Resin molding apparatus and method for manufacturing resin molded articles

Abstract

This invention provides a resin molding apparatus and a method for manufacturing a resin molded article. The present invention provides a resin molding apparatus that can provide a high-quality resin molded article as a final product even when removing excess resin from the resin molded article. The resin molding apparatus includes: a molding die driven by a clamping mechanism to mold an object to produce a resin molded article; a removal mechanism (70) for removing excess resin from the resin molded article; a cleaner (80) for collecting dust on the surface of the resin molded article; and a pressing mechanism (82) for pressing the resin molded article while the cleaner (80) collects dust on the resin molded article, wherein the cleaner (80) collects dust on the resin molded article before and after the removal of excess resin by the removal mechanism (70).

Description

Technical Field

[0001] This specification relates to a resin molding apparatus and a method for manufacturing resin molded articles. Background Technology

[0002] In a resin molding apparatus, a substrate containing electronic components such as integrated circuits (ICs), transistors, and capacitors is prepared as the object to be molded and supplied to a molding die. For example, resin molding is performed using methods such as transfer molding, compression molding, and injection molding to seal the electronic components on the substrate with resin and produce a resin molded product.

[0003] When a resin molded article is removed from the molding die, excess resin (residual resin) may sometimes be integrally formed on the resin molded article. Typically, a removal mechanism (also called a degate mechanism, etc.) is installed in the resin molding apparatus to remove the excess resin from the resin molded article. In the removal mechanism (degate mechanism) disclosed in Patent Document 1 below, the runner gate is pushed off by a degate pin and removed from the resin molded article.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2008-118012 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] During the removal process, actions such as separating excess resin from the resin molded article may generate fine resin particles (resin powder, resin flakes, or resin residue). If these fine resin particles adhere to the resin molded article, they may affect the processing of the resin molded article in various steps and impact the quality of the resin molded article as the final product.

[0009] The purpose of this specification is to disclose a resin molding apparatus and a method for manufacturing resin molded articles, which can provide resin molded articles of higher quality as final products compared with the prior art, even when removing excess resin from the resin molded articles.

[0010] Technical means to solve the problem

[0011] The resin molding apparatus includes: a clamping mechanism; a molding die comprising an upper die and a lower die facing the upper die, driven by the clamping mechanism to mold an object to be molded to produce a resin molded article; a removal mechanism for removing excess resin portions formed on the resin molded article; a cleaner for collecting dust on the surface of the resin molded article; and a pressing mechanism for pressing the resin molded article while the cleaner is collecting dust on the resin molded article, wherein the cleaner collects dust on the resin molded article before and after the removal mechanism removes the excess resin portions.

[0012] A method for manufacturing a resin molded article includes: a molding step in which a molding die comprising an upper mold and a lower mold facing the upper mold is driven by a mold-locking mechanism to mold an object to be molded and thereby produce a resin molded article; a removal step in which excess resin portion formed on the resin molded article is removed from the resin molded article; and a dust collection step in which dust is collected on the surface of the resin molded article by a cleaner while the resin molded article is being pressed, the dust collection step being performed at least at a time between the molding step and the removal step, and at a time after the removal step.

[0013] The effects of the invention

[0014] According to the structure described above, a resin molding apparatus and a method for manufacturing a resin molded article can be obtained, which can provide a resin molded article with higher quality as a final product compared with the prior art, even when removing excess resin from the resin molded article. Attached Figure Description

[0015] Figure 1 A functional block diagram showing an example of a resin molding apparatus 100.

[0016] Figure 2 A plan view schematically showing the main internal structure of the resin molding apparatus 100.

[0017] Figure 3 This is a perspective view showing the removal mechanism 70, the cleaner 80, and the pressing mechanism 82.

[0018] Figure 4 This is a cross-sectional view showing the state in which the resin molded article 10 is placed on the mounting part 77 of the removal mechanism 70.

[0019] Figure 5 To indicate the direction from arrow B2 ( Figure 3 A side view of the condition of the cleaner 80 and the pressing mechanism 82.

[0020] Figure 6To indicate the direction from arrow B1 ( Figure 3 A side view of the condition of the cleaner 80 and the pressing mechanism 82.

[0021] Figure 7 This is a flowchart illustrating a method for manufacturing the resin molded article 10.

[0022] Figure 8 This is a cross-sectional view showing the state in which the substrate indenter 73 contacts the substrate 12 of the resin molded article 10.

[0023] Figure 9 This is a cross-sectional view showing the state in which the punch pin 74 contacts the excess resin portion 16 and separates the excess resin portion 16 from the substrate 12 of the resin molded article 10.

[0024] Figure 10 This is a cross-sectional view showing the upward state of the punch holder 71.

[0025] Figure 11 This is a cross-sectional view showing the resin molded article 10 after the excess resin portion 16 has been removed.

[0026] Figure 12 To indicate the direction from arrow B2 ( Figure 3 A side view of the condition of the cleaner 80 and the pressing mechanism 82 in the modified example.

[0027] Figure 13 To indicate the direction from arrow B1 ( Figure 3 A side view of the condition of the cleaner 80 and the pressing mechanism 82 in the modified example.

[0028] Explanation of symbols

[0029] 1: Control Department

[0030] 2: Supply Module

[0031] 3: Resin molding module

[0032] 6: Molded Product Transfer Module

[0033] 10: Resin molded products

[0034] 12: Substrate

[0035] 12H: Opening

[0036] 14: Resin sealing part

[0037] 16: Excess resin portion

[0038] 20: Supply Department

[0039] 30: Forming mold

[0040] 31: Lower mold

[0041] 40: Mold clamping mechanism

[0042] 50: Relocation Agency

[0043] 51, 52: Body part

[0044] 60: Discharge section

[0045] 70: Removal mechanism

[0046] 71: Punch Holder

[0047] 72: Elastic member

[0048] 73: Substrate pressure head

[0049] 73H: Through hole

[0050] 74, 74a, 74b: Punch pins

[0051] 76: Transport pallets

[0052] 76H: Space

[0053] 77: Loading section

[0054] 78: Track

[0055] 80: Cleaner

[0056] 80H: Suction port

[0057] 82: Pressing mechanism

[0058] 84, 85, 86, 87: Pressing components

[0059] 90: Placement Machine Department

[0060] 100: Resin molding device

[0061] S1, S2, S3, S4, S5, S6, S7, S8: Process Detailed Implementation

[0062] The embodiments of this disclosure will now be described. In the embodiments described below, when referring to numbers, quantities, etc., unless specifically stated otherwise, the scope of this disclosure is not necessarily limited to the stated numbers, quantities, etc. Each structural component may not be necessary for this disclosure unless specifically stated otherwise. Sometimes, the same reference numerals are used to designate the same parts and equivalent parts, and repeated descriptions are not provided.

[0063] (Resin molding apparatus 100)

[0064] Figure 1This is a functional block diagram illustrating an example of a resin molding apparatus 100 according to an embodiment. The resin molding apparatus 100 includes a control unit 1, a supply module 2, a resin molding module 3, and a molded product unloading module 6. The control unit 1 is configured to control these modules. The supply module 2, the resin molding module 3, and the molded product unloading module 6 are mutually detachable and interchangeable. The number of these modules can also be increased or decreased.

[0065] The supply module 2 is configured to supply the object to be molded and the resin material to the resin molding module 3. The resin molding module 3 produces a resin molded article by locking the molding mold and molding the object with resin. The molded article removal module 6 will be described in detail later, but it is configured to remove the resin molded article from the resin molded article and move it to the mounting machine section.

[0066] Figure 2 This is a plan view schematically showing the main internal structure of the resin molding apparatus 100. (See attached image.) Figure 2 As shown, the resin molding apparatus 100 mainly includes a supply unit 20, a molding die 30, a mold locking mechanism 40, a conveying mechanism 50, and a discharge unit 60.

[0067] Reference Figure 1 and Figure 2 The supply module 2 mainly includes a supply section 20. The supply section 20 contains a molding object to be formed. The molding object is typically a substrate to which electronic components such as semiconductor chips are connected. Examples of substrates that can be used include lead frames, printed circuit boards, metal substrates, resin substrates, semiconductor substrates, and ceramic substrates.

[0068] The resin molding apparatus 100 also includes a conveying mechanism (not shown), which is configured to move between the supply module 2 and the resin molding module 3. The retracted position of the conveying mechanism is located in the supply module 2. The substrate and resin material are conveyed together from the supply section 20 to the molding die 30 by the conveying mechanism. The resin material can be, for example, ingot-shaped resin formed by compressing powdered thermosetting resin.

[0069] The resin molding module 3 includes a molding die 30 and a clamping mechanism 40. The molding die 30 has a lower die 31 ( Figure 2 The lower mold 31 and an upper mold (not shown) facing the lower mold 31 are driven by the clamping mechanism 40, thereby molding the object to be molded to produce a resin molded article 10 (see reference). Figure 4 The transfer mechanism 50 is configured to move between the resin molding module 3 and the molded article transfer module 6.

[0070] The transfer mechanism 50 includes, for example, a body portion 51 and a body portion 52. By moving the body portion 51 in the direction of arrow A1 and the body portion 52 in the direction of arrow A2, the resin molded article 10 (see reference) is transferred... Figure 4 The resin molded article 10 is discharged from the molding die 30. The molded article transfer module 6 includes a discharge section 60. The resin molded article 10 is delivered to the discharge section 60 by the transfer mechanism 50.

[0071] The discharge section 60 includes a removal mechanism 70, a cleaner 80, a pressing mechanism 82, and a placement machine section 90. The removal mechanism 70 performs gate removal processing, removing excess resin formed on the resin molded article from the resin molded article, which is then finally stored in the placement machine section 90. More detailed descriptions will follow.

[0072] (Remove mechanism 70)

[0073] Figure 3 This is a perspective view showing the removal mechanism 70, the cleaner 80, and the pressing mechanism 82. Figure 4 This is a cross-sectional view showing the state in which the resin molded article 10 is placed on the mounting part 77 of the removal mechanism 70.

[0074] like Figure 4 As shown, the resin molded article 10 is in the self-forming mold 30 ( Figure 2 In its removed state, the substrate 12 and the resin sealing portion 14 are mainly included, along with the excess resin portion 16. See below for reference. Figure 9 As explained, the excess resin portion 16 is eventually removed from the substrate 12 by the removal mechanism 70.

[0075] The removal mechanism 70 includes a punch holder 71 and an elastic member 72. Figure 4 ), substrate pressure head 73, punch pins 74 (74a, 74b) and transfer tray 76. Punch holder 71 can be positioned in the direction of arrow B3 ( Figure 4 The substrate pressing head 73 is held below the punch holder 71 by an elastic member 72. The substrate pressing head 73 has multiple through holes 73H. The punch pins 74 are held hanging down from the punch holder 71. One of the punch pins 74, a centrally located thick punch pin 74a, pushes down excess resin portions 16a formed between substrates 12. Multiple thin punch pins 74b push down flow channels 16b formed on the back side of substrates 12 in the excess resin portions 16. Furthermore, the multiple thin punch pins 74b are positioned to be inserted into the multiple through holes 73H.

[0076] On the upper part of the conveying pallet 76, there is a part that connects with the resin molded article 10 ( Figure 4The shape of the mounting portion 77 corresponding to the shape of the transfer pallet 76 is such that a space 76H is formed in the center of the mounting portion 77. The space 76H is a space for the excess material portion 16a of the excess resin portion 16 removed from the substrate 12 to fall and be discharged.

[0077] Figure 3 , Figure 4 In the configuration shown, there are two mounting portions 77 ( Figure 3 The substrate 12 is arranged at an open interval in the direction of arrow B2 and is disposed on one of the mounting portions 77. Figure 4 (left side) and substrate 12 disposed on another mounting part 77 Figure 4 (The right side of the middle) is connected via excess resin portion 16 (see also the right side of the middle) Figures 9-11 ). Moving out of the facility 50 ( Figure 2 The resin molded article 10 taken from the molding die 30 is supplied to the mounting part 77 of the transfer pallet 76. The transfer pallet 76 can transport the resin molded article 10 to a position below the punch holder 71.

[0078] (Cleaner 80 and pressing mechanism 82)

[0079] Figure 5 To indicate the direction from arrow B2 ( Figure 3 A side view showing the condition of the cleaner 80 and the pressing mechanism 82. Figure 6 To indicate the direction from arrow B1 ( Figure 3 A side view of the condition of the cleaner 80 and the pressing mechanism 82.

[0080] like Figure 3 , Figure 5 and Figure 6 As shown, the cleaner 80 is a hollow shape with a duct function, arranged to extend in the direction of arrow B2. The cleaner 80 is connected to a negative pressure generating device (not shown). A suction port 80H is formed at the lower end of the cleaner 80. The cleaner 80 collects dust through the suction port 80H. The cleaner 80 collects dust from at least one of the resin molded articles 10 before and after the removal mechanism 70 removes the excess resin portion 16 (details will be described later).

[0081] In this embodiment, the resin molded article 10 placed on the mounting part 77 can be transported along the track 78 by the transfer pallet 76. Figure 3 The resin molded article 10, placed on the mounting part 77, moves relative to the cleaner 80 in a direction corresponding to the direction of arrow B1 (first direction). The direction of arrow B2 (second direction) is orthogonal to the direction of arrow B1 (first direction) and the direction of arrow B3.

[0082] For example, the resin molded article 10 is conveyed to a position below the suction port 80H of the cleaner 80 via the conveying pallet 76. The cleaner 80 is configured to collect dust from the surface of the resin molded article 10. The pressing mechanism 82 presses the resin molded article 10 while the cleaner 80 collects dust from it. Even when the resin molded article 10 is subjected to the suction force generated by the cleaner 80, the resin molded article 10 is prevented from shifting from the desired position on the mounting portion 77.

[0083] In this embodiment, the pressing mechanism 82 includes pressing members 84 and 86 (see reference) disposed on both sides of the cleaner 80 in the direction of arrow B1 (first direction). Figure 5 In the direction of arrow B1, the suction port 80H of the cleaner 80 is located between the pressing member 84 and the pressing member 86. The pressing member 84 and the pressing member 86 have a brush shape and are arranged to extend in the direction of arrow B2.

[0084] The resin molded article 10 can be prevented from shifting on the mounting portion 77 by the brushes of the pressing members 84 and 86, and the cleaner 80 collects dust from the resin molded article 10. The dust collection operation is performed, for example, while the resin molded article 10 and the cleaner 80 are continuously moving relative to each other. The dust collection operation is not limited to this continuous operation; it can also be performed intermittently. For example, the resin molded article 10 can be configured to repeatedly move relative to each other and stop, and the cleaner 80 collects dust from the resin molded article 10 when the resin molded article 10 stops moving relative to the cleaner 80.

[0085] (Manufacturing method of resin molded articles)

[0086] Figure 7 The flowchart illustrates a method for manufacturing a resin molded article 10, which includes steps S1 to S8. In step S1, the object to be molded and resin material are supplied to the molding die 30 (lower die 31) of the resin molding module 3. In step S2 (molding step), the molding die 30, which includes an upper die and a lower die 31 facing the upper die, is driven by a mold-locking mechanism 40, thereby molding the object to be molded to produce the resin molded article 10.

[0087] In step S3, the resin molded article 10 is removed from the molding die 30 by the transfer mechanism 50 and placed on the mounting portion 77 of the transfer pallet 76. At this time, the removal mechanism 70 can be cleaned. Specifically, for example, before the stamping action by the substrate press head 73 and the punch pin 74, the substrate press head 73 or the punch pin 74 can be cleaned by a brush or suction mechanism (not shown). The cleaning of the removal mechanism 70 in step S3 can also be omitted.

[0088] In step S4 (first dust collection step), the resin molded article 10 is transported to a position facing the cleaner 80 via the transfer pallet 76, where the cleaner 80 collects dust from the resin molded article 10. Here, while the pressing mechanism 82 is pressing the resin molded article 10, the cleaner 80 collects dust from the surface of the resin molded article 10. The pressing mechanism 82 can prevent the resin molded article 10 from shifting, and the cleaner 80 collects dust from the resin molded article 10. Here, the pressing mechanism 82 has pressing members 84 and 86, which include brushes, so the surface of the resin molded article 10 is also cleaned by the pressing members 84 and 86. As a result, the resin adhering to the surface of the resin molded article 10 can also be appropriately removed.

[0089] In process S5 (removal process), the resin molded article 10 is transported to a position facing the punch pin 74 by the transfer pallet 76. For example... Figure 8 As shown, the punch holder 71 descends, causing the substrate press head 73 to contact the substrate 12 of the resin molded article 10. The punch holder 71 descends further, thereby clamping the resin molded article 10 between the substrate press head 73 and the mounting portion 77 of the transfer tray 76.

[0090] like Figure 9 As shown, the punch holder 71 and the punch pin 74 descend further together, so that the punch pin 74 contacts the excess resin portion 16, separating the excess resin portion 16 from the substrate 12 of the resin molded article 10. With the resin molded article 10 placed on the mounting portion 77, the excess resin portion 16 formed on the resin molded article 10 is removed from the resin molded article 10 by the removal mechanism 70.

[0091] like Figure 10 As shown, the punch holder 71 rises, causing the punch pin 74 to rise as well, and the substrate pressure head 73 to move away from the substrate 12. By removing excess resin portion 16 from the resin molded article 10, the opening 12H in the substrate 12 is exposed. Figure 11 As shown, a resin molded article 10 with excess resin portion 16 removed can be obtained. Here, the resin molded article 10 including the substrate 12 is disposed on one of the mounting portions 77. Figure 11 (left side), and resin molded article 10 containing substrate 12 disposed on another mounting portion 77. Figure 11 The right side of the middle part is obtained by separating them from each other.

[0092] In step S6 (second dust collection step), the resin molded article 10 is again transported to a position facing the cleaner 80 by the transfer pallet 76, and the cleaner 80 collects dust from the resin molded article 10. Here, while the pressing mechanism 82 is pressing the resin molded article 10, the cleaner 80 collects dust from the surface of the resin molded article 10. The pressing mechanism 82 can prevent the resin molded article 10 from shifting, and the cleaner 80 collects dust from the resin molded article 10. Here, the pressing mechanism 82 has pressing members 84 and 86 including brushes, and the surface of the resin molded article 10 is also cleaned by the pressing members 84 and 86. As a result, the resin adhering to the surface of the resin molded article 10 can also be appropriately removed.

[0093] In process S7, the resin molded article 10, with the excess resin portion 16 removed, is discharged from the mounting portion 77 of the transfer pallet 76 to the mounting machine portion 90. Figure 2 In process S8, the mounting portion 77 of the transfer pallet 76 is cleaned and dust is collected. Here, the transfer pallet 76 moves along the track 78 to a position facing the cleaner 80, and dust is collected on the mounting portion 77 of the cleaner 80. The cleaner 80 collects dust on the mounting portion 77 when the resin molded article 10 is not placed on it. The pressing mechanism 82 has pressing members 84 and 86, which include brushes, and the surface of the mounting portion 77 is also cleaned by pressing members 84 and 86. As a result, the resin adhering to the mounting portion 77 can also be appropriately removed.

[0094] (Functions and Effects)

[0095] As mentioned at the beginning, in the removal mechanism (gate removal mechanism), during actions such as separating the excess resin portion 16 from the resin molded article, fine resin particles (also called resin powder, resin flakes, or resin residue, etc.) may be generated. For example, when removing the excess resin portion 16a, the excess resin portion 16a is removed by pressing the punch pin 74a against the excess portion. However, when removing the flow channel portion 16b of the excess resin portion 16, the punch pin 74b penetrates the opening 12H of the substrate 12, pushing the resin filling the opening 12H off, thus creating a residue in the opening 12H of the substrate 12. Figure 10 When the punch pin 74b is pulled out, the resin that may remain in the opening 12H may splash up due to the punch pin 74b, resulting in the formation of fine resin particles.

[0096] Suppose that such fine resin adheres to, for example, the upper surface of the resin molded article 10 after degating. Without special countermeasures, this fine resin may remain directly on the resin molded article 10 as the final product, potentially affecting its quality. Alternatively, it is also conceivable that this fine resin may temporarily adhere to the punch pin 74b, resulting in it adhering to the upper surface of the resin molded article 10 before subsequent degating (before degating).

[0097] It is conceivable that the fine resin adhering to the upper surface of the resin molded article 10 may be pressed onto the upper surface of the substrate 12 by the substrate pressure head 73 during the gate removal process, damaging the upper surface of the resin molded article 10, or strongly adhering to the upper surface of the resin molded article 10. It is possible that the fine resin may remain directly on the resin molded article 10 as the final product, which may affect the quality.

[0098] In this embodiment, the cleaner 80 collects dust from the resin molded article 10 at least before and after the removal mechanism 70 removes the excess resin portion 16. In other words, the dust collection (steps S4 and S6) of the resin molded article 10 is performed at least once between the molding step (step S2) and the removal step (step S5) and after the removal step (step S5).

[0099] When dust is collected on the resin molded article 10 before the excess resin portion 16 is removed by the removal mechanism 70, during the gate removal process, it is possible to prevent the fine resin from being pressed onto the upper surface of the substrate 12 by the substrate press head 73, and it is possible to prevent damage to the upper surface of the resin molded article 10 or strong adhesion of fine resin to the upper surface of the resin molded article 10.

[0100] On the other hand, when collecting dust from the resin molded article 10 after the excess resin portion 16 has been removed by the removal mechanism 70, the possibility of fine resin residue directly remaining on the resin molded article 10 as the final product can be effectively reduced, thereby improving the quality of the resin molded article 10.

[0101] That is, the cleaner 80 collects dust on at least one of the resin molded articles 10 before and after the removal mechanism 70 removes the excess resin portion 16, thereby providing resin molded articles of higher quality as final products compared with the prior art.

[0102] By constructing a dust collector 80 that collects dust from the resin molded article 10 and also collects dust from the mounting portion 77 of the transfer pallet 76, advantages can be obtained in terms of the number of parts and cost, or the miniaturization of the device, compared to the case where separate dust collectors are provided for the resin molded article 10 and the mounting portion 77.

[0103] The pressing mechanism 82 that presses the resin molded article 10 during dust collection includes a brush and is configured to clean the resin molded article 10 or the mounting part 77. Therefore, compared with the case where the pressing mechanism 82 is provided for the pressing purpose and the cleaning purpose respectively, it can gain advantages in terms of the number of parts and cost, or the miniaturization of the device.

[0104] In this embodiment, the pressing mechanism 82 includes pressing members 84 and 86 disposed on both sides of the cleaner 80 in the direction of arrow B1 (first direction). The pressing members 84 and 86 can stably hold the resin molded article 10 while simultaneously collecting dust from the resin molded article 10 by the cleaner 80. Alternatively, the pressing member 84 may be disposed only on one side of the cleaner 80 in the direction of arrow B1 (first direction).

[0105] Reference Figure 10 Alternatively, by setting the tip of the punch pin 74b to a conical shape with a tapered front end, the opening 12H of the substrate 12 can be made more conical. Figure 10 When the punch pin 74b is withdrawn, the resin in the remaining opening 12H is prevented from splashing due to the punch pin 74b, and the fine resin particles are prevented from adhering to the resin molded article 10.

[0106] [Variations on the implementation method]

[0107] Figure 12 To indicate the direction from arrow B2 ( Figure 3 A side view showing the condition of the cleaner 80 and pressing mechanism 82 in a modified embodiment, corresponding to the embodiment. Figure 5 . Figure 13 To indicate the direction from arrow B1 ( Figure 3 A side view showing the condition of the cleaner 80 and pressing mechanism 82 in a modified embodiment, corresponding to the embodiment. Figure 6 .

[0108] like Figure 12 and Figure 13As shown, the pressing mechanism 83 may also include flat pressing members 85 and 87. The pressing members 85 and 87 may be used, for example, in addition to or in place of the pressing member 84 (brush) of the embodiment. The pressing members 85 and 87 are disposed on the sides of the cleaner 80 in the direction of arrow B2, which is orthogonal to the direction of arrow B1. Specifically, the pressing members 85 and 87 (flat-shaped) are disposed on both sides of the cleaner 80 in the direction of arrow B2, which is orthogonal to the direction of arrow B1, pressing the upper surface of the substrate 12 on both sides in the direction of arrow B2. Thus, by pressing the upper surfaces of the substrate 12 on both sides, the cleaner 80 can collect dust without tilting the resin molded article 10.

[0109] Pressing members 85 and 87 are formed, for example, of MC nylon (registered trademark) or Teflon (registered trademark). Pressing members 85 and 87 can apply appropriate pressing force to the resin molded article 10. During transport of the resin molded article 10, it can move while in contact with the pressing members 85 and 87, while the cleaner 80 continuously or intermittently collects dust from the resin molded article 10.

[0110] By pressing the resin molded article 10 with the pressing members 85 and 87, even if the resin molded article 10 is subjected to the suction force generated by the cleaner 80, displacement of the resin molded article 10 from the desired position on the mounting portion 77 is suppressed. The pressing members 85 and 87 can also be configured to press the portions of the resin molded article 10 that are not used as the final product. Therefore, the resin molded article 10 can be pressed without pressing the portions that become the final product, thus preventing damage or deformation to the portions that become the final product.

[0111] The embodiments of this disclosure have been described above, but should be considered illustrative and not limiting in all respects. The scope of this disclosure is defined by the claims and is intended to include all modifications within the meaning and scope equivalent to those claims.

Claims

1. A resin molding apparatus, comprising: Mold clamping mechanism; A molding die, comprising an upper die and a lower die facing the upper die, is driven by the mold-locking mechanism to mold an object to produce a resin molded article; A removal mechanism removes excess resin portions formed on the resin molded article from the resin molded article; A cleaner is used to collect dust from the surface of the resin molded article; as well as The pressing mechanism presses the resin molded article when the cleaner performs the dust collection process on the resin molded article. The cleaner performs dust collection on at least one of the resin molded articles before and after the removal mechanism removes the excess resin portion. The resin molding apparatus further includes a conveying pallet, which moves the resin molded article and the cleaner relative to each other along a first direction. The pressing mechanism includes a pressing member disposed to the side of the cleaner in a second direction orthogonal to the first direction. The removal mechanism includes: a mounting section for placing the resin molded article before the removal of the excess resin portion; A punch holder that can be raised and lowered; as well as The punch pin, by descending together with the punch holder, pushes off the excess resin portion of the resin molded article already disposed on the mounting portion. The tip of the punch pin is a conical shape that tapers towards the front. The cleaner collects dust on the surface of the resin molded article while the pressing mechanism is pressing the resin molded article.

2. The resin molding apparatus according to claim 1, wherein the pressing member is in the shape of a flat plate.

3. A resin molding apparatus, comprising: Mold clamping mechanism; A molding die, comprising an upper die and a lower die facing the upper die, is driven by the mold-locking mechanism to mold an object to produce a resin molded article; A removal mechanism removes excess resin portions formed on the resin molded article from the resin molded article; A cleaner is used to collect dust from the surface of the resin molded article; as well as The pressing mechanism presses the resin molded article when the cleaner performs the dust collection process on the resin molded article. The cleaner performs dust collection on at least one of the resin molded articles before and after the removal mechanism removes the excess resin portion. The resin molding apparatus further includes a conveying pallet, which moves the resin molded article and the cleaner relative to each other along a first direction. The pressing mechanism includes a pressing member disposed on one or both sides of the cleaner in the first direction. The removal mechanism includes: a mounting section for placing the resin molded article before the removal of the excess resin portion; A retractable punch holder; and The punch pin, by descending together with the punch holder, pushes off the excess resin portion of the resin molded article already disposed on the mounting portion. The tip of the punch pin is a conical shape that tapers towards the front. The cleaner collects dust on the surface of the resin molded article while the pressing mechanism is pressing the resin molded article.

4. The resin molding apparatus according to claim 3, wherein The cleaner collects dust from the mounting portion when the resin molded article is not placed on the mounting portion.

5. The resin molding apparatus according to claim 4, wherein... The pressing component has a brush shape.

6. The resin molding apparatus according to claim 5, wherein The pressing member cleans the mounting portion.

7. A method for manufacturing a resin molded article, comprising: In the molding process, a molding die, which includes an upper mold and a lower mold facing the upper mold, is driven by a mold-locking mechanism to mold the object to be molded and produce a resin molded article. The removal process involves removing excess resin from the resin molded article using a removal mechanism. as well as In the dust collection process, while the resin molded article is being pressed by a pressing mechanism, a cleaner collects dust from the surface of the resin molded article. The dust collection process is performed at least once, between the forming process and the removal process, and after the removal process. The resin molded article and the cleaner move relative to each other along a first direction via a conveying pallet. The pressing mechanism includes a pressing member disposed to the side of the cleaner in a second direction orthogonal to the first direction. The removal mechanism includes: a mounting section for placing the resin molded article before the removal of the excess resin portion; A punch holder that can be raised and lowered; as well as The punch pin moves up and down together with the punch holder. The tip of the punch pin is a conical shape that tapers towards the front. During the removal process, the punch pin descends together with the punch holder, pushing off the excess resin portion of the resin molded article that has been placed on the mounting portion.

8. A method for manufacturing a resin molded article, comprising: In the molding process, a molding die, which includes an upper mold and a lower mold facing the upper mold, is driven by a mold-locking mechanism to mold the object to be molded and produce a resin molded article. The removal process involves removing excess resin from the resin molded article using a removal mechanism. as well as In the dust collection process, while the resin molded article is being pressed by a pressing mechanism, a cleaner collects dust from the surface of the resin molded article. The dust collection process is performed at least once, between the forming process and the removal process, and after the removal process. The resin molded article and the cleaner move relative to each other along a first direction via a conveying pallet. The pressing mechanism includes a pressing member disposed on one or both sides of the cleaner in the first direction. The removal mechanism includes: a mounting section for placing the resin molded article before the removal of the excess resin portion; A retractable punch holder; and The punch pin moves up and down together with the punch holder. The tip of the punch pin is a conical shape that tapers towards the front. During the removal process, the punch pin descends together with the punch holder, pushing off the excess resin portion of the resin molded article that has been placed on the mounting portion.

Images