Electronic components

Abstract

The present invention relates to an electronic component (1) comprising a printed circuit board (4), an electronic module (2) fixed on a first side (5) of the printed circuit board (4), a housing (3) having a heat-conducting wall (9), a fastening device (18) configured to hold the printed circuit board (4) within the housing (3) at a distance from the heat-conducting wall (9), a housing (7) extending from the inner side (19) of the heat-conducting wall (9), and a cooling module (8) placed in the housing (7) for thermal coupling to the heat-conducting wall (9) and the electronic module (2), the housing (7) being configured to restrict the movement of the cooling module (8) in any direction parallel to the heat-conducting wall (9).

Description

Technical Field

[0001] This invention belongs to the technical field of electronic devices, and particularly relates to electronic devices used in motor vehicles, such as telecommunications equipment for telematics operations in automobiles, and also to means for cooling electronic devices. In particular, this invention relates to electronic components. Background Technology

[0002] A telematics control unit is an embedded electronic system that performs remote communication operations, such as vehicle tracking. To optimize communication performance, the telematics control unit is placed on the roof of the vehicle.

[0003] The temperature of a vehicle roof can vary greatly. For example, the roof temperature of a black car exposed to sunlight for a sufficient period of time can reach over 90°C. The optimal temperature for the telematics control unit to operate properly is typically below this limit. Such temperature increases can impair the normal operation of the control unit, thus posing a risk to the safety of the driver or other road users.

[0004] There are various solutions for cooling telematics control units. These solutions all have drawbacks, including complex structure, large size, and low efficiency. Summary of the Invention

[0005] This invention proposes an electronic component for cooling electronic devices to address the aforementioned technical deficiencies of the prior art, the component having a simple, compact, and efficient structure.

[0006] According to one aspect of the present invention, the present invention relates to an electronic component including a printed circuit board, an electronic module fixed to a first side of the printed circuit board, a housing having a heat-conducting wall, a fastening device configured to hold the printed circuit board within the housing at a distance from the heat-conducting wall, a housing extending from the inside of the heat-conducting wall, and a cooling module disposed within the housing for thermal coupling to the heat-conducting wall and the electronic module, the housing being configured to restrict movement of the cooling module in any direction parallel to the heat-conducting wall.

[0007] Thanks to this invention, the cooling module is protected from any mechanical stress in the direction parallel to the heat-conducting wall. Furthermore, using the outer casing wall for heat conduction increases heat dissipation, thereby improving the cooling efficiency of the component.

[0008] In the context of this invention, when a material allows for sufficient heat exchange with its environment, i.e., when it has a thermal conductivity greater than 50 W / m², it is considered to be in a state of equilibrium. -1 .K -1 When the heat transfer coefficient is less than 1, the material is considered to be thermally conductive.

[0009] In the context of this invention, the term "thermal coupling" means heat transfer with or without physical contact.

[0010] According to an embodiment of the invention, the housing includes a plurality of fingers extending from the inside of the heat-conducting wall, the plurality of fingers being configured to restrict the movement of the cooling module.

[0011] The housing, including the finger-like components, helps reduce the weight of the components and allows heat transfer between the cooling module and the ambient air.

[0012] According to an embodiment of the present invention, the housing extends from the heat-conducting wall to the printed circuit board.

[0013] The housing extending to the printed circuit board is advantageous because it protects the cooling module from pressure between the heat-conducting walls and the printed circuit board.

[0014] According to an embodiment of the present invention, the printed circuit board includes a second side opposite to the first side, the second side including a metal ground plane, and the cooling module is thermally coupled to the electronic module through contact with the metal ground plane.

[0015] The metal ground plane effectively increases heat conduction between the cooling module and the electronic module.

[0016] According to an embodiment of the present invention, the printed circuit board includes through-holes located in a region corresponding to the outline of an electronic module, and the cooling module contacts the electronic module via the through-holes.

[0017] Through-holes allow direct contact between electronic modules and cooling modules, thus increasing heat transfer between these components.

[0018] According to an embodiment of the present invention, the cooling module is thermally coupled to the thermally conductive wall and the electronic module via a thermally conductive pad, thermally conductive paste or thermally conductive foam.

[0019] Thermal pads, thermal foams, or thermal pastes increase heat transfer between cooling modules, thermal walls, and electronic modules. In addition, thermal pads, thermal foams, or thermal pastes also act as mechanical stress absorbers.

[0020] According to an embodiment of the invention, the outer side of the heat-conducting wall opposite to the inner side includes a region at least partially located in a region corresponding to the outline of the cooling module and including a plurality of fins.

[0021] Multiple fins increase the surface area on the outer side of the heat-conducting wall, thus increasing heat transfer to the outside of the casing.

[0022] According to an embodiment of the present invention, the fastening device is fixed to a heat-conducting wall and is heat-conducting.

[0023] This fastening device advantageously allows for a thermal path between the printed circuit board and the heat-conducting wall.

[0024] According to an embodiment of the present invention, the fastening device includes at least one metal screw.

[0025] According to an embodiment of the present invention, the housing is thermally conductive.

[0026] According to an embodiment of the invention, the heat-conducting wall and the housing are made of the same material.

[0027] According to an embodiment of the present invention, the heat-conducting wall and the housing are formed from a single piece of material.

[0028] Therefore, it enhances the heat transfer between the shell and the heat-conducting wall.

[0029] According to an embodiment of the present invention, the cooling module is a Peltier cooler.

[0030] The use of Peltier coolers or thermoelectric coolers enhances the cooling capacity of components.

[0031] According to an embodiment of the present invention, the electronic module is a telecommunications circuit.

[0032] Different features, variations, and embodiments of the present invention can be combined with each other in various ways, as long as they do not contradict or exclude each other. Attached Figure Description

[0033] Many other features of the invention will become apparent from the following description with reference to the accompanying drawings, which illustrate embodiments of the invention in a non-limiting manner, wherein:

[0034] - Figure 1 A telecommunications system is shown, in which electronic components according to the invention are embedded in a vehicle.

[0035] - Figure 2 An electronic component according to an embodiment of the present invention is shown.

[0036] - Figure 3 A cross-section of the housing according to an embodiment of the present invention is shown.

[0037] - Figure 4 An electronic component according to another embodiment of the present invention is shown.

[0038] It should be noted that in these figures, structural and / or functional elements common to different embodiments may have the same reference numerals. Detailed Implementation

[0039] To better understand the instruction manual and read the accompanying drawings, an orthogonal system defining three directions x, y, and z is used in the manual. Figure 2 , 3 As can be seen in 4.

[0040] Figure 1A communication system CS is shown, which includes a motor vehicle AV, a remote network DN with which the motor vehicle can establish a wireless communication link WL, and an equipment manufacturer back-end system EM linked to the remote network DN, thereby enabling the establishment of a communication channel between the motor vehicle AV and the equipment manufacturer back-end system EM.

[0041] In this embodiment, the motor vehicle AV (here, an automobile) includes an electronic component 1 according to the invention, which is located on the roof of the motor vehicle AV. The electronic component 1 in this example includes an electronic module 2, which is here a telecommunications circuit, such as a network access device. The electronic module 2 is configured here to establish a wireless communication link WL with a remote network DN. In this embodiment, the remote network includes the Internet and / or a cellular network.

[0042] The vehicle AV is equipped with an internal network IN, which includes and links various electronic units of the vehicle AV (e.g., command units, displays, sensors, etc.), where electronic module 2 is hosted by electronic component 1. Therefore, electronic module 2 can communicate with the vehicle's internal network IN and exchange data with the equipment manufacturer's back-end system BS via a remote network DN.

[0043] The data exchanged can include information about the vehicle's location and speed, information about vehicle maintenance such as alarms about equipment malfunctions, and more generally, various signals from the vehicle's AV sensors.

[0044] Figure 2 This is a cross-sectional view of an embodiment of electronic component 1. Electronic component 1 includes a housing 3 encapsulating a printed circuit board 4, an electronic module 2 fixed to a first side 5 of the printed circuit board 4, a plurality of electronic components 6 fixed to the first side 5 of the printed circuit board 4, a housing 7, and a cooling module 8 housed within the housing 7. For example, the plurality of electronic components 6 include an antenna.

[0045] Housing 3 includes a thermally conductive wall 9, which is a metal wall, such as an aluminum wall. Other walls of housing 3 are made of materials that do not interfere with radio frequency waves in order to allow the establishment of a wireless communication link WL. For example, here, the other walls of housing 3 are made of a plastic material. Figure 2 In the middle, the heat-conducting wall 9 extends in the xy plane.

[0046] The printed circuit board 4 is located within the housing 3, at a certain distance from the heat-conducting wall 9, such that the second side 10 of the printed circuit board 4, opposite the first side 5, faces the heat-conducting wall 9. The printed circuit board 4 includes alternating conductive and electrically insulating layers, and includes through-holes extending from the first side 5 to the second side 10, these through-holes being filled with a conductive material, such as a metal, in this case, copper. Therefore, in the context of this invention, the printed circuit board 4 is thermally conductive. Figure 2In the diagram, the printed circuit board 4 extends in the xy plane, and the via extends in the z direction.

[0047] The printed circuit board 4 is secured to the housing 3 (in this example, to the heat-conducting wall 9) by a fastening device 18 (by screws in this example). In this embodiment, the screws 18 are thermally conductive and, more precisely, made of metal.

[0048] The housing 7 includes a substrate 11 fixed to the inner side 19 of a heat-conducting wall 9. In this embodiment, the substrate 11 is formed by protrusions in the heat-conducting wall. The housing 7 includes a plurality of fingers 12 extending away from the substrate 11, that is, extending toward the printed circuit board 4. In this embodiment, the fingers extend to make physical contact with the printed circuit board 4. The substrate forms the bottom of the housing 7, and the plurality of fingers 12 extend from the edges of the substrate 11, thereby defining the side boundaries of the housing 7.

[0049] like Figure 3 As shown, Figure 3 The image shows a cross-sectional view of the finger 12 in the xy plane. The substrate 11 is rectangular, for example, square in this example, and the housing 7 includes eight fingers 12, four fingers 12a extending from the side of the substrate 11 and the other four fingers 12b extending from the corner of the substrate. Figure 3 The fingers 12a and 12b have angular cross-sections, but in other embodiments, the fingers may have cross-sections of any shape.

[0050] In this embodiment, the heat-conducting wall 9, the substrate 11, and the finger-shaped member 12 are made of the same material, in this case, aluminum. In other words, the heat-conducting wall 9 and the housing 7 form an integral structure.

[0051] The cooling module 8 is housed within the housing 7 such that the plurality of fingers 12 restrict their movement in any direction parallel to the heat-conducting wall, specifically in the x and y directions. Therefore, the fingers 12 among the plurality of fingers are in physical contact with the cooling module 8.

[0052] The cooling module 8 is housed in the housing 7 for thermal coupling to the substrate 11, and thus to the thermally conductive wall 9, and also for thermal coupling to the electronic module 2. In this embodiment, the cooling module 8 includes a first surface 13 and a second surface 14 opposite to the first surface 13. The first surface 13 contacts the printed circuit board 4 via a first layer of thermal paste 15, and the second surface 14 contacts the substrate 11 via a second layer of thermal paste 16. The invention is also compatible with thermal pads or thermal foams, rather than thermal paste.

[0053] The second side 10 of the printed circuit board 4 includes a ground plane 17, that is, a metal plane, such as a copper plane here, located in the first region A1 corresponding to the outline of the electronic module. In other words, considering Figure 2The orientation of electronic component 1 is such that ground plane 17 is located below the electronic module. The first layer of thermal paste 15 is in physical contact with ground plane 17.

[0054] The cooling module 8 in this embodiment is a Peltier cooler or a thermoelectric cooler. The cooling module 8 is therefore electrically powered to transfer heat from the first surface 13 to the second surface 14. Heat transfer relying on an external energy source is referred to as "active." Therefore, an electrically powered Peltier cooler is an active cooling device. Conversely, heat transfer that does not rely on any external energy source is considered passive.

[0055] The outer side 20 of the heat-conducting wall includes a second region A2 corresponding to the outline of the cooling module 8, which includes a plurality of fins 21. The surface area of ​​the outer side 20 is thus increased.

[0056] The aforementioned electronic component 1 includes at least four thermal paths from the electronic module 2 to the thermally conductive wall. The first thermal path passes through the printed circuit board 4, the cooling module 8 (via thermal paste layers 15 and 16), and the substrate 11. The second thermal path passes through the printed circuit board 4 and the screw 18. The third thermal path passes through the printed circuit board 4 and the ambient air. The fourth thermal path passes through the printed circuit board 4, the finger 12, and the substrate 11.

[0057] The first heat path is an active heat path because it means that the Peltier cooler 8 consumes electricity, while the second, third, and fourth heat paths are passive heat paths because they do not consume energy.

[0058] according to Figure 4 In the embodiment of the invention shown, the printed circuit board 4 includes a through-hole 22 located in a first region A1, extending from a first side 5 of the printed circuit board 4 to a second side 10 of the printed circuit board 4. The size of the through-hole 22 is smaller than the size of the first region A1, such that the electronic module 2 remains fixed to the first side 5 of the printed circuit board.

[0059] The cooling module 8 extends through the through hole 22 to the electronic module 2 and contacts the electronic module 2 via the first layer of thermal paste 15.

[0060] In the foregoing embodiment, the cooling module 8 protrudes from the through-hole 22 because the thickness of the printed circuit board 4 (measured in the z-direction) is less than the thickness of the cooling module 8. In other embodiments, the thickness of the printed circuit board 4 is greater than the thickness of the cooling module 8, such that the cooling module 8 does not protrude from the through-hole 22.

[0061] In such an embodiment, the x and y dimensions of the housing 7 are smaller than the x and y dimensions of the through hole 22, so that the finger 12 can extend in the through hole 22 to restrict the movement of the cooling module 8 and contact the cooling module 8, thereby allowing heat transfer between these components.

[0062] Furthermore, in such an embodiment, the housing 7 may include at least one central finger or central protrusion extending from the substrate 11 to the cooling module 8 for contact with the cooling module 8 via a second layer of thermal paste 16. Therefore, this central finger or central protrusion is shorter than the finger 12 (in the z-direction).

[0063] like Figure 1 As shown, in an embodiment of the invention, the electronic components are embedded in the vehicle, and the heat-conducting walls are advantageously in physical contact with the vehicle body. Therefore, the vehicle body acts as a radiator and improves cooling efficiency.

[0064] This invention is not limited to the above-mentioned combinations. Figures 1 to 4 The described embodiments.

[0065] For example, a housing 7 having a substrate 11 has been described, with fingers 12 extending from the substrate 11. In other embodiments, the housing may not include the substrate 11, and the fingers 12 may extend directly from the inner side 19 of the heat-conducting wall 9.

[0066] Furthermore, the aforementioned finger-like members 12 extend from the substrate 11 or the heat-conducting wall 9 to the printed circuit board 4 to make physical contact with the printed circuit board 4. This solution helps to reduce the mechanical stress applied to the cooling module 8 in the z-direction. However, other embodiments of the invention include at least some finger-like members 12 that extend toward the printed circuit board 4 but do not contact the printed circuit board 4. Therefore, the ends of these finger-like members are located at a certain distance from the printed circuit board 4.

[0067] Since the cooling module 8 is a Peltier cooler, the aforementioned electronic component 1 performs active cooling. This invention is also compatible with passive cooling, and embodiments of the invention include a passive cooling module located within the housing 7.

[0068] The dimensions and location of the aforementioned ground plane 17 correspond to the first region A1. In other embodiments, the dimensions of the ground plane 17 may differ from the dimensions of the first region A1 (i.e., different from the dimensions of the electronic module), for example, being smaller or larger. For example, the ground plane may cover the entire second side 10 of the printed circuit board 4. Furthermore, in some embodiments, the ground plane 17 may extend only within a portion of the first region A1.

[0069] Similarly, multiple fins 21 may extend over the entire outer side 20 of the heat-conducting wall 9, or over a surface smaller than the second region A2. Although fins have been described, other shapes may be used to increase the surface area of ​​the outer side 20 of the heat-conducting wall 9. For example, the outer side 20 may include corrugations, tapered shapes, fingers, pads, etc.

[0070] Finally, it has been described that the heat-conducting wall and the housing are made of the same material and form an integral structure. In other embodiments of the invention, the housing 7 and the heat-conducting wall 9 may be made of separate materials, or they may be made of different materials.

Claims

1. An electronic assembly (1) comprising a printed circuit board (4), an electronic module (2) fixed on a first side (5) of the printed circuit board (4), a housing (3) having a thermally conductive wall (9), a fastening device (18) configured to hold the printed circuit board (4) at a distance from the thermally conductive wall (9) within the housing (3), a casing (7) extending from an inner side (19) of the thermally conductive wall (9), and a cooling module (8) placed in the casing (7) so as to be thermally coupled to the thermally conductive wall (9) and to the electronic module (2), the casing (7) being configured to limit movements of the cooling module (8) in any direction parallel to the thermally conductive wall (9), the casing (7) comprising a plurality of fingers (12) extending from an edge of a base plate (11) formed by a protrusion on the inner side (19) of the thermally conductive wall (9), the plurality of fingers (12) being configured to limit the movements of the cooling module (8), the plurality of fingers (12) being in physical contact with the cooling module (8).

2. The electronic assembly of claim 1, wherein, The casing (7) extends from the thermally conductive wall (9) to the printed circuit board (4).

3. The electronic assembly of claim 1 or 2, wherein, The printed circuit board (4) comprises a second side (10) opposite the first side (5), the second side (10) comprising a metallic ground plane (17), the cooling module (8) being thermally coupled to the electronic module (2) by contact with the metallic ground plane (17).

4. The electronic assembly of claim 1 or 2, wherein, The printed circuit board (4) comprises a through hole (22) in a region (Al) corresponding to the outline of the electronic module (2), the cooling module (8) being in contact with the electronic module (2) via the through hole.

5. The electronic assembly of any one of claims 1 to 4, wherein, The cooling module (8) is thermally coupled to the thermally conductive wall (9) and to the electronic module (2) via a thermally conductive pad, a thermally conductive paste or a thermally conductive foam.

6. The electronic assembly of any one of claims 1 to 5, wherein, An outer side (20) of the thermally conductive wall (9) opposite the inner side (19) comprises a region at least partially located in a region (A2) corresponding to the outline of the cooling module (8) and comprising a plurality of fins (21).

7. The electronic assembly of any one of claims 1 to 6, wherein, The fastening device (18) is fixed to the thermally conductive wall (9) and is thermally conductive.

8. The electronic assembly of claim 7, wherein, The fastening device (18) comprises at least one metallic screw.

9. The electronic assembly of any one of claims 1 to 8, wherein, The casing (7) is thermally conductive.

10. The electronic assembly of any one of claims 1 to 9, wherein, The thermally conductive wall (9) and the casing (7) are made of the same material.

11. The electronic assembly of claim 10, wherein, The thermally conductive wall (9) and the casing (7) form a single piece of material.

12. The electronic assembly of any one of claims 1-11, wherein, The cooling module (8) is a Peltier cooler.

13. The electronic assembly of any one of claims 1 to 12, wherein, The electronic module (2) is a telecommunication circuit.

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