A high-efficiency, multi-angle force-controlled cleaning device and fully automatic cleaning machine

Abstract

The present disclosure relates to an efficient, multi-angle force-controlled cleaning device and a fully automatic cleaning machine, comprising a base and a first transmission structure and a second transmission structure mounted on the base; the first transmission structure is provided with a carrier platform for placing products to be cleaned, and the first transmission structure is used to control the movement of the carrier platform on a horizontal plane; the second transmission structure is provided with a cleaning structure for controlling the movement of the cleaning structure along the length direction of the second transmission structure; the cleaning structure comprises a linear module, an angle motor, a rotary motor and a clamp, the linear module controls the vertical movement of the rotary motor, the rotary motor controls the inclination angle of the axis of the rotary motor relative to the vertical line, the rotary motor controls the rotation angle of the clamp around the axis, and the clamp holds a glue stick. The present disclosure can adjust the angle at which the glue stick removes dust, thereby improving the utilization rate of the glue stick.

Description

Technical Field

[0001] The present disclosure relates to the field of chip cleaning technology, and in particular to a high-efficiency, multi-angle force-controlled cleaning device and a fully automatic cleaning machine. Background Art

[0002] Currently, in order to remove dust from semiconductor chips, the relevant technology uses a single glue stick to remove dust. The glue stick only uses one contact point to contact the semiconductor chip product when removing dust. Since the glue stick uses the same contact point to repeatedly remove dust, it will cause secondary contamination of the semiconductor chip product. Therefore, the glue stick needs to be replaced, resulting in low utilization of the glue stick and serious waste of the glue stick. Summary of the Invention

[0003] In order to solve at least one of the above-mentioned technical problems, the present disclosure provides a high-efficiency, multi-angle force-controlled cleaning device and a fully automatic cleaning machine.

[0004] According to some embodiments of the present disclosure, a high-efficiency, multi-angle force-controlled cleaning device is provided, the device comprising a base and a first transmission structure and a second transmission structure mounted on the base; a carrier platform is provided on the first transmission structure, the carrier platform is used to place products to be cleaned, and the first transmission structure is used to control the movement of the carrier platform on a horizontal plane; a cleaning structure is provided on the second transmission structure, and the second transmission structure is used to control the movement of the cleaning structure along the length direction of the second transmission structure; the cleaning structure comprises a linear module, an angular motor connected to the linear module, a rotary motor connected to the angular motor, and a clamp mounted at the bottom of the rotary motor, the linear module controls the movement of the rotary motor in a vertical direction, the rotary motor controls the inclination angle of the axis of the rotary motor relative to the vertical line, the rotary motor controls the rotation angle of the clamp around the axis, and the clamp holds a glue stick.

[0005] Based on the above solution, the angle motor adjusts the tilt angle of the glue stick, and cooperates with the rotary motor to adjust the rotation angle of the glue stick around the axis, so that the glue stick can clean the product at different contact points, avoiding secondary contamination of the product caused by multiple sticking and removing from the same contact point, and also improving the utilization rate of the glue stick.

[0006] In some possible embodiments, the first transmission structure includes a first linear motor and a second linear motor, the second linear motor is installed on the top of the first linear motor, the moving direction of the second linear motor is parallel to the moving direction of the second transmission structure, the moving direction of the first linear motor is perpendicular to the moving direction of the second linear motor, a first mounting plate is provided on the top of the second linear motor, and the carrier platform is installed on the first mounting plate.

[0007] Based on the above scheme, the first linear motor is the X-axis linear motor, and the second linear motor is the Y-axis linear motor. The movement of the two-axis motors can realize the movement of the carrier platform on the horizontal plane. The structure is simple and easy to implement, and the control accuracy is high.

[0008] In some possible implementations, a vision platform is provided on the first mounting plate, the vision platform is installed side by side with the carrier platform, and a vision device is installed on the vision platform, and the vision device is used to monitor the cleaning process of the product.

[0009] Based on the above solution, during the process of cleaning semiconductor chip products with glue sticks, visual equipment detects whether there are any abnormalities in the cleaning process, realizes the effect of automatic monitoring cleaning and feedback control, and improves the cleaning effect of glue sticks on products.

[0010] In some possible embodiments, the second transmission structure includes a gantry and a third linear motor, the track of the third linear motor is installed parallel to the bottom of the crossbeam of the gantry, a second mounting plate is provided on the side of the third linear motor, a slider is provided on the top of the second mounting plate, the slider is slidably installed on the crossbeam of the gantry, and the cleaning structure is installed on the second mounting plate.

[0011] Based on the above solution, by setting up a gantry, the height of the cleaning structure can be increased, and with the precise displacement of the third linear motor, the cleaning structure can be suspended above the product to be cleaned, and dust can be removed from the surface of the product from above.

[0012] In some possible implementations, a mounting frame is provided on one side column of the gantry, and a glue stick library is installed on the mounting frame. The glue stick library is used to store glue sticks.

[0013] Based on the above solution, the cleaning structure is moved to the glue stick library on one side of the gantry by the third linear motor, which can realize automatic replacement of glue sticks and improve the cleaning speed of semiconductor chip products.

[0014] In some possible implementations, the linear module of the cleaning structure is a high-precision module, and the high-precision module is communicatively connected to a controller of the device.

[0015] Based on the above solution, the high-precision module can improve the accuracy of the up and down movement of the cleaning structure, thereby accurately controlling the pressure of the glue stick on the product to be cleaned, ensuring that the glue stick can remove all dust on the product, while also preventing the glue stick from exerting too much pressure on the product, causing the glue stick to deform and break, or causing damage to the product.

[0016] In some possible implementations, the clamp includes a suction nozzle and a vacuum port connected to the suction nozzle, the vacuum port is connected to an external vacuum air pipe, and the suction nozzle is used to suck the glue stick.

[0017] Based on the above solution, the clamp pneumatically adsorbs the glue stick through the suction nozzle. The structure is simple and easy to implement, and the number of parts included is small, which can simplify the structural complexity of the clamp. The pneumatic adsorption has a strong adsorption force and a firm clamping effect on the glue stick.

[0018] In some possible implementations, a pressure sensor is provided on the clamp, and the pressure sensor is used to detect the pressure exerted on the product by the glue stick when cleaning the product. The pressure sensor is communicatively connected to a controller of the device.

[0019] Based on the above scheme, the device can detect the pressure of the glue stick when cleaning the product in real time, and provide timely feedback and adjustment, which can achieve the purpose of dynamic monitoring, thereby achieving the effect of dynamic force control of the glue stick cleaning process.

[0020] According to other embodiments of the present disclosure, a fully automatic cleaning machine is provided, comprising a high-efficiency, multi-angle force-controlled cleaning device according to any one of the above embodiments.

[0021] In some possible embodiments, the above-mentioned fully automatic cleaning machine also includes a shell, a fan filter unit is provided on the top of the shell, the fan filter unit is used to remove dust and filter the inside of the shell, and at least one of an industrial computer, a touch screen and a button switch is provided on the shell.

[0022] Based on the above solution, a fan filter unit is installed on the shell to make the interior of the shell a dust-free operating space, avoiding secondary pollution caused by the environment when the glue stick is used to clean the product. In conjunction with an industrial computer, touch screen and button switches, the degree of automation of the cleaning machine is further improved.

[0023] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

[0024] The implementation of this disclosure has the following beneficial effects:

[0025] The present invention can adjust the inclination angle of the glue stick relative to the vertical line and the rotation angle of the glue stick around its axis, thereby changing the contact point between the glue stick and the product, allowing the glue stick to clean the product at different contact points, avoiding secondary contamination caused by repeated cleaning of the same contact point of the glue stick, and also increasing the number of contact points of the glue stick used for cleaning, thereby improving the utilization rate of the glue stick.

[0026] Further features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions and advantages of the embodiments of this specification or the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 A schematic diagram showing an efficient multi-angle force-controlled cleaning device according to an embodiment of the present disclosure is shown;

[0029] Figure 2 A schematic diagram showing a cleaning structure according to an embodiment of the present disclosure;

[0030] Figure 3 A schematic diagram illustrating contact points of a glue area of ​​a glue stick according to an embodiment of the present disclosure;

[0031] Figure 4 A schematic diagram showing a first transmission structure according to an embodiment of the present disclosure;

[0032] Figure 5 A schematic diagram showing a second transmission structure according to an embodiment of the present disclosure;

[0033] Figure 6 A schematic diagram showing a glue stick library according to an embodiment of the present disclosure;

[0034] Figure 7 A schematic diagram illustrating a fixture of a cleaning structure according to an embodiment of the present disclosure;

[0035] Figure 8 A schematic diagram illustrating a visual platform according to an embodiment of the present disclosure;

[0036] Figure 9 A schematic diagram of a fully automatic cleaning machine according to an embodiment of the present disclosure is shown.

[0037] In the picture:

[0038] 1-base; 2-first transmission structure; 21-first linear motor; 22-second linear motor; 3-second transmission structure; 31-gantry; 32-third linear motor; 4-carrier platform; 5-cleaning structure; 51-linear module; 52-angle motor; 53-rotary motor; 54-fixture; 541-suction nozzle; 542-vacuum port; 6-visual platform; 7-glue stick magazine; 8-pressure sensor; 9-fan filter unit; 10-industrial computer; 11-touch screen; 12-button switch. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this invention.

[0040] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way are interchangeable where appropriate so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0041] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0042] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0043] The term "and / or" herein simply describes an association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent the existence of three situations: A alone, A and B simultaneously, and B alone. Furthermore, the term "at least one" herein refers to any combination of at least two of any one or more of a plurality of items. For example, "at least one of A, B, and C" can represent any one or more elements selected from the set consisting of A, B, and C.

[0044] In addition, numerous specific details are provided in the following detailed description to better illustrate the present disclosure. Those skilled in the art will appreciate that the present disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of the present disclosure.

[0045] To facilitate understanding of the present disclosure, the following technical terms used in the present disclosure are explained:

[0046] FFU: The full name of FFU is Fan Filter Unit, which is a self-powered air filter device. It is a modular terminal air supply device with filtering function. It is widely used in clean rooms, clean operating tables, clean production lines, assembled clean rooms and local Class 100 applications.

[0047] In order to facilitate understanding of the present disclosure, the coordinate axes appearing in the embodiments of the present disclosure are described below. Please refer to Figure 4 In the figure, the length direction of the gantry's beam corresponds to the Y-axis, the length direction of the gantry's column corresponds to the Z-axis, and the X-axis is defined as an axis perpendicular to both the Y-axis and the Z-axis. The length direction of the first linear motor in the figure corresponds to the X-axis.

[0048] Currently, when cleaning semiconductor chips, a glue stick is typically used to remove dust from the semiconductor chip product. The glue stick includes a stick body and a glue area disposed at one end of the stick body, the glue area being in the shape of a water drop or bead. When using such a glue stick to remove dust, a single glue stick is required for each cleaning operation, and the glue stick is used to perform a point-on adhesion to the semiconductor chip. That is, the glue area at the head of the glue stick contacts the semiconductor chip in a point-like manner, removing dust from the corresponding contact surface. The point-like surface can be considered a contact point, and generally, the contact point is the center point of the bottom of the water drop or bead-like glue area. In other words, the glue stick cleans the semiconductor chip by applying a point-on adhesion to the semiconductor chip in a manner such that the glue area is directed vertically downward.

[0049] After the above-mentioned glue stick cleans multiple locations on the surface of the semiconductor chip, a large amount of dust adheres to the contact point, and the dust will gradually accumulate into a layer, covering the surface of the contact point, resulting in a decrease in the viscosity of the contact point. At this time, if the semiconductor chip is still cleaned with the contact point, the dust will not be effectively adhered due to the decrease in the viscosity of the contact point, resulting in a deterioration in the cleaning effect; there is even a situation where dust falls off from the glue area onto the semiconductor chip, causing secondary contamination. In the related art, in order to avoid secondary contamination, after the glue stick is used to stick the semiconductor chip once or a small number of times at a contact point, a new glue stick needs to be replaced, resulting in low utilization of the glue stick and serious waste of materials.

[0050] In order to solve the above-mentioned technical problems, the embodiments of the present disclosure provide a high-efficiency, multi-angle force-controlled cleaning device. The device can change the angle of the glue stick by setting a transmission mechanism. After one contact point of the glue stick is adhered to the semiconductor chip product, the contact point between the glue stick and the semiconductor chip can be adjusted, and the new contact point can be used to clean the product, thereby making full use of the contact area of ​​the glue zone of the glue stick and avoiding the problem of secondary contamination.

[0051] In some embodiments of the present disclosure, please refer to Figure 1 The above-mentioned device includes a base 1 and a first transmission structure 2 and a second transmission structure 3 installed on the base 1; a carrier platform 4 is provided on the first transmission structure 2, the carrier platform 4 is used to place the product to be cleaned, and the first transmission structure 2 is used to control the movement of the carrier platform 4 on a horizontal plane; a cleaning structure 5 is provided on the second transmission structure 3, and the second transmission structure 3 is used to control the cleaning structure 5 to move along the length direction of the second transmission structure 3; the cleaning structure 5 includes a linear module 51, an angle motor 52 connected to the linear module 51, a rotating motor 53 connected to the angle motor 52 and a clamp 54 installed at the bottom of the rotating motor 53, the linear module 51 controls the rotating motor 53 to move in the vertical direction, the rotating motor 53 controls the inclination angle of the axis of the rotating motor 53 relative to the vertical line, the rotating motor 53 controls the rotation angle of the clamp 54 around the axis, and the clamp 54 clamps the glue stick.

[0052] In the above embodiment, the first transmission structure 2 holds up the carrier platform 4, driving the carrier platform 4 to move in the plane formed by the X-axis and the Y-axis, the cleaning structure 5 is located above the carrier, and the second transmission structure 3 drives the cleaning structure 5 to move along the Y-axis. Based on the above scheme, the carrier platform 4 and the product to be cleaned carried by it move over a large range, the second transmission structure 3 drives the cleaning structure 5 to move over a small range, and the cleaning structure 5 controls the macro adjustment of the glue stick, that is, controls the inclination angle, the rotation angle around the axis, and the up and down movement distance of the glue stick, thereby adjusting the contact point of the glue area of ​​the glue stick. When the cleaning structure 5 clamps the glue stick to clean the product, the second transmission structure 3 and the cleaning structure 5 are mainly used to adjust the position of the glue stick so that it is aligned with the product to be cleaned with different contact points, and the first transmission structure 2 adjusts the position of the product to be cleaned so that the cleaning area corresponding to the product to be cleaned is aligned with the contact point of the glue stick. Then the cleaning structure 5 clamps the glue stick and moves it down and up to complete the point sticking operation. During the above-mentioned cleaning process of the glue stick, the device controls the adjustment angle of the glue stick and controls the position of the product to be cleaned to find the glue stick, that is, the device separates the positioning operation during cleaning from the cleaning structure 5, and completes the positioning function during cleaning through the independently set first transmission structure 2, which can reduce the complexity of the second transmission structure 3 and the cleaning structure 5, thereby reducing the difficulty of control and positioning during cleaning.

[0053] In the above examples, please refer to Figure 2The bottom of the linear module 51 of the cleaning structure 5 is connected to a vertical mounting plate, and the angle motor 52 is fixedly mounted on the bottom end of the vertical mounting plate. The output shaft of the angle motor 52 is parallel to the Y axis, and the output shaft of the angle motor 52 is connected to the side plate of the rotary motor 53. In the initial state, the output shaft of the rotary motor 53 is parallel to the Z axis, that is, the rotary motor 53 is facing downward by default in the initial state. The output shaft of the rotary motor 53 is connected to a clamp 54, which clamps the glue stick. The axis of the clamp 54, the axis of the glue stick and the axis of the output shaft of the rotary motor 53 are the same. The adjustment process of the above-mentioned cleaning structure 5 includes: first, keeping the glue stick in a vertical state to perform spot-stick cleaning on the product; then the output shaft of the angle motor 52 rotates a first angle stroke, and the axis of the rotating motor 53, the clamp 54 and the glue stick produces an inclined angle with the vertical line (i.e., the Z axis). At this time, the glue stick replaces a new contact point, the linear module 51 moves downward, and the glue stick cleans the product through the new contact point; then, the rotating motor 53 rotates a second angle stroke, and the glue stick replaces a new contact point again. After one spot-stick cleaning action, the rotating motor 53 repeats the rotation action until the glue stick completes one circle.

[0054] It should be understood that during the adjustment process of the above-mentioned cleaning structure 5, the angle motor 52 can rotate multiple times, and the stroke of each rotation of the angle motor 52 may be inconsistent, that is, the angle motor 52 rotates a first angle stroke, and after the rotary motor 53 controls the glue stick to rotate one circle, the angle motor 52 rotates a first angle stroke again, and the first angle strokes of the two rotations of the angle motor 52 are different. On the other hand, the second angle stroke of the rotary motor 53 is adjusted according to the first angle stroke of the angle motor 52. The glue area of ​​the glue stick is regarded as spherical, and the contact points in the glue area should meet the following two requirements: the contact points cannot overlap with each other, and the contact points are arranged as closely as possible. When the glue stick is not vertically downward, the contact point change trajectory is a circular ring. Therefore, as the number of rotations of the angle motor 52 increases, the radius of the corresponding contact point change trajectory circular ring increases, and the corresponding number of times the rotary motor 53 controls the glue stick to rotate one circle also increases. In a specific embodiment, the angle motor 52 rotates twice, and the distribution diagram of the contact points of the corresponding glue stick on the glue area is as shown in FIG. Figure 3 As shown, when the angle motor 52 rotates for the second time compared to the first time, the rotation number of the rotary motor 53 increases, and the corresponding number of contact points also increases.

[0055] In the embodiments of the present disclosure, the specific implementation method of the first transmission structure 2 is not limited. That is to say, the first transmission structure 2 can be a transmission structure implemented based on a rotating coordinate system, and the coordinate parameters of the rotating coordinate axis are the distance between the coordinate point and the origin, and the angle between the line connecting the coordinate point and the origin and the reference line. Therefore, the telescopic component can be installed on the rotating component to simulate the operation mode of the rotating coordinate axis. The telescopic component is used to match the line distance, and the rotating component is used to match the angle. The first transmission structure 2 can also be a transmission structure implemented based on a plane vertical coordinate system. The coordinate parameters of the vertical coordinate system are the projection point position of the coordinate point on the X-axis and the projection point position of the coordinate point on the Y-axis. Therefore, the first transmission structure 2 can be configured as two mutually perpendicular linear motion structures. The two linear motion structures move independently of each other to realize a plane vertical coordinate system. In addition, the second transmission structure 3 can also be configured as a two-axis robot or an AGV car along a pre-laid two-dimensional guide line.

[0056] In some embodiments of the present disclosure, please refer to Figure 4 The first transmission structure 2 selects a transmission structure based on a plane vertical coordinate system. The first transmission structure 2 includes a first linear motor 21 and a second linear motor 22. The second linear motor 22 is installed on the top of the first linear motor 21. The moving direction of the second linear motor 22 is parallel to the moving direction of the second transmission structure 3, that is, the second linear motor 22 is a Y-axis linear motor. The moving direction of the first linear motor 21 is perpendicular to the moving direction of the second linear motor 22, that is, the first linear motor 21 is an X-axis linear motor. A first mounting plate is provided on the top of the second linear motor 22, and the carrier platform 4 is mounted on the first mounting plate.

[0057] Based on the above embodiment, the transmission structure implemented based on the plane vertical coordinate system is selected to reduce the difficulty of the first transmission structure 2 carrying the product when cleaning and positioning. Since the first linear motor 21 and the second linear motor 22 correspond to the X-axis and Y-axis of the coordinate point respectively, that is, the first linear motor 21 only needs to obtain the X parameter change vector of the coordinate point before and after the movement, and the second linear motor 22 only needs to obtain the Y parameter change vector of the coordinate point before and after the movement. The first transmission structure 2 can complete the movement instruction of the carrier platform 4 and align the part of the product to be cleaned with the contact point of the glue stick. Since the movement of the first linear motor 21 and the second linear motor 22 is based on a parameter and the two are based on different parameters, the first linear motor 21 and the second linear motor 22 can move at the same time, which can shorten the positioning movement time and increase the positioning speed. In addition, the parameters based on the movement are derived from the successive coordinate points. The successive coordinate points only need to perform a subtraction operation to obtain the vector movement instructions of the first linear motor 21 and the second linear motor 22. The entire calculation process does not involve complex conversion steps, the structure is simple and the reliability is strong, and the transmission structure is based on linear motors and has high precision.

[0058] In some embodiments of the present disclosure, please refer to Figure 5 The second transmission structure 3 includes a gantry 31 and a third linear motor 32. The track of the third linear motor 32 is installed parallel to the bottom of the crossbeam of the gantry 31. A second mounting plate is provided on the side of the third linear motor 32. A slider is provided on the top of the second mounting plate. The slider is slidably mounted on the crossbeam of the gantry 31. The above-mentioned cleaning structure 5 is installed on the second mounting plate. Based on the above embodiment, by setting the gantry 31, the effect of the cleaning structure 5 being suspended above the product is achieved. The cleaning structure 5 can clamp the glue stick, and the glue area of ​​the glue stick is aligned downward with the product for cleaning. The third linear motor 32 is a Y-axis linear motor. The purpose of setting the third linear motor 32 is that after the glue stick reaches the upper limit of the number of uses, the third linear motor 32 drives the cleaning structure 5 to move to one end of the crossbeam, and the glue stick is away from the product, and then the glue stick can be replaced. In the above embodiment, since the cleaning structure 5 contains many parts and the overall weight is large, and the cleaning structure 5 is installed on one side of the third linear motor 32, the force distribution is not uniform. Therefore, in order to avoid the third linear motor 32 from moving the cleaning structure 5 inaccurately and to protect the third linear motor 32 from damage, a slider is provided on the top of the above-mentioned second mounting plate. The slider can slide on the crossbeam of the gantry 31, thereby reducing the driving force requirement of the third linear motor 32, so that the movement of the cleaning structure 5 is smoother and more precise.

[0059] In some embodiments of the present disclosure, please refer to Figure 6 , a mounting frame is provided on one side column of the gantry 31 of the second transmission structure 3, and a glue stick library 7 is installed on the mounting frame. The glue stick library 7 is used to store glue sticks. Based on the above embodiment, the problem to be solved is that when the number of times a glue stick is used reaches the upper limit, it needs to be replaced with a new glue stick. In the related art, the operator of the device usually replaces it manually. During the replacement process, there is a problem of secondary contamination of the product due to improper operation of the operator. Therefore, a glue stick library 7 is provided on one side of the gantry 31. After a single glue stick reaches the upper limit of the number of uses, the third linear motor 32 carries the cleaning structure 5 to move toward the side column where the glue stick library 7 is provided. The cleaning structure 5 adjusts the angle of the glue stick so that it is aligned with the glue stick library 7, and then puts the used glue stick into the storage position of the glue stick library 7, and then clamps a new glue stick. Through the above setting and operation, the device can realize automatic replacement of glue sticks, which can avoid the secondary contamination problem of manual replacement of glue sticks and reduce the length of downtime for material replacement, thereby improving the efficiency of cleaning.

[0060] In the disclosed embodiment, the clamp 54 of the cleaning structure 5 is not limited to a single clamping component, but should include one or more of a clamping member, a retaining member, a transmission member, and a driving member for clamping the glue stick. In one possible embodiment, the clamp 54 may include a clamping jaw and a locking nut, in which case the clamp 54 needs to be manually operated to clamp the glue stick; in one possible embodiment, the clamp 54 includes a clamping jaw, a transmission rod, and a servo motor, and the servo motor controls the clamping jaw to contract and expand through the transmission rod, thereby automatically clamping the glue stick; in one possible embodiment, the clamp 54 includes a dishwashing hand component and an air pump, and the air pump is connected to the suction cup hand component through an air pipe to control the suction cup hand component to clamp the glue stick.

[0061] In a specific embodiment, please refer to Figure 7 , the above-mentioned fixture 54 includes a suction nozzle 541 and a vacuum port 542 connected to the suction nozzle 541, the vacuum port 542 is connected to an external vacuum air pipe, and the above-mentioned suction nozzle 541 is used to suck the glue stick. Based on the above embodiment, the way in which the fixture 54 clamps the glue stick is to pneumatically adsorb the glue stick through the air nozzle. The component structure of the fixture 54 is simple, the number of parts included is small, the manufacturing difficulty of the suction nozzle 541 is low, the structural complexity of the fixture 54 is low, and it is easy to assemble and realize. In addition, a vacuum air pipe (i.e., industrial high-pressure gas) is used as a driving mode for clamping. This driving mode is simple and easy to use, and the adsorption force of pneumatic adsorption is strong, the clamping effect on the glue stick is tight, the glue stick is evenly stressed, and the strength of the glue stick is high when the product is cleaned.

[0062] In some embodiments of the present disclosure, the linear module 51 of the cleaning structure 5 is a high-precision module that is communicatively connected to the controller of the device. The above-mentioned high-precision module refers to a linear module 51 that can be moved and controlled with a small moving distance scale (such as 0.001m, 0.0001m, 0.00001m, etc.) to achieve high precision requirements. Specifically, it can be configured as a screw drive linear module, a synchronous belt drive linear module, a guide rail slide linear module, etc. Based on the above embodiments, the problem to be solved is how to accurately control the pressure of the glue stick when cleaning the product. Since the glue stick removes dust by point sticking, in order to ensure that the dust can be removed, the contact point of the glue area should be in full contact with the product to be cleaned, that is, the pressure of the glue stick should be greater than the minimum pressure; on the other hand, when the pressure of the glue stick is too high, the glue area of ​​the glue stick is at risk of sticking to the product, and the glue stick itself is insufficient in strength, causing bending, deformation, or even breaking. In addition, when the glue stick is cleaning the product, excessive pressure can also cause the product to be damaged. By setting up the above-mentioned high-precision module, the accuracy of the up and down movement of the cleaning structure 5 can be improved, and there will be no sudden changes in the pressure of the glue stick on the product to be cleaned, thereby accurately controlling the pressure of the glue stick to ensure that the glue stick can remove the dust on the product. At the same time, it also avoids excessive pressure of the glue stick on the product, which may cause the glue stick to deform and break or damage the product.

[0063] In some embodiments of the present disclosure, a pressure sensor 8 is provided on the fixture 54 of the cleaning structure 5. The pressure sensor 8 is used to monitor the pressure applied to the product by the glue stick when cleaning the product. The pressure sensor 8 is in communication with the controller of the device. Based on the above scheme, the device can detect the pressure applied to the product by the glue stick in real time through the pressure sensor 8, and promptly provide feedback to the linear module 51 or the high-precision module. The linear module 51 or the high-precision module adjusts the downward pressure distance of the glue stick and adjusts the pressure applied to the product in real time, thereby achieving the purpose of dynamic monitoring. During the glue stick cleaning process, the dynamic force control effect is achieved by combining pressure detection with high-precision pressure control.

[0064] In the above embodiment, the specific type and structure of the pressure sensor 8 are not limited. That is to say, the pressure sensor 8 can be a piezoelectric device, a pressure-sensitive device, a pressure-thermal device, or a detection circuit / device / apparatus implemented based on the pressure sensor 8. The pressure sensor 8 can also be a device or apparatus that measures other parameters and processes the measured data into film-sticking pressure parameters, such as a visual component that calculates the film-sticking pressure by detecting the deformation of the glue area of ​​the glue stick.

[0065] In some embodiments of the present disclosure, please refer to Figure 8 A visual platform 6 is also provided on the first mounting plate of the second linear motor 22. The visual platform 6 is installed side by side with the carrier platform 4. A visual device is installed on the visual platform 6. The visual device is used to monitor the cleaning process of the product.

[0066] In the above embodiment, the specific configuration selection of the visual device is not limited, that is, the visual device can be a camera device based on the principle of optical imaging, a laser radar device based on the principle of laser imaging, an acoustic radar device based on the principle of acoustic imaging, or an infrared detection device based on thermal imaging, etc. It should be understood that the specific configuration of the visual device is selected based on the specific monitoring method. For example, in the above embodiment, monitoring the cleaning process of the product can include positioning monitoring, status monitoring, early warning monitoring, etc. Among them, in positioning monitoring, radar equipment can be used to achieve the purpose of precise positioning; in status monitoring, infrared detection equipment can be used to monitor whether the components are overheating, etc. It can be understood that the visual device of the present disclosure can include connected data processing devices, such as single-chip microcomputers, industrial computers, programmable devices, routers, and servers connected to the routers.

[0067] In some possible embodiments, the visual device is configured as a camera, which takes a photo of the glue stick and analyzes the glue stick's tilt angle, rotation angle around the axis, and whether the cleaned contact point is a new contact point, and uploads the analysis results to the device's controller. The controller controls the angle motor 52 and the rotation motor 53 of the cleaning structure 5 based on the above results to ensure that the glue stick cleans the product with a new contact point to avoid secondary contamination.

[0068] In some possible embodiments, the visual device is configured as a camera, the camera is placed horizontally, and the camera head is aimed at the semiconductor chip product to be cleaned. Each time the glue stick changes to a new contact point or the chip product changes to a new cleaning position, the camera takes a picture to identify whether the contact point of the glue stick is aligned with the cleaning position of the semiconductor chip, and sends the identification result to the controller of the device. The controller controls the first transmission structure 2 to adjust the position of the mobile semiconductor chip, and controls the second transmission structure 3 to adjust the position of the mobile glue stick, so that the contact point of the glue stick is aligned with the cleaning position of the semiconductor chip, thereby improving the accuracy of cleaning.

[0069] In some possible embodiments, the visual device is configured as a laser radar, which is used to detect the contact point position of the glue stick and convert it into spatial coordinates (X, Y, Z). The controller of the device controls the first linear motor 21 and the second linear motor 22 to work according to the X and Y parameters of the spatial coordinates until the point to be cleaned of the semiconductor chip is moved below the contact point of the glue stick. Then, the controller of the device controls the linear module 51 or the high-precision module of the cleaning structure 5 to move downward according to the Z parameter of the spatial coordinate and the Z-axis parameter of the plane where the semiconductor chip is located until a point sticking action is completed.

[0070] In a specific embodiment, the working process of a high-efficiency multi-angle force-controlled cleaning device disclosed herein includes:

[0071] The operator replenishes the glue sticks in the glue stick library 7, and the third linear motor 32 controls the cleaning structure 5 to move to the top of the glue stick library 7, and the suction nozzle 541 of the clamp 54 of the cleaning structure 5 sucks a glue stick from the glue stick library 7;

[0072] The third linear motor 32 controls the cleaning structure 5 to move to the middle section of the gantry 31, and the cleaning structure 5 maintains the glue stick in a vertical downward position;

[0073] The controller of the device controls the first linear motor 21 and the second linear motor 22 to move the carrier platform 4 according to the position coordinates of the contact point of the glue stick, so that the semiconductor chip product carried by the carrier platform 4 is aligned with the contact point of the glue stick;

[0074] The visual device takes pictures of the glue stick and the semiconductor chip respectively to locate them, confirming that the contact point of the glue stick is aligned with the position of the semiconductor chip to be cleaned. If it is not aligned, the feedback is sent to the controller of the device, and the controller sends instructions to the first linear motor 21 and the second linear motor 22 for calibration. If the position of the contact point of the glue stick is outside the travel range of the first linear motor 21 and the second linear motor 22, the controller first controls the third linear motor 32 to move, and after the contact point of the glue stick enters the travel range of the first linear motor 21 and the second linear motor 22, it sends instructions to the first linear motor 21 and the second linear motor 22 for calibration.

[0075] After the calibration is completed, the high-precision module of the cleaning structure 5 controls the glue stick to move downward until the glue area of ​​the glue stick touches the semiconductor chip. The pressure sensor 8 detects the pressure of the glue stick on the semiconductor chip and compares the detected pressure with the preset pressure value.

[0076] When the detected pressure value is less than the preset pressure value, the high-precision module continues to control the glue stick to move downward;

[0077] When the detected pressure value is equal to the preset pressure value, the high-precision module stops moving downward;

[0078] When the detected pressure value is greater than the preset pressure value, the high-precision module controls the glue stick to move upward;

[0079] After the glue area of ​​the glue stick contacts the semiconductor chip for a preset period of time, the high-precision module controls the glue stick to move upward until it returns to its initial height, completing a spot-stick cleaning operation.

[0080] The output shaft of the angle motor 52 rotates a first angle stroke, so that the axis of the glue stick forms an included angle of a first angle relative to the Z axis. The device detects whether the bottom contact point of the glue area of ​​the glue stick is within the stroke range of the first linear motor 21 and the second linear motor 22. If not, the third linear motor 32 is controlled to move so that it enters the stroke range of the first linear motor 21 and the second linear motor 22. Then the above cleaning steps are repeated until a point sticking cleaning action is completed;

[0081] The output shaft of the rotary motor 53 rotates a second angle stroke, causing the glue stick to rotate a second angle around its axis, so that the bottom of the glue area becomes an area not adhered to the dust removal, that is, a new contact point is replaced, and then the above cleaning steps are repeated until a point-sticking cleaning action is completed;

[0082] After completing a point sticking and cleaning action, the output shaft of the rotating motor 53 repeats the above action until the glue stick has no new contact points available in the corresponding glue area at this tilt angle;

[0083] The output shaft of the angle motor 52 rotates again through a first angle stroke, so that the angle between the glue stick axis and the Z axis increases by the first angle on the basis of the original angle. The device then repeats the subsequent steps in the above process until the glue stick has no new contact points available in the corresponding glue area at the new tilt angle.

[0084] The cleaning structure 5 holds the glue stick and returns to the initial position. The third linear motor 32 controls the cleaning structure 5 to move to the top of the glue stick storage 7. The cleaning structure 5 puts the used glue stick into the empty space of the glue stick storage 7, then takes an unused glue stick from the glue stick storage 7 and continues cleaning.

[0085] After the device completes the cleaning work of a semiconductor chip or all the glue sticks in a glue stick library 7 are used up, the operator stops the device and replaces the material.

[0086] In the above embodiment, the preset pressure value may also be a range, and the corresponding judgment method is:

[0087] When the detection pressure value is less than the minimum value of the range, the high-precision module continues to control the glue stick to move downward;

[0088] When the detected pressure value is within the preset pressure value range, the high-precision module stops moving downward;

[0089] When the detected pressure value is greater than the maximum value of the range, the high-precision module controls the glue stick to move upward.

[0090] According to other embodiments of the present disclosure, a fully automatic cleaning machine is further provided. The fully automatic cleaning machine includes a high-efficiency, multi-angle force-controlled cleaning device according to any one of the above embodiments.

[0091] In some embodiments of the present disclosure, please refer to Figure 9 The above-mentioned fully automatic cleaning machine also includes a shell, and an FFU component, namely a fan filter unit 9, is provided on the top of the shell. The fan filter unit 9 is used to remove dust and filter the inside of the shell, making the inside of the shell a dust-free operating space. When the glue stick is used to remove dust on the semiconductor chip, a small amount of flying dust is sucked away and filtered by the fan filter unit 9, which can avoid secondary pollution of the semiconductor chip by the flying dust in the environment.

[0092] In some embodiments of the present disclosure, please refer to Figure 8 , the shell of the above-mentioned fully automatic cleaning machine is also provided with at least one of an industrial computer 10, a touch screen 11 and a button switch 12. The purpose of setting up the industrial computer 10 is that the industrial computer 10 can perform one-to-many control to realize automatic monitoring and cleaning. In addition, the industrial computer 10 can provide high computing power to provide hardware support for data processing of visual equipment information and devices. The touch screen 11 can be used as a screen, as an independent control switch device, or as a data processing device to assist in monitoring the cleaning process or monitoring some components. By providing the above-mentioned industrial computer 10, touch screen 11, button switch 12 and other devices, the degree of automation of the fully automatic cleaning machine can be improved, and the operator's direct contact with the cleaning space can be further isolated, thereby improving the cleaning effect.

[0093] In the above embodiment, the housing of the fully automatic cleaning machine is also provided with a material exchange port, through which the operator can replace and refill the glue stick reservoir 7. In order to further improve the cleaning effect and avoid secondary contamination caused by manual operation, the fully automatic cleaning machine is also provided with a transport component for transporting and exchanging materials inside and outside the housing.

[0094] In a possible embodiment, the above-mentioned transport component can be configured as a multi-axis robotic arm.

[0095] In a possible embodiment, the material changing port is provided with an automatic sliding door.

[0096] While various embodiments of the present disclosure have been described above, the foregoing description is intended to be illustrative, non-exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technological improvements in the marketplace, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A high-efficiency, multi-angle force-controlled cleaning device, characterized in that: The device comprises a base (1) and a first transmission structure (2) and a second transmission structure (3) mounted on the base (1); A carrier platform (4) is provided on the first transmission structure (2), the carrier platform (4) is used to place the product to be cleaned, and the first transmission structure (2) is used to control the movement of the carrier platform (4) on a horizontal plane; A cleaning structure (5) is provided on the second transmission structure (3), and the second transmission structure (3) is used to control the cleaning structure (5) to move along the length direction of the second transmission structure (3); The cleaning structure (5) includes a linear module (51), an angular motor (52) connected to the linear module (51), a rotary motor (53) connected to the angular motor (52), and a clamp (54) installed at the bottom of the rotary motor (53), wherein the linear module (51) controls the rotary motor (53) to move in a vertical direction, the rotary motor (53) controls the tilt angle of the axis of the rotary motor (53) relative to the vertical line, and the rotary motor (53) controls the rotation angle of the clamp (54) around the axis. The clamp (54) holds a glue stick, and after one contact point of the glue stick is glued to the semiconductor chip, the contact point between the glue stick and the semiconductor chip can be adjusted by changing the angle of the glue stick.

2. The high-efficiency multi-angle force-controlled cleaning device according to claim 1, characterized in that: The first transmission structure (2) includes a first linear motor (21) and a second linear motor (22), the second linear motor (22) is mounted on the top of the first linear motor (21), the moving direction of the second linear motor (22) is parallel to the moving direction of the second transmission structure (3), the moving direction of the first linear motor (21) is perpendicular to the moving direction of the second linear motor (22), a first mounting plate is provided on the top of the second linear motor (22), and the carrier platform (4) is mounted on the first mounting plate.

3. The high-efficiency multi-angle force-controlled cleaning device according to claim 2, characterized in that: A visual platform (6) is provided on the first mounting plate, the visual platform (6) being installed side by side with the carrier platform (4), and a visual device is installed on the visual platform (6), the visual device being used to monitor the cleaning process of the product.

4. The high-efficiency multi-angle force-controlled cleaning device according to claim 1, characterized in that: The second transmission structure (3) includes a gantry (31) and a third linear motor (32), wherein a track of the third linear motor (32) is mounted parallel to and below a crossbeam of the gantry (31), a second mounting plate is provided on the side of the third linear motor (32), a slider is provided on the top of the second mounting plate, and the slider is slidably mounted on the crossbeam of the gantry (31), and the cleaning structure (5) is mounted on the second mounting plate.

5. The high-efficiency multi-angle force-controlled cleaning device according to claim 4, characterized in that: A mounting frame is provided on one side column of the gantry (31), and a glue stick library (7) is installed on the mounting frame. The glue stick library (7) is used to store glue sticks.

6. The high-efficiency multi-angle force-controlled cleaning device according to claim 1, characterized in that: The linear module (51) of the cleaning structure (5) is a high-precision module, and the high-precision module is communicatively connected to the controller of the device.

7. The high-efficiency multi-angle force-controlled cleaning device according to claim 1, characterized in that: The clamp (54) comprises a suction nozzle (541) and a vacuum port (542) connected to the suction nozzle (541), wherein the vacuum port (542) is connected to an external vacuum air pipe, and the suction nozzle (541) is used to suck the glue stick.

8. The high-efficiency multi-angle force-controlled cleaning device according to claim 1, characterized in that: A pressure sensor (8) is provided on the clamp (54), and the pressure sensor (8) is used to detect the pressure exerted on the product by the glue stick when cleaning the product. The pressure sensor (8) is in communication connection with the controller of the device.

9. A fully automatic cleaning machine, characterized in that: A high-efficiency, multi-angle force-controlled cleaning device comprising any one of claims 1-8.

10. The fully automatic cleaning machine according to claim 9, characterized in that: The housing further comprises a fan filter unit (9) provided on the top of the housing, the fan filter unit (9) being used for filtering dust inside the housing, and at least one of an industrial computer (10), a touch screen (11) and a button switch (12) being provided on the housing.

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