A method of ceramic polishing

Abstract

The embodiment of the application provides a ceramic polishing method, comprising: arranging a clamping piece on one side of a cover plate, placing a ceramic in a clamping groove in the clamping piece, clamping the ceramic through a pin piece, thereby clamping the ceramic; arranging the clamping piece clamping the ceramic in a through hole in a rotating piece, and arranging the outer diameter of the clamping piece to be smaller than the inner diameter of the through hole, thereby making the ceramic abut against a working surface on a base plate; abutting or fixedly connecting the side of the cover plate opposite to the clamping piece with a rotating head, thereby making the rotating head drive the cover plate to rotate; wherein, a preset gap is arranged between the cover plate and the side of the rotating piece facing the cover plate before polishing, and the outer diameter of the cover plate is arranged to be larger than the inner diameter of the through hole, so that the ceramic abuts against the working surface; after polishing, the cover plate abuts against the rotating piece, and the side of the rotating piece facing the cover plate rotates relative to the base plate driven by the cover plate, so that the ceramic abuts against the working surface.

Description

TECHNICAL FIELD

[0001] The present specification belongs to the technical field of ceramic polishing, and particularly relates to a ceramic polishing method. BACKGROUND

[0002] In the prior art, for the polishing of ceramics, the control of the grinding machine depends on manual operation. Generally, the staff needs to monitor the grinding machine. At the same time, the staff also needs to control the polishing of the grinding machine to obtain the polished ceramics. Manual monitoring and manual operation cannot meet the requirements of ceramic polishing accuracy, and the long-time work of the staff will greatly increase the probability of errors, further increasing the scrap rate.

[0003] At present, no effective solution has been proposed for the above problems.

[0004] It should be noted that the above introduction to the technical background is only to facilitate the clear and complete description of the technical scheme of the present application, and to facilitate the understanding of those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art only because it is described in the background section of the present application. SUMMARY

[0005] The present specification aims to provide a ceramic polishing method to solve the above problems.

[0006] The ceramic polishing method provided by the present specification comprises:

[0007] A clamping member is arranged on one side of the cover plate, the ceramic is placed in a clamping groove in the clamping member, and the ceramic is clamped by the pin member, so as to clamp the ceramic;

[0008] The clamping member clamping the ceramic is arranged in a through hole in the rotating member, and the outer diameter of the clamping member is arranged to be smaller than the inner diameter of the through hole, so that the ceramic is in contact with the working surface on the bottom plate;

[0009] The side of the cover plate opposite to the clamping member is in contact with or fixedly connected to the rotating head, so that the rotating head drives the cover plate to rotate;

[0010] Wherein, before the ceramic is polished, a predetermined gap is arranged between the cover plate and the side of the rotating member facing the cover plate, and the outer diameter of the cover plate is arranged to be larger than the inner diameter of the through hole, so that the ceramic is in contact with the working surface;

[0011] When the ceramic polishing is completed, the cover plate and the rotating member are in contact, and the side of the cover plate facing the rotating member is rotated relative to the bottom plate.

[0012] Preferably, before the ceramic is polished, the ceramic has a protruding part beyond the end wall of the clamping groove towards the direction where the bottom plate is located, the protruding part is arranged as a polishing height, and the polishing height is equal to the preset gap.

[0013] Preferably, before the ceramic is polished, the ceramic has a protruding part beyond the end wall of the clamping groove towards the direction where the bottom plate is located, the protruding part is arranged as a polishing height, and the polishing height is greater than the preset gap.

[0014] Preferably, during the abutting connection of the rotating head and the cover plate, a groove is arranged at the middle position of the side of the cover plate close to the rotating head, and the inner wall of the groove abuts against the rotating head.

[0015] Preferably, the rotating head is provided with an elastic gap, and the height of the elastic gap is equal to the height of the preset gap.

[0016] Preferably, the base is further provided with a mounting groove, and the bottom plate is mounted at the middle position or close to the edge of the bottom wall of the mounting groove, so as to fix the bottom plate.

[0017] Preferably, a stepped part is arranged close to the side wall of the mounting groove, a retaining ring is arranged on the stepped part, the rotating member and the cover plate are mounted in the retaining ring, and a gap is arranged between the inner wall of the retaining ring and the outer wall of the rotating member and the outer wall of the cover plate, so as to protect the rotating member and the cover plate.

[0018] Preferably, the clamping member is provided with a plurality of clamping heads for fixing the ceramic.

[0019] Preferably, water inlets are arranged at the middle positions of the base and the bottom plate, and a plurality of drainage grooves are arranged at intervals on the side of the rotating member close to the bottom plate, so as to drain and discharge the cooling liquid.

[0020] Compared with the prior art, the present application has the following beneficial effects:

[0021] 1. In the present application, the rotating member is arranged between the cover plate and the bottom plate. After the polishing of the ceramic is completed by the cover plate driving the clamping member, the cover plate abuts against the rotating member, and the side of the rotating member close to the cover plate is driven by the cover plate to rotate, so that the cover plate only rotates and cannot move towards the bottom plate to abut against the working surface of the ceramic, thereby ending the polishing of the ceramic.

[0022] 2. In the present application, the polishing of the ceramic is divided into two specific polishing processes, thereby significantly improving the polishing accuracy of the ceramic.

[0023] 3、The present application sets up the swivel head on the side of the cover plate far away from the cover plate, the swivel head is provided with the elastic gap, is in the compression state when polishing the ceramic, and when the polishing is completed, the compression of the swivel head restores, so that the swivel head can not exert force on the cover plate, and then the cover plate can not make the ceramic and the working surface resist, avoiding the error of manual work.

[0024] 4、The present application sets up the recess in the middle position of the side of the cover plate far away from the bottom plate, and the inner wall of the recess and the swivel head resist, so that the swivel head is convenient to drive the cover plate to rotate and separate from the cover plate.

[0025] 5、The present application sets up the base, the middle position of the base is recessed to form the mounting groove, the bottom plate is fixedly installed on the bottom wall of the mounting groove, and the bottom plate is installed at the middle position or the position close to the edge on the bottom wall, so as to increase the area of the ceramic polishing.

[0026] 6、The present application sets up the step part in the mounting groove, the stop ring is installed on the side of the rotating part towards the step part, and the rotating part and the cover plate are arranged in the stop ring, and the rotating part and the cover plate are protected by the stop ring. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments in the present specification, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0028] Figure 1 It is the overall structure of the ceramic grinding device provided by the embodiment of the present specification;

[0029] Figure 2 It is the base structure of the ceramic grinding device provided by the embodiment of the present specification;

[0030] Figure 3 It is the bottom plate installation structure of the ceramic grinding device provided by the embodiment of the present specification;

[0031] Figure 4 It is the stop ring structure of the ceramic grinding device provided by the embodiment of the present specification;

[0032] Figure 5 It is the internal structure of the ceramic grinding device provided by the embodiment of the present specification;

[0033] Figure 6 It is the section view of the ceramic grinding device provided by the embodiment of the present specification;

[0034] Figure 7A clamping piece structure of a ceramic grinding device is provided in the embodiments of the present application.

[0035] Figure 8 A collet structure of a ceramic grinding device is provided in the embodiments of the present application.

[0036] Figure 9 A rotating piece structure of a ceramic grinding device is provided in the embodiments of the present application.

[0037] Figure 10 A whole structure of a ceramic grinding device is provided in the embodiments of the present application.

[0038] In the figure, 1 is a bottom plate, 11 is a working surface, 2 is a cover plate, 21 is a clamping piece, 22 is a groove, 3 is a rotating piece, 31 is a through hole, 32 is a first rotating plate, 33 is a second rotating plate, 34 is a rolling body, 4 is a rotating head, 5 is a base, 51 is a mounting groove, 52 is a step portion, and 6 is a retaining ring. DETAILED DESCRIPTION

[0039] In order for those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present application.

[0040] In the description of the present application, it should be noted that the terms "upper", "middle", "lower", "inner", "outer", "front", "rear" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or components referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. The embodiments will be described below according to the overall structure of the present application.

[0041] Referring to Figure 1 The present application provides a ceramic grinding method, which comprises the following steps:

[0042] A clamping piece 21 is arranged on one side of the cover plate 2, the ceramic is placed in the clamping groove in the clamping piece 21, and clamping is performed through the pin, so that the ceramic is clamped;

[0043] The clamping member 21 for clamping the ceramic is inserted into the through hole 31 in the rotating member 3, and the outer diameter of the clamping member 21 is set to be smaller than the inner diameter of the through hole 31, so that the ceramic comes into contact with the working surface 11 on the base plate 1.

[0044] The side of the cover plate 2 opposite to the clamping member 21 is connected to or fixedly connected to the rotating head 4, so that the rotating head 4 drives the cover plate 2 to rotate.

[0045] Before polishing, a preset gap is provided between the cover plate 2 and the rotating part 3 on the side facing the cover plate, and the outer diameter of the cover plate 2 is set to be larger than the inner diameter of the through hole 31, so that the ceramic and the working surface 11 remain in contact.

[0046] When the ceramic polishing is completed, the cover plate 2 abuts against the rotating part 3, and the cover plate 2 drives the rotating part 3 to rotate relative to the base plate 1 towards one side of the cover plate 2, so that the ceramic comes into contact with the working surface 11.

[0047] See Figure 5 and Figure 6 A cover plate 2 is provided on the side of the cover plate 2 near the working surface 11 on the base plate 1, and a working gap is provided between the cover plate 2 and the base plate 1. A clamping member 21 is provided on the side of the cover plate 2 facing the working surface 11, and the clamping member 21 can be used to clamp the ceramic. A contact or fixed connection is provided on the side of the cover plate 2 away from the working surface to the rotating head 4.

[0048] In other words, when the rotating head 4 rotates, it can drive the cover plate 2 to rotate. When the cover plate 2 rotates, it can drive the clamped ceramic to rotate through the clamping member 21. The ceramic comes into contact with the working surface 11, and after rotation, it can be polished.

[0049] A through hole 31 is provided at the middle position of the rotating component 3. According to... Figure 9 A base plate 1 and a cover plate 2 are respectively provided on both sides of the rotating component 3, and the base plate 1 contacts the side of the rotating component 3 facing the base plate 1. In the above embodiment of this application, the cover plate 2 clamps the ceramic by a clamping member. One end of the ceramic is inserted into the through hole 31 of the rotating component 3, so that the ceramic can abut against the working surface 11 on the base plate 1 on the other side of the rotating component 3.

[0050] In this application, the ceramic is fixed to one side of the cover plate 2 by a clamping member 21. The clamping member is then inserted into the through hole 31 of the rotating member 3, allowing it to contact the working surface of the base plate 1, which is in contact with the rotating member 3 on the side opposite to the cover plate 2. A rotating head 4 is provided on the cover plate 2 on the side opposite to the clamping member 21. The rotating head 4 is in contact with or fixedly connected to the cover plate 2 and can rotate. When the rotating head 4 rotates, it drives the cover plate 2 to rotate, causing the clamping member 21 to rotate the ceramic. The ceramic contacts the working surface 11, and as the ceramic rotates, it can slide relative to the working surface 11 for polishing.

[0051] In the above polishing process, it is worth noting that the outer diameter of the clamping member 21 is smaller than the inner diameter of the through hole 31. The clamping member 21 is driven to rotate by the cover plate 2. In the normal operation of the person skilled in the art, the outer diameter of the clamping member 21 is smaller than the inner diameter of the through hole 31, so that the clamping member 21 can avoid scratching the inner wall of the through hole 31 when rotating.

[0052] Further, in the process of polishing the ceramic, a predetermined gap is provided between the cover plate 2 and the side of the rotating member 3 facing the cover plate 2 before polishing. After polishing, the cover plate 2 and the side of the rotating member 3 facing the cover plate 2 are in contact. The cover plate 2 and the rotating member 3 are in contact, so that the side of the rotating member 3 facing the cover plate 2 can rotate relative to the bottom plate 1. That is, the outer diameter of the cover plate 2 is greater than the inner diameter of the through hole 31 of the rotating member 3.

[0053] Through the above polishing process, it can be understood that when the ceramic is clamped by the clamping member 21 and the ceramic is in contact with the working surface 11, the part of the ceramic that needs to be polished will support the clamping member 21 and the cover plate 2, thereby forming a predetermined gap. In the process of polishing the part of the ceramic that needs to be polished, the predetermined gap gradually decreases linearly until the predetermined gap is 0. That is, the cover plate 2 and the rotating member 3 are in contact.

[0054] In the above polishing process, there is a predetermined gap between the cover plate 2 and the rotating member 3 during polishing. In the process of polishing the ceramic, the predetermined gap gradually decreases until the cover plate 2 and the rotating member 3 are in contact.

[0055] It can be understood that when the predetermined gap decreases to 0, the polishing is completed. At this time, the cover plate 2 continues to rotate, and the cover plate 2 is in contact with the rotating member 3 and drives the side of the rotating member 3 facing the cover plate 2 to rotate relative to the bottom plate. The ceramic is in contact with the working surface 11.

[0056] It can be understood that the sound emitted when the side of the rotating member 3 facing the cover plate 2 rotates is obviously different from the sound emitted when polishing the ceramic. The person skilled in the art can simply judge whether the ceramic is polished according to the sound emitted by the device when polishing the ceramic.

[0057] In an embodiment of the present application, the bottom plate 1 and the cover plate 2 are arranged on opposite sides of the rotating member 3. The side of the rotating member 3 facing the bottom plate 1 is in contact with the bottom plate 1, and the side of the rotating member 3 facing the cover plate 2 can rotate relative to the bottom plate 1. Preferably, the rotating member 3 has a first rotating plate 32 in contact with the bottom plate 1, and a second rotating plate 33 close to the cover plate, and a rolling body 34 is arranged between the first rotating plate 32 and the second rotating plate 33, for enabling the first rotating plate 32 to rotate relative to the second rotating plate 33.

[0058] In the embodiment, the rotating member 3 is provided with a first rotating plate 32, a rolling body 34 and a second rotating plate 33 in sequence from the bottom plate 1 to the cover plate 2. Figure 4 As can be seen, the first rotating plate 32 is in contact with the bottom plate 1, and the second rotating plate 33 is close to the cover plate. The first rotating plate 32, the rolling body 34 and the second rotating plate 33 are in contact with each other. The second rotating plate 33 can rotate relative to the first rotating plate 32 through the rolling body 34.

[0059] Through the above structure, after the ceramic is polished, the cover plate 2 is in contact with the second rotating plate 33, and the cover plate drives the second rotating plate 33 to rotate. During the polishing process, the first rotating plate 32 always remains in contact with the bottom plate 1.

[0060] During the polishing process of the ceramic, cooling and debris removal are also required. Water inlets are arranged at the middle positions of the base 5 and the bottom plate 1, and a plurality of drainage grooves are arranged at intervals on the side of the rotating member 3 facing the bottom plate 1, for draining and discharging the cooling liquid. Specifically, the cooling liquid is drained onto the working surface 11. Further, in another embodiment of the present application, the side of the rotating member 3 facing the bottom plate 1 is in contact with the bottom plate 1. In this embodiment, the side of the rotating member 3 facing the bottom plate 1 is in contact with the bottom plate 1 while also having drainage grooves. Those skilled in the art will arrange the drainage grooves at intervals on the side of the rotating member 3 facing the bottom plate 1.

[0061] Through the above structure, after the cooling liquid is drained through the water inlet, the cooling liquid can be discharged from the drainage grooves. The flow of the cooling liquid can cool the ceramic during polishing and remove debris and other impurities, thereby further improving the accuracy of ceramic polishing.

[0062] Preferably, before the ceramic is polished, the ceramic has a protruding portion beyond the end wall of the clamping groove in the direction of the bottom plate 1. The protruding portion is set as the polishing height, and the polishing height is equal to the predetermined gap.

[0063] That is, after the ceramic is polished, the side of the ceramic facing the bottom plate 1 is in the same plane as the side of the clamping member 21 facing the bottom plate 1. In this embodiment, the side wall of the clamping member 21 limits the ceramic from being further polished, that is, the polishing accuracy of the ceramic is optimized through the arrangement of the device. The above arrangement can effectively improve the polishing accuracy compared to manual operation in general cases.

[0064] In another embodiment, for the arrangement of the ceramic and the clamping groove, preferably, before the ceramic is polished, the ceramic has a protruding portion beyond the end wall of the clamping groove in the direction of the bottom plate, the protruding portion is arranged as a polishing height, the polishing height is greater than the preset gap. That is, in this embodiment, after the ceramic is polished, the ceramic still has a protruding portion relative to the end side of the clamping groove, which does not interfere with the working surface 11. That is, the protruding portion does not affect the polishing accuracy of the ceramic.

[0065] In the above, the protruding portion of the ceramic relative to the end side of the clamping groove does not affect the polishing accuracy of the ceramic because, in this embodiment, after the ceramic is polished, the cover plate 2 interferes with the rotating member 3. The rotating member 3 can block and limit the cover plate 2.

[0066] Preferably, during the interference connection of the rotating head 4 and the cover plate 2, a groove is arranged at the middle position of the side of the cover plate close to the rotating head, and the inner wall of the groove interferes with the rotating head 4. Please refer to Figure 6 By arranging the groove on the cover plate 2 to interfere with the rotating head 4, the contact area of the cover plate 2 and the rotating head 4 can be increased to prevent the rotating head 4 from slipping during rotation, and the rotating head 4 is also convenient to remove.

[0067] In another embodiment, preferably, the rotating head 4 is arranged with an elastic gap, and the height of the elastic gap is equal to the height of the preset gap. In this embodiment, the rotating head 4 is compressed before the ceramic is polished, and the rotating head 4 is tightly interfered with the cover plate. During the polishing of the ceramic, the rotating head 4 gradually rebounds, and at the same time, the preset gap is gradually reduced. The change amount of the two is the same. When the polishing of the ceramic is completed, the preset gap is reduced to 0, the cover plate 2 interferes with the rotating member 3, and the compression of the rotating head 4 is completely restored.

[0068] According to the above mechanism and polishing process, after the polishing of the ceramic is completed, the compression of the rotating head 4 is completely restored, so that the rotating head 4 cannot continue to press the cover plate 2, thereby making the polishing process of the ceramic more controllable and significantly improving the polishing accuracy of the ceramic. It is worth noting that the height of the part to be polished of the ceramic determines the height of the preset gap, and the height of the elastic gap can be adjusted by the person skilled in the art according to the height of the preset gap.

[0069] During the installation of the bottom plate, preferably, a base 5 is further included, an installation groove 51 is formed on the base 5, and the bottom plate 1 is installed at the middle position or close to the edge of the bottom wall of the installation groove 51 to fix the bottom plate 1. That is, the bottom plate 1 can adjust the installation position according to the polishing requirements of the ceramic, so that the flexibility of the device when polishing the ceramic is higher. Preferably, the bottom plate 1 is made of diamond.

[0070] Preferably, a step part is arranged at the position close to the side wall of the mounting groove, a retaining ring is arranged on the step part, the rotating member and the cover plate are arranged in the retaining ring, and a gap is arranged between the inner wall of the retaining ring and the outer wall of the rotating member and the cover plate, so as to protect the rotating member and the cover plate. Figure 1 The retaining ring 6 is arranged on the base 5, and the rotating member 3 and the cover plate 2 are arranged in the retaining ring 6 and have a gap with the inner wall of the retaining ring 6.

[0071] Through the above structure, the retaining ring 6 can limit the rotating member 3 and the cover plate 2, and meanwhile, avoid the sundries entering between the rotating member 3 and the cover plate 2, so as to effectively avoid the influence of the sundries on the precision of the ceramic polishing.

[0072] Preferably, the clamping member is provided with a plurality of clamping heads for fixing the ceramics. In the embodiment, the clamping member 21 is provided with a plurality of clamping heads, so as to process a plurality of ceramics. The fixing groove and the fastening pin can make the clamping of the ceramics more stable.

[0073] Although the different specific embodiments are mentioned in the content of the present application, the present application is not limited to the cases described by the embodiments, and some embodiments described by the industry standards or the embodiments described by the custom way or the embodiments slightly modified on the basis of the implementation of the embodiments can also achieve the same, equivalent or similar or modified expected implementation effects of the above embodiments. The embodiments of the application of the modified or modified data acquisition, processing, output, judgment and other methods still belong to the scope of the optional embodiments of the present application.

[0074] Although the present application is described by the embodiments, those skilled in the art know that there are many modifications and changes of the present application without departing from the spirit of the present application, and it is hoped that the attached embodiments include these modifications and changes without departing from the present application.

Claims

1. A method of ceramic polishing, characterized by, include: A clamping element is provided on one side of the cover plate. The ceramic is placed in the clamping groove of the clamping element and clamped by a pin, thereby holding the ceramic. The clamping member that clamps the ceramic passes through the through hole in the rotating member, and the outer diameter of the clamping member is set to be smaller than the inner diameter of the through hole, so that the ceramic abuts against the working surface on the base plate. The side of the cover plate opposite to the clamping member is connected to or fixedly connected to the rotating head, thereby causing the rotating head to drive the cover plate to rotate. Before the ceramic is polished, a preset gap is provided between the cover plate and the side of the rotating component facing the cover plate, and the outer diameter of the cover plate is set to be larger than the inner diameter of the through hole, so that the ceramic and the working surface remain in contact. When the ceramic polishing is completed, the cover plate abuts against the rotating component, and the cover plate drives the rotating component to rotate relative to the base plate towards one side of the cover plate.

2. The method of claim 1, wherein, Before the ceramic is polished, the ceramic has a protruding portion that extends beyond the end wall of the clamping groove in the direction of the base plate. The protruding portion is set as the polishing height, and the polishing height is equal to the preset gap.

3. The method of claim 1, wherein, Before the ceramic is polished, the ceramic has a protruding portion that extends beyond the end wall of the clamping groove in the direction of the base plate. The protruding portion is set as the polishing height, which is greater than the preset gap.

4. The method of claim 1, wherein, During the process of the rotating head abutting against the cover plate, a groove is provided in the middle position on the side of the cover plate near the rotating head, and the inner wall of the groove abuts against the rotating head.

5. The method of claim 1, wherein, The rotating head is provided with an elastic gap, the height of which is equal to the height of the preset gap.

6. The method of claim 1, wherein, It also includes a base, on which an installation groove is formed, and the base plate is installed in the middle position or near the edge of the bottom wall of the installation groove, thereby fixing the base plate.

7. The method of claim 6, wherein the ceramic is a ceramic abrasive. A step is provided near the side wall of the mounting groove, and a retaining ring is provided on the step. The rotating part and the cover plate are installed in the retaining ring. A gap is provided between the inner wall of the retaining ring and the outer wall of the rotating part and the outer wall of the cover plate, thereby protecting the rotating part and the cover plate.

8. The method of claim 1, wherein, The clamping component is equipped with multiple clamps for fixing the ceramic.

9. The method of claim 1, wherein, The base plate is made of diamond.

10. The method of claim 6, wherein, Water inlets are provided at the middle positions of the base and the bottom plate, and multiple drainage grooves are provided at intervals on the side of the rotating component facing the bottom plate to drain coolant.

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