A vertical power supply system

Abstract

The application relates to the technical field of power supply, in particular to a vertical power supply system, a core computing module is arranged on a first welding surface of a mainboard printed circuit board; a filter capacitor is arranged on a second welding surface of the mainboard printed circuit board; a plurality of openings are arranged on a power supply printed circuit board, the positions of the openings correspond to feeding capacitors one by one; the feeding capacitors are welded on the second welding surface of the mainboard printed circuit board and pass through the corresponding openings on the power supply printed circuit board to expose the electrodes of the feeding capacitors; a core power supply is arranged on the side of the power supply printed circuit board where the feeding capacitors are exposed; the output power supply of the core power supply passes through the feeding capacitors, the power supply printed circuit board and the mainboard printed circuit board in sequence to supply power to the core computing module. The above scheme meets the installation requirement of the filter capacitor, reduces the maintenance and repair difficulty of the core power supply, and the installation position of the feeding capacitor has a short current path, which is very beneficial to the output current of the core power supply.

Description

Technical Field

[0001] This application relates to the field of power supply technology, specifically to a vertical power supply system. Background Technology

[0002] The core power supply is a DC voltage source that provides power to computing cores such as the CPU (Central Processing Unit) and GPU (Graphics Processing Unit). Currently, the mainstream voltage of core power supplies is between 750mV and 1000mV, and the current is between 400A and 800A.

[0003] Currently, horizontal power supply is commonly used on PCBs (Printed Circuit Boards) to power CPUs / GPUs and other devices. This means the core power supply and the computing core module are placed on the same PCB, with no overlap, and current is transmitted horizontally through the PCB's copper foil. However, horizontal power supply causes significant voltage drop across the printed circuit board's copper foil, resulting in substantial power loss. To address the continuously increasing core power consumption and reduce power loss, some precedents have been explored for vertical power supply. Vertical power supply refers to mounting the CPU / GPU and other devices on one side of the PCB, while the core power supply is mounted on the other side, achieving vertical power supply through vias and copper foil on the PCB. Currently, commonly used vertical power supply technologies mainly fall into two categories: double-sided soldering and socket adapters. Double-sided soldering uses blind and buried via technology to create two different types of pads on the front and back of the PCB, one suitable for the CPU / GPU and the other for the core power supply. Socket adapters involve producing an adapter board (or using a dedicated socket) to solder (or press-fit) the core power supply onto the PCB of the CPU / GPU and other devices.

[0004] However, in the above solutions, to minimize impedance, the filter capacitors for components such as the CPU / GPU need to be placed on the back of the motherboard PCB, directly opposite the CPU / GPU. When using double-sided soldering, the core power supply pads occupy the back of the PCB, making it impossible to install filter capacitors, and double-sided soldering makes repair and maintenance difficult. While using a socket adapter solves the repair and maintenance problems, the pin area on the back of the motherboard PCB is largely occupied by spring-loaded pins, making it impossible to install filter capacitors, and the voltage drop is large, while custom sockets are expensive. Summary of the Invention

[0005] This application provides a vertical power supply system that meets the installation requirements of filter capacitors while reducing the difficulty of maintenance and repair of the core power supply. The technical solution is as follows: The vertical power supply system includes: a core computing module, filter capacitors, feed capacitors, a motherboard printed circuit board, a power supply printed circuit board, and a core power supply. The core computing module is disposed on the first soldering surface of the motherboard printed circuit board; the filter capacitor is disposed on the second soldering surface of the motherboard printed circuit board. The power printed circuit board has multiple openings, and the positions of the openings correspond one-to-one with the feeding capacitors. The feeding capacitors are soldered to the second soldering surface of the motherboard printed circuit board and pass through the corresponding openings on the power printed circuit board to expose the electrodes of the feeding capacitors. The core power supply is located on the side of the power printed circuit board that exposes the feeding capacitor. The output power of the core power supply is supplied to the core computing module through the feed capacitor, which passes through the power supply printed circuit board and the motherboard printed circuit board in sequence. The number of the feeding capacitors is determined according to the current requirement and the feeding path requirement, and the height of the feeding capacitors is higher than that of the filter capacitors.

[0006] In one possible implementation, both the power supply capacitor and the filter capacitor are MLCC capacitors, and the height of the power supply capacitor is greater than 5mm, while the height of the filter capacitor is less than 2mm.

[0007] In one possible implementation, the motherboard printed circuit board and the power supply printed circuit board are soldered independently, and after soldering, the motherboard printed circuit board and the power supply printed circuit board are connected through the power supply capacitor.

[0008] In one possible implementation, electrodes are provided on both sides of the feeding capacitor, and the feeding capacitor is soldered to the second soldering surface of the motherboard printed circuit board through the electrodes.

[0009] In one possible implementation, each opening on the power printed circuit board is provided with a corresponding pad; the pad is used to solder the power supply capacitor.

[0010] In one possible implementation, the core computing module includes a processor with core computing capabilities.

[0011] In one possible implementation, the processor includes a central processing unit and a graphics processing unit.

[0012] In one possible implementation, the core power supply consists of multiple power modules connected in parallel.

[0013] In one possible implementation, a heat sink is provided on the side of the core computing module away from the motherboard printed circuit board; the heat sink is used to dissipate heat from the core computing module.

[0014] The technical solution provided in this application may include the following beneficial effects: The core computing module is mounted on the first soldering surface of the motherboard printed circuit board; the filter capacitor is mounted on the second soldering surface of the motherboard printed circuit board; the power supply printed circuit board has multiple openings, the positions of which correspond one-to-one with the feed capacitor; the feed capacitor is soldered to the second soldering surface of the motherboard printed circuit board and passes through the corresponding opening on the power supply printed circuit board to expose the electrodes of the feed capacitor; the core power supply is mounted on the side of the power supply printed circuit board exposing the feed capacitor; the output power of the core power supply supplies power to the core computing module through the feed capacitor, the power supply printed circuit board, and the motherboard printed circuit board. In the above solution, a filter capacitor for filtering and a power supply capacitor for power transmission and filtering are provided on the second soldering surface of the motherboard printed circuit board. The height of the power supply capacitor is greater than that of the filter capacitor. At this time, an opening corresponding to the power supply capacitor is provided on the power supply printed circuit board, so that the power supply capacitor can pass through the hole for soldering. When the core power supply needs to be repaired, the solder buildup at the power supply capacitor and the hole can be removed, and the power supply printed circuit board can be removed. The current path of the installation position of the power supply capacitor is short, which is very beneficial to the output current of the core power supply. In addition, the motherboard printed circuit board retains the installation position of the filter capacitor, and the manufacturing process is simple. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a vertical power supply system according to an exemplary embodiment.

[0017] Figure 2 This is a disassembly diagram of a vertical power supply system according to an exemplary embodiment.

[0018] Among them, 1-core computing module; 2-motherboard printed circuit board; 3-power printed circuit board; 4-filter capacitor; 5-feed capacitor; 51-electrode; 6-core power supply; 61-power module; 7-opening; 8-pad; 9-heat sink. Detailed Implementation

[0019] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] It should be understood that the term "instruction" mentioned in the embodiments of this application can be a direct instruction, an indirect instruction, or an indication of a relationship. For example, A instructing B can mean that A directly instructs B, such as B being able to obtain information through A; it can also mean that A indirectly instructs B, such as A instructing C, so B can obtain information through C; or it can mean that there is a relationship between A and B.

[0021] In the description of the embodiments of this application, the term "correspondence" may indicate that there is a direct or indirect correspondence between two things, or that there is an association between two things, or that there is a relationship of instruction and being instructed, configuration and being configured, etc.

[0022] In the embodiments of this application, "predefined" can be achieved by pre-storing corresponding codes, tables or other means that can be used to indicate relevant information in the device (e.g., including terminal devices and network devices). This application does not limit the specific implementation method.

[0023] Figure 1 This is a schematic diagram illustrating the structure of a vertical power supply system according to an exemplary embodiment; as shown below. Figure 1 As shown, the vertical power supply system includes: a core computing module 1, a filter capacitor 4, a power supply capacitor 5, a motherboard printed circuit board 2, a power supply printed circuit board 3, and a core power supply 6. The core computing module 1 is disposed on the first soldering surface of the motherboard printed circuit board 2; the filter capacitor 4 is disposed on the second soldering surface of the motherboard printed circuit board 2; The power printed circuit board 3 has multiple openings 7, the positions of which correspond one-to-one with the feed capacitors 5; the feed capacitors 5 are soldered to the second soldering surface of the motherboard printed circuit board 2 and pass through the corresponding openings 7 on the power printed circuit board 3 to expose the electrodes 51 of the feed capacitors. The core power supply 6 is located on the side of the power supply printed circuit board 3 that exposes the feed capacitor 5. The output power of the core power supply 6 is supplied to the core computing module 1 through the feed capacitor 5, the power supply printed circuit board 3, and the motherboard printed circuit board 2.

[0024] Furthermore, the motherboard printed circuit board 2 and the power supply printed circuit board 3 can be double-sided printed circuit boards. The core computing module 1, the filter capacitor 4 and the power supply capacitor 5 are respectively soldered on the two soldering surfaces of the motherboard printed circuit board 2. The core computing module 1 is soldered on the first soldering surface of the motherboard printed circuit board 2, and the filter capacitor 4 and the power supply capacitor 5 are soldered on the second soldering surface of the motherboard printed circuit board 2 (the second soldering surface is the back of the motherboard printed circuit board 2).

[0025] In one possible implementation, the number of the feed capacitors 5 is determined according to the current requirement and the feed path requirement, and the height of the feed capacitors 5 is higher than that of the filter capacitor 4.

[0026] Furthermore, the filter capacitor 4 is used to filter out AC components, making the output DC smoother; the feed capacitor 5 can not only filter, but also perform power transmission function, that is, the output power of the core power supply 6 is transmitted to the core computing module 1 through the power supply printed circuit board 3 and the motherboard printed circuit board 2 to provide power.

[0027] Furthermore, in related technologies, the filter capacitors are mostly installed on the back of the CPU motherboard. If vertical power supply is used, all components on the back of the CPU motherboard need to be removed to another location during power board soldering, which is quite cumbersome. However, in the vertical power supply method proposed in this application, the installation position of the filter capacitor 4 remains unchanged, still installed on the back of the motherboard printed circuit board 2. A decoupling capacitor (i.e., the power supply capacitor 5) with a certain thickness is used, passing through the power supply printed circuit board 3 and the motherboard printed circuit board 2 to achieve electrical connection between the upper and lower printed circuit boards. During maintenance, it is not necessary to remove the filter capacitor 4, making maintenance more convenient. In addition, in the double-sided soldering vertical power supply method of related technologies, the soldering of the power board and CPU motherboard is somewhat similar to BGA solder balls, with the solder joints between the two boards, not exposed, making separation difficult. In this application, since the second end of the power supply capacitor 5 is soldered through the corresponding opening 7 on the power supply printed circuit board 3, the solder joints are exposed. Therefore, simply removing the solder at the solder joint of the power supply capacitor 5 passing through the power supply printed circuit board 3 allows for the removal of the power supply printed circuit board 3, making the operation much easier.

[0028] In one possible implementation, both the power supply capacitor 5 and the filter capacitor 4 are MLCC capacitors, and the height of the power supply capacitor 5 is greater than 5mm, while the height of the filter capacitor 4 is less than 2mm.

[0029] Furthermore, the filter capacitor 4 can be a conventional MLCC filter capacitor (abbreviated as CC, with a capacitance ranging from 10nF to 47uF), and the power supply capacitor 5 can be a large-capacity MLCC capacitor (abbreviated as CB, with a capacitance of 100uF or more). The conventional MLCC filter capacitor is placed on the back (second soldering surface) of the motherboard printed circuit board 2 according to conventional design, with a height of less than 2mm. Based on the current requirements and power supply path requirements, an appropriate number of power supply capacitors 5 are installed on the back of the motherboard printed circuit board 2, with a height of more than 5mm. The low electrode resistance of MLCC capacitors and vertical power supply allow the overall voltage drop to be controlled within 5mV-8mV. Moreover, the short current path at the installation location of the MLCC capacitors is highly beneficial for the output filtering of the core power supply 6.

[0030] Furthermore, MLCC stands for Multilayer Ceramic Capacitor, also known as a surface mount capacitor. Surface mount capacitors are made by stacking ceramic dielectric films with printed electrodes (internal electrodes) in a staggered manner, then sintering them at high temperature in a single process to form a ceramic chip, and finally sealing the two ends of the chip with metal layers (external electrodes).

[0031] In one possible implementation, the motherboard printed circuit board 2 and the power supply printed circuit board 3 are soldered independently, and after soldering, the motherboard printed circuit board 2 and the power supply printed circuit board 3 are connected through the power supply capacitor 5.

[0032] In one possible implementation, please refer to Figure 2 The diagram shows a disassembly schematic of a vertical power supply system. The feeding capacitor 5 has electrodes 51 on both sides, and the feeding capacitor 5 is soldered to the second soldering surface of the motherboard printed circuit board through the electrodes 51.

[0033] Furthermore, the power supply printed circuit board 3 is independently designed with an opening corresponding to the location of the power supply capacitor 5, allowing the electrodes of the power supply capacitor 5 to be exposed. Both the motherboard printed circuit board 2 and the power supply printed circuit board 3 are independently soldered. After inspection, they are placed in place, with the first end of the power supply capacitor 5 soldered to the second soldering surface of the motherboard printed circuit board 2, and the second end of the power supply capacitor 5 passing through the corresponding opening 7 on the power supply printed circuit board 3. Tin is then deposited at the corresponding opening 7 on the power supply printed circuit board 3 to complete the installation. This allows the motherboard printed circuit board 2 to establish a connection through the power supply capacitor 5. When power is supplied, the output power of the core power supply 6 passes through the power supply capacitor 5, sequentially through the power supply printed circuit board 3 and the motherboard printed circuit board 2 to supply power to the core computing module 1. At this time, the power supply path is close to the thickness of the two PCB layers of the motherboard printed circuit board 2 and the power supply printed circuit board 3, approximately within 5mm. Compared to the path of power transmission through the copper foil of the printed circuit board PCB in the horizontal power supply mode, the path is shorter and the voltage drop is much smaller. In addition, when repairing the core power supply 6, the solder buildup at the corresponding opening 7 of the power supply printed circuit board 3 can be directly removed, and the power supply printed circuit board 3 can be removed without removing all the components on the back of the motherboard printed circuit board 2. The repair is simpler and saves a lot of time and manpower.

[0034] Furthermore, the welding end face of the power supply capacitor 5 is on both sides, and the electrodes on both sides are positive and negative respectively (the positions of the positive and negative electrodes can be set according to the actual situation, such as positive on the left and negative on the right, or negative on the left and positive on the right). They all need to be welded to the second welding surface of the motherboard printed circuit board 2, and then welded through the solder pads 8 on both sides of the power supply printed circuit board 3 and the opening 7.

[0035] In one possible implementation, such as Figure 2 As shown, each opening 7 on the power supply printed circuit board 3 is provided with a corresponding pad 8; the pad 8 is used to solder the power supply capacitor 5.

[0036] Furthermore, the pads 8 are set on both sides of the corresponding opening 7; after the power supply capacitor 5 is soldered on the motherboard printed circuit board 2, it passes through the power supply printed circuit board 3, and then the electrodes 51 on both sides of the power supply capacitor 5 are soldered to the pads 8 on both sides of the opening 7 of the power supply printed circuit board 3, so that the power supply electrodes can be connected vertically.

[0037] Furthermore, when soldering the feed capacitor 5 that passes through the opening 7, solder is applied to the corresponding pad 8 on the power supply printed circuit board 3 to achieve the soldering of the feed capacitor 5. The large-capacity feed capacitor 5 can transmit load current while filtering, and transmit the output current of the core power supply 6 to the core computing module 1 for use by the core computing module 1. The core power supply 6 is located on the back of the power supply printed circuit board 3, which can be manually disassembled and has good maintainability. The motherboard printed circuit board 2 retains the mounting position of the filter capacitor, and the manufacturing process is simple and the cost is reduced.

[0038] In one possible implementation, the core computing module 1 includes a processor with core computing capabilities.

[0039] In one possible implementation, the processor includes a central processing unit (CPU) and a graphics processing unit (GPU).

[0040] Furthermore, both the central processing unit (CPU) and the graphics processing unit (GPU) are processors with core computing functions. In addition, the core computing module 1 may also include other processors with core computing functions. Among them, the central processing unit (CPU) is the core of the computer system for operation and control, and is the final execution unit for information processing and program execution; while the graphics processing unit (GPU), also known as a display core, visual processor, or display chip, is a microprocessor specifically designed for performing image and graphics-related calculations on personal computers, workstations, game consoles, and some mobile devices (such as tablets and smartphones).

[0041] In one possible implementation, the core power supply 6 is composed of multiple power modules 61 connected in parallel.

[0042] Furthermore, such as Figure 2As shown, the power modules 61 can be distributed on the power printed circuit board 3 according to actual needs. The core power supply 6 is generally composed of multiple power modules 61 connected in parallel. In common cases, the number of power modules 61 connected in parallel is 8 to 32. The power module 61 is a power electronic device that is encapsulated into a module according to a certain functional combination.

[0043] In one possible implementation, a heat sink 9 is provided on the side of the core computing module 1 away from the motherboard printed circuit board 2; the heat sink 9 is used to dissipate heat from the core computing module 1.

[0044] Furthermore, the core computing module 1 may generate a large amount of heat during operation. When the temperature of the core computing module 1 is too high, it will reduce the working performance of the core computing module 1, shorten its service life, and may even directly damage the components in the system. Therefore, it is necessary to dissipate heat from the core computing module 1. The heat sink 9 will transfer the heat generated by the core computing module 1 during operation in a timely manner to avoid affecting its normal operation. Common heat sinks 9 can be divided into various types according to the heat dissipation method, such as air cooling, heat pipe heat sink, liquid cooling, semiconductor cooling, and compressor cooling.

[0045] In practical applications, the motherboard printed circuit board 2 and the power supply printed circuit board 3 are designed and soldered independently according to actual needs. The core computing module 1 is placed on the first soldering surface of the motherboard printed circuit board 2, and the first ends of the filter capacitor 4 and the power supply capacitor 5 are soldered to the second soldering surface of the motherboard printed circuit board 2. The second soldering surface is the back of the motherboard printed circuit board 2. The height of the power supply capacitor 5 is higher than that of the filter capacitor 4, approximately greater than 5mm, so that the power supply capacitor 5 can completely pass through the opening 7 on the power supply printed circuit board 3 (the power supply printed circuit board 3 has openings 7 at the corresponding positions of each power supply capacitor 5), so that the electrodes of the power supply capacitor 5 are exposed on the power supply printed circuit board 3. Then, the pads 8 at each opening 7 are used to solder each power supply capacitor 5 together. At this time, each power supply capacitor 5 is placed between the motherboard printed circuit board 2 and the power supply printed circuit board 3, acting as a power transmission bridge. Secondly, the core power supply 6 is soldered to the side of the power supply printed circuit board 3 that exposes the feed capacitor 5. The output power of the core power supply 6 passes through the feed capacitor 5, and then sequentially through the power supply printed circuit board 3 and the motherboard printed circuit board 2 to supply power to the core computing module 1. During the repair process, since the feed capacitor 5 and the power supply printed circuit board 3 are soldered to each of the openings 7 via solder pads 8, and the height of the feed capacitor 5 is much higher than that of the filter capacitor 4, the filter capacitor 4 only needs to be soldered to the motherboard printed circuit board 2 and does not need to be soldered to the power supply printed circuit board 3. Therefore, if the power supply printed circuit board 3 needs to be removed, only the solder on the solder pads 8 needs to be removed, without removing the filter capacitor 4 and the feed capacitor 5, thus reducing the difficulty of repair.

[0046] In summary, the core computing module is located on the first soldering surface of the motherboard printed circuit board; the filter capacitor is located on the second soldering surface of the motherboard printed circuit board; the power supply printed circuit board has multiple openings, the positions of which correspond one-to-one with the power supply capacitors; the first end of the power supply capacitor is soldered to the second soldering surface of the motherboard printed circuit board, and the second end of the power supply capacitor passes through the corresponding opening on the power supply printed circuit board; the core power supply is located on the side of the power supply printed circuit board exposing the power supply capacitor; the output power of the core power supply passes through the power supply printed circuit board and the motherboard printed circuit board in sequence through the power supply capacitor to supply power to the core computing module. In the above solution, a filter capacitor for filtering and a power supply capacitor for power transmission and filtering are provided on the second soldering surface of the motherboard printed circuit board. The height of the power supply capacitor is greater than that of the filter capacitor. At this time, an opening corresponding to the power supply capacitor is provided on the power supply printed circuit board, so that the power supply capacitor can pass through the hole for soldering. When the core power supply needs to be repaired, the solder buildup at the power supply capacitor and the hole can be removed, and the power supply printed circuit board can be removed. The current path of the installation position of the power supply capacitor is short, which is very beneficial to the output current of the core power supply. In addition, the motherboard printed circuit board retains the installation position of the filter capacitor, and the manufacturing process is simple.

[0047] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0048] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A vertical power supply system, characterized in that, The system includes: a core computing module, filter capacitors, power supply capacitors, a motherboard printed circuit board, a power supply printed circuit board, and a core power supply. The core computing module is disposed on the first soldering surface of the motherboard printed circuit board; the filter capacitor is disposed on the second soldering surface of the motherboard printed circuit board. The power printed circuit board has multiple openings, and the positions of the openings correspond one-to-one with the feeding capacitors. The feeding capacitors are soldered to the second soldering surface of the motherboard printed circuit board and pass through the corresponding openings on the power printed circuit board to expose the electrodes of the feeding capacitors. The core power supply is located on the side of the power printed circuit board that exposes the feeding capacitor. The output power of the core power supply is supplied to the core computing module through the feed capacitor, which passes through the power supply printed circuit board and the motherboard printed circuit board in sequence. The number of the feeding capacitors is determined according to the current requirement and the feeding path requirement, and the height of the feeding capacitors is higher than that of the filter capacitors.

2. The system according to claim 1, characterized in that, Both the power supply capacitor and the filter capacitor are MLCC capacitors, and the height of the power supply capacitor is greater than 5mm, while the height of the filter capacitor is less than 2mm.

3. The system according to claim 1, characterized in that, The motherboard printed circuit board and the power supply printed circuit board are soldered independently, and after soldering, the motherboard printed circuit board and the power supply printed circuit board are connected through the power supply capacitor.

4. The system according to claim 3, characterized in that, The power supply capacitor has electrodes on both sides, and the power supply capacitor is soldered to the second soldering surface of the motherboard printed circuit board through the electrodes.

5. The system according to claim 4, characterized in that, Each opening on the power printed circuit board is provided with a corresponding pad; the pad is used to solder the power supply capacitor.

6. The system according to claim 1, characterized in that, The core computing module includes a processor with core computing functions.

7. The system according to claim 6, characterized in that, The processor includes a central processing unit and a graphics processing unit.

8. The system according to claim 1, characterized in that, The core power supply is composed of multiple power modules connected in parallel.

9. The system according to any one of claims 1 to 8, characterized in that, A heat sink is provided on the side of the core computing module away from the motherboard printed circuit board; the heat sink is used to dissipate heat from the core computing module.

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