A method and system for controlling the production and processing of reconstituted bamboo

Abstract

This invention discloses a method and system for controlling the production and processing of reconstituted bamboo, relating to the field of data processing technology. The method includes: acquiring the geometric information of the components of a first reconstituted bamboo core board; setting temperature sensors on the first reconstituted bamboo core board according to the geometric information, determining an upper sensor integration module and a lower sensor integration module; performing hot-pressing uniformity identification based on the upper sensor integration module to obtain upper contact heat uniformity, and performing hot-pressing uniformity identification based on the lower sensor integration module to obtain lower contact heat uniformity; obtaining contact heat difference; performing fitness optimization based on a heat uniformity optimization control model, and outputting a first thermal control parameter; and inputting the first thermal control parameter into the temperature control terminal of a first hot press for control. This invention solves the technical problems of incomplete consideration, low control quality, and low control efficiency in the production and processing control of reconstituted bamboo in the prior art, achieving the technical effect of improving the reliability of processing control.

Description

Technical Field

[0001] This invention relates to the field of data processing technology, specifically to a method and system for controlling the production and processing of reconstituted bamboo. Background Technology

[0002] Reconstituted bamboo is primarily produced through a hot-pressing process, and the quality of processing control during production is closely related to the final product quality. While sensors are now used to monitor the production process, the data analysis is often incomplete, resulting in unreliable data and failing to provide effective guidance for production control. Current technologies for reconstituted bamboo production and processing control suffer from incomplete considerations and low efficiency in quality control. Summary of the Invention

[0003] This application provides a method and system for controlling the production and processing of reconstituted bamboo, which addresses the technical problems of incomplete consideration, low control quality, and low control efficiency in the production and processing of reconstituted bamboo in the prior art.

[0004] In view of the above problems, this application provides a method and system for controlling the production and processing of reconstituted bamboo.

[0005] The first aspect of this application provides a method for controlling the production and processing of reconstituted bamboo, the method comprising:

[0006] Obtain the material geometry information of the first reconstituted bamboo core board;

[0007] According to the material geometry information, temperature sensing settings are applied to the first reconstituted bamboo core board to determine the upper sensing integration module and the lower sensing integration module. The upper sensing integration module is the sensor integration module set on the hot-pressing contact surface of the first reconstituted bamboo core board, and the lower sensing integration module is the sensor integration module set on the lower hot-pressing contact surface of the first reconstituted bamboo core board.

[0008] The upper contact heat uniformity is obtained by performing heat pressure uniformity identification based on the upper sensor integrated module, and the lower contact heat uniformity is obtained by performing heat pressure uniformity identification based on the lower sensor integrated module.

[0009] The contact thermal difference is obtained by identifying the upper sensor integration module and the lower sensor integration module.

[0010] The upper contact heat uniformity, the lower contact heat uniformity, and the contact heat difference are input into the heat uniformity optimization control model. The model is then used for fitness optimization, and the first thermal control parameter is output.

[0011] The first thermal control parameter is input into the temperature control terminal of the first hot press for control.

[0012] A second aspect of this application provides a control system for the production and processing of reconstituted bamboo, the system comprising:

[0013] A geometric information acquisition module is used to acquire the material geometry information of the first reconstituted bamboo core board;

[0014] The sensor integration determination module is used to set the temperature sensing of the first reconstituted bamboo core board according to the geometric information of the assembly materials, and to determine the upper sensor integration module and the lower sensor integration module. The upper sensor integration module is the sensor integration module set on the hot-pressing contact surface of the first reconstituted bamboo core board, and the lower sensor integration module is the sensor integration module set on the lower hot-pressing contact surface of the first reconstituted bamboo core board.

[0015] A thermal uniformity acquisition module is used to obtain the upper contact thermal uniformity by performing thermal pressure uniformity identification based on the upper sensor integrated module, and to obtain the lower contact thermal uniformity by performing thermal pressure uniformity identification based on the lower sensor integrated module.

[0016] A difference degree acquisition module is used to identify the contact heat difference degree using the upper sensing integration module and the lower sensing integration module.

[0017] A thermal control parameter output module is used to input the upper contact heat uniformity, the lower contact heat uniformity, and the contact heat difference into the thermal uniformity optimization control model, perform fitness optimization based on the thermal uniformity optimization control model, and output the first thermal control parameter.

[0018] The terminal control module is used to input the first thermal control parameters into the temperature control terminal of the first hot press for control.

[0019] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0020] This application obtains the geometric information of the first reconstituted bamboo core board, and then sets temperature sensing settings for the first reconstituted bamboo core board according to the geometric information. It determines an upper sensing integration module and a lower sensing integration module. The upper sensing integration module is a sensor integration module set on the hot-pressing contact surface of the first reconstituted bamboo core board, and the lower sensing integration module is a sensor integration module set on the lower hot-pressing contact surface of the first reconstituted bamboo core board. Based on the upper sensing integration module, hot-pressing uniformity is identified to obtain the upper contact thermal uniformity; based on the lower sensing integration module, hot-pressing uniformity is identified to obtain the lower contact thermal uniformity. Then, based on the upper and lower sensing integration modules, contact thermal difference is obtained. The upper contact thermal uniformity, lower contact thermal uniformity, and contact thermal difference are then input into a thermal uniformity optimization control model. The model is then used for fitness optimization, and a first thermal control parameter is output. This first thermal control parameter is input into the temperature control terminal of the first hot press for control. This achieves the technical effect of improving control efficiency and the quality of reconstituted bamboo hot pressing. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a process control method for the production and processing of reconstituted bamboo provided in an embodiment of this application;

[0023] Figure 2 This is a schematic flowchart illustrating the temperature sensing settings in a reconstituted bamboo production and processing control method provided in this application embodiment.

[0024] Figure 3 A schematic flowchart illustrating the control of a first hot press in a reconstituted bamboo production and processing control method provided in this application embodiment;

[0025] Figure 4 This is a schematic diagram of a reconstituted bamboo production and processing control system provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures: 11. Geometric information acquisition module; 12. Sensor integration determination module; 13. Thermal uniformity acquisition module; 14. Difference acquisition module; 15. Thermal control parameter output module; 16. Terminal control module. Detailed Implementation

[0027] This application provides a method and system for controlling the production and processing of reconstituted bamboo, which addresses the technical problems of incomplete consideration, low control quality, and low control efficiency in the production and processing of reconstituted bamboo in the prior art.

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] It should be noted that the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or modules that are not explicitly listed or that are inherent to such process, method, product, or device.

[0030] Example 1

[0031] like Figure 1 As shown, this application provides a method for controlling the production and processing of reconstituted bamboo, wherein the method includes:

[0032] Step S100: Obtain the material geometry information of the first reconstituted bamboo core board;

[0033] In one possible embodiment, the first reconstituted bamboo core board is any reconstituted bamboo core board that requires production and processing control and is made from bamboo bundles as constituent units using a hot-pressing process. The component geometry information describes the external geometric state of the base materials constituting the first reconstituted bamboo core board, including component length, component thickness, and component width. Obtaining the component geometry information lays the foundation for reliable subsequent temperature sensing settings.

[0034] Step S200: According to the material geometry information, temperature sensing settings are applied to the first reconstituted bamboo core board to determine the upper sensing integration module and the lower sensing integration module. The upper sensing integration module is the sensor integration module set on the hot-pressing contact surface of the first reconstituted bamboo core board, and the lower sensing integration module is the sensor integration module set on the lower hot-pressing contact surface of the first reconstituted bamboo core board.

[0035] Furthermore, such as Figure 2 As shown, according to the geometric information of the assembled materials, the temperature sensing settings are applied to the first reconstituted bamboo core board. In this embodiment, step S200 further includes:

[0036] Step S210: Perform array coordinate simulation based on the material geometry information to generate a first simulation coordinate set;

[0037] Step S220: Obtain the sensor attribute information of the first laying sensor, including the sensor patch size and sensor sensing range;

[0038] Step S230: Generate sensor installation conditions based on the sensor attribute information;

[0039] Step S240: Optimize the first simulated coordinate set according to the sensor installation conditions, and output the first optimized coordinate set;

[0040] Step S250: Set the temperature sensing for the upper and lower hot-pressing contact surfaces of the first reconstituted bamboo core board according to the first optimization coordinate set.

[0041] In one possible embodiment, the upper sensing integration module is a sensor integration module installed on the hot-pressing contact surface of the first reconstituted bamboo core board. The lower sensing integration module is a sensor integration module installed on the lower hot-pressing contact surface of the first reconstituted bamboo core board. The placement of temperature sensors on the hot-pressing contact surfaces of the first and lower reconstituted bamboo core boards is determined based on the geometric information of the composite materials. Since hot pressing is used in the production and processing of reconstituted bamboo core boards, temperature changes have a significant impact on the production quality of the bamboo core boards. Therefore, the more reasonable the temperature sensor settings, the more accurately the collected temperature data reflects the true state of production and processing, which can greatly improve the reliability of processing control. Preferably, the upper and lower sensing integration modules are obtained by optimizing the coordinates of the temperature sensor placement on the hot-pressing contact surfaces of the first and lower reconstituted bamboo core boards based on the geometric information of the composite materials.

[0042] In one possible embodiment, a first simulated coordinate set is obtained by inputting the material geometry information into an array coordinate simulation unit for coordinate simulation. The array coordinate simulation unit includes a mapping relationship between the material geometry information and the simulated coordinate set. Preferably, the mapping relationship is constructed by acquiring the material geometry information and simulated coordinate sets of multiple samples of the first reconstituted bamboo core board over a historical time period. Then, using the material geometry information as an index, a coordinate set matching search is performed in the array coordinate simulation unit to generate the first simulated coordinate set. The first simulated coordinate set includes the sensor patch placement location and the number of sensors.

[0043] In one embodiment, the first installation sensor is a device installed on the hot-pressing contact surface and the lower hot-pressing contact surface of the first reconstituted bamboo core board to collect the temperature of the contact surface. Sensor attribute information is obtained based on the factory information of the first installation sensor, including the sensor patch size and the sensor sensing range. The area constraint required for sensor installation is determined based on the sensor patch size, and the effective range constraint is used as the sensor sensing range constraint. These area and effective range constraints are then combined as the sensor installation conditions.

[0044] In one possible embodiment, by constraining and optimizing the first simulated coordinate set according to the sensor installation conditions, the coordinate set with the widest sensing range after installation is determined as the first optimized coordinate set. Then, based on the installation positions in the first optimized coordinate set, temperature sensors are installed on the upper and lower hot-pressing contact surfaces of the first reconstituted bamboo core board. This achieves the technical effect of ensuring the validity of the collected data.

[0045] Furthermore, temperature sensing is set for the first reconstituted bamboo core board. In this embodiment, step S200 further includes:

[0046] Step S260: Perform coordinate displacement based on the first optimization coordinate set to obtain the second optimization coordinate set;

[0047] Step S270: Set the temperature sensing settings for the upper hot-pressing contact surface of the first reconstituted bamboo core board according to the first optimization coordinate set, and set the temperature sensing settings for the lower hot-pressing contact surface of the first reconstituted bamboo core board according to the second optimization coordinate set.

[0048] In one possible embodiment, a second optimal coordinate set is obtained by performing coordinate displacement on the first optimal coordinate set. Preferably, the distance the first optimal coordinate set is moved downward along the Z-axis is determined based on the thickness of the first reconstituted bamboo core board, and the z-coordinate values ​​of the coordinate points in the first optimal coordinate set are adjusted according to this distance. Then, temperature sensing settings are applied to the upper hot-pressing contact surface of the first reconstituted bamboo core board according to the first optimal coordinate set, and temperature sensing settings are applied to the lower hot-pressing contact surface of the first reconstituted bamboo core board according to the second optimal coordinate set.

[0049] Furthermore, temperature sensing is set for the first reconstituted bamboo core board. In this embodiment, step S200 further includes:

[0050] Step S280: Based on the material geometry information, determine whether the thickness of the first reconstituted bamboo core board is greater than the preset thickness. If the thickness of the first reconstituted bamboo core board is greater than the preset thickness, obtain the side sensing integrated module.

[0051] Step S290: Add the sensing data of the side sensing integration module to the thermal uniformity optimization control model to adjust the output first thermal control parameter.

[0052] Specifically, the longitudinal sensing range of the temperature sensor is limited. When the thickness of the first reconstituted bamboo core board is greater than the preset thickness, the upper and lower sensing integration modules can only collect real-time temperature changes at the hot-pressing contact surfaces of the first reconstituted bamboo core board. They cannot accurately obtain the temperature changes between these two surfaces. Therefore, a side sensing integration module is needed to collect the temperature changes on the side of the first reconstituted bamboo core board. Preferably, the placement position of the sensing integration module on the side of the first reconstituted bamboo core board is obtained by inputting the material geometry information into the array coordinate simulation unit. Furthermore, the sensing data from the side sensing integration module is added to the thermal uniformity optimization control model to adjust the output first thermal control parameters, thereby improving the accuracy of the first thermal control parameters and enhancing the processing control quality.

[0053] Step S300: Perform hot-press uniformity identification based on the upper sensor integrated module to obtain the upper contact heat uniformity; perform hot-press uniformity identification based on the lower sensor integrated module to obtain the lower contact heat uniformity.

[0054] Step S400: Identify the contact thermal difference using the upper sensor integration module and the lower sensor integration module;

[0055] In one possible embodiment, by using an upper sensor integration module and a lower sensor integration module respectively to identify the uniformity of hot pressing, and collecting temperature data sets of the upper and lower contact surfaces during hot pressing, the upper contact thermal uniformity and lower contact thermal uniformity are obtained. Preferably, the upper and lower contact thermal uniformity are calculated using a uniformity calculation formula. The uniformity calculation formula is Y = (X... max -X min ) / (X max +X min Y represents the uniformity of contact heat, and X represents the uniformity of contact heat. max X is the maximum value in the temperature dataset. min It is the minimum value in the temperature data set. By inputting the temperature data sets of the upper and lower contact surfaces during hot pressing into the uniformity calculation formula, the upper contact thermal uniformity and lower contact thermal uniformity are obtained. The difference between the mean of the upper and lower contact surface temperature data sets during hot pressing is taken as the contact thermal difference, reflecting the temperature difference between the upper and lower contact surfaces of the first reconstituted bamboo core board.

[0056] Step S500: Input the upper contact heat uniformity, the lower contact heat uniformity, and the contact heat difference into the heat uniformity optimization control model, perform fitness optimization based on the heat uniformity optimization control model, and output the first thermal control parameter;

[0057] Furthermore, the expression for the thermal uniformity optimization control model is as follows:

[0058] H = C1g(x) 2 +C2g(y) 2 +f(t)g(x,y);

[0059] Where H is the fitness, g(x) is the cost function of upper contact thermal uniformity, g(y) is the cost function of lower contact thermal uniformity, C1 is the thermal weight coefficient of upper contact surface, C2 is the thermal weight coefficient of lower contact surface, g(x,y) is a function characterizing the contact thermal difference between upper and lower contact thermal uniformity, and f(t) is the heat transfer loss function of upper and lower contact surfaces based on temperature variable t.

[0060] In one possible embodiment, the thermal uniformity optimization model is a functional model that uses the upper contact thermal uniformity, the lower contact thermal uniformity, and the contact thermal difference as input data to obtain a first thermal control parameter. Based on the thermal uniformity optimization control model, the value of the temperature variable t at which the fitness is minimized is obtained, and this value of the temperature variable t is used as the first thermal control parameter. Thus, the goal of determining the temperature control parameters during the production process is achieved.

[0061] Step S600: Input the first thermal control parameter into the temperature control terminal of the first hot press for control.

[0062] Furthermore, such as Figure 3 As shown, step S600 in this embodiment further includes:

[0063] Step S610: Collect sample data of the historical operating conditions of the first hot press to obtain an operating condition sample dataset, wherein the operating condition sample dataset includes the temperature control dataset and the pressure control dataset of the first hot press.

[0064] Step S620: Perform temperature-pressure mapping on the working condition sample dataset and output the first mapped data set;

[0065] Step S630: Train the data using the first mapping data set to generate a temperature-pressure mapping model;

[0066] Step S640: Connect the temperature-pressure mapping model with the thermal uniformity optimization control model, and input the first thermal control parameter into the temperature-pressure mapping model to obtain the mapped first pressure parameter;

[0067] Step S650: Control the first hot press using the first thermal control parameter and the first pressure parameter.

[0068] Furthermore, step S610 in this embodiment of the application also includes:

[0069] Step S611: Obtain the component attribute information of the first reconstituted bamboo core board;

[0070] Step S612: Obtain the sample material attribute information corresponding to each working condition in the working condition sample dataset;

[0071] Step S613: Perform a similarity comparison between the material attribute information and the sample material attribute information to obtain a working condition sample dataset with attribute similarity greater than the preset attribute similarity.

[0072] In one possible embodiment, the first hot press is used to process the first reconstituted bamboo core board, and the temperature control terminal is used to control the operating temperature of the first hot press. By inputting the first thermal control parameters into the temperature control terminal of the first hot press, the operating temperature of the first hot press is controlled, thereby controlling the production and processing of the first bamboo core board.

[0073] Specifically, historical operating conditions of the first hot press are sampled to obtain sample operating data under different working states, which is the operating condition sample dataset. This operating condition sample dataset includes the temperature control dataset and pressure control dataset of the first hot press. Based on this operating condition sample dataset, a temperature-pressure mapping is constructed to determine the pressure parameters at different temperatures, obtaining a first mapping data set. This first mapping data set is used as training data; that is, the temperature-pressure mapping relationship in the first mapping data set serves as the operating logic for the temperature-pressure mapping model, thereby generating the temperature-pressure mapping model.

[0074] In one possible embodiment, the temperature-pressure mapping model is connected to the thermal uniformity optimization control model. The first thermal control parameter output by the thermal uniformity optimization control model is input into the temperature-pressure mapping model to obtain the first pressure parameter. Then, the first hot press is controlled using the first thermal control parameter and the first pressure parameter.

[0075] Specifically, the component attribute information describes the properties of the components of the first reconstituted bamboo core board, including component composition, component model, and component manufacturer. The component attribute information is obtained from the sample component data set corresponding to each working condition, and then compared with the data in the component attribute information. Preferably, a keyword comparison method is used. The set of keywords in the component attribute information is compared with the set of keywords corresponding to the sample component attribute information. The number of successfully matched keywords is determined, and this number is compared with the number of keywords in the set of keywords in the component attribute information. This ratio is used as the similarity score. The working condition sample data set is then filtered based on the similarity score. Sample data sets with similarity scores greater than the preset attribute similarity score are retained, while those with similarity scores less than the preset attribute similarity score are removed. This achieves the technical effect of improving the quality of the working condition sample data set and reducing the amount of data to be analyzed.

[0076] Other methods that can achieve the same or similar technical effects as the above-described embodiments are also within the scope of protection of this application.

[0077] In summary, the embodiments of this application have at least the following technical effects:

[0078] This application determines the placement of sensor integration modules based on the geometry of the reconstituted bamboo core board, achieving a more realistic sensor placement and improving the reliability of collected data. Then, based on the upper and lower sensor integration modules, it identifies the uniformity of heat pressing, obtaining the upper and lower contact heat uniformity and contact heat difference. This allows for analysis of the temperature distribution during the production and processing of the first reconstituted bamboo core board. Furthermore, a quantified heat uniformity optimization control model is used to obtain the first thermal control parameters, which are then used to control the temperature control terminal of the first hot press. This achieves the technical effect of improving the quality and efficiency of reconstituted bamboo production and processing control.

[0079] Example 2

[0080] Based on the same inventive concept as the reconstituted bamboo production and processing control method in the foregoing embodiments, such as Figure 4 As shown, this application provides a control system for the production and processing of reconstituted bamboo. The system and method embodiments in this application are based on the same inventive concept. The system includes:

[0081] The geometric information acquisition module 11 is used to acquire the material geometry information of the first reconstituted bamboo core board;

[0082] The sensor integration determination module 12 is used to set the temperature sensing of the first reconstituted bamboo core board according to the geometric information of the composite material, and to determine the upper sensor integration module and the lower sensor integration module. The upper sensor integration module is the sensor integration module set on the hot-pressing contact surface of the first reconstituted bamboo core board, and the lower sensor integration module is the sensor integration module set on the lower hot-pressing contact surface of the first reconstituted bamboo core board.

[0083] Thermal uniformity acquisition module 13 is used to obtain upper contact thermal uniformity by performing thermal pressure uniformity identification based on the upper sensing integrated module, and to obtain lower contact thermal uniformity by performing thermal pressure uniformity identification based on the lower sensing integrated module.

[0084] The difference degree acquisition module 14 is used to identify the contact heat difference degree by using the upper sensing integration module and the lower sensing integration module.

[0085] The thermal control parameter output module 15 is used to input the upper contact heat uniformity, the lower contact heat uniformity and the contact heat difference into the thermal uniformity optimization control model, perform fitness optimization according to the thermal uniformity optimization control model, and output the first thermal control parameter.

[0086] Terminal control module 16 is used to input the first thermal control parameters into the temperature control terminal of the first hot press for control.

[0087] Furthermore, the terminal control module 16 is used to perform the following methods:

[0088] Sample data of historical operating conditions of the first hot press are collected to obtain an operating condition sample dataset, wherein the operating condition sample dataset includes the temperature control dataset and the pressure control dataset of the first hot press;

[0089] Perform temperature-pressure mapping on the aforementioned working condition sample dataset and output the first mapped data set;

[0090] The temperature-pressure mapping model is generated by training the data using the first mapping data set.

[0091] Connect the temperature-pressure mapping model with the thermal uniformity optimization control model, and input the first thermal control parameter into the temperature-pressure mapping model to obtain the mapped first pressure parameter;

[0092] The first hot press is controlled using the first thermal control parameters and the first pressure parameters.

[0093] Furthermore, the terminal control module 16 is used to perform the following methods:

[0094] Obtain the component attribute information of the first reconstituted bamboo core board;

[0095] Obtain the sample material attribute information corresponding to each working condition in the working condition sample dataset;

[0096] A similarity comparison is performed between the material attribute information and the sample material attribute information to obtain a working condition sample dataset with attribute similarity greater than a preset attribute similarity.

[0097] Furthermore, the sensor integration determination module 12 is used to perform the following method:

[0098] Based on the material geometry information, an array coordinate simulation is performed to generate a first simulated coordinate set;

[0099] Obtain sensor attribute information of the first laying sensor, including sensor patch size and sensor sensing range;

[0100] Based on the sensor attribute information, sensor installation conditions are generated;

[0101] The first simulated coordinate set is optimized based on the sensor installation conditions, and the first optimized coordinate set is output.

[0102] Temperature sensing settings are applied to the upper and lower hot-pressing contact surfaces of the first reconstituted bamboo core board according to the first optimization coordinate set.

[0103] Furthermore, the sensor integration determination module 12 is used to perform the following method:

[0104] Based on the first optimal coordinate set, coordinate displacement is performed to obtain the second optimal coordinate set;

[0105] Temperature sensing settings are applied to the upper hot-pressing contact surface of the first reconstituted bamboo core board according to the first optimization coordinate set, and temperature sensing settings are applied to the lower hot-pressing contact surface of the first reconstituted bamboo core board according to the second optimization coordinate set.

[0106] Furthermore, the sensor integration determination module 12 is used to perform the following method:

[0107] Based on the material geometry information, determine whether the thickness of the first reconstituted bamboo core board is greater than a preset thickness. If the thickness of the first reconstituted bamboo core board is greater than the preset thickness, obtain the side sensing integrated module.

[0108] The sensor data from the side-sensor integration module is added to the thermal uniformity optimization control model to adjust the output first thermal control parameter.

[0109] Furthermore, the expression for the thermal uniformity optimization control model in the thermal control parameter output module 15 is as follows:

[0110] H = C1g(x) 2 +C2g(y) 2 +f(t)g(x,y);

[0111] Where H is the fitness, g(x) is the cost function of upper contact thermal uniformity, g(y) is the cost function of lower contact thermal uniformity, C1 is the thermal weight coefficient of upper contact surface, C2 is the thermal weight coefficient of lower contact surface, g(x, y) is a function characterizing the contact thermal difference between upper and lower contact thermal uniformity, and f(t) is the heat transfer loss function of upper and lower contact surfaces based on temperature variable t.

[0112] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, specific embodiments have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in a different order than that shown in the embodiments and still achieve the desired result. Additionally, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0113] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0114] This specification and accompanying drawings are merely illustrative examples of this application and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from its scope. Therefore, if such modifications and modifications fall within the scope of this application and its equivalents, this application intends to include such modifications and modifications.

Claims

1. A method for controlling the production and processing of reconstituted bamboo, characterized in that, The method includes: Obtain the material geometry information of the first reconstituted bamboo core board; According to the material geometry information, temperature sensing settings are applied to the first reconstituted bamboo core board to determine the upper sensing integration module and the lower sensing integration module. The upper sensing integration module is the sensor integration module set on the hot-pressing contact surface of the first reconstituted bamboo core board, and the lower sensing integration module is the sensor integration module set on the lower hot-pressing contact surface of the first reconstituted bamboo core board. The upper contact heat uniformity is obtained by performing heat pressure uniformity identification based on the upper sensor integrated module, and the lower contact heat uniformity is obtained by performing heat pressure uniformity identification based on the lower sensor integrated module. The contact thermal difference is obtained by identifying the upper sensor integration module and the lower sensor integration module. The upper contact heat uniformity, the lower contact heat uniformity, and the contact heat difference are input into the heat uniformity optimization control model. The model is then used for fitness optimization, and the first thermal control parameter is output. The first thermal control parameter is input into the temperature control terminal of the first hot press for control. The method for setting temperature sensing on the first reconstituted bamboo core board according to the material geometry information includes: Based on the material geometry information, an array coordinate simulation is performed to generate a first simulated coordinate set; Obtain sensor attribute information of the first laying sensor, including sensor patch size and sensor sensing range; Based on the sensor attribute information, sensor installation conditions are generated; The first simulated coordinate set is optimized based on the sensor installation conditions, and the first optimized coordinate set is output. Temperature sensing settings are applied to the upper and lower hot-pressing contact surfaces of the first reconstituted bamboo core board according to the first optimization coordinate set. The method for setting temperature sensing for the first reconstituted bamboo core board further includes: Based on the first optimal coordinate set, coordinate displacement is performed to obtain the second optimal coordinate set; Temperature sensing settings are applied to the upper hot-pressing contact surface of the first reconstituted bamboo core board according to the first optimization coordinate set, and temperature sensing settings are applied to the lower hot-pressing contact surface of the first reconstituted bamboo core board according to the second optimization coordinate set. The method for setting temperature sensing for the first reconstituted bamboo core board further includes: Based on the material geometry information, determine whether the thickness of the first reconstituted bamboo core board is greater than a preset thickness. If the thickness of the first reconstituted bamboo core board is greater than the preset thickness, obtain the side sensing integrated module. The sensor data from the side-sensor integration module is added to the thermal uniformity optimization control model to adjust the output first thermal control parameter.

2. The method as described in claim 1, characterized in that, The method further includes: Sample data of historical operating conditions of the first hot press are collected to obtain an operating condition sample dataset, wherein the operating condition sample dataset includes the temperature control dataset and the pressure control dataset of the first hot press; Perform temperature-pressure mapping on the aforementioned working condition sample dataset and output the first mapped data set; The temperature-pressure mapping model is generated by training the data using the first mapping data set. Connect the temperature-pressure mapping model with the thermal uniformity optimization control model, and input the first thermal control parameter into the temperature-pressure mapping model to obtain the mapped first pressure parameter; The first hot press is controlled using the first thermal control parameters and the first pressure parameters.

3. The method as described in claim 2, characterized in that, The method further includes: Obtain the component attribute information of the first reconstituted bamboo core board; Obtain the sample material attribute information corresponding to each working condition in the working condition sample dataset; A similarity comparison is performed between the material attribute information and the sample material attribute information to obtain a working condition sample dataset with attribute similarity greater than a preset attribute similarity.

4. The method as described in claim 1, characterized in that, The expression for the thermal uniformity optimization control model is as follows: ； Where H represents fitness. This is the cost function for achieving uniformity of heat in the upper contact area; This is the cost function for improving the uniformity of contact heat. This is the thermal weighting coefficient for the upper contact surface; This is the thermal weighting coefficient for the lower contact surface; A function characterizing the difference in contact heat between the upper and lower contact heat uniformities. This is a heat transfer loss function based on the temperature variable t of the upper and lower contact surfaces.

5. A control system for the production and processing of reconstituted bamboo, characterized in that, The system is used to execute the reconstituted bamboo production and processing control method according to any one of claims 1 to 4, the system comprising: A geometric information acquisition module is used to acquire the material geometry information of the first reconstituted bamboo core board; The sensor integration determination module is used to set the temperature sensing of the first reconstituted bamboo core board according to the geometric information of the assembly materials, and to determine the upper sensor integration module and the lower sensor integration module. The upper sensor integration module is the sensor integration module set on the hot-pressing contact surface of the first reconstituted bamboo core board, and the lower sensor integration module is the sensor integration module set on the lower hot-pressing contact surface of the first reconstituted bamboo core board. A thermal uniformity acquisition module is used to obtain the upper contact thermal uniformity by performing thermal pressure uniformity identification based on the upper sensor integrated module, and to obtain the lower contact thermal uniformity by performing thermal pressure uniformity identification based on the lower sensor integrated module. A difference degree acquisition module is used to identify the contact heat difference degree using the upper sensing integration module and the lower sensing integration module. A thermal control parameter output module is used to input the upper contact heat uniformity, the lower contact heat uniformity, and the contact heat difference into the thermal uniformity optimization control model, perform fitness optimization based on the thermal uniformity optimization control model, and output the first thermal control parameter. The terminal control module is used to input the first thermal control parameters into the temperature control terminal of the first hot press for control.

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