A laser processing method and system for forming micro-group holes

Abstract

The present invention discloses a laser processing method and system for forming micro-group holes, which includes the following steps: according to the dimensions of vector primitives in a processing drawing, marking the vector primitives as first processing vectors corresponding to a first deflection unit or second processing vectors corresponding to a second deflection unit, and storing the center point coordinates of each vector primitive in the processing drawing into a queue Q; determining the processing sequence of the group holes according to the stored center point coordinates of the vector primitives; and performing micro-group hole processing according to the processing sequence of the group holes and the dimensions of the vector primitives. The present invention can complete the processing of vector primitives with corresponding sizes through the first deflection unit and the second deflection unit, and realize the processing of multi-size micro-group holes from microns to millimeters.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing, and particularly relates to a laser processing method and system for forming micro-hole clusters. Background Art

[0002] Currently, in the field of product production in various industries, it is necessary to form micro-hole clusters on products. The so-called micro-hole clusters refer to a series of hole structures with small sizes and uniform distributions. The diameter of each hole is usually between the micron and millimeter levels. For example, in the electronic information industry, it is necessary to process hole-like structures with a pore diameter of 150 μm - 50 mm and a quantity of 3000 - 6000 on the polyimide film of the FPC bottom plate insulation layer.

[0003] Therefore, in the prior art, a technical solution for processing micro-hole clusters by laser has been developed. For example, a patent application with the application number 201810130219.1 - A Method for Efficient Manufacturing of Femtosecond Laser Thin Film Micro-Hole Clusters discloses a similar solution, which mainly completes array punching through galvanometer deflection, but its processing speed is slow and the production efficiency is low. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides a laser processing method and system for forming micro-hole clusters, which can complete the processing of vector graphics elements of corresponding sizes through a first deflection unit and a second deflection unit, and realize the processing of multi-size micro-hole clusters from microns to millimeters.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] On the one hand, a laser processing method for forming micro-hole clusters is provided, which includes the following steps:

[0007] According to the size of the vector graphics element in the processing drawing, the vector graphics element is marked as a first processing vector corresponding to the first deflection unit or a second processing vector corresponding to the second deflection unit, and the center point coordinates of each vector graphics element in the processing drawing are stored in the queue Q;

[0008] Determine the processing sequence of the hole clusters according to the stored center point coordinates of the vector graphics elements;

[0009] And perform micro-hole cluster processing according to the processing sequence of the hole clusters and the size of the vector graphics elements.

[0010] Preferably, the first deflection unit includes a modulation deflection unit.

[0011] Preferably, the first deflection unit includes one or more of an electro-optic polarizer, an acousto-optic polarizer, and a liquid crystal polarization grating.

[0012] Preferably, the second deflection unit includes a mechanical deflection unit.

[0013] Preferably, the second deflection unit includes one or more of a galvanometer, a rotating reflecting prism, and a MEMS mirror.

[0014] Preferably, according to the size of the vector graphics in the processing drawing, the vector graphics are marked as the first processing vector corresponding to the first deflection unit or the second processing vector corresponding to the second deflection unit, and the center point coordinates of each vector graphics in the processing drawing are stored in the queue Q, including the following steps:

[0015] Set the threshold T of the processable vector graphic size according to the deflection angle of the first deflection unit;

[0016] Traverse the vector graphics in the processing drawing. When the size of the vector graphic is less than or equal to the vector graphic size threshold T, the vector graphic is marked as the first processing vector corresponding to the first deflection unit; when the size of the vector graphic is greater than the vector graphic size threshold T, the vector graphic is marked as the second processing vector corresponding to the second deflection unit;

[0017] Store the center point coordinates of each vector graphic in the queue Q.

[0018] Preferably, determine the processing order of the group holes according to the stored center point coordinates of the vector graphics, including the following steps:

[0019] Obtain the distance between each center point in the queue Q and all other center points, and store it in the form of a two-dimensional array A;

[0020] Take the first data in the queue Q as the sorting reference point Pc, and remove it from the queue Q, and then use the queue Q with the first data removed as the unsorted queue Qw;

[0021] Create a new queue Q f , and store the removed sorting reference point Pc in the queue Qf;

[0022] Traverse the distances stored in the two-dimensional array A, and determine the center point P1 closest to the sorting reference point P c distance, and remove the center point P1 from the unsorted queue Q w and store it at the end of the queue Q f ;

[0023] Traverse the distances stored in the two-dimensional array A, and determine the center point P2 closest to the center point P1, and remove the center point P2 from the unsorted queue Qw and store it at the end of the queue Qf;

[0024] Until each center point in the unsorted queue Qw is stored in the queue Qf, the queue order of the center points in the queue Qf is the micro-hole processing order.

[0025] Preferably, micro-group hole processing is performed according to the processing order of the group holes and the size of the vector graphics element, including the following steps:

[0026] Traverse the center points in the queue Qf according to the queue order of the center points in the queue Qf. If the vector graphics element corresponding to the current center point is the first processing vector, control the first deflection unit to act, and use the laser beam generated by the laser to complete the processing of the hole-shaped structure corresponding to the current vector graphics element;

[0027] If the vector graphics element corresponding to the current center point is the second processing vector, control the second deflection unit to act, and use the laser beam generated by the laser to complete the processing of the hole-shaped structure corresponding to the current vector graphics element.

[0028] Preferably, start from the first center point in the queue Q f and traverse the center points in the queue Qf according to the queue order of the center points.

[0029] A laser processing system for implementing the above laser processing method is also provided, which includes:

[0030] A motion controller;

[0031] A laser, which is connected to the motion controller and is used to generate a laser beam;

[0032] A first deflection unit and a second deflection unit, both of which are connected to the motion controller;

[0033] A vector marking unit, which is used to mark the vector graphics element as the first processing vector corresponding to the first deflection unit or the second processing vector corresponding to the second deflection unit according to the size of the vector graphics element in the processing drawing, and store the center point coordinates of each vector graphics element in the processing drawing into the queue Q;

[0034] And a sorting unit, which is used to determine the processing order of the group holes according to the stored center point coordinates of the vector graphics elements;

[0035] The motion controller performs micro-group hole processing according to the processing order of the group holes and the size of the vector graphics element.

[0036] Compared with the prior art, the present invention has the following beneficial effects:

[0037] The present invention simultaneously sets a first deflection unit and a second deflection unit, marks the micro-group hole vector elements according to their sizes, and enables the first deflection unit and the second deflection unit to respectively complete the vector elements of corresponding sizes. Thus, the processing advantages of the first deflection unit and the second deflection unit can be fully exerted to maximize the processing efficiency and achieve the processing of multi-size micro-group holes from micrometers to millimeters. Brief Description of the Drawings

[0038] Figure 1 It is a flowchart of the steps of the laser processing method for forming micro-group holes in the present invention;

[0039] Figure 2 It is a schematic structural diagram of the laser processing system for forming micro-group holes in the present invention. Detailed Description of the Embodiments

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0041] Embodiment 1:

[0042] As Figure 1 shown, in this embodiment, a laser processing method for forming micro-group holes is provided, which includes the following steps:

[0043] S1. Configure laser processing parameters according to the processing drawings of the micro-group holes:

[0044] In this embodiment, the shape of the micro-group holes can be a centrally symmetric figure, including but not limited to one or several of rectangles, regular polygons, triangles, circles, ellipses, etc.; the processing drawings can be imported into the corresponding data processing system in data forms such as DXF format, such as the display system of the upper computer. Further, the corresponding laser processing parameters are configured manually according to the imported processing drawings and the processing materials for forming the micro-group holes. The laser processing parameters include one or several of repetition frequency, laser power, scanning speed, scanning times, etc.;

[0045] S2. According to the sizes of the vector elements in the processing drawings, mark the vector elements as the first processing vectors corresponding to the first deflection unit or the second processing vectors corresponding to the second deflection unit, and store the center point coordinates of each vector element in the processing drawings into the queue Q;

[0046] Specifically, the step S2 includes the following steps:

[0047] S21. Set the size threshold T of the vector graphics that can be processed according to the deflection angle of the first deflection unit, where the size can be calculated by diameter and the unit is μm. For example, if the deflection angle of the first deflection unit is 3 mrad, the corresponding vector graphics size threshold is 200 μm, that is, the first deflection unit can process holes with a maximum diameter of 200 μm.

[0048] S22. Traverse the vector primitives in the processing drawing. When the size of the vector primitive is less than or equal to the vector graphics size threshold T, the vector primitive is marked as the first processing vector corresponding to the first deflection unit; when the size of the vector primitive is greater than the vector graphics size threshold T, the vector primitive is marked as the second processing vector corresponding to the second deflection unit.

[0049] And S23. Store the center point coordinates of each vector primitive into the queue Q, where the queue Q is a data storage method of a linear list structure, which can be predefined, and the center point coordinates of each vector primitive are stored in the queue Q in the default order (such as the previously determined number order or diameter size, etc.).

[0050] Further, in this step, the first deflection unit includes a modulation deflection unit, which has a small processing area (50 - 200 μm), but fast processing speed and high efficiency. It mainly uses electro-optic effect, acousto-optic effect or liquid crystal birefringence, etc. to change the refractive index of the transparent medium to achieve optical path deflection, including but not limited to one or several of electro-optic polarizer, acousto-optic polarizer, liquid crystal polarization grating, etc.

[0051] The second deflection unit includes a mechanical deflection unit, which has a large processing area (50 - 150 mm), but slow scanning speed and low processing efficiency. It mainly drives the optical element to rotate or vibrate by a precision motor to achieve optical path deflection, including but not limited to one or several of galvanometer, rotating reflecting prism, MEMS mirror, etc.

[0052] S3. Determine the processing order of the group holes according to the stored center point coordinates of the vector primitives.

[0053] Specifically, the step S3 includes:

[0054] S31. Obtain the distance between each center point in the queue Q and all other center points according to formula (1) and store it in the form of a two-dimensional array A:

[0055]

[0056] where F(m,n) is the distance between any two center points m and n in the queue Q, x m 、y mThey are the abscissa and ordinate of the center point m respectively; x n , y n They are the abscissa and ordinate of the center point n respectively;

[0057]

[0058] Wherein, N is the total number of the center points of the vector graphic elements in the queue Q;

[0059] S32. Take the first data in the queue Q (that is, the center point coordinates of the vector graphic element that first enters the queue) as the sorting reference point P c , and take it out from the queue Q, and then use the queue Q from which the first data has been taken out as the unsorted queue Q w ;

[0060] S33. Create a new queue Q f , and store the taken sorting reference point P c into the queue Q f ;

[0061] S34. Traverse the distances stored in the two-dimensional array A, and determine the center point P1 closest to the sorting reference point P c , and remove the center point P1 from the unsorted queue Q w , and store it at the end of the queue Q f ;

[0062] S35. Traverse the distances stored in the two-dimensional array A, and determine the center point P2 closest to the center point P1, and remove the center point P2 from the unsorted queue Q w , and store it at the end of the queue Q f ;

[0063] S36. Repeat step S35 until each center point in the unsorted queue Q w is stored in the queue Q f . Thus, the center points in the queue Q f are sorted according to the distance from the sorting reference point P c , and the queue order of the center points in the queue Q f is the micro-hole processing order;

[0064] And S4. Perform micro-group hole processing according to the processing order of the group holes and the dimensions of the vector graphic elements.

[0065] Specifically, the step S4 includes the following steps:

[0066] Traverse the queue Q according to the queue order of the center points in the queue Q f , fThe central point therein (for example, traversal can start from the first central point in the queue). If the vector graphic element corresponding to the current central point is the first processing vector, control the first deflection unit to act, and use the laser beam generated by the laser to complete the processing of the hole-shaped structure corresponding to the current vector graphic element;

[0067] If the vector graphic element corresponding to the current central point is the second processing vector, control the second deflection unit to act, and use the laser beam generated by the laser to complete the processing of the hole-shaped structure corresponding to the current vector graphic element;

[0068] For example, the queue Q after the central points are rearranged f In it, the vector graphic elements corresponding to the 1st - 2nd central points are both the first processing vectors, and the vector graphic element corresponding to the 3rd central point is the second processing vector. Then start traversing the queue Q from the 1st central point f , since the vector graphic element corresponding to the 1st central point is the first processing vector, at this time control the first deflection unit to move, so as to complete the processing of the hole-shaped structure corresponding to the current vector graphic element on the XY two-dimensional plane through the laser beam generated by the laser. When traversing to the 2nd central point, the operation is the same as that of the 1st central point. When traversing to the 3rd central point, control the second deflection unit to move, so as to complete the processing of the hole-shaped structure corresponding to the current vector graphic element on the XY two-dimensional plane through the laser beam generated by the laser.

[0069] Thus, in this embodiment, the first deflection unit and the second deflection unit are simultaneously adopted, and they are marked according to the size of the micro-group hole vector graphic elements, and the first deflection unit and the second deflection unit are respectively made to complete the vector graphic elements of corresponding sizes. Thus, the respective processing advantages of the first deflection unit and the second deflection unit can be fully exerted, making the best use of advantages and avoiding disadvantages, so as to maximize the processing efficiency and realize the processing of multi-size micro-group holes from microns to millimeters.

[0070] Embodiment 2:

[0071] This embodiment provides a laser processing system for implementing the laser processing method described in Embodiment 1, as Figure 2 shown, which includes:

[0072] The host computer 1; for example, in this embodiment, the host computer 1 includes an industrial control computer PC installed with the Windows operating system;

[0073] The motion controller 2, which is connected to the host computer 1 through communication connection methods such as Ethernet 3, etc.; in this embodiment, the motion controller 2 includes one or several control chips such as ARM and FPGA to implement the corresponding control functions;

[0074] The laser 4, which is connected to the motion controller 2 and is used to generate laser beams;

[0075] A first deflection unit 5 and a second deflection unit 6, both of which are connected to the motion controller 2;

[0076] A vector marking unit 7, which is used to mark vector primitives in the processing drawing as a first processing vector corresponding to the first deflection unit or a second processing vector corresponding to the second deflection unit according to the dimensions of the vector primitives in the processing drawing, and store the center point coordinates of each vector primitive in the processing drawing into the queue Q. The specific process is the same as that of step S2;

[0077] And a sorting unit 8, which is used to determine the processing order of the cluster holes according to the stored center point coordinates of the vector primitives. The specific process is the same as that of step S3;

[0078] Wherein, the host computer 1 is used to display the processing drawing of the imported micro cluster holes and configure the laser processing parameters; the vector marking unit 7 and the sorting unit 8 are both connected to the motion controller 2, and in this embodiment, both can be integrated into the host computer 1;

[0079] The motion controller 2 performs micro cluster hole processing according to the queue order of the center points in the queue Q f and the dimensions of the vector primitives corresponding to the center points. The specific process is the same as that of step S4.

[0080] Specifically, the motion controller 2 traverses the queue Q according to the queue order of the center points in the queue Q f (such as starting from the first center point in the queue Q f to traverse). If the vector primitive corresponding to the current center point is a first processing vector, the laser 4 is controlled to generate a laser beam, and at the same time, the first deflection unit 5 is controlled to act. The laser beam passes through the reflecting mirror and the beam expander system in sequence and then enters the first deflection unit 5. Under the deflection action of the first deflection unit 5, it enters the focusing field lens. After focusing, a hole-shaped structure corresponding to the current vector primitive is processed on the XY two-dimensional plane; f If the vector primitive corresponding to the current center point is a second processing vector, the laser 4 is controlled to generate a laser beam, and at the same time, the second deflection unit 6 is controlled to act. The laser beam passes through the reflecting mirror and the beam expander system in sequence and then enters the second deflection unit 6. Under the deflection action of the second deflection unit 6, it enters the focusing field lens. After focusing, a hole-shaped structure corresponding to the current vector primitive is processed on the XY two-dimensional plane;

[0081] If the vector primitive corresponding to the current center point is a second processing vector, the laser 4 is controlled to generate a laser beam, and at the same time, the second deflection unit 6 is controlled to act. The laser beam passes through the reflecting mirror and the beam expander system in sequence and then enters the second deflection unit 6. Under the deflection action of the second deflection unit 6, it enters the focusing field lens. After focusing, a hole-shaped structure corresponding to the current vector primitive is processed on the XY two-dimensional plane;

[0082] Thus, the laser processing of the micro cluster holes is completed.

[0083] In summary, in the present application, the first deflection unit and the second deflection unit are simultaneously provided, and they are marked according to the size of the micro-group hole vector primitive, and the first deflection unit and the second deflection unit are made to complete the vector primitives of corresponding sizes respectively. Thus, the processing advantages of the first deflection unit and the second deflection unit can be fully utilized to maximize the processing efficiency and achieve the processing of multi-size micro-group holes from microns to millimeters.

[0084] It should be noted that the technical features in the above-mentioned Embodiments 1 to 2 can be combined arbitrarily, and the combined technical solutions all fall within the protection scope of the present application. And in this text, such terms as "including", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0085] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laser processing method for forming micro-group holes, characterized in that, Including the following steps: According to the dimensions of the vector graphics elements in the processing drawing, mark the vector graphics elements as the first processing vectors corresponding to the first deflection unit or the second processing vectors corresponding to the second deflection unit, and store the center point coordinates of each vector graphics element in the processing drawing into the queue Q; Determine the processing order of the cluster holes according to the stored center point coordinates of the vector graphics elements; And perform micro-cluster hole processing according to the processing order of the cluster holes and the dimensions of the vector graphics elements; The first deflection unit includes a modulation deflection unit, and the second deflection unit includes a mechanical deflection unit; According to the dimensions of the vector graphics elements in the processing drawing, mark the vector graphics elements as the first processing vectors corresponding to the first deflection unit or the second processing vectors corresponding to the second deflection unit, and store the center point coordinates of each vector graphics element in the processing drawing into the queue Q, including the following steps: Set the threshold T of the vector graphic size that can be processed according to the deflection angle of the first deflection unit; Traverse the vector graphics elements in the processing drawing. When the size of the vector graphics element is less than or equal to the vector graphic size threshold T, the vector graphics element is marked as the first processing vector corresponding to the first deflection unit; when the size of the vector graphics element is greater than the vector graphic size threshold T, the vector graphics element is marked as the second processing vector corresponding to the second deflection unit; Store the center point coordinates of each vector graphics element into the queue Q.

2. The laser processing method according to claim 1, wherein The first deflection unit includes one or more of an electro-optic polarizer, an acousto-optic polarizer, and a liquid crystal polarization grating.

3. The laser processing method according to claim 1, wherein The second deflection unit includes one or more of a galvanometer, a rotating reflecting prism, and a MEMS mirror.

4. The laser processing method according to claim 1, characterized in that, Determine the processing order of the cluster holes according to the stored center point coordinates of the vector graphics elements, including the following steps: Obtain the distances between each center point in the queue Q and all other center points, and store them in the form of a two-dimensional array A; Use the first data in the queue Q as the sorting reference point P c , and remove it from the queue Q. Then, use the queue Q after removing the first data as the unsorted queue Q w ; Create a new queue Q f , and store the retrieved sorting reference point P c into the queue Q f ; Traverse the distances stored in the two-dimensional array A to determine the center point P1 that is closest to the sorting reference point P c Remove the center point P1 from the unsorted queue Q w and store it at the end of the queue Q f ; Traverse the distances stored in the two-dimensional array A to determine the central point P2 that is closest to the central point P1, and remove this central point P2 from the unsorted queue Q w and store it at the end of the queue Q f ; until each center point in the unsorted queue Q w is stored in the queue Q f The queue order of the center points in the queue Q f is the processing order of the grouped holes.

5. The laser processing method according to claim 4, wherein, Perform micro-cluster hole processing according to the processing order of the cluster holes and the dimensions of the vector graphics elements, including the following steps: According to queue Q f Traverse queue Q in the queue order of the center points in f the center points. If the vector graphic element corresponding to the current center point is the first processing vector, control the first deflection unit to act, and use the laser beam generated by the laser to complete the processing of the hole-like structure corresponding to the current vector graphic element; If the vector graphics element corresponding to the current center point is the second processing vector, control the second deflection unit to act, and use the laser beam generated by the laser to complete the processing of the hole-shaped structure corresponding to the current vector graphics element.

6. The laser processing method according to claim 5, characterized in that, Starting from the first center point of queue Q f traverse the center points in queue Q in the queue order of the center points f in Q.

7. A laser processing system for implementing the laser processing method according to any one of claims 1-6, characterized in that, Including: A motion controller; A laser, which is connected to the motion controller and is used to generate a laser beam; A first deflection unit and a second deflection unit, both of which are connected to the motion controller; A vector marking unit, which is used to mark the vector graphics elements as the first processing vectors corresponding to the first deflection unit or the second processing vectors corresponding to the second deflection unit according to the dimensions of the vector graphics elements in the processing drawing, and store the center point coordinates of each vector graphics element in the processing drawing into the queue Q; And a sorting unit, which is used to determine the processing order of the cluster holes according to the stored center point coordinates of the vector graphics elements; The motion controller performs micro-cluster hole processing according to the processing order of the cluster holes and the dimensions of the vector graphics elements.

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