Large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks

Abstract

This invention discloses a large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks, comprising a buffer module and an adsorption module. The adsorption module is fixed to the buffer module by insulating silicone rubber. The buffer module includes a power supply module, an upper support plate, a tension spring, a buffer cavity, a telescopic rod, a damping ball head, and a lower support plate. The power supply module is fixed to the upper surface of the upper support plate, and the buffer cavity is connected to the lower surface of the upper support plate by screws. Both the lower and upper surfaces of the upper and lower support plates have spring grooves, and a tension spring is provided between the spring grooves of the upper and lower support plates. The telescopic rod cooperates with the buffer cavity and can slide along the central axis of the buffer cavity. One end of the telescopic rod is provided with a damping ball head, which cooperates with a universal damping ball joint fixed to the lower support plate. The adsorption module includes an electrostatic adsorption layer, an adhesive layer, a fixing plate, and a buffer fixing material. The adhesive layer is located on the outside of the electrostatic adsorption layer. This invention is applicable to target surfaces with various surface roughnesses and materials.

Description

Technical Field

[0001] This invention belongs to the field of impact buffering and adhesion technology, specifically relating to a large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks. Background Technology

[0002] Currently, low-to-medium speed, high-angle collision tests are widely used in various projectile collision tests, including those in the automotive, construction, and aerospace industries. Some of these devices have strict requirements regarding the collision angle. Buffer devices generally include air-damped, rubber-damped, and dry-friction types. When a single-stage buffer system cannot meet the collision buffering requirements under high-altitude and high-angle conditions, hydraulic buffers cannot be used in a vacuum environment and all have drawbacks such as being easily damaged and unable to self-recover after stopping. Multi-stage buffer systems, on the other hand, occupy a large space and are costly.

[0003] Patent application number 202223160963.7 discloses a mechanism for collision buffering protection. The buffer structure of this mechanism includes two buffer plates, two side buffer mechanisms, and two bottom buffer mechanisms. The buffer plates, in conjunction with the side buffer mechanisms, can buffer and absorb the impact energy when the mechanism swings and collides with a wall. When the mechanism descends, the two bottom buffer mechanisms can buffer the impact force and absorb the impact energy. However, the buffer mechanism can only buffer and absorb energy in a normal collision; when the collision occurs at a certain angle, the buffering effect weakens or even fails.

[0004] Electrostatic adsorption works by energizing the electrodes in an electrostatic adsorption unit. Due to electrostatic induction, a charge of opposite polarity is induced on the surface of the object to be adsorbed, generating an electrostatic force between the unit and the object for adsorption. This force can be generated on conductive, magnetic, or non-conductive surfaces, as well as smooth or rough surfaces, making it suitable for various impact surfaces. Furthermore, the adsorption force is controllable and adjustable; its magnitude can be changed by adjusting the excitation voltage to suit different needs. It also features low energy consumption and no damage to the surface.

[0005] To meet the requirements of impact adhesion tasks, it is necessary to optimize the adsorption system and buffer system based on the characteristics of the existing electrostatic adsorption system, combining the advantages of both to achieve good adhesion under impact conditions. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks, which addresses the shortcomings of the prior art.

[0007] To achieve the above-mentioned technical objectives, the technical solution adopted by the present invention is as follows:

[0008] A large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks, the device includes a buffer module and an adsorption module, the adsorption module being fixed to the buffer module by insulating silicone rubber;

[0009] The buffer module includes a power supply module, an upper support plate, a tension spring, a buffer cavity, a telescopic rod, a damping ball joint, and a lower support plate. The power supply module is fixed to the upper surface of the upper support plate, and the lower surface of the upper support plate is connected to the buffer cavity by screws. Both the lower surface of the upper support plate and the upper surface of the lower support plate have spring slots at their edges, and a tension spring is provided between the spring slots of the upper and lower support plates. The telescopic rod cooperates with the buffer cavity and can slide along the central axis of the buffer cavity. One end of the telescopic rod is provided with a damping ball joint, which cooperates with a universal damping ball joint fixed to the lower support plate.

[0010] The adsorption module includes an electrostatic adsorption layer, an adhesive layer, a fixing plate, and a buffer fixing material. The adhesive layer is disposed on the outside of the electrostatic adsorption layer. The electrostatic adsorption layer and the adhesive layer are bonded to the fixing plate by insulating silicone rubber. The fixing plate is bonded to the buffer fixing material by insulating silicone rubber. The buffer fixing material is bonded to the lower surface of the lower support plate of the buffer module by insulating silicone rubber, thereby achieving a fixed connection between the adsorption module and the buffer module.

[0011] Preferably, the telescopic rod has an annular protrusion at one end that extends into the buffer cavity, and an annular groove inside the buffer cavity. When the telescopic rod and the buffer cavity slide relative to each other to their maximum position, the protrusion is restricted in its displacement by the annular groove, preventing the telescopic rod and the buffer cavity from separating. The telescopic rod has internal through holes for fixing screws as reinforcing screws. These screws are symmetrically distributed, and their number and size can be changed according to the required screws to fix the thin plate-type buffer material.

[0012] Preferably, the buffer cavity is provided with protrusions around its perimeter, and the protrusions are provided with through holes. Screws pass through the through holes and are screwed into the threaded holes on the upper support plate. The buffer cavity is filled with buffer material.

[0013] Preferably, the cushioning fixing material is silicone rubber for cushioning.

[0014] Preferably, the upper support plate is a regular hexagonal flat plate, with a tension spring slot at the center line of each side for fixing the tension spring, and the tension spring between the upper and lower support plates has a preload.

[0015] Preferably, the universal damping ball joint has a threaded hole and is connected to the through hole in the center of the lower support plate by a countersunk screw and a washer. The tightness of the lower support plate can be controlled by adjusting the countersunk screw, and the stiffness of the ball joint can be adjusted by adjusting the universal damping ball joint. The tension between the ball joint and the telescopic rod is controlled by an internal hexagon screw.

[0016] Preferably, the fixing plate, the buffer fixing material and the lower support plate are provided with power supply line connection through holes, and the telescopic rod and the buffer cavity side are each provided with telescopic rod opening slot and buffer cavity opening slot. Each opening slot is used for external circuit wiring. The opening slot pressure plate is matched with the corresponding opening slot by two screws to realize cable fixing.

[0017] Preferably, the upper support plate has a screw connecting the buffer mechanism body to the required rear mechanism, and a recessed slot is provided in the middle part for fixing the external power supply equipment. The protruding part of the recessed slot has a through hole for the power supply equipment wiring.

[0018] Preferably, the electrostatic adsorption layer includes an insulating layer, an electrode layer, and a base layer, wherein the insulating layer and the base layer are bonded together by insulating silicone rubber, and an electrode layer is provided between the insulating layer and the base layer.

[0019] Preferably, the electrodes of the electrode layer are arranged in a concentric circle cross pattern, with positive and negative electrodes arranged alternately. The ratio of the electrode width to the electrode gap is 2:1. The electrode part adopts a dual-point dual-line redundant design, with a set of positive and negative electrode terminals on each side, which can be powered simultaneously by the power supply module.

[0020] The present invention has the following beneficial effects:

[0021] The large-angle electrostatic adsorption compliant buffer device of the present invention for impact adhesion tasks has a simple structure and is easy to operate. It can be adapted to different external mechanisms by adjusting the type, size and position of the mounting holes on the upper support plate. It uses the buffer material, tension spring and universal damping ball joint inside the buffer cavity to achieve buffering and self-adaptation. It is adsorbed by the end electrostatic adsorption module and can be applied to target surfaces with various surface roughness and materials. Attached Figure Description

[0022] Figure 1 is a perspective view of the assembly of a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention.

[0023] Figure 2 is a schematic cross-sectional view of the electrostatic adsorption layer and the fixing plate of a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention.

[0024] Figure 3 is a schematic diagram of the specific structure of the electrostatic adsorption layer electrode layer in a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention.

[0025] Figure 4 is a bottom view of a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention (viewed from the electrostatic adsorption layer towards the support plate).

[0026] Figure 5 is a schematic diagram of the buffer chamber and telescopic rod in a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention.

[0027] Figure 6 is a schematic diagram of the buffer cavity structure of a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention.

[0028] Figure 7 is a schematic diagram of the telescopic rod structure of a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention.

[0029] Figure 8 is a schematic diagram of the lower support plate structure of a specific embodiment of the large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks of the present invention.

[0030] The components are as follows: 1. Electrostatic adsorption layer; 2. Fixing plate; 3. Fixing material; 4. Lower support plate; 5. Damping ball head; 6. Telescopic rod; 7. Buffer cavity; 8. Tension spring; 9. Upper support plate; 10. Power supply module; 11. Insulation layer; 12. Electrode layer; 13. Base layer; 14. Insulating silicone rubber; 15. Positive electrode; 16. Negative electrode; 17. Buffer cavity opening slot pressure plate; 18. Telescopic rod opening slot pressure plate; 19. Power supply line connection through hole; 20. Adhesive layer; 21. Protrusion block; 22. Annular slot; 23. Buffer cavity opening slot; 24. Telescopic rod internal through hole; 25. Protruding structure; 26. Telescopic rod opening slot; 27. Threaded hole; 28. Elongated hole; 29. ​​Central through hole. Implementation

[0031] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0032] See Figures 1-8 A large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks, the device includes a buffer module and an adsorption module, the adsorption module being bonded and fixed to the buffer module by insulating silicone rubber (preferably GD144).

[0033] The buffer module includes a power supply module 10, an upper support plate 9, a tension spring 8, a buffer cavity 7, a telescopic rod 6, a damping ball head 5, and a lower support plate 4. The power supply module 10 is fixed to the upper surface of the upper support plate 9, and the lower surface of the upper support plate 9 is connected to the buffer cavity 7 by screws. The edges of the lower surface of the upper support plate 9 and the upper surface of the lower support plate 4 are both fitted with spring slots, and a tension spring 8 is provided between the spring slots of the upper support plate 9 and the lower support plate 4. The telescopic rod 6 cooperates with the buffer cavity 7 and can slide along the central axis of the buffer cavity 7. One end of the telescopic rod 6 is provided with a damping ball head 5, which is matched with a universal damping ball joint fixed on the lower support plate 4.

[0034] The adsorption module includes an electrostatic adsorption layer 1, an adhesive layer 20, a fixing plate 2, and a buffer fixing material 3. The adhesive layer 20 is disposed on the outside of the electrostatic adsorption layer 1. The electrostatic adsorption layer 1 and the adhesive layer 20 are both bonded to the fixing plate 2 with insulating silicone rubber. The fixing plate 2 is bonded to the buffer fixing material 3 with insulating silicone rubber 14. The buffer fixing material 3 is bonded to the lower surface of the lower support plate 4 of the buffer module with insulating silicone rubber 14, thereby achieving a fixed connection between the adsorption module and the buffer module.

[0035] See Figure 6 and Figure 7 In specific implementation, the telescopic rod 6 has an annular protrusion 25 at one end that extends into the buffer cavity 7. The buffer cavity 7 has an annular groove 22 inside. When the telescopic rod 6 and the buffer cavity 7 slide relative to each other to the maximum position, the protrusion 25 is restricted in displacement by the annular groove 22 to prevent the telescopic rod 6 and the buffer cavity 7 from separating. The telescopic rod has an internal through hole 24, which is used to fix screws for positioning as reinforcing screws. The screws are symmetrically distributed, and their number and size can be changed according to the required screws to fix the thin plate-type buffer material.

[0036] In specific implementation, a total of 6 protrusions 21 are provided around the buffer cavity 7. The protrusions are provided with through holes. The screw passes through the through holes and is screwed into the threaded hole on the upper support plate 9. The buffer cavity 7 is filled with buffer material. The buffer material is a controllable gradient closed-cell foam material, which can achieve compression buffering after a single impact. Alternatively, materials such as aluminum wire mesh and non-Newtonian fluid can be used.

[0037] In specific implementation, the buffer fixing material 3 is a buffer silicone rubber, which can provide a certain buffering performance while ensuring a certain flatness of the electrostatic adsorption layer. In actual mechanisms, buffer sponge, ACF buffer material, etc. can also be used.

[0038] In specific implementation, the upper support plate 9 is a regular hexagonal flat plate with a spring slot at the center line of each side for fixing the spring 8. The spring 8 should be parallel to the buffer cavity 7 and the telescopic rod 6, and perpendicular to the upper support plate 9 and the lower support plate 4. The upper and lower support plates should be parallel to ensure the optimal collision buffering effect. The spring 8 between the spring slots of the upper support plate 9 and the lower support plate 4 has a preload.

[0039] See Figure 7 and Figure 8 In specific implementation, the universal damping ball joint 5 has a threaded hole 27, which is connected to the through hole 29 in the center of the lower support plate 4 through a countersunk screw and a washer. The tightness of the lower support plate 4 can be controlled by adjusting the countersunk screw, and the stiffness of the ball joint can be adjusted by adjusting the universal damping ball joint 5. The tension between the ball joint and the telescopic rod 6 is controlled by an internal hexagon screw.

[0040] In specific implementation, the fixing plate 2, the buffer fixing material 3 and the lower support plate 4 are provided with power supply line connection through holes 19. The telescopic rod 6 and the buffer cavity 7 each have a telescopic rod opening slot 26 and a buffer cavity opening slot 23 on their sides. Each opening slot is used for external circuit wiring. The buffer cavity opening slot pressure plate 17 and the telescopic rod opening slot pressure plate 18 are matched with the corresponding opening slots by two screws to fix the cable.

[0041] In specific implementation, the upper surface of the upper support plate 9 is connected to the buffer mechanism body and the required rear mechanism by screws. A recessed slot is opened in the middle part for fixing the external power supply equipment. The protruding part of the recessed slot has a through hole for the power supply equipment to run.

[0042] In a specific implementation, the electrostatic adsorption layer 1 includes an insulating layer 11, an electrode layer 12, and a base layer 13. The insulating layer 11 and the base layer 13 are bonded together by insulating silicone rubber 14, and the electrode layer 12 is disposed between the insulating layer 11 and the base layer 13. The insulating layer 11 and the base layer 13 are made of flexible organic polymer materials, such as polyimide (PI), polyethylene terephthalate (PET), polyvinylidene fluoride (PVDF), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polycarbonate (PC), polyurethane (PU), parylene (Parylene), silicone plastic, biaxially oriented polypropylene (BOPP) film, and other polymer films, as well as silicone rubbers such as PDMS, ECOFLEX0030, and ECOFLEX0050. The electrode layer 12 can be made of conductive materials such as copper, silver, conductive ink, and carbon nanotubes.

[0043] In specific implementation, the electrodes of the electrode layer 12 are arranged in a concentric, intersecting pattern, see [reference needed]. Figure 3 The positive electrode 15 and the negative electrode 16 are arranged alternately. The shape, width and gap of the electrodes are adjusted according to the applicable working conditions. The shape includes coplanar, comb-shaped and concentric circle types to achieve different adsorption effects and adsorption performance. The ratio of the electrode width to the electrode gap is 2:1. The electrode part adopts a dual-point dual-line redundant design. There is a set of positive and negative electrode terminals on each side. It can be powered by the power supply module at the same time or powered by the power supply module. If one end of the electrode breaks during the impact task, the other end can continue to supply power to maintain the stability of the electrostatic adsorption force. There are elongated holes 28 on both sides of the lower support plate at symmetrical positions. The terminals on both sides are fixed through the elongated holes 28 of the lower support plate and extend backward.

[0044] The size of the electrostatic adsorption layer 1 can be adjusted according to different application scenarios. Pressure-sensitive adhesive can be added to the adhesive layer 20 area to increase the adsorption performance. At the same time, when adsorbing after impact, the pressure-sensitive adhesive plays the adsorption role first, which can prolong the electrostatic adsorption polarization time to stabilize the electrostatic adsorption performance and ensure that the adsorption is controllable in the later stage.

[0045] The lower support plate has four symmetrical countersunk holes to reduce its weight, and the end material is connected to the lower support plate 4 via insulating silicone rubber 14.

[0046] During operation, when the impact angle is small, the damping elastic system begins to compress, and the telescopic rod 6 compresses the buffer material inside the buffer chamber 7. Due to the action of inertia and electrostatic adsorption, the attachment mechanism continues to move towards the impact target. Under the action of the flexible material and the damping elastic system, the speed gradually approaches 0. Under the action of the restoring force of the damping elastic system, the system returns to its original working state and achieves target attachment.

[0047] When the impact angle is large, one corner of the mechanism contacts the target first, and that point is the first to be impacted. The damping elastic system begins to compress. As the mechanism continues to move, the electrostatic adsorption area increases, and the electrostatic adsorption force gradually increases. Under the action of the flexible material and the damping elastic system, the velocity gradually approaches 0. Due to the deviation of the contact angle, the compression distance of the damping elastic system is inconsistent. Under the action of the restoring force of the damping elastic system, the attachment mechanism gradually shifts towards the normal direction until it returns to its original working state and comes to rest, thus completing the target attachment.

[0048] When the electrostatic adsorption layer is attached to the target surface, an excitation voltage is applied between the flexible electrodes by the power supply module (the voltage type of the power supply module between the electrode layers of the electrostatic adsorption layer can include DC, sine, square wave, etc.). The electric field generated causes the conductor to generate induced charges due to electrostatic induction, and causes the dielectric to generate polarized charges due to polarization. The generated charges attract each other with the charges of opposite polarity on the surface of the electrostatic adsorption layer, forming an electrostatic adsorption force and achieving the adsorption effect.

[0049] The large-angle electrostatic adsorption compliant buffer device of the present invention for impact adhesion tasks has a simple structure and is easy to operate. It can be adapted to different external mechanisms by adjusting the type, size and position of the mounting holes on the upper support plate. It uses the buffer material, tension spring and universal damping ball joint inside the buffer cavity to achieve buffering and self-adaptation. It is adsorbed by the end electrostatic adsorption module and can be applied to target surfaces with various surface roughness and materials.

[0050] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A large angle electrostatic chucking compliant cushioning device for impact- oriented attachment tasks, characterized by: The device includes a buffer module and an adsorption module, wherein the adsorption module is fixed to the buffer module by adhesive bonding with insulating silicone rubber. The buffer module includes a power supply module (10), an upper support plate (9), a tension spring (8), a buffer cavity (7), a telescopic rod (6), a damping ball head (5), and a lower support plate (4); the power supply module (10) is fixed to the upper surface of the upper support plate (9), the lower surface of the upper support plate (9) is connected to the buffer cavity (7) by screws, the edges of the lower surface of the upper support plate (9) and the upper surface of the lower support plate (4) are both fitted with spring slots, and a tension spring (8) is provided between the spring slots of the upper support plate (9) and the lower support plate (4); the telescopic rod (6) cooperates with the buffer cavity (7), the telescopic rod (6) can slide along the central axis of the buffer cavity (7), one end of the telescopic rod (6) is provided with a damping ball head (5), the damping ball head (5) cooperates with a universal damping ball joint fixed on the lower support plate (4); The telescopic rod (6) has an annular protrusion (25) at one end that extends into the buffer cavity (7). The buffer cavity (7) has an annular groove (22) inside. When the telescopic rod (6) and the buffer cavity (7) slide relative to each other to the maximum position, the protrusion (25) is restricted from displacement by the annular groove (22) to prevent the telescopic rod (6) and the buffer cavity (7) from separating. The telescopic rod has an internal through hole (24) for fixing screws as reinforcing screws. The screws are symmetrically distributed, and their number and size can be changed according to the required screws to fix thin plate-type buffer material. The universal damping ball joint (5) has a threaded hole (27) and is connected to the through hole (29) in the center of the lower support plate (4) by countersunk screws and washers. The tightness of the lower support plate (4) can be controlled by adjusting the countersunk screws. The stiffness of the ball joint can be adjusted by adjusting the universal damping ball joint (5). The tension between the ball joint and the telescopic rod (6) is controlled by an internal hexagon screw. The adsorption module includes an electrostatic adsorption layer (1), an adhesive layer (20), a fixing plate (2), and a buffer fixing material (3). The adhesive layer (20) is disposed on the outside of the electrostatic adsorption layer (1). The electrostatic adsorption layer (1) and the adhesive layer (20) are both bonded to the fixing plate (2) by insulating silicone rubber. The fixing plate (2) is bonded to the buffer fixing material (3) by insulating silicone rubber (14). The buffer fixing material (3) is bonded to the lower surface of the lower support plate (4) of the buffer module by insulating silicone rubber (14), thereby realizing the fixed connection between the adsorption module and the buffer module. The electrostatic adsorption layer (1) includes an insulating layer (11), an electrode layer (12), and a base layer (13). The insulating layer (11) and the base layer (13) are bonded together by insulating silicone rubber (14). An electrode layer (12) is provided between the insulating layer (11) and the base layer (13). The insulating layer (11) and the base layer (13) are made of flexible organic polymer material. Pressure-sensitive adhesive is added to the adhesive layer (20) area to increase the adsorption performance. The electrodes of the electrode layer (12) are arranged in a concentric circle cross pattern, with positive and negative electrodes arranged alternately. The ratio of the electrode width value to the electrode gap value is 2:

1. The electrode part adopts a dual-point dual-line redundant design, with a set of positive and negative electrode terminals on each side, which can be powered by the power supply module at the same time.

2. The large angle electrostatic chucking compliant bumper device for impact oriented attachment tasks of claim 1, wherein: The buffer cavity (7) is provided with protrusions (21) around its perimeter. The protrusions are provided with through holes. The screw passes through the through holes and is screwed into the threaded hole on the upper support plate (9). The buffer cavity (7) is filled with buffer material. Depending on the impact scenario, the buffer material is a controllable gradient closed-cell foam material, aluminum wire mesh, or non-Newtonian fluid.

3. The large angle electrostatic chucking compliant bumper device for impact oriented attachment tasks of claim 1, wherein: The upper support plate (9) is a regular hexagonal flat plate with a spring slot at the center line of each side for fixing the spring (8). The spring (8) between the upper support plate (9) and the lower support plate (4) has a preload.

4. The large angle electrostatic chucking compliant bumper device for impact oriented attachment tasks of claim 1, wherein: The fixing plate (2), the buffer fixing material (3) and the lower support plate (4) are provided with power supply line connection through holes (19). The telescopic rod (6) and the buffer cavity (7) each have a telescopic rod opening groove (26) and a buffer cavity opening groove (23) on their sides. Each opening groove is used for external circuit wiring. The opening groove pressure plate is matched with the corresponding opening groove by two screws to realize cable fixing.

5. The large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks according to claim 1, characterized in that: The upper support plate (9) connects the buffer mechanism body to the required rear mechanism by screws on its upper surface. A recessed slot is opened in the middle part for fixing the external power supply equipment. A through hole is opened in the protruding part of the recessed slot for the power supply equipment to run.

6. The large-angle electrostatic adsorption compliant buffer device for impact adhesion tasks according to claim 1, characterized in that: The pressure-sensitive adhesive in the adhesive layer (20) region increases the adsorption performance. When the adhesive adheres after impact, the pressure-sensitive adhesive plays the adsorption role first, which can prolong the electrostatic adsorption polarization time, so as to stabilize the electrostatic adsorption performance and ensure that the adsorption in the later stage is controllable.

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