 11 for maintenance and cleaning.

[0027] The transmission unit 2 includes at least one first transmission mechanism 21 and at least one second transmission mechanism 22. In this embodiment, two first transmission mechanisms 21 and two second transmission mechanisms 22 are provided, both arranged along the length of the conveying channel 11. In actual use, the number of first transmission mechanisms 21 and second transmission mechanisms 22 can be adjusted in a timely manner according to the processing technology of the processing line or other factors. Specifically, the first transmission mechanism 21 and the second transmission mechanism 22 can be arranged horizontally side by side, or they can be arranged in parallel layers. In this embodiment, the first transmission mechanism 21 and the second transmission mechanism 22 are arranged in parallel layers, wherein the first transmission mechanism 21 is located below the second transmission mechanism 22, and the operating directions of the first transmission mechanism 21 and the second transmission mechanism 22 are opposite. Specifically, the transmission direction of the first transmission mechanism 21 is from the outside of the feeding body 1 to the inside of the feeding body 1. The transmission direction of the second transmission mechanism 22 is from the inside of the feeding body 1 to the outside of the feeding body 1. That is to say, the input end of the first transmission mechanism 21 and the output end of the second transmission mechanism 22 are on the same side.

[0028] In this embodiment, the first transmission mechanism 21 and the second transmission mechanism 22 have the same structure and can be constructed using roller conveyor or belt conveyor. Considering the stability during transmission, this embodiment uses belt conveyor for both the first and second transmission mechanisms 21. Since the first and second transmission mechanisms 21 have the same structure, only the specific structure of the first transmission mechanism 21 will be described below. In practical applications, the second transmission mechanism 22 can directly refer to the structure of the first transmission mechanism 21, only needing to ensure that the transmission direction of the second transmission mechanism 22 during operation is opposite to that of the first transmission mechanism 21.

[0029] The first conveying mechanism 21 includes at least one first conveying component 211 arranged along the length of the conveying channel 11. To indicate the conveying method of the first conveying component 211, its two ends are defined as a first end and a second end, respectively. The first conveying component 211 is configured to transfer the object it carries from the first end to the second end. It should be noted that the aforementioned first and second ends are only to indicate the conveying direction of the first conveying component 211, and do not imply that the first conveying component 211 can only achieve unidirectional conveying. It should be anticipated that the first conveying component 211 can achieve bidirectional conveying; however, during use, to ensure the directional conveying of the silicon wafer basket, the first conveying component 211 is controlled to achieve unidirectional conveying. Correspondingly, the second conveying mechanism 22 includes at least one second conveying component 221 arranged along the length of the conveying channel 11. Furthermore, the conveying direction of the second conveying component 221 is controlled to be opposite to the conveying direction of the first conveying component 211.

[0030] The structure of the first conveying component 211 will be described in detail below, specifically in conjunction with... Figures 3 to 5 The first conveying assembly 211 includes a support body 2111, a mounting side plate 2112, a conveying wheel set 2113, and a conveying belt 2114.

[0031] The supporting body 2111 is located within the conveying channel 11 of the feeding body 1. Specifically, the feeding body 1 has a bottom frame and a middle frame inside. The first conveying mechanism 21 is located on the bottom frame. A partition is laid on the middle frame to divide the conveying channel 11 of the feeding body 1 into a lower first channel 111 and an upper second channel 112. The second conveying mechanism 22 is located on the partition. The supporting body 2111 includes two conveying supports 21111 arranged along its own length, multiple transverse supports 21112 connecting the two conveying supports 21111, and a supporting support 21113 fixed to the bottom of the transverse supports 21112. The two conveying supports 21111 are arranged in parallel, and the width between them is slightly larger than the width of the silicon wafer basket to be supported. Furthermore, the top of the conveying support 21111 has a guide groove along its own length. The two ends of the transverse support 21112 are fixedly connected to the inner side of the conveying support 21111. The support body 2111 is fixed to the bottom frame parallel to the conveying bracket 21111 to support the transverse bracket 21112 and ensure that there is a certain distance between the bottom of the support body 2111 and the bottom frame.

[0032] The mounting side plate 2112 includes a first side plate 21121 and a second side plate 21122 respectively mounted on both ends of the support body 2111. The conveying wheel assembly 2113 includes a drive shaft 21131, a drive wheel 21132, a driven shaft 21133, and a driven wheel 21134. Each first conveying assembly 211 includes two first side plates 21121, which are respectively fixed to the outer side of the same end of the two conveying brackets 21111. The two ends of the drive shaft 21131 are rotatably connected to the two first side plates 21121, and one end of the drive shaft 21131 extends out of one of the first side plates 21121 and is connected to the power source 2115. The power source 2115 can be a motor, a reducer, and a sprocket connected in sequence. When the power source 2115 is started, the drive shaft 21131 rotates around its own axis. There are no strict restrictions on the power source 2115, as long as it can achieve the rotation of the drive shaft 21131. There are two drive wheels 21132, which are coaxially fixed to the drive shaft 21131, and these two drive wheels 21132 are opposite to the two conveying brackets 21111 mentioned above. Each first conveying assembly 211 includes two or four second side plates 21122. If two second side plates 21122 are used, they correspond to one driven shaft 21133. In this case, the arrangement of the second side plates 21122, driven shaft 21133, and driven wheels 21134 is a mirror image of the arrangement of the first side plates 21121, drive shaft 21131, and drive wheels 21132. This will not be described in detail here, but this arrangement is one implementation of this embodiment. The following focuses on the structure with four second side plates 21122. Each conveying bracket 21111 has a second side plate 21122 on its inner and outer sides at the end away from the first side plate 21121. There are two driven shafts 21133, both of which are shorter than the drive shaft 21131. These two driven shafts 21133 are respectively positioned to correspond to two conveyor supports 21111. Taking one driven shaft 21133 as an example, its two ends are connected to two second side plates 21122 at the end of one conveyor support 21111. There are two driven wheels 21134, corresponding to the two driven shafts 21133. The driven wheels 21134 are coaxially connected to the driven shafts 21133, and the driven shafts 21133 are positioned between the two second side plates 21122. A first conveyor assembly 211 uses two conveyor belts 2114. Each conveyor belt 2114 corresponds to a set of drive wheels 21132 and driven wheels 21134. Taking one conveyor belt 2114 as an example, its ends are connected to form a loop structure. Furthermore, the conveyor belt 2114 is positioned with a driving pulley 21132 and a driven pulley 21134 in sequence so that the upper part of the conveyor belt 2114 is located within the guide groove. The thickness of the conveyor belt 2114 is slightly greater than the depth of the guide groove.Thus, when the power source 2115 is started, the drive shaft 21131 drives the drive wheel 21132 to rotate, thereby causing the conveyor belt 2114 to run and achieve the conveying function. In this embodiment, the drive wheel 21132 and the driven wheel 21134 are synchronous pulleys, and the conveyor belt 2114 is a synchronous belt adapted to the synchronous pulleys.

[0033] During long-term use, the conveyor belt 2114 will undergo irreversible elastic deformation, leading to slack and affecting the conveying effect. Therefore, in this embodiment, the driven shaft 21133 and the second side plate 21122 are slidably connected, and the driven wheel 21134 is rotatably connected to the driven shaft 21133. The belt tension is adjusted by changing the distance between the driven shaft 21133 and the drive shaft 21131. The specific implementation is described below. Specifically, the second side plate 21122 has a groove 211221 along the conveying direction of the first conveying assembly 211. Simultaneously, the second side plate 21122 has a through hole extending from its end away from the first side plate 21121 towards the groove 211221. This through hole can be a stepped hole with an outer diameter larger than its inner diameter. The end of the driven shaft 21133 is inserted into the groove 211221 and slides in cooperation with it. Furthermore, the driven shaft 21133 has a threaded hole at its end along the length of the slide groove 211221. A threaded component 2116, such as a bolt, is inserted into the through hole. This threaded component 2116 is threadedly engaged with the threaded hole. Rotating the threaded component 2116 adjusts the position of the driven shaft 21133 in the slide groove 211221, thereby achieving tensioning of the conveyor belt 2114. Here, the applicant explains the advantages of using four second side plates 21122: on the one hand, the tension of one of the conveyor belts 2114 can be adjusted individually; on the other hand, when one of the conveyor belts 2114 needs to be replaced, it is easy to disassemble and assemble without affecting the other conveyor belts 2114, reducing labor intensity and maintenance efficiency, thereby reducing the downtime of the feeder and ensuring the working efficiency of the feeder.

[0034] The feeding unit 3 includes a feeding support 31 and at least one third transmission mechanism 32. The feeding support 31 is located at one end of the feeding body 1. The feeding support 31 can also be in the form of a frame structure. The third transmission mechanism 32 is located on the feeding support 31. Referring to the arrangement of the first transmission mechanism 21 and the second transmission mechanism 22, in this embodiment, there are two third transmission mechanisms 32. Each third transmission mechanism 32 includes at least one third conveying component 321. Specifically, in this embodiment, the third transmission mechanism 32 includes one third conveying component 321. The third conveying component 321 can be in the form of roller conveying or belt conveying. Specifically, in this embodiment, the third conveying component 321 adopts the same structure as the first conveying component 211, which will not be described in detail here. However, it should be noted that the transmission direction of the third conveying component 321 can change as the working process proceeds, that is, the transmission direction of the third conveying component 321 is bidirectional.

[0035] The transfer unit 4 is located between the loading unit 3 and the transmission unit 2. After the first transmission mechanism 21 obtains an empty silicon wafer basket from the outside of the feeding body 1, it transfers it to the third transmission mechanism 32 of the loading unit 3 via the transfer mechanism, and then the silicon wafers are loaded on the third transmission mechanism 32. After loading, the loaded silicon wafer basket is transferred to the second transmission mechanism 22 via the transfer mechanism, and then the feeding body 1 is transported through the second transmission mechanism 22. The aforementioned empty silicon wafer basket refers to the case where there are no silicon wafers in the silicon wafer basket; the loaded silicon wafer basket refers to the case where there are silicon wafers in the silicon wafer basket.

[0036] Specifically, in combination Figure 6 and Figure 7 In this embodiment, the transfer unit 4 includes a lifting mechanism 41 and a fourth transmission mechanism 42. The lifting mechanism 41 drives the fourth transmission mechanism 42 to move, thereby positioning the fourth transmission mechanism 42 at different heights. When the fourth transmission mechanism 42 is aligned with the first transmission mechanism 21, the first transmission mechanism 21 transfers its silicon wafer basket to the fourth transmission mechanism 42; when the fourth transmission mechanism 42 is aligned with the third transmission mechanism 32, the silicon wafers are transferred back to the third transmission mechanism 32, or the silicon wafer basket is retrieved from the third transmission mechanism 32; when the fourth transmission mechanism 42 is aligned with the second transmission mechanism 22, the fourth transmission mechanism 42 transfers its silicon wafer basket to the second transmission mechanism 22. In this embodiment, there are two fourth transmission mechanisms 42 arranged side by side, and each fourth transmission mechanism 42 includes a fourth conveying component 421. The fourth conveying component 421 can be in the form of roller conveyor or belt conveyor. Similarly, the fourth conveying component 421 in this embodiment also adopts the same structure as the first conveying component 211, and adopts a bidirectional transmission form, which will not be described in detail here.

[0037] The lifting mechanism 41 includes a lifting body 411, a lifting component 412, a lifting drive assembly 413, and a lifting bracket 414. The lifting body 411 is vertically arranged. Specifically, a vertical column is provided on one side of the feeding unit 3 within the feeding body 1, and the lifting body 411 is fixed to one side of the lifting column 415. The lifting component 412 is slidably engaged with the lifting body 411. Considering that when a cylinder or hydraulic cylinder is used for driving, the cylinder itself needs to occupy half of the lifting space, which would result in a shorter lifting component. In this embodiment, the lifting drive assembly 413 includes a drive motor 4131 mounted on the lifting body 411, a lead screw 4132 connected to the drive motor 4131, and a lead screw nut 4133 cooperating with the lead screw 4132. The lead screw 4132 and the drive motor 4131 can be connected via a coupling. The lead screw nut 4133 is fixedly connected to the lifting component 412. When the drive motor 4131 drives the lead screw 4132 to rotate, it in turn drives the lifting component 412 to rise and fall via the lead screw nut 4133. The lifting bracket 414 is fixedly connected to the lifting component 412, and the fourth transmission mechanism 42 is fixed on the lifting bracket 414. As the lifting component 412 rises and falls, the height of the fourth transmission mechanism 42 is adjusted to be flush with the first transmission mechanism 21, the second transmission mechanism 22, and the third transmission mechanism 32 as needed.

[0038] Considering that existing technologies may include lead screw-type lifting structures, these structures require the configuration of corresponding guide rods and sliders adapted to the guide rods to prevent the lifting component from rotating, thereby achieving lifting. This results in the guide rod not only having a guiding function but also bearing a large torque. This has a predictable adverse impact on the stability and service life of the lifting structure. Moreover, such lifting structures are usually exposed to the environment, making them highly susceptible to dust and solid particles adhering to the lead screw and lead screw nut, affecting their transmission efficiency. Therefore, this embodiment rationally optimizes the lifting body 411 and the lifting component 412 to reduce the above-mentioned adverse effects.

[0039] Specifically, in combination Figure 8 and Figure 10The lifting body 411 includes a rear portion 4111 with a generally concave cross-section, a top portion 4112 located at the top of the rear portion, a bottom portion 4113 located at the bottom of the rear portion, and a front portion 4114 located on the front side of the rear portion. The rear portion 4111 includes a rear portion 41111 and two side portions 41112 fixed to both sides of the rear portion. Generally, the rear portion 41111 and the side portions 41112 are integrally formed to form the rear portion 4111. The rear portion, top portion, and bottom portion surround and form a groove-shaped space 4115, the opening of which is opposite to the front portion 4114. The two ends of the front portion 4114 are connected to the top portion and the bottom portion, respectively. A gap 4116 exists between the front portion 4114 and the two side portions 41112 of the rear portion 4111. The lead screw 4132 extends along the length of the grooved space, and its two ends are rotatably connected to the top and bottom of the main body, respectively. The top end of the lead screw 4132 can extend beyond the top of the main body and then be connected to the drive motor 4131. The drive motor 4131, together with the transmission structure connected to it, is fixed to the top of the main body.

[0040] Combination Figures 8 to 10The lifting component 412 includes a sliding part 4121 that slides with the front part of the main body and a connecting part 4122 that is fixedly connected to the sliding part 4121. Generally, the sliding part 4121 and the connecting part 4122 are integrally formed to form the lifting component. The sliding part has a sliding groove 41211 from top to bottom that fits the front part of the main body, allowing the sliding part to slide up and down along the front part of the main body and placing the connecting part 4122 within the groove space 4115. The connecting part has a through hole 41221 that penetrates vertically through itself. This through hole 41221 is a through-hole structure, and its diameter is larger than the outer diameter of the lead screw 4132, thus providing space for the lead screw 4132 to rotate. Simultaneously, the connecting part 4122 has a mounting slot 41223 along the through hole from bottom to top, which fits the shape of the lead screw nut. This mounting slot 41223 is a stepped hole structure to achieve a fixed connection with the lead screw nut. The lead screw nut is fixedly connected to the connecting part. Furthermore, the width of the connecting part 4122 is smaller than the width of the sliding part, thus forming an L-shaped stepped structure 41222 at the connection between the connecting part and the sliding part. This stepped structure 41222 is located at the gap 4116 between the two sides of the front and rear parts of the main body. This allows the two sides of the rear part of the main body to restrict the lifting member 412 from both directions of the L-shaped structure. On one hand, when the lead screw 4132 and the lead screw nut 4133 rotate relative to each other, both the front and rear parts of the main body slide and guide the lifting member 412, and both bear the torque that prevents the lifting member 412 from rotating, greatly improving the stability of the overall structure. On the other hand, the lead screw 4132 and the lead screw nut 4133 are both located within the grooved space 4115 of the rear part of the main body, and are shielded by the front part 4114 and the lifting member 412, which greatly reduces the accumulation of dust and solid particles on the lead screw 4132 and the lead screw nut 4133, ensuring the transmission effect of both. To better showcase the detailed structure of the lifting mechanism, Figure 10 The dimensions of some structures have been reduced in size to allow relevant personnel to accurately understand their shape and positional relationships. In practical applications, these dimensions should be modified according to the fitting requirements of each component to achieve a better fit.

[0041] In practical applications, AGV equipment is typically used in conjunction with a wafer feeder to transport silicon wafer baskets. However, considering the distance between the two during docking, issues such as uneven transport or even tilting and falling of the wafer baskets may occur. In a further embodiment, the wafer feeder also includes a transition mechanism 6 installed at the end of the first transmission mechanism 21 and / or the second transmission mechanism 22. The transition mechanism 6 extends the transmission distance at the end of the first transmission mechanism 21 and / or the second transmission mechanism 22.

[0042] Combination Figure 11The transition mechanism 6 includes an L-shaped transition bracket 61 and a transition roller 62. The transition bracket 61 is fixed to the end of the first transmission mechanism 21 and / or the second transmission mechanism 22. Specifically, taking the first transmission mechanism 21 as an example, the transition mechanism 6 is fixed to the first conveying assembly 211 on the side of the first transmission mechanism 21 furthest from the feeding unit 3. The transition bracket 61 of the transition mechanism 6 is fixed to the mounting side plate 2112 on the end of the first conveying assembly 211 furthest from the feeding unit 3. The transition roller 62 is rotatably mounted on the transition bracket 61. Furthermore, the transition roller 62 is opposite to the conveyor belt 2114 near the mounting side plate 2112. The transition roller 62 extends the conveying distance of the conveyor belt 2114 in the transmission direction.

[0043] In a further embodiment, the silicon wafer feeding machine also includes an air purification device 5. The air purification device 5 is disposed on the feeding body 1 and contains filter material. The air purification device 5 purifies the external air and introduces it into the conveying channel 11, thereby creating high pressure in the conveying channel 11, preventing air from outside the conveying channel 11 from entering, and reducing the deposition of floating dust on the silicon wafer.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer feeding machine, characterized in that, include The feeding body has a conveying channel inside for transporting silicon wafer baskets; The transmission unit includes at least one first transmission mechanism and at least one second transmission mechanism disposed within the conveying channel; the first transmission mechanism and the second transmission mechanism are arranged along the length direction of the conveying channel; the first transmission mechanism and the second transmission mechanism have the same structure, and the first transmission mechanism and the second transmission mechanism operate in opposite directions; The feeding unit includes a feeding support and at least one third transmission mechanism disposed on the feeding support; A transfer unit, located between the loading unit and the transmission unit, receives empty silicon wafer baskets from the first transmission mechanism and transfers them to the third transmission mechanism for silicon wafer loading, and receives loaded silicon wafer baskets from the third transmission mechanism and transfers them to the second transmission mechanism. The transfer unit includes a lifting mechanism and a fourth transmission mechanism mounted on the lifting mechanism. The lifting mechanism drives the fourth transmission mechanism to move up and down so that it is flush with the first, second, or third transmission mechanism. The lifting mechanism includes a vertically arranged lifting body, a lifting component that slides with the lifting body, a lifting drive assembly that drives the lifting component to move up and down, and a lifting bracket fixed to the lifting component. The fourth transmission mechanism is mounted on the lifting bracket. The lifting body includes a rear portion, a top portion at the top of the rear portion, a bottom portion at the bottom of the rear portion, and a front portion at the front of the rear portion. The main body comprises a rear, top, and bottom portion forming a groove-shaped space with an opening opposite to the front portion. The lifting drive assembly includes a lead screw extending along the length of the groove-shaped space and a lead screw nut cooperating with it. Both ends of the lead screw are rotatably connected to the top and bottom of the main body, respectively, and one end of the lead screw is connected to a drive source to obtain power for rotation. The lifting component includes a sliding portion slidingly engaged with the front portion of the main body and a connecting portion fixedly connected to the sliding portion. The sliding portion has a sliding groove adapted to the front portion of the main body from top to bottom. The connecting portion is placed in the groove-shaped space and fixedly connected to the lead screw nut. The rear portion of the main body includes a rear portion and two side portions fixed to both sides of the rear portion. A gap exists between the front portion of the main body and the two side portions. The width of the connecting portion is less than the width of the sliding portion, and the connection between the connecting portion and the sliding portion forms an L-shaped stepped structure. The stepped structure is located in the gap between the front portion of the main body and the two side portions.

2. The silicon wafer feeding machine according to claim 1, characterized in that, The first conveying mechanism includes at least one first conveying component disposed along the length of the conveying channel; the first conveying component includes a first end and a second end, and the first conveying component is configured to transfer an object carried thereon from the first end to the second end.

3. The silicon wafer feeding machine according to claim 2, characterized in that, The first conveying component includes: A support body is disposed within the conveying channel, and the support body has a guide groove formed along its length. The mounting side panels include a first side panel mounted on one end of the support body and a second side panel mounted on the other end of the support body; The conveyor wheel assembly includes a drive shaft rotatably connected to a first side plate, a drive wheel fixed coaxially with the drive shaft, a driven shaft connected to a second side plate, and a driven wheel coaxially connected to the driven shaft; one end of the drive shaft is connected to a power source that drives its own rotation. A conveyor belt is connected end to end and wound around the drive pulley and the driven pulley in sequence; the upper part of the conveyor belt is located in the guide groove.

4. The silicon wafer feeding machine according to claim 3, characterized in that, The driven shaft is slidably connected to the second side plate to adjust the distance between the driven shaft and the driving shaft, thereby adjusting the tension of the belt; the driven pulley is rotatably connected to the driven shaft.

5. The silicon wafer feeding machine according to claim 4, characterized in that, The second side plate has a groove along the transmission direction of the first conveying assembly, and the second side plate has a through hole from the end away from the first side plate toward the groove; The end of the driven shaft is inserted into the slide groove and slides in fit with the slide groove. The end of the driven shaft has a threaded hole along the length of the slide groove. A threaded component is inserted into the through hole, and the threaded component is threadedly engaged with the threaded hole. The position of the driven shaft in the slide groove can be adjusted by rotating the threaded component.

6. The silicon wafer feeding machine according to claim 1, characterized in that, Also includes: A transition mechanism is installed at the end of the first transmission mechanism and / or the second transmission mechanism, the transition mechanism being used to extend the transmission distance of the first transmission mechanism and / or the second transmission mechanism at the end.

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