Adhesive tape and its preparation method and application

Abstract

The present application relates to the field of bonding technology, and provides an adhesive tape and a preparation method and application thereof, wherein the adhesive tape comprises a flexible substrate having a woven structure and an adhesive layer bonded to at least one side surface of the flexible substrate. The adhesive tape provided by the present application is provided with an adhesive layer on the surface of the flexible substrate. Since the flexible substrate is provided with a woven structure, the woven structure can be displaced during the peeling process, thereby improving the energy dissipation of the peeling process, thereby enhancing the adhesion between the adhesive tape and the substrate.

Description

Technical Field

[0001] The present application belongs to the field of bonding technology, and in particular relates to an adhesive tape and a preparation method and application thereof. Background Art

[0002] The bonding energy of existing tapes is generally low, about 15J / m 2 It is difficult to meet the demand for high bonding strength. Summary of the invention

[0003] The purpose of the present application is to provide an adhesive tape and a preparation method and application thereof, aiming to solve the problem of low bonding energy of existing adhesive tapes.

[0004] In order to achieve the above application purpose, the technical solution adopted in this application is as follows:

[0005] In a first aspect, the present application provides an adhesive tape comprising a flexible substrate having a woven structure and an adhesive layer bonded to at least one side surface of the flexible substrate.

[0006] Optionally, the flexible substrate includes a plurality of warp knitted tapes extending along a first direction and a plurality of weft knitted tapes extending along a second direction, the first direction and the second direction intersect, and the warp knitted tapes and the weft knitted tapes are intertwined and entangled.

[0007] Optionally, the warp knitted tape and the weft knitted tape are interlaced and woven once to form a weaving unit, and in the weaving unit, a ratio of a length H1 of the warp knitted tape extending along the first direction to a length H2 of the weft knitted tape extending along the second direction is 2-6.

[0008] Optionally, H1 is 5 mm to 40 mm, and H2 is 2 mm to 7 mm.

[0009] Optionally, the flexible substrate includes at least one of non-woven fabric and dust-free fabric; and the adhesive layer is a polypropylene adhesive layer.

[0010] In a second aspect, the present application provides a method for preparing the above-mentioned tape, comprising: providing a flexible substrate having a woven structure; providing a precursor liquid; loading the precursor liquid onto the flexible substrate; and subjecting the substrate to light treatment so that the precursor liquid solidifies on at least one side surface of the flexible substrate to form an adhesive layer.

[0011] Optionally, the precursor solution contains acrylic acid monomer, and the concentration of the acrylic acid monomer is 3 mol / L to 6 mol / L.

[0012] Optionally, the precursor solution further comprises a photoinitiator, which includes at least one of α-ketoglutaric acid, 2-hydroxy-2-methyl-1-phenylpropanone and 1-hydroxycyclohexyl phenyl ketone, and the concentration of the photoinitiator is 0.001 mol / L to 0.003 mol / L.

[0013] Optionally, the precursor solution further comprises a cross-linking agent, the cross-linking agent comprises methylene bisacrylamide, and the concentration of the cross-linking agent is 0.0005 mol / L to 0.001 mol / L.

[0014] Optionally, the precursor solution further comprises acrylamide monomer, and the concentration of the acrylamide monomer is 1 mol / L to 2 mol / L.

[0015] Optionally, the light treatment includes: irradiating the flexible substrate loaded with the precursor liquid under ultraviolet light for a first time period, wherein the first time period is 2 hours to 8 hours.

[0016] In a third aspect, the present application provides an application, which is the application of the tape provided in the first aspect of the present application or the tape prepared by the preparation method provided in the second aspect of the present application in tissue engineering, drug delivery, wound dressing, medical implants, functional devices, flexible electronics, soft robots or intelligent structures.

[0017] The adhesive tape provided in the first aspect of the present application is provided with an adhesive layer on the surface of a flexible substrate having a woven structure, and the woven structure can be displaced during the peeling process, thereby improving the energy dissipation of the peeling process, thereby enhancing the adhesion between the adhesive tape and the substrate.

[0018] The second aspect of the present application provides a method for preparing the tape by photocuring to form an adhesive layer on a flexible substrate having a woven structure, and relies on the woven structure to achieve displacement during the peeling process, thereby further improving the dissipation of fracture energy during the peeling process, thereby enhancing the adhesion between the tape and the substrate.

[0019] The application provided in the third aspect of the present application adopts the tape provided in the first aspect of the present application or the tape prepared by the preparation method provided in the first aspect of the present application. Since the tape has good adhesion, it has good application prospects in tissue engineering, drug delivery, wound dressings, medical implants, functional devices, flexible electronics, soft robots and intelligent structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 is a schematic cross-sectional structural diagram of the adhesive tape provided in an embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of the weaving structure of a flexible substrate provided in one embodiment of the present application;

[0023] Figure 3 is a schematic diagram of a weaving structure of a flexible substrate provided in another embodiment of the present application;

[0024] Figure 4 is a schematic diagram of a weaving structure of a flexible substrate provided in another embodiment of the present application;

[0025] Figure 5 This is the usage state of the adhesive tape provided in the embodiment of the present application Figure 1 , the figure shows the state when the tape is peeled off from the substrate at one viewing angle;

[0026] Figure 6 This is the usage state of the adhesive tape provided in the embodiment of the present application Figure 2 , the figure shows the state when the tape is peeled off from the substrate at another viewing angle;

[0027] Figure 7 1 is a flow chart of the preparation of the adhesive tape provided in the embodiment of the present application, wherein FIG. (a) shows a schematic diagram of the structure of the flexible substrate, and FIG. (b) shows a schematic diagram of the structure of the prepared adhesive tape;

[0028] Figure 8 It is a schematic diagram of the peeling peak force test results of a total of 4 types of adhesive tapes in Examples 1 to 3 of the present application and the comparative example;

[0029] Fig. 9 It is a schematic diagram of the bonding performance test results of four types of tapes in Examples 1 to 3 of the present application and a comparative example.

[0030] Among them, the reference numerals in the figure are:

[0031] 10. Adhesive tape; 101. Weaving unit; 1. Flexible substrate; 11. Warp knitted tape; 12. Weft knitted tape; 2. Adhesive layer; 100. Base. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0033] In this application, the term "and / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0034] In this application, "at least one" means one or more, and "plurality" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, c can be single or multiple, respectively.

[0035] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution, some or all of the steps can be executed in parallel or sequentially, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0036] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0037] The weight of the relevant components mentioned in the embodiment description of the present application can not only refer to the specific content of each component, but also represent the proportional relationship between the weights of the components. Therefore, as long as the content of the relevant components is proportionally enlarged or reduced according to the embodiment description of the present application, it is within the scope disclosed in the embodiment description of the present application. Specifically, the mass described in the embodiment description of the present application can be a mass unit known in the chemical industry such as μg, mg, g, kg, etc.

[0038] The terms "first" and "second" are used only for descriptive purposes to distinguish objects such as substances from each other, and should not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. For example, without departing from the scope of the embodiments of the present application, the first XX may also be referred to as the second XX, and similarly, the second XX may also be referred to as the first XX. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0039] In order to solve the problem of low bonding ability of existing adhesive tapes, the embodiments of the present application provide an adhesive tape and a preparation method and application thereof.

[0040] See also Figure 1 In a first aspect, an embodiment of the present application provides an adhesive tape 10 , comprising a flexible substrate 1 with a woven structure and an adhesive layer 2 bonded to at least one side surface of the flexible substrate 1 .

[0041] Specifically, the adhesive tape 10 includes a flexible substrate 1 and an adhesive layer 2, wherein the flexible substrate 1 is used as a bearing structure to bear and support the adhesive layer 2, and the adhesive layer 2 is used as an adhesive layer to adhere to the flexible substrate 1. The flexible substrate 1 can be made of cloth or paper. Optionally, the flexible substrate 1 is made of at least one of non-woven fabric, dust-free cloth and dust-free paper.

[0042] The flexible substrate 1 has a woven structure. The woven structure refers to a structure with a stable structural relationship formed by crossing and entanglement of braids. In different weaving processes, the braids are intertwined in different ways to form a spatial mesh structure formed by braids interwoven in multiple directions. The braids can be interwoven regularly or irregularly. The woven structure can be a woven fabric or a knitted fabric.

[0043] The adhesive layer 2 refers to an adhesive layer with adhesiveness, which can realize the bonding connection between objects. Optionally, the adhesive layer 2 is an adhesive layer prepared from at least one of carboxymethyl chitosan, 2-hydroxyethyl methacrylic acid and acrylic acid.

[0044] Typically, the flexible substrate 1 has two opposite surfaces along its thickness direction, such as a first surface (not shown) and a second surface (not shown). The adhesive layer 2 may be provided on the first surface, the second surface, or both.

[0045] By setting an adhesive layer 2 on the surface of the flexible substrate 1, since the flexible substrate 1 has a woven structure, the woven structure can be used to achieve displacement during the peeling process, thereby improving the energy dissipation of the peeling process, thereby enhancing the adhesion between the tape 10 and the substrate (such as a stainless steel plate, glass, etc.).

[0046] In some embodiments, the flexible substrate 1 includes at least one of a non-woven fabric and a dust-free fabric, and the adhesive layer 2 is a polypropylene adhesive layer.

[0047] Both the non-woven fabric and the dust-free fabric contain polyester fibers, which are synthetic fibers obtained by spinning polyesters obtained by polycondensation of organic dibasic acids and diols. Polyesters include polyethylene terephthalate (PET). The polyacrylic adhesive layer 2 mainly refers to a high molecular polymer layer formed by polymerization of monomers including acrylic acid.

[0048] When preparing the polyacrylic acid adhesive layer 2, acrylic acid and PET react on the surface of the flexible substrate 1 to improve the bonding strength between the flexible substrate 1 and the polyacrylic acid adhesive layer 2 at the bonding interface. At the same time, the flexible substrate 1 is also set to a woven structure, which makes it convenient for acrylic acid to infiltrate the flexible substrate 1 and react with it when the polyacrylic acid adhesive layer 2 is formed, thereby enhancing the bonding force between the polyacrylic acid adhesive layer 2 and the flexible substrate 1.

[0049] In some embodiments, see Figures 2 to 4 The flexible substrate 1 includes a plurality of warp knitted tapes 11 extending along a first direction and a plurality of weft knitted tapes 12 extending along a second direction. The first direction and the second direction intersect, and the warp knitted tapes 11 and the weft knitted tapes 12 are intertwined and entangled.

[0050] Specifically, the flexible substrate 1 includes a plurality of warp knitted tapes 11 (white tapes in the figure) and a plurality of weft knitted tapes 12 (grey tapes in the figure), and the warp knitted tapes 11 and the weft knitted tapes 12 are intertwined to form a woven structure. It can be understood that the warp knitted tapes 11 and the weft knitted tapes 12 are both flexible tapes. At least one of the warp knitted tapes 11 and the weft knitted tapes 12 contains PET, that is, at least one of them is made of PET. The multiple here refers to at least two. Among them, the multiple warp knitted tapes 11 extend along the first direction, see Figures 2 to 4 , the first direction is the X-axis direction. Optionally, the plurality of warp knitted tapes 11 extend in parallel along the first direction, that is, the warp knitted tapes 11 are arranged parallel to each other. The plurality of weft knitted tapes 12 extend in the second direction, wherein the second direction intersects the first direction, that is, the second direction is not parallel to the first direction. Optionally, the second direction is perpendicular to the first direction, see Figures 2 to 4 , the first direction is the X-axis direction, and the second direction is the Y-axis direction. Optionally, the plurality of weft-knitted tapes 12 extend in parallel along the second direction, that is, the weft-knitted tapes 12 are arranged parallel to each other. Optionally, the warp-knitted tape 11 is at least one of a non-woven fabric and a dust-free fabric. Optionally, the weft-knitted tape 12 is at least one of a non-woven fabric and a dust-free fabric.

[0051] By setting the flexible substrate 1 to include a plurality of warp knitted tapes 11 and a plurality of weft knitted tapes 12 that are intertwined and entangled, and the warp knitted tapes 11 and the weft knitted tapes 12 extend in two intersecting directions respectively, so that the obtained woven structure is formed into a plain weave, the warp knitted tapes 11 and the weft knitted tapes 12 each have their own extension direction and extension law, thereby enhancing the adhesion of the tape 10 when peeled off in a specific direction.

[0052] See also Figure 5 and Figure 6 Due to the uneven thickness of the surface topological structure of the woven structure, there will be larger wire drawing in the thicker area of ​​the woven structure, that is, larger energy dissipation and peeling peak force, while smaller wire drawing will be produced in the thinner area of ​​the woven structure, that is, smaller energy dissipation and peeling peak force; at the same time, due to the periodicity of the woven structure, the thicker area of ​​the woven structure will transition from larger energy dissipation to smaller energy dissipation in one cycle, while the thinner area of ​​the woven structure will transition from smaller energy dissipation to larger energy dissipation. This transition process of long and short wire drawing will produce larger energy dissipation and peeling peak force. When the adhesive tape 10 is bonded to the substrate 100 and the adhesive tape 10 is peeled off from the substrate 100 along the F direction, the peak peeling force occurs at the junction of the two weft knitted tapes 12 of the woven structure, and the bonding energy disappears and is generated alternately through the in-plane elastic dissipator, thereby introducing a high energy barrier, forming a large energy dissipation and peeling peak force provided by the alternating long wire drawing of the warp knitted tape 11, which significantly improves the bonding force and bonding energy between the adhesive tape 10 and the substrate 100. This technical solution is suitable for dynamic and static loading modes, and can demonstrate good strong bonding behavior in a variety of application environments.

[0053] In some embodiments, see Figures 2 to 6 The warp knitted tape 11 and the weft knitted tape 12 are overlapped and woven once to form a weaving unit 101. In the weaving unit 101, the ratio of the length H1 of the warp knitted tape 11 extending along the first direction to the length H2 of the weft knitted tape 12 extending along the second direction is 2-6.

[0054] Specifically, the structure formed by overlapping and weaving the warp-knitted tape 11 and the weft-knitted tape 12 once is defined as a weaving unit 101. It can be understood that the flexible substrate 1 includes a plurality of warp-knitted tapes 11 and a plurality of weft-knitted tapes 12 interlaced and entangled together, and a plurality of weaving units 101 will be formed on the flexible substrate 1. It can be foreseen that in some weaving units 101, the warp-knitted tape 11 is superimposed on the weft-knitted tape 12, and in other weaving units 101, the weft-knitted tape 12 is superimposed on the warp-knitted tape 11. In a single weaving unit 101, the length of the warp-knitted tape 11 extending along the first direction is defined as H1, that is, H1 is the length of the warp-knitted tape 11 extending along the X direction in the figure. In a single weaving unit 101, the length of the weft-knitted tape 12 extending along the second direction is defined as H2, that is, H2 is the length of the weft-knitted tape 12 extending along the Y direction in the figure. The ratio of H1 to H2 ranges from 2 to 6. Optionally, the ratio of H1 to H2 is 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5 or 6.

[0055] Compared with a substrate without a woven structure, the woven structure provided in the flexible substrate 1 can improve the structural dislocation during the bonding and peeling process, and significantly improve the energy dissipation during the bonding and peeling process. At the same time, by setting the ratio of H1 to H2 in the woven unit 101 to within a range of 2 to 6, when the adhesive tape 10 is bonded to the substrate 100, a long and short drawing effect will be presented during the peeling process, and an alternation will be formed between the two weft-knitted tapes 12. At the same time, the static bonding force and bonding energy of the adhesive tape 10 can be increased by a multiple of about 12, which is a significant effect.

[0056] In some embodiments, H1 is 5 mm to 40 mm, and H2 is 2 mm to 7 mm.

[0057] Optionally, H1 is 5mm, 10mm, 15mm, 20mm, 25mm, 30mm, 35mm or 40mm. Optionally, H2 is 2mm, 3mm, 4mm, 5mm, 6mm or 7mm.

[0058] In this range, the bonding energy of the adhesive tape 10 can reach 150 J / m 2 ~210J / m 2 , much higher than the 15J / m in the existing technology 2 .

[0059] See also Figure 7 The second aspect of the embodiment of the present application also provides a method for preparing the above-mentioned adhesive tape 10, comprising:

[0060] S1: providing a flexible substrate having a woven structure;

[0061] S2: providing precursor solution;

[0062] S3: loading the precursor solution onto the flexible substrate;

[0063] S4: performing light treatment to solidify the precursor liquid on at least one side of the flexible substrate to form an adhesive layer.

[0064] The preparation method of the tape provided in the embodiment of the present application forms an adhesive layer on a flexible substrate with a woven structure by photocuring, and relies on the woven structure to achieve displacement during the peeling process, thereby further improving the dissipation of fracture energy during the peeling process, thereby enhancing the adhesion between the tape and the substrate.

[0065] In some embodiments, the flexible substrate in the above step S1 includes at least one of a non-woven fabric and a dust-free fabric. Both the non-woven fabric and the dust-free fabric contain polyester fibers. The polyester fibers include polyethylene terephthalate (PET).

[0066] In some embodiments, the precursor solution in step S2 includes at least one of carboxymethyl chitosan, 2-hydroxyethyl methacrylic acid and acrylic acid.

[0067] In some embodiments, the flexible substrate includes at least one of a non-woven fabric and a dust-free fabric, and the precursor liquid is an acrylic acid solution. Before providing the acrylic acid solution, the acrylic acid solution is also prepared. It can be understood that the acrylic acid solution refers to a solution containing acrylic acid monomers. Acrylic acid is a colorless liquid organic compound that is miscible with water, ethanol, ether, etc. The preparation of the acrylic acid solution specifically includes: measuring acrylic acid, and mixing the acrylic acid with deionized water evenly. Optionally, in the acrylic acid solution, the concentration of the acrylic acid monomer is 3mol / L to 6mol / L, for example, the concentration of the acrylic acid monomer can be 3mol / L, 4mol / L, 5mol / L or 6mol / L.

[0068] The molecular formula of acrylic acid is CH2CHCOOH, which contains a carbon-carbon double bond and a carboxyl group. When polyethylene terephthalate (PET) is included in the flexible substrate, PET is a polymer compound formed by the polycondensation of an organic dibasic acid and a diol. After the acrylic acid solution is loaded onto the flexible substrate, the acrylic acid solution will contact the PET. During the light treatment and photopolymerization reaction, the acrylic acid solution will also react with the flexible substrate, so a bonding interface with strong bonding force will be generated between the cured polyacrylic acid adhesive layer and the flexible substrate, improving the adhesive performance of the tape and increasing the fracture energy dissipation during the peeling process. At the same time, the woven structure is used to achieve dislocation during the peeling process, further increasing the fracture energy dissipation during the peeling process, thereby enhancing the adhesion between the tape and the substrate.

[0069] In some embodiments, in the above step S2, the precursor solution further comprises a photoinitiator.

[0070] Specifically, the photoinitiator refers to a compound that can absorb energy of a certain wavelength in the ultraviolet region (250-420nm) or the visible region (400-800nm), generate free radicals, cations, etc., thereby initiating monomer polymerization and cross-linking curing. Optionally, the photoinitiator includes at least one of α-ketoglutaric acid, 2-hydroxy-2-methyl-1-phenylacetone and 1-hydroxycyclohexyl phenyl ketone. Optionally, in the precursor solution, the concentration of the photoinitiator is 0.001mol / L-0.003mol / L, for example, the concentration of the photoinitiator is 0.001mol / L, 0.0015mol / L, 0.002mol / L, 0.0025mol / L or 0.003mol / L.

[0071] By adding a photoinitiator to the precursor liquid, when it is treated with light, the photoinitiator absorbs energy and is converted into free radicals, causing the organic monomers in the precursor liquid to undergo cross-linking polymerization, thereby solidifying to form an adhesive layer. For example, when the precursor liquid is an acrylic acid solution, the acrylic acid monomers in the acrylic acid solution undergo cross-linking polymerization and solidify to form a polyacrylic acid hydrogel.

[0072] In some embodiments, in the above step S2, the precursor solution further comprises a cross-linking agent.

[0073] Specifically, the role of the crosslinking agent is to generate chemical bonds between linear molecules, so that the linear molecules are connected to each other to form a network structure. The crosslinking agent can also generate diradicals after exposure and promote the polymerization reaction. Optionally, it includes methylenebisacrylamide. Optionally, in the precursor solution, the concentration of the crosslinking agent is 0.0005mol / L to 0.001mol / L, for example, the concentration of the crosslinking agent is 0.0005mol / L, 0.0006mol / L, 0.0007mol / L, 0.0008mol / L, 0.0009mol / L or 0.001mol / L.

[0074] By adding a cross-linking agent to a precursor solution, such as an acrylic acid solution, the cross-linking polymerization of the monomers in the precursor solution is promoted, thereby improving the bonding strength and surface adhesion of the prepared adhesive layer.

[0075] In some embodiments, in the above step S2, the precursor solution, such as acrylic acid solution, further comprises acrylamide monomer.

[0076] Acrylamide is a white crystalline powder with the chemical formula C3H5NO, soluble in water, ethanol, ether, acetone, etc. Acrylamide contains carbon-carbon double bonds and amide groups, and has the chemical properties of double bonds: it is easy to polymerize under ultraviolet light or at the melting point.

[0077] Optionally, the preparation of the acrylic acid solution includes: firstly mixing olefin amide and acrylic acid, then adding a photoinitiator and a cross-linking agent, vortex mixing, then adding deionized water to mix, and slowly pouring it into a volumetric flask after dissolution.

[0078] Optionally, the concentration of acrylamide monomer in the acrylic acid solution is 1 mol / L to 2 mol / L, for example, the concentration of acrylamide monomer in the acrylic acid solution is 1 mol / L, 1.2 mol / L, 1.4 mol / L, 1.6 mol / L, 1.8 mol / L or 2 mol / L.

[0079] In some embodiments, in the above step S1, a silicone oil film layer is provided on the surface of the flexible substrate. The silicone oil film layer can improve the adhesive property of the surface of the flexible substrate.

[0080] In some embodiments, in the above step S3, loading the acrylic acid solution onto the flexible substrate includes providing a mold, placing the flexible substrate in the mold, and then injecting the precursor solution into the mold.

[0081] Specifically, the mold comprises an acrylic plate and a glass plate arranged in parallel, a silicone gasket is arranged between the acrylic plate and the glass plate, and the flexible substrate is also placed between the acrylic plate and the glass plate.

[0082] In some embodiments, in the above step S4, the light treatment includes: irradiating the flexible substrate loaded with the precursor liquid under ultraviolet light for a first time period.

[0083] Specifically, UV light (Ultraviolet Rays) is used to irradiate the mold after the precursor solution is injected. Optionally, at least one of short-wave ultraviolet rays, medium-wave ultraviolet rays and long-wave ultraviolet rays is used for irradiation, wherein the wavelength of short-wave ultraviolet rays (UV-C) is 200nm to 280nm, the wavelength of medium-wave ultraviolet rays (UV-B) is 280nm to 315nm, and the wavelength of long-wave ultraviolet rays (UV-A) is 315nm to 400nm. Optionally, 365nm ultraviolet light is used for irradiation.

[0084] Optionally, the first duration is 2 hours to 8 hours. For example, the first duration may be 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours or 8 hours.

[0085] The third aspect of the embodiments of the present application also provides an application, which is the application of the tape provided in the first aspect of the embodiments of the present application or the tape prepared by the preparation method provided in the second aspect of the embodiments of the present application in tissue engineering, drug delivery, wound dressing, medical implants, functional devices, flexible electronics, soft robots or intelligent structures.

[0086] The application provided in the present application adopts the tape provided in the first aspect of the embodiment of the present application or the tape prepared by the preparation method provided in the second aspect of the embodiment of the present application. Since the tape has good adhesion, it has good application prospects in tissue engineering, drug delivery, wound dressings, medical implants, functional devices, flexible electronics, soft robots and intelligent structures.

[0087] The following describes the invention in conjunction with specific embodiments.

[0088] Example 1

[0089] S10, preparing the woven structure: using non-woven fabric as the raw material of the woven structure, the thickness of the single layer of non-woven fabric is 0.3mm. Figure 4 The base material is designed according to the weaving structure scheme shown in , and in a single weaving unit, the length H1 of the warp knitted tape is 10 mm, and the length H2 of the weft knitted tape is 5 mm.

[0090] S20, prepare the precursor solution of polyacrylic acid: add acrylic acid, methylenebisacrylamide and α-ketoglutaric acid to a beaker and mix evenly, add a certain amount of deionized water to mix, and slowly pour it into a volumetric flask after dissolving. After that, wash the beaker with deionized water several times to completely transfer the residual solute to the volumetric flask, and finally add deionized water to the volumetric flask until the lowest concave liquid surface of the liquid in the volumetric flask is tangent to the scale line. The concentration of acrylic acid in the obtained precursor solution is 3mol / L, the concentration of methylenebisacrylamide is 0.001mol / L, and the concentration of α-ketoglutaric acid is 0.002mol / L.

[0091] S30, using a needle to add the precursor liquid into the parallel plate mold, and the braided structure is arranged in the mold. The parallel plate mold is composed of one side of acrylic and one side of polyethylene terephthalate film and a glass plate, and a silicone gasket is arranged in the middle for controlling the thickness.

[0092] S40, light treatment: Curing under 365nm ultraviolet (UV) light for about 3 hours to form glue.

[0093] The prepared tape sample was named woven 20_30, the length of the tape was 120 mm, the total length of the structure was 100 mm, the width was 20 mm, and the thickness was 1 mm.

[0094] Example 2

[0095] The difference between Example 2 and Example 1 lies in the different weaving structures. Figure 3 The base material is designed according to the weaving structure scheme shown in , and in a single weaving unit, the length H1 of the warp knitted tape is 20 mm, and the length H2 of the weft knitted tape is 5 mm.

[0096] The prepared tape sample was named as braided 20_20.

[0097] Example 3

[0098] The difference between Example 3 and Example 1 lies in the different weaving structures. Figure 2 The base material is designed according to the weaving structure scheme shown in , and in a single weaving unit, the length H1 of the warp knitted tape is 30 mm, and the length H2 of the weft knitted tape is 5 mm.

[0099] The prepared tape sample was named as braided 20_30.

[0100] Comparative Example 1

[0101] The difference between the comparative example and the examples 1, 2 and 3 is that the substrate is designed as a non-woven structure.

[0102] The prepared tape sample was named as non-woven.

[0103] In order to verify the progress of the embodiments of the present application, the samples of embodiments 1 to 3 and the comparative example were tested as follows:

[0104] The sample was bonded to a 304 stainless steel plate substrate to prepare the test sample, and the static bonding peak force and bonding energy of the tape were tested by the peel test method. Specifically, the static loading peeling method was used for testing. The test environment was a normal temperature and humidity environment. The tape and the substrate were fixed on the fixture of the universal material testing machine for static holding loading. For specific test results, please refer to Tables 1 and 2. Figure 8 and Fig. 9 .

[0105] Table 1 90 degree adhesion peeling peak force test results of different tape samples

[0106]

[0107]

[0108] Table 2 90 degree bonding energy test results of different tape samples

[0109] <![CDATA[Adhesion and peeling energy (J / m 2 )]]> Bonding and peeling can increase multiples Weaving-20_10 178.447288 11.49283817 Weave-20_20 181.6507451 11.69915576 Weaving-20_30 193.9917874 12.49397648 No weaving 15.52682509 1

[0110] According to the data in Table 1 and Table 2, Figure 8 and Fig. 9 It can be seen that the peak bonding and peeling force of the adhesive tape provided in the comparative example is 0.4636N, and the bonding and peeling energy is generally low, which is 15.5J / m 2. The peak bonding and peeling force of the adhesive tapes provided in Examples 1 to 3 of the present application is increased to about 12 times that of the comparative example, and the static bonding force is also increased to about 12 times that of the comparative example. The reason is that the addition of the woven structure improves the structural dislocation during the bonding and peeling process, significantly improves the energy dissipation during the bonding and peeling process, and presents a long and short drawing effect during the peeling process, and forms an alternation between the two weft-knitted tapes.

[0111] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An adhesive tape, characterized in that: It includes a flexible substrate having a woven structure and an adhesive layer bonded to at least one side surface of the flexible substrate; The flexible substrate comprises a plurality of warp knitted tapes extending in a first direction and a plurality of weft knitted tapes extending in a second direction, the first direction and the second direction intersect, and the first direction is perpendicular to the second direction, the warp knitted tapes and the weft knitted tapes are intertwined and entangled, so that the woven structure forms a plain weave; The warp knitted tape and the weft knitted tape are intertwined once to form a weaving unit, and the ratio of the length H1 of the warp knitted tape extending along the first direction to the length H2 of the weft knitted tape extending along the second direction in the weaving unit is 2 to 6; The H1 is 5 mm to 40 mm, and the H2 is 2 mm to 7 mm; The adhesive energy of the tape is 150 J / m 2 ~210J / m 2 ; The adhesive layer is formed by curing a precursor liquid through light treatment, wherein the precursor liquid contains an acrylic monomer, and the concentration of the acrylic monomer is 3 mol / L to 6 mol / L; the precursor liquid also contains a photoinitiator, and the photoinitiator includes at least one of α-ketoglutaric acid, 2-hydroxy-2-methyl-1-phenylpropanone and 1-hydroxycyclohexyl phenyl ketone, and the concentration of the photoinitiator is 0.001 mol / L to 0.003 mol / L; the precursor liquid also contains a crosslinking agent, and the crosslinking agent includes methylenebisacrylamide, and the concentration of the crosslinking agent is 0.0005 mol / L to 0.001 mol / L.

2. The adhesive tape according to claim 1, characterized in that The flexible substrate includes at least one of non-woven fabric and dust-free fabric.

3. The method for preparing the adhesive tape according to claim 1 or 2, characterized in that: include: Providing a flexible substrate having a woven structure; Providing precursor fluid; loading the precursor liquid onto the flexible substrate; The precursor liquid is cured on at least one side of the surface of the flexible substrate to form an adhesive layer by light treatment.

4. The method for preparing the adhesive tape according to claim 3, characterized in that: The precursor solution contains acrylic acid monomers, and the concentration of the acrylic acid monomers is 3 mol / L to 6 mol / L.

5. The method for preparing the adhesive tape according to claim 4, characterized in that: The precursor solution also contains a photoinitiator, which includes at least one of α-ketoglutaric acid, 2-hydroxy-2-methyl-1-phenylpropanone and 1-hydroxycyclohexyl phenyl ketone, and the concentration of the photoinitiator is 0.001 mol / L to 0.003 mol / L; the precursor solution also contains a crosslinking agent, which includes methylene bisacrylamide, and the concentration of the crosslinking agent is 0.0005 mol / L to 0.001 mol / L; and / or, the precursor solution also contains acrylamide monomer, and the concentration of the acrylamide monomer is 1 mol / L to 2 mol / L.

6. The method for preparing the adhesive tape according to any one of claims 3 to 5, characterized in that: The light treatment comprises: irradiating the flexible substrate loaded with the precursor liquid under ultraviolet light for a first time period, wherein the first time period is 2 hours to 8 hours.

7. An application, characterized in that: The adhesive tape according to claim 1 or 2 or the adhesive tape prepared by the preparation method according to any one of claims 3 to 6 is used in tissue engineering, drug delivery, wound dressing, medical implants, functional devices, flexible electronics, soft robots or intelligent structures.

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