A drilling device for processing an outline of an integrated circuit (IC) carrier board and a drilling method thereof

Abstract

The application relates to the technical field of intelligent basic manufacturing equipment, in particular to a drilling device for integrated circuit (IC) carrier plate contour processing and a drilling method thereof. The drilling device comprises a base, a side plate fixed on the top of the base, and a supporting frame fixed on the top of the base in a symmetrical mode. The drilling device further comprises two mounting frames fixed on the top of the base in a symmetrical mode, two horizontal clamping assemblies respectively arranged in the two mounting frames, and an upper clamping piece arranged on the horizontal clamping assembly. The clamping surface of the upper clamping piece is located at the same horizontal height, so that the two ends of the upper surface of the IC carrier plate are at the same height under the pushing action of the clamping surface of the upper clamping piece, the upper surface of the IC carrier plate is in a horizontal state, the laser beam is prevented from being refracted to the periphery of the falling point, and the regularity of the drilling is ensured.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of intelligent basic manufacturing equipment, and in particular to a drilling device for integrated circuit (IC) carrier plate profile processing and a drilling method thereof. BACKGROUND

[0002] The IC carrier plate is developed on the basis of the related technology of the PCB plate and is used for establishing the signal connection between the IC and the PCB. In addition, the IC carrier plate can also play the roles of protecting the circuit, fixing the circuit and dissipating the residual heat. In order to better connect the routes of the layers, a through hole needs to be drilled on the IC carrier plate.

[0003] The prior art discloses some invention patents for IC carrier plate profile processing. The Chinese utility model patent with the application number CN202221445720.5 discloses a punching device for integrated circuit (IC) carrier plate profile processing. The punching device comprises a plurality of supporting rods, a same processing table is fixedly installed on the plurality of supporting rods, a same lifting plate is slidably connected to the plurality of supporting rods, the lifting plate is located above the processing table, a same top plate is fixedly installed at the top end of the plurality of supporting rods, the material to be processed is placed on the processing table, the positions of the longitudinal moving plates and the transverse moving plates are adjusted according to the length and width of the material when the material is punched, the motor A is started, the motor A drives the first lead screw to rotate so as to adjust the spacing between the two longitudinal moving plates, the motor B is started, the motor B drives the second lead screw to rotate so as to adjust the spacing between the two transverse moving plates, the hydraulic cylinder is started after the positions are adjusted, the hydraulic cylinder drives the lifting plate to ascend and descend, the material is pressed tightly after the lower pressing block contacts the material, and the punching machine body punches the material.

[0004] In the process of drilling the IC carrier plate by using the laser drilling machine, the IC carrier plate with a large area is first clamped and positioned, the laser is emitted to drill the IC carrier plate after the positioning is completed, and the IC carrier plate is cut after the drilling is completed, so that the IC carrier plate with a specific size and a through hole is obtained. Due to the error generated in the manufacturing process of the IC carrier plate, there is a non-parallel condition between the upper surface and the lower surface of part of the IC carrier plate, so that the upper surface of the IC carrier plate is in an inclined state after the IC carrier plate is clamped. When the laser beam is incident on the inclined upper surface, the refraction of the laser beam is increased, the energy of the laser landing point is diffused outward, the hole diameter is irregular, and the fine gap is prone to occur when the hole is filled. SUMMARY

[0005] The present application aims at solving the problem that the upper surface of the IC carrier plate is in an inclined state after clamping the IC carrier plate in the prior art, so that when the laser beam is shot on the inclined upper surface, the refraction of the laser beam is increased, the energy of the laser spot is diffused outward, and the aperture is irregular, and a drilling device and drilling method for integrated circuit (IC) carrier plate profile processing are provided.

[0006] In a first aspect, the present application provides a drilling device for integrated circuit (IC) carrier plate profile processing, comprising a base, a side plate fixed on the top of the base, and a support frame fixed symmetrically on the top of the base, further comprising:

[0007] Two mounting frames are provided and fixed symmetrically on the top of the base;

[0008] Two horizontal clamping assemblies are provided and installed inside the two mounting frames, respectively, the horizontal clamping assembly comprises an upper clamping piece and a lower clamping piece, the IC carrier plate is clamped between the upper clamping piece and the lower clamping piece, the upper clamping piece rigidly pushes and clamps the upper surface of the IC carrier plate, and the clamping surfaces of the two upper clamping pieces are located at the same horizontal height and are lifted synchronously, and the lower clamping piece elastically supports the lower surface of the IC carrier plate;

[0009] A positioning and drilling mechanism is installed on the top of the side plate, and after the IC carrier plate is clamped, the positioning and drilling mechanism positions and drills the horizontally clamped IC carrier plate;

[0010] Firstly, the staff places the IC carrier board on the top of the two support frames, and then starts the two lower clamping pieces. After the lower clamping pieces are started, the support pushes the IC carrier board to move upwards, so that the two lower clamping pieces lift the IC carrier board to a certain height. After lifting is completed, the two upper clamping pieces are started. After the two upper clamping pieces move downwards synchronously, the clamping surface of the upper clamping piece is in contact with the upper surface of the IC carrier board, so that the two upper clamping pieces synchronously move and push the IC carrier board to move downwards. Since the clamping surface of the upper clamping piece is located at the same horizontal height, the IC carrier board is pushed to be in the horizontal state after being pushed, and the two ends of the upper surface are at the same height, so that the upper surface of the IC carrier board is in the horizontal state, and the lower surface of the IC carrier board is supported by the lower clamping piece. Since the support of the lower clamping piece to the IC carrier board is elastic support, when the upper surface of the IC carrier board is pushed to be in the horizontal state, the lower clamping piece can produce elastic displacement to keep supporting the lower surface of the IC carrier board, so that the IC carrier board is clamped in the air. This is favorable for avoiding the influence of the drilling debris on the workbench on the levelness of the upper surface of the IC carrier board during the process of placing the IC carrier board on the workbench for drilling, and facilitates the adjustment of the levelness of the upper surface of the IC carrier board by clamping in the air, thereby favoring the improvement of the processing efficiency of the IC carrier board. After the upper surface of the IC carrier board is adjusted to be horizontal, the positioning and drilling mechanism is started to position the horizontally clamped IC carrier board. After positioning is completed, the laser is emitted to perform laser drilling on the IC carrier board. By horizontally clamping the upper surface of the IC carrier board, it is favorable for preventing the laser beam from being refracted to the surrounding of the falling point, thereby favoring the ensuring of the regularity of drilling.

[0011] Preferably, the lower clamping piece comprises:

[0012] The sliding plate is slidingly connected to the inside of the mounting frame.

[0013] The first air cylinder is fixed to the inner wall of the mounting frame, and the telescopic rod of the first air cylinder is fixedly connected to the sliding plate through the elastic member.

[0014] The lower clamping plate is installed on the side wall of the sliding plate through the torsion support.

[0015] When the lower clamping plate is not in contact with the IC carrier board, the torsion support maintains the lower clamping plate in the horizontal state through torsional force. When the IC carrier board is pushed downwards and the lower clamping plate elastically supports the bottom of the IC carrier board, the torsion support can displace according to the inclination of the lower surface of the IC carrier board while maintaining the support of the lower surface of the IC carrier board.

[0016] After the staff places the IC carrier plate on the top of the two support frames, the first air cylinder is started, the first air cylinder drives the elastic piece to move upward, the elastic piece moves upward to drive the sliding plate to move upward, the sliding plate moves upward to drive the torsion support to move upward, the torsion support drives the lower clamping plate to lift the IC carrier plate, so that the lifting of the IC carrier plate is realized, when the upper clamping piece moves downward to press the IC carrier plate, the upper surface of the IC carrier plate is pushed to a horizontal state, if the upper and lower surfaces of the IC carrier plate are not parallel at this time, the upper surface of the IC carrier plate is pushed to a horizontal state at the same time, the lower surface of the IC carrier plate is gradually inclined, at this time, the torsion support can be turned over while supporting the lower surface of the IC carrier plate under the push of the lower surface of the IC carrier plate, which is beneficial to the full close of the upper clamping piece and the upper surface of the IC carrier plate, thereby the levelness of the IC carrier plate is improved, through the elastic piece, in the process that the upper clamping piece moves downward to press the IC carrier plate to move downward, the IC carrier plate can compress the elastic piece to move downward, thereby giving the torsion support enough space to adjust the deflection of the lower clamping plate.

[0017] Preferably, the torsion support comprises:

[0018] A U-shaped mounting seat is rotatably mounted on one side of the sliding plate through a rotating shaft;

[0019] A mounting block is rotatably connected to the inside of the U-shaped mounting seat, and the top is fixedly connected with the lower clamping plate;

[0020] Rotating limit pieces are installed between the rotating shaft and the sliding plate and between the mounting block and the U-shaped mounting seat, when the lower clamping plate does not contact the IC carrier plate, the rotating limit pieces drive the top of the U-shaped mounting seat to be in a horizontal state, at the same time, drive the top of the mounting block to be in a horizontal state, and the rotating limit pieces limit the maximum inclination angle of the U-shaped mounting seat and the mounting block;

[0021] If the upper and lower surfaces of the IC carrier are not parallel, after the upper clamping piece is attached to the upper surface of the IC carrier, the lower surface of the IC carrier is in an inclined state, the U-shaped mounting seat can rotate around the rotating shaft, thereby adjusting the inclination of the lower clamping plate in the front-back direction, and the lower clamping plate can be adjusted in inclination in the left-right direction through the mounting block, so that when the lower surface of the IC carrier pushes the lower clamping plate, the lower clamping plate can be inclined in four directions, thereby making room according to the inclination direction of the lower surface of the lower clamping plate, thereby facilitating inclination and room while supporting the lower surface of the IC carrier, and the rotating limiting piece includes a first limiting groove and a first limiting block, a second limiting groove, and a second limiting block, the first limiting groove is formed on the side wall of the sliding plate close to the rotating shaft, the first limiting block is fixed on the outer wall of the rotating shaft, the first limiting block and the first limiting groove are in sliding connection, a first limiting spring is fixed between the inner wall of the first limiting groove and the first limiting block, the second limiting groove is formed on the side wall of the U-shaped mounting seat, the second limiting block is fixed on the outer wall of the pin column, the second limiting block and the second limiting groove are in sliding connection, a second limiting spring is fixed between the inner wall of the second limiting groove and the second limiting block, when the lower clamping plate is not in contact with the lower surface of the IC carrier, the first limiting spring and the second limiting spring can maintain the lower clamping plate in a horizontal state, when the IC carrier is pushed downward to indirectly push the lower clamping plate, the first limiting block can limit the degree of overturning of the lower clamping plate, thereby preventing the lower clamping plate from overturning too much and causing the IC carrier to slide down, and preventing the IC carrier from tilting to one side due to gravity when the two lower clamping plates lift the IC carrier, thereby causing the IC carrier to slide down.

[0022] Preferably, the upper clamping piece comprises:

[0023] The driving cylinder is fixed to the top of the inner wall of the mounting frame.

[0024] The upper clamping plate is fixed to the bottom of the telescopic rod of the driving cylinder through a sliding block, and the sliding block is in sliding connection with the inner wall of the mounting frame.

[0025] Preferably, the positioning drilling mechanism comprises:

[0026] The support plate is installed on the top of the side plate through a driving assembly.

[0027] The second cylinder is fixed to the top of the support plate, and the telescopic end of the second cylinder is fixed with a mounting plate after penetrating through the support plate.

[0028] A laser emitter and an infrared locator are fixed to the bottom of the mounting plate, and the laser emitter emits a laser beam for drilling after the drilling position is determined by the infrared locator.

[0029] A cleaning assembly is installed at the bottom of the mounting plate, and the cleaning assembly cleans the splashed fine particles during the downward movement of the mounting plate.

[0030] Preferably, the cleaning assembly comprises:

[0031] A cylinder is fixed to the bottom of the mounting plate, and a track groove is formed in the inner wall of the cylinder.

[0032] A vertical rod is slidingly connected to the inside of the cylinder, and a sliding pin is fixed to the outer wall of the vertical rod and slidingly connected to the track groove.

[0033] A return spring is fixed between the top of the vertical rod and the inner wall of the top of the cylinder.

[0034] A brush is fixed to the bottom outer wall of the vertical rod.

[0035] Preferably, a sliding groove is formed in the front side of the side plate, a sliding rod is slidingly connected inside the sliding groove, the sliding rod is driven to move by the driving assembly, a third cylinder is fixed to the top of the sliding rod, a support rod is fixed to the top of the third cylinder, a contact sensor is fixed to the top of the support rod, and the support rod is located directly below the vertical rod.

[0036] In a second aspect, a drilling method for an integrated circuit (IC) carrier board profile processing drilling device is provided. One side wall of the side plate is fixed with a controller, and a detection assembly is installed on the mounting bracket. The detection assembly includes a pressure sensor and an elastic telescopic rod. The pressure sensor is fixed to the inner wall of the mounting bracket, and the elastic telescopic rod is fixedly connected to one side of the sliding block. The telescopic end of the elastic telescopic rod is rotatably connected with a level detector. The drilling method comprises the following steps:

[0037] Obtaining first request information, the first request information is generated by the detection assembly after obtaining the pressure information, and the first request information is used to request the controller to control the horizontal clamping assembly to start clamping the IC carrier board;

[0038] Generating first control information and second control information based on the first request information;

[0039] Sending the first control information to the lower clamping piece of the horizontal clamping assembly to control the lower clamping piece to stop the lifting movement, and sending the second control information to the upper clamping piece of the horizontal clamping assembly to control the upper clamping piece to move downward;

[0040] acquire second request information, the second request information is generated after the detection component acquires the level information, and the second request information is used to request the controller to control the horizontal clamping component to maintain clamping and control the positioning drilling mechanism to start drilling;

[0041] generate third control information and fourth control information based on the second request information;

[0042] send the third control information to the upper clamp of the horizontal clamping component to control the upper clamp to stop, and send the fourth control information to the positioning drilling mechanism to control the positioning drilling mechanism to sequentially position and drill the to-be-drilled position;

[0043] wherein, when the lower clamp moves upward to press the pressure sensor of the detection component, the detection component acquires pressure information, then the detection component generates first request information and sends the first request information to the controller, then the controller generates first control information and second control information, and sends the first control information to the lower clamp to control the lower clamp to stop the lifting motion, and sends the second control information to the upper clamp to control the upper clamp to move downward to press the upper surface of the IC carrier board, the level detector of the detection component acquires level information after detecting that the upper surface of the IC carrier board is in a horizontal state, then the detection component generates second request information and sends the second request information to the controller, then the controller generates third control information and fourth control information, and sends the third control information to the upper clamp to control the upper clamp to stop the motion, and sends the fourth control information to the positioning drilling mechanism to control the positioning drilling mechanism to sequentially position and drill the to-be-drilled position.

[0044] Preferably, the specific leveling method of the horizontal clamping component to the upper surface of the IC carrier board is:

[0045] acquire first control information, and the lower clamp stops the lifting motion;

[0046] acquire second control information, and the upper clamp moves downward to press the upper surface of the IC carrier board;

[0047] acquire third control information, and the upper clamp stops the motion;

[0048] wherein, after the horizontal clamping component receives the first control information sent by the controller, the lower clamp stops, after the horizontal clamping component receives the second control information sent by the controller, the upper clamp starts and presses the upper surface of the IC carrier board, so that the both ends of the upper surface of the IC carrier board are pushed to be horizontal, so that the upper surface of the IC carrier board is in a horizontal state, after the horizontal clamping component receives the third control information sent by the controller, the upper clamp stops to maintain the pushing position of the IC carrier board.

[0049] Preferably, the specific detection method of the detection component is:

[0050] acquiring pressure information;

[0051] generating first request information based on the pressure information;

[0052] sending the first request information to the controller;

[0053] acquiring level information;

[0054] generating second request information based on the level information;

[0055] sending the second request information to the controller;

[0056] wherein, when the lower clamping piece moves upward to press the pressure sensor of the detection assembly, the detection assembly acquires pressure information, then the detection assembly generates first request information and sends the first request information to the controller, after the level detector of the detection assembly detects that the upper surface of the IC carrier plate is in a horizontal state, the detection assembly acquires level information, then the detection assembly generates second request information and sends the second request information to the controller.

[0057] Compared with the prior art, the present application has the following beneficial effects:

[0058] 1. Since the clamping surfaces of the upper clamping pieces are located at the same horizontal height, under the pushing action of the clamping surfaces of the upper clamping pieces, the two ends of the upper surface of the IC carrier plate are at the same height after being pushed, so that the upper surface of the IC carrier plate is in a horizontal state. Since the support of the lower clamping piece to the IC carrier plate is elastic support, when the upper surface of the IC carrier plate is pushed to a horizontal state, the lower clamping piece can produce elastic displacement to keep supporting the lower surface of the IC carrier plate, so that the IC carrier plate is clamped in suspension, and the horizontal condition of the upper surface of the IC carrier plate can be adjusted through the suspended clamping. The horizontal clamping of the upper surface of the IC carrier plate is beneficial to prevent the laser beam from being refracted to the periphery of the landing point, thereby facilitating the regularity of the drilling.

[0059] 2. The first limiting block can limit the turning degree of the lower clamping plate, thereby preventing the IC carrier plate from sliding down due to the excessive turning angle of the lower clamping plate, and avoiding the situation that the IC carrier plate tilts to one side due to gravity when the two lower clamping plates contact the IC carrier plate during lifting the IC carrier plate.

[0060] 3. The upper clamp plate pushes the upper surface of the IC carrier plate, the IC carrier plate is elastically supported by the support on the lower surface and can be cleaned and adjusted in all directions, and the pushing of the upper clamp plate on the upper surface of the IC carrier plate is rigid pushing, so that the upper surface of the IC carrier plate is adjusted to be horizontal after being pushed, thereby facilitating the horizontal clamping and adjustment of the upper surface of the IC carrier plate. BRIEF DESCRIPTION OF DRAWINGS

[0061] Figure 1 A flow chart of the drilling method of the present application.

[0062] Figure 2 A schematic diagram of the overall structure of the drilling device of the present application.

[0063] Figure 3 A schematic diagram of the second overall structure of the drilling device of the present application.

[0064] Figure 4 A schematic diagram of the Figure 3 A structure enlargement diagram of A in the present application.

[0065] Figure 5 A schematic diagram of the structure of the support frame of the present application.

[0066] Figure 6 A schematic diagram of the structure of the lower clamp plate of the present application.

[0067] Figure 7 A schematic diagram of the Figure 6 A structure enlargement diagram of B in the present application.

[0068] Figure 8 A schematic diagram of the structure of the sliding plate of the present application.

[0069] Figure 9 A schematic diagram of the Figure 8 A structure enlargement diagram of C in the present application.

[0070] Figure 10 A schematic diagram of the local structure of the positioning and drilling mechanism of the present application.

[0071] Figure 11 A sectional view of the internal structure of the cylinder of the present application.

[0072] Figure 12 A schematic diagram of the Figure 11 A structure enlargement diagram of D in the present application.

[0073] Figure 13 A flow chart of the specific leveling method of the present application.

[0074] Figure 14 A flow chart of the specific detection method of the detection assembly of the present application.

[0075] In the figure: 1, base; 2, side plate; 3, support frame; 4, mounting frame; 5, upper clamping plate; 6, lower clamping plate; 7, controller; 8, drive cylinder; 9, sliding block; 11, pressure sensor; 12, elastic telescopic rod; 13, level detector; 14, sliding plate; 15, first cylinder; 16, elastic member; 17, rotating shaft; 18, U-shaped mounting seat; 19, mounting block; 20, pin column; 21, first limiting groove; 22, first limiting block; 23, first limiting spring; 24, second limiting groove; 25, second limiting block; 26, second limiting spring; 27, support plate; 28, second cylinder; 29, mounting plate; 30, laser emitter; 31, infrared positioner; 32, cylinder; 33, track groove; 3301, first guide groove; 3302, second guide groove; 3303, third guide groove; 34, vertical rod; 35, sliding pin; 36, return spring; 37, brush; 38, sliding groove; 39, sliding rod; 40, third cylinder; 41, support rod; 42, contact sensor. DETAILED DESCRIPTION

[0076] The following description is provided to disclose the present application so that those skilled in the art can implement the present application. The preferred embodiments in the following description are only examples, and other obvious modifications can be made by those skilled in the art.

[0077] As Figures 2 to 12 The drilling device for processing the outline of an integrated circuit (IC) carrier board comprises a base 1, a side plate 2 fixed on the top of the base 1, and support frames 3 symmetrically fixed on the top of the base 1, and further comprises:

[0078] Mounting frames 4 are provided in two, symmetrically fixed on the top of the base 1;

[0079] Horizontal clamping assemblies are provided in two, respectively mounted in the interiors of the two mounting frames 4, and each horizontal clamping assembly comprises an upper clamping member and a lower clamping member, and an IC carrier board is clamped between the upper clamping member and the lower clamping member, the upper clamping member rigidly pushes and clamps the upper surface of the IC carrier board, and the clamping surfaces of the two upper clamping members are located at the same horizontal plane height and are synchronously lifted and lowered, and the lower clamping member elastically supports the lower surface of the IC carrier board;

[0080] The positioning and drilling mechanism is installed on the top of the side plate 2, and after the IC carrier plate is clamped, the positioning and drilling mechanism is used for positioning and drilling the horizontally clamped IC carrier plate; during operation, due to the error generated during the manufacturing of the IC carrier plate, there is a non-parallel condition between the upper surface and the lower surface of part of the IC carrier plate, so that the upper surface of the IC carrier plate is in an inclined state after the IC carrier plate is clamped, and when the laser beam is incident on the inclined upper surface, the refraction of the laser beam is increased, the energy of the laser spot is diffused outward, the aperture is irregular, and the fine gap is prone to occur during hole filling. The embodiment of the present application can solve the above problems, and the specific implementation is as follows: first, the worker places the IC carrier plate on the top of the two support frames 3, and then starts the two lower clamping pieces. After the lower clamping pieces are started, the IC carrier plate is pushed upward, so that the two lower clamping pieces lift the IC carrier plate to a certain height. After lifting, start the two upper clamping pieces. After the two upper clamping pieces move downward synchronously, the clamping surface of the upper clamping piece is in contact with the upper surface of the IC carrier plate, so that the two upper clamping pieces move synchronously and push the IC carrier plate downward. Since the clamping surface of the upper clamping piece is at the same horizontal height, the two ends of the upper surface of the IC carrier plate are at the same height after being pushed, so that the upper surface of the IC carrier plate is in a horizontal state, and the lower surface of the IC carrier plate is supported by the lower clamping piece. Since the support of the lower clamping piece to the IC carrier plate is elastic support, when the upper surface of the IC carrier plate is pushed to a horizontal state, the lower clamping piece can produce elastic displacement to support the lower surface of the IC carrier plate, so that the IC carrier plate is clamped in the air. It is beneficial to avoid the influence of the drilling debris on the workbench on the horizontal degree of the upper surface of the IC carrier plate during the drilling process of the IC carrier plate placed on the workbench, and the clamping in the air is convenient for adjusting the horizontal condition of the upper surface of the IC carrier plate, thereby improving the processing efficiency of the IC carrier plate. After the upper surface of the IC carrier plate is adjusted to be horizontal, the positioning and drilling mechanism is started, the positioning and drilling mechanism is used for positioning the horizontally clamped IC carrier plate, and after positioning, the laser is emitted to drill the IC carrier plate. By clamping the upper surface of the IC carrier plate horizontally, it is beneficial to prevent the refraction of the laser beam to the periphery of the landing point, thereby ensuring the regularity of the drilling.

[0081] Specifically, the lower clamping piece comprises:

[0082] The sliding plate 14 is slidingly connected to the inside of the mounting frame 4.

[0083] The first air cylinder 15 is fixed to the inner wall of the mounting frame 4, and the telescopic rod of the first air cylinder 15 is fixedly connected with the sliding plate 14 through the elastic element 16.

[0084] The lower clamping plate 6 is installed on the side wall of the sliding plate 14 through the torsion support.

[0085] Wherein, when the lower clamping plate 6 is not in contact with the IC carrier plate, the torsion support maintains the lower clamping plate 6 in a horizontal state through torsion force, when the IC carrier plate is pushed downward and the lower clamping plate 6 elastically supports the bottom of the IC carrier plate, the torsion support gives way according to the inclination of the lower surface of the IC carrier plate while maintaining the support of the lower surface of the IC carrier plate; in operation, after the worker places the IC carrier plate on the top of the two support frames 3, the first air cylinder 15 is started, the first air cylinder 15 pushes the elastic element 16 to move upward, the elastic element 16 moves upward to push the sliding plate 14 to move upward, the sliding plate 14 moves upward to drive the torsion support to move upward, the torsion support drives the lower clamping plate 6 to lift the IC carrier plate, so as to realize the lifting of the IC carrier plate, when the upper clamping element moves downward to press the IC carrier plate, the upper surface of the IC carrier plate is pushed to a horizontal state, at this time, if the upper and lower surfaces of the IC carrier plate are not parallel, the upper surface of the IC carrier plate is pushed to a horizontal state, at this time, the torsion support can be turned over while supporting the lower surface of the IC carrier plate under the push of the lower surface of the IC carrier plate, which is beneficial to the full close of the upper clamping element and the upper surface of the IC carrier plate, so as to improve the levelness of the IC carrier plate, through the elastic element 16, in the process that the upper clamping element moves downward to press the IC carrier plate to move downward, the downward movement of the IC carrier plate can compress the elastic element 16, so as to give the torsion support enough space to adjust the deflection of the lower clamping plate 6.

[0086] Specifically, the torsion support comprises:

[0087] The U-shaped mounting seat 18 is rotatably installed on one side of the sliding plate 14 through the rotating shaft 17;

[0088] The mounting block 19 is rotatably connected to the inside of the U-shaped mounting seat 18, and the top is fixedly connected with the lower clamping plate 6;

[0089] The rotating limiting piece is arranged between the rotating shaft 17 and the sliding plate 14 and between the mounting block 19 and the U-shaped mounting seat 18. When the lower clamping plate 6 is not in contact with the IC carrier plate, the rotating limiting piece drives the top of the U-shaped mounting seat 18 to be in a horizontal state, simultaneously drives the top of the mounting block 19 to be in a horizontal state, and limits the maximum inclination angle of the U-shaped mounting seat 18 and the mounting block 19. During work, if the upper and lower surfaces of the IC carrier plate are not parallel, after the upper clamping piece is attached to the upper surface of the IC carrier plate, the lower surface of the IC carrier plate is in an inclined state. The U-shaped mounting seat 18 can rotate around the rotating shaft 17 through the rotating shaft 17, so that the inclination adjustment of the lower clamping plate 6 in the front and back directions can be realized. The lower clamping plate 6 can be inclined in the left and right directions through the mounting block 19, so that the lower clamping plate 6 can be inclined in four directions when the lower surface of the IC carrier plate pushes the lower clamping plate 6, and the inclination of the lower clamping plate 6 can be adjusted according to the inclination direction of the lower surface of the lower clamping plate 6, so that the IC carrier plate can be inclined and adjusted while being supported on the lower surface of the IC carrier plate, and the IC carrier plate can be kept in a horizontal state through the active inclination adjustment of the lower clamping plate 6. The rotating limiting piece comprises a first limiting groove 21, a first limiting block 22, a second limiting groove 24 and a second limiting block 25. The first limiting groove 21 is arranged on the side wall of the sliding plate 14 close to the rotating shaft 17. The first limiting block 22 is fixed on the outer wall of the rotating shaft 17. The first limiting block 22 is in sliding connection with the first limiting groove 21. The first limiting spring 23 is fixed between the inner wall of the first limiting groove 21 and the first limiting block 22. The second limiting groove 24 is arranged on the side wall of the U-shaped mounting seat 18. The second limiting block 25 is fixed on the outer wall of the pin column 20. The second limiting block 25 is in sliding connection with the second limiting groove 24. The second limiting spring 26 is fixed between the inner wall of the second limiting groove 24 and the second limiting block 25. When the lower clamping plate 6 is not in contact with the lower surface of the IC carrier plate, the first limiting spring 23 and the second limiting spring 26 can keep the lower clamping plate 6 in a horizontal state. When the IC carrier plate is pushed downward to indirectly push the lower clamping plate 6, the first limiting block 22 can limit the overturning degree of the lower clamping plate 6, so that the IC carrier plate is prevented from sliding downward due to the excessive overturning angle of the lower clamping plate 6, and the IC carrier plate is prevented from being inclined to one side due to the gravity when the two lower clamping plates 6 are in contact with the IC carrier plate in a position deviating from the center during the lifting of the IC carrier plate by the two lower clamping plates 6.

[0090] Specifically, the upper clamping piece comprises:

[0091] The driving cylinder 8 is fixed to the top of the inner wall of the mounting frame 4.

[0092] The upper clamping plate 5 is fixed to the bottom of the telescopic rod of the drive cylinder 8 by the slider 9. The slider 9 is slidably connected to the inner wall of the mounting frame 4. During operation, after the IC carrier is lifted upward, the drive cylinder 8 is activated. The telescopic rod of the drive cylinder 8 pushes the slider 9 downward, and the slider 9 drives the upper clamping plate 5 downward. The drive cylinders 8 inside the two mounting frames 4 are driven synchronously, thereby driving the two upper clamping plates 5 to move downward synchronously. The lower surfaces of the two upper clamping plates 5 are always at the same height. This allows the IC carrier to be elastically supported when the upper clamping plate 5 pushes the upper surface of the IC carrier, and it can move in all directions. At the same time, the pushing of the upper surface of the IC carrier by the upper clamping plate 5 is rigid, so that the upper surface of the IC carrier is adjusted to a horizontal state after being pushed. This is beneficial for the horizontal clamping and adjustment of the upper surface of the IC carrier.

[0093] Specifically, the positioning drilling mechanism includes:

[0094] Support plate 27 is mounted on top of side plate 2 via a drive assembly;

[0095] The second cylinder 28 is fixed to the top of the support plate 27, and the telescopic end of the second cylinder 28 passes through the support plate 27 and is fixed with the mounting plate 29.

[0096] Both the laser emitter 30 and the infrared locator 31 are fixed to the bottom of the mounting plate 29. After the infrared locator 31 determines the drilling position, the laser emitter 30 emits a laser beam to drill the hole.

[0097] A cleaning component, installed at the bottom of the mounting plate 29, cleans up small particles splashed during the downward movement of the mounting plate 29. During operation, after horizontally clamping the IC carrier board, the drive component is activated to move the support plate 27. The drive component includes a motor and a lead screw. The lead screw is fixedly connected to the output shaft of the motor and is rotatably mounted on the top of the side plate 2. The motor drives the lead screw to rotate, which in turn moves the sliding sleeve threaded to it. The sliding sleeve moves the support plate 27, which is slidably connected to the top of the side plate 2, allowing the support plate 27 to slide only along the top of the side plate 2. The infrared locator 31 is used to locate the position to be drilled. After positioning, the second cylinder 28 is activated to move the mounting plate 29 downward. During the downward movement of the mounting plate 29, the cleaning component removes small particles splashed. Subsequently, the laser emitter 30 emits a laser beam to drill a hole at the designated position on the IC carrier board.

[0098] Specifically, the cleanup components include:

[0099] A cylindrical tube 32 is fixed to the bottom of the mounting plate 29, and a track groove 33 is provided on the inner wall of the cylindrical tube 32;

[0100] A vertical rod 34 is slidably connected to the inside of the cylinder 32, and a sliding pin 35 is fixed to the outer wall of the vertical rod 34 and slidably connected to the track groove 33.

[0101] A reset spring 36 is fixed between the top of the vertical rod 34 and the inner wall of the top of the cylinder 32.

[0102] A brush 37 is fixed to the bottom outer wall of the vertical rod 34; during the laser drilling process, fine particles may splash and fall on the upper surface of the IC carrier plate, which increases the refractive index of the laser. During the downward movement of the mounting plate 29, the mounting plate 29 drives the cylinder 32 to move downward, the cylinder 32 drives the reset spring 36 to move downward, and the vertical rod 34 moves downward. When the bottom of the vertical rod 34 touches the surface of the IC carrier plate, the cylinder 32 continues to move downward, the sliding pin 35 moves along the track groove 33 and drives the vertical rod 34 to rotate, the brush 37 rotates, and the brush 37 rotates on the surface of the IC carrier plate to clean the surface of the IC carrier plate, thereby facilitating the cleaning of the to-be-processed position. During the upward movement of the mounting plate 29, under the action of the compressed reset spring 36, the vertical rod 34 moves towards the outside of the cylinder 32, thereby driving the sliding pin 35 to reset, the sliding pin 35 resets the vertical rod 34, thereby driving the brush 37 to reset.

[0103] Specifically, the track groove 33 includes a first guide groove 3301, a second guide groove 3302, and a third guide groove 3303. The top of the first guide groove 3301 is in communication with the bottom of the second guide groove 3302, and the top of the second guide groove 3302 is in communication with the bottom of the third guide groove 3303.

[0104] Furthermore, a sliding groove 38 is provided on the front side of the side plate 2. A sliding rod 39 is slidably connected inside the sliding groove 38. The sliding rod 39 is driven to move by the drive assembly. A third cylinder 40 is fixed to the top of the sliding rod 39, and a support rod 41 is fixed to the top of the third cylinder 40. A contact sensor 42 is fixed to the top of the support rod 41. The support rod 41 is located directly below the vertical rod 34. During operation, because the IC carrier board is long and thin, it is easy to cause the IC carrier board to tilt downward after the vertical rod 34 presses down on the upper surface of the IC carrier board, resulting in the upper surface of the IC carrier board not being horizontal. During the process of the drive assembly moving the mounting plate 29, it can synchronously drive the sliding rod 39. As rod 39 moves, the sliding sleeve of the drive assembly is fixedly connected to the sliding rod 39 below. The sliding groove 38 is connected to the sliding space of the sliding sleeve. After the drive assembly moves the mounting plate 29 and completes the positioning of the hole to be drilled, the third cylinder 40 starts and drives the support rod 41 to move upward. After the support rod 41 moves upward and contacts the lower surface of the IC carrier, a signal is sent to the controller 7 through the contact sensor 42. The controller 7 controls the third cylinder 40 to stop. Then, after the vertical rod 34 moves downward and abuts against the upper surface of the IC carrier, the support rod 41 supports the IC carrier, preventing the IC carrier from being squeezed by the vertical rod 34 and causing a groove.

[0105] like Figure 1 The drilling method of a drilling device for processing the outline of an integrated circuit (IC) substrate is shown. A controller 7 is fixed on one side wall of the side plate 2, and a detection assembly is mounted on the mounting bracket 4. The detection assembly includes a pressure sensor 11 and an elastic telescopic rod 12. The pressure sensor 11 is fixed on the inner wall of the mounting bracket 4, and the elastic telescopic rod 12 is fixedly connected to one side of the slider 9. The telescopic end of the elastic telescopic rod 12 is rotatably connected to a levelness detector 13. The drilling method includes the following steps:

[0106] The first request information is obtained. The first request information is generated by the detection component after obtaining the pressure information. The first request information is used to request the controller 7 to control the horizontal clamping component to start the horizontal clamping IC carrier board.

[0107] First control information and second control information are generated based on the first request information;

[0108] The first control information is sent to the lower clamping member of the horizontal clamping assembly to control the lower clamping member to stop its lifting and lowering movement, and the second control information is sent to the upper clamping member of the horizontal clamping assembly to control the upper clamping member to move downward.

[0109] The second request information is obtained. The second request information is generated by the detection component after obtaining the horizontal information. The second request information is used to request the controller 7 to control the horizontal clamping component to maintain clamping and to control the positioning drilling mechanism to start drilling.

[0110] Generate third and fourth control information based on the second request information;

[0111] The third control information is sent to the upper clamping member of the horizontal clamping assembly to control the upper clamping member to stop, and the fourth control information is sent to the positioning drilling mechanism to control the positioning drilling mechanism to perform positioning drilling in sequence at the position to be drilled.

[0112] When the lower clamping member moves upward to squeeze the pressure sensor 11 of the detection component, the detection component acquires pressure information. Subsequently, the detection component generates a first request message and sends it to the controller 7. Then, the controller 7 generates a first control message and a second control message, and sends the first control message to the lower clamping member to control the lower clamping member to stop its lifting and lowering movement. The controller 7 sends the second control message to the upper clamping member to control the upper clamping member to move downward to squeeze the upper surface of the IC carrier. After the levelness detector 13 of the detection component detects that the upper surface of the IC carrier is in a level state, it acquires level information. Then, the detection component generates a second request message and sends it to the controller 7. Subsequently, the controller 7 generates a third control message and a fourth control message, and sends the third control message to the upper clamping member to control the upper clamping member to stop its movement. The controller 7 sends the fourth control message to the positioning drilling mechanism to control the positioning drilling mechanism to perform positioning drilling at the positions to be drilled in sequence.

[0113] like Figure 13 As shown, the specific leveling method of the horizontal clamping assembly on the upper surface of the IC carrier board is as follows:

[0114] Upon receiving the first control information, the lower clamping component stops its lifting and lowering motion.

[0115] The second control information is obtained, and the upper clamp moves downward to press the upper surface of the IC carrier board;

[0116] Upon receiving third-party control information, the upper clamping component stops moving.

[0117] Specifically, after the horizontal clamping component receives the first control information sent by the controller 7, the lower clamping component stops. After the horizontal clamping component receives the second control information sent by the controller 7, the upper clamping component starts and presses down on the upper surface of the IC carrier board, so that both ends of the upper surface of the IC carrier board are pushed horizontally, so that the upper surface of the IC carrier board is in a horizontal state. After the horizontal clamping component receives the third control information sent by the controller 7, the upper clamping component stops, maintaining the pushing position on the IC carrier board.

[0118] like Figure 14 As shown, the specific detection method of the detection component is as follows:

[0119] Obtain stress information;

[0120] generating first request information based on the pressure information;

[0121] sending the first request information to the controller 7;

[0122] obtaining level information;

[0123] generating second request information based on the level information;

[0124] sending the second request information to the controller 7;

[0125] wherein when the lower clamping member moves upward to press the pressure sensor 11 of the detection assembly, the detection assembly obtains pressure information, then the detection assembly generates first request information and sends the first request information to the controller 7, and after the level detector 13 of the detection assembly detects that the upper surface of the IC carrier plate is in a horizontal state, the detection assembly obtains level information, then the detection assembly generates second request information and sends the second request information to the controller 7.

[0126] Working principle of the application:

[0127] Due to the error generated in the IC carrier plate manufacturing process, the upper surface and the lower surface of part of the IC carrier plate are not parallel, so that the upper surface of the IC carrier plate is in an inclined state after clamping the IC carrier plate, so that when the laser beam is incident on the inclined upper surface, the refraction of the laser beam is increased, the energy of the laser spot is diffused outward, the aperture is irregular, and the fine gap is prone to occur during hole filling. The embodiment of the present application can solve the above problems, and the specific implementation is as follows: first, the staff places the IC carrier plate on the top of the two supporting frames 3, and then starts the two lower clamping pieces. After the lower clamping piece is started, the IC carrier plate is pushed upward, so that the two lower clamping pieces lift the IC carrier plate to a certain height. After lifting, start the two upper clamping pieces, and after the two upper clamping pieces move downward synchronously, the clamping surface of the upper clamping piece is in contact with the upper surface of the IC carrier plate, so that the two upper clamping pieces move synchronously and push the IC carrier plate downward. Since the clamping surface of the upper clamping piece is at the same horizontal height, the two ends of the upper surface of the IC carrier plate are at the same height after being pushed, so that the upper surface of the IC carrier plate is in a horizontal state, and the lower surface of the IC carrier plate is supported by the lower clamping piece. Since the support of the lower clamping piece to the IC carrier plate is elastic support, when the upper surface of the IC carrier plate is pushed to a horizontal state, the lower clamping piece can produce elastic displacement to support the lower surface of the IC carrier plate, so that the IC carrier plate is clamped in the air. It is beneficial to avoid the influence of the drilling debris on the workbench on the horizontal degree of the upper surface of the IC carrier plate during the drilling process of the IC carrier plate placed on the workbench, and the clamping in the air is convenient for adjusting the horizontal condition of the upper surface of the IC carrier plate, thereby improving the processing efficiency of the IC carrier plate. After the horizontal adjustment of the upper surface of the IC carrier plate is completed, the positioning and drilling mechanism is started, the positioning and drilling mechanism positions the horizontally clamped IC carrier plate, and then emits laser to drill the IC carrier plate. By horizontally clamping the upper surface of the IC carrier plate, it is beneficial to prevent the refraction of the laser beam to the periphery of the landing point, thereby ensuring the regularity of the drilling.

[0128] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A drilling device for processing the outline of an integrated circuit (IC) substrate, comprising a base (1), a side plate (2) fixed to the top of the base (1), and support frames (3) symmetrically fixed to the top of the base (1), characterized in that, Also includes: Mounting brackets (4) are provided in two parts, symmetrically fixed to the top of the base (1); Two horizontal clamping components are provided and installed inside the two mounting brackets (4) respectively. The horizontal clamping components include an upper clamping member and a lower clamping member. The IC carrier board is clamped between the upper clamping member and the lower clamping member. The upper clamping member rigidly pushes and clamps the upper surface of the IC carrier board. The clamping surfaces of the two upper clamping members on the IC carrier board are at the same horizontal plane height and move up and down synchronously. The lower clamping member elastically supports the lower surface of the IC carrier board. The positioning drilling mechanism is installed on the top of the side plate (2). After the IC carrier board is clamped, the positioning drilling mechanism performs positioning drilling on the horizontally clamped IC carrier board. The lower clamping member includes: A sliding plate (14) is slidably connected to the interior of the mounting bracket (4); The first cylinder (15) is fixed on the inner wall of the mounting bracket (4), and the telescopic rod of the first cylinder (15) is fixedly connected to the sliding plate (14) by an elastic element (16). The lower clamping plate (6) is mounted on the side wall of the sliding plate (14) by a torsion support member; When the lower clamping plate (6) is not in contact with the IC carrier plate, the torsion support member maintains the lower clamping plate (6) in a horizontal state by torsion force. When the IC carrier plate is pushed downward and the lower clamping plate (6) provides elastic support to the bottom of the IC carrier plate, the torsion support member makes room according to the inclination of the lower surface of the IC carrier plate while maintaining support for the lower surface of the IC carrier plate. The torsion support includes: The U-shaped mounting base (18) is rotatably mounted on one side of the sliding plate (14) via a rotating shaft (17); Mounting block (19) is rotatably connected to the inside of the U-shaped mounting base (18), and its top is fixedly connected to the lower clamping plate (6); Rotation limiting components are installed between the rotating shaft (17) and the sliding plate (14) and between the mounting block (19) and the U-shaped mounting seat (18). When the lower clamping plate (6) is not in contact with the IC carrier, the rotation limiting component drives the top of the U-shaped mounting seat (18) to a horizontal state, and at the same time drives the top of the mounting block (19) to a horizontal state. The rotation limiting component also limits the maximum tilt angle between the U-shaped mounting seat (18) and the mounting block (19).

2. The drilling device for processing the outline of an integrated circuit (IC) substrate according to claim 1, characterized in that, The upper clamping member includes: Drive cylinder (8) is fixed to the top of the inner wall of mounting bracket (4); The upper clamp (5) is fixed to the bottom of the telescopic rod of the drive cylinder (8) by a slider (9), and the slider (9) is slidably connected to the inner wall of the mounting bracket (4).

3. The drilling apparatus for processing the outline of an integrated circuit (IC) substrate according to claim 1, characterized in that, The positioning drilling mechanism includes: Support plate (27), which is mounted on top of the side plate (2) by a drive assembly; The second cylinder (28) is fixed to the top of the support plate (27), and the telescopic end of the second cylinder (28) passes through the support plate (27) and is fixed with a mounting plate (29). The laser emitter (30) and the infrared locator (31) are both fixed to the bottom of the mounting plate (29). After the infrared locator (31) determines the drilling position, the laser emitter (30) emits a laser beam to drill the hole. The cleaning component is installed at the bottom of the mounting plate (29) and cleans up the splashed fine particles as the mounting plate (29) moves downward.

4. The drilling apparatus for processing the outline of an integrated circuit (IC) substrate according to claim 3, characterized in that, The cleaning component includes: A cylindrical tube (32) is fixed to the bottom of the mounting plate (29), and a track groove (33) is provided on the inner wall of the cylindrical tube (32). A vertical rod (34) is slidably connected to the inside of the cylinder (32), and a sliding pin (35) is fixed on the outer wall of the vertical rod (34). The sliding pin (35) is slidably connected to the track groove (33). A return spring (36) is fixed between the top of the vertical rod (34) and the top inner wall of the cylinder (32); Brush (37), which is fixed to the bottom outer wall of the vertical rod (34).

5. The drilling apparatus for processing the outline of an integrated circuit (IC) substrate according to claim 4, characterized in that, The front side of the side plate (2) is provided with a sliding groove (38), and a sliding rod (39) is slidably connected inside the sliding groove (38). The sliding rod (39) is driven to move by the driving assembly. A third cylinder (40) is fixed to the top of the sliding rod (39), and a support rod (41) is fixed to the top of the third cylinder (40). A contact sensor (42) is fixed to the top of the support rod (41), and the support rod (41) is located directly below the vertical rod (34).

6. A drilling method for a drilling apparatus for processing the outline of an integrated circuit (IC) substrate, applicable to the drilling apparatus for processing the outline of an integrated circuit (IC) substrate as described in any one of claims 1-5, characterized in that, A controller (7) is fixed on one side wall of the side plate (2), and a detection assembly is installed on the mounting bracket (4). The detection assembly includes a pressure sensor (11) and an elastic telescopic rod (12). The pressure sensor (11) is fixed on the inner wall of the mounting bracket (4), and the elastic telescopic rod (12) is fixedly connected to one side of the slider (9). The telescopic end of the elastic telescopic rod (12) is rotatably connected to a levelness detector (13). The drilling method includes the following steps: Obtain first request information, which is generated by the detection component after obtaining pressure information. The first request information is used to request the controller (7) to control the horizontal clamping component to start horizontal clamping IC carrier board. First control information and second control information are generated based on the first request information; The first control information is sent to the lower clamping member of the horizontal clamping assembly to control the lower clamping member to stop its lifting and lowering movement, and the second control information is sent to the upper clamping member of the horizontal clamping assembly to control the upper clamping member to move downward. Obtain second request information. The second request information is generated by the detection component after obtaining the horizontal information. The second request information is used to request the controller (7) to control the horizontal clamping component to maintain clamping and to control the positioning drilling mechanism to start drilling. Generate third and fourth control information based on the second request information; The third control information is sent to the upper clamping member of the horizontal clamping assembly to control the upper clamping member to stop, and the fourth control information is sent to the positioning drilling mechanism to control the positioning drilling mechanism to perform positioning drilling in sequence at the position to be drilled.

7. The drilling method of the drilling apparatus for processing the outline of an integrated circuit (IC) substrate according to claim 6, characterized in that, The specific leveling method of the horizontal clamping assembly for the upper surface of the IC carrier is as follows: Upon receiving the first control information, the lower clamping component stops its lifting and lowering motion. The second control information is obtained, and the upper clamp moves downward to press the upper surface of the IC carrier board; Upon receiving third control information, the upper clamping component stops moving.

8. The drilling method of the drilling apparatus for processing the outline of an integrated circuit (IC) substrate according to claim 6, characterized in that, The specific detection method of the detection component is as follows: Obtain stress information; The first request information is generated based on the pressure information; Send the first request information to the controller (7); Obtain horizontal information; Generate a second request message based on the horizontal information; Send the second request information to the controller (7).

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