Grinding disk device for sapphire wafer substrates

Abstract

The application discloses a grinding disc device of a sapphire wafer substrate, a signal acquisition module collects a grinding force signal of a grinding disc and transmits the signal to a control module, the control module compares a collected grinding force value F1 with a preset force value F0, calculates a deviation value E of the grinding force value F1 and the preset force value F0, and then: if the deviation value E is less than 0, the control module controls an execution module to execute a pressure increasing instruction, so that the grinding force of the grinding disc is increased; if the deviation value E is equal to 0, the control module does not issue an instruction to the execution module, so that the grinding force of the grinding disc remains unchanged; and if the deviation value E is greater than 0, the control module controls the execution module to execute a pressure decreasing instruction, so that the grinding force of the grinding disc is decreased. The grinding disc device can ensure that the grinding force of each grinding disc is stable and unchanged, so that the uniformity of the grinding force inside and outside the grinding disc is ensured. Moreover, the grinding disc device is more suitable for large-size grinding discs and is better for the grinding uniformity of the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a grinding disc device for sapphire wafer substrates. BACKGROUND

[0002] Sapphire is widely used in high-speed integrated circuits, laser chip communication, LEDs, high-speed missile fairing, mobile phone screens, optical elements, medical sapphire blades, high-temperature and high-strength structural elements, and other military and civilian fields due to its excellent properties such as high temperature resistance, wear resistance, good thermal conductivity, excellent electrical insulation, chemical stability, high hardness and high strength, and a very wide light transmission band. In these applications, precision or even ultra-precision machining of the surface of sapphire parts is required, especially for sapphire as LED substrate and window material, the workpiece surface is required to be super smooth and damage-free. However, sapphire is a hard and brittle material with electrical properties, and its hardness is only second to diamond, making it very difficult to process. Processing damage is easily caused during processing, and the processing efficiency is very low.

[0003] Grinding is an intermediate process for sapphire substrate processing. The grinding process uses a grinding disc device for grinding. Traditional grinding discs are connected by rigid methods such as bonding or sintering. A patent for a semi-solid grinding disc for semiconductor substrate grinding, with publication number CN209850657U and the name of a kind of semi-solid grinding disc for semiconductor substrate grinding, is disclosed. The patent includes a bottom base, a top grinding disc provided on the bottom base, a plurality of linearly and equally spaced transverse grooves provided on the top surface of the top grinding disc, a plurality of linearly and equally spaced vertical grooves provided on the top surface of the top grinding disc, the transverse grooves and the vertical grooves dividing the top surface of the top grinding disc into a plurality of grinding pieces, a plurality of honeycomb filler holes in communication with the outside provided in the grinding pieces, and semi-solid grinding media provided in the honeycomb filler holes, the vertical grooves, and the transverse grooves. When in use, the convex disc is fixedly installed on the bottom base using fastening bolts, and the limiting disc is fixedly connected to the flange disc on the external transmission shaft using fastening bolts. The bottom base and the top grinding disc are driven to rotate by the external transmission shaft, and the semiconductor substrate is ground. As can be seen from the drawings, the bottom base is a large-size grinding disc. When the transmission shaft drives the bottom base to rotate, the center area of the bottom base is subjected to greater force due to the limitations of the grinding disc structure and material, while the edge area is subjected to less force, resulting in uneven distribution of the grinding force of the grinding disc, which affects the uniformity of the grinding force.

[0004] It is necessary to design a grinding disc device suitable for large-size grinding discs and capable of adjusting the grinding force inside and outside the grinding disc at any time to ensure the uniformity of the grinding force inside and outside the grinding disc. SUMMARY

[0005] The present application provides a grinding disc device for sapphire wafer substrates, which overcomes the deficiencies of the prior art. The technical solution adopted by the present application to solve its technical problems is:

[0006] A grinding disc device of a sapphire wafer substrate, comprising:

[0007] A machine table;

[0008] A base disc rotatably connected to the machine table, and provided with a plurality of mounting cavities arranged in an array;

[0009] A plurality of execution modules, each of which is installed in a corresponding mounting cavity;

[0010] A plurality of signal acquisition modules, each of which is installed on a corresponding execution module;

[0011] A plurality of grinding discs, each of which is installed on a corresponding signal acquisition module;

[0012] A control module in signal connection with the execution modules and the signal acquisition modules;

[0013] The signal acquisition modules acquire grinding force signals of the grinding discs and transmit the signals to the control module, the control module compares the acquired grinding force value F1 with a preset force value F0, and calculates a deviation value E of the grinding force value F1 and the preset force value F0, and then:

[0014] If the deviation value E is less than 0, the control module controls the execution modules to execute a pressurization instruction so as to increase the grinding force of the grinding discs;

[0015] If the deviation value E is equal to 0, the control module does not issue an instruction to the execution modules so as to keep the grinding force of the grinding discs unchanged;

[0016] If the deviation value E is greater than 0, the control module controls the execution modules to execute a depressurization instruction so as to decrease the grinding force of the grinding discs.

[0017] In a preferred embodiment, the execution module adopts a damping device provided with a lifting disc, the signal acquisition module is installed on the lifting disc, and the control module can control the lifting disc to move up and down so as to drive the signal acquisition module and the grinding disc to move up and down synchronously, thereby increasing or decreasing the grinding force of the grinding disc.

[0018] In a preferred embodiment, the damping device further comprises a damping housing, a damping block, a damping rod and a damping spring, the damping housing is installed in the mounting cavity, the damping housing is divided into an upper damping cavity and a lower cavity, the upper damping cavity is filled with damping liquid, the top end of the damping rod extends upward after passing through the upper damping cavity, the lifting disc is fixed to the top end of the damping rod, the damping block is fixed to the damping rod and located in the upper damping cavity, the bottom end of the damping rod extends into the lower cavity, and one end of the damping spring is connected to the damping rod and the other end is fixed to the inner bottom wall of the damping housing.

[0019] In a preferred embodiment, the grinding disc is detachably mounted on the signal acquisition module.

[0020] In a preferred embodiment, the bottom end of the grinding disc is provided with a first magnetic attraction element, and the top end of the signal acquisition module is provided with a second magnetic attraction element, and the grinding disc is detachably mounted on the signal acquisition module through the magnetic attraction cooperation of the first magnetic attraction element and the second magnetic attraction element.

[0021] In a preferred embodiment, the bottom end of the signal acquisition module and the lifting disc are detachably connected through a magnetic attraction structure.

[0022] In a preferred embodiment, the signal acquisition module uses a pressure sensor.

[0023] In a preferred embodiment, the signal acquisition module uses one of a piezoresistive, piezoelectric, capacitive, and Hall type pressure sensor.

[0024] In a preferred embodiment, the base disc is further provided with a mounting groove, and the control module is mounted in the mounting groove.

[0025] In a preferred embodiment, a power supply module is further included, which is electrically connected with the control module, the signal acquisition module, and the execution module.

[0026] Compared with the background art, the technical scheme has the following advantages:

[0027] 1. The grinding disc, the signal acquisition module, and the execution module are assembled one-to-one, and are arranged in an array on the base disc. When the control module receives the grinding force value F1 of each grinding disc and compares it with the preset force value F0, the grinding force of each grinding disc is adjusted in real time through the control of the execution module, so as to ensure that the grinding force of each grinding disc is stable and unchanged, thereby ensuring the uniformity of the grinding force inside and outside the grinding disc. Moreover, the grinding disc device is more suitable for large-size grinding discs, and the grinding uniformity of the substrate is better.

[0028] 2. The control module can control the lifting disc of the damping device to move up and down, so as to drive the signal acquisition module and the grinding disc to move up and down synchronously, thereby increasing or decreasing the grinding force of the grinding disc. The damping device can buffer the up and down movement of the grinding disc, so as to ensure that the grinding disc can move in a small range.

[0029] 3. The grinding disc is detachably mounted on the signal acquisition module through the magnetic attraction cooperation of the first magnetic attraction element and the second magnetic attraction element, so that the grinding disc can be replaced at any time, and the use is more convenient.

[0030] 4. The bottom end of the signal acquisition module and the lifting disc are detachably connected through a magnetic attraction structure, so that the signal acquisition module can be replaced at any time, and the use is more convenient. BRIEF DESCRIPTION OF DRAWINGS

[0031] The application will be further described below in conjunction with the accompanying drawings and embodiments.

[0032] Figure 1 A circuit schematic diagram of a grinding disc device of a sapphire wafer substrate of a preferred embodiment is shown.

[0033] Figure 2 A side view schematic diagram of a grinding disc device of a sapphire wafer substrate of a preferred embodiment is shown.

[0034] Figure 3 A top view schematic diagram of a base disc of a preferred embodiment is shown.

[0035] Figure 4 An assembly schematic diagram of a damping device and a signal acquisition module, a grinding disc of a preferred embodiment is shown. DETAILED DESCRIPTION

[0036] In the claims, the specification, and the above drawings of the present application, unless otherwise stated, the terms "first", "second", or "third" etc. are used merely as identifiers to distinguish one object from another, and are not necessarily used to describe a specific sequence or order.

[0037] In the claims, the specification, and the above drawings of the present application, unless otherwise stated, the terms "first", "second", or "third" etc. are used merely as identifiers to distinguish one object from another, and are not necessarily used to describe a specific sequence or order.

[0038] In the claims, the specification, and the above drawings of the present application, unless otherwise stated, the terms "first", "second", or "third" etc. are used merely as identifiers to distinguish one object from another, and are not necessarily used to describe a specific sequence or order.

[0039] In the claims, the specification, and the above drawings of the present application, unless otherwise stated, the terms "first", "second", or "third" etc. are used merely as identifiers to distinguish one object from another, and are not necessarily used to describe a specific sequence or order.

[0040] Please refer to Figures 1 to 4A preferred embodiment of the grinding disc device for sapphire wafer substrate, the grinding disc device for sapphire wafer substrate comprises a machine table, a base disc 10, a plurality of execution modules 20, a plurality of signal acquisition modules 30, a plurality of grinding discs 40 and a control module 50.

[0041] The machine table is provided with a driving module, which can adopt the motor driving structure in the prior art.

[0042] The base disc 10 is rotatably connected to the machine table and is provided with a plurality of mounting cavities 11 arranged in an array. Specifically, as shown in Figure 2 The driving module adopts a motor rotor 12 connected to the base disc 10 to drive the base disc 10 to rotate.

[0043] In this embodiment, the base disc 10 is further provided with a mounting groove 13, and the control module 50 is mounted in the mounting groove 13.

[0044] In this embodiment, the grinding disc device further comprises a power supply module electrically connected to the control module 50, the signal acquisition module 30 and the execution module 20.

[0045] Each execution module 20 is mounted in a corresponding mounting cavity 11. In this embodiment, the execution module 20 adopts a damping device provided with a lifting disc 21, and the signal acquisition module 30 is mounted on the lifting disc 21. The control module 50 can control the lifting disc 21 to move up and down to drive the signal acquisition module 30 and the grinding disc 40 to move up and down synchronously, thereby increasing or decreasing the grinding force of the grinding disc 40.

[0046] Specifically, as shown in Figure 4 The damping device further comprises a damping housing 22, a damping block 23, a damping rod 24 and a damping spring 25. The damping housing 22 is mounted in the mounting cavity 11 and is divided into an upper damping cavity 221 and a lower cavity 222. The upper damping cavity 221 is filled with damping liquid. The top end of the damping rod 24 extends upward after passing through the upper damping cavity 221. The lifting disc 21 is fixed to the top end of the damping rod 24. The damping block 23 is fixed to the damping rod 24 and located in the upper damping cavity 221. The bottom end of the damping rod 24 extends into the lower cavity 222. One end of the damping spring 25 is connected to the damping rod 24, and the other end is fixed to the inner bottom wall of the damping housing 22.

[0047] Each signal acquisition module 30 is mounted on a corresponding execution module 20.

[0048] In the embodiment, the signal acquisition module 30 is detachably connected with the lifting disc 21 through a magnetic attraction structure. Alternatively, the signal acquisition module 30 can be fixedly connected with the lifting disc 21 through adhesion according to needs, without being limited thereto.

[0049] In the embodiment, the signal acquisition module 30 is a pressure sensor. In the embodiment, the signal acquisition module 30 is one of a piezoresistive pressure sensor, a piezoelectric pressure sensor, a capacitive pressure sensor and a Hall pressure sensor.

[0050] Each of the grinding discs 40 is respectively installed on the corresponding signal acquisition module 30.

[0051] In the embodiment, the grinding disc 40 is detachably installed on the signal acquisition module 30.

[0052] In the embodiment, the grinding disc 40 is provided with a first magnetic attraction member 41 at the bottom end, and the signal acquisition module 30 is provided with a second magnetic attraction member 31 at the top end. The grinding disc 40 is detachably installed on the signal acquisition module 30 through the magnetic attraction cooperation of the first magnetic attraction member 41 and the second magnetic attraction member 31.

[0053] The control module 50 is in signal connection with the execution module 20 and the signal acquisition module 30. The signal acquisition module 30 collects the grinding force signal of the grinding disc 40 and transmits the signal to the control module 50. The control module 50 compares the collected grinding force value F1 with the preset force value F0, calculates the deviation value E of the grinding force value F1 and the preset force value F0, and then:

[0054] If the deviation value E is less than 0, the control module 50 controls the execution module 20 to execute a pressure increasing instruction, so as to increase the grinding force of the grinding disc 40.

[0055] If the deviation value E is equal to 0, the control module 50 does not issue an instruction to the execution module 20, so as to keep the grinding force of the grinding disc 40 unchanged.

[0056] If the deviation value E is greater than 0, the control module 50 controls the execution module 20 to execute a pressure decreasing instruction, so as to decrease the grinding force of the grinding disc 40.

[0057] As shown in Figure 1 The control module 50 includes an input unit, an output unit, a processor, a memory and a radio frequency transceiver module. The input unit is connected with the signal acquisition module 30, and the output unit is connected with the execution module 20.

[0058] In actual use, as shown in Figure 2As shown, first, the sapphire wafer substrate 1 is fixed on the workpiece table 2, then the workpiece table 2 is moved downward until the sapphire wafer substrate 1 is attached to the top surface of the grinding disc 40, and then the grinding operation can be performed. The rotation speed of the base disc 10 is set to 80 r / min, the preset force value F0 is 70 N, the reciprocating translation speed of the workpiece table 2 is 1 mm / s, the rotation speed of the workpiece table 2 is 40 r / min, and the processing time is 30 min. At this time, the control module 50 calculates the deviation value E of the grinding force value F1 and the preset force value F0, and then the control execution module 20 can perform corresponding actions.

[0059] The above is only a preferred embodiment of the present application, and therefore cannot limit the scope of the present application. Any equivalent changes and modifications made in accordance with the scope of the present application and the content of the specification should still be within the scope of the present application.

Claims

1. A grinding disc apparatus for sapphire wafer substrates, characterized in that: It includes: Machine tool; The base plate is rotatably mounted on the machine base and has several mounting cavities arranged in an array. Several execution modules are installed in their respective mounting cavities; Several signal acquisition modules are installed on the corresponding execution module; Several grinding discs, each of which is installed on a corresponding signal acquisition module; The control module is connected to the execution module and the signal acquisition module via signals. The signal acquisition module acquires the grinding force signal of the grinding disc and transmits the signal to the control module. The control module compares the acquired grinding force value F1 with the preset force value F0, and calculates the deviation value E between the grinding force value F1 and the preset force value F0. If the deviation value E is less than 0, the control module controls the execution module to execute a pressurization command to increase the grinding force of the grinding disc; If the deviation value E is equal to 0, the control module will not issue instructions to the execution module so that the grinding force of the grinding disc remains constant. If the deviation value E is greater than 0, the control module controls the execution module to execute a pressure reduction command to reduce the grinding force of the grinding disc. The execution module employs a damping device, which is equipped with a lifting plate. The signal acquisition module is mounted on the lifting plate, and the control module can control the lifting plate to move up and down, thereby driving the signal acquisition module and the grinding plate to move up and down synchronously, thereby increasing or decreasing the grinding force of the grinding plate. The damping device further includes a damping shell, a damping block, a damping rod, and a damping spring. The damping shell is installed in the mounting cavity, and the interior of the damping shell is divided into an upper damping cavity and a lower cavity. The upper damping cavity is filled with damping fluid. The top end of the damping rod passes through the upper damping cavity and extends upward. The lifting plate is fixed to the top end of the damping rod. The damping block is fixed to the damping rod and located in the upper damping cavity. The bottom end of the damping rod extends into the lower cavity. One end of the damping spring is connected to the damping rod, and the other end is fixed to the bottom wall of the damping shell. The base plate is also provided with a mounting slot, and the control module is installed in the mounting slot.

2. The grinding disc apparatus for sapphire wafer substrates according to claim 1, characterized in that: The grinding disc is detachably mounted on the signal acquisition module.

3. The grinding disc apparatus for sapphire wafer substrates according to claim 2, characterized in that: The grinding disc is provided with a first magnetic suction component at the bottom and a second magnetic suction component at the top of the signal acquisition module. The grinding disc is detachably installed on the signal acquisition module by the magnetic attraction between the first magnetic suction component and the second magnetic suction component.

4. The grinding disc apparatus for sapphire wafer substrates according to claim 3, characterized in that: The bottom of the signal acquisition module is detachably connected to the lifting plate using a magnetic attraction structure.

5. The grinding disc apparatus for sapphire wafer substrates according to claim 4, characterized in that: The signal acquisition module uses a pressure sensor.

6. The grinding disc apparatus for sapphire wafer substrates according to claim 5, characterized in that: The signal acquisition module uses one of the following pressure sensors: piezoresistive, piezoelectric, capacitive, or Hall effect.

7. The grinding disc apparatus for sapphire wafer substrates according to claim 1, characterized in that: It also includes a power supply module, which is electrically connected to the control module, signal acquisition module, and execution module.

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