Manufacturing method of composite sealed vapor chamber and composite sealed vapor chamber

Abstract

The present application relates to the technical field of the uniform temperature plate and the manufacturing method, disclose a kind of manufacturing method of composite sealing type uniform temperature plate, including VC substrate, multiple first heat pipe and multiple second heat pipe, first heat pipe forms first pipe cavity, steps are as follows:(1), VC substrate is made using diffusion welding, VC substrate forms substrate cavity, and the operation temperature range of diffusion welding is 800 DEG C to 900 DEG C;(2), first heat pipe is welded in base side face using brazing, first pipe cavity is arranged in communication with substrate cavity, and the operation temperature range of brazing is 650 DEG C to 800 DEG C;(3), second heat pipe is welded in VC substrate using soldering, second heat pipe forms second pipe cavity, and second pipe cavity is in communication or barrier with substrate cavity;The operation temperature range of brazing is 250 DEG C to 350 DEG C;(4), vacuum degassing, sealing operation is carried out.Using diffusion welding, brazing and soldering composite processing manufacturing, perfect the manufacturing process of uniform temperature plate, improve the heat dissipation efficiency of uniform temperature plate and improve the heat dissipation effect.

Description

Technical Field

[0001] This invention patent relates to a method for manufacturing a heat exchanger and the technical field of heat exchangers, specifically to a method for manufacturing a composite sealed heat exchanger and the composite sealed heat exchanger itself. Background Technology

[0002] Computer hosts generate a lot of heat when they are working. If this heat is not dissipated in time, it can cause the computer to crash or even burn out the components of the host. Therefore, a heat sink is needed to dissipate heat from the internal components of the host.

[0003] The heat sink consists of heat dissipation fins and a heat spreader. Heat is conducted through the heat spreader, and then heat dissipation is achieved through the cooperation of the heat dissipation fins and the heat spreader.

[0004] To improve the heat dissipation efficiency of the vapor chamber and reduce its thermal resistance, a three-dimensional integrated heat sink is used. For example, the prior patent with publication number CN112254559A discloses a three-dimensional heat sink, comprising: a vapor chamber with a defined cavity inside, and an installation port communicating with the cavity on one side of the vapor chamber; a heat pipe with one end closed and the other end open, the open end of which is inserted into the installation port and communicates with the cavity; a first capillary structure disposed in the cavity and defining a capillary chamber inside, with a communication port communicating with the capillary chamber at a position corresponding to the installation port on the first capillary structure; a second capillary structure disposed on the heat pipe, with one end closed and the other end open, the open end of which is connected to the communication port and communicates with the capillary chamber, the second capillary structure being integrally formed with at least a portion of the heat pipe; and a degassing pipe communicating with the capillary chamber.

[0005] In the existing technology, heat pipes are assembled by plugging them in. When the working fluid undergoes a phase change, the airtightness is poor, which can easily lead to leakage of the working fluid and poor sealing of the heat spreader. Furthermore, existing heat sinks do not have composite manufacturing capabilities, resulting in poor heat dissipation efficiency. Summary of the Invention

[0006] The purpose of this invention is to provide a method for manufacturing a composite sealed heat exchanger and a composite sealed heat exchanger, in order to solve the problem that heat exchangers in the prior art do not have composite manufacturing capabilities.

[0007] This invention is achieved through a method for manufacturing a composite sealed heat spreader, comprising a VC substrate, multiple first heat pipes, and multiple second heat pipes, wherein a first cavity is formed inside the first heat pipe. The specific manufacturing steps are as follows:

[0008] (1) The VC substrate is integrally formed by diffusion soldering, and multiple substrate cavities are formed inside the VC substrate. The working temperature range of diffusion soldering is 800°C to 900°C.

[0009] (2) Each of the first heat pipes is brazed to the base side of the VC substrate, and the first pipe cavity is connected to the substrate cavity. The brazing operation temperature range is 650°C to 800°C.

[0010] (3) Each of the second heat pipes is soldered to the VC substrate by means of soldering. The interior of the second heat pipe forms a second cavity. The second cavity is either connected to or blocked from the substrate cavity. The working temperature range of the soldering is 250°C to 350°C.

[0011] (4) Vacuum degassing, and seal each of the first heat pipes and each of the second heat pipes.

[0012] Furthermore, the base side surface is formed on both sides of the VC substrate, and each of the first heat pipes is welded to one of the base side surface, and each of the second heat pipes is welded to the other base side surface; the first cavity and the second cavity are simultaneously arranged in communication with the substrate cavity.

[0013] Furthermore, the substrate cavities are arranged sequentially, with the first cavity, the substrate cavity, and the second cavity arranged in a one-to-one correspondence and connected manner.

[0014] Furthermore, each of the substrate cavities is arranged independently, or the substrate cavities are arranged in a connected manner.

[0015] Furthermore, a base surface is formed on the top of the VC substrate, and each of the second heat pipes is connected to the base surface by soldering.

[0016] Furthermore, each of the first heat pipes, the VC substrate, and each of the second heat pipes are integrally formed and arranged.

[0017] Furthermore, the operating temperature for diffusion soldering is 850℃, the operating temperature for brazing is 750℃, and the operating temperature for tin soldering is 300℃.

[0018] A composite sealed heat spreader includes a VC substrate, multiple first heat pipes, and multiple second heat pipes. Both the first and second heat pipes are filled with a working fluid. A base side is formed on the side of the VC substrate. The VC substrate has multiple substrate cavities, which are arranged at intervals and corresponding to each other. Each substrate cavity extends through the base side. The first heat pipes are butted together with and integrally arranged with the base side. A first cavity is formed inside each first heat pipe, and the first cavity is connected to the substrate cavity. The second heat pipes have connecting sections that are connected to the VC substrate.

[0019] Furthermore, the first heat pipe and the second heat pipe are arranged symmetrically along the VC substrate, and the first heat pipe and the pipe joint are respectively welded to the two sides of the substrate; or, the VC substrate includes a bottom substrate and a cover plate, the bottom substrate and the cover plate are integrally formed, and the cover plate and the VC substrate clamp and fix the pipe joint.

[0020] Furthermore, an assembly groove is formed on the top of the base plate, and a cover plate has a cover groove. Each of the pipe segments is arranged radially, and each of the pipe segments is simultaneously embedded in the assembly groove and the cover groove. The pipe segments are arranged in a square shape, and each pipe segment has a pipe joint surface and a pipe bottom surface. Adjacent pipe joint surfaces are arranged in a flat, abutting arrangement. Each of the pipe bottom plates is simultaneously arranged in a flat, abutting arrangement with the VC base plate.

[0021] Compared with existing technologies ， The method for manufacturing a composite sealed heat spreader provided by this invention first uses diffusion soldering to form a VC substrate, then brazes each first heat pipe to the substrate side, and finally solders each second heat pipe to the VC substrate. Since the operating temperature of brazing is much higher than that of soldering, the soldering of the second heat pipes does not affect the welding quality, preventing subsequent leakage of the working fluid and ensuring the heat spreader's airtightness, thus improving the yield rate. Furthermore, the combined processing of diffusion soldering, brazing, and soldering improves the heat spreader's manufacturing process and enhances its heat dissipation efficiency and effect. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the manufacturing process of the composite sealed temperature distribution plate provided by the present invention.

[0023] Figure 2 This is an exploded view of the heat pipe embodiment of the method for manufacturing the composite sealed heat spreader provided by the present invention.

[0024] Figure 3 This is an exploded perspective view of the heat pipe embodiment two of the manufacturing method of the composite sealed heat spreader provided by the present invention.

[0025] Figure 4 This is an exploded perspective view of different embodiments of the VC substrate of the composite sealed heat spreader provided by the present invention. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0027] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0028] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0029] Reference Figure 1-4 The image shows a preferred embodiment of the present invention.

[0030] The method for manufacturing a composite sealed heat spreader includes a VC substrate 1, multiple first heat pipes 2, and multiple second heat pipes 3. The interior of the first heat pipe 2 forms a first cavity. The specific manufacturing steps are as follows:

[0031] (1) The VC substrate 1 is integrally formed by diffusion soldering. Multiple substrate cavities 11 are formed inside the VC substrate 1. The working temperature range of diffusion soldering is 800℃ to 900℃.

[0032] (2) Each first heat pipe 2 is welded to the base side of the VC substrate 1 by brazing, and the first pipe cavity and the substrate cavity 11 are connected. The brazing operation temperature range is 650℃ to 800℃.

[0033] (3) Each second heat pipe 3 is soldered to the VC substrate 1 by means of soldering. The interior of the second heat pipe 3 forms a second cavity. The second cavity is connected to or blocked from the substrate cavity 11. The working temperature range of the soldering is 250°C to 350°C.

[0034] (4) Vacuum degassing, and seal each of the first heat pipe 2 and each of the second heat pipe 3.

[0035] The above-described method for manufacturing a composite sealed heat spreader involves first fabricating a VC substrate 1 using diffusion soldering, then brazing each of the first heat pipes 2 to the substrate side, and finally soldering each of the second heat pipes 3 to the VC substrate 1. Since the operating temperature of brazing is much higher than that of soldering, soldering the second heat pipes 3 does not affect the brazing quality, preventing subsequent leakage of the working fluid and ensuring the heat spreader's airtightness, thus improving the heat spreader's yield rate. Furthermore, the combined process of diffusion soldering, brazing, and soldering improves the heat spreader's manufacturing process and enhances its heat dissipation efficiency and effect.

[0036] Each of the first heat pipes 2, the VC substrate 1, and each of the second heat pipes 3 are integrally formed and arranged; this effectively ensures the airtightness of the heat spreader and facilitates vacuum degassing and capillary material filling operations.

[0037] The melting point temperature of diffusion soldering is 850℃, that of brazing is 750℃, and that of tin soldering is 300℃. In this way, the brazing operation does not affect the diffusion soldering, and the tin soldering does not affect the brazing or diffusion soldering, thus realizing the fabrication of a composite sealed heat spreader.

[0038] The melting point temperature of diffusion soldering is 800℃, that of brazing is 700℃, and that of tin soldering is 250℃. In this way, the brazing operation does not affect the diffusion soldering, and the tin soldering does not affect the brazing or diffusion soldering, thus realizing the fabrication of a composite sealed heat spreader.

[0039] The melting point temperature of diffusion soldering is 900℃, that of brazing is 800℃, and that of tin soldering is 350℃. In this way, the brazing operation does not affect the diffusion soldering, and the tin soldering does not affect the brazing or diffusion soldering, thus realizing the fabrication of a composite sealed heat spreader.

[0040] The melting point temperature of diffusion soldering is 800℃, that of brazing is 650℃, and that of tin soldering is 300℃. In this way, the brazing operation does not affect the diffusion soldering, and the tin soldering does not affect the brazing or diffusion soldering, thus realizing the fabrication of a composite sealed heat spreader.

[0041] The operating temperature for diffusion soldering is 850℃, for brazing it is 750℃, and for tin soldering it is 300℃; these temperatures result in better soldering results.

[0042] The method for manufacturing a composite sealed heat spreader includes a welding ring component, which is fitted with a first heat-conducting pipe 2. Step (1) involves processing the mating position between the first heat-conducting pipe 2 and the side base to form the welding ring component; the brazing includes welding operations using copper paste and silver paste.

[0043] In this way, by combining diffusion welding with brazing, the welding stability and sealing of the first heat pipe 2 and the VC substrate 1 are enhanced, the sealing effect is improved, and the working fluid leakage is effectively prevented. At the same time, the melting point temperature of brazing is much higher than that of tin soldering, so the subsequent welding operation of the second heat pipe 3 will not affect the brazing operation effect.

[0044] Example 1 of heat pipe:

[0045] Both sides of the VC substrate 1 are formed with base sides, and each first heat pipe 2 is welded to one base side, and each second heat pipe 3 is welded to the other base side; the first cavity and the second cavity are simultaneously connected to the substrate cavity 11; this achieves multi-path heat dissipation, facilitates heat dissipation, and at the same time facilitates heat exchange, thereby improving the heat dissipation effect.

[0046] Each substrate cavity 11 is arranged in sequence, and the first cavity, substrate cavity 11 and second cavity are arranged in a one-to-one correspondence and connected arrangement; this facilitates heat exchange and improves heat dissipation.

[0047] Each substrate cavity 11 is arranged independently, and heat is exchanged between the first cavity, the substrate cavity 11 and the second cavity to achieve heat dissipation. Furthermore, through the cooperation of multiple first cavities, multiple substrate cavities 11 and multiple second cavities, heat dissipation is achieved through multiple pathways, thereby improving heat dissipation efficiency and facilitating heat dissipation.

[0048] Alternatively, the substrate cavities 11 can be arranged in a connected manner, enabling heat exchange between the substrate cavities 11, which facilitates heat balance and accelerates heat dissipation efficiency and effectiveness.

[0049] Example 2 of heat pipe:

[0050] The top of the VC substrate 1 forms a base surface, and each of the second heat pipes 3 is connected to the base surface by soldering; thus, the welding of each of the second heat pipes 3 is realized; and the first heat pipe 2 and the second heat pipe 3 dissipate heat independently, realizing heat dissipation through multiple paths, improving heat dissipation efficiency, and facilitating heat dissipation.

[0051] A composite sealed heat spreader includes a VC substrate 1, multiple first heat pipes 2 and multiple second heat pipes 3. The first heat pipes 2 and the second heat pipes 3 are filled with working fluid. The side of the VC substrate 1 forms a base side surface. The VC substrate 1 has multiple substrate cavities 11, which are arranged at intervals and corresponding to each other. The substrate cavities 11 penetrate the base side surface. The first heat pipes 2 are connected to the base side surface and are integrally arranged. The interior of the first heat pipe 2 forms a first cavity, which is connected to the substrate cavity 11. The second heat pipe 3 has a pipe joint section 31, which is connected to the VC substrate 1.

[0052] In the aforementioned composite sealed heat spreader, during heat dissipation, the working fluid in the VC substrate 1 is heated and vaporized, flowing to the first heat pipe 2 and the second heat pipe 3. The working fluid is then cooled by heat dissipation and turns back into liquid, flowing back to the VC substrate 1. This cycle achieves the absorption and dissipation of heat from the heat source. Since each of the first heat pipes 2 is integrated with the VC substrate 1, it facilitates the vaporization and heat dissipation of the working fluid and its liquefaction and return, effectively reducing working fluid leakage. During the fabrication of the heat spreader, the first heat pipes 2 and the second heat pipes 3 are assembled in different positions with the VC substrate 1, and their welding melting points differ greatly. Therefore, welding each of the first heat pipes 2 first and then welding each of the second heat pipes 3 will not cause leakage of the working fluid in the first heat pipes 2, ensuring the pass rate of the heat spreader fabrication and realizing the fabrication of the composite sealed heat spreader.

[0053] The first heat pipe 2 and the second heat pipe 3 are arranged symmetrically along the VC substrate 1. The first heat pipe 2 and the pipe joint 31 are respectively welded to the two base sides; to achieve multi-path heat dissipation, facilitate heat dissipation, and at the same time facilitate heat exchange, thereby improving the heat dissipation effect.

[0054] Meanwhile, the first heat pipe 2 and the second heat pipe 3 are arranged in a connected manner along the VC substrate 1; this facilitates heat exchange and improves heat dissipation.

[0055] Alternatively, the VC substrate 1 includes a bottom substrate 12 and a cover plate 13, which are integrally formed and arranged. The cover plate 13 and the VC substrate 1 clamp and fix the pipe connection section 31. The first heat pipe 2 and the second heat pipe 3 dissipate heat independently, realizing heat dissipation through multiple paths, improving heat dissipation efficiency, and facilitating heat dissipation.

[0056] The top of the base plate 12 forms an assembly groove, the cover plate 13 has a cover groove, and each pipe segment 31 is arranged in a radial direction, and each pipe segment 31 is simultaneously embedded in the assembly groove and the cover groove; in this way, the welding of each second heat conduction pipe 3 is realized through the cooperation of a single assembly groove and a single cover groove.

[0057] The pipe joint section 31 is arranged in a square shape. The pipe joint section 31 has a pipe joint surface and a pipe bottom surface. Adjacent pipe joint surfaces are arranged in a flat, contacting arrangement. Each pipe bottom plate is arranged in a flat, contacting arrangement with the VC substrate 1.

[0058] In this way, the contact area between adjacent second heat pipes 3 is increased by the action of the pipe joint surface, which facilitates heat exchange, thereby facilitating heat transfer and dissipation and improving the heat dissipation effect; the contact area between the pipe joint section 31 and the VC substrate 1 is increased by the action of the bottom surface of each pipe, which facilitates the absorption of heat from the VC substrate 1 by the pipe joint section 31, improves the heat transfer effect, and thus improves the heat dissipation effect.

[0059] Multiple assembly slots are formed on the top of the VC substrate 1, and the cover plate 13 has multiple cover slots. Each cover slot is arranged in a one-to-one correspondence with each assembly slot. The pipe connection section 31 is simultaneously embedded in the assembly slot and the cover slot. Under the cooperation of the assembly slot and the cover slot, the welding of each second heat conduction pipe 3 is realized.

[0060] Along the direction away from the cover plate 13, the assembly groove is arranged in a concave arc shape. Along the direction away from the VC substrate 1, the cover groove is arranged in an upward concave arc shape. The pipe connection section 31 is arranged in a cylindrical shape. The assembly groove has a plate groove wall, and the cover groove has a cover groove wall. The plate groove wall and the cover groove wall are arranged in arc shapes respectively, and the plate groove wall and the cover groove wall are arranged in a flat shape to clamp the pipe connection section 31.

[0061] The advantage of this design is that it increases the contact area between the pipe section 31 and the assembly groove and the cover groove, improves the welding stability of the second heat pipe 3, and increases the heat conduction range and area, thereby improving the heat dissipation effect.

[0062] The first heat pipe 2 has a first capillary layer inside, and the substrate cavity 11 has a plate capillary layer. The first capillary layer and the plate capillary layer are integrally formed and arranged. In this way, the thermal resistance between the first capillary layer and the plate capillary layer is reduced, which facilitates heat conduction and improves the heat conduction effect. It also facilitates heat dissipation and improves the heat dissipation effect. At the same time, it facilitates the reflux of liquefied chemical substances.

[0063] Along the radial direction of the substrate cavity 11, each substrate cavity 11 is arranged at intervals, and each first heat pipe 2 is arranged in a one-to-one correspondence with each substrate cavity 11. The working fluid is heated and vaporized, flows through the substrate cavity 11 to the first heat pipe 2, and then dissipates heat through the first heat pipe 2 to achieve cooling and heat dissipation. After cooling, the working fluid turns into a liquid and flows back to the substrate cavity 11 of the VC substrate 1, where it absorbs heat and vaporizes again. This cycle is repeated to achieve heat dissipation.

[0064] Along the axial direction of the first heat pipe 2, the substrate cavity 11 extends in a long strip shape and extends to the end of the VC substrate 1; this makes the lateral range occupied by the substrate cavity 11 larger, increasing the range of heat absorption and improving the heat absorption effect.

[0065] Along the radial direction of the first heat pipe 2, adjacent first heat pipes 2 are arranged in a sequentially abutting arrangement; the first heat pipe 2 has a side pipe surface, and adjacent side pipe surfaces are arranged in a flat abutting arrangement.

[0066] This increases the contact area between adjacent first heat pipes 2, facilitating heat exchange, thereby improving heat transfer and dissipation and enhancing heat dissipation.

[0067] The second heat pipe 3 has a second capillary layer inside, which is integrally formed with the plate capillary layer. This reduces the thermal resistance between the second capillary layer and the plate capillary layer, facilitates heat conduction, and thus improves the heat conduction effect and heat dissipation. At the same time, it facilitates the reflux of liquefied chemical substances.

[0068] Along the radial direction of the substrate cavity 11, each substrate cavity 11 is arranged at intervals, and each second heat pipe 3 is arranged in a one-to-one correspondence with each substrate cavity 11. The working fluid is heated and vaporized, flows through the substrate cavity 11 to the second heat pipe 3, and then dissipates heat through the second heat pipe 3 to achieve cooling and heat dissipation. After cooling, the working fluid turns into a liquid and flows back to the substrate cavity 11 of the VC substrate 1, where it absorbs heat and vaporizes again. This cycle is repeated to achieve heat dissipation.

[0069] Along the axial direction of the second heat pipe 3, the substrate cavity 11 extends in a long strip shape and extends to the end of the VC substrate 1; this makes the lateral range occupied by the substrate cavity 11 larger, increasing the range of heat absorption and improving the heat absorption effect.

[0070] Along the radial direction of the second heat pipe 3, adjacent second heat pipes 3 are arranged in a sequentially abutting arrangement; the second heat pipe 3 has a side pipe surface, and adjacent side pipe surfaces are arranged in a flat abutting arrangement.

[0071] This increases the contact area between adjacent second heat pipes 3, facilitating heat exchange and thus improving heat transfer and dissipation, thereby enhancing the heat dissipation effect.

[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method of manufacturing a composite sealed vapor chamber, characterized by, The application relates to a composite sealed heat-dissipating plate manufacturing method, which comprises a VC substrate, a plurality of first heat-conducting pipes and a plurality of second heat-conducting pipes. (1) the VC substrate is integrally formed by diffusion welding, and a plurality of substrate cavities are formed in the VC substrate, and the working temperature range of diffusion welding is 800-900 DEG C; (2) each first heat-conducting pipe is welded to the base side of the VC substrate by brazing, and the first pipe cavity is in communication with the substrate cavity, and the working temperature range of brazing is 650-800 DEG C; (3) each second heat-conducting pipe is welded to the VC substrate by tin soldering, the second heat-conducting pipe has a second pipe cavity, and the second pipe cavity is in communication with the substrate cavity; and the working temperature range of tin soldering is 250-350 DEG C; (4) vacuum degassing and sealing of each first heat-conducting pipe and each second heat-conducting pipe.

2. The method of claim 1, wherein Both sides of the VC substrate form the base side, each first heat-conducting pipe is welded to one of the base sides, and each second heat-conducting pipe is welded to the other base side; the first pipe cavity and the second pipe cavity are in communication with the substrate cavity.

3. The method of claim 2, wherein Each substrate cavity is arranged in sequence, and the first pipe cavity, the substrate cavity and the second pipe cavity are arranged in one-to-one correspondence and in communication.

4. The method of claim 3, wherein Each substrate cavity is independently arranged, or each substrate cavity is arranged in communication.

5. The method of claim 1-4, wherein The working temperature of diffusion welding is 850 DEG C, the working temperature of brazing is 750 DEG C, and the working temperature of tin soldering is 300 DEG C.

6. A composite sealed vapor chamber, characterized by, The application relates to a composite sealed heat-dissipating plate manufacturing method, which comprises a VC substrate, a plurality of first heat-conducting pipes and a plurality of second heat-conducting pipes.

7. The composite sealed vapor chamber of claim 6, wherein, The first heat-conducting pipe and the second heat-conducting pipe are filled with working medium, the side of the VC substrate forms a base side, the VC substrate has a plurality of substrate cavities, each substrate cavity is arranged in correspondence, the substrate cavity penetrates the base side, the first heat-conducting pipe is in butt joint and integrated arrangement with the base side, the first heat-conducting pipe has a first pipe cavity, and the first pipe cavity is in communication with the substrate cavity; and the second heat-conducting pipe has a pipe joint section, and the pipe joint section is connected with the VC substrate.

8. The composite sealed vapor chamber of claim 7, wherein, The first heat-conducting pipe and the second heat-conducting pipe are symmetrically arranged along the VC substrate, and the first heat-conducting pipe and the pipe joint section are welded to two base sides. The VC substrate comprises a bottom substrate and a cover plate, the bottom substrate and the cover plate are integrally formed, the cover plate and the bottom substrate clamp and fix the pipe joint section, the top of the bottom substrate forms an assembly groove, the cover plate has a cover groove, each pipe joint section is arranged in the radial direction, and each pipe joint section is synchronously embedded in the assembly groove and the cover groove; the pipe joint section is in square arrangement, the pipe joint section has a pipe joint surface and a pipe bottom surface, and adjacent pipe joint surfaces are in flat contact arrangement; each pipe bottom surface is synchronously in flat contact with the VC substrate.

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