Production detection device and detection method of conductive adhesive

Abstract

The application relates to the technical field of conductive glue detection, in particular to a production detection device for conductive glue, which comprises a base plate, the top of the base plate is provided with two packaging jigs in mirror image, the top of the base plate is provided with a running structure for controlling the mirror image movement of the two packaging jigs, the running structure can control the mutual butt joint of the two packaging jigs; the top of the base plate is fixedly provided with a base, the two packaging jigs can form a plastic space between the top of the base when the two packaging jigs butt joint, and an injection position is reserved, the base plate is provided with a probe mechanism for measuring the glue solidified in the plastic space through a four-probe method, the top of each of the two packaging jigs is provided with four guide grooves, the guide grooves are semicircular structures, and the guide grooves penetrate into the interiors of the packaging jigs, the conductive glue can be shaped into a sample through the device, the probe mechanism is used for testing the conductive performance of the sample through a four-probe method, and the bonding strength of the conductive glue can be detected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of conductive glue production detection, in particular to a conductive glue production detection device and method. BACKGROUND

[0002] Conductive glue is a kind of adhesive with conductive performance after curing or drying, which can connect various conductive materials together to form an electrical path between the connected equipment, and also has good adhesive strength and mechanical properties.

[0003] The conductive glue needs to be detected after production, mainly for its electrical performance, and in the prior art, a conductive glue sample of appropriate size and shape is made or cut, and then a micro-ohm meter method is used to apply a current source and a voltage source to the sample to detect its resistance or resistivity. This detection method has low detection efficiency and accuracy, and is affected by contact resistance and lead errors. SUMMARY

[0004] The present application provides a conductive glue production detection device and method, which can shape the conductive glue into a sample, and use a probe mechanism to test the conductive performance of the sample by four-probe method, improve the authenticity and accuracy of the test, and also can detect the adhesive strength of the conductive glue.

[0005] To achieve the above purpose, the present application provides the following technical scheme:

[0006] A conductive glue production detection device and method, comprising:

[0007] A substrate, the top of the substrate is provided with two packaging jigs in mirror image, the top of the substrate is provided with a running structure for controlling the mirror image movement of the two packaging jigs, the running structure can control the two packaging jigs to be mutually docked;

[0008] The top of the substrate is fixedly provided with a base, when the two packaging jigs are docked, they can form a shaping space with the top of the base, and a glue injection position is reserved, and the substrate is provided with a probe mechanism for measuring the solidified glue in the shaping space by four-probe method.

[0009] Preferably, the top of each of the two packaging jigs is provided with four guide grooves, the guide grooves are semicircular structures, and the guide grooves penetrate into the interior of the packaging jigs, when the two packaging jigs are docked, the corresponding two guide grooves can be combined into an accommodation channel, the combined plurality of accommodation channels are equidistantly distributed, and the accommodation channel can allow the probe mechanism to enter and press against the solidified glue.

[0010] Preferably, the operation structure comprises a plurality of assembly rods hinged between the top of the base plate and the bottom of the packaging jig, the plurality of assembly rods under the same packaging jig are arranged in parallel, and the plurality of assembly rods under two packaging jigs are mirror-symmetric, and the drive controls the rotation of the assembly rod.

[0011] Preferably, the drive comprises a gear coaxially rotating with the hinge part at the bottom end of the assembly rod, the top of the base plate is slidingly installed with a rack, the rack and the gear are in meshing transmission connection, the top of the base plate is fixedly installed with a second electric telescopic rod, and a pressure sensor is installed between the output end of the second electric telescopic rod and the rack.

[0012] Preferably, the top plane of the base is in the same plane as the bottom of the shaping space, the base is hollow, and an electric heating plate is installed in the hollow interior of the base, the top of the base is composed of an isothermal panel, and the proportion of the top of the base to the inner bottom of the shaping space is not less than 75%.

[0013] Preferably, the top of the packaging jig is installed with a first electric telescopic rod, the output end of the first electric telescopic rod is slidingly penetrated into the interior of the packaging jig, the output end of the first electric telescopic rod in the interior of the packaging jig is fixedly installed with a rubber plate, the outer wall of the rubber plate is covered with an isolation film, the two rubber plates are abutted against each other when the two packaging jigs are butted, and the two rubber plates and the two isolation films form an integral compression plate.

[0014] Preferably, the top of the packaging jig is provided with an assembly groove, and the two assembly grooves form a glue injection channel after the two packaging jigs are butted.

[0015] Preferably, the probe mechanism comprises a tester installed on the top of the packaging jig through a gantry, four downward output probe parts are installed on the tester, a downward running conductive needle is installed in the probe part, the downward output of the conductive needle can pierce the rubber plate and the isolation film, and the accommodation channel allows the probe part to enter.

[0016] A production and detection method of conductive glue, comprising the following steps:

[0017] I. Control the operation structure to make the two packaging jigs mirror move and butt, form a shaping space, and form an accommodation channel and a reserved glue injection position;

[0018] II. The produced conductive glue is injected into the reserved glue injection position with a certain amount of conductive glue, and the conductive glue is shaped and solidified to obtain a sample with a predetermined shape;

[0019] III. Control the probe mechanism and make the probe mechanism enter the accommodation channel to enable the probe mechanism to perform four-probe measurement.

[0020] In addition to step three, the following steps are also included:

[0021] Fourth, the control mechanism makes the two packaging fixtures mirror each other and move away. At the same time, the cooperation of multiple assembly rods and drivers will make the two packaging fixtures move obliquely downward. Combined with the base's resistance to the solidified sample, the two packaging fixtures form a bond strength test on the sample. The oblique movement also adds the shear strength factor during the test.

[0022] This invention provides a conductive adhesive production and testing device. By utilizing a rotating structure, two encapsulation fixtures move in mirror image until a shaping space is formed between them and the base. Simultaneously, a pre-reserved injection channel facilitates the injection of conductive adhesive into the shaping space. The conductive adhesive is shaped and, after drying and solidification, forms the desired sample shape. The conductive adhesive solidifies in a self-leveling state, simulating the real-world solidification process of conductive adhesive, thus increasing the realism and accuracy of conductivity testing. Furthermore, a probe mechanism enables a four-probe conductivity test on the top of the sample in the shaping space, thereby detecting the conductivity performance of the conductive adhesive and measuring its resistance or resistivity. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the external three-dimensional structure of the present invention;

[0024] Figure 2 For the present invention Figure 1 Front view structural diagram;

[0025] Figure 3 For the present invention Figure 2 A schematic diagram of the structure viewed in section AA along the middle edge;

[0026] Figure 4 For the present invention Figure 2 A structural schematic diagram showing the cross-section at point BB.

[0027] Figure 5 For the present invention Figure 1 A schematic diagram of the right-side view structure;

[0028] Figure 6 For the present invention Figure 5 A three-dimensional structural diagram with cross-section at the CC point;

[0029] Figure 7 This is a schematic diagram of the component structure that makes up the shaping space in this invention.

[0030] In the figure: 1, base plate; 2, packaging jig; 3, tester; 4, probe part; 5, assembly rod; 6, base; 7, rubber plate; 8, isolation film; 9, first electric telescopic rod; 11, electric heating plate; 12, gear; 13, rack; 14, pressure sensor; 15, second electric telescopic rod; 16, guide groove; 17, assembly groove. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] Please refer to Figures 1 to 7 The present application provides a kind of production detection device of conductive glue, comprising:

[0033] Base plate 1, the top of base plate 1 is provided with two packaging jigs 2 in mirror image, and the top of base plate 1 is provided with a running structure for controlling the mirror image movement of the two packaging jigs 2, which can control the two packaging jigs 2 to be mutually docked;The top of base plate 1 is fixedly provided with a base 6, and when the two packaging jigs 2 are docked, they can form a shaping space between the top of the base 6, and a glue injection position is reserved, and the base plate 1 is provided with a probe mechanism for measuring the gel in the shaping space by four-probe method.

[0034] The conductive glue can form an irreversible or reversible crosslinking network through chemical reaction at high temperature, and the conductive particles therein can be combined together to form a conductive circuit, realizing the conductive connection of the adherend. However, in the prior art, the sample needs to be cut and prepared, but the cutting will cause the fracture of the conductive structure of the conductive glue or the damage of the conductive particles, thereby interfering with the detection of the conductive performance of the conductive glue. In addition, the cutting or the shoe upper produced by cutting will also cause interference. Therefore, in the present application, the two packaging jigs 2 are moved in mirror image by using the running structure until the shaping space is formed between the two packaging jigs 2 and the base 6, and a glue injection channel is reserved at the same time, so as to facilitate the injection of the conductive glue into the shaping space and the shaping of the conductive glue. After the conductive glue is dried and solidified, the shape of the required sample can be formed, so that the conductive glue can be solidified in the self-leveling state, the real situation of the solidification of the conductive glue can be simulated, and the authenticity and accuracy of the conductive test are increased. Secondly, the probe mechanism can conduct the conductive test of the top of the sample in the shaping space by four-probe method, so as to detect the conductive performance of the conductive glue and detect the resistance or resistivity thereof.

[0035] Since the two packaging jigs 2 and the base 6 constitute a shaping space that can be arranged, the sample volume or cross-sectional area of the solidified conductive adhesive can be obtained, so that the square resistance or resistivity thereof can be measured.

[0036] In a more preferred embodiment, four guide grooves 16 are formed in the top of each of the two packaging jigs 2, the guide grooves 16 are semicircular structures, and the guide grooves 16 penetrate into the interior of the packaging jigs 2, when the two packaging jigs 2 are docked, the corresponding two guide grooves 16 can be combined into accommodation channels, the combined multiple accommodation channels are equidistantly distributed, and the accommodation channels can allow the probe mechanism to enter and press the solidified adhesive for docking, please refer to Figure 1 、 Figure 6 and Figure 7 , the corresponding guide grooves 16 of the two packaging jigs 2 will be docked with each other during docking, thereby forming an accommodation channel for the probe mechanism to enter, and the four equidistantly distributed accommodation channels can correspond to the equidistant requirement in the four-probe method.

[0037] In a more preferred embodiment, the operating structure includes multiple assembly rods 5 hinged between the top of the base plate 1 and the bottom of the packaging jig 2, and the multiple assembly rods 5 located below the same packaging jig 2 are arranged in parallel, and the multiple assembly rods 5 below the two packaging jigs 2 are mirror-symmetric, and a driver for controlling the rotation of the assembly rod 5 is included, please refer to Figure 3 and Figure 4 , which show the inclination of the assembly rod 5, the parallel state of the multiple assembly rods 5 below the same packaging jig 2, and the multiple assembly rods 5 below the same packaging jig 2 form a connecting rod structure, which and the packaging jig 2 and the base plate 1 can form a parallelogram connecting rod mechanism, thereby enabling the packaging jig 2 to move obliquely while maintaining a horizontal state, thereby enabling the two packaging jigs 2 to dock and move away from each other during mirror-image movement.

[0038] Further, the driver includes a gear 12 coaxially rotating with the hinged part at the bottom end of the assembly rod 5, a rack 13 slidingly installed on the top of the base plate 1, the rack 13 and the gear 12 are in meshing transmission connection, a second electric telescopic rod 15 is fixedly installed on the top of the base plate 1, and a pressure sensor 14 is installed between the output end of the second electric telescopic rod 15 and the rack 13, please refer to Figure 4 and its detailed enlarged view, in this embodiment, due to the limitation of the parallelogram connecting rod, when one of the assembly rods 5 rotates, the oblique displacement of the entire packaging jig 2 can be controlled, therefore, the displacement of the rack 13 can be controlled when the second electric telescopic rod 15 inputs and outputs, thereby enabling the gear 12 meshing therewith to rotate, thereby enabling the coaxial rotation of the assembly rod 5.

[0039] In this process, since the conductive glue has strong bonding strength after drying and solidification, when the conductive glue completes the conductive test, the two packaging jigs 2 are moved away from each other, and due to the restriction of the parallelogram linkage, when the assembly rod 5 rotates, the packaging jigs 2 will move obliquely downward, so that the two packaging jigs 2 are separated from the conductive glue, and due to the fixed state of the base 6, the base 6 will limit the downward movement of the conductive glue, at this time the conductive glue will be subjected to two directions of tension, including a certain strength of shear pressure, when the second electric telescopic rod 15 is input or output, the pressure sensor 14 can detect the pressure acting on itself, when the packaging jigs 2 are separated from the conductive glue, the bonding strength of the conductive glue can be tested.

[0040] Secondly, when the two packaging jigs 2 are mirror away from each other, they can serve as an auxiliary means for the conductive glue to separate from the shaping space, facilitating rapid processing of the shaping space and the next detection.

[0041] Further, the top plane of the base 6 is in the same plane as the bottom of the shaping space, the base 6 is hollow, and the hollow interior of the base 6 is provided with an electric heating plate 11, the top of the base 6 is composed of an isothermal panel, and the proportion of the top of the base 6 to the inner bottom of the shaping space is not less than 75%, please refer to Figure 3 、 Figure 4 、 Figure 6 and Figure 7 Since the base 6 occupies more than 75% of the area of the inner bottom of the shaping space, the heating area of the electric heating plate 11 can cover more conductive glue, avoiding uneven solidification of the conductive glue due to heating. Secondly, by setting the isothermal panel, the heat generated by the electric heating plate 11 can make the top of the base 6 in an isothermal state, improve the uniformity of the bottom of the conductive glue, effectively accelerate the drying and solidification of the conductive glue, and improve the efficiency and quality of the solidification, so that the conductive performance can reach the best state. The top of the base 6 is in the same plane as the inner bottom of the shaping space, which can effectively shape the conductive glue.

[0042] Among the more preferred embodiments, the top of the packaging jig 2 is provided with a first electric telescopic rod 9, the output end of the first electric telescopic rod 9 slides through and penetrates into the inside of the packaging jig 2, and the output end of the first electric telescopic rod 9 inside the packaging jig 2 is fixedly provided with a rubber plate 7, the outer wall of the rubber plate 7 is covered with a separation film 8, and the two rubber plates 7 are abutted against each other when the two packaging jigs 2 are connected, and the two rubber plates 7 and the two separation films 8 form an integral compression plate, please refer to Figure 3By setting the cooperation of the two rubber plates 7, the isolation film 8 and the first electric telescopic rod 9, the liquid level of the conductive glue can be limited and assisted, so that the bottom outer wall of the isolation film 8 can shape the top of the conductive glue, and the top can maintain a certain horizontal state, thereby improving the contact accuracy of the probe and improving the efficiency of the conductive connection test. The isolation film 8 can isolate the contact between the rubber plate 7 and the conductive glue, and prevent the conductive glue from adhering to the outer wall of the rubber plate 7.

[0043] In a more preferred embodiment, the top of the packaging jig 2 is provided with an assembly groove 17, and the two assembly grooves 17 form a glue injection channel after the two packaging jigs 2 are docked. Please refer to Figure 1 and Figure 6 In this embodiment, the glue injection channel can facilitate the injection of conductive glue into the shaping space from the outside.

[0044] Further, the probe mechanism includes a tester 3 mounted on the top of the packaging jig 2 through the gantry, and four downward output probe parts 4 are mounted on the tester 3. The probe part 4 is internally provided with a downward running conductive needle. The downward output of the conductive needle can pierce the rubber plate 7 and the isolation film 8, and the accommodation channel can allow the probe part 4 to enter. Please refer to Figure 1 and Figure 2 Figure 2 By setting the conductive needle, when the rubber plate 7 flattens the top of the conductive glue, the isolation film 8 will adhere to the top of the conductive glue, so as to isolate the rubber plate 7 and the conductive glue. When detection is needed, the downward output of the conductive needle will break through the limitation of the isolation film 8 and the rubber plate 7, and will pierce and form a pressure joint with the top of the conductive glue, thereby improving the efficiency and accuracy of the probe mechanism test.

[0045] By cooperating the above structures, the conductive glue can be shaped into a sample, and the probe mechanism can be used to test the conductive performance of the sample by four-probe method, and the adhesion strength of the conductive glue can also be tested.

[0046] A production and detection method of conductive glue, comprising the following steps:

[0047] I. Control the operation structure to make the two packaging jigs 2 move in mirror image and dock, form a shaping space, and form an accommodation channel and a reserved glue injection position.

[0048] II. The produced conductive glue is injected into a certain amount of conductive glue through the glue injection position, and is shaped and solidified to obtain a sample with a predetermined shape.

[0049] III. Control the probe mechanism and make it enter the accommodation channel, so that the probe mechanism can be measured by four-probe method.

[0050] Further, based on step III, the following steps are further included:

[0051] Four, control operation structure makes two encapsulation jigs 2 mirror image away, at the same time, the cooperation of multiple assembly rods 5 and drivers makes two encapsulation jigs 2 move obliquely downward, and the cooperation of bases 6 against the solidified sample limits the detection of two encapsulation jigs 2 on the bonding strength of the sample, and the oblique movement can also increase the shear strength factor during the detection process.

[0052] Compared with the prior art, the method can improve the detection accuracy of the conductive performance of the conductive adhesive, and can also detect the bonding strength of the conductive adhesive.

[0053] The standard parts used in the embodiment can be directly purchased from the market, and the non-standard structural parts according to the description and drawings can also be processed according to the existing technical knowledge without doubt, and the connection mode of each part adopts the mature conventional means in the existing technology, and the machinery, parts and equipment adopt the conventional models in the existing technology, so specific description is not made here.

[0054] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A production inspection device for conductive paste, characterized by: The utility model relates to a four-probe method testing device for encapsulation tooling, which comprises a substrate (1) provided with two encapsulation toolings (2) on the top thereof, a running structure mounted on the top of the substrate (1) for controlling the mirror image movement of the two encapsulation toolings (2), and the running structure controls the mutual butt joint of the two encapsulation toolings (2). The top of the substrate (1) is fixedly provided with a base (6), and the two encapsulation toolings (2) can form a plastic space with the top of the base (6) when they are butted, and a glue injection position is reserved, and a probe mechanism for measuring the solidified glue in the plastic space by the four-probe method is mounted on the top of the substrate (1). Four guide grooves (16) are formed in the top of each of the two encapsulation toolings (2), the guide grooves (16) are semicircular structures, the guide grooves (16) penetrate into the interior of the encapsulation tooling (2), and when the two encapsulation toolings (2) are butted, the corresponding two guide grooves (16) can be combined into accommodation channels, the combined accommodation channels are equidistantly distributed, and the accommodation channels can allow the probe mechanism to enter and press the solidified glue. The running structure comprises a plurality of assembly rods (5) hingedly connected between the top of the substrate (1) and the bottom of the encapsulation tooling (2), the assembly rods (5) located below the same encapsulation tooling (2) are arranged in parallel, the assembly rods (5) below the two encapsulation toolings (2) are mirror-symmetrically arranged, and the running structure comprises a drive for controlling the rotation of the assembly rods (5). The probe mechanism comprises a tester (3) mounted on the top of the encapsulation tooling (2) through a gantry, four downward output probe parts (4) are mounted on the tester (3), downward running conductive needles are mounted in the probe parts (4), the downward output of the conductive needles can pierce a rubber plate (7) and a separation film (8), and the accommodation channels can allow the probe parts (4) to enter. The drive comprises a gear (12) coaxially rotating with the hinged part at the bottom end of the assembly rod (5), a rack (13) is slidably mounted on the top of the substrate (1), the rack (13) and the gear (12) are in meshing transmission connection, a second electric telescopic rod (15) is fixedly mounted on the top of the substrate (1), and a pressure sensor (14) is mounted between the output end of the second electric telescopic rod (15) and the rack (13).

2. The apparatus for detecting production of the conductive paste according to claim 1, wherein: The top plane of the base (6) is in the same plane as the bottom of the plastic space, the base (6) is hollow, an electric heating plate (11) is mounted in the hollow interior of the base (6), the top of the base (6) is composed of an isothermal panel, and the proportion of the top of the base (6) to the inner bottom of the plastic space is not less than 75%.

3. The apparatus for detecting production of the conductive paste according to claim 2, wherein: ​ 4. The apparatus for detecting production of conductive paste according to claim 1, wherein: The top of the packaging jig (2) is equipped with a first electric telescopic rod (9), the output end of the first electric telescopic rod (9) is slidably penetrated into the inside of the packaging jig (2), the output end of the first electric telescopic rod (9) is fixedly installed with a rubber plate (7) in the inside of the packaging jig (2), the outer wall of the rubber plate (7) is covered with an isolation film (8), the two rubber plates (7) are abutted against each other when the two packaging jigs (2) are abutted, and the two rubber plates (7) and the two isolation films (8) constitute an integral compression plate.

5. The apparatus for detecting production of the conductive paste according to claim 1, characterized by: The top of the packaging jig (2) is provided with an assembly groove (17), and the two assembly grooves (17) constitute a glue injection channel after the two packaging jigs (2) are abutted.

6. A detection method of a production detection device using the conductive adhesive according to claim 3, characterized by: The method comprises the following steps: I. Control the operation structure to make the two packaging jigs (2) mirror image and abut, form a shaping space, and form an accommodating channel and a reserved glue injection position at the same time; II. Use the glue injection position to inject a certain amount of conductive glue, and make the conductive glue shape and solidify to obtain a sample with a predetermined shape; III. Control the probe mechanism and make the probe mechanism enter the accommodating channel to perform four-probe method measurement.

7. The method of claim 6, wherein: the conductive adhesive is a conductive adhesive paste. On the basis of step III, the following steps are further included: IV. Control the operation structure to make the two packaging jigs (2) mirror image and move away from each other, and the cooperation of the plurality of assembly rods (5) and the driver will make the two packaging jigs (2) move obliquely downward, and then the cooperation of the base (6) will abut against and limit the solidified sample to make the two packaging jigs (2) detect the bonding strength of the sample, and the oblique movement can also increase the shear strength during the detection process.

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