Manipulator, manipulator automatic calibration device and method

Abstract

The present disclosure provides a robot, a robot automatic calibration device and method, the robot comprising: a carrying body for carrying a wafer, the carrying body comprising a base, and a first arm portion and a second arm portion connected to the base and arranged at intervals; a moving assembly for moving the carrying body; and a sensor, the sensor comprising a transmitting end arranged on the first arm portion, and a receiving end arranged on the second arm portion, the transmitting end being configured to transmit a light beam transmitted along a first horizontal direction to the receiving end, and the receiving end being configured to generate a corresponding sensing signal according to the situation that the light beam is blocked by the wafer. The robot, the robot automatic calibration device and method provided by the present disclosure can realize automatic calibration of the robot during production, and can solve problems such as compatibility of different wafer boxes, or deviation of robot teaching positions, thereby reducing the risk of robot breakage, wafer damage, etc.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular, to a robot, a robot automatic calibration device and method. BACKGROUND

[0002] In the production and processing of wafers, when the robot grabs the wafers, due to the differences in wafer box types and sizes, or the deviation of the robot teaching position, etc., there are risks of robot breakage and wafer damage. However, in the related art, the calibration operation of the robot is performed in the device debugging stage, which cannot realize automatic calibration of the robot in the production process, and cannot simultaneously solve the problems of different wafer box differences or robot teaching position deviation, etc., and cannot completely solve the risks of robot breakage and wafer damage in production. SUMMARY

[0003] The embodiments of the present disclosure aim to provide a robot, a robot automatic calibration device and method, which can realize automatic calibration of the robot in the production process, and simultaneously solve the problems of different wafer box differences or robot teaching position deviation, etc., and reduce the risks of robot breakage and wafer damage.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] A robot comprises:

[0006] a carrying body for carrying a wafer, the carrying body comprising a base, and a first arm portion and a second arm portion connected to the base and arranged at intervals;

[0007] a moving assembly for moving the carrying body; and

[0008] a sensor, the sensor comprising a transmitting end arranged on the first arm portion, and a receiving end arranged on the second arm portion, the transmitting end being configured to transmit a light beam transmitted in a first horizontal direction to the receiving end, and the receiving end being configured to generate a corresponding sensing signal according to the blocking of the light beam by the wafer.

[0009] For example, the first arm portion and the second arm portion each comprise an inner side surface opposite to each other in the first horizontal direction, the transmitting end is arranged on the inner side surface of the first arm portion, and the receiving end is arranged on the inner side surface of the second arm portion.

[0010] A robot automatic calibration device for automatically calibrating a robot in the processing of wafers, the robot automatic calibration device comprising:

[0011] A robot, comprising: a carrying body for carrying a wafer; the carrying body comprising a base, and a first arm part and a second arm part connected to the base and spaced apart; a moving assembly for moving the carrying body; and a sensor, comprising a transmitting end provided on the first arm part, and a receiving end provided on the second arm part, the transmitting end being configured to transmit a light beam transmitted in a first horizontal direction to the receiving end, and the receiving end being configured to generate a corresponding sensing signal according to a situation that the light beam is blocked by the wafer; and

[0012] A controller, connected with the sensor and the moving assembly, configured to control the moving assembly to move the robot according to a predetermined strategy, determine a position of the robot according to a sensing signal fed back by the receiving end during movement of the robot, and calibrate the position of the robot in three-dimensional directions, the three-dimensional directions comprising a horizontal direction and a vertical direction, the horizontal direction comprising the first horizontal direction and a second horizontal direction perpendicular to each other.

[0013] Exemplarily, the wafer is arranged in layers in a wafer box in the vertical direction;

[0014] The controller comprises:

[0015] A first control module, connected with the moving assembly, configured to control the robot to move from a first position to a second position in the vertical direction, the robot being located directly above a topmost wafer in the wafer box in the vertical direction when being in the first position, and the robot being located directly below a bottommost wafer in the wafer box in the vertical direction when being in the second position.

[0016] A first processing module, connected with the sensor, configured to record positions of wafers in layers in the wafer box in the vertical direction according to a sensing signal fed back by the receiving end during movement of the robot from the first position to the second position.

[0017] Exemplarily, the controller further comprises:

[0018] A second control module, connected with the moving assembly and the first processing module, configured to control the robot to ascend to a third position in the vertical direction, the third position being a position of the bottommost wafer in the vertical direction, so as to calibrate the position of the robot in the vertical direction.

[0019] Exemplarily, the controller further comprises:

[0020] A third control module, connected to the moving component, is used to control the robotic arm to translate from the third position toward the fourth position along the second horizontal direction, wherein when the robotic arm is in the fourth position, the robotic arm is located outside the wafer cassette along the second horizontal direction;

[0021] The second processing module, connected to the sensor, is used to record the edge position of the bottom wafer in the second horizontal direction based on the sensing signal fed back by the receiving end during the movement of the robotic arm from the third position to the fourth position.

[0022] For example, the controller further includes:

[0023] The fourth control module, connected to the moving component and the first processing module, is used to control the robot to move along the second horizontal direction to the edge position in order to calibrate the position of the robot in the horizontal direction.

[0024] An automatic calibration method for a robotic arm, comprising the use of the automatic calibration device described above to perform automatic calibration of the robotic arm during wafer fabrication, the method comprising the following steps:

[0025] The robotic arm is controlled to move according to a predetermined strategy;

[0026] Based on the sensor signals detected by the sensor during the movement of the robotic arm, the position of the robotic arm is determined and the position of the robotic arm in three dimensions is calibrated. The three dimensions include the horizontal direction and the vertical direction. The horizontal direction includes the first horizontal direction and the second horizontal direction, which are perpendicular to each other.

[0027] For example, the method specifically includes:

[0028] The robotic arm is controlled to move vertically from a first position to a second position. When the robotic arm is in the first position, it is directly above the top wafer in the wafer cassette in the vertical direction. When the robotic arm is in the second position, it is directly below the bottom wafer in the wafer cassette in the vertical direction.

[0029] Based on the sensing signals fed back by the receiving end during the movement of the robotic arm from the first position to the second position, the positions of each layer of wafers in the wafer cassette in the vertical direction are recorded;

[0030] The robotic arm is controlled to rise along the vertical direction to a third position, which is the position of the bottom wafer in the vertical direction, in order to calibrate the position of the robotic arm in the vertical direction.

[0031] For example, the method further includes:

[0032] The robotic arm is controlled to translate from the third position to the fourth position along the second horizontal direction, wherein when the robotic arm is in the fourth position, the robotic arm is located outside the wafer cassette along the second horizontal direction;

[0033] Based on the sensing signal fed back by the receiving end during the movement of the robotic arm from the third position to the fourth position, the edge position of the bottom wafer in the second horizontal direction is recorded;

[0034] The robotic arm is controlled to move along the second horizontal direction to the edge position to calibrate its position in the horizontal direction.

[0035] The beneficial effects of the embodiments disclosed herein are as follows:

[0036] The robotic arm, automatic calibration device, and method disclosed herein feature a sensor transmitter and receiver on each of the two arms of the robotic arm. A horizontal light beam emitted by the transmitter is received by the receiver. When a wafer is placed between the two arms, its position can be determined by whether it blocks the light beam. This allows the robotic arm to be moved according to a predetermined strategy. The horizontal and vertical positions of the robotic arm are recorded based on the sensor signals, enabling automatic calibration of the robotic arm during wafer fabrication. This allows for the loading of different types of wafer cassettes, ensuring the safety of both the wafer and the robotic arm. The device is simple in structure, low in cost, and highly reliable. Attached Figure Description

[0037] Figure 1 This diagram illustrates the structure of the robotic arm provided in the embodiments of this disclosure.

[0038] Figure 2 This diagram illustrates the calibration process of the automatic calibration device for robotic arms provided in this embodiment of the present disclosure.

[0039] Figure 3 This diagram illustrates the structure of the controller in the automatic calibration device for robotic arms provided in this embodiment. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0041] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0042] like Figure 1 and Figure 2 As shown, this disclosure provides a robotic arm, the robotic arm 10 comprising:

[0043] The carrier body 11 for carrying the wafer 20 includes a base 111, and a first arm 112 and a second arm 113 connected to the base 111 and spaced apart along a first horizontal direction X.

[0044] The movable component (not shown in the figure) of the moving support body 11; and

[0045] The sensor 12 includes a transmitter 121 disposed on the first arm 112 and a receiver 122 disposed on the second arm 113. The transmitter 121 is used to transmit a light beam that is transmitted along a first horizontal direction X to the receiver 122. The receiver 122 is used to generate a corresponding sensing signal according to the situation where the light beam is blocked by the wafer 20.

[0046] In the above scheme, the transmitter 121 and receiver 122 of the sensor 12 are respectively provided on the first arm 112 and the second arm 113 of the robotic arm 10. The transmitter 121 can emit a light beam that is transmitted along the first horizontal direction X to the receiver 122. The first arm 112 and the second arm 113 can be spaced apart in the first horizontal direction X.

[0047] When the wafer 20 is placed between the first arm 112 and the second arm 113, and the light beam emitted by the transmitter 121 is on the same horizontal plane in the vertical direction as the wafer 20, if the light beam emitted by the transmitter 121 is blocked by the wafer 20, the receiver 122 cannot receive the light beam, and thus the sensor 12 can generate a first sensing signal. If the light beam emitted by the transmitter 121 is not blocked by the wafer 20, the receiver 122 can receive the light beam, and thus the sensor 12 can generate a second sensing signal. Therefore, if the robot arm 10 is moved in the second horizontal direction, the edge position of the wafer 20 in the horizontal direction can be determined based on the change in the sensing signal of the sensor 12.

[0048] Similarly, when the robotic arm 10 moves up and down along the vertical direction Z from directly above the wafer 20 to directly below it, if the light beam emitted by the transmitter 121 is blocked by the wafer 20, the receiver 122 cannot receive the light beam, and thus the sensor 12 can generate a first sensing signal. If the light beam emitted by the transmitter 121 is not blocked by the wafer 20, the receiver 122 can receive the light beam, and thus the sensor 12 can generate a second sensing signal. Therefore, if the robotic arm 10 moves up and down in the vertical direction Z, the position of the wafer 20 in the vertical direction Z can be determined based on the change in the sensing signal of the sensor 12.

[0049] Therefore, when the robot arm 10 moves horizontally and vertically in the Z direction according to the predetermined strategy, the position of the wafer 20 can be determined based on the sensing signal of the sensor 12. This allows for automatic calibration of the position of the robot arm 10, thereby achieving the purpose of automatic calibration of the robot arm 10 during the wafer 20 production process. This approach is compatible with different wafer cassettes 21 or deviations in the indicated position of the robot arm 10, reducing the risk of the robot arm 10 breaking or the wafer 20 being damaged.

[0050] As an exemplary implementation, the first arm 112 and the second arm 113 each include inner surfaces opposite to each other in the first horizontal direction X, the transmitting end 121 is disposed on the inner surface of the first arm 112, and the receiving end 122 is disposed on the inner surface of the second arm 113.

[0051] In addition, this disclosure also provides an automatic calibration device for robotic arm 10, used for automatic calibration of robotic arm 10 during wafer 20 processing.

[0052] like Figure 1 and Figure 3 As shown, the automatic calibration device of the robotic arm 10 includes:

[0053] A robotic arm 10 includes: a support body 11 for carrying a wafer 20; the support body 11 includes a base 111, and a first arm 112 and a second arm 113 spaced apart from the base 111; a moving component for moving the support body 11; and a sensor 12, the sensor 12 including a transmitting end 121 disposed on the first arm 112 and a receiving end 122 disposed on the second arm 113, the transmitting end 121 being used to emit a light beam transmitted along a first horizontal direction X to the receiving end 122, and the receiving end 122 being used to generate a corresponding sensing signal according to whether the light beam is blocked by the wafer 20; and

[0054] The controller 30 is connected to the sensor 12 and the moving component, and is used to control the moving component to move the robot arm 10 according to a predetermined strategy, and to determine the position of the robot arm 10 based on the sensing signal fed back by the receiver 122 during the movement of the robot arm 10, and to calibrate the position of the robot arm 10 in three dimensions, the three dimensions including the horizontal direction and the vertical direction Z, the horizontal direction including the first horizontal direction X and the second horizontal direction Y which are perpendicular to each other.

[0055] In the above scheme, the transmitter 121 and receiver 122 of the sensor 12 are respectively provided on the first arm 112 and the second arm 113 of the robotic arm 10. The transmitter 121 can emit a light beam that is transmitted along the first horizontal direction X to the receiver 122. The first arm 112 and the second arm 113 can be spaced apart in the first horizontal direction X.

[0056] When the wafer 20 is placed between the first arm 112 and the second arm 113, and the light beam emitted by the transmitter 121 is on the same horizontal plane in the vertical direction Z as the wafer 20, if the light beam emitted by the transmitter 121 is blocked by the wafer 20, the receiver 122 cannot receive the light beam, and thus the sensor 12 can generate a first sensing signal. If the light beam emitted by the transmitter 121 is not blocked by the wafer 20, the receiver 122 can receive the light beam, and thus the sensor 12 can generate a second sensing signal. Therefore, if the robot arm 10 is translated in the second horizontal direction Y, the edge position of the wafer 20 in the horizontal direction can be determined based on the change in the sensing signal of the sensor 12.

[0057] Similarly, when the robotic arm 10 moves up and down along the vertical direction Z from directly above the wafer 20 to directly below it, if the light beam emitted by the transmitter 121 is blocked by the wafer 20, the receiver 122 cannot receive the light beam, and thus the sensor 12 can generate a first sensing signal. If the light beam emitted by the transmitter 121 is not blocked by the wafer 20, the receiver 122 can receive the light beam, and thus the sensor 12 can generate a second sensing signal. Therefore, if the robotic arm 10 moves up and down in the vertical direction Z, the position of the wafer 20 in the vertical direction Z can be determined based on the change in the sensing signal of the sensor 12.

[0058] As an exemplary embodiment, such as Figure 2 As shown, the wafer 20 is arranged in layers along the vertical direction Z inside the wafer box 21, wherein the wafer box 21 has a slot 22 for holding the wafer 20.

[0059] like Figure 2 and Figure 3 As shown, the controller 30 includes:

[0060] The first control module 31, connected to the moving component 40, is used to control the robotic arm 10 to move from the first position A to the second position B along the vertical direction Z. When the robotic arm 10 is in the first position A, it is located directly above the top wafer 20 in the wafer box 21 in the vertical direction Z. When the robotic arm 10 is in the second position B, it is located directly below the bottom wafer 20 in the wafer box 21 in the vertical direction Z.

[0061] The first processing module 32, connected to the sensor 12, is used to record the position of each layer of wafers 20 in the wafer cassette 21 in the vertical direction Z based on the sensing signal fed back by the receiving end 122 during the movement of the robotic arm 10 from the first position A to the second position B.

[0062] In the above scheme, the robotic arm 10 can be controlled to move from the first position A to the second position B along the vertical direction Z. That is, the robotic arm 10 moves from directly above the top layer wafer 20 to directly below the bottom layer wafer 20. During this entire movement, when the robotic arm 10 passes the wafer 20, the sensor 12 will automatically sense the wafer 20 and feed back the sensing signal to the first processing module 32. The first processing module 32 then records the position of each layer wafer 20 in the vertical direction Z. Based on the position of each layer wafer 20 in the vertical direction Z, the position of the robotic arm 10 in the vertical direction Z can be automatically calibrated.

[0063] Specifically, in some embodiments, the controller 30 further includes a second control module 33 connected to the moving component 40 and the first processing module 32, for controlling the robot arm 10 to rise along the vertical direction Z to a third position C, the third position C being the position of the bottom wafer 20 in the vertical direction Z, so as to calibrate the position of the robot arm 10 in the vertical direction Z.

[0064] In the above scheme, the position of the robot arm 10 in the vertical direction Z is calibrated by moving the robot arm 10 along the vertical direction Z to a position in the vertical direction Z where the bottom layer wafer 20 is located. It should be understood that in other embodiments, the robot arm 10 can also be calibrated based on the position in the vertical direction Z of any layer wafer 20.

[0065] Furthermore, in some exemplary embodiments, such as Figure 2 and Figure 3 As shown, the controller 30 further includes:

[0066] The third control module 34 is connected to the moving component 40 and is used to control the robotic arm 10 to translate from the third position C toward the fourth position along the second horizontal direction Y, wherein when the robotic arm 10 is in the fourth position, the robotic arm 10 is located on the outer side of the wafer cassette 21 along the second horizontal direction Y.

[0067] The second processing module 35, connected to the sensor 12, is used to record the edge position of the bottom wafer 20 in the second horizontal direction Y based on the sensing signal fed back by the receiving end 122 during the movement of the robotic arm 10 from the third position C to the fourth position.

[0068] In the above scheme, the robot arm 10 can be controlled to move from the third position C to the fourth position along the second horizontal direction Y. That is, the robot arm 10 moves from directly above the bottom layer wafer 20 to the outside of the bottom layer wafer 20. During this entire translation process, when the robot arm 10 passes the wafer 20, the sensor 12 will automatically sense the wafer 20 and feed back the sensing signal to the second processing module. The second processing module records the edge position of each layer wafer 20 in the second horizontal direction Y. Based on the edge position of the wafer 20 in the second horizontal direction Y, the position of the robot arm 10 in the horizontal direction can be automatically calibrated.

[0069] Specifically, such as Figure 2 and Figure 3 As shown, the controller 30 further includes:

[0070] The fourth control module 36, connected to the moving component 40 and the second processing module 35, is used to control the robot arm 10 to move along the second horizontal direction Y to the edge position in order to calibrate the position of the robot arm 10 in the horizontal direction.

[0071] In the above scheme, the position of the robot arm 10 in the second horizontal direction Y is calibrated by translating the robot arm 10 to the outside of the bottom layer wafer 20. It should be understood that in other embodiments, the robot arm 10 can also be calibrated based on the position in the second horizontal direction Y of any layer wafer 20.

[0072] As can be seen from the above scheme, the automatic calibration of the robot arm 10 is not limited by the size of the wafer 20, and is compatible with the differences of different wafer boxes 21 or the teaching position deviation of the robot arm 10. The automatic calibration of the robot arm 10 can be realized during the wafer 20 production process.

[0073] Furthermore, this disclosure also provides an automatic calibration method for a robotic arm 10. The automatic calibration device for the robotic arm 10 provided in this disclosure is used to automatically calibrate the robotic arm 10 during the wafer 20 processing. The method includes the following steps:

[0074] The robotic arm 10 is controlled to move according to a predetermined strategy;

[0075] Based on the sensing signals from the sensor 12 during the movement of the robotic arm 10, the position of the robotic arm 10 is determined, and the position of the robotic arm 10 in the three-dimensional direction is calibrated.

[0076] For example, the method specifically includes:

[0077] Step S01: Control the robotic arm 10 to move from the first position A to the second position B along the vertical direction Z. When the robotic arm 10 is in the first position A, it is directly above the top wafer 20 in the wafer box 21 in the vertical direction Z. When the robotic arm 10 is in the second position B, it is directly below the bottom wafer 20 in the wafer box 21 in the vertical direction Z.

[0078] Step S02: Based on the sensing signal fed back by the receiving end 122 during the movement of the robotic arm 10 from the first position A to the second position B, record the position of each layer of wafers 20 in the wafer cassette 21 in the vertical direction Z.

[0079] Step S03: Control the robot arm 10 to rise along the vertical direction Z to the third position C, where the third position C is the position of the bottom wafer 20 in the vertical direction Z, so as to calibrate the position of the robot arm 10 in the vertical direction Z.

[0080] In the above scheme, the robotic arm 10 can be controlled to move from the first position A to the second position B along the vertical direction Z. That is, the robotic arm 10 moves from directly above the top layer wafer 20 to directly below the bottom layer wafer 20. During this entire movement, when the robotic arm 10 passes the wafer 20, the sensor 12 will automatically sense the wafer 20 and feed back the sensing signal to the first processing module 32. The first processing module 32 then records the position of each layer wafer 20 in the vertical direction Z. Based on the position of each layer wafer 20 in the vertical direction Z, the position of the robotic arm 10 in the vertical direction Z can be automatically calibrated.

[0081] Specifically, in some embodiments, the position of the robot arm 10 in the vertical direction Z is calibrated by moving the robot arm 10 along the vertical direction Z to a position in the vertical direction Z where the bottom layer wafer 20 is located. It should be understood that in other embodiments, the robot arm 10 can also be calibrated based on the position in the vertical direction Z of any layer wafer 20.

[0082] For example, the method further includes:

[0083] Step S04: Control the robotic arm 10 to translate from the third position C to the fourth position along the second horizontal direction Y, wherein when the robotic arm 10 is in the fourth position, the robotic arm 10 is located on the outer side of the wafer cassette 21 along the second horizontal direction Y;

[0084] Step S05: Based on the sensing signal fed back by the receiving end 122 during the movement of the robotic arm 10 from the third position C to the fourth position, record the edge position of the bottom wafer 20 in the second horizontal direction Y.

[0085] Step S06: Control the robot arm 10 to move along the second horizontal direction Y to the edge position to calibrate the position of the robot arm 10 in the horizontal direction.

[0086] In the above scheme, the robot arm 10 can be controlled to move from the third position C to the fourth position along the second horizontal direction Y. That is, the robot arm 10 moves from directly above the bottom layer wafer 20 to the outside of the bottom layer wafer 20. During this entire translation process, when the robot arm 10 passes the wafer 20, the sensor 12 will automatically sense the wafer 20 and feed back the sensing signal to the second processing module. The second processing module records the edge position of each layer wafer 20 in the second horizontal direction Y. Based on the edge position of the wafer 20 in the second horizontal direction Y, the position of the robot arm 10 in the horizontal direction can be automatically calibrated.

[0087] Specifically, the position of the robot arm 10 in the second horizontal direction Y is calibrated by translating the robot arm 10 along the second horizontal direction Y to the outside of the bottom layer wafer 20. It should be understood that in other embodiments, the robot arm 10 may also be calibrated based on the position in the second horizontal direction Y of any layer wafer 20.

[0088] As can be seen from the above scheme, the automatic calibration of the robot arm 10 is not limited by the size of the wafer 20, and is compatible with the differences of different wafer boxes 21 or the teaching position deviation of the robot arm 10. The automatic calibration of the robot arm 10 can be realized during the wafer 20 production process.

[0089] The following points need to be explained:

[0090] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0091] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0092] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0093] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. An automatic calibration device for a robotic arm, used for automatic calibration of a robotic arm during wafer fabrication; characterized in that, The automatic calibration device for the robotic arm includes: A robotic arm, comprising: a carrier body for carrying a wafer; the carrier body including a base, and a first arm and a second arm spaced apart from the base; a moving component for moving the carrier body; and a sensor, the sensor including a transmitting end disposed on the first arm and a receiving end disposed on the second arm, the transmitting end for emitting a light beam propagating along a first horizontal direction to the receiving end, and the receiving end for generating a corresponding sensing signal based on whether the light beam is blocked by the wafer; and A controller, connected to the sensor and the moving component, is used to control the moving component to move the robotic arm according to a predetermined strategy, and to determine the position of the robotic arm based on the sensing signals fed back by the receiving end during the movement of the robotic arm, and to calibrate the position of the robotic arm in three dimensions, the three dimensions including the horizontal direction and the vertical direction, the horizontal direction including the first horizontal direction and the second horizontal direction that are perpendicular to each other; The wafers are arranged in layers within the wafer box along the vertical direction; The controller includes: A first control module, connected to the moving component, is used to control the robotic arm to move vertically from a first position to a second position. When the robotic arm is in the first position, it is directly above the topmost wafer in the wafer cassette in the vertical direction. When the robotic arm is in the second position, it is directly below the bottommost wafer in the wafer cassette in the vertical direction. The first processing module, connected to the sensor, is used to record the position of each layer of wafers in the wafer cassette in the vertical direction based on the sensing signal fed back by the receiving end during the movement of the robotic arm from the first position to the second position.

2. The automatic calibration device for a robotic arm according to claim 1, characterized in that, The first arm and the second arm each include inner sides facing each other in the first horizontal direction, the transmitting end is disposed on the inner side of the first arm, and the receiving end is disposed on the inner side of the second arm.

3. The automatic calibration device for a robotic arm according to claim 1, characterized in that, The controller also includes: The second control module, connected to the moving component and the first processing module, is used to control the robot to rise to a third position along the vertical direction, the third position being the position of the bottom wafer in the vertical direction, so as to calibrate the position of the robot in the vertical direction.

4. The automatic calibration device for a robotic arm according to claim 3, characterized in that, The controller also includes: A third control module, connected to the moving component, is used to control the robotic arm to translate from the third position toward the fourth position along the second horizontal direction, wherein when the robotic arm is in the fourth position, the robotic arm is located outside the wafer cassette along the second horizontal direction; The second processing module, connected to the sensor, is used to record the edge position of the bottom wafer in the second horizontal direction based on the sensing signal fed back by the receiving end during the movement of the robotic arm from the third position to the fourth position.

5. The automatic calibration device for a robotic arm according to claim 4, characterized in that, The controller also includes: The fourth control module, connected to the moving component and the first processing module, is used to control the robot to move along the second horizontal direction to the edge position in order to calibrate the position of the robot in the horizontal direction.

6. An automatic calibration method for a robotic arm, characterized in that, The automatic robot calibration device as described in any one of claims 1 to 5 is used to perform automatic robot calibration during wafer processing, the method comprising the following steps: The robotic arm is controlled to move according to a predetermined strategy; Based on the sensor signals detected by the sensor during the movement of the robotic arm, the position of the robotic arm is determined and the position of the robotic arm in three dimensions is calibrated. The three dimensions include the horizontal direction and the vertical direction. The horizontal direction includes the first horizontal direction and the second horizontal direction, which are perpendicular to each other.

7. The automatic calibration method for a robotic arm according to claim 6, characterized in that, The method specifically includes: The robotic arm is controlled to move vertically from a first position to a second position. When the robotic arm is in the first position, it is directly above the top wafer in the wafer cassette in the vertical direction. When the robotic arm is in the second position, it is directly below the bottom wafer in the wafer cassette in the vertical direction. Based on the sensing signals fed back by the receiving end during the movement of the robotic arm from the first position to the second position, the positions of each layer of wafers in the wafer cassette in the vertical direction are recorded; The robotic arm is controlled to rise along the vertical direction to a third position, which is the position of the bottom wafer in the vertical direction, in order to calibrate the position of the robotic arm in the vertical direction.

8. The automatic calibration method for a robotic arm according to claim 7, characterized in that, The method further includes: The robotic arm is controlled to translate from the third position to the fourth position along the second horizontal direction, wherein when the robotic arm is in the fourth position, the robotic arm is located outside the wafer cassette along the second horizontal direction; Based on the sensing signal fed back by the receiving end during the movement of the robotic arm from the third position to the fourth position, the edge position of the bottom wafer in the second horizontal direction is recorded; The robotic arm is controlled to move along the second horizontal direction to the edge position to calibrate its position in the horizontal direction.

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