Automatic processing equipment for converting and pasting plug-in crystal oscillator

By designing an automated processing equipment for converting through-hole crystal oscillators to surface mount devices, the automated production of OCXO lead cutting, PCB base plate solder paste application, and OCXO and PCB base plate assembly was realized, solving the problems of high labor intensity and low efficiency of traditional manual operation and improving work efficiency.

CN116744670BActive Publication Date: 2026-04-28HEBEI FAREAST COMM SYST ENG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HEBEI FAREAST COMM SYST ENG
Filing Date
2023-07-18
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

The traditional OCXO through-hole to surface mount assembly process is labor-intensive, inefficient, and cannot achieve automated production.

Method used

Design an automated processing equipment for converting through-hole crystal oscillators to surface mount devices, including an operation control unit, a crystal oscillator feeding unit, a crystal oscillator lead cutting unit, and a rotary processing unit, to realize automated production of OCXO lead cutting, PCB substrate solder paste application, and OCXO and PCB substrate assembly.

Benefits of technology

It reduced the workload of personnel, improved work efficiency, and automated the operations of OCXO leg cutting, PCB baseboard solder paste application, and OCXO and PCB baseboard assembly.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The application discloses a kind of plug-in crystal oscillator conversion table automatic processing equipment, belong to crystal oscillator processing equipment technical field;It includes operation control unit, crystal oscillator feeding unit, crystal oscillator pin cutting unit, rotary processing unit and cabinet;Operation control unit is used to control equipment by operator, start, pause, set device parameters, crystal oscillator feeding unit is used to place the OCXO of processing, and the OCXO of processing is automatically transferred to crystal oscillator cutting unit, crystal oscillator pin cutting unit is used to cut the pin of processing OCXO, and the OCXO after cutting is transferred to rotary processing unit, rotary processing unit is used to tin paste on PCB bottom plate and the OCXO after pin cutting and complete tin paste PCB bottom plate are assembled, cabinet is used to install all units described above;The application changes into equipment automatic operation from artificial one-by-one manual operation, and artificial only needs to feed and discharge, to reduce personnel work intensity, improve work efficiency.
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Description

Technical Field

[0001] This invention relates to the field of crystal oscillator processing equipment technology, specifically an automatic processing equipment for converting through-hole crystal oscillators to surface mount crystal oscillators. Background Technology

[0002] Traditional oven-controlled crystal oscillators (OCXOs) are typically through-hole type, requiring manual soldering or wave soldering to install on communication equipment. As the manufacturing process of communication equipment becomes more automated, manufacturers are demanding that OCXOs be made into surface-mount packages for reflow soldering. This has led to the development of surface-mount packages for through-hole OCXOs, where the pins are soldered onto a PCB substrate to meet the needs of communication equipment manufacturers.

[0003] Currently, the assembly of OCXO through-hole to surface mount components is generally done manually, which involves three processes: OCXO lead cutting, PCB base plate solder paste application, and OCXO and PCB base plate assembly. This process is labor-intensive and inefficient. Summary of the Invention

[0004] This invention provides an automated processing equipment for converting through-hole crystal oscillators to surface mount devices. This equipment can automate three processes: OCXO lead cutting, PCB substrate solder paste application, and OCXO and PCB substrate assembly. It transforms manual operation into automated operation, with workers only needing to load and unload materials, thereby reducing labor intensity and improving work efficiency.

[0005] To achieve the above objectives, the technical solution proposed by this invention is as follows:

[0006] An automatic processing device for converting through-hole crystal oscillators to surface mount crystal oscillators includes: an operation control unit, a crystal oscillator feeding unit, a crystal oscillator lead cutting unit, a rotary processing unit, and a cabinet;

[0007] The operation control unit includes an operation control box, a touch screen, a power button, a start button, a pause button, and an operation control box support. The touch screen is mounted on the touch screen mounting box and is used to set equipment parameters. The power button is mounted on the touch screen mounting box and is used to power on and off the entire equipment. The start button is mounted on the touch screen mounting box and is used to trigger equipment operation. The pause button is mounted on the touch screen mounting box and is used to trigger equipment pause. The operation control box is mounted on the operation control box support and is used to mount the touch screen, power button, start button, and pause button. One end of the operation control box mounting support is connected to the touch screen mounting box, and the other end is mounted on the cabinet to support the operation control box.

[0008] The crystal oscillator feeding unit includes a crystal oscillator storage tray, a left crystal oscillator storage tray fixing column, a right crystal oscillator storage tray fixing column, a crystal oscillator storage tray fixing bracket, a crystal oscillator feeding track, a direct vibration feeder, a direct vibration feeder mounting base, a direct vibration feeder fixing column, and a crystal oscillator feeding unit mounting platform. The crystal oscillator storage tray is mounted on the left and right crystal oscillator storage tray fixing columns and is used to store the crystal oscillators to be fed. The top of the left crystal oscillator storage tray fixing column is connected to the crystal oscillator storage tray, and the bottom is connected to the crystal oscillator storage tray fixing bracket to support the crystal oscillator storage tray. The crystal oscillator storage tray fixing bracket is mounted on the cabinet and connected to the left crystal oscillator storage tray fixing column to support the left crystal oscillator storage tray fixing column. The top of the right crystal oscillator storage tray fixing column is connected to the crystal oscillator storage tray, and the bottom is connected to the crystal oscillator feeding unit mounting platform to support the crystal oscillator storage tray. One end of the material track is connected to the crystal oscillator storage tray, and the other end is connected to the crystal oscillator storage slide of the crystal oscillator pin cutting and feeding mechanism of the crystal oscillator pin cutting unit. This track is used to feed the crystal oscillators from the storage tray to the storage slide of the crystal oscillator pin cutting and feeding mechanism. The direct vibration feeder is mounted on the direct vibration feeder mounting base and connected to the crystal oscillator feeding track. This causes the crystal oscillator feeding track to vibrate, moving the crystal oscillators within the track from one end to the other. The direct vibration feeder mounting base is mounted on the direct vibration feeder fixed column and connected to the direct vibration feeder. This base is used to mount the direct vibration feeder. One end of the direct vibration feeder fixed column is connected to the mounting base, and the other end is connected to the crystal oscillator feeding unit mounting platform. This platform supports the mounting base. The crystal oscillator feeding unit mounting platform is mounted on the cabinet and is used to mount the right-side crystal oscillator storage tray fixed column and the direct vibration feeder fixed column.

[0009] The crystal oscillator pin trimming unit includes a horizontal transfer mechanism (31), a transfer gripping mechanism (32), a crystal oscillator pin trimming and feeding mechanism (33), a first crystal oscillator pin trimming mechanism (34), a second crystal oscillator pin trimming mechanism (35), a crystal oscillator pin trimming mechanism mounting platform (36), and a crystal oscillator pin trimming mechanism mounting platform fixing column (37). The horizontal transfer mechanism is installed on the crystal oscillator pin trimming mechanism mounting platform and connected to the transfer gripping mechanism, used to make the transfer gripping mechanism move laterally. The transfer gripping mechanism is installed on the horizontal transfer mechanism and is used to move the crystal oscillator to be processed in the crystal oscillator pin trimming and feeding mechanism to the first crystal oscillator pin trimming mechanism, and at the same time move the crystal oscillator processed in the first crystal oscillator pin trimming mechanism to the second crystal oscillator pin trimming mechanism, and at the same time move the crystal oscillator processed in the second crystal oscillator pin trimming mechanism to the crystal oscillator feeding station of the rotary processing unit. The first crystal oscillator pin cutting mechanism is installed on the crystal oscillator pin cutting mechanism mounting platform to receive crystal oscillators to be processed from the crystal oscillator feeding track of the crystal oscillator feeding unit. The second crystal oscillator pin cutting mechanism is also installed on the platform to receive crystal oscillators transferred from the first crystal oscillator pin cutting and feeding mechanism by the transfer gripping mechanism, and to cut the pins on one side of the crystal oscillator. The third crystal oscillator pin cutting mechanism is installed on the platform to receive crystal oscillators transferred from the first crystal oscillator pin cutting mechanism by the transfer gripping mechanism, and to cut the pins on the other side of the crystal oscillator. The crystal oscillator pin cutting mechanism mounting platform is mounted on a fixed column and is used to install the horizontal transfer mechanism, the crystal oscillator pin cutting and feeding mechanism, the first crystal oscillator pin cutting mechanism, and the second crystal oscillator pin cutting mechanism. The fixed column is mounted on a cabinet and is used to install the crystal oscillator pin cutting mechanism mounting platform.

[0010] The rotary processing unit includes a rotary processing mechanism (41), a PCB substrate loading mechanism (42), a first solder paste dispensing device (43), a second solder paste dispensing device (44), a third solder paste dispensing device (45), a fourth solder paste dispensing device (46), a fifth solder paste dispensing device (47), a first crystal oscillator pressing mechanism (48), a second crystal oscillator pressing mechanism (49), a crystal oscillator unloading mechanism (410), a rotary processing unit mounting platform (411), and a rotary processing unit mounting platform fixing column (412). The rotary processing mechanism is mounted on the rotary processing unit mounting platform and can rotate at a fixed angle to load the PCB substrate. The PCB substrate loading mechanism, the first solder paste dispensing device, the second solder paste dispensing device, the third solder paste dispensing device, the fourth solder paste dispensing device, the fifth solder paste dispensing device, the first crystal oscillator pressing mechanism, the second crystal oscillator pressing mechanism, and the crystal oscillator unloading mechanism flow sequentially among these components. The PCB substrate loading mechanism is mounted on the rotary processing unit mounting platform and is used to store the PCB substrates to be processed and to transport the PCB substrates one by one to the PCB substrate loading station of the rotary processing mechanism. The first solder paste dispensing device is mounted on the rotary processing unit mounting platform and is used to dispense the solder paste from the solder paste tube of the first solder paste dispensing device to the first solder paste dispensing device of the rotary processing unit. The first solder paste application device is installed on the PCB substrate within the solder paste application station; the second solder paste application device is mounted on the rotary processing unit mounting platform and is used to apply solder paste from the solder paste tube of the second solder paste application device to the PCB substrate within the second solder paste application station of the rotary processing unit; the third solder paste application device is mounted on the rotary processing unit mounting platform and is used to apply solder paste from the solder paste tube of the third solder paste application device to the PCB substrate within the third solder paste application station of the rotary processing unit; the fourth solder paste application device is mounted on the rotary processing unit mounting platform and is used to apply solder paste from the solder paste tube of the fourth solder paste application device to the rotary processing machine of the rotary processing unit. The fifth solder paste dispensing device is installed on the rotary processing unit mounting platform and is used to dispense solder paste from the solder paste tube of the fifth solder paste dispensing device onto the PCB substrate in the fifth solder paste dispensing station of the rotary processing unit. The first crystal oscillator pressing mechanism is installed on the rotary processing unit mounting platform and is used to press the crystal oscillator already placed on the PCB substrate. The second crystal oscillator pressing mechanism is installed on the rotary processing unit mounting platform and is used to press the crystal oscillator already placed on the PCB substrate a second time. The crystal oscillator unloading mechanism is installed on the rotary processing unit mounting platform and is used to unload the processed crystal oscillator.The rotary processing unit mounting platform is mounted on the fixed column of the rotary processing unit mounting platform and is used to mount the rotary processing mechanism, the PCB substrate loading mechanism, the first solder paste dispensing device, the second solder paste dispensing device, the third solder paste dispensing device, the fourth solder paste dispensing device, the fifth solder paste dispensing device, the first crystal oscillator pressing mechanism, the second crystal oscillator pressing mechanism, and the crystal oscillator unloading mechanism. The fixed column of the rotary processing unit mounting platform is mounted on the cabinet and is used to mount the rotary processing unit mounting platform.

[0011] The cabinet is used to install the operation control unit, the crystal oscillator feeding unit, the crystal oscillator pin cutting unit, and the rotary processing unit.

[0012] Furthermore, the lateral transplanting mechanism includes a lateral pushing cylinder, a lateral pushing cylinder fixing bracket, a floating joint, a floating joint fixing bracket, a lateral transplanting mechanism mounting back plate, a lateral transplanting mechanism fixing column, a lateral guide rail, and a lateral slider; the lateral pushing cylinder is mounted on the lateral pushing cylinder fixing bracket, and the lateral pushing cylinder is connected to the floating joint, driving the floating joint and its connecting mechanism to move left and right; the lateral pushing cylinder fixing bracket is mounted on the lateral transplanting mechanism mounting back plate for mounting the lateral pushing cylinder; the floating joint is mounted on the lateral pushing cylinder, connecting the lateral pushing cylinder and the floating joint connecting bracket; the floating joint connecting bracket is mounted on the floating joint. Above, a downward pressure cylinder fixing bracket connected to the transplanting gripping mechanism is used to move the transplanting gripping mechanism left and right under the drive of the horizontal pushing cylinder; the horizontal transplanting mechanism mounting back plate is installed on the horizontal transplanting mechanism fixing bracket for installing the horizontal guide rail; the horizontal transplanting mechanism fixing bracket is installed on the crystal oscillator pin cutting mechanism mounting platform for installing the horizontal transplanting mechanism mounting back plate; the horizontal guide rail is installed on the horizontal transplanting mechanism mounting back plate for installing the horizontal slider, and the horizontal slider can slide left and right on the horizontal guide rail; the horizontal slider is installed on the horizontal guide rail for installing the transplanting gripping mechanism fixing seat of the transplanting gripping mechanism for the left and right sliding of the transplanting gripping mechanism.

[0013] Furthermore, the transplanting gripping mechanism includes a pressing cylinder, a pressing cylinder fixing bracket, a transplanting gripping mechanism fixing seat, a pressing guide rail, a pressing slider, a first sliding connecting block, a second sliding connecting block, a gripping device mounting panel, a first-station gripping device, a second-station gripping device, a rotary cylinder, a rotary cylinder fixing bracket, and a third-station gripping device. The pressing cylinder is mounted on the pressing cylinder fixing bracket and connected to the second sliding connecting block, used to drive the second sliding connecting block and its connecting mechanism to move up and down. The pressing cylinder fixing bracket is mounted on the floating joint connecting bracket of the transverse transplanting mechanism and used to install the pressing cylinder. The transplanting gripping mechanism fixing seat is mounted on the transverse slider of the transverse transplanting mechanism and used to install the pressing guide rail. The pressing guide rail is mounted on the transplanting gripping mechanism fixing seat and used to install the pressing slider. The pressing slider is mounted on the pressing guide rail and used to install the first sliding connecting block. The first sliding connecting block is mounted on the pressing slider and used to install the second sliding connecting block and the gripping device mounting panel. A connecting block is mounted on a pressing cylinder to connect to a first sliding connecting block; the gripping device mounting panel is mounted on the first sliding connecting block to mount a first-station gripping device, a second-station gripping device, and a rotary cylinder fixing bracket; the first-station gripping device is mounted on the gripping device mounting panel to grip the crystal oscillator in the crystal oscillator pin cutting and feeding mechanism, moves it laterally, and places it into the first crystal oscillator pin cutting mechanism; the second-station gripping device is mounted on the gripping device mounting panel to grip the crystal oscillator in the first crystal oscillator pin cutting mechanism, moves it laterally, and places it into the second crystal oscillator pin cutting mechanism; the rotary cylinder is mounted on a rotary cylinder fixing bracket and connected to a third-station gripping device to rotate the third-station gripping device by 90 degrees; the rotary cylinder fixing bracket is mounted on the gripping device mounting panel to mount the rotary cylinder; the third-station gripping device is mounted on the rotary cylinder to grip the crystal oscillator in the second crystal oscillator pin cutting mechanism, moves it laterally, and places it into the crystal oscillator feeding station of the rotary processing unit's rotary processing mechanism;

[0014] The crystal oscillator pin cutting and feeding mechanism includes a crystal oscillator pin cutting and feeding push cylinder, a crystal oscillator pin cutting and feeding push cylinder fixing base, a crystal oscillator storage slide, a crystal oscillator pin cutting and feeding slider, a crystal oscillator pin cutting and feeding guide rail, and a crystal oscillator pin cutting and feeding guide rail fixing base. The crystal oscillator pin cutting and feeding push cylinder is installed on the crystal oscillator pin cutting and feeding push cylinder fixing base and connected to the crystal oscillator storage slide, causing the crystal oscillator storage slide to move left and right, which is used to push the crystal oscillator conveyed from the crystal oscillator feeding rail of the crystal oscillator feeding unit to the first station gripping device of the crystal oscillator pin cutting unit transfer gripping mechanism, so that the crystal oscillator in the crystal oscillator storage slide can be gripped by the first station gripping device; the crystal oscillator pin cutting and feeding push cylinder... A cylinder fixing base is installed on the crystal oscillator pin cutting mechanism mounting platform and is used to install the crystal oscillator pin cutting and feeding push cylinder; the crystal oscillator storage slide is installed on the crystal oscillator pin cutting and feeding slide and is connected to the crystal oscillator pin cutting and feeding push cylinder, and is used to receive the crystal oscillator conveyed by the crystal oscillator feeding unit's crystal oscillator feeding track; the crystal oscillator pin cutting and feeding slide is installed on the crystal oscillator pin cutting and feeding guide rail and is used to install the crystal oscillator storage slide; the crystal oscillator pin cutting and feeding guide rail is installed on the crystal oscillator pin cutting and feeding guide rail fixing base and is used to install the crystal oscillator pin cutting and feeding slide; the crystal oscillator pin cutting and feeding guide rail fixing base is installed on the crystal oscillator pin cutting mechanism mounting platform and is used to install the crystal oscillator pin cutting and feeding guide rail.

[0015] Furthermore, both the first and second crystal oscillator pin trimming mechanisms include a crystal oscillator pin trimming cylinder fixing bracket, a crystal oscillator pin trimming cylinder, a crystal oscillator pin trimming cylinder connecting column, a crystal oscillator pin trimming cylinder connecting seat, a crystal oscillator pin trimming cutter, a crystal oscillator pin clamping seat fixing block, a crystal oscillator pin clamping seat connecting spring, a crystal oscillator pin clamping seat, a crystal oscillator pin clamping seat limiting fixing seat, a crystal oscillator pin trimming placement seat, and a crystal oscillator pin trimming mechanism fixing base; the crystal oscillator pin trimming cylinder fixing bracket is installed on the crystal oscillator pin... A crystal oscillator pin cutting cylinder is mounted on a foot-cutting mechanism mounting platform. The crystal oscillator pin cutting cylinder is mounted on a crystal oscillator pin cutting cylinder fixing bracket and connected to a crystal oscillator pin cutting cylinder connecting column, used to drive the crystal oscillator pin cutting cylinder connecting column and its connecting mechanism to move left and right. The crystal oscillator pin cutting cylinder connecting column is mounted on the crystal oscillator pin cutting cylinder and used to connect to the crystal oscillator pin cutting cylinder connecting seat. The crystal oscillator pin cutting cylinder connecting seat is mounted on the crystal oscillator pin cutting cylinder connecting column and used to connect the crystal oscillator pin cutting blade. The crystal oscillator pin cutting blade is mounted on the crystal oscillator pin cutting cylinder connecting seat and connected to the crystal oscillator pin clamping seat fixing block, used to cut the crystal oscillator pins placed in the crystal oscillator pin cutting placement seat; the crystal oscillator pin clamping seat fixing block is mounted on the crystal oscillator pin cutting blade and connected to the crystal oscillator pin clamping seat connecting spring; the crystal oscillator pin clamping seat connecting spring is mounted on the crystal oscillator pin clamping seat fixing block and connected to the crystal oscillator pin clamping seat; the crystal oscillator pin clamping seat is mounted on the crystal oscillator pin clamping seat connecting spring, which can cut the crystal oscillator pins. The foot clamping seat slides left and right within the limiting and fixing seat; the crystal oscillator pin clamping seat limiting and fixing seat is installed on the fixed base of the crystal oscillator pin cutting mechanism to limit the clamping seat; the crystal oscillator pin cutting and placing seat is installed on the fixed base of the crystal oscillator pin cutting mechanism to place the crystal oscillator gripped by the first station gripping device of the transfer gripping mechanism; the fixed base of the crystal oscillator pin cutting mechanism is installed on the installation platform of the crystal oscillator pin cutting mechanism to install the crystal oscillator pin clamping seat limiting and fixing seat and the crystal oscillator pin cutting and placing seat.

[0016] Furthermore, the rotary processing mechanism includes a rotary processing disk, a PCB base plate storage slot cover, a PCB base plate loading station, a first solder paste application station, a second solder paste application station, a third solder paste application station, a fourth solder paste application station, a fifth solder paste application station, a crystal oscillator loading station, a first crystal oscillator pressing station, a second crystal oscillator pressing station, a crystal oscillator unloading station, a divider, a divider synchronous pulley, a divider synchronous pulley belt, a stepper motor, a stepper motor synchronous pulley, and a stepper motor mounting bracket. The rotary processing disk is mounted on the divider and is used to install the PCB base plate storage slot cover. The PCB substrate storage slot cover is installed on the rotary processing tray, forming with the rotary processing tray a PCB substrate loading station, a first solder paste application station, a second solder paste application station, a third solder paste application station, a fourth solder paste application station, a fifth solder paste application station, a crystal oscillator loading station, a first crystal oscillator pressing station, a second crystal oscillator pressing station, and a crystal oscillator unloading station. The PCB substrate loading station connects to the PCB substrate loading mechanism; the first solder paste application station connects to the first solder paste application device; the second solder paste application station connects to the second solder paste application device; and the third solder paste application station connects to... The third solder paste dispensing device is connected to the fourth solder paste dispensing device, the fifth solder paste dispensing device is connected to the fifth solder paste dispensing device, the crystal oscillator loading station is connected to the third station gripping device of the crystal oscillator pin cutting unit transfer gripping mechanism, the first crystal oscillator pressing station is connected to the first crystal oscillator pressing mechanism, the second crystal oscillator pressing station is connected to the second crystal oscillator pressing mechanism, the crystal oscillator unloading station is connected to the crystal oscillator unloading mechanism, the divider is mounted on the rotary processing unit mounting platform for mounting the rotary processing disk; the divider synchronous pulley is mounted on the divider for connecting... A timing belt is connected to the divider's timing pulley; the timing belt is mounted on the divider's timing pulley and the stepper motor's timing pulley, connecting them. The stepper motor is mounted on a stepper motor mounting bracket, connecting to the stepper motor's timing pulley. When the stepper motor rotates, it drives the divider to rotate via the timing belt, which in turn drives the rotary processing disc to rotate. The stepper motor's timing pulley is mounted on the stepper motor, connecting to the timing belt. The stepper motor mounting bracket is mounted on the rotary processing unit's mounting platform, for mounting the stepper motor.

[0017] Furthermore, the PCB substrate loading mechanism includes a PCB substrate storage slot, a PCB substrate pushing cylinder, and a PCB substrate pushing plate. The PCB substrate storage slot is mounted on the PCB substrate pushing cylinder mounting plate and is used to store PCB substrates. The PCB substrate pushing cylinder is mounted on the PCB substrate pushing cylinder mounting plate and is used to mount the PCB substrate pushing plate. The PCB substrate pushing cylinder moves left and right, driving the PCB substrate pushing plate to push the PCB substrates in the PCB substrate storage slot to the PCB substrate loading station. The PCB substrate pushing plate is mounted on the PCB substrate pushing cylinder and is used to push the PCB substrates in the PCB substrate storage slot. The PCB substrate pushing cylinder mounting plate is mounted on the PCB substrate pushing cylinder mounting plate bracket and is used to mount the PCB substrate storage slot and the PCB substrate pushing cylinder. The PCB substrate pushing cylinder mounting plate bracket is mounted on the rotary processing unit mounting platform and is used to mount the PCB substrate pushing cylinder mounting plate.

[0018] Furthermore, the first, second, third, fourth, and fifth solder paste dispensing devices all include a solder paste tube, a solder paste tube support, a slide cylinder, and a slide cylinder support. The solder paste tube is mounted on the solder paste tube support and is used to apply solder paste to the PCB substrate in the solder paste dispensing station. The solder paste tube support is mounted on the slide cylinder and is used to mount the solder paste tube. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder support is mounted on the rotary processing unit mounting platform and is used to mount the slide cylinder.

[0019] Furthermore, both the first and second crystal oscillator pressing mechanisms include a pressing cylinder, a flexible rubber ball, and a support. The pressing cylinder is mounted on the support and is used to mount the flexible rubber ball. The flexible rubber ball is mounted on the pressing cylinder and is used to press down the crystal oscillator in the first pressing station. The support is mounted on the rotary machining unit mounting platform and is used to mount the pressing cylinder.

[0020] Furthermore, the crystal oscillator unloading mechanism includes a crystal oscillator unloading push cylinder, a crystal oscillator unloading push cylinder mounting bracket, a crystal oscillator unloading push plate, a crystal oscillator unloading slide, and a crystal oscillator unloading slide mounting bracket. The crystal oscillator unloading push cylinder is mounted on the crystal oscillator unloading push cylinder mounting bracket and is used to mount the crystal oscillator unloading push plate. The crystal oscillator unloading push cylinder drives the crystal oscillator unloading push plate to move left and right, pushing the crystal oscillator in the crystal oscillator unloading station into the crystal oscillator unloading slide. The crystal oscillator unloading push cylinder mounting bracket is mounted on the rotary processing unit mounting platform and is used to mount the crystal oscillator unloading push cylinder. The crystal oscillator unloading push plate is mounted on the crystal oscillator unloading push cylinder and is used to push the crystal oscillator in the crystal oscillator unloading station. The crystal oscillator unloading slide is mounted on the crystal oscillator unloading slide mounting bracket and is used to receive the crystal oscillator pushed by the crystal oscillator unloading push plate. The crystal oscillator unloading slide mounting bracket is mounted on the rotary processing unit mounting platform and is used to mount the crystal oscillator unloading slide.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This invention places the OCXO to be processed through a crystal oscillator loading unit and automatically transfers the processed OCXO to a crystal oscillator cutting unit. The crystal oscillator pin cutting unit cuts the pins of the processed OCXO and transfers the cut OCXO to a rotary processing unit. The rotary processing unit applies solder paste to the PCB base plate and assembles the OCXO with the pins cut and the PCBA base plate with the solder paste applied. The cabinet is used to install all the above units.

[0023] This invention can automate the production of three processes: OCXO leg trimming, PCB base plate solder paste application, and OCXO and PCB base plate assembly. It transforms manual operation into automated operation, with workers only needing to load and unload materials, thereby reducing the workload of personnel and improving work efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0025] Figure 2 This is a schematic diagram of the operation control unit of the present invention.

[0026] Figure 3 This is a schematic diagram of the crystal oscillator feeding unit.

[0027] Figure 4 This is a schematic diagram of the crystal oscillator pin trimming unit.

[0028] Figure 5 This is a schematic diagram of a horizontal transplanting mechanism.

[0029] Figure 6 This is a schematic diagram of the transplanting and gripping mechanism.

[0030] Figure 7This is a schematic diagram of the crystal oscillator pin cutting and feeding mechanism.

[0031] Figure 8 This is a schematic diagram of the first crystal oscillator pin cutting mechanism.

[0032] Figure 9 This is a schematic diagram of the second crystal oscillator pin cutting mechanism.

[0033] Figure 10 This is a schematic diagram of a rotary machining unit.

[0034] Figure 11 This is a schematic diagram of a rotary machining mechanism.

[0035] Figure 12 This is a schematic diagram of the PCB substrate loading mechanism.

[0036] Figure 13 This is a schematic diagram of the first solder paste application device.

[0037] Figure 14 This is a schematic diagram of the second solder paste application device.

[0038] Figure 15 This is a schematic diagram of the third solder paste application device.

[0039] Figure 16 This is a schematic diagram of the fourth solder paste application device.

[0040] Figure 17 This is a schematic diagram of the fifth solder paste application device.

[0041] Figure 18 This is a schematic diagram of the first crystal oscillator pressing mechanism.

[0042] Figure 19 This is a schematic diagram of the second crystal oscillator pressing mechanism.

[0043] Figure 20 This is a schematic diagram of the crystal oscillator feeding mechanism.

[0044] In the picture:

[0045] 1. Operation control unit; 2. Crystal oscillator feeding unit; 3. Crystal oscillator pin trimming unit; 4. Rotary processing unit; 5. Cabinet; 11. Operation control box; 12. Touch screen; 13. Power button; 14. Start button; 15. Pause button; 16. Operation control box support column; 21. Crystal oscillator storage tray; 22. Left crystal oscillator storage tray fixing column; 23. Right crystal oscillator storage tray fixing column; 24. Crystal oscillator storage tray fixing bracket; 25. Crystal oscillator feeding track; 26. Direct vibration feeder; 27. Direct vibration feeder mounting base; 28. Direct vibration feeder fixing column; 29. ​​Crystal oscillator feeding unit mounting platform; 31. Lateral transfer mechanism; 32. Transfer gripping mechanism; 33. Crystal oscillator pin trimming and feeding mechanism; 34. First crystal oscillator shear. 35. Second crystal oscillator pin cutting mechanism; 36. Crystal oscillator pin cutting mechanism mounting platform; 37. Crystal oscillator pin cutting mechanism mounting platform fixing column; 3101. Horizontal pushing cylinder; 3102. Horizontal pushing cylinder fixing bracket; 3103. Floating joint; 3104. Floating joint connecting bracket; 3105. Horizontal transplanting mechanism mounting back plate; 3106. Horizontal transplanting mechanism fixing bracket; 3107. Horizontal guide rail; 3108. Horizontal slider; 3201. Downward pressing cylinder; 3202. Downward pressing cylinder fixing bracket; 3203. Transplanting gripping mechanism fixing seat; 3204. Downward pressing guide rail; 3205. Downward pressing slider; 3206. First sliding connecting block; 3207. Second sliding connecting block; 3 208. Gripping device mounting panel; 3209. First station gripping device; 3210. Second station gripping device; 3211. Rotary cylinder; 3212. Rotary cylinder fixing bracket; 3213. Third station gripping device; 3301. Crystal oscillator pin cutting and feeding push cylinder; 3302. Crystal oscillator pin cutting and feeding push cylinder fixing base; 3303. Crystal oscillator storage slide; 3304. Crystal oscillator pin cutting and feeding slider; 3305. Crystal oscillator pin cutting and feeding guide rail; 3306. Crystal oscillator pin cutting and feeding guide rail fixing base; 3401. First crystal oscillator pin cutting cylinder fixing bracket; 3402. First crystal oscillator pin cutting cylinder; 3403. First crystal oscillator pin cutting cylinder connecting column; 3404. First crystal oscillator 3405. First crystal oscillator pin cutting blade; 3406. First crystal oscillator pin clamping seat fixing block; 3407. First crystal oscillator pin clamping seat connecting spring; 3408. First crystal oscillator pin clamping seat; 3409. First crystal oscillator pin clamping seat limiting fixing seat; 3410. First crystal oscillator pin cutting placement seat; 3411. First crystal oscillator pin cutting mechanism fixing base; 3501. Second crystal oscillator pin cutting cylinder fixing bracket; 3502. Second crystal oscillator pin cutting cylinder; 3503. Second crystal oscillator pin cutting cylinder connecting column; 3504. Second crystal oscillator pin cutting cylinder connecting seat; 3505. Second crystal oscillator pin cutting blade; 3506. Second crystal oscillator pin clamping seat fixing block; 3507.3508. Second crystal oscillator pin clamping seat connecting spring; 3509. Second crystal oscillator pin clamping seat limit fixing seat; 3510. Second crystal oscillator pin cutting and placing seat; 3511. Second first crystal oscillator pin cutting mechanism fixing base; 41. Rotary processing mechanism; 42. PCB base plate loading mechanism; 43. First solder paste dispensing device; 44. Second solder paste dispensing device; 45. Third solder paste dispensing device; 46. Fourth solder paste dispensing device; 47. Fifth solder paste dispensing device; 48. First crystal oscillator pressing mechanism; 49. Second crystal oscillator pressing mechanism; 410. Crystal oscillator unloading mechanism; 411. Rotary processing unit mounting platform; 412. Rotary processing unit mounting platform fixing column; 4101. Rotary processing tray; 4102. PCB base plate storage. 4103. PCB base plate loading station; 4104. First solder paste application station; 4105. Second solder paste application station; 4106. Third solder paste application station; 4107. Fourth solder paste application station; 4108. Fifth solder paste application station; 4109. Crystal oscillator loading station; 4110. First crystal oscillator pressing station; 4111. Second crystal oscillator pressing station; 4112. Crystal oscillator unloading station; 4113. Divider; 4114. Divider synchronous pulley; 4115. Divider synchronous pulley belt; 4116. Stepper motor; 4117. Stepper motor synchronous pulley; 4118. Stepper motor mounting bracket; 4201. PCB base plate storage slot; 4202. PCB base plate pushing cylinder; 4203. PCB base plate pushing board; 4204. 4205. PCB baseboard push cylinder mounting plate; 4301. Solder paste tube of the first solder paste dispensing device; 4302. Solder paste tube bracket of the first solder paste dispensing device; 4303. Slide cylinder of the first solder paste dispensing device; 4304. Slide cylinder bracket of the first solder paste dispensing device; 4401. Solder paste tube of the second solder paste dispensing device; 4402. Solder paste tube bracket of the second solder paste dispensing device; 4403. Slide cylinder of the second solder paste dispensing device; 4404. Slide cylinder bracket of the second solder paste dispensing device; 4501. Solder paste tube of the third solder paste dispensing device; 4502. Solder paste tube bracket of the third solder paste dispensing device; 4503. Slide cylinder of the third solder paste dispensing device; 4504. Slide cylinder of the third solder paste dispensing device 4601. Solder paste tube of the fourth solder paste dispensing device; 4602. Solder paste tube support of the fourth solder paste dispensing device; 4603. Slide cylinder of the fourth solder paste dispensing device; 4604. Slide cylinder support of the fourth solder paste dispensing device; 4701. Solder paste tube of the fifth solder paste dispensing device; 4702. Solder paste tube support of the fifth solder paste dispensing device; 4703. Slide cylinder of the fifth solder paste dispensing device; 4704. Slide cylinder support of the fifth solder paste dispensing device; 4801. Pressing cylinder of the first crystal oscillator pressing mechanism; 4802. Flexible rubber ball of the first crystal oscillator pressing mechanism; 4803. Support of the first crystal oscillator pressing mechanism; 4901. Pressing cylinder of the second crystal oscillator pressing mechanism; 4902.4903. Flexible rubber ball for the second crystal oscillator pressing mechanism; 41001. Crystal oscillator feeding and pushing cylinder; 41002. Crystal oscillator feeding and pushing cylinder mounting bracket; 41003. Crystal oscillator feeding and pushing plate; 41004. Crystal oscillator feeding slide; 41005. Crystal oscillator feeding slide mounting bracket. Detailed Implementation

[0046] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0047] See Figure 1 An automatic processing equipment for converting through-hole crystal oscillators to surface mount crystal oscillators includes: an operation control unit, a crystal oscillator feeding unit, a crystal oscillator pin cutting unit, a rotary processing unit, and a cabinet;

[0048] See Figure 2 The operation control unit includes an operation control box, a touch screen, a power button, a start button, a pause button, and an operation control box support. The touch screen is mounted on the touch screen mounting box and is used to set equipment parameters. The power button is mounted on the touch screen mounting box and is used to power on and off the entire equipment. The start button is mounted on the touch screen mounting box and is used to trigger the equipment to run. The pause button is mounted on the touch screen mounting box and is used to trigger the equipment to pause. The operation control box is mounted on the operation control box support and is used to mount the touch screen, power button, start button, and pause button. One end of the operation control box mounting support is connected to the touch screen mounting box, and the other end is mounted on the cabinet to support the operation control box.

[0049] See Figure 3The crystal oscillator feeding unit includes a crystal oscillator storage tray, a left crystal oscillator storage tray fixing column, a right crystal oscillator storage tray fixing column, a crystal oscillator storage tray fixing bracket, a crystal oscillator feeding track, a direct vibration feeder, a direct vibration feeder mounting base, a direct vibration feeder fixing column, and a crystal oscillator feeding unit mounting platform. The crystal oscillator storage tray is mounted on the left and right crystal oscillator storage tray fixing columns and is used to store the crystal oscillators to be fed. One end of the left crystal oscillator storage tray fixing column is connected to the crystal oscillator storage tray, and the other end is connected to the crystal oscillator storage tray fixing bracket to support the crystal oscillator storage tray. The crystal oscillator storage tray fixing bracket is mounted on the cabinet and connected to the left crystal oscillator storage tray fixing column to support it. One end of the right crystal oscillator storage tray fixing column is connected to the crystal oscillator storage tray, and the other end is connected to the crystal oscillator feeding unit mounting platform to support the crystal oscillator storage tray and the crystal oscillator feeding track. One end of the conveyor is connected to the crystal oscillator storage tray, and the other end is connected to the crystal oscillator pin cutting unit and the crystal oscillator pin cutting and feeding mechanism's crystal oscillator storage slide. This conveyor is used to send the crystal oscillators from the crystal oscillator storage tray to the crystal oscillator pin cutting unit and the crystal oscillator pin cutting and feeding mechanism's crystal oscillator storage slide. The direct vibration feeder is installed on the direct vibration feeder mounting base and connected to the crystal oscillator feeding track. This feeder is used to make the crystal oscillator feeding track vibrate, causing the crystal oscillators in the crystal oscillator feeding track to move from one end to the other. The direct vibration feeder mounting base is installed on the direct vibration feeder fixed column and connected to the direct vibration feeder. This fixed column is used to install the direct vibration feeder mounting base at one end and the crystal oscillator feeding unit mounting platform at the other end. This fixed column is used to support the direct vibration feeder mounting base. The crystal oscillator feeding unit mounting platform is installed on the cabinet and is used to install the right-side crystal oscillator storage tray fixed column and the direct vibration feeder fixed column.

[0050] See Figure 4The crystal oscillator pin trimming unit includes a lateral transfer mechanism, a transfer gripping mechanism, a crystal oscillator pin trimming and feeding mechanism, a first crystal oscillator pin trimming mechanism, a second crystal oscillator pin trimming mechanism, a crystal oscillator pin trimming mechanism mounting platform, and a fixed column for the crystal oscillator pin trimming mechanism mounting platform. The lateral transfer mechanism is mounted on the crystal oscillator pin trimming mechanism mounting platform and is connected to the transfer gripping mechanism to enable lateral movement of the transfer gripping mechanism. The transfer gripping mechanism is mounted on the lateral transfer mechanism and is used to move the crystal oscillator to be processed in the crystal oscillator pin trimming and feeding mechanism to the first crystal oscillator pin trimming mechanism, and simultaneously move the crystal oscillator processed in the first crystal oscillator pin trimming mechanism to the second crystal oscillator pin trimming mechanism, and simultaneously move the crystal oscillator processed in the second crystal oscillator pin trimming mechanism to the crystal oscillator feeding station of the rotary processing unit. The crystal oscillator pin trimming and feeding mechanism is mounted on the crystal oscillator pin trimming mechanism mounting platform. On the platform, a first crystal oscillator pin-cutting mechanism is installed on the crystal oscillator pin-cutting mechanism mounting platform. This mechanism receives the crystal oscillator transferred from the crystal oscillator pin-cutting and feeding mechanism by the transfer gripping mechanism and cuts the pins on one side of the crystal oscillator. A second crystal oscillator pin-cutting mechanism is also installed on the same platform. This mechanism receives the crystal oscillator transferred from the first crystal oscillator pin-cutting mechanism by the transfer gripping mechanism and cuts the pins on the other side of the crystal oscillator. The crystal oscillator pin-cutting mechanism mounting platform is mounted on a fixed column and is used to install the horizontal transfer mechanism, the crystal oscillator pin-cutting and feeding mechanism, the first crystal oscillator pin-cutting mechanism, and the second crystal oscillator pin-cutting mechanism. The fixed column is mounted on the cabinet and is used to install the crystal oscillator pin-cutting mechanism mounting platform.

[0051] See Figure 5The lateral transplanting mechanism includes a lateral pushing cylinder, a lateral pushing cylinder mounting bracket, a floating joint, a floating joint mounting bracket, a lateral transplanting mechanism mounting back plate, a lateral transplanting mechanism mounting column, a lateral guide rail, and a lateral slider. The lateral pushing cylinder is mounted on the lateral pushing cylinder mounting bracket and is connected to the floating joint, causing the floating joint and its connecting mechanism to move left and right. The lateral pushing cylinder mounting bracket is mounted on the lateral transplanting mechanism mounting back plate and is used to mount the lateral pushing cylinder. The floating joint is mounted on the lateral pushing cylinder and connects the lateral pushing cylinder and the floating joint connecting bracket. The floating joint connecting bracket is mounted on the floating joint. Above, a downward pressure cylinder fixing bracket connected to the transplanting gripping mechanism is used to move the transplanting gripping mechanism left and right under the drive of the horizontal pushing cylinder. The horizontal transplanting mechanism mounting back plate is installed on the horizontal transplanting mechanism fixing bracket to install the horizontal guide rail. The horizontal transplanting mechanism fixing bracket is installed on the crystal oscillator pin cutting mechanism mounting platform to install the horizontal transplanting mechanism mounting back plate. The horizontal guide rail is installed on the horizontal transplanting mechanism mounting back plate to install the horizontal slider for the horizontal slider to slide left and right. The horizontal slider is installed on the horizontal guide rail to install the transplanting gripping mechanism fixing seat for the transplanting gripping mechanism to slide left and right.

[0052] See Figure 6The transplanting gripping mechanism includes a pressing cylinder, a pressing cylinder fixing bracket, a transplanting gripping mechanism fixing seat, a pressing guide rail, a pressing slider, a first sliding connecting block, a second sliding connecting block, a gripping device mounting panel, a first-station gripping device, a second-station gripping device, a rotary cylinder, a rotary cylinder fixing bracket, and a third-station gripping device. The pressing cylinder is mounted on the pressing cylinder fixing bracket and connected to the second sliding connecting block, used to drive the second sliding connecting block and its connecting mechanism to move up and down. The pressing cylinder fixing bracket is mounted on the floating joint connecting bracket of the transverse transplanting mechanism and used to install the pressing cylinder. The transplanting gripping mechanism fixing seat is mounted on the transverse slider of the transverse transplanting mechanism and used to install the pressing guide rail. The pressing guide rail is mounted on the transplanting gripping mechanism fixing seat and used to install the pressing slider. The pressing slider is mounted on the pressing guide rail and used to install the first sliding connecting block. The first sliding connecting block is mounted on the pressing slider and used to install the second sliding connecting block and the gripping device mounting panel. The second sliding connecting block is mounted on... A first sliding connecting block is connected to the pressing cylinder. A gripping device mounting panel is mounted on the first sliding connecting block for mounting a first-station gripping device, a second-station gripping device, and a rotary cylinder fixing bracket. The first-station gripping device is mounted on the gripping device mounting panel for gripping the crystal oscillator in the crystal oscillator pin cutting and feeding mechanism, moving it laterally, and placing it into the first crystal oscillator pin cutting mechanism. The second-station gripping device is mounted on the gripping device mounting panel for gripping the crystal oscillator in the first crystal oscillator pin cutting mechanism, moving it laterally, and placing it into the second crystal oscillator pin cutting mechanism. A rotary cylinder is mounted on a rotary cylinder fixing bracket and connected to a third-station gripping device for rotating the third-station gripping device by 90 degrees. The rotary cylinder fixing bracket is mounted on the gripping device mounting panel for mounting the rotary cylinder. The third-station gripping device is mounted on the rotary cylinder for gripping the crystal oscillator in the second crystal oscillator pin cutting mechanism, moving it laterally, and placing it into the crystal oscillator feeding station of the rotary processing unit's rotary processing mechanism.

[0053] See Figure 7The crystal oscillator pin cutting and feeding mechanism includes a crystal oscillator pin cutting and feeding push cylinder, a crystal oscillator pin cutting and feeding push cylinder fixing base, a crystal oscillator storage slide, a crystal oscillator pin cutting and feeding slider, a crystal oscillator pin cutting and feeding guide rail, and a crystal oscillator pin cutting and feeding guide rail fixing base. The crystal oscillator pin cutting and feeding push cylinder is mounted on the crystal oscillator pin cutting and feeding push cylinder fixing base and connected to the crystal oscillator storage slide, causing the crystal oscillator storage slide to move left and right. This pushes the crystal oscillators conveyed from the crystal oscillator feeding track of the crystal oscillator feeding unit to the first station gripping device of the crystal oscillator pin cutting unit transfer gripping mechanism, so that the crystal oscillators in the crystal oscillator storage slide can be gripped by the first station gripping device. A cylinder mounting base is installed on the crystal oscillator pin cutting mechanism mounting platform to install the crystal oscillator pin cutting and feeding push cylinder. A crystal oscillator storage slide is installed on the crystal oscillator pin cutting and feeding slide block and connected to the crystal oscillator pin cutting and feeding push cylinder to receive the crystal oscillator from the crystal oscillator feeding unit's crystal oscillator feeding track. A crystal oscillator pin cutting and feeding slide block is installed on the crystal oscillator pin cutting and feeding guide rail to install the crystal oscillator storage slide block. A crystal oscillator pin cutting and feeding guide rail is installed on the crystal oscillator pin cutting and feeding guide rail mounting base to install the crystal oscillator pin cutting and feeding slide block. A crystal oscillator pin cutting and feeding guide rail mounting base is installed on the crystal oscillator pin cutting mechanism mounting platform to install the crystal oscillator pin cutting and feeding guide rail.

[0054] See Figure 8The first crystal oscillator pin trimming mechanism includes a first crystal oscillator pin trimming cylinder fixing bracket, a first crystal oscillator pin trimming cylinder, a first crystal oscillator pin trimming cylinder connecting column, a first crystal oscillator pin trimming cylinder connecting seat, a first crystal oscillator pin trimming cutter, a first crystal oscillator pin clamping seat fixing block, a first crystal oscillator pin clamping seat connecting spring, a first crystal oscillator pin clamping seat, a first crystal oscillator pin clamping seat limiting fixing seat, a first crystal oscillator pin trimming placement seat, and a first crystal oscillator pin trimming mechanism fixing base. The first crystal oscillator pin trimming cylinder fixing bracket is installed on the crystal oscillator pin trimming mechanism mounting plate. On the platform, a first crystal oscillator pin-cutting cylinder is mounted. This cylinder is installed on a mounting bracket and connected to a connecting post. This connection post drives the connecting post and its connecting mechanism to move left and right. The connecting post is mounted on the first crystal oscillator pin-cutting cylinder and connects to a connecting seat. The connecting seat is mounted on the connecting post and connects to the first crystal oscillator pin-cutting blade. A crystal oscillator pin cutting blade is mounted on the first crystal oscillator pin cutting cylinder connecting seat and connected to the first crystal oscillator pin clamping seat fixing block. It is used to cut the crystal oscillator pins placed in the first crystal oscillator pin cutting placement seat. The first crystal oscillator pin clamping seat fixing block is mounted on the first crystal oscillator pin cutting blade and connected to the first crystal oscillator pin clamping seat connecting spring. The first crystal oscillator pin clamping seat connecting spring is mounted on the first crystal oscillator pin clamping seat fixing block and connected to the first crystal oscillator pin clamping seat. The first crystal oscillator pin clamping seat is mounted on the first crystal oscillator pin clamping seat connecting spring. This allows for the cutting of crystal oscillator pins placed in the first crystal oscillator pin clamping placement seat. The first crystal oscillator pin clamping seat limit fixing seat slides left and right inside the first crystal oscillator pin clamping seat limit fixing seat. The first crystal oscillator pin clamping seat limit fixing seat is installed on the first crystal oscillator pin cutting mechanism fixing base to limit the first crystal oscillator pin clamping seat. The first crystal oscillator pin cutting and placing seat is installed on the first crystal oscillator pin cutting mechanism fixing base to place the crystal oscillator grabbed by the first station gripping device of the transfer gripping mechanism. The first crystal oscillator pin cutting mechanism fixing base is installed on the crystal oscillator pin cutting mechanism mounting platform to install the first crystal oscillator pin clamping seat limit fixing seat and the first crystal oscillator pin cutting and placing seat.

[0055] See Figure 9The second crystal oscillator pin trimming mechanism includes a second crystal oscillator pin trimming cylinder fixing bracket, a second crystal oscillator pin trimming cylinder, a second crystal oscillator pin trimming cylinder connecting column, a second crystal oscillator pin trimming cylinder connecting seat, a second crystal oscillator pin trimming cutter, a second crystal oscillator pin clamping seat fixing block, a second crystal oscillator pin clamping seat connecting spring, a second crystal oscillator pin clamping seat, a second crystal oscillator pin clamping seat limit fixing seat, a second crystal oscillator pin trimming placement seat, and a second crystal oscillator pin trimming mechanism fixing base. The second crystal oscillator pin trimming cylinder fixing bracket is installed on the crystal oscillator pin trimming mechanism mounting plate. On the platform, a second crystal oscillator pin-cutting cylinder is installed. This cylinder is mounted on a fixed bracket and connected to a connecting post. This connection post drives the connecting post and its connecting mechanism to move left and right. The connecting post is mounted on the cylinder and connects to a connecting seat. The connecting seat is mounted on the connecting post and connects to the second crystal oscillator pin-cutting blade. A crystal oscillator pin cutting blade is mounted on the connecting seat of the second crystal oscillator pin cutting cylinder, and connected to the fixing block of the second crystal oscillator pin clamping seat. It is used to cut the crystal oscillator pins placed in the second crystal oscillator pin cutting placement seat. The fixing block of the second crystal oscillator pin clamping seat is mounted on the second crystal oscillator pin cutting blade, and connected to the second crystal oscillator pin clamping seat connecting spring. The second crystal oscillator pin clamping seat connecting spring is mounted on the fixing block of the second crystal oscillator pin clamping seat, and connected to the second crystal oscillator pin clamping seat. The second crystal oscillator pin clamping seat is mounted on the second crystal oscillator pin clamping seat connecting spring, which can cut the crystal oscillator pins placed in the second crystal oscillator pin cutting placement seat. The second crystal oscillator pin clamping seat limit fixing seat slides left and right inside the second crystal oscillator pin clamping seat limit fixing seat. The second crystal oscillator pin clamping seat limit fixing seat is installed on the second crystal oscillator pin cutting mechanism fixing base to limit the second crystal oscillator pin clamping seat. The second crystal oscillator pin cutting and placing seat is installed on the second crystal oscillator pin cutting mechanism fixing base to place the crystal oscillator grabbed by the second station gripping device of the transfer gripping mechanism. The second crystal oscillator pin cutting mechanism fixing base is installed on the crystal oscillator pin cutting mechanism mounting platform to install the second crystal oscillator pin clamping seat limit fixing seat and the second crystal oscillator pin cutting and placing seat.

[0056] See Figure 10The rotary processing unit includes a rotary processing mechanism, a PCB substrate loading mechanism, a first solder paste dispensing device, a second solder paste dispensing device, a third solder paste dispensing device, a fourth solder paste dispensing device, a fifth solder paste dispensing device, a first crystal oscillator pressing mechanism, a second crystal oscillator pressing mechanism, a crystal oscillator unloading mechanism, a rotary processing unit mounting platform, and a rotary processing unit mounting platform fixing column. The rotary processing mechanism is mounted on the rotary processing unit mounting platform and can rotate at a fixed angle. It is used to load the PCB substrate onto the PCB substrate loading mechanism, the first solder paste dispensing device, the second solder paste dispensing device, the third solder paste dispensing device, the fourth solder paste dispensing device, the fifth solder paste dispensing device, the first crystal oscillator pressing mechanism, the second crystal oscillator pressing mechanism, and the crystal oscillator. The PCB substrate loading mechanism operates sequentially between the feeding and unloading units. The PCB substrate loading mechanism, mounted on the rotary processing unit mounting platform, stores the PCB substrates to be processed and transports them one by one to the PCB substrate loading station of the rotary processing unit. A first solder paste dispensing device, also mounted on the rotary processing unit mounting platform, dispenses solder paste from its tube onto the PCB substrate at the first solder paste dispensing station of the rotary processing unit. A second solder paste dispensing device, also mounted on the rotary processing unit mounting platform, dispenses solder paste from its tube onto the PCB substrate at the second solder paste dispensing station of the rotary processing unit. A third solder paste dispensing device is mounted on the rotary processing unit... The unit mounting platform is used to apply solder paste from the solder paste tube of the third solder paste applicator to the PCB substrate in the third solder paste applicator station of the rotary machining unit. The fourth solder paste applicator is mounted on the rotary machining unit mounting platform and is used to apply solder paste from the solder paste tube of the fourth solder paste applicator to the PCB substrate in the fourth solder paste applicator station of the rotary machining unit. The fifth solder paste applicator is mounted on the rotary machining unit mounting platform and is used to apply solder paste from the solder paste tube of the fifth solder paste applicator to the PCB substrate in the fifth solder paste applicator station of the rotary machining unit. The first crystal oscillator pressing mechanism is mounted on the rotary machining unit mounting platform and is used to press down the pre-placed crystal oscillator on the PCB substrate. The system includes a crystal oscillator, a second crystal oscillator pressing mechanism, and a rotating processing unit mounting platform. The second pressing mechanism is installed on the rotating processing unit mounting platform to press the crystal oscillator already placed on the PCB substrate. The crystal oscillator unloading mechanism is installed on the rotating processing unit mounting platform to unload the processed crystal oscillator. The rotating processing unit mounting platform is mounted on a fixed column and is used to mount the rotating processing mechanism, the PCB substrate loading mechanism, the first solder paste application device, the second solder paste application device, the third solder paste application device, the fourth solder paste application device, the fifth solder paste application device, the first crystal oscillator pressing mechanism, the second crystal oscillator pressing mechanism, and the crystal oscillator unloading mechanism. The fixed column of the rotating processing unit mounting platform is mounted on the cabinet and is used to mount the rotating processing unit mounting platform.

[0057] See Figure 11The rotary processing mechanism includes a rotary processing tray, a PCB base plate storage slot cover, a PCB base plate loading station, a first solder paste application station, a second solder paste application station, a third solder paste application station, a fourth solder paste application station, a fifth solder paste application station, a crystal oscillator loading station, a first crystal oscillator pressing station, a second crystal oscillator pressing station, a crystal oscillator unloading station, a divider, a divider synchronous pulley, a divider synchronous pulley belt, a stepper motor, a stepper motor synchronous pulley, and a stepper motor mounting bracket. The rotary processing tray is mounted on the divider and is used to install the PCB base plate storage slot cover. The PCB substrate storage slot cover is installed on the rotary processing tray, forming with the rotary processing tray a PCB substrate loading station, a first solder paste dispensing station, a second solder paste dispensing station, a third solder paste dispensing station, a fourth solder paste dispensing station, a fifth solder paste dispensing station, a crystal oscillator loading station, a first crystal oscillator pressing station, a second crystal oscillator pressing station, and a crystal oscillator unloading station. The PCB substrate loading station connects to the PCB substrate loading mechanism, the first solder paste dispensing station connects to the first solder paste dispensing device, the second solder paste dispensing station connects to the second solder paste dispensing device, and the third solder paste dispensing station connects to the fourth solder paste dispensing device. The workstations are connected to the third solder paste dispensing device, the fourth solder paste dispensing station, and the fifth solder paste dispensing station. The crystal oscillator loading station is connected to the third station gripping device of the crystal oscillator pin cutting unit transfer and gripping mechanism. The first crystal oscillator pressing station is connected to the first crystal oscillator pressing mechanism, the second crystal oscillator pressing station is connected to the second crystal oscillator pressing mechanism, and the crystal oscillator unloading station is connected to the crystal oscillator unloading mechanism. The divider is mounted on the rotary processing unit mounting platform for mounting the rotary processing disk. The divider synchronous pulley is mounted on the divider for connecting the divider... The cutter synchronous pulley belt is mounted on the cutter synchronous pulley and the stepper motor synchronous pulley, connecting the cutter synchronous pulley and the stepper motor synchronous pulley. The stepper motor is mounted on the stepper motor mounting bracket, which is connected to the stepper motor synchronous pulley. When the stepper motor rotates, it drives the cutter to rotate via the cutter synchronous pulley belt. The cutter drives the rotary processing disk to rotate. The stepper motor synchronous pulley is mounted on the stepper motor, connecting to the cutter synchronous pulley belt. The stepper motor mounting bracket is mounted on the rotary processing unit mounting platform, which is used to mount the stepper motor.

[0058] See Figure 12The PCB baseboard loading mechanism includes a PCB baseboard storage slot, a PCB baseboard pushing cylinder, and a PCB baseboard pushing plate. The PCB baseboard storage slot is mounted on the PCB baseboard pushing cylinder mounting plate and is used to store PCB baseboards. The PCB baseboard pushing cylinder is mounted on the PCB baseboard pushing cylinder mounting plate and is used to install the PCB baseboard pushing plate. The PCB baseboard pushing cylinder moves left and right, driving the PCB baseboard pushing plate to push the PCB baseboards in the PCB baseboard storage slot to the PCB baseboard loading station. The PCB baseboard pushing plate is mounted on the PCB baseboard pushing cylinder and is used to push the PCB baseboards in the PCB baseboard storage slot. The PCB baseboard pushing cylinder mounting plate is mounted on the PCB baseboard pushing cylinder mounting plate bracket and is used to install the PCB baseboard storage slot and the PCB baseboard pushing cylinder. The PCB baseboard pushing cylinder mounting plate bracket is mounted on the rotary processing unit mounting platform and is used to install the PCB baseboard pushing cylinder mounting plate.

[0059] See Figure 13 The first solder paste dispensing device includes a first solder paste dispensing device solder paste tube, a first solder paste dispensing device solder paste tube bracket, a first solder paste dispensing device slide cylinder, and a first solder paste dispensing device slide cylinder bracket. The first solder paste dispensing device solder paste tube is mounted on the first solder paste dispensing device solder paste tube bracket and is used to dispense solder paste onto the PCB substrate in the first solder paste dispensing station. The first solder paste dispensing device solder paste tube bracket is mounted on the first solder paste dispensing device slide cylinder and is used to mount the first solder paste dispensing device solder paste tube. The first solder paste dispensing device slide cylinder is mounted on the first solder paste dispensing device slide cylinder bracket and is used to mount the first solder paste dispensing device solder paste tube bracket. The first solder paste dispensing device slide cylinder bracket is mounted on the rotary processing unit mounting platform and is used to mount the first solder paste dispensing device slide cylinder.

[0060] See Figure 14 The second solder paste dispensing device includes a second solder paste dispensing device solder paste tube, a second solder paste dispensing device solder paste tube bracket, a second solder paste dispensing device slide cylinder, and a second solder paste dispensing device slide cylinder bracket. The second solder paste dispensing device solder paste tube is mounted on the second solder paste dispensing device solder paste tube bracket and is used to dispense solder paste onto the PCB substrate in the second solder paste dispensing station. The second solder paste dispensing device solder paste tube bracket is mounted on the second solder paste dispensing device slide cylinder and is used to mount the second solder paste dispensing device solder paste tube. The second solder paste dispensing device slide cylinder bracket is mounted on the second solder paste dispensing device slide cylinder bracket and is used to mount the second solder paste dispensing device solder paste tube bracket. The second solder paste dispensing device slide cylinder bracket is mounted on the rotary processing unit mounting platform and is used to mount the second solder paste dispensing device slide cylinder.

[0061] See Figure 15The third solder paste dispensing device includes a solder paste tube, a solder paste tube support, a slide cylinder, and a slide cylinder support. The solder paste tube is mounted on the solder paste tube support and is used to apply solder paste to the PCB substrate in the third solder paste dispensing station. The solder paste tube support is mounted on the slide cylinder and is used to mount the solder paste tube. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder support is mounted on the rotary processing unit mounting platform and is used to mount the slide cylinder.

[0062] See Figure 16 The fourth solder paste dispensing device includes a fourth solder paste dispensing device solder paste tube, a fourth solder paste dispensing device solder paste tube bracket, a fourth solder paste dispensing device slide cylinder, and a fourth solder paste dispensing device slide cylinder bracket. The fourth solder paste dispensing device solder paste tube is mounted on the fourth solder paste dispensing device solder paste tube bracket and is used to dispense solder paste onto the PCB substrate in the fourth solder paste dispensing station. The fourth solder paste dispensing device solder paste tube bracket is mounted on the fourth solder paste dispensing device slide cylinder and is used to mount the fourth solder paste dispensing device solder paste tube. The fourth solder paste dispensing device slide cylinder bracket is mounted on the fourth solder paste dispensing device slide cylinder bracket and is used to mount the fourth solder paste dispensing device solder paste tube bracket. The fourth solder paste dispensing device slide cylinder bracket is mounted on the rotary processing unit mounting platform and is used to mount the fourth solder paste dispensing device slide cylinder.

[0063] See Figure 17 The fifth solder paste dispensing device includes a solder paste tube, a solder paste tube support, a slide cylinder, and a slide cylinder support. The solder paste tube is mounted on the solder paste tube support and is used to apply solder paste to the PCB substrate in the fifth solder paste dispensing station. The solder paste tube support is mounted on the slide cylinder and is used to mount the solder paste tube. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder support is mounted on the rotary processing unit mounting platform and is used to mount the slide cylinder.

[0064] See Figure 18The first crystal oscillator pressing mechanism includes a first crystal oscillator pressing mechanism pressing cylinder, a first crystal oscillator pressing mechanism flexible rubber ball, and a first crystal oscillator pressing mechanism bracket. The first crystal oscillator pressing mechanism pressing cylinder is mounted on the first crystal oscillator pressing mechanism bracket and is used to mount the first crystal oscillator pressing mechanism flexible rubber ball. The first crystal oscillator pressing mechanism flexible rubber ball is mounted on the first crystal oscillator pressing mechanism pressing cylinder and is used to press down the crystal oscillator in the first crystal oscillator pressing station. The first crystal oscillator pressing mechanism bracket is mounted on the rotary processing unit mounting platform and is used to mount the first crystal oscillator pressing mechanism pressing cylinder.

[0065] See Figure 19 The second crystal oscillator pressing mechanism includes a second crystal oscillator pressing mechanism pressing cylinder, a second crystal oscillator pressing mechanism flexible rubber ball, and a second crystal oscillator pressing mechanism bracket. The second crystal oscillator pressing mechanism pressing cylinder is mounted on the second crystal oscillator pressing mechanism bracket and is used to mount the second crystal oscillator pressing mechanism flexible rubber ball. The second crystal oscillator pressing mechanism flexible rubber ball is mounted on the second crystal oscillator pressing mechanism pressing cylinder and is used to press down the crystal oscillator in the second crystal oscillator pressing station. The second crystal oscillator pressing mechanism bracket is mounted on the rotary processing unit mounting platform and is used to mount the second crystal oscillator pressing mechanism pressing cylinder.

[0066] See Figure 20 The crystal oscillator unloading mechanism includes a crystal oscillator unloading push cylinder, a crystal oscillator unloading push cylinder mounting bracket, a crystal oscillator unloading push plate, a crystal oscillator unloading slide, and a crystal oscillator unloading slide mounting bracket. The crystal oscillator unloading push cylinder is mounted on the crystal oscillator unloading push cylinder mounting bracket and is used to mount the crystal oscillator unloading push plate. The crystal oscillator unloading push cylinder drives the crystal oscillator unloading push plate to move left and right, pushing the crystal oscillator in the crystal oscillator unloading station into the crystal oscillator unloading slide. The crystal oscillator unloading push cylinder mounting bracket is mounted on the rotary processing unit mounting platform and is used to mount the crystal oscillator unloading push cylinder. The crystal oscillator unloading push plate is mounted on the crystal oscillator unloading push cylinder and is used to push the crystal oscillator in the crystal oscillator unloading station. The crystal oscillator unloading slide is mounted on the crystal oscillator unloading slide mounting bracket and is used to receive the crystal oscillator pushed by the crystal oscillator unloading push plate. The crystal oscillator unloading slide mounting bracket is mounted on the rotary processing unit mounting platform and is used to mount the crystal oscillator unloading slide.

Claims

1. An automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals, characterized in that, include: The system includes an operation control unit, a crystal oscillator feeding unit, a crystal oscillator pin trimming unit, a rotary processing unit, and a cabinet. The operation control unit includes an operation control box, a touch screen, a power button, a start button, a pause button, and an operation control box support. The touch screen is mounted on the touch screen mounting box and is used to set equipment parameters. The power button is mounted on the touch screen mounting box and is used to power on and off the entire equipment. The start button is mounted on the touch screen mounting box and is used to trigger equipment operation. The pause button is mounted on the touch screen mounting box and is used to trigger equipment pause. The operation control box is mounted on the operation control box support and is used to mount the touch screen, power button, start button, and pause button. One end of the operation control box mounting support is connected to the touch screen mounting box, and the other end is mounted on the cabinet to support the operation control box. The crystal oscillator feeding unit includes a crystal oscillator storage tray, a left crystal oscillator storage tray fixing column, a right crystal oscillator storage tray fixing column, a crystal oscillator storage tray fixing bracket, a crystal oscillator feeding track, a direct vibration feeder, a direct vibration feeder mounting base, a direct vibration feeder fixing column, and a crystal oscillator feeding unit mounting platform. The crystal oscillator storage tray is mounted on the left and right crystal oscillator storage tray fixing columns and is used to store the crystal oscillators to be fed. The top of the left crystal oscillator storage tray fixing column is connected to the crystal oscillator storage tray, and the bottom is connected to the crystal oscillator storage tray fixing bracket to support the crystal oscillator storage tray. The crystal oscillator storage tray fixing bracket is mounted on the cabinet and connected to the left crystal oscillator storage tray fixing column to support the left crystal oscillator storage tray fixing column. The top of the right crystal oscillator storage tray fixing column is connected to the crystal oscillator storage tray, and the bottom is connected to the crystal oscillator feeding unit mounting platform to support the crystal oscillator storage tray. One end of the feeding track is connected to the crystal oscillator storage tray, and the other end is connected to the crystal oscillator storage slide of the crystal oscillator pin cutting and feeding mechanism of the crystal oscillator pin cutting unit. This track is used to feed the crystals from the crystal oscillator storage tray to the crystal oscillator storage slide of the crystal oscillator pin cutting and feeding mechanism. The direct vibration feeder is installed on the direct vibration feeder mounting base and connected to the crystal oscillator feeding track. This causes the crystal oscillator feeding track to vibrate, moving the crystals within the track from one end to the other. The direct vibration feeder mounting base is installed on the direct vibration feeder fixed column and connected to the direct vibration feeder. This base is used to install the direct vibration feeder. One end of the direct vibration feeder fixed column is connected to the direct vibration feeder mounting base, and the other end is connected to the crystal oscillator feeding unit mounting platform. This platform supports the direct vibration feeder mounting base. The crystal oscillator feeding unit mounting platform is installed on the cabinet and is used to install the right-side crystal oscillator storage tray fixed column and the direct vibration feeder fixed column. The crystal oscillator pin trimming unit includes a horizontal transfer mechanism (31), a transfer gripping mechanism (32), a crystal oscillator pin trimming and feeding mechanism (33), a first crystal oscillator pin trimming mechanism (34), a second crystal oscillator pin trimming mechanism (35), a crystal oscillator pin trimming mechanism mounting platform (36), and a crystal oscillator pin trimming mechanism mounting platform fixing column (37). The horizontal transfer mechanism is installed on the crystal oscillator pin trimming mechanism mounting platform and connected to the transfer gripping mechanism, used to make the transfer gripping mechanism move laterally. The transfer gripping mechanism is installed on the horizontal transfer mechanism and is used to move the crystal oscillator to be processed in the crystal oscillator pin trimming and feeding mechanism to the first crystal oscillator pin trimming mechanism, and at the same time move the crystal oscillator processed in the first crystal oscillator pin trimming mechanism to the second crystal oscillator pin trimming mechanism, and at the same time move the crystal oscillator processed in the second crystal oscillator pin trimming mechanism to the crystal oscillator feeding station of the rotary processing unit. The first crystal oscillator pin cutting mechanism is installed on the crystal oscillator pin cutting mechanism mounting platform to receive crystal oscillators to be processed from the crystal oscillator feeding track of the crystal oscillator feeding unit. The second crystal oscillator pin cutting mechanism is also installed on the platform to receive crystal oscillators transferred from the crystal oscillator pin cutting and feeding mechanism by the transfer gripping mechanism, and to cut the pins on one side of the crystal oscillator. The third crystal oscillator pin cutting mechanism is installed on the platform to receive crystal oscillators transferred from the first crystal oscillator pin cutting mechanism by the transfer gripping mechanism, and to cut the pins on the other side of the crystal oscillator. The crystal oscillator pin cutting mechanism mounting platform is mounted on a fixed column and is used to install the horizontal transfer mechanism, the crystal oscillator pin cutting and feeding mechanism, the first crystal oscillator pin cutting mechanism, and the second crystal oscillator pin cutting mechanism. The fixed column is mounted on a cabinet and is used to install the crystal oscillator pin cutting mechanism mounting platform. The rotary processing unit includes a rotary processing mechanism (41), a PCB substrate loading mechanism (42), a first solder paste dispensing device (43), a second solder paste dispensing device (44), a third solder paste dispensing device (45), a fourth solder paste dispensing device (46), a fifth solder paste dispensing device (47), a first crystal oscillator pressing mechanism (48), a second crystal oscillator pressing mechanism (49), a crystal oscillator unloading mechanism (410), a rotary processing unit mounting platform (411), and a rotary processing unit mounting platform fixing column (412). The rotary processing mechanism is mounted on the rotary processing unit mounting platform and can rotate at a fixed angle to load the PCB substrate. The PCB substrate loading mechanism, the first solder paste dispensing device, the second solder paste dispensing device, the third solder paste dispensing device, the fourth solder paste dispensing device, the fifth solder paste dispensing device, the first crystal oscillator pressing mechanism, the second crystal oscillator pressing mechanism, and the crystal oscillator unloading mechanism flow sequentially among these components. The PCB substrate loading mechanism is mounted on the rotary processing unit mounting platform and is used to store the PCB substrates to be processed and to transport the PCB substrates one by one to the PCB substrate loading station of the rotary processing mechanism. The first solder paste dispensing device is mounted on the rotary processing unit mounting platform and is used to dispense the solder paste from the solder paste tube of the first solder paste dispensing device to the first solder paste dispensing device of the rotary processing unit. The first solder paste application device is installed on the PCB substrate within the solder paste application station; the second solder paste application device is mounted on the rotary processing unit mounting platform and is used to apply solder paste from the solder paste tube of the second solder paste application device to the PCB substrate within the second solder paste application station of the rotary processing unit; the third solder paste application device is mounted on the rotary processing unit mounting platform and is used to apply solder paste from the solder paste tube of the third solder paste application device to the PCB substrate within the third solder paste application station of the rotary processing unit; the fourth solder paste application device is mounted on the rotary processing unit mounting platform and is used to apply solder paste from the solder paste tube of the fourth solder paste application device to the rotary processing machine of the rotary processing unit. The fifth solder paste dispensing device is installed on the rotary processing unit mounting platform and is used to dispense solder paste from the solder paste tube of the fifth solder paste dispensing device onto the PCB substrate in the fifth solder paste dispensing station of the rotary processing unit. The first crystal oscillator pressing mechanism is installed on the rotary processing unit mounting platform and is used to press the crystal oscillator already placed on the PCB substrate. The second crystal oscillator pressing mechanism is installed on the rotary processing unit mounting platform and is used to press the crystal oscillator already placed on the PCB substrate a second time. The crystal oscillator unloading mechanism is installed on the rotary processing unit mounting platform and is used to unload the processed crystal oscillator.The rotary processing unit mounting platform is mounted on the fixed column of the rotary processing unit mounting platform and is used to mount the rotary processing mechanism, the PCB substrate loading mechanism, the first solder paste dispensing device, the second solder paste dispensing device, the third solder paste dispensing device, the fourth solder paste dispensing device, the fifth solder paste dispensing device, the first crystal oscillator pressing mechanism, the second crystal oscillator pressing mechanism, and the crystal oscillator unloading mechanism. The fixed column of the rotary processing unit mounting platform is mounted on the cabinet and is used to mount the rotary processing unit mounting platform. The cabinet is used to install the operation control unit, the crystal oscillator feeding unit, the crystal oscillator pin cutting unit, and the rotary processing unit.

2. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, The lateral transplanting mechanism includes a lateral pushing cylinder, a lateral pushing cylinder fixing bracket, a floating joint, a floating joint fixing bracket, a lateral transplanting mechanism mounting back plate, a lateral transplanting mechanism fixing stand, a lateral guide rail, and a lateral slider. The lateral pushing cylinder is mounted on the lateral pushing cylinder fixing bracket and is connected to the floating joint, driving the floating joint and its connecting mechanism to move left and right. The lateral pushing cylinder fixing bracket is mounted on the lateral transplanting mechanism mounting back plate and is used to mount the lateral pushing cylinder. The floating joint is mounted on the lateral pushing cylinder and connects the lateral pushing cylinder and the floating joint connecting bracket. The floating joint connecting bracket is mounted on the floating joint. A downward-pressing cylinder fixing bracket connected to the transplanting gripping mechanism is used to move the transplanting gripping mechanism left and right under the drive of the lateral pushing cylinder; the lateral transplanting mechanism mounting back plate is mounted on the lateral transplanting mechanism fixing stand for mounting the lateral guide rail; the lateral transplanting mechanism fixing stand is mounted on the crystal oscillator pin cutting mechanism mounting platform for mounting the lateral transplanting mechanism mounting back plate; the lateral guide rail is mounted on the lateral transplanting mechanism mounting back plate for mounting the lateral slider, and the lateral slider can slide left and right on the lateral guide rail; the lateral slider is mounted on the lateral guide rail for mounting the transplanting gripping mechanism fixing seat of the transplanting gripping mechanism, for the lateral sliding of the transplanting gripping mechanism.

3. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, The transplanting gripping mechanism includes a pressing cylinder, a pressing cylinder fixing bracket, a transplanting gripping mechanism fixing seat, a pressing guide rail, a pressing slider, a first sliding connecting block, a second sliding connecting block, a gripping device mounting panel, a first-station gripping device, a second-station gripping device, a rotary cylinder, a rotary cylinder fixing bracket, and a third-station gripping device. The pressing cylinder is mounted on the pressing cylinder fixing bracket and connected to the second sliding connecting block, used to drive the second sliding connecting block and its connecting mechanism to move up and down. The pressing cylinder fixing bracket is mounted on the floating joint connecting bracket of the transverse transplanting mechanism and is used to install the pressing cylinder. The transplanting gripping mechanism fixing seat is mounted on the transverse slider of the transverse transplanting mechanism and is used to install the pressing guide rail. The pressing guide rail is mounted on the transplanting gripping mechanism fixing seat and is used to install the pressing slider. The pressing slider is mounted on the pressing guide rail and is used to install the first sliding connecting block. The first sliding connecting block is mounted on the pressing slider and is used to install the second sliding connecting block and the gripping device mounting panel. A block is mounted on a pressing cylinder to connect to a first sliding connecting block; the gripping device mounting panel is mounted on the first sliding connecting block to mount a first-station gripping device, a second-station gripping device, and a rotary cylinder fixing bracket; the first-station gripping device is mounted on the gripping device mounting panel to grip the crystal oscillator in the crystal oscillator pin cutting and feeding mechanism, moves it laterally, and places it into the first crystal oscillator pin cutting mechanism; the second-station gripping device is mounted on the gripping device mounting panel to grip the crystal oscillator in the first crystal oscillator pin cutting mechanism, moves it laterally, and places it into the second crystal oscillator pin cutting mechanism; the rotary cylinder is mounted on a rotary cylinder fixing bracket to connect to a third-station gripping device to rotate the third-station gripping device by 90 degrees; the rotary cylinder fixing bracket is mounted on the gripping device mounting panel to mount the rotary cylinder; the third-station gripping device is mounted on the rotary cylinder to grip the crystal oscillator in the second crystal oscillator pin cutting mechanism, moves it laterally, and places it into the crystal oscillator feeding station of the rotary processing unit's rotary processing mechanism; The crystal oscillator pin cutting and feeding mechanism includes a crystal oscillator pin cutting and feeding push cylinder, a crystal oscillator pin cutting and feeding push cylinder fixing base, a crystal oscillator storage slide, a crystal oscillator pin cutting and feeding slider, a crystal oscillator pin cutting and feeding guide rail, and a crystal oscillator pin cutting and feeding guide rail fixing base. The crystal oscillator pin cutting and feeding push cylinder is installed on the crystal oscillator pin cutting and feeding push cylinder fixing base and connected to the crystal oscillator storage slide, causing the crystal oscillator storage slide to move left and right, which is used to push the crystal oscillator conveyed from the crystal oscillator feeding rail of the crystal oscillator feeding unit to the first station gripping device of the crystal oscillator pin cutting unit transfer gripping mechanism, so that the crystal oscillator in the crystal oscillator storage slide can be gripped by the first station gripping device; the crystal oscillator pin cutting and feeding push cylinder... A cylinder fixing base is installed on the crystal oscillator pin cutting mechanism mounting platform and is used to install the crystal oscillator pin cutting and feeding push cylinder; the crystal oscillator storage slide is installed on the crystal oscillator pin cutting and feeding slide and is connected to the crystal oscillator pin cutting and feeding push cylinder, and is used to receive the crystal oscillator conveyed by the crystal oscillator feeding unit's crystal oscillator feeding track; the crystal oscillator pin cutting and feeding slide is installed on the crystal oscillator pin cutting and feeding guide rail and is used to install the crystal oscillator storage slide; the crystal oscillator pin cutting and feeding guide rail is installed on the crystal oscillator pin cutting and feeding guide rail fixing base and is used to install the crystal oscillator pin cutting and feeding slide; the crystal oscillator pin cutting and feeding guide rail fixing base is installed on the crystal oscillator pin cutting mechanism mounting platform and is used to install the crystal oscillator pin cutting and feeding guide rail.

4. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, Both the first and second crystal oscillator pin cutting mechanisms include a crystal oscillator pin cutting cylinder fixing bracket, a crystal oscillator pin cutting cylinder, a crystal oscillator pin cutting cylinder connecting column, a crystal oscillator pin cutting cylinder connecting seat, a crystal oscillator pin cutting blade, a crystal oscillator pin clamping seat fixing block, a crystal oscillator pin clamping seat connecting spring, a crystal oscillator pin clamping seat, a crystal oscillator pin clamping seat limiting fixing seat, a crystal oscillator pin cutting placement seat, and a crystal oscillator pin cutting mechanism fixing base; the crystal oscillator pin cutting cylinder fixing bracket is installed on the crystal oscillator pin cutting machine. On the mounting platform, a crystal oscillator pin-cutting cylinder is installed. The crystal oscillator pin-cutting cylinder is mounted on a fixed bracket and connected to a connecting column, used to drive the connecting column and its connecting mechanism to move left and right. The connecting column is mounted on the crystal oscillator pin-cutting cylinder and connected to a connecting seat. The connecting seat is mounted on the connecting column and connected to a crystal oscillator pin-cutting blade. The crystal oscillator pin cutting blade is mounted on the crystal oscillator pin cutting cylinder connecting seat and connected to the crystal oscillator pin clamping seat fixing block, used to cut the crystal oscillator pins placed in the crystal oscillator pin cutting placement seat; the crystal oscillator pin clamping seat fixing block is mounted on the crystal oscillator pin cutting blade and connected to the crystal oscillator pin clamping seat connecting spring; the crystal oscillator pin clamping seat connecting spring is mounted on the crystal oscillator pin clamping seat fixing block and connected to the crystal oscillator pin clamping seat; the crystal oscillator pin clamping seat is mounted on the crystal oscillator pin clamping seat connecting spring, which can cut the crystal oscillator pins. The clamping seat limits and fixes the crystal oscillator pins; the crystal oscillator pin clamping seat limits and fixes the crystal oscillator pins, and is used to limit the clamping of the crystal oscillator pins; the crystal oscillator pins cutting and placing seat is installed on the crystal oscillator pins cutting and placing seat for placing the crystal oscillator gripped by the first station gripping device of the transfer gripping mechanism; the crystal oscillator pins cutting and fixing seat is installed on the crystal oscillator pins cutting and mounting platform, and is used to install the crystal oscillator pin clamping seat limits and fixing seat and the crystal oscillator pins cutting and placing seat.

5. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, The rotary processing mechanism includes a rotary processing disk, a PCB base plate storage slot cover, a PCB base plate loading station, a first solder paste application station, a second solder paste application station, a third solder paste application station, a fourth solder paste application station, a fifth solder paste application station, a crystal oscillator loading station, a first crystal oscillator pressing station, a second crystal oscillator pressing station, a crystal oscillator unloading station, a divider, a divider synchronous pulley, a divider synchronous pulley belt, a stepper motor, a stepper motor synchronous pulley, and a stepper motor mounting bracket. The rotary processing disk is mounted on the divider and is used to install the PCB base plate storage slot cover. The base plate storage slot cover is installed on the rotary processing tray, forming with the rotary processing tray a PCB base plate loading station, a first solder paste dispensing station, a second solder paste dispensing station, a third solder paste dispensing station, a fourth solder paste dispensing station, a fifth solder paste dispensing station, a crystal oscillator loading station, a first crystal oscillator pressing station, a second crystal oscillator pressing station, and a crystal oscillator unloading station. The PCB base plate loading station is connected to the PCB base plate loading mechanism, the first solder paste dispensing station is connected to the first solder paste dispensing device, the second solder paste dispensing station is connected to the second solder paste dispensing device, and the third solder paste dispensing station is connected to the... The three-solder paste dispensing device, the fourth solder paste dispensing station is connected to the fourth solder paste dispensing device, the fifth solder paste dispensing station is connected to the fifth solder paste dispensing device, the crystal oscillator loading station is connected to the third station gripping device of the crystal oscillator pin cutting unit transfer gripping mechanism, the first crystal oscillator pressing station is connected to the first crystal oscillator pressing mechanism, the second crystal oscillator pressing station is connected to the second crystal oscillator pressing mechanism, the crystal oscillator unloading station is connected to the crystal oscillator unloading mechanism, the divider is mounted on the rotary processing unit mounting platform for mounting the rotary processing disk; the divider synchronous wheel is mounted on the divider for connecting... A synchronizer belt for the divider; the synchronizer belt for the divider is mounted on the synchronizer pulley of the divider and the synchronizer pulley of the stepper motor, and is used to connect the synchronizer pulley of the divider and the synchronizer pulley of the stepper motor. The stepper motor is mounted on a stepper motor mounting bracket, and is used to connect the synchronizer pulley of the stepper motor. When the stepper motor rotates, it drives the divider to rotate through the synchronizer belt for the divider, and the divider drives the rotary processing disk to rotate. The synchronizer pulley of the stepper motor is mounted on the stepper motor, and is used to connect the synchronizer belt for the divider. The stepper motor mounting bracket is mounted on the rotary processing unit mounting platform, and is used to mount the stepper motor.

6. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, The PCB substrate loading mechanism includes a PCB substrate storage slot, a PCB substrate pushing cylinder, and a PCB substrate pushing plate. The PCB substrate storage slot is mounted on the PCB substrate pushing cylinder mounting plate and is used to store PCB substrates. The PCB substrate pushing cylinder is mounted on the PCB substrate pushing cylinder mounting plate and is used to mount the PCB substrate pushing plate. The PCB substrate pushing cylinder moves left and right, driving the PCB substrate pushing plate to push the PCB substrates in the PCB substrate storage slot to the PCB substrate loading station. The PCB substrate pushing plate is mounted on the PCB substrate pushing cylinder and is used to push the PCB substrates in the PCB substrate storage slot. The PCB substrate pushing cylinder mounting plate is mounted on the PCB substrate pushing cylinder mounting plate bracket and is used to mount the PCB substrate storage slot and the PCB substrate pushing cylinder. The PCB substrate pushing cylinder mounting plate bracket is mounted on the rotary processing unit mounting platform and is used to mount the PCB substrate pushing cylinder mounting plate.

7. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, The first, second, third, fourth, and fifth solder paste dispensing devices all include a solder paste tube, a solder paste tube support, a slide cylinder, and a slide cylinder support. The solder paste tube is mounted on the solder paste tube support and is used to apply solder paste to the PCB substrate in the solder paste dispensing station. The solder paste tube support is mounted on the slide cylinder and is used to mount the solder paste tube. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder is mounted on the slide cylinder support and is used to mount the solder paste tube support. The slide cylinder support is mounted on the rotary processing unit mounting platform and is used to mount the slide cylinder.

8. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, Both the first and second crystal oscillator pressing mechanisms include a pressing cylinder, a flexible rubber ball, and a support. The pressing cylinder is mounted on the support and is used to mount the flexible rubber ball. The flexible rubber ball is mounted on the pressing cylinder and is used to press down the crystal oscillator in the first pressing station. The support is mounted on the rotary processing unit mounting platform and is used to mount the pressing cylinder.

9. The automatic processing equipment for converting through-hole crystal oscillators to surface mount crystals according to claim 1, characterized in that, The crystal oscillator unloading mechanism includes a crystal oscillator unloading and pushing cylinder, a crystal oscillator unloading and pushing cylinder mounting bracket, a crystal oscillator unloading and pushing plate, a crystal oscillator unloading slide, and a crystal oscillator unloading slide mounting bracket. The crystal oscillator unloading and pushing cylinder is mounted on the crystal oscillator unloading and pushing cylinder and is used to mount the crystal oscillator unloading and pushing plate left and right, pushing the crystal oscillator in the unloading station into the crystal oscillator unloading slide. The crystal oscillator unloading and pushing cylinder mounting bracket is mounted on the rotary processing unit mounting platform and is used to mount the crystal oscillator unloading and pushing cylinder. The crystal oscillator unloading and pushing plate is mounted on the crystal oscillator unloading and pushing cylinder and is used to push the crystal oscillator in the unloading station. The crystal oscillator unloading slide is mounted on the crystal oscillator unloading slide mounting bracket and is used to receive the crystal oscillator pushed by the crystal oscillator unloading and pushing plate. The crystal oscillator unloading slide mounting bracket is mounted on the rotary processing unit mounting platform and is used to mount the crystal oscillator unloading slide.

Citation Information

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