Optoelectronic module packaging system and method

Abstract

This invention relates to a photoelectric module packaging system and method. The photoelectric module packaging system includes: a conveying device, comprising a conveying unit having a first station and a second station, wherein the conveying unit conveys and sequentially passes through a fixing fixture at the first station and the second station, the fixing fixture being used to fix and install the photoelectric module to be packaged; an adhesive application and cover fastening device, which applies double-sided adhesive and fastens a protective cover to the photoelectric module within the fixing fixture when the fixing fixture is at the first station; and a first dispensing device, which performs dispensing operations on the photoelectric module within the fixing fixture when the fixing fixture is at the second station. The photoelectric module packaging system can at least improve the production efficiency and product quality of block photoelectric modules, and the protective cover can be safely fastened to the photoelectric module without the risk of being deformed by pressure.

Description

Technical Field

[0001] The embodiments of this invention relate to the field of active optical cable manufacturing and assembly. More specifically, this invention relates to an optoelectronic module packaging system and an optoelectronic module packaging method. Background Technology

[0002] As a core component of Active Optical Cables (AOCs), the optoelectronic module is primarily used for photoelectric signal conversion. The optoelectronic module includes a circuit board, a photoelectric signal converter mounted on the circuit board, an optical component connected to the photoelectric signal converter, and an optical fiber connector that interfaces with the optical component. The optical fiber connector is used to connect optical fibers. The optical component includes a reflective surface and corresponding lenses. The optical component interfaces with the optical fiber connector to form an optical coupling structure. This optical coupling structure is used to transmit optical signals between the optical fiber and the corresponding photoelectric signal converter; that is, the reflective surface transmits the optical signal from the optical fiber to the photoelectric signal converter, or vice versa.

[0003] During the manufacturing process of the aforementioned optoelectronic module, double-sided tape is manually applied to the optical coupling structure, and a protective cover is then attached. Copper foil is then adhered to the protective cover and wrapped around the optical coupling structure. Finally, adhesive is applied around the copper foil, and the copper foil is used to adhere the structure to the circuit board, completing the sealing of the optical coupling structure and ensuring its integrity.

[0004] However, the aforementioned manufacturing process relies on manual labor for applying double-sided tape, attaching protective caps, and applying adhesive, which results in low efficiency and poor quality. Furthermore, the protective caps are easily deformed during attachment. The large amount of adhesive used during the sealing process also increases manufacturing costs. Summary of the Invention

[0005] To address one or more of the technical problems mentioned above, this invention provides a photoelectric module packaging system and a photoelectric module packaging method, which can at least improve the production efficiency and product quality of photoelectric modules, and the protective cover can be safely attached to the photoelectric module without the risk of being deformed by pressure.

[0006] According to a first aspect of the present invention, a photoelectric module packaging system is provided, comprising: a conveying device including a conveying unit having a first station and a second station, wherein a fixing fixture is conveyed by the conveying unit and sequentially passes through the first station and the second station, the fixing fixture being used to fix and install the photoelectric module to be packaged; an adhesive application and cover fastening device, which applies double-sided adhesive and fastens a protective cover to the photoelectric module located within the fixing fixture when the fixing fixture is at the first station; and a first dispensing device, which performs a dispensing operation on the photoelectric module located within the fixing fixture when the fixing fixture is at the second station.

[0007] According to a second aspect of the present invention, a method for packaging an optoelectronic module is provided. The optoelectronic module includes an optical coupling structure, the optical coupling structure including an optical component and an optical fiber connector that are mated to each other. The method comprises the following steps: applying double-sided adhesive to the optical coupling structure; attaching a protective cover to the optical coupling structure such that the double-sided adhesive bonds the optical coupling structure to the protective cover; and sealing the side wall gaps of the optical coupling structure with adhesive, the side wall gaps being the gaps formed at the mating points of the side walls of the optical component and the optical fiber connector.

[0008] The optoelectronic module packaging system and method provided above can replace manual operations such as applying double-sided tape, attaching protective covers, and applying adhesive. This can improve the production efficiency and product quality of optoelectronic modules, and the protective covers can be safely attached to the optoelectronic modules without the risk of being deformed.

[0009] Furthermore, the optoelectronic module packaging system and method only use adhesive, which, after curing, can work with a protective cover to seal and protect the optical coupling structure. Compared with the existing technology that uses copper foil and adhesive around the copper foil to create a seal, this sealing method is more economical in terms of materials, as it eliminates the need for copper foil and reduces the amount of adhesive used. Attached Figure Description

[0010] The above and other objects, features, and advantages of exemplary embodiments of the present invention will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the invention are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0011] Figure 1 An optoelectronic module packaging system according to an embodiment of the present invention is shown;

[0012] Figure 2 for Figure 1 A three-dimensional view of the fixture for the optoelectronic module packaging system shown.

[0013] Figure 3 for Figure 1 The diagram shows the usage status of the fixing fixture in the optoelectronic module packaging system.

[0014] Figure 4 It shows Figure 1 The blocking device shown is part of the optoelectronic module packaging system.

[0015] Figure 5 It shows Figure 1 The adhesive-fitting cover device of the optoelectronic module packaging system shown.

[0016] Figure 6 It shows Figure 1 The double-sided adhesive feeding device for the optoelectronic module packaging system shown.

[0017] Figure 7 It shows Figure 1 The protective cover feeding device of the optoelectronic module packaging system shown.

[0018] Figure 8 It shows Figure 1 The first dispensing device in the optoelectronic module packaging system shown;

[0019] Figure 9 It shows Figure 1 The first curing device of the optoelectronic module packaging system shown;

[0020] Figure 10 It shows Figure 1 The second dispensing device in the optoelectronic module packaging system shown;

[0021] Figure 11 It shows Figure 1 The second curing device of the optoelectronic module packaging system shown.

[0022] Explanation of reference numerals in the attached drawings: 1. Conveying equipment; 11. Conveying device; 111. First conveyor belt; 112. Second conveyor belt; 12. Fixing jig; 121. First positioning structure; 2. Adhesive-applying and cap-fastening equipment; 21. Adhesive-applying and cap-fastening device; 211. Robotic arm; 212. Adhesive-applying assembly; 213. Cap-fastening assembly; 214. Imaging device; 215. Adapter; 22. Double-sided adhesive feeding device; 221. Receiving platform; 23. Protective cap feeding device; 231. Automatic feeding vibratory feeder; 232. Receiving and feeding mechanism; 233. Second sensor; 3. 31. First dispensing device; 32. First dispensing apparatus; 4. First curing device; 41. First curing lamp; 5. Second dispensing device; 51. Second driving device; 52. Second dispensing apparatus; 53. Vision device; 6. Second curing device; 61. Second curing lamp; 7. Barrier device; 71. Lifting mechanism; 72. Positioning tray; 73. Blocking mechanism; 731. Blocking cylinder; 732. Blocking plane; 74. Second positioning structure; 75. First sensor; 100. Optoelectronic module packaging system; 200. Optoelectronic module. Detailed Implementation

[0023] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0024] Figure 1 An optoelectronic module packaging system 100 according to an embodiment of the present invention is shown. For example... Figure 1 As shown, the optoelectronic module packaging system 100 includes at least a conveying device 1, an adhesive application and capping device 2, and a first dispensing device 3.

[0025] The conveying equipment 1 includes a conveying device 11 and a fixing fixture 12 disposed on the conveying device 11, wherein the fixing fixture 12 is used to fix and install the optoelectronic module 200 to be packaged, as detailed below. Figure 2 The conveying device 11 includes a first station and a second station arranged sequentially along a predetermined conveying direction, so that the conveying device 11 can convey the fixing fixture 12 and the photoelectric module 200, and force them to pass through the first station and the second station in sequence.

[0026] The adhesive application and cover fastening device 2 is located near the first work station and can apply double-sided adhesive and fasten the protective cover to the photoelectric module 200 inside the fixed fixture 12 when the fixed fixture 12 reaches the first work station.

[0027] The first dispensing device 3 is located near the second work station and can perform dispensing operations on the photoelectric module 200 inside the fixed fixture 12 when the fixed fixture 12 reaches the second work station.

[0028] Based on this, the optoelectronic module packaging system 100 can replace manual operations such as double-sided tape application, protective cover fastening, and dispensing by conveying equipment 1, adhesive application and cover fastening equipment 2, and first dispensing equipment 3. As a result, the optoelectronic module packaging system 100 can improve the production efficiency and product quality of the optoelectronic module, and ensure that the protective cover can be safely fastened onto the optoelectronic module 200 without the risk of being deformed by pressure.

[0029] like Figure 1 and Figure 3 As shown, the optoelectronic module packaging system 100 also includes blocking devices 7, one after another, located at the first and second workstations. The blocking devices 7 have a blocking state and a released state. In the blocking state, the blocking devices 7 suspend the passing fixing jigs 12 to prevent the conveying device 11 from continuing to convey the fixing jigs 12, thereby ensuring that the adhesive application and cover fastening equipment 2 can more reliably perform the application of double-sided adhesive and the fastening of the protective cover. In the released state, the blocking devices 7 can release the fixing jigs 12 to allow the conveying device 11 to continue conveying the fixing jigs 12.

[0030] Next, combine Figure 2 and Figure 3 The conveying device 11 and the fixing fixture 12 are described in detail. The conveying device 11 includes a first conveyor belt 111 and a second conveyor belt 112 arranged side by side. The fixing fixture 12 is respectively mounted on the first conveyor belt 111 and the second conveyor belt 112 on both sides. When the first conveyor belt 111 and the second conveyor belt 112 rotate synchronously, they can jointly transport the fixing fixture 12 along a predetermined conveying direction and sequentially pass through the first station and the second station, etc.

[0031] Schematic, the fixing fixture 12 includes a fixture body that is approximately rectangular and has receiving slots, and a flip cover disposed on the fixture body to clamp or lock the photoelectric module 200 within the receiving slots. As an example, the fixing fixture 12 includes multiple receiving slots and multiple flip covers. The receiving slots are symmetrically distributed around the centroid of the fixture body, and the multiple flip covers are disposed on the fixture body and correspond one-to-one with the receiving slots. Thus, each receiving slot and its adjacent flip cover can jointly lock one photoelectric module 200.

[0032] Next, combine Figure 3 and Figure 4The blocking device 7 is described in detail. The blocking device 7 includes a lifting mechanism 71 located below the conveying device 11, a positioning plate 72 located on the lifting mechanism 71, and a blocking mechanism 73 located within the conveying device 11. The blocking mechanism 73 can be located on a fixed portion of the lifting mechanism 71 and has blocking and releasing actions. When the blocking action is performed, the blocking mechanism 73 blocks the passing fixed fixture 12, allowing the positioning plate 72 to lift the fixed fixture 12 under the drive of the lifting mechanism 71, forcing the fixed fixture 12 to detach from the conveying device 11 and no longer be conveyed by it. At this time, the blocking device 7 is in a blocking state. When the releasing action is performed, the blocking mechanism 73 releases its obstruction of the fixed fixture 12, allowing the positioning plate 72 to lower the fixed fixture 12 under the drive of the lifting mechanism 71, thereby ensuring that the fixed fixture 12 can fall back into the conveying device 11 for re-conveyorment. At this time, the blocking device 7 is in a released state.

[0033] As an example, the blocking mechanism 73 includes a blocking cylinder 731, and the piston rod of the blocking cylinder 731 is provided with a blocking surface 732 for surface contact with the fixing fixture 12. When the piston rod of the blocking cylinder 731 extends, the piston rod can smoothly and safely block the passing fixing fixture 12 through the blocking surface 732, and when the piston rod of the blocking cylinder 731 retracts, the piston rod can release the fixing fixture 12 that was blocked. In addition to the blocking cylinder 731, the blocking mechanism 73 can also be selected as other structures capable of achieving blocking, such as an electric cylinder or a baffle that is lifted and lowered by electromagnetism and gravity.

[0034] As an example, the lifting mechanism 71 includes a cylinder, and a positioning plate 72 is mounted on the piston rod of the cylinder. When the piston rod of the cylinder extends, the positioning plate 72 rises, and when the piston rod of the cylinder retracts, the positioning plate 72 falls. In addition to a cylinder, the lifting mechanism 71 may also include an electric cylinder or a hydraulic cylinder.

[0035] To improve the stability of the fixed fixture 12 when it stays at various workstations, the fixed fixture 12 may include a first positioning structure 121 (or may participate in...). Figure 2 The blocking device 7 includes a second positioning structure 74 disposed on the positioning tray 72. After the blocking mechanism 73 blocks the passing fixing fixture 12, the positioning tray 72 can trigger the first positioning structure 121 and the second positioning structure 74 to cooperate and simultaneously lift the fixing fixture 12 under the drive of the lifting mechanism 71. The cooperation of the first positioning structure 121 and the second positioning structure 74 can determine the position of the fixing fixture 12 on the positioning tray 72, which is beneficial to improve the application quality of double-sided tape, the fastening quality of protective covers, or the quality of glue application at the corresponding workstation.

[0036] For example, one of the first positioning structure 121 and the second positioning structure 74 is a positioning pin, and the other is a positioning hole. The mating parts of the positioning hole and the positioning pin can not only determine the orientation of the fixing fixture 12 on the positioning support plate 72, but also have the advantages of low cost and safety and reliability. In addition, in order to improve the success rate of the positioning pin insertion into the positioning hole and the reliability of the two mating, the end of the positioning pin used for insertion into the positioning hole can be constructed as a tapered end.

[0037] To enhance automation and intelligence, the blocking device 7 also includes a first sensor 75 mounted on the positioning tray 72 or the frame of the conveying device 1. The first sensor 75 generates a control signal to activate the blocking mechanism 73 and the lifting mechanism 71 in response to the fixed fixture 12 reaching above the positioning tray 72. The first sensor 75 can be a photoelectric sensor or a distance sensor, etc. For example, when the first sensor 75 is selected as a photoelectric sensor, the fixed fixture 12 reaching above the positioning tray 72 can be sensed by the photoelectric sensor and generate a change in electrical signal. This change in electrical signal can be used to sequentially activate the blocking mechanism 73 and the lifting mechanism 71; that is, the blocking mechanism 73 is activated first to perform the blocking action, and then the lifting mechanism 71 is activated to complete the raising action of the positioning tray 72.

[0038] Next, combine Figure 5 , Figure 6 and Figure 7 The adhesive-applying and cap-attaching equipment 2 is described in detail. The adhesive-applying and cap-attaching equipment 2 includes an adhesive-applying and cap-attaching device 21, a double-sided adhesive feeding device 22, and a protective cap feeding device 23. The double-sided adhesive feeding device 22 stores double-sided adhesive so that the cap-attaching device 21 can retrieve it. The protective cap feeding device 23 stores protective caps so that the adhesive-applying and cap-attaching device 21 can retrieve them. The adhesive-applying and cap-attaching device 21 can move between the double-sided adhesive feeding device 22, the protective cap feeding device 23, and the first station of the conveying device 11, applying or attaching the retrieved double-sided adhesive and protective caps to the photoelectric module 200.

[0039] As an example, the adhesive-applying and cap-attaching device 21 includes a robotic arm 211, an adhesive-applying assembly 212, and a cap-attaching assembly 213. The adhesive-applying assembly 212 includes a nozzle for picking up and placing double-sided adhesive, and the cap-attaching assembly 213 includes a nozzle for picking up and placing a protective cap. The adhesive-applying assembly 212 and the cap-attaching assembly 213 are spaced apart on the free end of the robotic arm 211. If the design indirection between the adhesive-applying assembly 212 and the cap-attaching assembly 213 is large, they are also connected to the movable end of the robotic arm 211 via an adapter 215. Driven by the robotic arm 211, the adhesive-applying assembly 212 can retrieve double-sided adhesive from the double-sided adhesive feeding device 22 and adhere it to the optical coupling structure of the optoelectronic module 200. The cover assembly 213 is used to remove the protective cover from the protective cover feeding device 23 under the drive of the robotic arm 211 and fasten it onto the optical coupling structure of the photoelectric module 200, so as to ensure that the protective cover can be attached to the photoelectric module 200 by means of double-sided adhesive, and to achieve a seal between the protective cover and the photoelectric module 200 by means of double-sided adhesive.

[0040] It's easy to understand that double-sided tape mainly consists of an adhesive substrate and a release film. To facilitate the removal of the release film from the adhesive substrate by the robotic arm 21 and the adhesive application assembly 212, the adhesive force between the double-sided tape and the photoelectric module 200 should be greater than the adhesive force between the release film and the adhesive substrate. Simultaneously, to effectively utilize the double-sided tape and avoid waste or adverse effects, the area of ​​the double-sided tape should be less than or equal to the area of ​​the protective cover.

[0041] As an example, such as Figure 5 As shown, the adhesive application and cover fastening device 21 includes an imaging device 214. The imaging device 214 is mounted on the robotic arm 211 and is used to acquire image information containing the photoelectric module 200 at the first station. This allows the robotic arm 211 to determine the application position of the double-sided adhesive on the photoelectric module 200 and the fastening position of the protective cover on the photoelectric module 200 based on the image information. Through the imaging device 214, the robotic arm 211 can more precisely control the adhesive application component 212 and the cover fastening component 213 to achieve the application of the double-sided adhesive and the fastening of the protective cover. This effectively avoids misaligned application of the double-sided adhesive or crooked fastening of the protective cover, and helps reduce manual intervention and improve the degree of automation.

[0042] As an example, such as Figure 6 As shown, the double-sided tape feeding device 22 includes a receiving platform 221 for receiving double-sided tape. The double-sided tape on the receiving platform 221 may come from an automated feeding device 223 (e.g., the peeling device described in Chinese invention patent application No. 202310424838.2) or be provided manually, for example, by manually cutting double-sided tape of a specified size from a double-sided tape roll and placing it on the receiving platform 221.

[0043] As an example, such as Figure 7As shown, the protective cover feeding device 23 includes an automatic feeding vibratory feeder 231 and a material feeding mechanism 232 connected to the automatic feeding vibratory feeder 231. The automatic feeding vibratory feeder 231 can adjust the orientation (including direction and position) of the protective cover by its own vibration and transport the protective cover that meets the predetermined orientation requirements to the receiving feeding mechanism 232. The receiving feeding mechanism 232 includes at least one loading surface for temporarily receiving the protective cover transported by the automatic feeding vibratory feeder 231, so as to facilitate the adhesive cap fastening device 21 to remove the protective cover from the receiving feeding mechanism 232.

[0044] To improve automation, the protective cover feeding device 23 also includes a second sensor 233 mounted on the receiving and feeding mechanism 232. The second sensor 233 can be configured to switch the start / stop state of the automatic feeding vibratory feeder 231 in response to the presence or absence of the photoelectric module 200 on the fixed fixture 12, so as to intermittently deliver the protective cover to the receiving and feeding mechanism 232. The second sensor 233 can be a fiber optic sensor, a photoelectric sensor, or a distance sensor, etc. For example, when the second sensor 233 is selected as a photoelectric sensor, the protective cover arriving at the receiving and feeding mechanism 232 can be sensed by the photoelectric sensor and generate a change in electrical signal. This change in electrical signal can be used to start the automatic feeding vibratory feeder 231, causing the automatic feeding vibratory feeder 231 to deliver the protective cover to the receiving and feeding mechanism 232 and then automatically shut down. The second sensor 233 can also be configured to switch the start / stop state of the automatic feeding vibratory feeder 231 in response to the presence or absence or orientation of the protective cover on the receiving and feeding mechanism 232.

[0045] Next, combine Figure 1 and Figure 8 A detailed description of the first dispensing device 3 is provided. The first dispensing device 3 includes a first driving device 31 and a first dispensing device 32 mounted on the first driving device 31. The first driving device 31 may be a driving device including a multi-axis motion platform or a robotic arm. The first dispensing device 32 is preferably an electric glue gun. During operation, the first driving device 31 drives the first dispensing device 32 to move back and forth to the second station and to an initial position that does not interfere with the operation of other devices. The first dispensing device 32 is used to dispense the first adhesive liquid onto a first selected portion of the optoelectronic module 200 at the second station. The first selected portion is the side wall gap of the optical coupling structure of the optoelectronic module 200. The optical coupling structure includes optical components and optical fiber connecting parts that are mated to each other. The side wall gap is the gap formed at the mating point of the side walls of the optical components and the side walls of the optical fiber connecting parts. After the first adhesive liquid cures, it can work with the protective cap to seal and protect the optical coupling structure. This sealing method is more economical than the existing technology that uses copper foil and adhesive around the copper foil to form a seal, as it eliminates the need for copper foil and reduces the amount of adhesive liquid used.

[0046] like Figure 1 and Figure 9As shown, to improve the curing efficiency of the first adhesive, the conveying device 11 further includes a third station, and the optoelectronic module packaging system 100 may also include a first curing device 4 located adjacent to the third station. The third station is located at the position where the fixed fixture 12 passes the second station and then the third station, that is, along the predetermined conveying direction, the third station is downstream of the second station. The first curing device 4 can perform a curing operation on the optoelectronic module 200 inside the fixed fixture 12 when the fixed fixture 12 reaches the third station, specifically curing the first adhesive. A blocking device 7 may or may not be installed at the third station, depending on the curing time of the first adhesive under the irradiation of the first curing device 4.

[0047] Preferably, the first curing device 4 includes a first curing lamp 41 disposed above the conveying device 11. The first curing lamp 41 is used to irradiate the first adhesive and cause the first adhesive to cure on a first selected portion of the fixing fixture 12. In fact, the specific structure and form of the first curing device 4 should be selected according to the characteristics of the first adhesive. For example, when the first adhesive is selected as a UV adhesive, the first curing device 4 can be selected as an ultraviolet lamp that can promote the curing of the UV adhesive.

[0048] In this embodiment, as Figure 1 and Figure 10 As shown, the conveying device 1 also includes a fourth station and a fifth station. The fourth and fifth stations are located after the fixed fixture 12 passes the third station, and then sequentially passes the fourth and fifth stations. That is, along the predetermined conveying direction, the fourth station is downstream of the third station, and the fifth station is downstream of the fourth station. The optoelectronic module packaging system 100 also includes a second dispensing device 5 and a second curing device 6. The second dispensing device 5 is located near the fourth station and can perform dispensing operations on the optoelectronic module 200 within the fixed fixture 12 when the fixed fixture 12 reaches the fourth station. To ensure that the second dispensing device 5 has sufficient time to perform the dispensing operation, the aforementioned blocking device 7 can also be provided at the fourth station. The second curing device 6 is located near the fifth station and is used to cure the optoelectronic module 200 at the fifth station. The blocking device 7 can be selectively installed at the fifth station as needed.

[0049] As an example, the second dispensing device 5 includes a second driving device 51 and a second dispensing device 52 mounted on the second driving device 51. The second driving device 51 may be a driving device including a multi-axis motion platform or a robotic arm 211. The second dispensing device 52 is preferably an electric glue gun. During operation, the second driving device 51 drives the second dispensing device 52 to reciprocate to the fourth station and to an initial position that does not interfere with the operation of other devices. The second dispensing device 52 is used to dispense the second adhesive onto a second selected portion of the optoelectronic module 200 at the fourth station. The second selected portion is the fiber optic connection slot of the fiber optic connection component of the optical coupling structure of the optoelectronic module 200, thereby ensuring that the second adhesive can fix the optical fiber connected to the fiber optic connection component in the fiber optic connection slot.

[0050] The second dispensing device 5 includes a vision device 53. The vision device 53 is preferably an industrial camera, mounted on the second driving device 51, and used to acquire image information including the photoelectric module 200 at the fourth station. This allows the second driving device 51 to determine the location of the fiber optic connector slot of the fiber optic connector component based on the image information. With the assistance of the vision device 53, the second driving device 51 can more precisely control the second dispensing device 52 to drip the second adhesive into the fiber optic connector slot, which facilitates the curing of the adhesive and ensures that the fiber optic cable is firmly fixed within the fiber optic connector slot.

[0051] As an example, such as Figure 11 As shown, the second curing device 6 includes a second curing lamp 61 disposed above the conveying device 11. The second curing lamp 61 is used to irradiate the second adhesive and cure the second adhesive on a second selected portion of the photoelectric module 200. In fact, the specific structure and form of the second curing device 6 should be selected according to the characteristics of the second adhesive. For example, when the second adhesive is selected as a UV adhesive, the second curing device 6 can be selected as an ultraviolet lamp that can promote the curing of the UV adhesive.

[0052] This invention also provides a method for packaging an optoelectronic module, comprising: attaching double-sided adhesive to the optical coupling structure of the optoelectronic module 200; attaching a protective cover to the optical coupling structure, such that the double-sided adhesive bonds the optical coupling structure to the protective cover; and sealing the side wall gaps of the optical coupling structure with adhesive, wherein the side wall gaps are the gaps formed at the joints of the side walls of the optical components and the optical fiber connectors. After curing, the adhesive in the side wall gaps of the optical coupling structure can work with the protective cover and double-sided adhesive to seal and protect the optical coupling structure. This sealing method is more material-efficient than the existing sealing method which uses copper foil and adhesive around the copper foil, as it eliminates the need for copper foil and reduces the amount of adhesive used.

[0053] Furthermore, the optoelectronic module packaging method can be implemented by the aforementioned optoelectronic module packaging system 100, which can replace manual operations such as double-sided tape application, protective cover snapping, and dispensing. This can improve the production efficiency and product quality of the optoelectronic module, and ensure that the protective cover can be safely snapped onto the optoelectronic module 200 without the risk of being deformed.

[0054] In this embodiment, the optoelectronic module packaging method further includes acquiring image information of the optoelectronic module 200, determining the mounting position of the double-sided adhesive on the optoelectronic module 200, and the fastening position of the protective cover on the optoelectronic module 200 based on the image information. The step of attaching the double-sided adhesive to the optocoupler structure specifically includes: attaching the double-sided adhesive to the mounting position on the optocoupler structure. The step of fastening the protective cover to the optocoupler structure specifically includes: fastening the protective cover to the fastening position on the optocoupler structure. In this way, the attachment of the double-sided adhesive and the fastening of the protective cover can be implemented more accurately, effectively avoiding misalignment of the double-sided adhesive or misalignment of the protective cover, reducing manual intervention, and improving the degree of automation.

[0055] In this embodiment, the optoelectronic module packaging method further includes the following steps: acquiring image information of the optoelectronic module 200, and obtaining the location of the fiber optic connection slot of the fiber optic connector based on the image information; applying adhesive to the fiber optic connection slot of the fiber optic connector to fix the optical fiber connected to the fiber optic connector within the fiber optic connection slot. This method ensures that the adhesive can be more accurately dripped into the fiber optic connection slot, which is beneficial for the cured adhesive to firmly fix the optical fiber within the fiber optic connection slot.

[0056] In the foregoing description of this application, unless otherwise expressly specified and limited, the terms "fixed," "installed," "connected," or "linked" should be interpreted broadly. For example, the term "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; or it can refer to the internal communication of two components or the interaction between two components. Therefore, unless otherwise expressly limited in this application, those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0057] Based on the above description of this application, those skilled in the art will also understand that the terms used, such as "upper" and "lower," which indicate orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings of this application. They are only for the purpose of facilitating the explanation of the present invention and simplifying the description, and do not imply that the device or element involved must have the specific orientation, or be constructed and operated in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms cannot be understood or interpreted as a limitation on the present invention.

[0058] Furthermore, the terms "first" or "second," etc., used in this application to refer to numbers or ordinal numbers are for descriptive purposes only and should not be construed as explicitly or implicitly indicating relative importance or specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, or more, unless otherwise explicitly specified.

[0059] While numerous embodiments of the invention have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many modifications, alterations, and alternatives will occur to those skilled in the art without departing from the spirit and essence of the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in the practice of the invention. The appended claims are intended to define the scope of protection of the invention and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. A photoelectric module packaging system, characterized in that, include: A conveying device includes a conveying unit having a first station and a second station, wherein the conveying unit conveys and sequentially passes through a fixing fixture at the first station and the second station, and the fixing fixture is used to fix and install the optoelectronic module to be packaged. An adhesive-applying and cover-attaching device is provided, which applies double-sided adhesive and attaches a protective cover to the photoelectric module located within the fixed fixture when the fixture is at the first station. The adhesive-applying and cover-attaching device includes an adhesive-applying and cover-attaching assembly, which includes a robotic arm, an adhesive-applying component, and a cover-attaching component. The adhesive-applying component and the cover-attaching component are spaced apart on the free end of the robotic arm. Driven by the robotic arm, the adhesive-applying component applies double-sided adhesive to the photoelectric coupling structure of the photoelectric module. Driven by the robotic arm, the cover-attaching component attaches a protective cover to the photoelectric coupling structure of the photoelectric module, thereby ensuring that the protective cover is adhered to the photoelectric module by the double-sided adhesive and that the double-sided adhesive achieves a seal between the protective cover and the photoelectric module. The first dispensing device performs dispensing operations on the photoelectric module located in the fixed fixture when the fixed fixture is in the second working position; as well as The optoelectronic module includes an optical coupling structure, which includes an optical component and an optical fiber connector that are mated together. The first dispensing device is configured to seal the side wall gaps of the optoelectronic module with adhesive. The side wall gaps are the gaps formed at the mating points of the side walls of the optical component and the optical fiber connector. The adhesive, together with the protective cover, seals and protects the optical coupling structure. After curing, the adhesive and the protective cover together form a seal for the optical coupling structure.

2. The optoelectronic module packaging system according to claim 1, characterized in that: The optoelectronic module packaging system includes blocking devices installed at the first and second workstations, each blocking device having a blocking state and a released state. When in the blocked state, the blocking device suspends the passing fixed fixture to prevent the conveying device from continuing to convey the fixed fixture; When in the released state, the blocking device releases the fixing fixture to allow the conveying device to continue conveying the fixing fixture.

3. The optoelectronic module packaging system according to claim 2, characterized in that, The blocking device includes: A lifting mechanism is provided below the conveying device; A positioning tray, wherein the positioning tray is mounted on the lifting mechanism and moves up and down under the drive of the lifting mechanism; and A blocking mechanism is provided in the lifting mechanism and has a blocking action and a releasing action; The blocking mechanism is used for: After the blocking action is performed, the fixed fixture that is blocking the path is blocked, causing the positioning plate to lift the fixed fixture under the drive of the lifting mechanism; and After the release action is performed, the obstruction to the fixing fixture is removed, and the positioning plate is lowered by the lifting mechanism to lower the fixing fixture.

4. The optoelectronic module packaging system according to claim 3, characterized in that, The blocking mechanism includes a blocking cylinder, and the piston rod of the blocking cylinder is provided with a blocking plane for surface contact with the fixing fixture.

5. The optoelectronic module packaging system according to claim 3 or 4, characterized in that, The fixing fixture includes a first positioning structure, and the blocking device includes a second positioning structure disposed on the positioning plate. The second positioning structure is used to cooperate with the first positioning structure and determine the orientation of the fixing fixture on the positioning plate.

6. The optoelectronic module packaging system according to claim 5, characterized in that, One of the first positioning structure and the second positioning structure is a positioning pin, and the other is a positioning hole.

7. The optoelectronic module packaging system according to claim 3, characterized in that, The blocking device includes a first sensor disposed on the positioning plate, the first sensor being used to generate a control signal for activating the blocking mechanism and the lifting mechanism in response to the action of the fixing fixture reaching above the positioning plate.

8. The optoelectronic module packaging system according to claim 1, characterized in that: The adhesive-applying and capping equipment includes a double-sided adhesive feeding device and a protective cap feeding device; The adhesive-applying and capping device is used to move between the double-sided adhesive feeding device, the protective cap feeding device, and the first station of the conveying device.

9. The optoelectronic module packaging system according to claim 8, characterized in that: The adhesion between the double-sided adhesive and the optoelectronic module is greater than the adhesion between the release film of the double-sided adhesive and the adhesive substrate of the double-sided adhesive. The area of ​​the double-sided adhesive is less than or equal to the area of ​​the protective cover.

10. The optoelectronic module packaging system according to claim 9, characterized in that, The adhesive application assembly and the cap fastening assembly include a suction nozzle.

11. The optoelectronic module packaging system according to any one of claims 8-10, characterized in that: The adhesive-fit cover device includes a camera; The imaging device is mounted on the robotic arm and is used to acquire image information containing the photoelectric module at the first workstation, so that the robotic arm determines the mounting position of the double-sided adhesive on the photoelectric module and the fastening position of the protective cover on the photoelectric module based on the image information.

12. The optoelectronic module packaging system according to claim 8, characterized in that: The protective cover feeding device includes an automatic feeding vibratory feeder and a feeding mechanism connected to the automatic feeding vibratory feeder. The receiving and feeding mechanism is used to temporarily receive the protective cover conveyed by the automatic feeding vibratory plate so that the adhesive-attached cover device can remove the protective cover from the receiving and feeding mechanism.

13. The optoelectronic module packaging system according to claim 12, characterized in that: The protective cover feeding device includes a second sensor disposed on the feeding mechanism; The second sensor is configured to switch the start / stop state of the automatic feeding vibratory feeder in response to the presence or absence of the photoelectric module on the material receiving and feeding mechanism, so as to intermittently send the photoelectric module to the material receiving and feeding mechanism.

14. The optoelectronic module packaging system according to claim 8, characterized in that, The double-sided adhesive feeding device includes a receiving platform for receiving the double-sided adhesive.

15. The optoelectronic module packaging system according to claim 2, characterized in that, The first dispensing device includes a first driving device and a first dispensing device disposed on the first driving device. The first driving device is used to drive the first dispensing device to dispense the first adhesive liquid onto a first selected portion of the photoelectric module at the second station. The first selected portion is the side wall gap of the optical coupling structure of the photoelectric module.

16. The optoelectronic module packaging system according to claim 15, characterized in that, include: The conveying device includes a third station, which is located at the position where the fixed fixture passes through the second station and then passes through the third station; The optoelectronic module packaging system includes a first curing device, which performs a curing operation on the optoelectronic module located in the fixing fixture when the fixing fixture is in the third station.

17. The optoelectronic module packaging system according to claim 16, characterized in that, The first curing device includes a first curing lamp disposed above the conveying device, the first curing lamp being used to irradiate the first adhesive and cause the first adhesive to cure on a first selected portion of the fixing fixture.

18. The optoelectronic module packaging system according to claim 16, characterized in that: The conveying equipment includes a fourth station and a fifth station, which are located at the positions where the fixed fixture passes through the third station and then sequentially passes through the fourth and fifth stations, and the blocking device is provided at the fourth station. The optoelectronic module packaging system includes a second dispensing device and a second curing device; The second dispensing device performs dispensing operations on the photoelectric module located within the fixed fixture when the fixed fixture is forced to pause at the fourth station; The second curing device performs a curing operation on the photoelectric module located at the fifth station.

19. The optoelectronic module packaging system according to claim 18, characterized in that, The second dispensing device includes a second driving device and a second dispensing device disposed on the second driving device. The second driving device is used to drive the second dispensing device to dispense the second adhesive liquid onto a second selected portion of the optoelectronic module at the fourth station. The second selected portion is the optical fiber connection groove of the optical fiber connection component of the optical coupling structure of the optoelectronic module.

20. The optoelectronic module packaging system according to claim 19, characterized in that, The second curing device includes a second curing lamp disposed above the conveying device, the second curing lamp being used to irradiate the second adhesive and cause the second adhesive to cure on a second selected portion of the photoelectric module.

21. The optoelectronic module packaging system according to claim 15 or 19, characterized in that, The first and second drive devices include multi-axis motion platforms.

22. The optoelectronic module packaging system according to claim 1, characterized in that, The conveying device includes a first conveyor belt and a second conveyor belt arranged side by side, and the two sides of the fixing fixture are respectively arranged on the first conveyor belt and the second conveyor belt.

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