Method for processing a c-shaped exhaust silicon ring

Abstract

A C-shaped structure exhaust silicon ring processing method, including the following steps, using a circular grinding machine to the A, C face of the silicon ring blank material is rough machining, the flatness of A, C face is processed to 0.05-0.08mm, parallelism is processed to 0.07-0.1mm;Using vertical machining center to the A face inner diameter and C-shaped cavity of the silicon ring blank material is semi-finishing;Using water cutting machine to the C face oval groove, C face inner diameter of the silicon ring blank material is finishing;Using vertical machining center to the C face features and C-shaped inner cavity of the silicon ring blank material is finishing;Using vertical machining center to the A face of the silicon ring blank material is finishing.The application adopts new processing procedure and processing method, improves the processing efficiency;Selects the suitable processing tool, reduces the processing cost, improves the qualified rate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon ring processing, in particular to a C-shaped structure exhaust silicon ring processing method. BACKGROUND

[0002] The silicon ring mainly includes an exhaust silicon ring, a silicon outer ring, a silicon shower head, a silicon focusing ring, a silicon shielding ring and the like. The silicon shower head has dense micro-holes on the surface, and in the etching link of wafer manufacturing, the silicon shower head is a passage for etching gas to enter the cavity; the silicon focusing ring has a step and a positioning protruding part on the inner side, and is mainly used for bearing a silicon wafer; the silicon outer ring is a connecting part for connecting the exhaust ring and the shower head; and the exhaust silicon ring is a gas passage, providing a passage for process gas or carrier gas to enter and tail gas after reaction to be discharged. At present, the silicon ring processing process is as follows: outer diameter grinding, double-side grinding, processing center for A-face inner diameter and positioning hole, processing center for B-face clamping groove, etching, clamping groove grinding, clamping groove polishing, double-side polishing and cleaning; wherein the clamping groove grinding adopts manual grinding by using sandpaper, and the clamping groove polishing adopts manual polishing by using polishing cloth. However, due to the C-shaped structure of the exhaust silicon ring, the overall structure is complex and the shape is special, and in the processing process, the technical requirement is high, and it takes nearly 185 hours to complete the production of one piece by using the existing processing process, which not only has high processing cost, but also has low processing efficiency. SUMMARY

[0003] In order to solve the above technical problems in the prior art, and in view of this, it is necessary to provide a C-shaped structure exhaust silicon ring processing method.

[0004] A C-shaped structure exhaust silicon ring processing method, comprising the following steps,

[0005] S1: rough machining A and C faces of a silicon ring blank by using a cylindrical grinding machine, so that the flatness of the A and C faces is machined to 0.05-0.08 mm, and the parallelism is machined to 0.07-0.1 mm;

[0006] S2: semi-finish machining A-face inner diameter and C-shaped cavity of the silicon ring blank by using a vertical machining center;

[0007] S3: finish machining C-face elliptical groove and C-face inner diameter of the silicon ring blank by using a water cutting machine;

[0008] S4: finish machining C-face features and C-shaped inner cavity of the silicon ring blank by using a vertical machining center;

[0009] S5: finish machining the A face of the silicon ring blank by using a vertical machining center.

[0010] Preferably, in the step S2, the semi-finish machining of the A-face inner diameter and the C-shaped cavity of the silicon ring blank adopts the following steps,

[0011] a: the silicon ring blank is fixed and clamped by a negative pressure chuck, the A surface inner diameter of the silicon ring blank is semi-finished, and the A surface inner diameter is processed to be 10-16 mm smaller than the final size;

[0012] b: the C cavity of the silicon ring blank is semi-finished, and the C cavity is processed to be 5-8 mm smaller than the final size.

[0013] Preferably, when the A surface inner diameter of the silicon ring blank is semi-finished, a 100-200 mesh, 50-70 mm in diameter diamond tool is used, the tool is processed in a downward cutting mode from top to bottom, the rotating table rotating speed is set to 60-240 rpm, and the tool axial feeding is set to 0.5-1 mm / min.

[0014] Preferably, when the C cavity of the silicon ring blank is semi-finished, a 100-200 mesh, 200-250 mm in diameter, 10 mm in thickness diamond tool is used, the tool is processed in a center downward cutting mode from left to right, the rotating table rotating speed is set to 60-240 rpm, and the tool radial feeding is set to 1-2 mm / min.

[0015] Preferably, in step S3, the C surface elliptical groove and the C surface inner diameter of the silicon ring blank are finished by the following steps,

[0016] a: the silicon ring blank is fixed and clamped by a water cutting machine clamping tool, the assembled protective alloy pad is placed in the inner cavity of the silicon ring blank, the water cutting machine water blade width is set to 0.5-0.8 mm by adjusting the pressure and selecting a nozzle, and the silicon ring blank C surface elliptical groove is finished by using 150-250 mesh diamond sand;

[0017] b: the water cutting machine water blade width is set to 0.5-0.8 mm by adjusting the pressure and selecting a nozzle, and the silicon ring blank C surface inner diameter is finished by using 150-250 mesh diamond sand.

[0018] Preferably, in step S4, the C surface features and the C cavity of the silicon ring blank are finished by the following steps,

[0019] a: the silicon ring blank is fixed and clamped, the C surface features of the silicon ring blank are finished, a 200-300 mesh, 50-70 mm in diameter diamond tool is used, the tool is processed in a left to right feeding mode from the outside, the rotating table rotating speed is set to 60-240 rpm, the tool radial feeding is set to 0.4-0.6 mm / min, and the C surface features are processed to the final size of the product;

[0020] b: finish machining the C-shaped inner cavity of the silicon ring blank, using a 400-500 mesh, 200-250 mm diameter, 10 mm thick diamond blade cutter, center down cutting, left to right feed, while the turntable speed is set to 60-240 rpm, the cutter axial feed speed is set to 0.5-1 mm / min, and the cutter radial feed is set to 0.4-0.6 mm / min, so that the C face feature size is machined to the final product size.

[0021] Preferably, in step S5, the A face of the silicon ring blank is finish machined using the following steps,

[0022] a: the silicon ring blank is fixed and waxed using a support tool, the A face feature of the silicon ring blank is finish machined, a 200-300 mesh, 8-10 mm diameter diamond threaded milling cutter and a 2-3 mm diameter diamond flat bottom milling cutter are used to machine the threaded holes and positioning holes respectively, the spiral feed method is used for machining, the cutter radial feed is set to 20-40 mm / min, and the axial feed is set to 10-20 mm / min, so that the A face feature (eight threaded holes and three positioning holes) size is machined to the final product size;

[0023] b: finish machining the A face inner diameter step of the silicon ring blank, using a 200-300 mesh, 20-40 mm diameter diamond flat bottom milling cutter, center down cutting, left to right feed, cutter radial feed is set to 1-4 mm / min, so that the A face inner diameter step size is machined to the final product size;

[0024] c: finish machining the B face small hole of the silicon ring blank, using a 200-300 mesh, 0.5-1.5 mm diameter diamond drill bit, using an angle indexing head to change the spindle machining direction from vertical to horizontal, using outside down cutting, right to left feed, cutter radial feed is set to 1-2 mm / min, so that the B face small hole size is machined to the final product size.

[0025] Preferably, the negative pressure suction cup comprises a cup body, a plurality of fixing blocks are uniformly distributed along the radial direction of the front surface of the cup body, and a suction groove is arranged along the circumferential direction of the cup body between any two adjacent fixing blocks on the front surface of the cup body.

[0026] Preferably, the water cutting machine clamping tool comprises a base plate, a positioning hole is arranged on one side of the base plate to fix the base plate to the side wall of the water cutting machine, a square hole is arranged on the front surface of the base plate without penetrating the base plate, a circular hole is arranged at the bottom of the square hole and penetrates the base plate, and a pair of clamping plates are slidably arranged on the base plate and can move along the radial direction of the circular hole, and recesses are arranged at the ends of the clamping plates.

[0027] Preferably, the protective alloy pad plate comprises a sub-plate and a mother plate; the sub-plate and the mother plate are arranged in a circular ring structure in turn staggered and overlapped; the upper surfaces of the sub-plate and the mother plate are inclined to the center of the protective alloy pad plate, so that the cross section of the protective alloy pad plate is in the shape of a right-angled trapezoid.

[0028] Compared with the prior art, the C-shaped structure exhaust silicon ring processing method provided by the application adopts new processing procedures and processing methods, improves the processing efficiency, selects appropriate processing tools, reduces the processing cost, and improves the qualified rate. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0030] Figure 1 It is a schematic diagram of the present application for semi-finishing the A inner diameter and C cavity of the silicon ring blank.

[0031] Figure 2 It is a schematic diagram of the present application for finishing the C face elliptical groove and C inner diameter of the silicon ring blank.

[0032] Figure 3 It is a schematic diagram of the present application for finishing the C face features and C inner cavity of the silicon ring blank.

[0033] Figure 4 It is a schematic diagram of the present application for finishing the A face of the silicon ring blank.

[0034] Figure 5 It is a structural schematic diagram of the negative pressure suction cup of the present application.

[0035] Figure 6 It is a structural schematic diagram of the present application Figure 5 Another angle structural schematic diagram.

[0036] Figure 7 It is a structural schematic diagram of the water cutting machine clamping tool of the present application.

[0037] Figure 8 It is a structural schematic diagram of the present application Figure 7 Another angle structural schematic diagram.

[0038] Figure 9 It is a structural schematic diagram of the protective alloy pad plate of the present application.

[0039] Figure 10 It is a structural schematic diagram of the sub-plate of the present application.

[0040] Figure 11 It is a structural schematic view of the mother plate of the application.

[0041] Figure 12 It is a structural schematic view of the exhaust silicon ring with C-shaped structure.

[0042] In the figure: negative pressure suction cup, disc body 01, fixed block 02, air suction groove 03, water cutting machine clamping tool, base plate 04, positioning hole 05, square hole 06, round hole 07, clamping plate 08, protective alloy pad plate, sub plate 09, mother plate 10. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0044] In the description of the application, it should be understood that the terms "upper", "middle", "outer", "inner", "lower" and the like indicate the orientation or positional relationship, and are only used to facilitate the description of the application and simplify the description, and do not indicate or imply that the indicated components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the application.

[0045] The application provides a processing method of a C-shaped structure exhaust silicon ring, comprising the following steps,

[0046] S1: using a cylindrical grinder to perform rough machining on the A and C surfaces of the silicon ring blank, so that the flatness of the A and C surfaces is machined to 0.05-0.08 mm, and the parallelism is machined to 0.07-0.1 mm; so as to ensure clamping and alignment in subsequent processing.

[0047] S2: using a vertical machining center to perform semi-finishing machining on the A surface inner diameter and C-shaped cavity of the silicon ring blank.

[0048] S3: using a water cutting machine to perform finishing machining on the C surface oval groove and C surface inner diameter of the silicon ring blank.

[0049] S4: using a vertical machining center to perform finishing machining on the C surface features and C-shaped inner cavity of the silicon ring blank.

[0050] S5: using a vertical machining center to perform finishing machining on the A surface of the silicon ring blank.

[0051] In the specific implementation process, the following steps are adopted for semi-finishing machining on the A surface inner diameter and C-shaped cavity of the silicon ring blank,

[0052] a: first, the silicon ring blank is fixed and clamped by a negative pressure chuck, and the A face inner diameter of the silicon ring blank is semi-finished; wherein the negative pressure chuck comprises a disc body 01, and the disc body 01 is uniformly distributed with fixing blocks 02 along the radial direction of the front surface of the disc body 01; when the inner diameter of the product is processed, the fixing blocks 02 can fix the outer diameter of the product. On the contrary, when the outer diameter of the product is processed, the fixing blocks 02 can fix the inner diameter of the product; prevent the product from moving during the rotation processing. The disc body 01 is provided with an air suction groove 03 arranged along the circumferential direction of the disc body 01 between the two adjacent fixing blocks 02 on the front surface of the disc body 01, and the air suction groove 03 adopts a double-layer distribution mode to enhance the adsorption force of the product. A 100-200 mesh, 50-70 mm diameter diamond tool is used, and a top-down tool is used for processing, and the rotation speed of the turntable is set to 60-240 rpm, and the axial feed of the tool is set to 0.5-1 mm / min; the A face inner diameter size is processed to be less than the final size by 10-16 mm.

[0053] b: semi-finished machining of the C-shaped cavity of the silicon ring blank, using a 100-200 mesh, 200-250 mm diameter, 10 mm thick blade diamond tool, using a center down tool, and processing from left to right, while the rotation speed of the turntable is set to 60-240 rpm, and the radial feed of the tool is set to 1-2 mm / min; the C-shaped cavity size is processed to be less than the final size by 5-8 mm.

[0054] In the specific implementation process, the following steps are adopted for finishing the C face oval groove and the C face inner diameter of the silicon ring blank,

[0055] a: Since the water cutting machine workbench is composed of aluminum alloy square plates, the square plates will move in water during water jet cutting, which cannot effectively fix the product, and the product movement is much higher than the product size tolerance. First, the silicon ring blank needs to be fixed and clamped by the water cutting machine clamping tool. The water cutting machine clamping tool includes a base plate 04, a positioning hole 05 is arranged on one side of the base plate 04, which can fix the base plate 04 to the side wall of the water cutting machine, and can ensure that the tool does not displace during processing. A square hole 06 is formed in the front of the base plate 04, which does not penetrate the base plate 04. A circular hole 07 is arranged at the bottom of the square hole 06, which penetrates the base plate 04. A pair of clamping plates 08 is slidably arranged on the base plate 04 and can move along the radial direction of the circular hole 07. The end of the clamping plate 08 is provided with a groove, and the product can be clamped by moving the clamping plate 08 to ensure that the product does not displace. To prevent the water jet from damaging the A surface of the silicon ring blank when machining the C surface groove, a protective alloy pad is placed in the inner cavity of the silicon ring blank and is bonded by wax. The protective alloy pad is assembled, which includes a sub-plate 09 and a mother plate 10. The sub-plate 09 and the mother plate 10 are arranged in a circular ring structure in turn. The upper surfaces of the sub-plate 09 and the mother plate 10 are inclined to the center of the protective alloy pad, so that the cross section of the protective alloy pad is a right trapezoid. During water jet cutting, the water jet moves to the center of the circular groove with the water off, and then starts to cut along the circular groove contour in the clockwise direction after the water jet penetrates the C surface of the silicon ring blank. The cutting speed will affect the quality of the inner wall of the circular groove. In order to ensure the quality, the cutting speed is set to 30-60 mm / min; 280 elliptical grooves are cut in sequence according to the above method. During the machining process, the protective alloy pad can form a protective effect in the inner cavity to prevent the water jet from cutting the A surface of the silicon ring blank; and during the water jet cutting, the protective alloy pad can also offset the impact force generated during the water jet cutting to affect the A surface of the silicon ring blank; secondly, during the water jet cutting, particles will be generated. By blocking the protective alloy pad, these particles can prevent the A surface of the silicon ring blank from being scratched, and the water flow can be discharged more easily.

[0056] Secondly, the width of the water cutting machine water jet blade is set to 0.5-0.8 mm by adjusting the pressure and selecting the nozzle, and 150-250 mesh diamond sand is used to finish machining the C surface elliptical groove of the silicon ring blank.

[0057] b: The width of the water cutting machine water jet blade is set to 0.5-0.8 mm by adjusting the pressure and selecting the nozzle, and 150-250 mesh diamond sand is used to finish machining the C surface inner diameter of the silicon ring blank.

[0058] In the specific implementation process, the following steps are used to finish machining the C surface features and C-shaped inner cavity of the silicon ring blank,

[0059] a: the silicon ring blank is clamped and fixed, the C face feature of the silicon ring blank is finished, 200-300 mesh, 50-70 mm in diameter diamond tool is adopted, outside down tool is adopted, left to right feed mode is adopted, the rotating table speed is set to 60-240 rpm, the tool radial feed is set to 0.4-0.6 mm / min, and the C face feature size is processed to the final size of the product.

[0060] b: the C-shaped inner cavity of the silicon ring blank is finished, 400-500 mesh, 200-250 mm in diameter, 10 mm thick blade diamond tool is adopted, center down tool is adopted, left to right feed mode is adopted, the rotating table speed is set to 60-240 rpm, the tool axial feed speed is set to 0.5-1 mm / min, and the tool radial feed is set to 0.4-0.6 mm / min, so that the C face feature size is processed to the final size of the product.

[0061] In the specific implementation process, the A face of the silicon ring blank is finished by the following steps,

[0062] a: the silicon ring blank is fixed and waxed by supporting tool, the A face feature of the silicon ring blank is finished; 200-300 mesh, 8-10 mm in diameter diamond thread milling cutter and 2-3 mm in diameter diamond flat bottom milling cutter are respectively used to process thread holes and positioning holes 05, spiral feed mode is adopted, the tool radial feed is set to 20-40 mm / min, and the axial feed is set to 10-20 mm / min, so that the A face feature (eight thread holes and three positioning holes 05) size is processed to the final size of the product.

[0063] b: the A face inner diameter step of the silicon ring blank is finished, 200-300 mesh, 20-40 mm in diameter diamond flat bottom milling cutter is used, center down tool is adopted, left to right feed mode is adopted, tool radial feed is set to 1-4 mm / min, so that the A face inner diameter step size is processed to the final size of the product.

[0064] c: the B face small hole of the silicon ring blank is finished, 200-300 mesh, 0.5-1.5 mm in diameter diamond drill bit is used, the spindle processing direction is changed from vertical direction to horizontal direction by using angle indexing head, outside down tool is adopted, right to left feed mode is adopted, tool radial feed is set to 1-2 mm / min, so that the B face small hole size is processed to the final size of the product.

[0065] The above disclosure is merely the preferred embodiments of the present application, and of course cannot be used to limit the scope of the present application, and those skilled in the art can understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made according to the claims of the present application, still belong to the scope covered by the present application.

Claims

1. A method for processing a C-shaped venting silicon ring, characterized in that: The method comprises the following steps, S1: rough machining of A and C surfaces of the silicon ring blank by using a circular grinding machine, so that the flatness of the A and C surfaces is machined to 0.05-0.08 mm and the parallelism is machined to 0.07-0.1 mm; S2: semi-finishing machining of the A surface inner diameter and the C-shaped cavity of the silicon ring blank by using a vertical machining center; S3: finishing machining of the C surface oval groove and the C surface inner diameter of the silicon ring blank by using a water cutting machine; wherein the finishing machining of the C surface oval groove and the C surface inner diameter of the silicon ring blank comprises the following steps, a: the silicon ring blank is fixed and clamped by using a water cutting machine clamping tool, the assembled protective alloy pad is placed in the inner cavity of the silicon ring blank, the water cutting machine water jet blade width is set to 0.5-0.8 mm by adjusting the pressure and selecting the nozzle, and 150-250 mesh diamond is used to finish machining the C surface oval groove of the silicon ring blank; b: the water cutting machine water jet blade width is set to 0.5-0.8 mm by adjusting the pressure and selecting the nozzle, and 150-250 mesh diamond is used to finish machining the C surface inner diameter of the silicon ring blank; S4: finishing machining of the C surface features and the C-shaped inner cavity of the silicon ring blank by using a vertical machining center; S5: finishing machining of the A surface of the silicon ring blank by using a vertical machining center.

2. The method of claim 1, wherein: In step S2, the semi-finishing machining of the A surface inner diameter and the C-shaped cavity of the silicon ring blank comprises the following steps, a: the silicon ring blank is fixed and clamped by using a negative pressure suction cup, and the A surface inner diameter of the silicon ring blank is semi-finished machined so that the A surface inner diameter size is machined to be less than the final size by 10-16 mm; b: the C-shaped cavity of the silicon ring blank is semi-finished machined so that the C-shaped cavity size is machined to be less than the final size by 5-8 mm.

3. The method of claim 2, wherein: When the A surface inner diameter of the silicon ring blank is semi-finished machined, 100-200 mesh, 50-70 mm in diameter diamond tool is used, the machining is performed in a top-down down tool mode, the rotating table rotating speed is set to 60-240 rpm, and the tool axial feed is set to 0.5-1 mm / min.

4. The method of claim 2 or 3, wherein: When the C-shaped cavity of the silicon ring blank is semi-finished machined, 100-200 mesh, 200-250 mm in diameter, 10 mm in blade thickness diamond tool is used, the machining is performed in a center down tool, left-to-right feed mode, the rotating table rotating speed is set to 60-240 rpm, and the tool radial feed is set to 1-2 mm / min.

5. The method of claim 1, wherein: In step S4, the finishing machining of the C surface features and the C-shaped inner cavity of the silicon ring blank comprises the following steps, a: the silicon ring blank is clamped and fixed, the C surface features of the silicon ring blank are finished machined, 200-300 mesh, 50-70 mm in diameter diamond tool is used, the machining is performed in an outside down tool, left-to-right feed mode, the rotating table rotating speed is set to 60-240 rpm, the tool radial feed is set to 0.4-0.6 mm / min, and the C surface feature size is machined to the final size of the product; b: the C-shaped inner cavity of the silicon ring blank is finished by using a 400-500 mesh, 200-250 mm diameter, 10 mm thick diamond blade cutter, center down cutting, left to right feed, while the rotating table speed is set to 60-240 rpm, the cutter axial feed speed is set to 0.5-1 mm / min, and the cutter radial feed is set to 0.4-0.6 mm / min, so that the size of the C-shaped inner cavity is processed to the final size of the product.

6. The method of claim 1, wherein: In step S5, the A surface of the silicon ring blank is finished by using the following steps, a: the A surface features of the silicon ring blank are finished by using a support tool to fix the silicon ring blank and wax clamping, the A surface features including eight threaded holes and three positioning holes, a 200-300 mesh, 8-10 mm diameter diamond threaded milling cutter and a 2-3 mm diameter diamond flat bottom milling cutter are used to process the threaded holes and the positioning holes respectively, the threaded holes and the positioning holes are processed by using a spiral feed method, the cutter radial feed is set to 20-40 mm / min, and the axial feed is set to 10-20 mm / min, so that the size of the A surface features is processed to the final size of the product; b: the A surface inner diameter step of the silicon ring blank is finished by using a 200-300 mesh, 20-40 mm diameter diamond flat bottom milling cutter, center down cutting, left to right feed, the cutter radial feed is set to 1-4 mm / min, so that the size of the A surface inner diameter step is processed to the final size of the product; c: the B surface small hole of the silicon ring blank is finished by using a 200-300 mesh, 0.5-1.5 mm diameter diamond drill bit, the spindle processing direction is changed from vertical to horizontal by using an angle indexing head, the outside down cutter is used, the feed direction is from right to left, the cutter radial feed is set to 1-2 mm / min, so that the size of the B surface small hole is processed to the final size of the product.

7. The method of claim 2, wherein: The negative pressure suction cup comprises a disc body, fixing blocks are uniformly distributed along the radial direction of the front surface of the disc body, and an air suction groove is arranged between two adjacent fixing blocks on the front surface of the disc body and along the circumferential direction of the disc body.

8. The method of claim 1, wherein: The water cutting machine clamping tool comprises a base plate, a positioning hole for fixing the base plate to the side wall of the water cutting machine is arranged on one side of the base plate, a square hole not penetrating through the base plate is arranged on the front surface of the base plate, a circular hole penetrating through the base plate is arranged at the bottom of the square hole, and a pair of clamping plates capable of moving along the radial direction of the circular hole are slidably arranged on the base plate, and recesses are arranged at the ends of the clamping plates.

9. The method of claim 1 or 8, wherein: The protective alloy pad plate comprises a sub-plate and a mother plate, the sub-plate and the mother plate are arranged in a circular ring structure in turn and staggered, the upper surfaces of the sub-plate and the mother plate are inclined to the center of the protective alloy pad plate, and the cross section of the protective alloy pad plate is in the shape of a right-angled trapezoid.

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