A device for rapidly grinding and cutting irregular silicon carbide ingots

Abstract

The present invention discloses a device for rapidly grinding and cutting irregular silicon carbide ingots, which relates to the field of cargo transportation. The device comprises a plurality of grinding and cutting units for grinding and cutting irregular silicon carbide ingots; a drive unit for simultaneously driving the plurality of grinding and cutting units to move linearly; and a rotating support unit for supporting the irregular silicon carbide ingot and performing a rotational operation on the ingot. The plurality of grinding and cutting units are mounted on the drive unit, which is mounted on the rotating support unit. The device uses a plurality of grinding and cutting units to perform vertical rotational grinding and cutting on the ingot, which can quickly remove irregular portions of the ingot. Furthermore, the diamond wire can be of a smaller diameter (which can be selected based on the precision of fine grinding), which can simultaneously cut the ingot and perform a fine grinding effect on it, thereby obtaining a standard round ingot (i.e., a qualified ingot obtained after a traditional grinding process) in one go. The device is easy and quick to operate.

Description

Technical Field

[0001] The invention relates to the field of carburized silicon carbide ingots, and in particular to a device for rapidly grinding and cutting irregular silicon carbide ingots. Background Art

[0002] Silicon carbide (SiC) single crystals have excellent semiconductor physical properties such as high thermal conductivity, high breakdown voltage, extremely high carrier mobility, and high chemical stability. They can be made into high-frequency, high-power electronic and optoelectronic devices that operate under high temperature and strong radiation conditions. They have huge application value in national defense, high technology, industrial production, power supply, and power transformation, and are regarded as a third-generation wide bandgap semiconductor material with great development prospects.

[0003] Currently, physical vapor deposition (PVT) is a commonly used method for growing silicon carbide ingots. In this method, silicon carbide powder is used as the raw material. When the silicon carbide powder in the crucible is heated to a certain temperature, it will significantly sublime. The decomposed silicon carbide gas will be transported along the temperature gradient and condensed at the silicon carbide seed crystal to form a silicon carbide ingot. The silicon carbide ingot can form an irregular shape due to various reasons such as unstable crystal growth conditions, crystal orientation selection, and chemical properties or structural mismatch between the raw material gas phase and the substrate surface. To this end, grinding is usually used to make its outer diameter consistent. Before grinding, the irregular surfaces at both ends of the ingot need to be cut off using a wire cutting machine to form a regular plane (to facilitate subsequent clamping of the clamping mechanism). The ingot is then clamped and fixed by the clamping mechanism on the grinder to contact the two end surfaces of the ingot for grinding. Grinding generally includes three stages: coarse grinding, medium grinding, and fine grinding. The operation is cumbersome and time-consuming. Therefore, the present application provides a rapid grinding and cutting device for irregular silicon carbide ingots to meet this need. Summary of the Invention

[0004] The purpose of this application is to provide a device for rapidly grinding and cutting irregular silicon carbide ingots to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a device for rapidly grinding and cutting irregular silicon carbide ingots, comprising a plurality of grinding and cutting units, for grinding and cutting irregular silicon carbide ingots;

[0006] Driving unit: used to drive the multiple grinding and cutting units to move linearly at the same time;

[0007] Rotating carrying unit: used to carry irregular silicon carbide ingots and rotate them;

[0008] Wherein, a plurality of grinding and cutting units are all mounted on the driving unit, and the driving unit is mounted on the rotating bearing unit.

[0009] Preferably, the rotating bearing unit includes a bearing plate with a diameter smaller than the size of the silicon carbide ingot, a rotating ring is rotatably provided on the outer wall of the bearing plate, and the rotating ring is fixed in the material receiving barrel through a column, the bearing plate is fixedly connected to the gear ring through a connecting rod, a mounting plate is fixed below the gear ring, and a rotating motor meshing with the gear ring is mounted on the mounting plate, and a plurality of power telescopic rods are circumferentially provided on the periphery of the material receiving barrel;

[0010] The drive unit includes a hollow cylinder fixed to the upper ends of the multiple power telescopic rods and having an inner diameter larger than the size of the silicon carbide ingot, a plurality of cooling tubes are circumferentially arranged on the inner wall of the hollow cylinder, a mounting ring is fixed to the outer wall of the hollow cylinder, and a plurality of limiting through holes are circumferentially arranged on the mounting ring, a drive ring is rotatably provided on the outer wall of the mounting ring, and a plurality of inclined grooves are circumferentially arranged on the drive ring, a drive motor is fixed to the bottom of the mounting ring, and a drive gear is fixed to the output shaft of the drive motor, and the drive gear is gear-engaged with the drive gear arranged in an arc shape at the lower end of the mounting ring;

[0011] The grinding and cutting unit includes a plate body with a plurality of guide wheels installed, one of the guide wheels is connected to the output shaft of the grinding and cutting motor installed on the plate body, and diamond wires are sleeved on the plurality of guide wheels. A square limiting rod passing through the corresponding limiting through holes is fixed on the plate body, and two limiting blocks are provided on the square limiting rod, and the opposite ends of the two limiting blocks are in sliding contact with the upper and lower ends of the mounting ring respectively. A driving rod with a lower end located in the corresponding inclined groove is fixed on the plate body;

[0012] The axis of the hollow cylinder, the axis of the supporting plate, and the axis of the circle formed by the plurality of grinding and cutting units are all on the same vertical line.

[0013] Preferably, it also includes a plurality of U-shaped baffles corresponding to the plurality of diamond wires, and the plurality of U-shaped baffles are circumferentially arranged on the periphery of the rotating ring. The U-shaped cavity of the U-shaped baffle is adapted to the diameter and movement trajectory of the diamond wire, and a material removal gap is formed between two adjacent U-shaped baffles.

[0014] Preferably, it also includes an axial alignment unit, which includes a transparent plate installed at the axis of the supporting disk and a sealing plate fixed to the upper end of the gear ring, the sealing plate is penetrated by a square gear rod, a weight block is fixed to the upper end of the square gear rod, and a first mirror is provided at the upper end of the weight block, the square gear rod is connected to a T-shaped gear rod with a lower end penetrating the mounting plate through a transmission gear provided on the mounting plate, the cross bar of the T-shaped gear rod extends to the outer diameter of the hollow cylinder, a mark is provided at the axis of the transparent plate, the diameter of the transparent plate is smaller than the diameter of the ground silicon carbide ingot, the upper end face of the transparent plate is located below the upper end face of the supporting disk, and the lower end of the supporting disk is provided with a accommodating cavity.

[0015] Preferably, a second mirror surface is obliquely provided on the upper end of the weight-increasing block, and the second mirror surface is inclined toward the direction of the first mirror surface.

[0016] Preferably, the upper end surface of the carrier plate is provided with a groove, and a push switch is installed in the groove, the pressing upper end of the push switch is arc-shaped, a ring-shaped power supply is provided in the accommodating cavity of the carrier plate, and a plurality of lighting lamps are circumferentially arranged on the inner ring of the ring-shaped power supply.

[0017] Preferably, the push switch is the lighting start switch of the lighting lamp, and further includes a closing push switch, and the closing push switch is located at the contact portion between the T-shaped gear rod and the hollow cylinder.

[0018] In summary, the technical effects and advantages of the present invention are:

[0019] 1. The present invention has a reasonable structure. The device uses multiple grinding and cutting units to perform vertical rotation grinding and cutting on the crystal ingot, which can quickly remove irregular parts on the crystal ingot. The diamond wire can use a smaller diameter (which can be selected according to the fine grinding accuracy). While cutting the crystal ingot, it also has a fine grinding effect on it. A standard round crystal ingot (that is, a qualified crystal ingot obtained after the traditional grinding process) can be obtained in one go. The operation of this device is convenient and fast.

[0020] 2. The present invention also includes an axis alignment unit to facilitate the alignment and placement of the crystal ingot. At the same time, it can be automatically stored during grinding and cutting to prevent the first mirror from being splashed by liquid, adhered by grinding chips, and hit by the crystal block. After cutting, it automatically returns to its original position. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0023] Figure 2 For the present invention Figure 1 Schematic diagram of the hollow cylinder structure;

[0024] Figure 3 For the present invention Figure 2 Schematic diagram of the hollow core tube structure viewed from above;

[0025] Figure 4 For the present invention Figure 2 Schematic diagram of the hollow core tube structure from a top view;

[0026] Figure 5 For the present invention Figure 1 Schematic diagram of the structure of the grinding and cutting unit;

[0027] Figure 6 For the present invention Figure 1 Schematic diagram of the structure of the middle rotating bearing unit;

[0028] Figure 7 For the present invention Figure 6 Schematic diagram of the structure of the middle load plate when viewed from above;

[0029] Figure 8 For the present invention Figure 1 A is a schematic diagram of the enlarged structure.

[0030] Figure: 1. Grinding unit; 101. Plate; 102. Guide wheel; 103. Grinding motor; 104. Square limit rod; 105. Limit block; 106. Drive rod; 2. Drive unit; 21. Hollow cylinder; 22. Mounting ring; 23. Drive ring; 24. Cooling pipe; 25. Drive gear; 26. Drive motor; 27. Drive gear; 28. Inclined groove; 29. ​​Limiting hole; 3. Rotating bearing unit; 31. Carrying plate ; 32. swivel; 33. column; 34. gear ring; 35. rotating motor; 36. mounting plate; 37. receiving barrel; 38. power telescopic rod; 4. U-shaped baffle; 5. axis alignment unit; 51. transparent sheet; 52. square gear rod; 53. T-shaped gear rod; 54. transmission gear; 55. weight block; 56. first mirror; 57. second mirror; 58. sealing plate; 6. push switch; 7. ring power supply; 8. lighting lamp. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Example: Reference Figure 1 The device for rapidly grinding and cutting irregular silicon carbide ingots shown includes a grinding and cutting unit 1: a plurality of grinding and cutting units 1 are provided for grinding and cutting irregular silicon carbide ingots;

[0033] Driving unit 2: used to drive multiple grinding and cutting units 1 to move linearly at the same time;

[0034] Rotating carrying unit 3: used for carrying the irregular silicon carbide ingot and rotating the silicon carbide ingot.

[0035] The plurality of grinding and cutting units 1 are all mounted on the driving unit 2 , and the driving unit 2 is mounted on the rotating bearing unit 3 .

[0036] As a preferred implementation in this embodiment, Figure 1-7As shown, the rotating carrying unit 3 includes a carrying plate 31 with a diameter smaller than the size of the silicon carbide ingot, and a rotating ring 32 is rotatably provided on the outer wall of the carrying plate 31, and the rotating ring 32 is fixed in the material receiving barrel 37 through a column 33, and the carrying plate 31 is fixedly connected to the gear ring 34 through a connecting rod, and a mounting plate 36 is fixed below the gear ring 34, and a rotating motor 35 meshing with the gear ring 34 is installed on the mounting plate 36, and a plurality of power telescopic rods 38 are circumferentially provided on the periphery of the material receiving barrel 37; the driving unit 2 includes a hollow cylinder 21 fixed to the upper ends of multiple power telescopic rods 38 and with an inner diameter larger than the size of the silicon carbide ingot, and a plurality of cooling tubes 24 are circumferentially provided on the inner wall of the hollow cylinder 21, a mounting ring 22 is fixed on the outer wall of the hollow cylinder 21, and a plurality of limiting through holes 29 are circumferentially arranged on the mounting ring 22, a driving ring 23 is rotatably provided on the outer wall of the mounting ring 22, and a plurality of inclined rings 38 are circumferentially arranged on the driving ring 23 Groove 28, a driving motor 26 is fixed to the bottom of the mounting ring 22, and a driving gear 25 is fixed on the output shaft of the driving motor 26, and the driving gear 25 is geared with the driving teeth 27 arranged in an arc shape at the lower end of the mounting ring 22; the grinding and cutting unit 1 includes a plate body 101 on which a plurality of guide wheels 102 are installed, one of which is connected to the output shaft of the grinding and cutting motor 103 installed on the plate body 101, and diamond wires are sleeved on the plurality of guide wheels 102, and a square limiting rod 104 passing through the corresponding limiting through-hole 29 is fixed on the plate body 101, and two limiting blocks 105 are provided on the square limiting rod 104, and the opposite ends of the two limiting blocks 105 are respectively in sliding contact with the upper and lower ends of the mounting ring 22, and a driving rod 106 is fixed on the plate body 101, the lower end of which is located in the corresponding inclined groove 28; the axis center of the hollow cylinder 21, the axis center of the carrying plate 31 and the axis center of the circle surrounded by the plurality of grinding and cutting units 1 are all on the same vertical straight line.

[0037] When in use, the crystal ingot with irregular surfaces at both ends cut off is placed on the supporting plate 31, and the axis of the crystal ingot is aligned with the axis of the supporting plate 31. After completion, the power telescopic rod 38 is controlled to drive the hollow cylinder 21 to move downward, and the movement is stopped when the guide wheel 102 arranged below is located below the crystal ingot. The multiple rotary motors 35 and the drive motor 26 are controlled to work. The rotary motor 35 drives the diamond wire to move quickly, and the drive motor 26 can drive the rotating ring 32 to move slowly. Due to the setting of the square limit rod 104, the plate body 101 can only move in a straight line. Therefore, when the rotating ring 32 rotates, the cooperation of the inclined slot 28 and the drive rod 106 can make the plate body 101 move closest to the crystal ingot as slowly as possible, so that the diamond wire performs a straight line motion cutting on the crystal ingot. When the diamond wire moves to the set standard position, the drive motor 26 stops working, and the rotary motor 35 works to drive the crystal ingot to rotate, and the moving diamond wire is used to perform rotational cutting on the crystal ingot. The crystal blocks that fall down during the process and the cooling water sprayed from the cooling pipe 24 eventually fall into the receiving barrel 37. When the crystal ingot is cut into a circle by the combined force of multiple diamond wires, the rotating motor 35 and the grinding motor 103 both stop working. At this time, the driving motor 26 rotates in the opposite direction to drive the diamond wire to return to its original position, and then drives the hollow cylinder 21 to return to its original position through the power telescopic rod 38. The device adopts multiple grinding units 1 to perform vertical rotational grinding on the crystal ingot, which can quickly remove irregular parts on the crystal ingot, and the diamond wire can be of smaller diameter (can be selected according to the fine grinding accuracy). While cutting the crystal ingot, it also has a fine grinding effect on it, and a standard round crystal ingot (that is, a qualified crystal ingot obtained after the traditional grinding process) can be obtained at one time. The operation of the device is convenient and fast. Since the device does not grind the irregular parts on the crystal ingot into grinding chips, but removes the irregular parts by cutting, the total heat generated by this method is small, and the amount of cooling water used is greatly reduced.

[0038] It should be noted that, first, the cooling pipe 24 is connected to the cooling water source through the pump body; second, this device is not suitable for grinding and cutting longer ingots; third, when cutting, the diamond wire moves along the Figure 5 The power telescopic rod can be an electric telescopic rod, an air cylinder or a hydraulic cylinder.

[0039] As a preferred implementation in this embodiment, Figure 6As shown, it also includes a plurality of U-shaped baffles 4 corresponding to the plurality of diamond wires. The plurality of U-shaped baffles 4 are circumferentially arranged on the periphery of the rotating ring 32. The U-shaped cavity of the U-shaped baffle 4 is adapted to the diameter and movement trajectory of the diamond wire. A feeding gap is formed between two adjacent U-shaped baffles 4. When the diamond wire makes a cutting movement close to the ingot, the diamond wire will enter the U-shaped cavity of the U-shaped baffle 4. At the same time, the guide wheel 102 at the bottom will move to the bottom of the U-shaped baffle 4, which can prevent the bottom guide wheel 102 from being hit by the cut crystal block and causing a large amplitude of shaking, thereby avoiding affecting the stability of the diamond wire, thereby being beneficial to improving the quality of the ingot grinding.

[0040] As a preferred implementation in this embodiment, Figure 6-8 As shown, it also includes an axial alignment unit 5, which includes a transparent sheet 51 installed at the axis of the carrier plate 31 and a sealing plate 58 fixed to the upper end of the gear ring 34. The sealing plate 58 is penetrated by a square gear rod 52, and a weight block 55 is fixed to the upper end of the square gear rod 52, and a first mirror 56 is provided on the upper end of the weight block 55. The square gear rod 52 is gear-connected with a T-shaped gear rod 53 whose lower end penetrates the mounting plate 36 through a transmission gear 54 provided on the mounting plate 36. The cross bar of the T-shaped gear rod 53 extends to the outer diameter of the hollow cylinder 21. A mark is provided at the axis of the transparent sheet 51. The diameter of the transparent sheet 51 is smaller than the diameter of the ground silicon carbide ingot. The upper end surface of the transparent sheet 51 is located below the upper end surface of the carrier plate 31, and the lower end of the carrier plate 31 is provided with a accommodating cavity.

[0041] When placing the ingot on the carrier plate 31, a color mark can be set at the axis of the standard round ingot at the bottom of the irregular ingot. The position of the color mark can be observed through the first mirror 56, and the color mark can be aligned with the mark at the axis of the transparent sheet 51 by moving the ingot, which facilitates the placement of the ingot. When the hollow cylinder 21 moves downward, its lower end will contact the cross bar of the T-shaped gear rod 53, so that the T-shaped gear rod 53 overcomes the gravity of the weight block 55 and the square gear rod 52 and moves downward. 4 causes the square gear rod 52 to move upward, and the first mirror surface 56 can be sent into the accommodating cavity of the carrier plate 31 for protection to prevent it from being splashed by falling cooling water (which may easily obstruct the mirror surface observation and be detrimental to the subsequent placement of the crystal ingot), being hit by falling crystal blocks (which may easily directly damage the first mirror surface 56), or being attached by grinding chips produced by grinding (affecting the observation line). When the hollow cylinder 21 is restored to its original position after cutting, the gravity of the weight block 55 and the square gear rod 52 will drive the T-shaped gear rod 53 to return to its original position.

[0042] It should be noted that, first, the upper end surface of the weight block 55 can be set to be consistent with the diameter of the accommodating cavity, so that the first mirror surface 56 can be directly sealed and protected in the accommodating cavity during cutting; second, when observing, it is necessary to get close to the first mirror surface 56 and look down to observe the mirror surface.

[0043] As a preferred implementation in this embodiment, Figure 8 As shown, a second mirror 57 is tilted on the upper end of the weight block 55, and the second mirror 57 is tilted toward the first mirror 56. In order to facilitate the observation of the color mark position, the second mirror 57 is provided so that the operator can observe the color mark position at eye level, which is more convenient for observation.

[0044] As a preferred implementation in this embodiment, Figure 1 and Figure 7 As shown, the upper end surface of the carrier plate 31 is provided with a groove, and a push switch 6 is installed in the groove. The upper push end of the push switch 6 is arc-shaped. A ring power supply 7 is provided in the accommodating cavity of the carrier plate 31, and a plurality of lighting lamps 8 are circumferentially arranged on the inner ring of the ring power supply 7. When the crystal ingot placed on the carrier plate 31 is squeezed by the push switch 6 due to gravity, the lighting lamp 8 works to increase the brightness, so that personnel can clearly observe the color mark position through the first mirror 56 and automatically turn on the light. When the crystal ingot is ground and cut, the crystal ingot is removed, the push switch 6 pops up, and the lighting lamp 8 automatically stops working.

[0045] It should be noted that the push switch 6 is located below the standard crystal ingot formed after grinding and cutting.

[0046] As a preferred implementation mode in this embodiment, not shown in the figure, the push switch 6 is the lighting start switch of the lighting lamp 8, and also includes a closing push switch. The closing push switch is located at the contact position between the T-shaped gear rod 53 and the hollow cylinder 21. When the hollow cylinder 21 moves downward and contacts the closing push switch to form a press, the lighting lamp 8 stops working, which can save electricity.

[0047] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A device for rapidly grinding and cutting irregular silicon carbide ingots, characterized by: include Grinding and cutting units (1): multiple units are provided for grinding and cutting irregular silicon carbide ingots; A driving unit (2) is used to simultaneously drive the plurality of grinding and cutting units (1) to move linearly; Rotating carrying unit (3): used for carrying the irregular silicon carbide ingot and rotating the silicon carbide ingot; Wherein, the plurality of grinding and cutting units (1) are all mounted on the driving unit (2), and the driving unit (2) is mounted on the rotating bearing unit (3); The rotating bearing unit (3) includes a bearing plate (31) having a diameter smaller than that of the silicon carbide ingot, a rotating ring (32) is rotatably provided on the outer wall of the bearing plate (31), and the rotating ring (32) is fixed in a receiving barrel (37) via a column (33), the bearing plate (31) is fixedly connected to a gear ring (34) via a connecting rod, a mounting plate (36) is fixed below the gear ring (34), and a rotating motor (35) meshingly connected to the gear ring (34) is mounted on the mounting plate (36), and a plurality of power telescopic rods (38) are circumferentially provided on the periphery of the receiving barrel (37); The driving unit (2) includes a hollow cylinder (21) fixed to the upper ends of the plurality of power telescopic rods (38) and having an inner diameter larger than the size of the silicon carbide ingot, a plurality of cooling tubes (24) are circumferentially arranged on the inner wall of the hollow cylinder (21), a mounting ring (22) is fixed on the outer wall of the hollow cylinder (21), and a plurality of limiting through holes (29) are circumferentially arranged on the mounting ring (22), a driving ring (23) is rotatably arranged on the outer wall of the mounting ring (22), and a plurality of inclined grooves (28) are circumferentially arranged on the driving ring (23), a driving motor (26) is fixed to the bottom of the mounting ring (22), and a driving gear (25) is fixed to the output shaft of the driving motor (26), and the driving gear (25) is gear-engaged with a driving tooth (27) arranged in an arc shape at the lower end of the mounting ring (22); The grinding unit (1) comprises a plate body (101) on which a plurality of guide wheels (102) are mounted, wherein one of the guide wheels (102) is connected to an output shaft of a grinding motor (103) mounted on the plate body (101), a plurality of the guide wheels (102) are sleeved with diamond wires, a square limiting rod (104) penetrating the corresponding limiting through holes (29) is fixed on the plate body (101), and two limiting blocks (105) are provided on the square limiting rod (104) at the top and bottom, and the opposite ends of the two limiting blocks (105) are in sliding contact with the upper and lower ends of the mounting ring (22) respectively, and a driving rod (106) is fixed on the plate body (101), the lower end of which is located in the corresponding inclined groove (28); The axis of the hollow cylinder (21), the axis of the carrier plate (31), and the axis of the circle formed by the plurality of grinding and cutting units (1) are all on the same vertical line; The invention also includes an axis center alignment unit (5), the axis center alignment unit (5) including a transparent sheet (51) mounted at the axis center of the carrier plate (31) and a sealing plate (58) fixed to the upper end of the gear ring (34), the sealing plate (58) being penetrated by a square gear rod (52), a weight block (55) being fixed to the upper end of the square gear rod (52), and a first mirror surface (56) being provided on the upper end of the weight block (55), the square gear rod (52) being passed through the mounting plate (36) ) is provided with a transmission gear (54) and is gear-connected with a T-shaped gear rod (53) whose lower end passes through the mounting plate (36); the cross bar of the T-shaped gear rod (53) extends to the outer diameter of the hollow cylinder (21); a mark is provided at the axis of the transparent sheet (51); the diameter of the transparent sheet (51) is smaller than the diameter of the silicon carbide ingot after grinding and cutting; the upper end surface of the transparent sheet (51) is located below the upper end surface of the supporting plate (31); and the lower end of the supporting plate (31) is provided with a receiving cavity.

2. The device for rapidly grinding and cutting irregular silicon carbide ingots according to claim 1, characterized in that: It also includes a plurality of U-shaped baffles (4) corresponding to the plurality of diamond wires, wherein the plurality of U-shaped baffles (4) are circumferentially arranged on the periphery of the rotating ring (32), the U-shaped cavities of the U-shaped baffles (4) are adapted to the diameter and movement trajectory of the diamond wires, and a blanking gap is formed between two adjacent U-shaped baffles (4).

3. The device for rapidly grinding and cutting irregular silicon carbide ingots according to claim 1, characterized in that: A second mirror surface (57) is tilted on the upper end of the weight-increasing block (55), and the second mirror surface (57) is tilted toward the first mirror surface (56).

4. The device for rapidly grinding and cutting irregular silicon carbide ingots according to claim 1, characterized in that: The upper end surface of the carrier plate (31) is provided with a groove, and a push switch (6) is installed in the groove, the upper pressing end of the push switch (6) is arranged in an arc shape, and a ring power supply (7) is arranged in the accommodating cavity of the carrier plate (31), and a plurality of lighting lamps (8) are arranged in a circular shape on the inner ring of the ring power supply (7).

5. The device for rapidly grinding and cutting irregular silicon carbide ingots according to claim 4, characterized in that: The push switch (6) is a lighting start switch for the lighting lamp (8), and further comprises a closing push switch, wherein the closing push switch is located at the contact portion between the T-shaped gear rod (53) and the hollow cylinder (21).

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