Power supply unit of the aerosol generating device

Abstract

The present invention provides an aerosol generating device capable of achieving miniaturization and cost reduction. The suction device (100) includes: a power supply BAT; a socket RCP capable of being electrically connected to an external power supply; a charging IC2 configured to include an input terminal VBUS connected to the socket RCP, a charging terminal bat connected to the power supply BAT, and an output terminal SYS connected to the MCU1, which converts the power input to the input terminal VBUS and outputs it from the charging terminal bat; and a discharge path that connects the power supply BAT and the heater HTR without passing through the charging IC2. The charging IC2 is configured to be able to supply the power input from the power supply BAT to the charging terminal bat to the MCU1 via the output terminal SYS.

Description

Technical Field

[0001] The present invention relates to a power supply unit for an aerosol generating device. Background Art

[0002] Patent Document 1 describes an evaporator device having a converter that can receive a voltage from a USB power supply or a battery and supply the received voltage to a heating element. The converter is configured to be able to charge the battery with the voltage from the USB power supply.

[0003] Patent Document 2 describes a smoking system including: a primary device including a primary power supply and a charging device for charging the primary power supply; and a secondary device including a secondary power supply charged by the primary power supply and a load heated by power supplied from the secondary power supply. In this smoking system, power can be directly supplied from the primary power supply to the load.

[0004] Patent Document 3 describes an electronic cigarette capable of supplying power from a charger to a heating element of a cigarette cartridge.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: U.S. Patent Publication No. 2020 / 0120991

[0008] Patent Document 2: International Publication No. 2018 / 167817

[0009] Patent Document 3: Japanese Patent Application Laid-Open No. 2015-500647 Summary of the Invention

[0010] Problems to be Solved by the Invention

[0011] When a charging IC is provided in an aerosol generating device equipped with a power supply, considering using the Power Path function of the charging IC, power from an external power supply or an internal power supply is supplied to loads such as a heater and a controller. However, if the load connected to the output terminal of the charging IC increases, the current output from the output terminal increases, and a large-scale and high-cost charging IC needs to be used.

[0012] An object of the present invention is to provide an aerosol generating device capable of achieving miniaturization and cost reduction.

[0013] Means for Solving the Problems

[0014] One aspect of the present invention relates to a power supply unit of an aerosol generating device that heats an aerosol source to generate an aerosol, and includes: a power supply; a connector capable of being electrically connected to an external power supply; a first load; a charging IC configured to include: an input terminal connected to the connector; a charging terminal connected to the power supply; and an output terminal connected to the first load, the charging IC converting the power input to the input terminal and outputting it from the charging terminal; and a discharge path connecting the power supply and a second load without passing through the charging IC, the charging IC being configured to supply the power input from the power supply to the charging terminal to the first load via the output terminal.

[0015] Advantages of the Invention

[0016] According to the present invention, an aerosol generating device capable of miniaturization and cost reduction can be provided. Description of the Drawings

[0017] Figure 1 It is a perspective view of a non-combustible inhaler.

[0018] Figure 2 It is a perspective view of a non-combustible inhaler showing the state where a rod is installed.

[0019] Figure 3 It is another perspective view of a non-combustible inhaler.

[0020] Figure 4 It is an exploded perspective view of a non-combustible inhaler.

[0021] Figure 5 It is a perspective view of an internal unit of a non-combustible inhaler.

[0022] Figure 6 It is Figure 5 an exploded perspective view of the internal unit.

[0023] Figure 7 It is a perspective view of the internal unit with the power supply and the bottom plate removed.

[0024] Figure 8 It is another perspective view of the internal unit with the power supply and the bottom plate removed.

[0025] Figure 9 It is a schematic diagram for explaining the operation mode of the inhaler.

[0026] Figure 10 It is a diagram showing a schematic structure of a circuit of the internal unit.

[0027] Figure 11 It is a diagram showing a schematic structure of a circuit of the internal unit.

[0028] Figure 12 This is a diagram showing the schematic structure of the circuit of the internal unit.

[0029] Figure 13 This is a diagram for explaining the operation of the circuit in the sleep mode.

[0030] Figure 14 This is a diagram for explaining the operation of the circuit in the active mode.

[0031] Figure 15 This is a diagram for explaining the operation of the circuit in the heating initial setting mode.

[0032] Figure 16 This is a diagram for explaining the operation of the circuit when the heater is heating in the heating mode.

[0033] Figure 17 This is a diagram for explaining the operation of the circuit when the temperature of the heater is detected in the heating mode.

[0034] Figure 18 This is a diagram for explaining the operation of the circuit in the charging mode.

[0035] Figure 19 This is a diagram for explaining the operation of the circuit when the MCU is reset (restarted).

[0036] Figure 20 This is a schematic diagram of the schematic structure inside the charging IC. Detailed implementation mode

[0037] Hereinafter, a suction system as an embodiment of the aerosol generating device in the present invention will be described with reference to the accompanying drawings. This suction system includes: a non-combustible suction device 100 (hereinafter, simply referred to as "suction device 100") as an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100. In the following description, a structure in which the suction device 100 non-detachably accommodates the heating unit will be described as an example. However, the heating unit may be configured to be detachable from the suction device 100. For example, a member in which the rod 500 and the heating unit are integrated may be configured to be detachable from the suction device 100. That is, the power supply unit of the aerosol generating device may also be a structure that does not include the heating unit as a constituent element. In addition, non-detachable means a form that cannot be disassembled within the scope of the intended use. Alternatively, a base built into the rod 500 and an induction heating coil provided on the suction device 100 may cooperate to form the heating unit.

[0038] Figure 1 This is a perspective view showing the overall structure of the suction device 100. Figure 2 This is a perspective view showing the suction device 100 with the rod 500 installed. Figure 3It is another perspective view of the suction device 100. Figure 4 It is an exploded perspective view of the suction device 100. In addition, in the following description, for convenience, an orthogonal coordinate system of a three-dimensional space in which three mutually orthogonal directions are set as the front-back direction, left-right direction, and up-down direction will be used for the description. In the figure, the front is represented as Fr, the rear as Rr, the right as R, the left as L, the upper as U, and the lower as D.

[0039] The suction device 100 is configured to generate a fragrance-containing aerosol by heating a long and slender substantially cylindrical rod 500 (refer to Figure 2 ) which is an example of a fragrance component generation substrate, and the fragrance component generation substrate has a filler including an aerosol source and a fragrance source.

[0040] <Fragrance Component Generation Substrate (Rod)>

[0041] The rod 500 includes a filler which contains an aerosol source that is heated at a specified temperature to generate an aerosol.

[0042] The type of the aerosol source is not particularly limited, and an extraction substance from various natural products and / or their constituent components can be selected according to the use. The aerosol source can be either a solid or a liquid such as a polyol like glycerin or propylene glycol, or water. The aerosol source can also contain a fragrance source such as a cigarette raw material or an extract derived from a cigarette raw material that releases a fragrance component upon heating. The gas with an added fragrance component is not limited to an aerosol, and for example, an invisible vapor can also be generated.

[0043] The filler of the rod 500 can contain cut tobacco as a fragrance source. The material of the cut tobacco is not particularly limited, and known materials such as leaves and midribs can be used. The filler can also contain one or more kinds of fragrances. The type of the fragrance is not particularly limited, and from the viewpoint of imparting a good taste, menthol is preferably used. The fragrance source can contain plants other than tobacco (for example, mint, Chinese medicine, or herbs, etc.). Depending on the use, the rod 500 may not contain a fragrance source.

[0044] <Overall Structure of the Non-Burning Suction Device>

[0045] Next, with reference to Figures 1 - 4 the overall structure of the suction device 100 will be described.

[0046] The suction device 100 includes a housing 110 having a substantially rectangular parallelepiped shape, and the housing 110 has a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface. The housing 110 includes: a bottomed cylindrical housing main body 112, on which the front surface, the rear surface, the upper surface, the lower surface, and the right surface are integrally formed; an outer panel 115 and an inner panel 118, which close the opening 114 of the housing main body 112 (refer toFigure 4 ) and form the left surface; and the slider 119.

[0047] The inner panel 118 is fixed to the housing body 112 by bolts 120. The outer panel 115 is fixed to the housing body 112 by magnets 124 so as to cover the outer surface of the inner panel 118. The magnets 124 are held in a bottom plate 150 (refer to Figure 5 ) which is accommodated in the housing body 112. The outer panel 115 is fixed by the magnets 124, whereby the user can replace the outer panel 115 according to preference.

[0048] Two through-holes 126 are formed in the inner panel 118 for the magnets 124 to pass through. On the inner panel 118, a longitudinally long slot 127 and a circular hole 128 are also provided between the two vertically arranged through-holes 126. The slot 127 is for the light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built in the housing body 112 to pass through. A push-button type operation switch OPS built in the housing body 112 passes through the circular hole 128. Thus, the user can detect the light emitted from the eight LEDs L1 to L8 via the LED window 116 of the outer panel 115. In addition, the user can press the operation switch OPS via the pressing portion 117 of the outer panel 115.

[0049] As Figure 2 shown, an opening 132 into which the rod 500 can be inserted is provided on the upper surface of the housing body 112. The slider 119 is coupled to the housing body 112 in such a manner that it can move in the front-rear direction between a position where the opening 132 is closed (refer to Figure 1 ) and a position where the opening 132 is open (refer to Figure 2 ).

[0050] The operation switch OPS is used to perform various operations of the suction device 100. For example, as Figure 2 shown, when the user inserts and installs the rod 500 into the opening 132, the operation switch OPS is operated via the pressing portion 117. Thus, the rod 500 is heated non-combustibly by a heating portion 170 (refer to Figure 5 ). If the rod 500 is heated, an aerosol is generated from the aerosol source contained in the rod 500, and the fragrance of the fragrance source contained in the rod 500 is added to the aerosol. The user can inhale the aerosol containing the fragrance by holding the suction port 502 of the rod 500 protruding from the opening 132.

[0051] As Figure 3As shown, a charging terminal 134 is provided on the lower surface of the housing main body 112. The charging terminal 134 is used for electrical connection with an external power source such as a socket or a mobile battery to receive power supply. In the present embodiment, the charging terminal 134 is a socket in the shape of a USB (Universal Serial Bus) Type-C, but it is not limited thereto. Hereinafter, the charging terminal 134 is also referred to as the socket RCP.

[0052] In addition, the charging terminal 134 may also be configured to include a power receiving coil, for example, and be capable of receiving power transmitted from an external power source in a non-contact manner. In this case, the power transmission (Wireless Power Transfer) method can be either an electromagnetic induction type, a magnetic resonance type, or a method combining the electromagnetic induction type and the magnetic resonance type. As another example, the charging terminal 134 can be connected to various USB terminals, etc., and have the above-mentioned power receiving coil.

[0053] Figures 1 - 4 The structure of the suction device 100 shown is merely an example. The suction device 100 can be configured in various ways as follows: By holding the rod 500 and applying an action such as heating, a gas containing a fragrance component is generated from the rod 500, and the user can inhale the generated gas.

[0054] <Internal Structure of Non-Burning Suction Device>

[0055] Refer to Figures 5 - 8 The internal unit 140 of the suction device 100 will be described.

[0056] Figure 5 is a perspective view of the internal unit 140 of the suction device 100. Figure 6 is Figure 5 an exploded perspective view of the internal unit 140. Figure 7 is a perspective view of the internal unit 140 with the power supply BAT and the bottom plate 150 removed. Figure 8 is another perspective view of the internal unit 140 with the power supply BAT and the bottom plate 150 removed.

[0057] The internal unit 140 accommodated in the internal space of the housing 110 includes a bottom plate 150, a power supply BAT, a circuit unit 160, a heating unit 170, a notification unit 180, and various sensors.

[0058] The base plate 150 includes: a plate-shaped base plate main body 151, which is disposed substantially at the center of the internal space of the housing 110 in the front-rear direction and extends in the up-down direction and the front-rear direction; a plate-shaped front-rear partition wall 152, which is disposed substantially at the center of the internal space of the housing 110 in the front-rear direction and extends in the up-down direction and the left-right direction; a plate-shaped up-down partition wall 153, which extends forward from substantially the center of the front-rear partition wall 152 in the up-down direction; a plate-shaped base plate upper wall 154, which extends rearward from the upper edge portions of the front-rear partition wall 152 and the base plate main body 151; and a plate-shaped base plate lower wall 155, which extends rearward from the lower edge portions of the front-rear partition wall 152 and the base plate main body 151. The left surface of the base plate main body 151 is covered by the internal panel 118 and the external panel 115 of the housing 110 described above.

[0059] The internal space of the housing 110 is partitioned by the base plate 150 to form a heating unit accommodation area 142 in the upper front, a substrate accommodation area 144 in the lower front, and a power supply accommodation space 146 extending throughout the up-down direction in the rear.

[0060] The heating unit 170 accommodated in the heating unit accommodation area 142 is composed of a plurality of cylindrical members. By arranging them in a concentric shape, a cylindrical body is formed as a whole. The heating unit 170 has a rod accommodation portion 172 capable of accommodating a part of the rod 500 therein and a heater HTR (refer to Figures 10 - 19 ) that heats the rod 500 from the outer periphery or the center. Preferably, the rod accommodation portion 172 is made of a heat-insulating material, or by providing a heat-insulating material inside the rod accommodation portion 172, the surface of the rod accommodation portion 172 and the heater HTR are heat-insulated. The heater HTR may be any element capable of heating the rod 500. The heater HTR is, for example, a heating element. Examples of the heating element include a heating resistor body, a ceramic heater, and an induction heating type heater. As the heater HTR, for example, a heater HTR having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases is preferably used. Instead of this, a heater HTR having an NTC (Negative Temperature Coefficient) characteristic in which the resistance value decreases as the temperature increases may also be used. The heating unit 170 has the function of defining the flow path of the air supplied to the rod 500 and the function of heating the rod 500. A ventilation port (not shown) for allowing air to flow in is formed in the housing 110, and it is configured such that air can flow into the heating unit 170.

[0061] The power source BAT accommodated in the power source accommodation space 146 is a rechargeable secondary battery, an electric double layer capacitor, etc., preferably a lithium ion secondary battery. The electrolyte of the power source BAT may also be constituted by one kind of a gelled electrolyte, an electrolytic solution, a solid electrolyte, an ionic liquid, or a combination thereof.

[0062] The notification unit 180 notifies various information such as the SOC (State Of Charge) indicating the charging state of the power source BAT, the preheating time during suction, and the period during which suction can be performed. The notification unit 180 of the present embodiment includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 may be constituted by a light emitting element such as the LEDs L1 to L8, may be constituted by a vibration element such as the vibration motor M, or may be constituted by a sound output element. The notification unit 180 may also be a combination of two or more elements among a light emitting element, a vibration element, and a sound output element.

[0063] The various sensors include: an inhalation sensor that detects the user's suction action (inhalation action), a power source temperature sensor that detects the temperature of the power source BAT, a heater temperature sensor that detects the temperature of the heater HTR, a housing temperature sensor that detects the temperature of the housing 110, a lid position sensor that detects the position of the slider 119, and a panel detection sensor that detects the attachment and detachment of the external panel 115, etc.

[0064] The inhalation sensor is constituted mainly by a thermistor T2 disposed near the opening 132, for example. The power source temperature sensor is constituted mainly by a thermistor T1 disposed near the power source BAT, for example. The heater temperature sensor is constituted mainly by a thermistor T3 disposed near the heater HTR, for example. As described above, the rod accommodation portion 172 is preferably thermally insulated from the heater HTR. In this case, the thermistor T3 is preferably in contact with or close to the heater HTR inside the rod accommodation portion 172. In the case where the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may also be used as the heater temperature sensor. The housing temperature sensor is constituted mainly by a thermistor T4 disposed near the left surface of the housing 110, for example. The lid position sensor is constituted mainly by a Hall IC14 including a Hall element disposed near the slider 119. The panel detection sensor is constituted mainly by a Hall IC13 including a Hall element disposed near the inner side surface of the inner panel 118.

[0065] The circuit unit 160 includes four circuit boards, a plurality of ICs (Integrated Circuits), and a plurality of components. The four circuit boards include: an MCU mounting board 161 on which an MCU (MicroController Unit) 1 and a charging IC 2 to be described later are mainly arranged; a socket mounting board 162 on which charging terminals 134 are mainly arranged; an LED mounting board 163 on which an operation switch OPS, LEDs L1 to L8, and a communication IC 15 to be described later are arranged; and a Hall IC mounting board 164 on which a Hall IC 14 to be described later including Hall elements constituting a lid position sensor is arranged.

[0066] The MCU mounting board 161 and the socket mounting board 162 are arranged in parallel with each other in the board accommodation area 144. Specifically described, the element arrangement surfaces of the MCU mounting board 161 and the socket mounting board 162 are arranged in the left - right direction and the up - down direction, and the MCU mounting board 161 is arranged at a position forward of the socket mounting board 162. Openings are provided in the MCU mounting board 161 and the socket mounting board 162 respectively. The MCU mounting board 161 and the socket mounting board 162 are fastened to the board fixing portion 156 of the front - rear partition wall 152 by bolts 136 in a state where a cylindrical spacer 173 is interposed between the peripheral portions of these openings. That is, the spacer 173 fixes the positions of the MCU mounting board 161 and the socket mounting board 162 inside the housing 110 and mechanically connects the MCU mounting board 161 and the socket mounting board 162. Thereby, it is possible to prevent the MCU mounting board 161 from contacting the socket mounting board 162 and generating a short - circuit current between them.

[0067] For convenience, if the front - facing surfaces of the MCU mounting board 161 and the socket mounting board 162 are set as their respective main surfaces 161a and 162a, and the opposite surfaces of the main surfaces 161a and 162a are set as their respective sub - surfaces 161b and 162b, then the sub - surface 161b of the MCU mounting board 161 faces the main surface 162a of the socket mounting board 162 with a predetermined gap therebetween. The main surface 161a of the MCU mounting board 161 faces the front surface of the housing 110, and the sub - surface 162b of the socket mounting board 162 faces the front - rear partition wall 152 of the bottom plate 150. The elements and ICs mounted on the MCU mounting board 161 and the socket mounting board 162 will be described later.

[0068] The LED-mounted substrate 163 is disposed between two magnets 124 arranged vertically on the left side surface of the bottom plate body 151. The component arrangement surface of the LED-mounted substrate 163 is arranged in the vertical direction and the front-back direction. In other words, the component arrangement surfaces of the MCU-mounted substrate 161 and the socket-mounted substrate 162 are orthogonal to the component arrangement surface of the LED-mounted substrate 163. In this way, the component arrangement surfaces of the MCU-mounted substrate 161 and the socket-mounted substrate 162 and the component arrangement surface of the LED-mounted substrate 163 are not limited to being orthogonal, and preferably intersect (non-parallel). In addition, the vibration motor M that constitutes the notification unit 180 together with the LEDs L1 to L8 is fixed to the lower surface of the lower wall 155 of the bottom plate and is electrically connected to the MCU-mounted substrate 161.

[0069] The Hall IC-mounted substrate 164 is disposed on the upper surface of the upper wall 154 of the bottom plate.

[0070] <Operation Modes of the Suction Device>

[0071] Figure 9 It is a schematic diagram for explaining the operation modes of the suction device 100. As Figure 9 shown, the operation modes of the suction device 100 include a charging mode, a sleep mode, an activation mode, a heating initial setting mode, a heating mode, and a heating end mode.

[0072] The sleep mode is a mode mainly for stopping the power supply to the electronic components required for the heating control of the heater HTR to achieve power saving.

[0073] The activation mode is a mode in which most functions other than the heating control of the heater HTR become effective. When the suction device 100 is operating in the sleep mode and the slider 119 is opened, the operation mode is switched to the activation mode. When the suction device 100 is operating in the activation mode and the slider 119 is closed or the non-operation time of the operation switch OPS reaches a specified time, the operation mode is switched to the sleep mode.

[0074] The heating initial setting mode is a mode for performing the initial setting of control parameters and the like for starting the heating control of the heater HTR. When the suction device 100 is operating in the activation mode and the operation of the operation switch OPS is detected, the operation mode is switched to the heating initial setting mode, and when the initial setting is completed, the operation mode is switched to the heating mode.

[0075] The heating mode is a mode for performing the heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection). When the operation mode is switched to the heating mode, the suction device 100 starts the heating control of the heater HTR.

[0076] The heating end mode is a mode for performing end processing (such as storage processing of heating history) of the heating control of the heater HTR. When the aspirator 100 is operating in the heating mode, if the power-on time of the heater HTR or the number of user aspirations reaches the upper limit, or the slider 119 is closed, the operation mode is switched to the heating end mode. If the end processing is completed, the operation mode is switched to the activation mode. When the aspirator 100 is operating in the heating mode, if a USB connection is made, the operation mode is switched to the heating end mode. If the end processing is completed, the operation mode is switched to the charging mode. As Figure 9 shown, in this case, the operation mode can also be switched to the activation mode before switching to the charging mode. In other words, when the aspirator 100 is operating in the heating mode and a USB connection is made, the operation mode can be switched in the order of the heating end mode, activation mode, and charging mode.

[0077] The charging mode is a mode for charging the power supply BAT with power supplied from an external power supply connected to the socket RCP. When the aspirator 100 is operating in the sleep mode or activation mode and an external power supply is connected to the socket RCP (USB connection), the operation mode is switched to the charging mode. When the aspirator 100 is operating in the charging mode and the charging of the power supply BAT is completed or the connection between the socket RCP and the external power supply is disconnected, the operation mode is switched to the sleep mode.

[0078] <Overview of the Circuit of the Internal Unit>

[0079] Figure 10 , Figure 11 and Figure 12 are diagrams showing the schematic structure of the circuit of the internal unit 140. Figure 11 Except for adding the range 161A (the range surrounded by the thick dashed line) mounted on the MCU mounting board 161 and the range 163A (the range surrounded by the thick solid line) mounted on the LED mounting board 163 to the circuit shown in Figure 10 , it is the same as Figure 10 . Figure 12 Except for adding the range 162A mounted on the socket mounting board 162 and the range 164A mounted on the Hall IC mounting board 164 to the circuit shown in Figure 10 , it is the same as Figure 10 .

[0080] In Figure 10 , the wiring represented by the thick solid line is the wiring at the same potential as the reference potential (ground potential) of the internal unit 140 (the wiring for grounding provided in the internal unit 140). Hereinafter, this wiring will be referred to as the ground wire. In Figure 10In this case, a rectangular shape represents an electronic component in which a plurality of circuit elements are chip-sized, and symbols of various terminals are described inside the rectangle. The power supply terminals VCC and VDD mounted on the chip respectively represent the power supply terminals on the high potential side. The power supply terminal VSS and the ground terminal GND mounted on the chip respectively represent the power supply terminals on the low potential side (reference potential side). The difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side of the chip-sized electronic component becomes the power supply voltage. The chip-sized electronic component uses this power supply voltage to perform various functions.

[0081] As Figure 11 shown, on the MCU mounting substrate 161 (range 161A), as main electronic components, the following are provided: an MCU 1 that overall controls the entire aspirator 100, a charging IC 2 that controls the charging of the power supply BAT, load switches (hereinafter referred to as LSWs) 3, 4, 5 formed by combining capacitors, resistors, transistors, etc., a ROM (Read Only Memory) 6, a switch driver 7, a step-up / step-down DC / DC converter 8 (described as step-up / step-down DC / DC 8 in the figure), operational amplifiers OP2 and OP3, flip-flops (hereinafter referred to as FFs) 16 and 17, a connector Cn(t2) electrically connected to the thermistor T2 that constitutes the intake air sensor (the thermistor T2 connected to this connector is described in the figure), a connector Cn(t3) electrically connected to the thermistor T3 that constitutes the heater temperature sensor (the thermistor T3 connected to this connector is described in the figure), a connector Cn(t4) electrically connected to the thermistor T4 that constitutes the housing temperature sensor (the thermistor T4 connected to this connector is described in the figure), and a voltage dividing circuit Pc for USB connection detection.

[0082] The ground terminals GND of the charging IC 2, the LSWs 3, 4, 5, the switch driver 7, the step-up / step-down DC / DC converter 8, the FFs 16 and 17 are each connected to the ground wire. The power supply terminal VSS of the ROM 6 is connected to the ground wire. The negative power supply terminals of the operational amplifiers OP2 and OP3 are each connected to the ground wire.

[0083] As Figure 11As shown, on the LED mounting substrate 163 (range 163A), as the main electronic components, the following are provided: a Hall IC 13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, and a communication IC 15. The communication IC 15 is a communication module for communicating with electronic devices such as smartphones. Each of the power supply terminal VSS of the Hall IC 13 and the ground terminal GND of the communication IC 15 is connected to the ground wire. The communication IC 15 and the MCU 1 are configured to be able to communicate via the communication line LN. One end of the operation switch OPS is connected to the ground wire, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU 1.

[0084] As Figure 12 shown, on the socket mounting substrate 162 (range 162A), as the main electronic components, the following are provided: a power connector electrically connected to the power supply BAT (the power supply BAT connected to this power connector is shown in the figure), a connector electrically connected to a thermistor T1 constituting a power supply temperature sensor (the thermistor T1 connected to this connector is shown in the figure), a boost DC / DC converter 9 (shown as boost DC / DC 9 in the figure), a protection IC 10, an overvoltage protection IC 11, a margin meter IC 12, a socket RCP, switches S3 to S6 constituted by MOSFETs, an operational amplifier OP1, and a pair of (positive electrode side and negative electrode side) heater connectors Cn electrically connected to the heater HTR.

[0085] Two ground terminals GND of the socket RCP, the ground terminal GND of the boost DC / DC converter 9, the power supply terminal VSS of the protection IC 10, the power supply terminal VSS of the margin meter IC 12, the ground terminal GND of the overvoltage protection IC 11, and the negative power supply terminal of the operational amplifier OP1 are respectively connected to the ground wire.

[0086] As Figure 12 shown, a Hall IC 14 including a Hall element constituting a lid position sensor is provided on the Hall IC mounting substrate 164 (range 164A). The power supply terminal VSS of the Hall IC 14 is connected to the ground wire. The output terminal OUT of the Hall IC 14 is connected to the terminal P8 of the MCU 1. The MCU 1 detects the opening and closing of the slider 119 based on the signal input to the terminal P8.

[0087] As Figure 11 shown, a connector electrically connected to the vibration motor M is provided on the MCU mounting substrate 161.

[0088] <Details of the circuit of the internal unit>

[0089] Hereinafter, with reference to Figure 10 the connection relationships and the like of the respective electronic components will be described.

[0090] The two power input terminals V of the socket RCP BUS are respectively connected to the input terminal IN of the overvoltage protection IC11 via fuses Fs. If a USB plug is connected to the socket RCP and a USB cable including the USB plug is connected to an external power supply, then the two power input terminals V of the socket RCP BUS are supplied with the USB voltage V USB .

[0091] One end of a voltage dividing circuit Pa composed of a series circuit of two resistors is connected to the input terminal IN of the overvoltage protection IC11. The other end of the voltage dividing circuit Pa is connected to the ground wire. The connection point of the two resistors constituting the voltage dividing circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11. The overvoltage protection IC11 outputs the voltage input to the input terminal IN from the output terminal OUT in a state where the voltage input to the voltage detection terminal OVLo is less than the threshold value. When the voltage input to the voltage detection terminal OVLo becomes equal to or higher than the threshold value (overvoltage), the overvoltage protection IC11 protects the electronic components downstream of the overvoltage protection IC11 by stopping the voltage output from the output terminal OUT (cutting off the electrical connection between LSW3 and the socket RCP). The output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of LSW3 and one end of a voltage dividing circuit Pc (a series circuit of two resistors) connected to the MCU1. The other end of the voltage dividing circuit Pc is connected to the ground wire. The connection point of the two resistors constituting the voltage dividing circuit Pc is connected to the terminal P17 of the MCU1.

[0092] One end of a voltage dividing circuit Pf composed of a series circuit of two resistors is connected to the input terminal VIN of LSW3. The other end of the voltage dividing circuit Pf is connected to the ground wire. The connection point of the two resistors constituting the voltage dividing circuit Pf is connected to the control terminal ON of LSW3. The collector terminal of a bipolar transistor S2 is connected to the control terminal ON of LSW3. The emitter terminal of the bipolar transistor S2 is connected to the ground wire. The base terminal of the bipolar transistor S2 is connected to the terminal P19 of the MCU1. If the signal input to the control terminal ON becomes high level, LSW3 outputs the voltage input to the input terminal VIN from the output terminal VOUT. The output terminal VOUT of LSW3 is connected to the input terminal VBUS of the charging IC2. The MCU1 turns on the bipolar transistor S2 during the period when no USB connection is made. As a result, the control terminal ON of LSW3 is connected to the ground wire via the bipolar transistor S2, so a low-level signal is input to the control terminal ON of LSW3.

[0093] If a USB connection is made, the bipolar transistor S2 connected to LSW3 is cut off by the MCU1. By cutting off the bipolar transistor S2, the USB voltage V divided by the voltage dividing circuit Pf USBThe control terminal ON of LSW3 is input with a high level signal. Therefore, if a USB connection is made and the bipolar transistor S2 is cut off, a high level signal is input to the control terminal ON of LSW3. As a result, LSW3 outputs the USB voltage V supplied from the USB cable from the output terminal VOUT. USB In addition, even when a USB connection is made while the bipolar transistor S2 is not cut off, the control terminal ON of LSW3 is connected to the ground via the bipolar transistor S2. Therefore, it should be noted that as long as the MCU1 does not cut off the bipolar transistor S2, a low level signal continues to be input to the control terminal ON of LSW3.

[0094] The positive terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC10, the input terminal VIN of the boost DC / DC converter 9, and the charging terminal bat of the charging IC2. Therefore, the power supply voltage V of the power supply BAT BAT is supplied to the protection IC10, the charging IC2, and the boost DC / DC converter 9. A resistor Ra, a switch Sa composed of a MOSFET, a switch Sb composed of a MOSFET, and a resistor Rb are connected in series in sequence to the negative terminal of the power supply BAT. The current detection terminal CS of the protection IC10 is connected to the connection point between the resistor Ra and the switch Sa. The control terminals of the switches Sa and Sb are connected to the protection IC10. Both ends of the resistor Rb are connected to the margin meter IC12.

[0095] The protection IC10 obtains the current value flowing through the resistor Ra during charging and discharging of the power supply BAT based on the voltage input to the current detection terminal CS. When this current value becomes too large (overcurrent), the protection IC10 controls the opening and closing of the switches Sa and Sb to stop the charging or discharging of the power supply BAT, thereby achieving the protection of the power supply BAT. More specifically, when an excessive current value is obtained during charging of the power supply BAT, the protection IC10 stops the charging of the power supply BAT by turning off the switch Sb. When an excessive current value is obtained during discharging of the power supply BAT, the protection IC10 stops the discharging of the power supply BAT by turning off the switch Sa. In addition, the protection IC10 controls the opening and closing of the switches Sa and Sb based on the voltage input to the power supply terminal VDD to stop the charging or discharging of the power supply BAT when the voltage value of the power supply BAT becomes abnormal (in the case of overcharging or overvoltage), thereby achieving the protection of the power supply BAT. More specifically, when overcharging of the power supply BAT is detected, the protection IC10 stops the charging of the power supply BAT by turning off the switch Sb. When over-discharging of the power supply BAT is detected, the protection IC10 stops the discharging of the power supply BAT by turning off the switch Sa.

[0096] A resistor Rt1 is connected to a connector that is connected to a thermistor T1 disposed near a power supply BAT. A series circuit of the resistor Rt1 and the thermistor T1 is connected to a ground line and a regulator terminal TREG of a remaining capacity meter IC12. A connection point of the thermistor T1 and the resistor Rt1 is connected to a thermistor terminal THM of the remaining capacity meter IC12. The thermistor T1 can be either a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.

[0097] The remaining capacity meter IC12 detects the current flowing through a resistor Rb and derives battery information such as the remaining capacity of the power supply BAT, the SOC (State Of Charge) indicating the charging state, and the SOH (State Of Health) indicating the sound state based on the detected current value. The remaining capacity meter IC12 supplies voltage from a built-in regulator connected to the regulator terminal TREG to a voltage dividing circuit of the thermistor T1 and the resistor Rt1. The remaining capacity meter IC12 obtains the voltage divided by the voltage dividing circuit from the thermistor terminal THM and obtains temperature information related to the temperature of the power supply BAT based on this voltage. The remaining capacity meter IC12 is connected to an MCU1 through a communication line LN for serial communication and is configured to be able to communicate with the MCU1. The remaining capacity meter IC12 sends the derived battery information and the obtained temperature information of the power supply BAT to the MCU1 according to a request from the MCU1. In addition, for serial communication, a plurality of signal lines such as a data transmission line and a clock line for synchronization are required. It should be noted that in Figures 10 - 19 For simplicity, only one signal line is shown in the figure.

[0098] The remaining capacity meter IC12 has a notification terminal 12a. The notification terminal 12a is connected to a terminal P6 of the MCU1 and the cathode of a diode D2 described later. If an abnormality such as the temperature of the power supply BAT becoming too high is detected, the remaining capacity meter IC12 notifies the MCU1 of the occurrence of this abnormality by outputting a low-level signal from the notification terminal 12a. This low-level signal is also input to the CLR(￣) terminal of the FF17 via the diode D2.

[0099] One end of a reactor Lc is connected to the switch terminal SW of a boost DC / DC converter 9. The other end of the reactor Lc is connected to the input terminal VIN of the boost DC / DC converter 9. The boost DC / DC converter 9 boosts the input voltage and outputs it from the output terminal VOUT by performing on / off control of an internal transistor connected to the switch terminal SW. In addition, the input terminal VIN of the boost DC / DC converter 9 constitutes the power supply terminal on the high potential side of the boost DC / DC converter 9. The boost DC / DC performs a boosting operation when the signal input to the enable terminal EN is at a high level. In the state of USB connection, the signal input to the enable terminal EN of the boost DC / DC converter 9 can also be controlled to be at a low level by the MCU1. Alternatively, in the state of USB connection, the signal input to the enable terminal EN of the boost DC / DC converter 9 can also not be controlled by the MCU1, making the potential of the enable terminal EN indeterminate.

[0100] The source terminal of a switch S4 composed of a P-channel MOSFET is connected to the output terminal VOUT of the boost DC / DC converter 9. The gate terminal of the switch S4 is connected to the terminal P15 of the MCU1. One end of a resistor Rs is connected to the drain terminal of the switch S4. The other end of the resistor Rs is connected to the positive-side heater connector Cn connected to one end of a heater HTR. A voltage-dividing circuit Pb composed of two resistors is connected to the connection point between the switch S4 and the resistor Rs. The connection point of the two resistors constituting the voltage-dividing circuit Pb is connected to the terminal P18 of the MCU1. The connection point between the switch S4 and the resistor Rs is also connected to the positive power supply terminal of an operational amplifier OP1.

[0101] The source terminal of a switch S3 composed of a P-channel MOSFET is connected to the connection line between the output terminal VOUT of the boost DC / DC converter 9 and the source terminal of the switch S4. The gate terminal of the switch S3 is connected to the terminal P16 of the MCU1. The drain terminal of the switch S3 is connected to the connection line between the resistor Rs and the positive-side heater connector Cn. In this way, a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs are connected in parallel between the output terminal VOUT of the boost DC / DC converter 9 and the positive side of the heater connector Cn. The circuit including the switch S3 does not have a resistor, so it is a circuit with a lower resistance than the circuit including the switch S4 and the resistor Rs.

[0102] The non-inverting input terminal of the operational amplifier OP1 is connected to the connection line of the resistor Rs and the heater connector Cn on the positive side. The inverting input terminal of the operational amplifier OP1 is connected to the heater connector Cn on the negative side connected to the other end of the heater HTR and the drain terminal of the switch S6 composed of an N-channel MOSFET. The source terminal of the switch S6 is connected to the ground wire. The gate terminal of the switch S6 is connected to the terminal P14 of the MCU1, the anode of the diode D4, and the enable terminal EN of the boost DC / DC converter 9. The cathode of the diode D4 is connected to the Q terminal of the FF17. One end of the resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU1 and the drain terminal of the switch S5 composed of an N-channel MOSFET. The source terminal of the switch S5 is connected to the ground wire. The gate terminal of the switch S5 is connected to the connection line of the resistor Rs and the heater connector Cn on the positive side.

[0103] The input terminal VBUS of the charging IC2 is connected to the anodes of the LEDs L1 to L8 respectively. The cathodes of the LEDs L1 to L8 are connected to the control terminals PD1 to PD8 of the MCU1 via resistors for current limiting. That is, the LEDs L1 to L8 are connected in parallel to the input terminal VBUS. The LEDs L1 to L8 are configured to be able to operate by each of the USB voltage V supplied from the USB cable connected to the socket RCP USB and the voltage supplied from the power supply BAT via the charging IC2. Transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND are built in the MCU1. The MCU1 turns on the transistor connected to the control terminal PD1 to energize the LED L1 to turn it on, and turns off the transistor connected to the control terminal PD1 to turn off the LED L1. By rapidly switching the on and off of the transistor connected to the control terminal PD1, the brightness and light emission mode of the LED L1 can be dynamically controlled. The LEDs L2 to L8 are also similarly controlled to be turned on by the MCU1.

[0104] The charging IC2 has a charging function of charging the power supply BAT based on the USB voltage V input to the input terminal VBUS USB The charging IC2 obtains the charging current and charging voltage of the power supply BAT from terminals and wirings not shown, and performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT) based on them. In addition, the charging IC2 can also obtain the temperature information of the power supply BAT sent from the remaining amount meter IC12 to the MCU1 through serial communication using the communication line LN, and use it for charging control.

[0105] The charging IC2 also has V BATPower path function and OTG function. V BAT The power path function is a function that outputs a system power supply voltage Vcc0 that is substantially the same as the power supply voltage V input to the charging terminal bat from the output terminal SYS. BAT The OTG function is a function that outputs a system power supply voltage Vcc4 obtained by boosting the power supply voltage V input to the charging terminal bat from the input terminal VBUS. The on / off of the OTG function of the charging IC2 is controlled by the MCU1 through serial communication using the communication line LN. In addition, in the OTG function, the power supply voltage V input to the charging terminal bat can also be directly output from the input terminal VBUS. BAT In this case, the power supply voltage V is substantially the same as the system power supply voltage Vcc4. BAT . In this case, the power supply voltage V BAT is substantially the same as the system power supply voltage Vcc4.

[0106] The output terminal SYS of the charging IC2 is connected to the input terminal VIN of the buck-boost DC / DC converter 8. One end of the reactor La is connected to the switch terminal SW of the charging IC2. The other end of the reactor La is connected to the output terminal SYS of the charging IC2. The charging enable terminal CE(￣) of the charging IC2 is connected to the terminal P22 of the MCU1 via a resistor. Further, the collector terminal of the bipolar transistor S1 is connected to the charging enable terminal CE(￣) of the charging IC2. The emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4 described later. The base terminal of the bipolar transistor S1 is connected to the Q terminal of the FF17. Further, one end of the resistor Rc is connected to the charging enable terminal CE(￣) of the charging IC2. The other end of the resistor Rc is connected to the output terminal VOUT of the LSW4.

[0107] A resistor is connected to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. By inputting the system power supply voltage Vcc0 from the output terminal SYS of the charging IC2 to the input terminal VIN of the buck-boost DC / DC converter 8, the signal input to the enable terminal EN of the buck-boost DC / DC converter 8 becomes high level, and the buck-boost DC / DC converter 8 starts the boosting operation or the bucking operation. The buck-boost DC / DC converter 8 boosts or buckles the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb, generates the system power supply voltage Vcc1, and outputs it from the output terminal VOUT. The output terminal VOUT of the buck-boost DC / DC converter 8 is connected to the feedback terminal FB of the buck-boost DC / DC converter 8, the input terminal VIN of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of the FF16, and the D terminal. The wiring for supplying the system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is recorded as the power supply line PL1.

[0108] If the signal input to the control terminal ON becomes high level, LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of LSW4 and the power supply line PL1 are connected via a resistor. Therefore, by supplying the system power supply voltage Vcc1 to the power supply line PL1, a high-level signal is input to the control terminal ON of LSW4. If wiring resistance and the like are ignored, the voltage output by LSW4 is the same as the system power supply voltage Vcc1, but in order to distinguish it from the system power supply voltage Vcc1, the voltage output from the output terminal VOUT of LSW4 is hereinafter referred to as the system power supply voltage Vcc2.

[0109] The output terminal VOUT of LSW4 is connected to the power supply terminal VDD of MCU1, the input terminal VIN of LSW5, the power supply terminal VDD of the margin meter IC12, the power supply terminal VCC of ROM6, the emitter terminal of the bipolar transistor S1, the resistor Rc, and the power supply terminal VCC of FF17. The wiring for supplying the system power supply voltage Vcc2 output from the output terminal VOUT of LSW4 is referred to as the power supply line PL2.

[0110] If the signal input to the control terminal ON becomes high level, LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of LSW5 is connected to the terminal P23 of MCU1. If wiring resistance and the like are ignored, the voltage output by LSW5 is the same as the system power supply voltage Vcc2, but in order to distinguish it from the system power supply voltage Vcc2, the voltage output from the output terminal VOUT of LSW5 is hereinafter referred to as the system power supply voltage Vcc3. The wiring for supplying the system power supply voltage Vcc3 output from the output terminal VOUT of LSW5 is referred to as the power supply line PL3.

[0111] A series circuit of a thermistor T2 and a resistor Rt2 is connected to the power supply line PL3, and the resistor Rt2 is connected to the ground wire. The thermistor T2 and the resistor Rt2 form a voltage dividing circuit, and their connection point is connected to the terminal P21 of MCU1. MCU1 detects the temperature change (resistance value change) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of a suction operation based on this temperature change amount.

[0112] A series circuit of a thermistor T3 and a resistor Rt3 is connected to the power supply line PL3, and the resistor Rt3 is connected to the ground wire. The thermistor T3 and the resistor Rt3 form a voltage dividing circuit, and their connection point is connected to the terminal P13 of MCU1 and the inverting input terminal of the operational amplifier OP2. MCU1 detects the temperature of the thermistor T3 (equivalent to the temperature of the heater HTR) based on the voltage input to the terminal P13.

[0113] A series circuit of a thermistor T4 and a resistor Rt4 is connected to the power line PL3, and the resistor Rt4 is connected to the ground wire. The thermistor T4 and the resistor Rt4 form a voltage dividing circuit, and their connection point is connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3. The MCU1 detects the temperature of the thermistor T4 (equivalent to the temperature of the housing 110) based on the voltage input to the terminal P12.

[0114] The source terminal of a switch S7 composed of a MOSFET is connected to the power line PL2. The gate terminal of the switch S7 is connected to the terminal P20 of the MCU1. The drain terminal of the switch S7 is connected to one of a pair of connectors connecting the vibration motor M. The other of the pair of connectors is connected to the ground wire. The MCU1 controls the opening and closing of the switch S7 by operating the potential of the terminal P20, and can make the vibration motor M vibrate in a specific mode. A dedicated driver IC can also be used instead of the switch S7.

[0115] The positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2 are connected to the power line PL2. The connection point of the two resistors constituting the voltage dividing circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2. The operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (a signal corresponding to the resistance value of the thermistor T3). In the present embodiment, a thermistor having NTC characteristics is used as the thermistor T3. Therefore, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2. This is because the negative power supply terminal of the operational amplifier OP2 is connected to the ground wire, and if the voltage value input to the inverting input terminal of the operational amplifier OP2 (the voltage dividing value based on the thermistor T3 and the resistor Rt3) is higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP2 (the voltage dividing value based on the voltage dividing circuit Pd), the output voltage value of the operational amplifier OP2 is approximately equal to the value of the ground potential. That is, if the temperature of the heater HTR (the temperature of the thermistor T3) becomes high, the output voltage of the operational amplifier OP2 becomes low level.

[0116] In addition, in the case of using a thermistor having PTC characteristics as the thermistor T3, it is only necessary to connect the output of the voltage dividing circuit of the thermistor T3 and the resistor Rt3 to the non-inverting input terminal of the operational amplifier OP2, and connect the output of the voltage dividing circuit Pd to the inverting input terminal of the operational amplifier OP2.

[0117] The positive power supply terminal of the operational amplifier OP3 and the voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2. The connection point of the two resistors constituting the voltage dividing circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3. The operational amplifier OP3 outputs a signal corresponding to the temperature of the housing 110 (a signal corresponding to the resistance value of the thermistor T4). In the present embodiment, a thermistor having NTC characteristics is used as the thermistor T4. Therefore, the higher the temperature of the housing 110, the lower the output voltage of the operational amplifier OP3. This is because the negative power supply terminal of the operational amplifier OP3 is connected to the ground wire, and if the voltage value input to the inverting input terminal of the operational amplifier OP3 (the voltage dividing value based on the thermistor T4 and the resistor Rt4) is higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP3 (the voltage dividing value based on the voltage dividing circuit Pe), the output voltage value of the operational amplifier OP3 is approximately equal to the ground potential value. That is, if the temperature of the thermistor T4 becomes high, the output voltage of the operational amplifier OP3 becomes low level.

[0118] In addition, in the case of using a thermistor having PTC characteristics as the thermistor T4, it is only necessary to connect the output of the voltage dividing circuit of the thermistor T4 and the resistor Rt4 to the non-inverting input terminal of the operational amplifier OP3, and connect the output of the voltage dividing circuit Pe to the inverting input terminal of the operational amplifier OP3.

[0119] A resistor R1 is connected to the output terminal of the operational amplifier OP2. The cathode of a diode D1 is connected to the resistor R1. The anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR(￣) terminal of the FF17. A resistor R2 connected to the power supply line PL1 is connected to the connection line of the resistor R1 and the diode D1. In addition, the CLR(￣) terminal of the FF16 is connected to this connection line.

[0120] One end of a resistor R3 is connected to the connection line of the anode of the diode D1 and the output terminal of the operational amplifier OP3 and the D terminal of the FF17. The other end of the resistor R3 is connected to the power supply line PL2. Further, the anode of a diode D2, the anode of a diode D3, and the CLR(￣) terminal of the FF17, which are connected to the notification terminal 12a of the remaining amount meter IC12, are connected to this connection line. The cathode of the diode D3 is connected to the terminal P5 of the MCU1.

[0121] If the temperature of the heater HTR becomes too high, the signal output from the operational amplifier OP2 of FF16 becomes smaller. If the signal input to the CLR(￣) terminal becomes low level, a high-level signal is input from the Q(￣) terminal to the terminal P11 of the MCU1. The power supply line PL1 supplies the high-level system power supply voltage Vcc1 to the D terminal of FF16. Therefore, in FF16, as long as the signal input to the CLR(￣) terminal that operates in negative logic does not become low level, a low-level signal is continuously output from the Q(￣) terminal.

[0122] In any of the cases where the temperature of the heater HTR becomes too high, the temperature of the housing 110 becomes too high, or a low-level signal indicating abnormal detection is output from the notification terminal 12a of the margin meter IC12, the signal input to the CLR(￣) terminal of FF17 becomes low level. If the signal input to the CLR(￣) terminal becomes low level, FF17 outputs a low-level signal from the Q terminal. This low-level signal is respectively input to the terminal P10 of the MCU1, the gate terminal of the switch S6, the enable terminal EN of the boost DC / DC converter 9, and the base terminal of the bipolar transistor S1 connected to the charging IC2. If the low-level signal is input to the gate terminal of the switch S6, the gate-source voltage of the N-channel MOSFET constituting the switch S6 is lower than the threshold voltage, so the switch S6 is turned off. If the low-level signal is input to the enable terminal EN of the boost DC / DC converter 9, since the enable terminal EN of the boost DC / DC converter 9 is in positive logic, the boost operation stops. If the low-level signal is input to the base terminal of the bipolar transistor S1, the bipolar transistor S1 conducts (an amplified current is output from the collector terminal). If the bipolar transistor S1 conducts, the high-level system power supply voltage Vcc2 is input to the CE(￣) terminal of the charging IC2 via the bipolar transistor S1. The CE(￣) terminal of the charging IC2 is in negative logic, so the charging of the power supply BAT is stopped. Thus, the heating of the heater HTR and the charging of the power supply BAT are stopped. Additionally, even if the MCU1 outputs a low-level enable signal to the charging enable terminal CE(￣) of the charging IC2 from the terminal P22, if the bipolar transistor S1 conducts, the amplified current is also input from the collector terminal to the terminal P22 of the MCU1 and the charging enable terminal CE(￣) of the charging IC2. Therefore, it should be noted that a high-level signal is input to the charging enable terminal CE(￣) of the charging IC2.

[0123] The system power supply voltage Vcc2 at a high level is supplied from the power supply line PL2 to the D terminal of FF17. Therefore, in FF17, as long as the signal input to the CLR(￣) terminal operating in negative logic does not become low level, a signal at a high level is continuously output from the Q terminal. If a signal at a low level is output from the output terminal of the operational amplifier OP3, regardless of the level of the signal output from the output terminal of the operational amplifier OP2, the signal at a low level is input to the CLR(￣) terminal of FF17. It should be noted that when a signal at a high level is output from the output terminal of the operational amplifier OP2, the signal at a low level output from the output terminal of the operational amplifier OP3 is not affected by the signal at a high level due to the diode D1. In addition, when a signal at a low level is output from the output terminal of the operational amplifier OP2, even if a signal at a high level is output from the output terminal of the operational amplifier OP3, the signal at a high level is replaced with a signal at a low level via the diode D1.

[0124] The power supply line PL2 further branches from the MCU mounting substrate 161 to the LED mounting substrate 163 and the Hall IC mounting substrate 164 side. The power supply terminal VDD of the Hall IC13, the power supply terminal VCC of the communication IC15, and the power supply terminal VDD of the Hall IC14 are connected to the branched power supply line PL2.

[0125] The output terminal OUT of the Hall IC13 is connected to the terminal P3 of the MCU1 and the terminal SW2 of the switch driver 7. If the external panel 115 is removed, a signal at a low level is output from the output terminal OUT of the Hall IC13. The MCU1 determines whether the external panel 115 is installed based on the signal input to the terminal P3.

[0126] A series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS is provided on the LED mounting substrate 163. This series circuit is connected to the power supply line PL2. The connection point of the resistor and the capacitor of this series circuit is connected to the terminal P4 of the MCU1, the operation switch OPS, and the terminal SW1 of the switch driver 7. In a state where the operation switch OPS is not pressed, the operation switch OPS is not conducting, and the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 become high level through the system power supply voltage Vcc2. If the operation switch OPS is pressed and the operation switch OPS becomes conducting, the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 are connected to the ground wire and become low level. The MCU1 detects the operation of the operation switch OPS based on the signal input to the terminal P4.

[0127] A reset input terminal RSTB is provided in the switch driver 7. The reset input terminal RSTB is connected to the control terminal ON of the LSW4. When the electrical levels of the signals input to the terminal SW1 and the terminal SW2 both become low (the state where the external panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 stops the output operation of the LSW4 by outputting a low-level signal from the reset input terminal RSTB. That is, if the operation switch OPS that was originally pressed via the pressing portion 117 of the external panel 115 is directly pressed by the user in the state where the external panel 115 is removed, the electrical levels of the signals input to the terminal SW1 and the terminal SW2 of the switch driver 7 both become low.

[0128] <Operation of Each Operation Mode of the Suction Device>

[0129] Hereinafter, with reference to Figures 13 - 19 to Figure 10 the operation of the circuit shown will be described. Figure 13 is a diagram for explaining the operation of the circuit in the sleep mode. Figure 14 is a diagram for explaining the operation of the circuit in the active mode. Figure 15 is a diagram for explaining the operation of the circuit in the heating initial setting mode. Figure 16 is a diagram for explaining the operation of the circuit when the heater HTR is heating in the heating mode. Figure 17 is a diagram for explaining the operation of the circuit when the temperature of the heater HTR is detected in the heating mode. Figure 18 is a diagram for explaining the operation of the circuit in the charging mode. Figure 19 is a diagram for explaining the operation of the circuit when the MCU1 is reset (restarted). In Figures 13 - 19 each of them, the terminals of the chip-mounted electronic components surrounded by the dotted ellipse represent the terminals for inputting or outputting the power supply voltage V BAT , the USB voltage V USB and the system power supply voltage, etc.

[0130] In any operation mode, the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC10, the input terminal VIN of the boost DC / DC converter 9, and the charging terminal bat of the charging IC2.

[0131] <Sleep Mode: Figure 13 >

[0132] The MCU1 enables the V BAT power path function of the charging IC2 and disables the OTG function and the charging function. By not inputting the USB voltage V USB to the input terminal VBUS of the charging IC2, the V BATThe power path function is effective. The signal for enabling the OTG function from the communication line LN is not output from the MCU1 to the charging IC2, so the OTG function is invalid. Therefore, the charging IC2 generates the system power supply voltage Vcc0 based on the power supply voltage V input to the charging terminal bat and outputs it from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. The buck-boost DC / DC converter 8 is enabled by inputting the high-level system power supply voltage Vcc0 to the enable terminal EN as positive logic, generates the system power supply voltage Vcc1 based on the system power supply voltage Vcc0, and outputs it from the output terminal VOUT. The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is respectively supplied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of the FF16, and the D terminal. BAT The LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT by inputting the system power supply voltage Vcc1 to the control terminal ON. The system power supply voltage Vcc2 output from the LSW4 is input to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the Hall IC13, the power supply terminal VCC of the communication IC15, and the power supply terminal VDD of the Hall IC14. Further, the system power supply voltage Vcc2 is respectively supplied to the power supply terminal VDD of the margin meter IC12, the power supply terminal VCC of the ROM6, the resistor Rc connected to the charging enable terminal CE(￣) of the charging IC2, the bipolar transistor S1, the power supply terminal VCC of the FF17, the positive power supply terminal of the operational amplifier OP3, the voltage dividing circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage dividing circuit Pd. As long as a low-level signal is not output from the Q terminal of the FF17, the bipolar transistor S1 connected to the charging IC2 is turned off. Therefore, the system power supply voltage Vcc2 generated by the LSW4 is also input to the charging enable terminal CE(￣) of the charging IC2. The charging enable terminal CE(￣) of the charging IC2 is negative logic, so in this state, the charging function of the charging IC2 is turned off.

[0133] In this way, in the sleep mode, the LSW5 stops the output of the system power supply voltage Vcc3, so the power supply to the electronic components connected to the power line PL3 is stopped. In addition, in the sleep mode, the OTG function of the charging IC2 stops, so the power supply to the LEDs L1 to L8 is stopped.

[0134]

[0135] <Active mode: Figure 14 >​

[0136] If, from Figure 13 the state of the sleep mode, the signal input to terminal P8 becomes high level and it is detected that the slider 119 is opened, then the MCU1 inputs a high-level signal from terminal P23 to the control terminal ON of LSW5. As a result, LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN as the system power supply voltage Vcc3 from the output terminal VOUT. The system power supply voltage Vcc3 output from the output terminal VOUT of LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.

[0137] Furthermore, if it is detected that the slider 119 is opened, then the MCU1 validates the OTG function of the charging IC2 via the communication line LN. As a result, the charging IC2 outputs from the input terminal VBUS the system power supply voltage Vcc4 obtained by boosting the power supply voltage V BAT boosted from the charging terminal bat. The system power supply voltage Vcc4 output from the input terminal VBUS is supplied to the LEDs L1 to L8.

[0138] <Heating initial setting mode: Figure 15 >

[0139] If, from Figure 14 the state, the signal input to terminal P4 becomes low level (the operation switch OPS is pressed), then after the MCU1 makes various settings required for heating, it inputs a high-level enable signal from terminal P14 to the enable terminal EN of the boost DC / DC converter 9. As a result, the boost DC / DC converter 9 outputs from the output terminal VOUT the drive voltage V BAT obtained by boosting the power supply voltage V bst . The drive voltage V bst is supplied to the switch S3 and the switch S4. In this state, the switch S3 and the switch S4 are turned off. In addition, the switch S6 is turned on by the high-level enable signal output from terminal P14. As a result, if the negative terminal side of the heater HTR is connected to the ground and the switch S3 is turned on (ON), the heater HTR is made to be in a state where it can be heated. After the enable signal of high level is output from the terminal P14 of the MCU1, it transfers to the heating mode.

[0140] <Heater heating during the heating mode: Figure 16 >

[0141] During Figure 15In the state of , the MCU1 starts the switch control of the switch S3 connected to the terminal P16 and the switch control of the switch S4 connected to the terminal P15. These switch controls can be automatically started when the above heating initial setting mode is completed, or can be started by further pressing the operation switch OPS. Specifically, the MCU1 performs heating control and temperature detection control. The heating control is such that Figure 16 the switch S3 is turned on and the switch S4 is turned off, and the drive voltage V bst is supplied to the heater HTR to heat the heater HTR for aerosol generation. The temperature detection control is such that Figure 17 the switch S3 is turned off and the switch S4 is turned on to detect the temperature of the heater HTR.

[0142] As Figure 16 shown, during the heating control, the drive voltage V bst is also supplied to the gate of the switch S5, and the switch S5 is turned on. In addition, during the heating control, the drive voltage V bst that has passed through the switch S3 is also input to the positive power supply terminal of the operational amplifier OP1 via the resistor Rs. The resistance value of the resistor Rs is small enough to be negligible compared to the internal resistance value of the operational amplifier OP1. Therefore, during the heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is approximately equal to the drive voltage V bst .

[0143] In addition, the resistance value of the resistor R4 is greater than the on-resistance value of the switch S5. Even though the operational amplifier OP1 operates during the heating control, the switch S5 is turned on during the heating control. In the state where the switch S5 is turned on, the output voltage of the operational amplifier OP1 is divided by the voltage dividing circuit of the resistor R4 and the switch S5 and input to the terminal P9 of the MCU1. The resistance value of the resistor R4 is greater than the on-resistance value of the switch S5, so that the voltage input to the terminal P9 of the MCU1 becomes small enough. Thus, it is possible to prevent a large voltage from being input to the MCU1 from the operational amplifier OP1.

[0144] <Heater temperature detection during the heating mode: Figure 17 >

[0145] As Figure 17 shown, during the temperature detection control, the drive voltage V bst is input to the positive power supply terminal of the operational amplifier OP1 and input to the voltage dividing circuit Pb. The voltage divided by the voltage dividing circuit Pb is input to the terminal P18 of the MCU1. The MCU1 obtains the reference voltage V temp applied to the series circuit of the resistor Rs and the heater HTR during the temperature detection control based on the voltage input to the terminal P18.

[0146] In addition, during temperature detection and control, a drive voltage V bst (reference voltage V temp ) is supplied to a series circuit of a resistor Rs and a heater HTR. Then, the drive voltage V bst (reference voltage V temp ) is divided by the resistor Rs and the heater HTR, and the divided voltage V heat is input to the non-inverting input terminal of an operational amplifier OP1. The resistance value of the resistor Rs is sufficiently large compared to the resistance value of the heater HTR, so the voltage V heat is a value sufficiently lower than the drive voltage V bst . During temperature detection and control, this low voltage V heat is also supplied to the gate terminal of the switch S5, whereby the switch S5 is turned off. The operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage V heat input to the non-inverting input terminal.

[0147] The output signal of the operational amplifier OP1 is input to the terminal P9 of the MCU1. The MCU1 obtains the temperature of the heater HTR based on the signal input to the terminal P9, the reference voltage V temp obtained based on the input voltage of the terminal P18, and the resistance value of the known resistor Rs. The MCU1 performs heating control of the heater HTR (for example, control such that the temperature of the heater HTR becomes a target temperature) based on the obtained temperature of the heater HTR.

[0148] In addition, even during the period when the switches S3 and S4 are turned off respectively (the period when power is not supplied to the heater HTR), the MCU1 can obtain the temperature of the heater HTR. Specifically, the MCU1 obtains the temperature of the heater HTR based on the voltage input to the terminal P13 (the output voltage of the voltage dividing circuit composed of the thermistor T3 and the resistor Rt3).

[0149] In addition, the MCU1 can obtain the temperature of the housing 110 at any timing. Specifically, the MCU1 obtains the temperature of the housing 110 based on the voltage input to the terminal P12 (the output voltage of the voltage dividing circuit composed of the thermistor T4 and the resistor Rt4).

[0150] <Charging mode: Figure 18 >

[0151] Figure 18 An example of a case where a USB connection is made in the sleep mode state is illustrated. If a USB connection is made, the USB voltage V USB is input to the input terminal VIN of the LSW3 via the overvoltage protection IC11. The USB voltage V USBis also supplied to a voltage dividing circuit Pf connected to the input terminal VIN of LSW3. At the time point immediately after USB connection, the bipolar transistor S2 is turned on, so the signal input to the control terminal ON of LSW3 becomes low level. The USB voltage V USB is also supplied to a voltage dividing circuit Pc connected to the terminal P17 of MCU1, and the voltage divided by the voltage dividing circuit Pc is input to the terminal P17. MCU1 detects the USB connection based on the voltage input to the terminal P17.

[0152] If it is detected that a USB connection has been made, MCU1 turns off the bipolar transistor S2 connected to the terminal P19. If a low-level signal is input to the gate terminal of the bipolar transistor S2, the USB voltage V divided by the voltage dividing circuit Pf USB is input to the control terminal ON of LSW3. Thereby, a high-level signal is input to the control terminal ON of LSW3, and LSW3 outputs the USB voltage V from the output terminal VOUT USB . The USB voltage V output from LSW3 USB is input to the input terminal VBUS of the charging IC2. In addition, the USB voltage V output from LSW3 USB is directly supplied as the system power supply voltage Vcc4 to the LEDs L1 to L8.

[0153] If it is detected that a USB connection has been made, MCU1 further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE(￣) of the charging IC2

[0154] ￣. Thereby, the charging IC2 enables the charging function of the power supply BAT and starts charging the power supply BAT based on the USB voltage V input to the input terminal VBUS USB .

[0155] In addition, in the case where a USB connection is made in the active mode state, if it is detected that a USB connection has been made, MCU1 turns off the bipolar transistor S2 connected to the terminal P19, and further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE(￣) of the charging IC2. Furthermore, the OTG function of the charging IC2 is turned off by serial communication using the communication line LN. Thereby, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 is switched from the voltage generated by the OTG function of the charging IC2 (voltage based on the power supply voltage V BAT to the USB voltage V output from LSW3 USB . The LEDs L1 to L8 do not operate unless the built-in transistor is turned on and off by MCU1. Therefore, it is possible to prevent an unstable voltage during the transition period from the OTG function being turned on to being turned off from being supplied to the LEDs L1 to L8.

[0156] <Reset of the MCU: Figure 19 >

[0157] If the external panel 115 is removed and the output of the Hall IC 13 becomes low level, when the operation switch OPS is turned on and the signal input to terminal P4 of the MCU 1 becomes low level, both terminal SW1 and terminal SW2 of the switch driver 7 become low level. Thereby, the switch driver 7 outputs a low-level signal from the reset input terminal RSTB. The low-level signal output from the reset input terminal RSTB is input to the control terminal ON of the LSW4. Thereby, the LSW4 stops the output of the system power supply voltage Vcc2 from the output terminal VOUT. By stopping the output of the system power supply voltage Vcc2, the system power supply voltage Vcc2 is not input to the power supply terminal VDD of the MCU 1, so the MCU 1 stops.

[0158] If the time for which a low-level signal is output from the reset input terminal RSTB reaches a predetermined time, or if the signal input to either of terminal SW1 and terminal SW2 becomes high level, the switch driver 7 returns the signal output from the reset input terminal RSTB to high level. Thereby, the control terminal ON of the LSW4 becomes high level, and it returns to the state where the system power supply voltage Vcc2 is supplied to each part.

[0159] <Details of the functions of the charging IC>

[0160] Figure 20 It is a diagram showing a schematic configuration inside the charging IC 2. The charging IC 2 includes a processor 21, a gate driver 22, and switches Q1 to Q4 formed of N-channel MOSFETs.

[0161] The source terminal of the switch Q1 is connected to the input terminal VBUS. The drain terminal of the switch Q1 is connected to the drain terminal of the switch Q2. The source terminal of the switch Q2 is connected to the switch terminal SW. The drain terminal of the switch Q3 is connected to the connection node of the switch Q2 and the switch terminal SW. The source terminal of the switch Q3 is connected to the ground terminal GND. The drain terminal of the switch Q4 is connected to the output terminal SYS. The source terminal of the switch Q4 is connected to the charging terminal bat.

[0162] The gate driver 22 is connected to the gate terminals of the switch Q2 and the switch Q3, and performs on / off control of the switches Q2 and Q3 according to the instruction of the processor 21.

[0163] The processor 21 is connected to the gate driver 22, the gate terminal of the switch Q1, the gate terminal of the switch Q4, and the charge enable terminal CE(￣). The processor 21 performs on / off control of the switches Q2 and Q3 via the gate driver 22, and on / off control of the switches Q1 and Q4.

[0164] In addition to the above-mentioned charging function, V BAT power path function, and OTG function, the charging IC2 also has V USB power path function and V USB &V BAT power path function. Hereinafter, the internal control content of the charging IC2 when each of these functions is effective will be described. In addition, the specific values of the above-mentioned various voltages are preferably the values shown below.

[0165] Power supply voltage V BAT (Full charge voltage) = 4.2V

[0166] Power supply voltage V BAT (Nominal voltage) = 3.7V

[0167] System power supply voltage Vcc1 = 3.3V

[0168] System power supply voltage Vcc2 = 3.3V

[0169] System power supply voltage Vcc3 = 3.3V

[0170] System power supply voltage Vcc4 = 5.0V

[0171] USB voltage V USB = 5.0V

[0172] Drive voltage V bst = 4.9V

[0173] (Charging function)

[0174] The processor 21 controls the on / off of the switch Q2 and the switch Q4 while controlling the switch Q1 to be on and the switch Q3 to be off. The on / off control of the switch Q4 is performed to adjust the charging current of the power supply BAT. The processor 21 controls the on / off of the switch Q2 so that the voltage of the output terminal SYS is the same as the voltage suitable for charging the power supply BAT. Thus, the USB voltage V input to the input terminal VBUS USB is stepped down and output from the output terminal SYS. The voltage output from the output terminal SYS is input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0, and is output from the charging terminal bat of the charging IC2. Thus, based on the USB voltage V USBThe power supply BAT is charged with the voltage obtained by stepping down the voltage. In addition, when the charging function is effective, the system power supply voltage Vcc0 finally becomes the same value as the full charge voltage of the power supply BAT. Therefore, the step-up / step-down DC / DC converter 8 steps down the 4.2V system power supply voltage Vcc0 input to the input terminal VIN, generates a 3.3V system power supply voltage Vcc1 and outputs it. When the charging function is effective, in the charging IC2, the potential of the input terminal VBUS becomes a potential higher than the potential of the output terminal SYS, so the power from the power supply BAT is not output from the input terminal VBUS.

[0175] (V USB Power Path Function)

[0176] For example, when the power supply BAT cannot be used due to over-discharge or other reasons, V USB The power path function is effective. The processor 21 controls the switch Q1 to be on, controls the switch Q2 to be on, controls the switch Q3 to be off, and controls the switch Q4 to be off. As a result, the USB voltage V input to the input terminal VBUS is USB The voltage output from the switch terminal SW is directly outputted without stepping down. The voltage outputted from the switch terminal SW is inputted to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. In this case, the buck-boost DC / DC converter 8 also steps down the 5V system power supply voltage Vcc0 inputted to the input terminal VIN, generates a 3.3V system power supply voltage Vcc1 and outputs it. USB When the power path function is effective, the processor 21 can also control the switch Q2 to be on and off while the switch Q1 is controlled to be on, the switch Q3 is controlled to be off, and the switch Q4 is controlled to be on. In this way, the charging IC2 and the buck-boost DC / DC converter 8 can separately control the USB voltage V from 5.0V to V. USB The system power supply voltage Vcc1 is stepped down to 3.3 V. Therefore, it is possible to suppress the concentration of load or heat on the step-up / step-down DC / DC converter 8.

[0177] (V USB &V BAT Power Path Function)

[0178] For example, when the charging of the power supply BAT is completed and the USB connection continues, V USB &V BAT The power passing function is effective. The processor 21 controls the switch Q2 to be on and off while the switch Q1 is controlled to be on, the switch Q3 is controlled to be off, and the switch Q4 is controlled to be on. The processor 21 controls the switch Q2 so that the voltage of the output terminal SYS is equal to the voltage of the power supply BAT (power supply voltage V BAT) is the same. Thus, the USB voltage V input to the input terminal VBUS USB is stepped down and output from the output terminal SYS. The USB voltage V input to the input terminal VBUS USB is stepped down and the voltage output from the output terminal SYS and the voltage output from the power supply BAT via the charging terminal bat to the output terminal SYS are the same value. Therefore, the power including the voltage obtained by stepping down the USB voltage V USB is combined with the power of the power supply voltage V output from the output terminal SYS BAT and supplied to the input terminal VIN of the buck-boost DC / DC converter 8. At V USB &V BAT When the power path function is effective, in the charging IC2, the potential of the input terminal VBUS becomes higher than the potential of the output terminal SYS, so the power from the power supply BAT is not output from the input terminal VBUS.

[0179] At V USB &V BAT When the power path function is effective, the buck-boost DC / DC converter 8 determines whether to perform boosting or bucking according to the magnitude of the power supply voltage V BAT . When the power supply voltage VBAT is 3.3V or more, the buck-boost DC / DC converter 8 steps down the system power supply voltage Vcc0 input to the input terminal VIN and generates and outputs a 3.3V system power supply voltage Vcc1. When the power supply voltage V BAT is less than 3.3V, the buck-boost DC / DC converter 8 boosts the system power supply voltage Vcc0 input to the input terminal VIN and generates and outputs a 3.3V system power supply voltage Vcc1.

[0180] (V BAT power path function)

[0181] V BAT The power path function is effective in modes other than the charging mode (for example, the sleep mode). The processor 21 controls the switch Q1 and the switch Q3 to be off. Thus, the power supply voltage V input to the charging terminal bat BAT is directly output from the output terminal SYS and input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. Through this control, the power transmission path between the input terminal VBUS and the switch terminal SW of the charging IC2 is blocked by the parasitic diode of the switch Q1. Therefore, the power supply voltage V output from the output terminal SYS BAT is not output from the input terminal VBUS.

[0182] At V BATWhen the power path function is valid, the buck-boost DC / DC converter 8 determines whether to step up or step down according to the magnitude of the power supply voltage V BAT When the power supply voltage V BAT input to the input terminal VIN is 3.3V or higher, the buck-boost DC / DC converter 8 steps down the power supply voltage V BAT to generate a system power supply voltage Vcc1 of 3.3V and output it. When the power supply voltage V BAT input to the input terminal VIN is less than 3.3V, the buck-boost DC / DC converter 8 steps up the power supply voltage V BAT to generate a system power supply voltage Vcc1 of 3.3V and output it.

[0183] (OTG function)

[0184] The OTG function is valid at the same time as the V BAT power path function, for example, it is valid in the active mode. When both the OTG function and the V BAT power path function are valid, the processor 21 controls the on / off of the switch Q3 in the state where the switch Q1 is controlled to be on. Thus, the power supply voltage V BAT input to the charging terminal bat is directly output from the output terminal SYS and input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. In addition, the power supply voltage V BAT output from the output terminal SYS is input to the switch terminal SW of the charging IC2. The processor 21 controls the switch Q3 so that the power supply voltage V BAT input to the switch terminal SW is the same as the system power supply voltage Vcc4. Thus, the power supply voltage V BAT input to the switch terminal SW is stepped up and output from the input terminal VBUS. The voltage output from the input terminal VBUS is input to the LEDs L1 to L8 as the system power supply voltage Vcc4.

[0185] In this way, the charging IC2 has both the function of a buck converter that steps down the USB voltage V USB and the function of a converter that steps up the power supply voltage V BATFunction of a boost - type boost converter. The voltage input from the charging IC2 to the buck - boost DC / DC converter 8 varies variously according to the effective function of the charging IC2. However, even with such variations, the buck - boost DC / DC converter 8 can maintain the system power supply voltage Vcc1 (including the power of the system power supply voltage Vcc1) as constant by selectively performing boost and buck operations. Additionally, when the voltage of the system power supply voltage Vcc0 input to the input terminal VIN of the buck - boost DC / DC converter 8 is equal to the voltage of the system power supply voltage Vcc1, that is, 3.3V, the buck - boost DC / DC converter 8 does not perform boost or buck operations, and takes the system power supply voltage Vcc0 as the system power supply voltage Vcc1 and outputs it from the output terminal VOUT.

[0186] <Power consumption of the circuit>

[0187] In the suction system including the suction device 100, the load that consumes the most power among all the loads included in the consumption system is the heater HTR. For example, the power consumption P of the heater HTR HTR is greater than the power consumption P of each of the LEDs L1 - L8. LED Moreover, the power consumption of the heater HTR is greater than the total value of the power consumption of all the electronic components connected to the output terminal SYS of the charging IC2. Therefore, it is preferable that the boost DC / DC converter 9 connected to the heater HTR can receive a supply current value from the power supply BAT that is greater than the maximum current value that the output terminal SYS of the charging IC2 can output.

[0188] <Preferred form of the buck - boost DC / DC converter 8>

[0189] From the viewpoint of reducing the cost and size of the buck - boost DC / DC converter 8, it is preferable that at least one of the maximum input current and the maximum output current of the buck - boost DC / DC converter 8 is smaller than the maximum current that the output terminal SYS of the charging IC2 can output. If such a structure is adopted, when the maximum current is output from the output terminal SYS of the charging IC2, there is a possibility of inputting an excessive current to the buck - boost DC / DC converter 8. However, since the heater HTR that consumes the most power is not connected to the output terminal VOUT of the buck - boost DC / DC converter 8, an excessive current will not be input to the buck - boost DC / DC converter 8. Therefore, even with such a structure, no adverse conditions will occur to the buck - boost DC / DC converter 8, and the cost and size can be reduced.

[0190] <Preferred form of the boost DC / DC converter 9>

[0191] The boost DC / DC converter 9 is preferably a switching regulator. In Figure 20In the example, the boost DC / DC converter 9 operates in either a PFM (Pulse Frequency Modulation) mode that performs PFM control or a PWM (Pulse Width Modulation) mode that performs PWM control to achieve boosting. More specifically, in the boost DC / DC converter 9, a mode terminal MODE for mode switching is provided and is configured to be able to switch the operation mode according to the potential of the mode terminal MODE. In addition, it is preferable that the maximum current that can be input to the switch terminal SW of the boost DC / DC converter 9 when the boost DC / DC converter 9 operates in the PFM mode is larger than the maximum current that can be input to the switch terminal SW of the boost DC / DC converter 9 when the boost DC / DC converter 9 operates in the PWM mode.

[0192] The voltage applied to the heater HTR varies significantly between the heating control and the temperature detection control. That is, the load of the boost DC / DC converter 9 varies between heavy load and light load. Since the switching frequency of the PWM mode is constant regardless of the load, at light load, the switching loss becomes dominant and the efficiency decreases. On the other hand, in the PFM mode, at light load, not much additional power is required, so the switching frequency becomes low and the switching loss is reduced. Therefore, high efficiency can be maintained even at light load. If the degree of the load increases from light load to heavy load, the relationship of this efficiency is reversed, and the efficiency of the PWM mode is higher than that of the PFM mode. The degree of the load for which the PWM mode has high efficiency is within a limited range. Therefore, when the load of the boost DC / DC converter 9 varies between heavy load and light load, it is preferable that the boost DC / DC converter 9 operates in the PFM mode.

[0193] Even when operating in either the PWM mode or the PFM mode, near the maximum current that can be input to the boost DC / DC converter 9 or the maximum current that the boost DC / DC converter 9 can output, the efficiency of the boost DC / DC converter 9 tends to decrease. In particular, when operating in the PFM mode, it has the characteristic that the efficiency decreases at heavy load as described above. Therefore, near the maximum current, the efficiency of the DC / DC converter decreases due to double reasons. Therefore, as described above, the boost DC / DC converter 9 is used, and the maximum current that can be input to the switch terminal SW of the boost DC / DC converter 9 when operating in the PFM mode is larger than the maximum current that can be input to the switch terminal SW of the boost DC / DC converter 9 when operating in the PWM mode. Thereby, even when the boost DC / DC converter 9 operates in the PFM mode, a decrease in efficiency at heavy load can be suppressed.

[0194] From the above perspective of efficiency, it is preferable that the potential of the mode terminal MODE is maintained at the potential for selecting the PFM mode. In Figure 20 the example, by the state where the mode terminal MODE is not connected to any part, the operation mode of the boost DC / DC converter 9 is fixed to the PFM mode. Thereby, a larger current can be input to the switch terminal SW of the boost DC / DC converter 9, and a larger current can flow to the heater HTR. In addition, it should be noted that the structure in which the potential of such a mode terminal MODE is not constant is just a specific example. According to the specifications of the boost DC / DC converter 9, sometimes the PFM mode is selected by making the potential of the mode terminal MODE high or low. In such a case, in order to select the PFM mode, the potential of the mode terminal MODE only needs to be maintained at an appropriate potential.

[0195] <Effect of the aspirator>

[0196] According to the aspirator 100, the voltage is supplied to the LEDs L1 to L8 as the notification unit not directly from the power supply BAT, but via the charging IC2. The voltage of the power supply BAT fluctuates, and this fluctuating voltage is not directly supplied to the LEDs L1 to L8, so that the LEDs L1 to L8 can operate stably. Since the brightness of the LED depends on the supplied voltage, if a stable voltage can be supplied to the LEDs L1 to L8, the brightness of the LEDs L1 to L8 can be stabilized. In addition, the charging IC2, which mainly functions as the charging control of the power supply BAT, generates the system power supply voltage Vcc4 and supplies it to the LEDs L1 to L8. Therefore, a dedicated IC for generating the system power supply voltage Vcc4 is not required. Therefore, miniaturization and cost reduction of the aspirator 100 can be achieved. In addition, the charging IC2 boosts the power supply voltage V BAT to generate the system power supply voltage Vcc4. Therefore, high-voltage power can be supplied to the LEDs L1 to L8. Thereby, the LEDs L1 to L8 can be lit with high brightness, and a good user interface can be achieved.

[0197] In addition, according to the aspirator 100, the power is supplied to the MCU1 not directly from the power supply BAT, but via the charging IC2. The charging IC2, which mainly functions as the charging control of the power supply BAT, generates the system power supply voltage Vcc0 and supplies it to the MCU1. Therefore, a dedicated IC for generating the system power supply voltage Vcc0 is not required. Therefore, miniaturization and cost reduction of the aspirator 100 can be achieved. In addition, since the buck-boost DC / DC converter 8 is provided between the charging IC2 and the MCU1, a certain amount of power can be supplied to the MCU1. Thereby, the operation of the MCU1 can be stabilized.

[0198] In addition, according to the aspirator 100, in the state where the LSW3 is turned off during USB connection, the OTG function cannot be executed. Therefore, power consumption of the power supply BAT during USB connection can be suppressed, and the amount of power of the power supply BAT that can be used can be increased. In addition, at the moment immediately after USB connection, since the LSW3 is turned on, noise and inrush current immediately after USB connection are not supplied to the LEDs L1 to L8, and the possibility of failure of the LEDs L1 to L8 can be reduced. In addition, at the moment immediately after USB connection, the OTG function can be executed. Therefore, even during the transition period when power from an external power supply immediately after USB connection cannot be supplied to the LEDs L1 to L8, power can be supplied from the power supply (BAT) to the LEDs L1 to L8 through the OTG function. Therefore, the opportunity for the LEDs L1 to L8 to operate can be increased, and the marketability of the aspirator 100 can be improved.

[0199] In addition, according to the aspirator 100, the charging IC2 can also supply the power of the power supply BAT to loads such as the MCU1, so a dedicated IC for supplying power to these loads is not required, and the cost of the aspirator 100 can be reduced.

[0200] In addition, a notification unit different from the LEDs L1 to L8 can be further connected to the input terminal VBUS of the charging IC2. For example, it can be configured such that the input terminal VBUS of the charging IC2 is connected to the vibration motor M, and the system power supply voltage Vcc4 and the USB voltage V USB are supplied to the vibration motor M, or the input terminal VBUS of the charging IC2 is connected to a speaker (not shown), and the system power supply voltage Vcc4 and the USB voltage V USB are supplied to the speaker. In addition, it can also be configured such that an IC other than the notification unit (an IC independent of the IC shown) is connected to the input terminal VBUS of the charging IC2. As the load, preferably, at least one of the notification unit and an IC separated from the notification unit is connected to the input terminal VBUS of the charging IC2. Figure 10 As the load, preferably, at least one of the notification unit and an IC separated from the notification unit is connected to the input terminal VBUS of the charging IC2.

[0201] In addition, the aspirator 100 has a first discharge path for supplying power from the power supply BAT to the MCU1 via the charging IC2, and a second discharge path for supplying power from the power supply BAT to the heater HTR without passing through the charging IC2. Therefore, it is sufficient that the current value that should flow through the first discharge path (the maximum current that can be output from the output terminal SYS of the charging IC2) is smaller than the current value that should flow through the second discharge path. Therefore, there is no need for an expensive and large-scale charging IC2 that can withstand large currents, and miniaturization and cost reduction of the aspirator 100 can be achieved. The MCU1 and the heater HTR can operate simultaneously, but when they operate simultaneously, since there are the first discharge path and the second discharge path, an excessive burden is not imposed on the charging IC2, and sufficient power can be supplied to them.

[0202] In addition, according to the aspirator 100, the second discharge path through which a large current flows is provided on a substrate different from the first discharge path. Specifically, the first discharge path is provided on the MCU mounting substrate 161, and the second discharge path is provided on the socket mounting substrate 162. Therefore, heat concentration on one substrate can be avoided, and the durability of the aspirator 100 can be improved.

[0203] In addition, according to the aspirator 100, all the electronic components that receive power supply from the power supply BAT without passing through the charging IC2 are provided on the same substrate (the socket mounting substrate 162). Therefore, circuit complication can be prevented.

[0204] In addition, according to the aspirator 100, a boost DC / DC converter 9 is provided in the discharge path for discharging from the power supply BAT to the heater HTR. Therefore, regardless of the maximum current of the output terminal SYS of the charging IC2, a large amount of power can be supplied to the heater HTR through the boost DC / DC converter 9. Therefore, cost reduction and miniaturization of the aspirator 100 can be achieved, and heating of the rod 500 using the heater HTR can be performed efficiently.

[0205] In addition, the aspirator 100 has a discharge path (the path from the socket RCP to the LEDs L1 to L8) for discharging to the LEDs L1 to L8 without passing through the charging IC2 when the USB is connected. Thus, compared with the case of providing a path for discharging from an external power supply to the LEDs L1 to L8 through the charging IC2, there is no need for an expensive and large-scale charging IC2 that can withstand large currents. Therefore, cost reduction and miniaturization of the aspirator 100 can be achieved.

[0206] In addition, in the aspirator 100, the electronic components connected to the input terminal VBUS of the charging IC2 are notification units such as LEDs L1 to L8 or an IC separate from the IC shown in the figure. Therefore, it is possible to prevent power from an external power source, where noise and inrush current are likely to be mixed in, from being supplied to precision electronic components such as the MCU1, the buck-boost DC / DC converter 8, the ROM6, the remaining amount meter IC12, the protection IC10, and the boost DC / DC converter 9, and the durability can be improved.

[0207] In addition, in the aspirator 100, an overvoltage protection IC11 is provided between the LSW3 and the socket RCP. Due to the presence of the overvoltage protection IC11, it is possible to block the noise and inrush current generated at the moment of USB connection not only through the LSW3 but also through the overvoltage protection IC11. Thereby, the durability of the aspirator 100 can be improved.

[0208] In addition, in the aspirator 100, the LEDs L1 to L8 are each configured not to operate unless the built-in switch of the MCU1 is turned on. Therefore, it is possible to prevent the noise and inrush current immediately after USB connection from being supplied to the LEDs L1 to L8, and the possibility of the LEDs L1 to L8 malfunctioning can be reduced. In addition, since the switch is built into the MCU1, the durability of the switch can be improved compared to the case where the switch is provided outside the MCU1.

[0209] As the larger voltage among the voltages supplied by the aspirator 100 to the load, there are the system power supply voltage Vcc4 and the drive voltage V bst . The system power supply voltage Vcc4 is generated based on the power from the external power source and the power from the power supply BAT, respectively. On the other hand, the drive voltage V bst is generated only from the power from the power supply BAT. In this way, regarding the drive voltage V bst , by forming a configuration that is not generated based on the power of the external power source, the line through which high-voltage power flows will not be complicated. Thereby, the complication of the circuit can be avoided, and thus the cost of the aspirator 100 can be reduced. In addition, the power supply path for supplying power including the system power supply voltage Vcc4 and the power supply path for supplying power including the drive voltage V bst are on different substrates. Specifically, the power supply path for supplying power including the system power supply voltage Vcc4 is provided on the MCU mounting substrate 161 and the LED mounting substrate 163. The power supply path for supplying power including the drive voltage V bst is provided on the socket mounting substrate 162. In this way, by providing the two power supply paths for applying high voltage on different substrates, it is possible to suppress the noise superposition of these power supply paths from becoming a noise that is difficult to handle. Therefore, the aspirator 100 can operate stably.

[0210] In addition, in the aspirator 100, a power connector connected to the power supply BAT, a socket RCP connected to an external power supply, and a heater connector Cn connected to the heater HTR are provided on the same substrate (the socket-mounted substrate 162). As a result, generation of heat in various parts within the aspirator 100 can be suppressed, and thus the durability of the aspirator 100 is improved.

[0211] As described above, various embodiments have been described with reference to the drawings, but the present invention is of course not limited to the above examples. Those skilled in the art can easily conceive of various modification examples or correction examples within the scope described in the claims, and these are of course also understood to belong to the technical scope of the present invention.

[0212] For example, it may also be configured such that a connector for connecting a heater different from the heater HTR (a heater having a heating object different from that of the heater HTR) or other load is connected between the output terminal VOUT of the boost DC / DC converter 9 and the ground wire.

[0213] In addition, in Figure 10 a parallel circuit including a circuit including a switch S3 and a circuit including a switch S4 and a resistor Rs is connected between the output terminal VOUT of the boost DC / DC converter 9 and the positive electrode side of the heater connector Cn, but it may also be configured such that this parallel circuit is connected between the negative electrode side of the heater connector Cn and the switch S6, and the output terminal VOUT of the boost DC / DC converter 9 is directly connected to the positive electrode side of the heater connector Cn.

[0214] At least the following matters are described in this specification. In addition, the corresponding components, etc. in the above-described embodiments are shown in parentheses, but are not limited thereto.

[0215] (1) A power supply unit (aspirator 100) of an aerosol generating device that heats an aerosol source (rod 500) to generate an aerosol, comprising:

[0216] A power supply (power supply BAT);

[0217] A connector (socket RCP) capable of being electrically connected to an external power supply;

[0218] A first load (MCU1);

[0219] A charging IC (charging IC2), configured to include: an input terminal (input terminal VBUS) connected to the connector; a charging terminal (charging terminal bat) connected to the power supply; and an output terminal (output terminal SYS) connected to the first load, the charging IC converting the power input to the input terminal and outputting it from the charging terminal; and

[0220] A discharge path that connects the power supply and the second load (heater HTR) without passing through the charging IC.

[0221] The charging IC is configured to be able to supply the power input from the power supply to the charging terminal to the first load via the output terminal.

[0222] According to (1), by means of a discharge path that discharges to the second load without passing through the charging IC, the load connected to the output terminal of the charging IC can be reduced. Therefore, there is no need for an expensive and large-scale charging IC that can withstand large currents, and the cost reduction and miniaturization of the aerosol generating device can be achieved.

[0223] (2) The power supply unit of the aerosol generating device as described in (1), wherein

[0224] The first load and the second load operate simultaneously.

[0225] According to (2), even if the two loads operate simultaneously, the burden on the charging IC will not be excessive. Therefore, sufficient power can be supplied to the two loads to enable them to operate fully.

[0226] (3) The power supply unit of the aerosol generating device as described in (2), which includes:

[0227] A first substrate (MCU-mounted substrate 161); and

[0228] A second substrate (socket-mounted substrate 162), independent of the first substrate,

[0229] The charging IC and the first load are provided on the first substrate,

[0230] The discharge path is provided on the second substrate.

[0231] According to (3), the path from the power supply via the charging IC to the first load and the path from the power supply to the second load are on different substrates. Therefore, heat concentration on one substrate can be avoided, and the durability of the aerosol generating device can be improved.

[0232] (4) The power supply unit of the aerosol generating device according to any one of (1) to (3), wherein

[0233] The power consumption of the first load is less than the power consumption of the second load.

[0234] According to (4), it is also possible not to make the charging IC discharge to the second load that consumes relatively large power. Therefore, a cheaper and smaller-scale charging IC can be used, and the cost reduction and miniaturization of the aerosol generating device can be achieved.

[0235] (5) The power supply unit of the aerosol generating device according to (4), wherein,

[0236] Among the loads included in the aerosol generating device, the second load consumes the most power.

[0237] According to (5), it is also possible not to discharge the charging IC to the second load that consumes the most power. Therefore, a cheaper and smaller charging IC can be used, and cost reduction and miniaturization of the aerosol generating device can be achieved.

[0238] (6) The power supply unit of the aerosol generating device according to any one of (1) to (5), wherein,

[0239] The discharge path includes a boost converter (boost DC / DC converter 9), and the boost converter can boost the output voltage (power supply voltage V BAT ) of the power supply and apply it to the second load.

[0240] According to (6), since it is necessary to improve the operation efficiency of the second load and not allow a large power for boosting or boosted to pass through the charging IC, the cost and size of the aerosol generating device can be reduced while increasing the effect of the second load.

[0241] (7) The power supply unit of the aerosol generating device according to (6), wherein,

[0242] A third load (protection IC 10) is provided, and the third load is connected to a node between the power supply and the boost converter in the discharge path and operates by the power supplied from the node.

[0243] According to (7), since there is a discharge path that discharges to the third load without passing through the charging IC, an expensive and large-scale charging IC that can withstand a large current is not required. Therefore, cost reduction and miniaturization of the aerosol generating device can be achieved.

[0244] (8) The power supply unit of the aerosol generating device according to (7), wherein it includes:

[0245] A power supply connector, connected to the power supply;

[0246] A first substrate (MCU-mounted substrate 161); and

[0247] A second substrate (socket-mounted substrate 162), independent of the first substrate,

[0248] The charging IC is provided on the first substrate,

[0249] The discharge path and the third load are provided on the second substrate.

[0250] According to (8), the discharge path not passing through the charging IC converges to one substrate. Therefore, it is possible to suppress the complication of the circuit on the substrate, and it is possible to achieve cost reduction and miniaturization of the aerosol generating device.

[0251] (9) The power supply unit of the aerosol generating device according to any one of (1) to (8), wherein

[0252] a voltage converter (step-up / step-down DC / DC converter 8) is provided, and the voltage converter is configured to be connected between the output terminal and the first load and output a constant voltage.

[0253] According to (9), since a constant voltage can be supplied to the first load, the operation of the first load is stable.

[0254] (10) The power supply unit of the aerosol generating device according to (9), wherein

[0255] the charging IC can supply the power input to the input terminal to the first load (V USB power path function) via the output terminal,

[0256] the voltage converter is configured to:

[0257] when the power input from the charging terminal is output from the output terminal (V BAT when the power path function is effective), boost or step down the voltage input from the charging IC and output a constant voltage,

[0258] when the power input from the input terminal is output from the output terminal (V USB when the power path function is effective), step down the voltage input from the charging IC and output the constant voltage.

[0259] According to (10), even when using either an external power supply or the power supply, a constant voltage is supplied to the first load, so the operation of the first load is stable.

[0260] As described above, various embodiments have been described with reference to the drawings, but the present invention is of course not limited to the above examples. Those skilled in the art can easily think of various modification examples or correction examples within the scope described in the claims, and these are of course also understood to belong to the technical scope of the present invention. In addition, within the scope not departing from the gist of the invention, the constituent elements in the above embodiments can be arbitrarily combined.

[0261] In addition, this application is based on a Japanese patent application filed on May 10, 2021 (Japanese Patent Application No. 2021-079870), the content of which is incorporated herein by reference.

[0262] Description of Reference Numerals

[0263] 100 Suction device; 1 MCU; HTR Heater; BAT Power supply; Cn Heater connector; RCP Socket; 2 Charging IC; L1 - L8 LEDs.

Claims

1. A power supply unit for an aerosol generating device that generates aerosol by heating an aerosol source, comprising: A first power supply; A connector capable of being electrically connected to an external second power supply; A first load; A charging IC configured to include: an input terminal connected to the connector; a charging terminal connected to the first power supply; and an output terminal connected to the first load, the charging IC converting the power input to the input terminal and outputting it from the charging terminal; A discharge path connecting the first power supply and a second load without passing through the charging IC; and A voltage converter configured to be connected between the output terminal and the first load and output a constant voltage, The charging IC is configured to be able to supply the power input from the first power supply to the charging terminal to the first load via the voltage converter from the output terminal.

2. The power supply unit for an aerosol generating device according to claim 1, wherein, The first load and the second load operate simultaneously.

3. The power supply unit for an aerosol generating device according to claim 2, wherein, Comprising: A first substrate; And A second substrate independent of the first substrate, The charging IC and the first load are provided on the first substrate, The discharge path is provided on the second substrate.

4. The power supply unit for an aerosol generating device according to any one of claims 1 to 3, wherein, The power consumption of the first load is less than that of the second load.

5. The power supply unit for an aerosol generating device according to claim 4, wherein, Among the loads of the aerosol generating device, the second load consumes the most power.

6. The power supply unit for an aerosol generating device according to any one of claims 1 to 3, wherein, The discharge path is configured to be able to boost the output voltage of the first power supply and apply it to the second load.

7. The power supply unit for an aerosol generating device according to claim 6, wherein, Comprising a third load connected to a node between the first power supply and the second load in the discharge path and operating by the power supplied from the node.

8. The power supply unit for an aerosol generating device according to claim 7, wherein, Comprising: A power connector connected to the first power supply; A first substrate; And A second substrate independent of the first substrate, The charging IC is provided on the first substrate, The discharge path and the third load are provided on the second substrate.

9. The power supply unit for an aerosol generating device according to claim 1, wherein, The charging IC can supply the power input to the input terminal to the first load via the output terminal, The voltage converter is configured to: When outputting the power input from the charging terminal from the output terminal, boost or step down the voltage input from the charging IC and output the constant voltage, In the case of outputting the power input from the input terminal from the output terminal, the voltage input from the charging IC is stepped down and the constant voltage is output.

10. The power supply unit of the aerosol generating device according to claim 1, wherein, the voltage converter is configured to step down the voltage input from the charging IC and output the constant voltage.

11. The power supply unit of the aerosol generating device according to any one of claims 1 to 3, wherein, it includes: a thermistor configured to be in contact with or close to the second load; a power line connected to the thermistor; and a load switch, the control terminal of which is connected to the first load, the input terminal of which is connected to the output terminal of the charging IC, and the output terminal of which is connected to the power line.

12. The power supply unit of the aerosol generating device according to any one of claims 1 to 3, wherein, the power supply unit is a suction device.

13. The power supply unit of the aerosol generating device according to any one of claims 1 to 3, wherein, the first load is an MCU.

14. The power supply unit of the aerosol generating device according to any one of claims 1 to 3, wherein, the second load is a heating unit.

15. The power supply unit of the aerosol generating device according to claim 14, wherein, the first load is configured to control the heating based on the second load.

16. The power supply unit of the aerosol generating device according to any one of claims 1 to 3, wherein, the second load is an induction heating type heater.

17. The power supply unit of the aerosol generating device according to claim 7 or 8, wherein, the third load is a protection IC.

18. The power supply unit of the aerosol generating device according to any one of claims 1 to 3, wherein, the discharge path includes a boost converter that can boost the output voltage of the first power supply and apply it to the second load.

19. The power supply unit of the aerosol generating device according to claim 18, wherein, it includes a third load, the third load is connected to the node between the first power supply and the boost converter in the discharge path, and operates by the power supplied from the node.

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