Coated baffle and coater

Abstract

The application discloses a coating baffle and a winding coating device. The coating baffle comprises a main body, the main body comprises a cooling part and a heating part adjacent to the cooling part, and a cooling flow channel is arranged on the cooling part. The cooling part is used for covering at least a non-film passing part of a main roller of the winding coating device, and the heating part is used for covering at least an edge of a film passing part of the main roller. The edge is an edge of the film passing part along an axis direction of the main roller. The application solves the problem that a large temperature difference is generated between a middle section and an edge section of a substrate due to the coating baffle, and the substrate is obviously deformed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of coating, in particular to a coating baffle and a winding coating device. BACKGROUND

[0002] In the winding coating device such as an evaporation coating device or a magnetron sputtering coating device, in order to effectively protect the two ends of the substrate width, avoid the deposition of sputtered particles on the cooling main roller of the winding coating device, so as to prevent the cooling main roller from being contaminated. And when the substrate is coated, the two ends of the substrate width are in contact with the deposited metal particles on the cooling main roller, which may cause the substrate to break. A coating baffle is provided to prevent the cooling main roller from being contaminated. The coating baffle is in the form of an arc-shaped plate. The cooling main roller includes a coating part and a non-coating part. The non-coating part is located at both ends of the cooling main roller in the axial direction, and the coating part is located between the two non-coating parts. The coating part is the part of the cooling main roller covered with the substrate, and the non-coating part is the part of the cooling main roller not covered with the substrate. The coating baffle is not in contact with the surface of the non-coating part of the cooling main roller, and can move along the axial direction of the cooling main roller, that is, the effective coating width of the substrate can be controlled, and the cooling main roller can be prevented from being contaminated by the coating layer.

[0003] Because the evaporation coating device or the magnetron sputtering coating device is coated in a vacuum environment, the temperature in the vacuum environment is very high whether it is evaporation coating or magnetron sputtering coating. Therefore, the coating baffle is an integral part with corresponding cooling channels inside. The cooling channels are usually cooling chambers or cooling pipelines arranged inside the coating baffle. Cooling medium is introduced into the cooling chamber or cooling pipeline to timely conduct the heat radiated on the coating baffle by sputtering or thermal evaporation, so as to maintain the low temperature state of the coating baffle for a long time and achieve the cooling of the baffle.

[0004] In order to prevent the substrate from being over-baked and broken, and the cooling main roller from being contaminated, and the accumulated plated layer of the cooling main roller from causing the substrate to be broken, a plating baffle is generally used to block the edge section of the substrate (generally, the distance of the edge section along the axis direction of the cooling main roller is 2-5 cm). Thus, when the substrate is plated by using a magnetron sputtering plating device, a large temperature difference will be generated between the middle section and the edge section of the substrate which is subjected to the sputtered metal particles. As a result, a sudden change in heating will occur at the boundary between the middle section and the edge section of the substrate, which can be observed as the softening and relaxation deformation of the heated side (the side of the boundary which is subjected to the sputtered metal particles) and the original non-deformed state of the un-baked side (the side of the boundary which is blocked by the baffle). The transmission and film-removing processes of the heated side and the un-baked side are different, and finally the distortion of the substrate based on the deformation of the boundary can be observed, and at the same time, the transmission and film-removing processes of the plating process are poor, the winding quality is poor, and the drum is prone to occur at the edge. As a result, the substrate plating process will be broken or the effective width cutting rate will be reduced.

[0005] It can be seen that in the current winding plating device, the plating baffle will cause a large temperature difference between the middle section and the edge section of the substrate, resulting in obvious deformation of the substrate. SUMMARY

[0006] The main purpose of the present application is to provide a plating baffle and a winding plating device to solve the problem that the plating baffle will cause a large temperature difference between the middle section and the edge section of the substrate, resulting in obvious deformation of the substrate.

[0007] According to one aspect of the present application, a plating baffle is provided, comprising:

[0008] a main body, the main body comprising a cooling part and a heating part adjacent to the cooling part, and a cooling flow channel is arranged on the cooling part;

[0009] wherein the cooling part is used to cover at least the non-film-removing part of the main roller of the winding plating device, and the heating part is used to cover at least the edge of the film-removing part of the main roller, and the edge is the edge of the film-removing part along the first direction.

[0010] Further, at least one of the cooling part and the heating part reciprocates along the first direction to adjust the contact area between the cooling part and the heating part.

[0011] Further, a plurality of first contact sections are arranged at the side of the cooling part close to the heating part, and a plurality of second contact sections are arranged at the side of the heating part close to the cooling part, and at least one of the first contact sections and the second contact sections reciprocates along the second direction to adjust the contact area between the first contact sections and the second contact sections.

[0012] Further, the main body further comprises:

[0013] A cover plate covering at least one of the first contact section and the second contact section.

[0014] Further, the heating part comprises a fixing plate and a heating plate, the fixing plate is adjacent to the cooling part, and the heating plate is fixedly arranged on a side of the fixing plate facing the film conveying part.

[0015] Further, the heating part further comprises:

[0016] A clamping groove fixedly arranged on a side of the fixing plate facing the film conveying part, the clamping groove is shaped to match the heating plate, and the heating plate is fixedly arranged in the clamping groove.

[0017] Further, the main body further comprises:

[0018] A first heat insulation member arranged between a side wall of the clamping groove and the fixing plate.

[0019] Further, the heating plate comprises a resistance heating plate.

[0020] Further, a width of the resistance heating plate gradually increases in a direction away from the cooling part, and the width of the resistance heating plate is a width of the resistance heating plate in a third direction.

[0021] Further, the heating part comprises a high-temperature-resistant plate body, and a temperature resistance range of the high-temperature-resistant plate body is between 150°C and 300°C.

[0022] Further, the main body further comprises a second heat insulation member arranged between the cooling part and the heating part.

[0023] Further, the second heat insulation member comprises:

[0024] A third plate body arranged between the cooling part and the heating part, and a thermal conductivity of the third plate body is less than one of a thermal conductivity of the cooling part and a thermal conductivity of the heating part.

[0025] Further, at least one of the cooling part and the third plate body reciprocally moves in a first direction to adjust a contact area between the cooling part and the third plate body; and / or, at least one of the heating part and the third plate body reciprocally moves in the first direction to adjust a contact area between the heating part and the third plate body.

[0026] Further, the plate body type of the cooling part comprises at least one of an aluminum plate, a copper plate, a stainless steel plate, and an aluminum-copper alloy plate, the plate body type of the heating part comprises at least one of an aluminum plate, a copper plate, a stainless steel plate, and an aluminum-copper alloy plate, and the plate body type of the cooling part and the plate body type of the heating part are the same or different.

[0027] Further, the plate body type of the cooling part comprises the aluminum plate and / or the copper plate, the plate body type of the heating part comprises the aluminum plate and / or the copper plate, and the third plate body comprises at least one of a platinum plate, an iron plate, a steel plate, a tin plate, and a lead plate.

[0028] Further, the width of the heating part gradually decreases along the second direction, and the width of the heating part is the width of the heating part along the first direction.

[0029] Further, the heating part has a first end and a second end along the second direction, and the absolute value of the difference between the width of the first end and the width of the second end is not less than 0 cm and not greater than 1.5 cm.

[0030] In another aspect, the application also provides a winding and coating device, which is provided with the coating baffle.

[0031] The coating baffle provided by the application is composed of a cooling part and a heating part in abutment, wherein the heating part can generate heat as a heat source to bake the edge section of the substrate conveyed to the film walking part of the winding and coating device, so as to reduce the temperature difference between the middle section and the edge section of the substrate. Since the heat generated by the heating part cannot be quickly conducted away through the abutting cooling part, the heating part and the cooling part can form a certain thermal resistance effect at the abutting boundary position therebetween. Under the thermal resistance effect, the heating temperature generated by the heating part will continuously increase, and after the heating part with the increased temperature bakes the edge section of the substrate as a heat source, the heating of the middle section and the edge section of the substrate can be relatively uniform or slowly changed, so as to avoid the deformation of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0032] The accompanying drawings, which are included to provide a further understanding of the application and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0033] Figure 1 FIG. 1 is a structural schematic view of a winding and coating device;

[0034] Figure 2 FIG. 3 is a front view of a main roller of the winding and coating device;

[0035] Figure 3 FIG. 5 is a structural schematic view of a substrate wrapped on the main roller;

[0036] Figure 4 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0037] Figure 5 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0038] Figure 6 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application; Figure 5 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0039] Figure 7 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application; Figure 5 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0040] Figure 8 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0041] Figure 9 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application; Figure 8 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0042] Figure 10 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0043] Figure 11 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application; Figure 10 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0044] Figure 12 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0045] Figure 13 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0046] Figure 14 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application; Figure 13 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0047] Figure 15 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application;

[0048] Figure 16 A structure diagram of a coating baffle provided on a coating device according to an embodiment of the present application.

[0049] The above drawings include the following reference signs:

[0050] 00. Winding coating device; 01. Main roller; 011. Film feeding section; 012. Non-film feeding section; 02. Crossbeam; 03. Slide rail; 04. Evaporation mechanism; 05. Unwinding roller; 06. Passing roller; 07. Rewinding roller; 10. Coating baffle; 11. Cooling section; 111. First contact section; 12. Heating section; 120. Fixing plate; 121. Second contact section; 122. First end; 123. Second end; 13. Third plate; 14. Cover plate; 15. First heat insulation component; 16. Locking mechanism; 17. Heating plate; 171. Resistance heating plate; 18. Slot; 20. Substrate; 21. Middle section; 22. Edge section; 23. Transition section. Detailed Implementation

[0051] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0052] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0053] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0054] like Figure 1 As shown, when the roll-to-roll coating apparatus 00 is an evaporation coating apparatus, the evaporation coating apparatus includes a main roller 01, a crossbeam 02, a slide rail 03, an evaporation mechanism 04, an unwinding roller 05, a guide roller 06, and a take-up roller 07, etc. Figure 2As shown, the main roller 01 includes a film passing part 011 and a non-film passing part 012. A slide rail 03 for connecting the film coating baffle 10 is arranged on the crossbeam 02 outside the surface of the main roller 01, and the film coating baffle 10 is movably connected to the surface of the main roller 01 through the slide rail 03. The film coating baffle 10 is arranged at both ends of the cooling main roller 01 of the winding film coating device 00, and is an integrally formed arc-shaped plate structure provided with a cooling flow channel. Since the film coating baffle 10 needs to not only protect the non-film passing part 012 at both ends of the main roller 01 from being contaminated by the film coating material, but also shield the edge section 22 of the substrate 20 (such as Figure 3 As shown, the edge section 22 of the substrate 20 is located at both ends of the middle section 21), the inventors of the present application have found through in-depth research that, during the film coating treatment of the substrate 20 by the winding film coating device 00, the integrally formed film coating baffle 10 is in a low-temperature state for a long time due to the cooling medium flowing in the cooling flow channel, which will cause a large temperature difference between the middle section 21 and the edge section 22 of the substrate 20, thereby causing the substrate 20 to be obviously deformed.

[0055] In view of the above problems, the first embodiment of the present application provides a film coating baffle 10, as shown, Figure 4 The film coating baffle 10 includes a main body, the main body includes a cooling part 11 and a heating part 12 adjacent to the cooling part 11, and the cooling part 11 is provided with a cooling flow channel. The cooling part 11 is at least used for the non-film passing part 012 of the cooling main roller 01 of the winding film coating device 00, and the heating part 12 is at least used for covering the edge of the film passing part 011 of the main roller 01, the edge being the edge of the film passing part 011 along a first direction, and the first direction (such as Figure 4 The moving direction indicated by the arrow A) is the axis direction of the main roller 01. The main body composed of the cooling part 11 and the heating part 12 is in an arc-shaped plate structure which is adapted to the surface of the main roller 01. The heating part 12 in the embodiment of the present application includes passive heating and active heating modes as a heat source for heating the substrate. In the passive heating mode, the heating part 12 can heat the substrate 20 by receiving the heat generated by the high-temperature film coating particles, and in the active heating mode, the heating part 12 itself generates heat to heat the substrate 20. Since the heating part 12 covers the edge of the film passing part 011, the heating part 12 can shield the edge section 22 of the substrate 20 when the film passing part 011 conveys the substrate 20. The heating part 12 and the cooling part 11 without the cooling flow channel form a certain thermal resistance effect at the adjacent boundary position therebetween, and the heat absorbed by the heating part 12 will not be quickly conducted away through the adjacent boundary position. The temperature of the heating part 12 continuously rises to become a heat source to bake the edge section 22 of the substrate 20, so that the temperature difference between the edge section 22 and the middle section 21 of the substrate 20 is small, thereby avoiding the defects such as deformation, film breakage and drum ribs of the substrate 20. The transmission efficiency and winding quality of the substrate 20 are ensured, and the effective width cutting rate of the substrate 20 is improved.

[0056] Secondly, when the cooling flow channel is arranged on the cooling part 11 and the cooling effect is generated based on the cooling medium, the heat in the vacuum chamber of the winding coating device 00 can be taken away. If not cooled, the temperature in the vacuum chamber will continue to increase, and the excessive heat is not allowed to deposit on the cooling part 11, so that the cooling part 11 will not be deformed. In addition, although the cooling part 11 and the heating part 12 are in contact, the heat barrier is generated between the cooling part 11 and the heating part 12, and the excessive heat on the heating part 12 can be slowly taken away through the cooling effect of the cooling part 11, so that the temperature generated after the continuous heating of the heating part 12 is not too high, and the temperature of the edge section 22 of the blocked baking is not too high, thereby avoiding the serious deformation of the substrate 20.

[0057] It can be seen that the coating baffle 10 provided by the embodiment of the present application is composed of the cooling part 11 and the heating part 12 in contact, wherein the heating part can generate heat as a heat source to bake the edge section of the substrate conveyed to the winding coating device, so as to reduce the temperature difference between the middle section and the edge section of the substrate. And because the heat generated by the heating part cannot be quickly taken away through the adjacent cooling part, the heating part and the cooling part can form a certain heat resistance effect at the adjacent boundary position between each other. Under the heat resistance effect, the heating temperature of the heating part will continue to rise, and after the baking of the edge section of the substrate by the heating part as a heat source after the temperature rises, the heating of the middle section and the edge section of the substrate is relatively uniform or slowly changed, thereby avoiding the deformation of the substrate.

[0058] Under the passive heating mode, the heating part 12 in the embodiment of the present application includes an arc-shaped plate body structure without a cooling flow channel and having a heat conduction function. At this time, because the heat absorbed by the heating part 12 cannot be quickly taken away through the adjacent boundary position, the temperature of the heating part 12 will continue to rise, and the heating part 12 itself becomes a heat source after the temperature rises. Therefore, the heating part 12 can radiate heat to bake the edge section 22 of the substrate 20, so that the heating of the middle section 21 and the edge section 22 of the substrate 20 is relatively uniform or slowly changed, thereby avoiding the deformation of the substrate 20.

[0059] In the embodiment of the present application, in order to realize that the heat radiation generated by the heating part 12 as a heat source can heat the edge section 22 of the substrate 20, so as to achieve that the heating of the blocked edge section 22 of the substrate 20 is similar to that of the unblocked middle section 21, the heating part 12 includes a high-temperature-resistant plate body, and the temperature resistance range of the high-temperature-resistant plate body is between 150℃ and 300℃.

[0060] To adjust the thermal resistance effect at the boundary position between the cooling section 11 and the heating section 12 according to actual needs, and to increase or decrease the rate of heat absorbed by the heating section 12 and transferred to the cooling section 11, the contact area between the cooling section 11 and the heating section 12 can be adjusted, and for this purpose, at least one of the cooling section 11 and the heating section 12 is reciprocally moved along the first direction to adjust the contact area between the cooling section 11 and the heating section 12. That is, the contact area between the cooling section 11 and the heating section 12 is adjusted by reciprocally moving the cooling section 11 along the axis direction of the main roller 01, and / or the contact area between the cooling section 11 and the heating section 12 is adjusted by reciprocally moving the heating section 12 along the axis direction of the main roller 01. The smaller the contact area, the less heat is taken away from the heating section 12 by the cooling section 11, so that by adjusting the contact area between the cooling section 11 and the heating section 12, the temperature difference between the middle section 21 and the edge section 22 of the substrate 20 can be controlled, the sudden change of the substrate 20 at the boundary of the heating section 12 can be reduced, the edge section 22 of the substrate 20 blocked by the heating section 12 can also be heated, the temperature of the middle section 21 to the edge section 22 gradually changes, and even the temperature of the entire width direction (i.e. the first direction) of the substrate 20 is very similar (e.g. the temperature difference between the middle section 21 and the edge section 22 is less than 10℃), so that the deformation problem of the substrate 20 in the film plating process is solved, the winding quality and cutting rate of the substrate 20 are improved, and the winding of the flexible substrate 20 which is not temperature-resistant is relatively flat.

[0061] As can be seen from the above, when the cooling section 11 and the heating section 12 are in contact, the cooling section 11 will take away part of the heat of the heating section 12, but because the contact area between the cooling section 11 and the heating section 12 can be reduced, the cooling section 11 can be hindered from taking away the heat of the heating section 12 under the condition of reduced contact area, so that a thermal resistance effect is formed at the boundary position between the cooling section 11 and the heating section 12, and the temperature of the heating section 12 can be continuously increased to form a heat source to bake the substrate 20.

[0062] As shown in Figures 5 to 7 In addition to the above-mentioned way of adjusting the contact area between the cooling section 11 and the heating section 12 to control the thermal resistance therebetween, the embodiment of the present application can also adjust the contact area between the cooling section 11 and the heating section 12 from a second direction perpendicular to the first direction. The second direction is as shown in Figure 6The arrow B shown in the figure indicates the direction of the circumference of the main roller 01. Specifically, the cooling part 11 is provided with a plurality of first contact sections 111 at intervals on the side close to the heating part 12, and the heating part 12 is provided with a plurality of second contact sections 121 at intervals on the side close to the cooling part 11. At least one of the first contact sections 111 and the second contact sections 121 moves back and forth along the second direction to adjust the contact area between the first contact sections 111 and the second contact sections 121. Specifically, when the main body composed of the cooling part 11 and the heating part 12 is installed on the outer surface of the main roller 01 through the slide rails 03 provided on the coating device 00, the cooling part 11 and the heating part 12 can be fixed on two slide rails 03 parallel to each other. Then, the contact area between the cooling part 11 and the heating part 12 can be adjusted by moving the cooling part 11 or the heating part 12 along the second direction. Finally, the cooling part 11 and the heating part 12 can be locked in the connected state with the current contact area through the locking mechanism 16.

[0063] When the first contact sections 111 and the second contact sections 121 are in contact and overlap, gaps are formed between the first contact sections 111 and the second contact sections 121. During the coating process of the substrate 20, coating particles can sputter through the gaps and contaminate the main roller 01. To this end, as shown in Figure 8 and Figure 9 The main body of the embodiment of the present application further comprises a cover plate 14 covering at least one of the first contact sections 111 and the second contact sections 121, so as to cover the gaps formed between the first contact sections 111 and the second contact sections 121, and prevent coating particles from sputtering onto the main roller 01.

[0064] As shown in Figure 10 To further make the heating of the middle section 21 to the edge section 22 of the substrate 20 more uniform or gradual, the width of the heating part 12 in the embodiment of the present application gradually decreases along the second direction. The width of the heating part 12 is the width of the heating part 12 along the first direction. Thus, as shown in Figure 11 The heating part 12 can divide the substrate 20 in the coating process into the middle section 21, the transition section 23, and the edge section 22 along the width direction (i.e., the first direction) of the substrate 20. When the substrate 20 is coated along the direction in which the width of the heating part 12 gradually decreases, the temperature of the transition section 23 will be higher than that of the edge section 22 but lower than that of the middle section 21, because the transition section 23 is less shielded by the heating part 12. Thus, the temperature of the middle section 21 to the edge section 22 of the substrate 20 can be made to change uniformly or gradually, and the deformation of the substrate 20 can be further avoided, and the winding quality and the cutting rate of the substrate 20 can be improved.

[0065] The heating part 12 has a first end 122 and a second end 123 along the second direction, and the absolute value of the difference between the width of the first end 122 and the width of the second end 123 is not less than 0 cm and not greater than 1.5 cm, so that the side of the heating part 12 close to the middle section 21 and the horizontal interface of the main roller 01 maintain a certain inclination angle. Specifically, when the heating part 12 is an arc-shaped plate body matched with the outer surface of the main roller 01, the first end 122 and the second end 123 are respectively opposite ends of the arc-shaped plate body in the second direction. The embodiment of the present application controls the width change of the heating part 12 by limiting the size of the difference between the first end 122 and the second end 123 of the heating part 12, so as to control the uniform change or slow change of the temperature of the middle section 21 to the edge section 22 of the substrate 20, and improve the winding quality and cutting rate of the substrate 20. Specifically, the heating part 12 with a certain inclination angle divides the substrate 20 in the film coating process along the axis direction of the main roller 01 into the middle section 21, the transition section 23 and the edge section 22. When the substrate 20 is coated in the direction of gradually decreasing width of the heating part 12, the temperature of the transition section 23 will be higher than that of the edge section 22 but lower than that of the middle section 21, because the transition section 23 is less shielded by the heating part 12, so as to achieve the uniform change or slow change of the temperature of the middle section 21 to the edge section 22 of the substrate 20, further avoid the deformation of the substrate 20, and improve the winding quality and cutting rate of the substrate 20. Therefore, the embodiment of the present application controls the width change of the heating part 12 by limiting the size of the difference between the first end 122 and the second end 123 of the heating part 12, so as to control the uniform change or slow change of the temperature of the middle section 21 to the edge section 22 of the substrate 20, and improve the winding quality and cutting rate of the substrate 20.

[0066] As shown in the drawings, Figure 12 When the heating part 12 in the embodiment of the present application is an arc-shaped plate body with active heating function, the heating part 12 includes a fixed plate 120 and a heating plate 17. The fixed plate 120 is adjacent to the cooling part 11, and the heating plate 17 is fixedly arranged on the side of the fixed plate 120 facing the film running part 011. The fixed plate 120 and the heating plate 17 are both arc-shaped plate structures matched with the outer surface of the main roller 01, so as to uniformly heat the edge section 22 of the substrate 20 on the film running part 011, thereby ensuring that the edge section 22 is uniformly heated along the circumferential direction of the main roller 01. The heating plate 17 can better realize the heating effect of the heating part 12 on the edge section 22 of the substrate 20, so that the temperature difference of the middle section 21 to the edge section 22 of the substrate 20 is controllable. Moreover, the heating plate 17 actively bakes the edge section 22 of the substrate 20, which can more accurately control the temperature difference of the middle section 21 to the edge section 22 of the substrate 20, so that the temperature difference reaches the expected change effect and avoids the deformation of the substrate 20.

[0067] Secondly, the plurality of second contact sections 121 of the heating part 12 are arranged at intervals on the side of the fixed plate 120 close to the cooling part 11, so that the thermal resistance effect between the cooling part 11 and the heating part 12 is adjusted by adjusting the contact area between the first contact section 111 and the second contact section 121 on the fixed plate 120. The fixed plate 120 includes an arc-shaped plate body structure provided with a cooling flow channel or an arc-shaped plate body structure not provided with a cooling flow channel. When the fixed plate 120 is an arc-shaped plate body structure not provided with a cooling flow channel, the fixed plate 120 can have a passive heating function, that is, the fixed plate 120 can heat the substrate 20 by receiving heat generated by the high-temperature coated particles. At this time, the fixed plate 120 can be a high-temperature-resistant plate body with a temperature resistance range of 150-300°C, so that the embodiment of the present application can realize heating of the substrate 20 by combining the active heating function of the heating plate and the passive heating function of the fixed plate 120, thereby avoiding deformation of the substrate 20.

[0068] The heating plate 17 includes a plurality of plates, and the plurality of heating plates 17 are arranged on the fixed plate 120 in the second direction in sequence, and the plurality of heating plates 17 are integrally arranged or separately arranged. Specifically, in the embodiment of the present application, a long-strip-shaped cavity region can be arranged in the length direction of the fixed plate 120, and the cavity region is located at one end of the fixed plate 120 close to the edge of the film running part 011, and the opening of the cavity region faces the outer surface of the film running part 011. The length of the fixed plate 120 is the length of the heating part 12 in the second direction. The heating plate 17 is a plate-shaped structure integrally formed and matched with the cavity region. In order to facilitate the installation of the heating plate 17, the heating plate 17 can be a flexible heating plate that can be bent, so that the heating plate 17 is better arranged in the cavity region of the heating part 12. Since the heating plate 17 assembled into the cavity region is located on the side of the heating part 12 away from the cooling part 11, it can better bake the side of the edge section 22 of the substrate 20 close to the middle section 21, further ensuring the slow change of the temperature of the middle section 21 to the edge section 22 of the substrate 20, reducing the temperature difference between the middle section 21 and the edge section 22, and thereby improving the winding quality and cutting rate of the substrate 20.

[0069] As shown in Figure 12 and Figure 13 In the embodiment of the present application, the heating part 12 further includes a clamping groove 18 fixedly arranged on the side of the fixed plate 120 facing the film running part 011, the shape of the clamping groove 18 is matched with the heating plate 17, and the heating plate 17 is fixedly arranged in the clamping groove 18. Specifically, the clamping groove 18 in the embodiment of the present application is fixedly arranged in the cavity region of the fixed plate 120, and the two ends of the clamping groove 18 in the first direction can be provided with a buckle structure (which is a stop boss of the heating plate 17), and in order to facilitate the assembly and cooperation between the heating plate 17 and the clamping groove 18, the heating plate 17 is selected to be a flexible heating plate.

[0070] As shown in Figure 14As shown, the main body provided by the embodiment of the present application further comprises a first heat insulation member 15, which is arranged between the side wall of the clamping groove 18 (i.e. the side wall of the clamping groove 18 facing the cavity region of the heating portion 12) and the fixing plate 120. The first heat insulation member 15 can be a temperature-resistant plastic plate, such as polytetrafluoroethylene, which can be used for a long time at about 260°C. The first heat insulation member 15 separates the clamping groove 18 and the fixing plate 120 to reduce the speed of heat conduction from the heating plate 17 to the fixing plate 120.

[0071] The heating plate 17 in the embodiment of the present application comprises a resistance heating plate 171 and / or a silica gel heating plate. The silica gel heating plate comprises a high-temperature-resistant silica gel body and a resistance heating wire, and the resistance heating wire is embedded in the high-temperature-resistant silica gel body. The high-temperature-resistant silica gel body is a common silica gel product, and the ordinary silica gel can resist a temperature of 200-300°C. The high-temperature-resistant silica gel body can resist a temperature of about 350°C for a short time (e.g. two hours), and the silica gel heating plate formed by the high-temperature-resistant silica gel body can realize baking of the base material 20 at a high temperature, thereby reducing the temperature difference between the middle section 21 and the edge section 22 of the base material 20.

[0072] To further ensure the slow change of the temperature of the middle section 21 to the edge section 22 of the base material 20, the side of the edge section 22 of the base material 20 close to the middle section 21 can be baked. To this end, as shown in FIG. 2, the silica gel heating plate 172 is arranged on the side of the edge section 22 of the base material 20 close to the middle section 21. Figure 15 As shown, the width of the resistance heating plate 171 gradually increases in the direction away from the cooling portion 11, and the width of the resistance heating plate 171 is the width of the resistance heating plate 171 along the third direction (i.e. the direction away from the cooling portion 11). Figure 15The third direction is a direction perpendicular to the first direction and the second direction, that is, the third direction is equivalent to the radial direction of the main roller 01. Since the cross section of the resistance heating plate 171 away from the cooling part 11 is larger, the resistance is larger, and the heat generated after the voltage is applied is also higher. When the side of the edge section 22 close to the middle section 21 is baked by the side of the resistance heating plate 171 away from the cooling part 11, the temperature of the side of the edge section 22 close to the middle section 21 is higher and closer to the temperature of the middle section 21, avoiding the temperature mutation at the boundary between the middle section 21 and the edge section 22 to affect the shape and quality of the substrate 20. Similarly, the width of the silica gel heating plate can also be gradually increased away from the cooling part 11. The width of the silica gel heating plate is the width of the silica gel heating plate along the third direction. The silica gel heating plate has a first heating end and a second heating end away from the cooling part 11. The width of the second heating end is greater than that of the first heating end. The resistance heating wire embedded in the second heating end is more than that in the first heating end, so that the second heating end has a larger resistance. When a working voltage is applied to the silica gel heating plate, the second heating end generates more heat. When the side of the edge section 22 close to the middle section 21 is baked by the second heating end, the side of the edge section 22 close to the middle section 21 can obtain a higher temperature, thereby being closer to the temperature of the middle section 21, avoiding the temperature mutation at the boundary between the middle section 21 and the edge section 22 to affect the shape and quality of the substrate 20.

[0073] The control mode of the working voltage applied to the heating plate 17 (such as the resistance heating plate 171 and the silica gel heating plate) of the embodiment of the present application changes with the film coating speed and the film coating power of the substrate 20. The faster the film coating speed, the less the middle section 21 of the substrate 20 is heated, so the voltage applied to the heating plate 17 can be reduced, thereby reducing the temperature of the edge section 22 of the substrate 20. The smaller the film coating power, the less the middle section 21 of the substrate 20 is heated, so the voltage applied to the heating plate 17 can be reduced, thereby reducing the temperature of the edge section 22 of the substrate 20. Thus, the embodiment of the present application adjusts the voltage applied to the heating plate 17 based on the film coating speed and the film coating power of the substrate 20, thereby ensuring that the temperature difference between the middle section 21 and the edge section 22 is within a predetermined range to avoid deformation of the substrate 20.

[0074] The main body provided by the embodiment of the present application further comprises a second heat insulation member arranged between the cooling part 11 and the heating part 12. The second heat insulation member is directly connected between the heating part 12 and the cooling part 11 by welding or the like, thereby forming a thermal barrier between the heating part 12 and the cooling part 11 to prevent the heat of the heating part 12 from being quickly conducted away by the cooling part 11, so that the heating part 12 can continuously heat to become a heat source to bake the edge section 22 of the substrate 20.

[0075] Specifically, as shown in Figure 16 The second heat insulating member includes a third plate body 13, which is disposed between the cooling portion 11 and the heating portion 12, and the thermal conductivity of the third plate body 13 is less than both the thermal conductivity of the cooling portion 11 and the thermal conductivity of the heating portion 12. Since the thermal conductivity of the third plate body 13 is smaller, the third plate body 13 plays a role of blocking the heat conducted from the heating portion 12 to the cooling portion 11, and when the thermal conductivity of the third plate body 13 is less than both the thermal conductivity of the cooling portion 11 and the thermal conductivity of the heating portion 12, the thermal resistance effect between the cooling portion 11 and the heating portion 12 is better, so that the heating portion 12 can continuously heat up to become a heat source to bake the edge section 22 of the substrate 20.

[0076] On the basis of adding the third plate body 13 to enhance the thermal resistance between the cooling portion 11 and the heating portion 12, in order to adjust the thermal resistance between the cooling portion 11 and the heating portion 12 according to actual needs, if it is needed to enhance or reduce the thermal resistance between the cooling portion 11 and the heating portion 12 according to the amount of heat that the middle section 21 of the substrate 20 can withstand, at least one of the cooling portion 11 and the third plate body 13 in the embodiment of the present application reciprocates along the first direction to adjust the contact area between the cooling portion 11 and the third plate body 13. And / or, at least one of the heating portion 12 and the third plate body 13 reciprocates along the first direction to adjust the contact area between the heating portion 12 and the third plate body 13. If the middle section 21 can withstand a large amount of heat, it is needed to make the contact area (i.e. the overlapping area of the cooling portion 11 and the third plate body 13) between the cooling portion 11 and the third plate body 13 smaller. And / or, if the middle section 21 can withstand a large amount of heat, it is needed to make the contact area between the heating portion 12 and the third plate body 13 smaller. The smaller the contact area is, the less heat is conducted away, so as to ensure that the temperature difference between the middle section 21 and the edge section 22 changes uniformly and slowly, and avoid deformation of the substrate 20.

[0077] The plate type of the cooling part 11 in the embodiment of the present application includes at least one of an aluminum plate, a copper plate, a stainless steel plate, and an aluminum-copper alloy plate, the plate type of the heating part 12 includes at least one of an aluminum plate, a copper plate, a stainless steel plate, and an aluminum-copper alloy plate, and the plate type of the cooling part 11 and the plate type of the heating part 12 are the same or different. Among them, the plate type of the cooling part 11 includes an aluminum plate and / or a copper plate, the plate type of the heating part 12 includes an aluminum plate and / or a copper plate, since the thermal conductivity of the aluminum plate is 237, the thermal conductivity of the copper plate is 401, and the thermal conductivity of the third plate 13 needs to be less than the thermal conductivity of the aluminum plate and the copper plate, for this, the third plate 13 can include at least one of a platinum plate, an iron plate, a steel plate, a tin plate, and a lead plate. Among them, the thermal conductivity of the platinum plate is 70, the thermal conductivity of the iron plate is 60, the thermal conductivity of the steel plate is 60, the thermal conductivity of the tin plate is 67, and the thermal conductivity of the lead plate is 34.8. Therefore, after the third plate 13 is arranged between the cooling part 11 and the heating part 12, the thermal resistance effect between the two is better, so that the heating part 12 continuously heats up to become a heat source to bake the edge section 22 of the substrate 20.

[0078] The second embodiment of the present application also provides a winding and coating device 00, which is provided with the coating baffle 10 provided in the first embodiment of the present application.

[0079] The winding and coating device 00 provided in the embodiment of the present application is internally provided with the coating baffle 10 which is composed of the abutment of the cooling part 11 and the heating part 12, the heating part 12 and the cooling part 11 provided with the cooling flow channel can form a thermal resistance effect at the abutment boundary position between each other, the heat generated by the heating part 12 cannot be quickly conducted away through the abutment boundary position, the temperature of the heating part 12 continuously rises, and the heating part 12 itself becomes a heat source after the temperature rises. Therefore, the heating part 12 can radiate heat to bake the edge section 22 of the substrate 20 in the width direction of the film conveying part 011 of the winding and coating device 00, so that the heating of the middle section 21 and the edge section 22 of the substrate 20 is relatively uniform or changes slowly, thereby avoiding deformation of the substrate 20.

[0080] The third embodiment of the present application provides an application embodiment of the coating baffle 10 on the basis of the above two embodiments. The application embodiment of the present application takes a magnetron sputtering coating device as an example to illustrate how the coating baffle 10 solves the deformation problem of the substrate 20 in the coating process.

[0081] Specifically, the application embodiment of the present invention can solve or reduce the deformation of the substrate 20 at the boundary of the coating baffle 10, while preventing the edge of the substrate 20 from being directly sputtered or baked by the coating particles generated by the winding coating device 00, resulting in film breakage, and ensuring that the main roller 01 is better protected by the coating baffle 10 to avoid coating problems. The coating baffle 10 provided in the first embodiment of the present invention reduces the sudden temperature change phenomenon of the substrate 20 at the boundary of the conventional coating baffle 10. The heating part 12 of the coating baffle 10 includes a high-temperature resistant arc-shaped plate without cooling channels. The heating part 12 allows the edge segment 22 of the substrate 20 that is blocked to also be heated, so that the temperature between the middle segment 21 and the edge segment 22 of the substrate 20 changes slowly, and even achieves that the temperature from the beginning of the middle segment 21 to the end of the edge segment 22 is very similar. This ultimately solves the problem of deformation in the coating process of substrate 20, ensures the winding quality of substrate 20, and ensures that the heat-sensitive flexible substrate 20 is relatively flat in the winding state. It also improves the cutting rate of wide substrate 20, achieving the goal of efficient cutting.

[0082] The slow temperature change is reflected in the fact that the left side of the edge segment 22 blocked by the coating baffle 10 (i.e. the side of the edge segment 22 closer to the middle segment 21) and the right side of the middle segment 21 of the substrate 20 (the side of the middle segment 21 closer to the edge segment 22) have similar temperatures. From the left side of the edge segment 22 to its right side away from the middle segment 21, the temperature changes slowly and becomes lower and lower, which can solve the deformation problem of the substrate 20.

[0083] To address the aforementioned problems, the present invention provides two design schemes for the coating baffle 10. Scheme one is a passive thermal baking scheme, where the substrate 20 is baked by a main body consisting of a cooling section 11 with cooling channels and a heating section 12 without cooling channels, while simultaneously protecting the non-film-feeding section 012 of the main roller 01. The heating section 12 is made of a high-temperature resistant plate with a temperature resistance range between 150°C and 300°C. Scheme two is an active thermal baking scheme, where a heating plate 17 capable of actively providing a heat source is provided on the heating section 12, which is an arc-shaped body, to actively bake the substrate 20 and protect the main roller 01.

[0084] Specifically, whether it is Option 1 or Option 2, such as Figure 2 As shown, in the application embodiments of the present invention, the main roller 01 of the winding coating apparatus 00 includes a film-feeding section 011 and a non-film-feeding section 012. Two parallel slide rails 03 are provided on the crossbeam 02 located on the outer surface of the main roller 01. The coating baffle 10 is movably connected to and covers the outer surface of the main roller 01 via the slide rails 03. The cooling section 11 and the heating section 12 of the coating baffle 10 are respectively connected to different slide rails 03.

[0085] The technical content of the application embodiment scheme one includes:

[0086] As shown in Figure 4 The original one-piece (integral component) arc-shaped cooling baffle is designed as two parts of the cooling part 11 and the heating part 12, the heating part 12 is mainly used for shielding and baking the edge section 22 of the base material 20, and the cooling part 11 is mainly used for protecting the non-film running part 012 of the two ends of the main roller 01 without covering the base material 20. Among them, the cooling part 11 and the heating part 12 can realize convenient abutment, and the cooling part 11 and the heating part 12 form a certain controlled thermal resistance effect at the abutment boundary position, so as to accumulate heat to improve the temperature of the heating part 12 when the heating part 12 is baked by the thermal radiation of sputtering or thermal evaporation film coating. The heating part 12 completely shields the edge section 22 of the base material 20, and the heating part 12 itself does not have the condition of guiding away heat, so the heat absorbed by the heating part 12 will not be quickly guided away through the abutment boundary, and the abutment boundary forms a thermal resistance effect. That is, the abutment boundary of the cooling part 11 and the heating part 12 forms a discontinuous heat distribution change, the temperature of the heating part 12 continues to rise, and the temperature of the cooling part 11 is low. The final effect is that the heating part 12 can provide thermal radiation to the edge section 22 relative to the other side of the evaporation source direction after the temperature of the heating part 12 rises. That is, the heating part 12 itself becomes a heat source to bake the shielded edge section 22, so that the heating of the base material 20 at the shielding boundary is relatively uniform or slowly changing. The heating part 12 in the application embodiment can be understood as a heat conduction block, and the heat formed outside the heating part 12 will be conducted to the inside, thereby realizing the baking of the film edge. The heat of the heating part 12 is formed by sputtering or thermal evaporation of the film coating particles. The temperature of the surface of the edge section 22 shielded by the heating part 12 is very close to the temperature of the surface of the middle section 21, and the temperature difference between the middle section 21 and the edge section 22 in the first direction is less than 10°C.

[0087] When the scheme one realizes passive baking of the base material 20 through the heating part 12, the winding quality can also be ensured by adjusting the speed of the base material 20 (i.e. the speed of the film running). Specifically, if the temperature of the edge section 22 is higher than the temperature of the middle section 21, the film running speed can be slowed down, and if the temperature of the edge section 22 is lower than the temperature of the middle section 21, the film running speed can be accelerated, so that the temperature difference between the middle section 21 and the edge section 22 is always within a controllable temperature range or even consistent.

[0088] When the cooling flow channel is provided on the cooling portion 11, the cooling effect is generated based on the cooling medium flowing in, and the heat in the vacuum chamber of the coating device 00 can be taken away. If not cooled, the temperature in the vacuum chamber will continue to increase, and the excessive heat will not be deposited on the cooling portion 11, so that the cooling portion 11 will not be deformed. In addition, although the cooling portion 11 and the heating portion 12 are in contact, a thermal barrier is generated between the cooling portion 11 and the heating portion 12. While the heating portion 12 provides the baking function for the edge section 22 of the substrate 20 as a heat source, the excessive heat on the heating portion 12 can be slowly taken away by the cooling effect of the cooling portion 11, so that the temperature of the heating portion 12 after continuous heating will not be too high, and the temperature of the edge section 22 of the substrate 20 will not be too high to cause serious deformation of the substrate 20.

[0089] The heating portion 12 and the cooling portion 11 can be of the same or different plate types. The cooling portion 11 is usually made of aluminum, copper, stainless steel, and alloys containing these metal elements. Specifically, the plate type of the cooling portion 11 can include at least one of an aluminum plate, a copper plate, a stainless steel plate, and an aluminum-copper alloy plate, and the plate type of the heating portion 12 can include at least one of an aluminum plate, a copper plate, a stainless steel plate, and an aluminum-copper alloy plate.

[0090] The size of the thermal resistance effect between the heating portion 12 and the cooling portion 11 can be controlled by adjusting the size of the contact area between them. Specifically, at least one of the cooling portion 11 and the heating portion 12 can reciprocally move along the first direction on the slide rail 03, so as to adjust the contact area between the cooling portion 11 and the heating portion 12.

[0091] In the application, a third plate 13 different from the heating portion 12 can be introduced on the side of the heating portion 12 close to the cooling portion 11, and the third plate 13 is connected between the cooling portion 11 and the heating portion 12 by welding or the like. The third plate 13 has a lower thermal conductivity than the heating portion 12 and the cooling portion 11, so as to block the heat of the heating portion 12. The plate type of the cooling portion 11 can include an aluminum plate and / or a copper plate, and the plate type of the heating portion 12 can include an aluminum plate and / or a copper plate. Since the thermal conductivity of the aluminum plate is 237 and the thermal conductivity of the copper plate is 401, the thermal conductivity of the third plate 13 needs to be less than that of the aluminum plate and the copper plate. To this end, the third plate 13 can include at least one of a platinum plate, an iron plate, a steel plate, a tin plate, and a lead plate. The thermal conductivity of the platinum plate is 70, the thermal conductivity of the iron plate is 60, the thermal conductivity of the steel plate is 60, the thermal conductivity of the tin plate is 67, and the thermal conductivity of the lead plate is 34.8. Therefore, the thermal resistance effect between the cooling portion 11 and the heating portion 12 is better after the third plate 13 is provided therebetween, so as to realize that the heating portion 12 continuously heats to become a heat source to bake the edge section 22 of the substrate 20.

[0092] On the basis of increasing the thermal resistance between the cooling section 11 and the heating section 12, in order to adjust the thermal resistance between the cooling section 11 and the heating section 12 according to actual needs, such as according to the amount of heat that the middle section 21 of the substrate 20 can withstand, the thermal resistance between the cooling section 11 and the heating section 12 can be increased or decreased. For this purpose, in the application, the cooling section 11 and the third plate 13 can be arranged such that at least one of them can move back and forth along the first direction to adjust the contact area between the cooling section 11 and the third plate 13. And / or, at least one of the heating section 12 and the third plate 13 moves back and forth along the first direction to adjust the contact area between the heating section 12 and the third plate 13. If the middle section 21 can withstand a large amount of heat, it is necessary to make the contact area between the cooling section 11 and the third plate 13 (i.e. the overlapping area of the cooling section 11 and the third plate 13) smaller. And / or, if the middle section 21 can withstand a large amount of heat, it is necessary to make the contact area between the heating section 12 and the third plate 13 smaller. The smaller the contact area, the less heat is dissipated, thereby ensuring that the temperature difference between the middle section 21 and the edge section 22 changes uniformly and slowly, avoiding deformation of the substrate 20.

[0093] In addition, the change of the contact area between the cooling section 11 and the heating section 12 can also be sliding movement along the circumferential direction of the main roller 01. Specifically, to achieve sliding movement along the circumferential direction of the main roller 01, the side of the cooling section 11 close to the heating section 12 is provided with a plurality of first contact sections 111, and the side of the heating section 12 close to the cooling section 11 is provided with a plurality of second contact sections 121, and at least one of the first contact sections 111 and the second contact sections 121 moves back and forth along the second direction (i.e. the circumferential direction of the main roller 01) to adjust the contact area between the first contact sections 111 and the second contact sections 121. Specifically, when the main body formed by the cooling section 11 and the heating section 12 is installed on the outer surface of the main roller 01 by winding around the slide rails 03 provided on the coating device 00, the cooling section 11 and the heating section 12 can be fixed on two slide rails 03 parallel to each other, and then the cooling section 11 or the heating section 12 is moved along the second direction to adjust the contact area between them, and then the cooling section 11 and the heating section 12 are locked in the connected state with the current contact area by the locking mechanism 16.

[0094] When the first contact section 111 and the second contact section 121 move along the first direction and / or the second direction contact overlap, a gap is formed between the first contact section 111 and the second contact section 121. During the film plating process of the substrate 20, film plating particles will sputter onto the main roller 01 through the gap and contaminate the main roller 01. To this end, the main body provided by the application embodiment further comprises a cover plate 14 covering at least one of the first contact section 111 and the second contact section 121, thereby covering the gap formed between the first contact section 111 and the second contact section 121 and preventing film plating particles from sputtering onto the main roller 01. Of course, after the first contact section 111 and the second contact section 121 move along the first direction, the horizontal distance of the first contact section 111 and the second contact section 121 in the first direction is preferably zero, thereby ensuring the sealing of the film plating baffle 10 as a whole and preventing film plating particles from sputtering onto the main roller 01.

[0095] In addition, the heating portion 12 has a first end 122 and a second end 123 along the second direction. The absolute value of the difference between the width of the first end 122 and the width of the second end 123 is not less than 0 cm and not greater than 1.5 cm, so that the horizontal interface between the side of the heating portion 12 close to the middle section 21 and the main roller 01 maintains a certain inclination angle. When the film plating baffle 10 of the application embodiment is in the form of an arc-shaped plate, the diameter of the arc-shaped plate can be set to be between 75 cm and 100 cm, thereby better covering the outer surface of the main roller 01. Specifically, when the heating portion 12 is an arc-shaped plate body that is adapted to the outer surface of the main roller 01, the first end 122 and the second end 123 are respectively opposite ends of the arc-shaped plate body along the second direction. When the substrate 20 is plated along the direction in which the width of the heating portion 12 gradually decreases (e.g., when the width of the second end 123 is greater than the width of the first end 122, the substrate 20 is plated along the direction from the second end 123 to the first end 122), the temperature of the transition section 23 will be higher than that of the edge section 22 but lower than that of the middle section 21, because the transition section 23 is less shielded by the heating portion 12, thereby achieving uniform or slow change of the temperature of the middle section 21 to the edge section 22 of the substrate 20, further avoiding deformation of the substrate 20 and improving the winding quality and cutting rate of the substrate 20. Therefore, the application embodiment limits the difference between the first end 122 and the second end 123 of the heating portion 12 to control the width variation of the heating portion 12, thereby controlling the uniform or slow change of the temperature of the middle section 21 to the edge section 22 of the substrate 20 and improving the winding quality and cutting rate of the substrate 20.

[0096] The temperature difference between the middle section 21 and the edge section 22 of the substrate 20 can be within a control range (e.g., within 10°C). For the heating part 12, the side edge near the middle section 21 is beveled. If the side edge is not beveled, the straight interface between the two sides can have a temperature difference, which can cause deformation and tension in the length direction of the substrate 20. Therefore, the deformation of the two sides of the straight interface can affect the winding quality of the substrate 20. However, if the side edge is beveled, the problem can be reduced or avoided.

[0097] The first thermal expansion coefficient of the heating part 12 in the hot state (i.e., in the first temperature range) is similar to the second thermal expansion coefficient of the film layer (e.g., a Cu film layer). However, when the heating part 12 is removed and cooled, the first thermal expansion coefficient needs to have a large difference from the second thermal expansion coefficient, i.e., the difference between the first thermal expansion coefficient and the second thermal expansion coefficient is greater than a second predetermined numerical range in the second temperature range. Therefore, the film layer can be peeled from the surface of the heating part 12 based on the large difference in the thermal expansion coefficient or the difference in the related stress, so as to clean the film layer on the surface of the heating part 12.

[0098] The second improved scheme of the application embodiment is to increase the heating plate 17 on the inner side (i.e., the side facing the outer surface of the main roller 01) of the heating part 12 of the film-coated baffle 10 to actively heat the substrate 20, so as to reduce the temperature difference or accumulated heat difference between the middle section 21 and the edge section 22 of the substrate 20.

[0099] Specifically, the technical content of the second improved scheme of the application embodiment includes:

[0100] The original one-piece (integral part) arc-shaped cooling baffle is optimally designed (the original arc-shaped baffle has a structure of an overall flow channel and a protective cover that can pass cooling medium). After improvement, the film-coated baffle 10 is provided with a heating plate 17 with a heating function and a flexible material on the inner side (i.e., the side near the edge section 22 of the middle section 21) near the central effective film-coating area of the substrate 20, so as to heat the edge section 22 through the heating plate 17.

[0101] The heating part 12 is provided with a cavity area on the side facing the side of the main roller 01 and close to the side of the film moving part 011 of the main roller 01, the flexible and bendable heating plate 17 is arranged in the cavity area, and the cooling flow channel is arranged at the position of the heating part 12 outside the cavity area to dissipate the excessive heat and protect the structure of the heating part 12, so that the heating part 12 always maintains a lower temperature while the heating plate 17 heats the base material 20. The application embodiment can adjust the heating temperature by adjusting the voltage or power of the heating plate 17, and the temperature is adjusted to make the actual heat received by the edge section 22 of the base material 20 similar to the heat received by the middle section 21, so as to avoid the deformation problem of the base material 20 caused by temperature mutation at the edge position blocked by the film coating baffle 10.

[0102] The heating plate 17 and the film coating baffle 10 in the application embodiment are both arc-shaped plate structures, and the film coating baffle 10 provided with the heating plate 17 usually covers half of the main roller 01.

[0103] The cooling part 11 and the heating part 12 provided with the heating plate 17 can be an integral structure or an adjacent split structure, and the side close to the heating part 12 of the cooling part 11 is provided with a cooling flow channel through which the cooling medium can be introduced to dissipate heat and cool. When the cooling part 11 and the heating part 12 are an integral structure, the integral structure has a cooling flow channel. When the heating part 12 and the cooling part 11 are a split structure, both of them can be provided with a cooling flow channel. When the heating part 12 is not provided with a cooling flow channel, the combination of scheme one and scheme two is realized, so as to realize the baking of the base material 20 by passive and active methods.

[0104] When the heating plate 17 is a flexible and bendable resistance heating plate 171, any voltage value in the range of 12V to 36V can be applied to the resistance heating plate 171. Thus, the heat received by the edge section 22 of the base material 20 is adjusted according to the different voltages applied to the resistance heating plate 171. The heating plate 17 can also be a silica gel heating plate, which includes a high-temperature-resistant silica gel body and a resistance heating wire embedded in the high-temperature-resistant silica gel body. Specifically, the control mode of the voltage applied to the resistance heating plate 171 can be determined according to the film coating speed and the size of the film coating power. The faster the film coating speed, the less heat the middle section 21 of the base material 20 receives, so the voltage applied to the resistance heating plate can be reduced. The smaller the film coating power, the less heat the middle section 21 of the base material 20 receives, so the voltage applied to the resistance heating plate can be reduced, so as to reduce the temperature of the edge section 22 of the base material 20, so that the temperature difference between the middle section 21 and the edge section 22 is always within a controllable temperature range that can avoid the deformation of the base material 20, such as less than 10℃.

[0105] The cavity region of the heating part 12 is provided with a clamping groove 18 capable of accommodating the fixed resistance heating plate 171, and the side of the clamping groove 18 facing the heating part 12 is provided with a first heat insulation piece 15, which can be a polytetrafluoroethylene plate capable of blocking the heat generated by the resistance heating plate 171 from being transmitted to the heating part 12.

[0106] In addition, the heating part 12 of the second scheme is provided with the resistance heating plate 171 and has a first end 122 and a second end 123 in the second direction, and when the film-coated baffle 10 is located within a diameter range of 75 cm to 100 cm, the absolute value of the difference between the width of the first end 122 and the width of the second end 123 is not less than 0 cm and not greater than 1.5 cm, so that the side of the heating part 12 close to the middle section 21 and the horizontal interface of the main roller 01 maintain a certain inclination angle. Specifically, when the heating part 12 is an arc-shaped plate body matched with the outer surface of the main roller 01, the first end 122 and the second end 123 are respectively opposite ends of the arc-shaped plate body in the second direction, and when the base material 20 is coated in a direction in which the width of the heating part 12 gradually decreases, the temperature of the transition section 23 will be higher than that of the edge section 22 but lower than that of the middle section 21, so that the temperature of the middle section 21 to the edge section 22 of the base material 20 changes uniformly or slowly, further avoiding deformation of the base material 20 and improving the winding quality and cutting rate of the base material 20. Therefore, by limiting the difference between the first end 122 and the second end 123 of the heating part 12, the application embodiment controls the width change of the heating part 12, so as to control the uniform change or slow change of the temperature of the middle section 21 to the edge section 22 of the base material 20 and improve the winding quality and cutting rate of the base material 20.

[0107] Since the cooling part 11 is provided with a plurality of first contact sections 111 at the side close to the heating part 12, and the heating part 12 is provided with a plurality of second contact sections 121 at the side close to the cooling part 11, the second scheme of the application can also adjust the contact area between the first contact section 111 and the second contact section 121 to change the heat blocking effect between the heating part 12 and the cooling part 11, so as to adjust the amount of heat taken away by the cooling part 11 from the heating part 12.

[0108] The horizontal movement or circumferential rotation of the cooling part 11 and the heating part 12 on the slide rail 03 in the application embodiment can be manually operated. After the contact area between the cooling part 11 and the heating part 12 is adjusted in a horizontal adjustment or circumferential adjustment manner, the film-coated winding device 00 is started to coat the base material 20. During the coating process, the power of the resistance heating plate 171 or the running speed of the base material 20 can be adjusted, so that the junction between the middle section 21 and the edge section 22 of the base material 20 will not be deformed.

[0109] For purposes of the description hereinafter, the terms "upper", "lower", "right", "left", "rear", "front", "vertical", "horizontal", and derivatives thereof shall relate to the application as oriented in the drawing figures. However, it is to be understood that the application can assume various alternative orientations and, accordingly, such terms are not to be taken as limitations of the present application.

[0110] In addition, it should be noted that the use of "first", "second", etc. words to describe various components is only intended to distinguish a certain one to another, and such words do not have special meaning, and therefore cannot be understood as a limitation to the scope of protection of the present application.

[0111] The preferred embodiments of the application are thus described. Changes and modifications can be suggested to one skilled in the art, and it is the intention to encompass such changes and modifications within the scope of the appended claims.

Claims

1. A coated baffle, characterized in that, The application relates to a cooling and heating device for a film coating device. The application relates to a cooling and heating device for a film coating device. The cooling part (11) and the heating part (12) are reciprocally moved along the axis direction of the main roller (01) to adjust the contact area between the cooling part (11) and the heating part (12).

2. The coated baffle of claim 1, wherein, The cooling part (11) and the heating part (12) are reciprocally moved along the axis direction of the main roller (01) to adjust the contact area between the cooling part (11) and the heating part (12).

3. The coated baffle of claim 1, wherein, The cooling part (11) and the heating part (12) are reciprocally moved along the axis direction of the main roller (01) to adjust the contact area between the cooling part (11) and the heating part (12).

4. The coated baffle of claim 3, wherein, The application relates to a cooling and heating device for a film coating device. The application relates to a cooling and heating device for a film coating device.

5. The coated baffle of claim 1, wherein, The application relates to a cooling and heating device for a film coating device.

6. The coated baffle of claim 5, wherein, The application relates to a cooling and heating device for a film coating device. The application relates to a cooling and heating device for a film coating device.

7. The coated baffle of claim 6, wherein, The application relates to a cooling and heating device for a film coating device. The application relates to a cooling and heating device for a film coating device.

8. The coated baffle of claim 1, wherein, The application relates to a cooling and heating device for a film coating device.

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The coated baffle of claim 9, wherein, At least one of the cooling part (11) and the third plate body (13) reciprocates along the axis direction of the main roller (01) to adjust the contact area between the cooling part (11) and the third plate body (13); and / or, at least one of the heating part (12) and the third plate body (13) reciprocates along the axis direction of the main roller (01) to adjust the contact area between the heating part (12) and the third plate body (13).

11. The coated baffle of any one of claims 1 to 10, wherein the coating is a metal coating. The width of the heating part (12) gradually decreases along the circumferential direction of the main roller (01), and the width of the heating part (12) is the width of the heating part (12) along the axis direction of the main roller (01).

12. The coated baffle of claim 11, wherein, The heating part (12) has a first end (122) and a second end (123) along the circumferential direction of the main roller (01), and the absolute value of the difference between the width of the first end (122) and the width of the second end (123) is not less than 0 cm and not greater than 1.5 cm.

13. A winding plating apparatus, characterized by comprising: The film coating device (00) is provided with the film coating baffle according to any one of claims 1 to 12.

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