Micro-nano processing technology for micro-spacing LED transfer printing

Abstract

The application relates to the technical field of micro-nano processing, and particularly provides a micro-nano processing technology for micro-small-spacing LED transfer printing. The micro-nano processing technology for micro-small-spacing LED transfer printing applies a micro transfer printing device, the micro transfer printing device comprises a primary moving body, a vertical shaft moving base and a positioning stamping mechanism. The primary moving body and the vertical shaft moving base are used for primary positioning and transmission, then the positioning stamping mechanism is used for secondary and tertiary positioning and grabbing, the micro-small-spacing LED transfer printing process is effectively and accurately positioned, transferred and installed and placed, displacement of an LED substrate caused by external vibration or vibration of parts between devices in a subsequent process is prevented, and the accurate butt joint of an LED receiving main base and a Micro-LED element is ensured, the bonding quality is improved, the donor groove is cleaned, and the combination is flat, so that the quality and reliability of the LED are improved.

Description

Technical Field

[0001] This invention relates to the field of micro-nano fabrication technology, and in particular to a micro-nano fabrication process for micro-pitch LED transfer printing. Background Technology

[0002] Micro-pitch LED transfer printing is a process that uses external pressure or laser radiation to achieve high-precision patterning of a large area on a host substrate.

[0003] However, in the process of removing the Micro-LED element from the source substrate and placing the Micro-LED element into the flexible substrate, it is currently impossible to accurately position, transfer, and install the Micro-LED element to ensure that there will be no large displacement during the transfer process, which would adversely affect the registration and bonding of the Micro-LED with the driver backplane. Summary of the Invention

[0004] Therefore, it is necessary to provide a micro-nano fabrication process for micro-pitch LED transfer printing to solve at least one of the technical problems in the background art.

[0005] A micro / nano fabrication process for transfer printing of fine-pitch LEDs includes the following steps:

[0006] Step S1: Place the LED substrate into the micro-transfer printing apparatus and move the LED substrate to a predetermined position within the micro-transfer printing apparatus;

[0007] Step S2: The micro-transfer printing device will peel off and adsorb the Micro-LED functional devices in the LED substrate;

[0008] Step S3: Remove the LED substrate, place it into the LED acceptor substrate, and move the LED acceptor substrate to a predetermined position in the micro-transfer printing apparatus;

[0009] Step S4: Place and adhere the Micro-LED functional device into the LED acceptor substrate, and then remove the LED acceptor substrate to complete the transfer printing process;

[0010] The micro-transfer printing device includes a primary moving body, a vertical axis moving base, and a positioning and stamping mechanism. The primary moving body is fixedly installed in the mounting base, the vertical axis moving base is slidably installed on the top of the primary moving body, and the positioning and stamping mechanism is fixedly installed on the bottom of the vertical axis moving base.

[0011] As a further improvement of the present invention, the initial moving body includes two mounting frames, two transverse guide rails, and two transmission guide rails. The two mounting frames are arranged opposite each other in the mounting ground. The two ends of the two transverse guide rails are respectively fixedly installed at the two ends of the top surface of the two mounting frames, so that the length direction of the transverse guide rails is perpendicular to the length direction of the mounting frames. A first straight strip is provided in the inner wall of each transverse guide rail. The two ends of each transmission guide rail are respectively fixedly installed at the two ends of the middle of the inner side wall of the mounting frame, so that the two transmission guide rails are arranged opposite each other, and the length direction of each transmission guide rail is perpendicular to the length direction of the transverse guide rails.

[0012] As a further improvement of the present invention, the vertical axis moving base includes a mounting track, a first drive motor, a transmission rod, a mounting platform, and a mounting vertical rail. A second ruler strip is provided in the middle of the outer sidewall of the mounting track. The two ends of the mounting track are slidably mounted on the top of two transverse guide rails, and the length direction of the mounting track is perpendicular to the length direction of the transverse guide rails. A mounting plate protrudes from one end of the inner sidewall of the mounting track. The first drive motor is fixedly mounted in the sidewall of the mounting plate. A rotating mounting platform protrudes from one end of the bottom surface of the mounting plate. The transmission rod is rotatably mounted in the rotating mounting platform. A first spur gear is provided at both ends of the transmission rod, and the two first spur gears are respectively meshed with the first ruler strip in the inner sidewall of the two transverse guide rails. A second spur gear is also provided on the end of the transmission rod adjacent to the mounting plate. A transmission belt is sleeved on the second spur gear and the output shaft of the first drive motor to achieve transmission connection. The mounting platform is slidably mounted in the outer sidewall of the mounting track, and a second drive motor is also provided at the end of the mounting platform away from the mounting plate. The output shaft of the second drive motor is meshed with the second ruler strip. The mounting vertical rail is slidably mounted on the outside of the mounting platform.

[0013] As a further improvement of the present invention, a third ruler strip is provided at one end of the mounting rail near the mounting plate, and a third drive motor is also provided at one end of the mounting platform near the mounting plate, with the output shaft of the third drive motor meshing with the third ruler strip.

[0014] As a further improvement of the present invention, the positioning stamping mechanism includes a positioning frame, a first driving cylinder, a transmission element, a micro-control element, and two stamping elements. The top surface of the positioning frame is fixedly installed on the bottom surface of the mounting vertical rail. The first driving cylinder, the transmission element, and the micro-control element are all installed in the positioning frame, and the two stamping elements are fixedly installed in the transmission element.

[0015] As a further improvement of the present invention, the positioning frame includes a mounting horizontal plate, two mounting vertical plates, an adsorption horizontal plate, a main adsorption plate, and two secondary adsorption plates. The top surface of the mounting horizontal plate is fixedly mounted on the bottom surface of the mounting vertical rail. The top surfaces of the two mounting vertical plates are respectively fixedly mounted on both ends of the bottom surface of the mounting horizontal plate. The top surfaces of the adsorption horizontal plate are respectively fixedly mounted on the bottom surfaces of the two mounting vertical plates. Sliding grooves are recessed at both ends of the top surface of the adsorption horizontal plate. A first mounting hole is opened through the middle of the bottom surface of the adsorption horizontal plate. The main adsorption plate is fixedly mounted in the first mounting hole, and the top of the main adsorption plate is connected to an external suction machine. The two secondary adsorption plates are fixedly mounted on both ends of the bottom surface of the adsorption horizontal plate. Suction ports are opened on the outer sides of the two secondary adsorption plates and are connected to an external suction machine. The top surface of the first driving cylinder is mounted on the middle of the bottom surface of the mounting horizontal plate.

[0016] As a further improvement of the present invention, the transmission element includes a transmission frame, two sliding plates, two vertical slide rails and two rotators. The top surface of the transmission frame is fixedly installed in the output shaft of the first drive cylinder. One end of the inner side of the two sliding plates is fixedly installed at both ends of the transmission frame. The outer sides of the two sliding plates are slidably installed in the two vertical slide rails. The two rotators are installed at the other end of the inner side of the two rotators and at both ends of the top surface of the adsorption plate.

[0017] As a further improvement of the present invention, each rotator includes a first rotating rod, a connecting plate, a second rotating rod, a sliding shaft, and a rotating platform. One end of the first rotating rod is rotatably mounted on one end of the inner side of the rotator, and the other end of the first rotating rod is rotatably mounted on the bottom of the connecting plate. One end of the sliding shaft is fixedly mounted on the top of the connecting plate, and the middle part of the second rotating rod is slidably mounted on the other end of the sliding shaft. The bottom of the rotating platform is fixedly mounted on one end of the top surface of the adsorption plate, and one end of the second rotating rod is mounted in the rotating platform.

[0018] As a further improvement of the present invention, the micro-control element includes two compression controllers and two microcontrollers. The two compression controllers are electrically connected to the first drive cylinder. The bottom surfaces of the two compression controllers are fixedly installed in the middle of the top surface of the adsorption plate. The two compression controllers are respectively located at both ends of the first mounting hole. The sensing ends of the two compression controllers are vertically upward and located directly below the transmission frame. The two microcontrollers are slidably installed in two sliding grooves. Each microcontroller is provided with a driver. Each microcontroller consists of two opposing pressure blocks. The top of the pressure blocks is made of rubber, and the inner side of the top of the pressure blocks is recessed with an inclined guide surface.

[0019] As a further improvement of the present invention, each stamping element includes a stamper and a probe. The stamper and the probe are fixedly installed on the end of the second rotating rod away from the rotating table, and the probe is located at the end of the stamper adjacent to the rotating table. A compression rod is also provided at the bottom of the probe. The compression rod is electrically connected to the first driving cylinder. A suction cup and an air bag are also provided on the bottom surface of the compression rod. The suction cup is connected to an external suction machine. The suction cup is fixedly installed at the end of the air bag adjacent to the rotating table. An air outlet is recessed at the bottom of the end of the air bag adjacent to the stamper. An air inlet is recessed at the other end of the air bag and is connected to the suction cup. A one-way valve is provided on both the air outlet and the air inlet.

[0020] The beneficial effects of this invention are as follows:

[0021] 1. The initial positioning and transmission are performed using the initial moving body and the vertical axis moving base. Then, the positioning and stamping mechanism is used for secondary and tertiary positioning and gripping. This effectively performs accurate positioning, transfer and installation of the micro-pitch LED in the transfer printing process, while preventing the LED substrate from shifting due to external vibration or vibration of parts between devices during subsequent processes.

[0022] 2. The positioning and stamping mechanism utilizes the positioning frame, transmission components, microcontroller components, and two stamping components to precisely move and position the incoming LED substrate and LED acceptor substrate. This ensures correct printing of the LED acceptor substrate and reliable installation of the Micro-LED element, while improving production efficiency and product quality in the LED manufacturing process. It also ensures accurate docking between the LED acceptor substrate and the Micro-LED element, improves bonding quality, cleans the donor groove, and ensures a smooth joint, thereby enhancing the quality and reliability of the LED. Attached Figure Description

[0023] Figure 1 This is a three-dimensional schematic diagram of an embodiment of the present invention.

[0024] Figure 2 This is a perspective view of another embodiment of the present invention.

[0025] Figure 3 This is a perspective view of another embodiment of the present invention.

[0026] Figure 4 This is a three-dimensional schematic diagram of the positioning stamping mechanism in one embodiment of the present invention.

[0027] Figure 5 This is a three-dimensional schematic diagram of the positioning stamping mechanism in another embodiment of the present invention.

[0028] Figure 6 for Figure 5 Enlarged view of point B in the middle.

[0029] Figure 7 for Figure 4 Enlarged view of point A in the middle.

[0030] In the diagram: 10. Moving body; 11. Mounting frame; 12. Horizontal guide rail; 13. Transmission guide rail; 20. Vertical axis moving base; 21. Mounting track; 211. Mounting plate; 212. Rotating mounting platform; 22. First drive motor; 23. Transmission rod; 231. First spur gear; 232. Second spur gear; 24. Mounting platform; 241. Second drive motor; 242. Third drive motor; 25. Mounting vertical rail; 30. Positioning and stamping mechanism; 31. Positioning frame; 311. Mounting horizontal plate; 312. Mounting vertical plate; 313. Adsorption horizontal plate; 314. Main adsorption plate; 315. Secondary adsorption plate; 316. 317. First mounting hole; 318. Suction port; 319. Sliding groove; 32. First drive cylinder; 33. Transmission element; 331. Transmission frame; 332. Sliding plate; 333. Vertical slide rail; 34. Microcontroller element; 341. Compression controller; 342. Microcontroller; 343. Pressure block; 344. Guide surface; 35. Stamping element; 351. Stamping device; 352. Position probe; 353. Suction cup; 354. Airbag; 355. Air outlet; 357. Compression rod; 36. Rotator; 361. First rotating rod; 362. Connecting plate; 363. Second rotating rod; 364. Rotating table; 365. Sliding shaft. Detailed Implementation

[0031] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0032] In the description of this invention, it should be noted that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0034] Please see Figures 1 to 7 A micro-nano fabrication process for micro-pitch LED transfer printing includes the following steps:

[0035] Step S1: Place the LED substrate into the micro-transfer printing apparatus and move the LED substrate to a predetermined position within the micro-transfer printing apparatus;

[0036] Step S2: The micro-transfer printing device will peel off and adsorb the Micro-LED functional devices in the LED substrate;

[0037] Step S3: Remove the LED substrate, place it into the LED acceptor substrate, and move the LED acceptor substrate to a predetermined position in the micro-transfer printing apparatus;

[0038] Step S4: Place and adhere the Micro-LED functional device into the LED acceptor substrate, and then remove the LED acceptor substrate to complete the transfer printing process;

[0039] The micro-transfer printing device includes a primary moving body 10, a vertical axis moving base 20, and a positioning and stamping mechanism 30. The primary moving body 10 is fixedly installed in the mounting base, the vertical axis moving base 20 is slidably installed on the top of the primary moving body 10, and the positioning and stamping mechanism 30 is fixedly installed on the bottom of the vertical axis moving base 20.

[0040] The initial moving body 10 includes two mounting frames 11, two transverse guide rails 12, and two transmission guide rails 13. The two mounting frames 11 are arranged opposite each other in the mounting ground. The two ends of the two transverse guide rails 12 are respectively fixedly installed on the top surfaces of the two mounting frames 11, so that the length direction of the transverse guide rails 12 is perpendicular to the length direction of the mounting frames 11. A first straight strip is provided in the inner wall of each transverse guide rail 12. The two ends of each transmission guide rail 13 are respectively fixedly installed on the two ends of the middle of the inner side wall of the mounting frame 11, so that the two transmission guide rails 13 are arranged opposite each other, and the length direction of each transmission guide rail 13 is perpendicular to the length direction of the transverse guide rail 12.

[0041] The vertical axis moving base 20 includes a mounting track 21, a first drive motor 22, a transmission rod 23, a mounting platform 24, and a mounting vertical rail 25. A second ruler strip is provided in the middle of the outer sidewall of the mounting track 21. Both ends of the mounting track 21 are slidably mounted on the tops of two transverse guide rails 12, with the length direction of the mounting track 21 perpendicular to the length direction of the transverse guide rails 12. A mounting plate 211 protrudes from one end of the inner sidewall of the mounting track 21. The first drive motor 22 is fixedly mounted in the sidewall of the mounting plate 211. A rotating mounting platform 212 protrudes from one end of the bottom surface of the mounting plate 211. The transmission rod 23 is rotatably mounted in the rotating mounting platform 212. The two ends of the transmission rod 23... Each end is provided with a first spur gear 231, and the two first spur gears 231 are respectively meshed with the first straight ruler strip in the inner side wall of the two transverse guide rails 12. A second spur gear 232 is also provided on the end of the transmission rod 23 near the mounting plate 211. A transmission belt is sleeved on the output shaft of the second spur gear 232 and the first drive motor 22 to realize the transmission connection. The mounting platform 24 is slidably installed in the outer side wall of the mounting rail 21, and a second drive motor 241 is also provided on the end of the mounting platform 24 away from the mounting plate 211. The output shaft of the second drive motor 241 is meshed with the second straight ruler strip. The mounting vertical rail 25 is slidably installed on the outside of the mounting platform 24.

[0042] A third ruler strip is provided at one end of the mounting rail 25 adjacent to the mounting plate 211, and a third drive motor 242 is also provided at one end of the mounting platform 24 adjacent to the mounting plate 211. The output shaft of the third drive motor 242 is engaged with the third ruler strip.

[0043] The positioning and stamping mechanism 30 includes a positioning frame 31, a first drive cylinder 32, a transmission element 33, a micro-control element 34, and two stamping elements 35. The top surface of the positioning frame 31 is fixedly installed on the bottom surface of the mounting vertical rail 25. The first drive cylinder 32, the transmission element 33, and the micro-control element 34 are all installed in the positioning frame 31, and the two stamping elements 35 are fixedly installed in the transmission element 33.

[0044] The positioning frame 31 includes a mounting horizontal plate 311, two mounting vertical plates 312, an adsorption horizontal plate 313, a main adsorption plate 314, and two secondary adsorption plates 315. The top surface of the mounting horizontal plate 311 is fixedly mounted to the bottom surface of the mounting vertical rail 25. The top surfaces of the two mounting vertical plates 312 are respectively fixedly mounted to both ends of the bottom surface of the mounting horizontal plate 311. The top surfaces of the adsorption horizontal plate 313 are respectively fixedly mounted to both ends of the bottom surface of the two mounting vertical plates 312. Sliding grooves 318 are recessed at both ends of the top surface of the adsorption horizontal plate 313. A first mounting hole 316 is provided through the middle of the bottom surface of the adsorption plate 313. The main adsorption plate 314 is fixedly installed in the first mounting hole 316, and the top of the main adsorption plate 314 is connected to an external suction machine. Two secondary adsorption plates 315 are fixedly installed at both ends of the bottom surface of the adsorption plate 313. Suction ports 317 are provided on the outer side of each of the two secondary adsorption plates 315. The suction ports 317 are connected to an external suction machine. The top surface of the first drive cylinder 32 is installed in the middle of the bottom surface of the mounting plate 311.

[0045] The transmission element 33 includes a transmission frame 331, two sliding plates 332, two vertical slide rails 333, and two rotators 36. The top surface of the transmission frame 331 is fixedly installed in the output shaft of the first drive cylinder 32. One end of the inner side of the two sliding plates 332 is fixedly installed at both ends of the transmission frame 331, and the outer sides of the two sliding plates 332 are slidably installed in the two vertical slide rails 333. The two rotators 36 are installed at the other end of the inner side of the two rotators 36 and at both ends of the top surface of the adsorption plate 313.

[0046] Each rotator 36 includes a first rotating rod 361, a connecting plate 362, a second rotating rod 363, a sliding shaft 365, and a rotating platform 364. One end of the first rotating rod 361 is rotatably mounted on one end of the inner side of the rotator 36, and the other end of the first rotating rod 361 is rotatably mounted on the bottom of the connecting plate 362. One end of the sliding shaft 365 is fixedly mounted on the top of the connecting plate 362, and the middle part of the second rotating rod 363 is slidably mounted on the other end of the sliding shaft 365. The bottom of the rotating platform 364 is fixedly mounted on one end of the top surface of the adsorption horizontal plate 313, and one end of the second rotating rod 363 is mounted in the rotating platform 364.

[0047] The microcontroller element 34 includes two compression controllers 341 and two microcontrollers 342. Both compression controllers 341 are electrically connected to the first drive cylinder 32. The bottom surfaces of both compression controllers 341 are fixedly installed in the middle of the top surface of the adsorption plate 313. The two compression controllers 341 are located at both ends of the first mounting hole 316. The sensing ends of the two compression controllers 341 are vertically upward and located directly below the transmission frame 331. The two microcontrollers 342 are slidably installed in two sliding grooves 318. Each microcontroller 342 is equipped with a driver. Each microcontroller 342 consists of two opposing pressure blocks 343. The top of the pressure block 343 is made of rubber, and the inner side of the top of the pressure block 343 is recessed with an inclined guide surface 344.

[0048] Each stamping element 35 includes a stamper 351 and a probe 352. The stamper 351 and the probe 352 are fixedly installed on the end of the second rotating rod 363 away from the rotating table 364, and the probe 352 is located at the end of the stamper 351 adjacent to the rotating table 364. A compression rod 357 is also provided at the bottom of the probe 352. The compression rod 357 is electrically connected to the first driving cylinder 32. A suction cup 353 and an air bag 354 are also provided on the bottom surface of the compression rod 357. The suction cup 353 is connected to an external suction machine. The suction cup 353 is fixedly installed on the end of the air bag 354 adjacent to the rotating table 364. An air outlet 355 is recessed at the bottom of the end of the air bag 354 adjacent to the stamper 351. An air inlet is recessed at the other end of the air bag 354 and is connected to the suction cup 353. A one-way valve is provided on both the air outlet 355 and the air inlet.

[0049] For example, in one embodiment: the LED substrate is placed into the transmission guide rail 13 and conveyed into the middle of the initial moving body 10 by the transmission guide rail 13. Then, the first drive motor 22, the second drive motor 241 and the third drive motor 242 are started in stages, so that the mounting vertical rail 25 moves the positioning and stamping mechanism 30 to the initial predetermined position, and the bottom surfaces of the main suction plate 314 and the two secondary suction plates 315 are attached to the LED substrate. Then, the suction machine is started, so that the LED substrate is adsorbed in the main suction plate 314 and the two secondary suction plates 315, preventing the LED substrate from being displaced due to external vibration or vibration of parts between devices in the subsequent process.

[0050] Then, the first drive cylinder 32 is activated, causing its output shaft to extend. This causes the transmission frame 331 and the two sliding plates 332 to move vertically downwards along the two vertical slide rails 333. This causes the first rotating rod 361 to rotate downwards, the connecting plate 362 to rotate downwards, and the second rotating rod 363 to rotate downwards along the rotating platform 364. This causes the micro-control element 34 to follow and move downwards until the second rotating rod 363 moves between the two pressure blocks 343 under the guidance of the guide surfaces 344. The two pressure blocks 343 then clamp one end of the second rotating rod 363, and the suction cup 353 of the probe 352 adheres to the surface of the LED substrate. The suction machine is then activated, causing the suction cup 353 of the probe 352 to adhere to one end of the LED substrate surface. The probe 352 then identifies and positions the Micro-LED elements in the LED substrate. If the LED substrate is not placed horizontally in the transmission guide rail 13, the probe will detect and locate the micro-LED elements. If the LED substrate shifts due to vibration or other reasons during transmission via the drive rail 13, causing the sidewall of the LED substrate to be non-parallel to the sidewall of the drive rail 13, the suction machine will cancel the suction force of the two suction cups 315 and reduce the suction force of the main suction cup 314. Then, the driver in the microcontroller 342 will be activated, causing the microcontroller 342 to slide in the two sliding grooves 318, causing the two second rotating rods 363 to slide synchronously along the sliding shaft 365, causing the two probes 352 to move accordingly. Since the suction cups 353 of the probes 352 are attached to one end of the LED substrate surface at this time, and the suction force of the main suction cup 314 is weak, the LED substrate will rotate around the main suction cup 314 until the sidewall of the LED substrate is parallel to the sidewall of the drive rail 13, making the Micro-LED element vertical, ensuring the stability and correct positioning of the LED substrate, and providing an accurate basis for subsequent processes.

[0051] It is worth noting that when the LED substrate offset is too large, causing the microcontroller 342 to move insufficiently in the sliding groove 318 to restore the LED substrate to a horizontal position, the suction machine can be controlled to cancel the suction of one of the adsorption disks 315. Furthermore, the suction force of the main adsorption disk 314 is reduced to compensate for the aforementioned deficiency. This causes the LED substrate to rotate around the adsorption disk 315 that did not cancel the suction force when the microcontroller 342 moves, further increasing the rotation of the LED substrate. This prevents the need for multiple rotations of the LED substrate to restore it to a horizontal position when the offset is too large.

[0052] Once the Micro-LED element is ensured to be in a vertical position, the first drive cylinder 32 and the compression rod 357 will be activated, causing the second rotating rod 363 to continue rotating and moving downward around the rotating table 364. This causes the compression rod 357 to compress, and the stamping device 351 to continue moving downward to adhere and peel off the Micro-LED element on the LED substrate until the bottom surface of the transmission frame 331 abuts against it, causing the sensing ends of the two compression controllers 341 to compress and descend. Then, the first drive cylinder 32 is activated, causing the output shaft of the first drive cylinder 32 to retract, causing the second rotating rod 363 to rotate and move upward. At the same time, the adsorption force of the main adsorption plate 314 and the two slave adsorption plates 315 will disappear, and the two transmission guide rails 13 will be activated to remove the LED substrate, completing the adsorption process.

[0053] For example, in one embodiment: after the adsorption process is completed, the LED acceptor substrate is placed into the transmission guide rail 13 and conveyed into the middle of the initial moving body 10 using the transmission guide rail 13. The above actions are repeated until the sidewall of the LED acceptor substrate is parallel to the sidewall of the transmission guide rail 13. Then, the probe 352 determines the position of the donor slot of the LED acceptor substrate. When the donor slot cannot align with the Micro-LED element adhered to the top surface of the stamping device 351, the suction machine will simultaneously lower the main adsorption plate 314 and the two slave adsorption plates 31. The adsorption force of 5 will simultaneously cause the suction cup 353 to generate suction force, and then the driver in the microcontroller 342 will be activated, causing the microcontroller 342 to slide in the two sliding grooves 318, causing the two second rotating rods 363 to slide synchronously along the sliding shaft 365, causing the two probes 352 to move accordingly, causing the LED recipient substrate to move laterally in parallel until the donor groove is aligned with the Micro-LED element adhered to the top surface of the cover plate 351, and then the adsorption force of the main adsorption plate 314 and the two slave adsorption plates 315 will be restored, and The first drive cylinder 32 is activated, causing the second rotating rod 363 to continue rotating and moving downwards around the rotating platform 364. This causes the cover plater 351 to continue moving downwards to imprint the LED acceptor substrate, allowing the Micro-LED element to be installed into the LED acceptor substrate. Simultaneously, the continued downward movement of the second rotating rod 363 compresses the airbag 354, causing the gas in the airbag 354 to be blown from the air outlet 355 into the donor slot in the LED acceptor substrate. This prevents impurities from appearing in the donor slot in the LED acceptor substrate, which could lead to poor bonding when the Micro-LED element is installed and used in the LED. At the same time, the blown airflow makes the liquid in the donor slot more even, resulting in a smoother bond. This ensures correct printing on the LED acceptor substrate and reliable installation of the Micro-LED element, improving production efficiency and product quality in the LED manufacturing process. It ensures accurate docking between the LED acceptor substrate and the Micro-LED element, improves bonding quality, cleans the donor slot, and ensures a smooth bond, thereby improving the quality and reliability of the LED.

[0054] Installation process: Two mounting frames 11 are positioned opposite each other on the mounting surface. The two ends of two transverse guide rails 12 are fixedly mounted to the top surfaces of the two mounting frames 11, with the length of the transverse guide rails 12 perpendicular to the length of the mounting frames 11. The two ends of each transmission guide rail 13 are fixedly mounted to the middle of the inner sidewall of the mounting frame 11, with the two transmission guide rails 13 facing each other and their length perpendicular to the length of the transverse guide rails 12. The two ends of the mounting rail 21 are slidably mounted on the top of the two transverse guide rails 12, with the length of the mounting rail 21 perpendicular to the length of the transverse guide rails 12. The first drive motor 22 is fixedly mounted in the sidewall of the mounting plate 211, and the transmission rod 23 is rotatably mounted. In the rotating mounting platform 212, two first spur gears 231 are respectively meshed with the first straight strips in the inner sidewalls of the two transverse guide rails 12. A transmission belt is fitted onto the output shaft of the second spur gear 232 to achieve transmission connection. The mounting platform 24 is slidably mounted in the outer sidewall of the mounting rail 21. The output shaft of the second drive motor 241 is meshed with the second straight strip. The mounting vertical rail 25 is slidably mounted on the outer side of the mounting platform 24. The output shaft of the third drive motor 242 is meshed with the third straight strip. The top surface of the mounting horizontal plate 311 is fixedly mounted on the bottom surface of the mounting vertical rail 25. The top surfaces of the two mounting vertical plates 312 are respectively fixedly mounted on both ends of the bottom surface of the mounting horizontal plate 311. The top surfaces of the adsorption horizontal plate 313 are respectively fixedly mounted on both ends of the bottom surface of the mounting vertical plate 25. The main adsorption plate 314 is fixedly installed in the first mounting hole 316 on the bottom surface of two mounting vertical plates 312, and the top of the main adsorption plate 314 is connected to an external suction machine. Two secondary adsorption plates 315 are fixedly installed at both ends of the bottom surface of the adsorption horizontal plate 313. Suction ports 317 are opened on the outer side of each of the two secondary adsorption plates 315 and are connected to an external suction machine. The top surface of the first driving cylinder 32 is installed in the middle of the bottom surface of the mounting horizontal plate 311, and the top surface of the transmission frame 331 is fixedly installed in the output shaft of the first driving cylinder 32. One end of the inner side of each of the two sliding plates 332 is fixedly installed at both ends of the transmission frame 331, and the outer sides of the two sliding plates 332 are slidably installed in two vertical slide rails 333. Two rotators 36 are installed on the inner side of each of the two rotators 36. At both ends of the top surface of the adsorption horizontal plate 313, one end of the first rotating rod 361 is rotatably mounted to one end of the inner side of the rotator 36, and the other end of the first rotating rod 361 is rotatably mounted to the bottom of the connecting plate 362. One end of the sliding shaft 365 is fixedly mounted to the top of the connecting plate 362, and the middle part of the second rotating rod 363 is slidably mounted to the other end of the sliding shaft 365. The bottom of the rotating platform 364 is fixedly mounted to one end of the top surface of the adsorption horizontal plate 313, and one end of the second rotating rod 363 is mounted in the rotating platform 364. Both compression controllers 341 are electrically connected to the first driving cylinder 32. The bottom surfaces of both compression controllers 341 are fixedly mounted to the middle of the top surface of the adsorption horizontal plate 313, and the two compression controllers 341 are respectively located at both ends of the first mounting hole 316.The sensing ends of two compression controllers 341 are vertically upward and located directly below the transmission frame 331. Two microcontrollers 342 are slidably mounted in two sliding grooves 318. The stamping device 351 and the probe 352 are fixedly mounted on the end of the second rotating rod 363 away from the rotating table 364, with the probe 352 located at the end of the stamping device 351 adjacent to the rotating table 364.

[0055] Beneficial effects:

[0056] 1. The initial positioning and transmission are performed using the initial moving body 10 and the vertical axis moving base 20. Then, the positioning and stamping mechanism 30 is used for secondary and tertiary positioning and gripping. This effectively performs accurate positioning, transfer and installation of the micro-pitch LED transfer printing process, while preventing the LED substrate from shifting due to external vibration or vibration of parts between devices during subsequent processes.

[0057] 2. The positioning and stamping mechanism 30 utilizes the positioning frame 31, transmission element 33, microcontroller element 34, and two stamping elements 35 to precisely move and position the incoming LED substrate and LED acceptor substrate. This ensures correct printing of the LED acceptor substrate and reliable installation of the Micro-LED element, while improving production efficiency and product quality in the LED manufacturing process. It also ensures accurate docking between the LED acceptor substrate and the Micro-LED element, improves bonding quality, cleans the donor groove, and ensures a smooth joint, thereby improving the quality and reliability of the LED.

[0058] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A micro-nano fabrication process for micro-pitch LED transfer printing, characterized in that, Includes the following steps: Step S1: Place the LED substrate into the micro-transfer printing apparatus and move the LED substrate to a predetermined position within the micro-transfer printing apparatus; Step S2: The micro-transfer printing device will peel off and adsorb the Micro-LED functional devices in the LED substrate; Step S3: Remove the LED substrate, place it into the LED acceptor substrate, and move the LED acceptor substrate to a predetermined position in the micro-transfer printing apparatus; Step S4: Place and adhere the Micro-LED functional device into the LED acceptor substrate, and then remove the LED acceptor substrate to complete the transfer printing process; The micro-transfer printing device includes a primary moving body (10), a vertical axis moving base (20), and a positioning and stamping mechanism (30). The primary moving body (10) is fixedly installed in the mounting base, the vertical axis moving base (20) is slidably installed on the top of the primary moving body (10), and the positioning and stamping mechanism (30) is fixedly installed on the bottom of the vertical axis moving base (20). The positioning stamping mechanism (30) includes a positioning frame (31), a first drive cylinder (32), a transmission element (33), a micro-control element (34), and two stamping elements (35). The top surface of the positioning frame (31) is fixedly installed on the bottom surface of the mounting vertical rail (25). The first drive cylinder (32), the transmission element (33), and the micro-control element (34) are all installed in the positioning frame (31), and the two stamping elements (35) are fixedly installed in the transmission element (33).

2. The micro-nano fabrication process for micro-pitch LED transfer printing according to claim 1, characterized in that: The initial moving body (10) includes two mounting frames (11), two transverse guide rails (12) and two transmission guide rails (13). The two mounting frames (11) are set opposite to each other in the mounting ground. The two ends of the two transverse guide rails (12) are respectively fixedly installed on the top surfaces of the two mounting frames (11), so that the length direction of the transverse guide rails (12) is perpendicular to the length direction of the mounting frames (11). A first straight strip is provided in the inner wall of each transverse guide rail (12). The two ends of each transmission guide rail (13) are respectively fixedly installed on the two ends of the middle of the inner side wall of the mounting frame (11), so that the two transmission guide rails (13) are set opposite to each other, and the length direction of each transmission guide rail (13) is perpendicular to the length direction of the transverse guide rails (12).

3. The micro-nano fabrication process for micro-pitch LED transfer printing according to claim 2, characterized in that: The vertical axis moving base (20) includes a mounting track (21), a first drive motor (22), a transmission rod (23), a mounting platform (24), and a mounting vertical rail (25). A second straightedge is provided in the middle of the outer sidewall of the mounting track (21). The two ends of the mounting track (21) are slidably mounted on the top of two transverse guide rails (12), and the length direction of the mounting track (21) is perpendicular to the length direction of the transverse guide rails (12). A mounting plate (211) protrudes from one end of the inner sidewall of the mounting track (21). The first drive motor (22) is fixedly mounted in the sidewall of the mounting plate (211). A rotating mounting platform (212) protrudes from one end of the bottom surface of the mounting plate (211). The transmission rod (23) is rotatably mounted in the rotating mounting platform (212). 23) Both ends are provided with a first spur gear (231), and the two first spur gears (231) are respectively meshed with the first straight strip in the inner side wall of the two transverse guide rails (12). A second spur gear (232) is also provided on the end of the transmission rod (23) near the mounting plate (211). A transmission belt is sleeved on the output shaft of the second spur gear (232) and the first drive motor (22) to realize the transmission connection. The mounting platform (24) is slidably installed in the outer side wall of the mounting rail (21), and a second drive motor (241) is also provided on the end of the mounting platform (24) away from the mounting plate (211). The output shaft of the second drive motor (241) is meshed with the second straight strip. The mounting vertical rail (25) is slidably installed on the outside of the mounting platform (24).

4. The micro-nano fabrication process for micro-pitch LED transfer printing according to claim 3, characterized in that: The mounting rail (25) is provided with a third straight ruler strip at one end near the mounting plate (211), and the mounting platform (24) is also provided with a third drive motor (242) at one end near the mounting plate (211). The output shaft of the third drive motor (242) is meshed with the third straight ruler strip.

5. The micro / nano fabrication process for micro-pitch LED transfer printing according to claim 4, characterized in that: The positioning frame (31) includes a mounting horizontal plate (311), two mounting vertical plates (312), an adsorption horizontal plate (313), a main adsorption plate (314), and two secondary adsorption plates (315). The top surface of the mounting horizontal plate (311) is fixedly mounted on the bottom surface of the mounting vertical rail (25). The top surfaces of the two mounting vertical plates (312) are respectively fixedly mounted on both ends of the bottom surface of the mounting horizontal plate (311). The top surfaces of the adsorption horizontal plate (313) are respectively fixedly mounted on both ends of the bottom surface of the two mounting vertical plates (312). The top surfaces of the adsorption horizontal plate (313) are recessed with sliding grooves (315) at both ends. 8) A first mounting hole (316) is provided through the middle of the bottom surface of the adsorption plate (313). The main adsorption plate (314) is fixedly installed in the first mounting hole (316), and the top of the main adsorption plate (314) is connected to the external suction machine. Two secondary adsorption plates (315) are fixedly installed at both ends of the bottom surface of the adsorption plate (313). Suction ports (317) are provided on the outer side of the two secondary adsorption plates (315). The suction ports (317) are connected to the external suction machine. The top surface of the first driving cylinder (32) is installed in the middle of the bottom surface of the mounting plate (311).

6. The micro-nano fabrication process for micro-pitch LED transfer printing according to claim 5, characterized in that: The transmission element (33) includes a transmission frame (331), two sliding plates (332), two vertical slide rails (333), and two rotators (36). The top surface of the transmission frame (331) is fixedly installed in the output shaft of the first drive cylinder (32). One end of the inner side of the two sliding plates (332) is fixedly installed at both ends of the transmission frame (331). The outer sides of the two sliding plates (332) are slidably installed in the two vertical slide rails (333). The two rotators (36) are installed at the other end of the inner side of the two rotators (36) and at both ends of the top surface of the adsorption plate (313).

7. The micro / nano fabrication process for micro-pitch LED transfer printing according to claim 6, characterized in that: Each rotator (36) includes a first rotating rod (361), a connecting plate (362), a second rotating rod (363), a sliding shaft (365), and a rotating platform (364). One end of the first rotating rod (361) is rotatably mounted on one end of the inner side of the rotator (36), and the other end of the first rotating rod (361) is rotatably mounted on the bottom of the connecting plate (362). One end of the sliding shaft (365) is fixedly mounted on the top of the connecting plate (362), and the middle part of the second rotating rod (363) is slidably mounted on the other end of the sliding shaft (365). The bottom of the rotating platform (364) is fixedly mounted on one end of the top surface of the adsorption horizontal plate (313), and one end of the second rotating rod (363) is mounted in the rotating platform (364).

8. The micro / nano fabrication process for micro-pitch LED transfer printing according to claim 7, characterized in that: The microcontroller (34) includes two compression controllers (341) and two microcontrollers (342). The two compression controllers (341) are electrically connected to the first drive cylinder (32). The bottom surfaces of the two compression controllers (341) are fixedly installed in the middle of the top surface of the adsorption plate (313). The two compression controllers (341) are located at both ends of the first mounting hole (316). The sensing ends of the two compression controllers (341) are vertically upward and located directly below the transmission frame (331). The two microcontrollers (342) are slidably installed in the two sliding grooves (318). Each microcontroller (342) is equipped with a driver. Each microcontroller (342) consists of two opposing pressure blocks (343). The top of the pressure block (343) is made of rubber, and the inner side of the top of the pressure block (343) is recessed with an inclined guide surface (344).

9. The micro / nano fabrication process for micro-pitch LED transfer printing according to claim 8, characterized in that: Each stamping element (35) includes a stamper (351) and a probe (352). The stamper (351) and the probe (352) are fixedly installed at the end of the second rotating rod (363) away from the rotating table (364), and the probe (352) is located at the end of the stamper (351) adjacent to the rotating table (364). A compression rod (357) is also provided at the bottom of the probe (352). The compression rod (357) is electrically connected to the first driving cylinder (32). 57) The bottom surface is also provided with a suction cup (353) and an air bag (354). The suction cup (353) is connected to an external suction machine. The suction cup (353) is fixedly installed at one end of the air bag (354) near the rotating table (364). The bottom of the air bag (354) near the stamping device (351) is also recessed with an air outlet (355). The other end of the air bag (354) is recessed with an air inlet, and the air inlet is connected to the suction cup (353). Both the air outlet (355) and the air inlet are provided with one-way valves.

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