A circuit board pin automatic tin dipping equipment

Abstract

This invention relates to an automatic soldering device for circuit board leads, comprising a carrier plate, a support platform, and a support frame, wherein the support platform is mounted on the side of the carrier plate. This invention relates to the technical field of circuit board processing and assembly. Beneficial effects: In use, this invention uses a soldering component to perform soldering, simultaneously feeding the solder wire. During soldering, the solder wire can be directly pulled out, and after soldering, the conveyor belt automatically moves forward. This eliminates the need for separate control of the solder wire feeding and conveying devices during soldering, thus saving on drive costs. Furthermore, after a certain period of use, no maintenance or replacement is required for the drive component and the servo motor in the conveying device, allowing for continuous use and eliminating the need for maintenance. Therefore, this achieves cost savings and increased efficiency.

Description

Technical Field

[0001] This invention relates to the technical field of circuit board processing and assembly, and in particular to an automatic soldering device for circuit board pins. Background Technology

[0002] In the processing of electronic components, the most common way to assemble circuit boards with other electronic components is through soldering. For example, when chips are processed onto circuit boards, their pins are typically mounted by soldering. This method has now reached a level of full automation for rapid processing and installation. The advantages of this equipment include the ability to automatically identify the position and shape of the circuit board pins and automatically perform soldering operations, greatly improving production efficiency. At the same time, the motion control system uses high-precision servo motors and laser sensors to achieve precise motion control and position detection, ensuring the quality and stability of the soldering. In addition, it can adapt to different types and sizes of circuit boards, and can achieve rapid switching and production by adjusting parameters and changing tools.

[0003] In existing automatic soldering equipment for circuit board leads, the circuit board is transported via a conveyor belt and a servo motor, which precisely delivers the circuit board to the soldering device for rapid soldering. The solder wire in the soldering device is pushed to the soldering pen by a conveyor, and then the soldering pen presses against the circuit board for heating and soldering, thus soldering the electronic component leads to the circuit board. However, in this method, both the conveyor and the solder wire feeding device are independently controlled. The internal drive components, such as the servo motor, require maintenance or replacement after a certain period of use, indirectly increasing the cost of the soldering equipment. Furthermore, during maintenance or replacement, soldering cannot be performed, thus reducing the efficiency of soldering circuit board leads. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of this invention is to provide an automatic soldering device for circuit board pins, which saves driving costs and eliminates the need for maintenance and replacement of the drive assembly for feeding solder wire and the servo motor in the conveying device after a certain period of use, thus allowing for continuous use and saving the maintenance process.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution:

[0006] An automatic soldering device for circuit board pins includes a carrier plate, a support platform, and a carrier frame. The support platform is installed on the side of the carrier plate, and the carrier frame is installed on the top side of the support platform. A groove is formed on the top side of the carrier plate, and support shafts are symmetrically and rotatably installed in the groove. A conveyor belt is connected between the two support shafts. A gap is left between one side of the conveyor belt and the inner wall of the groove. A soldering component is provided on the top side of the carrier frame, and a conveying component is installed on the inner side of the carrier frame through the soldering component.

[0007] By adopting the above technical solution, when the tinning component returns to its original position after tinning, the conveyor belt will be driven to rotate by the conveyor component, thereby conveying the circuit boards on the conveyor belt forward. The soldered circuit boards will be conveyed to the next processing step, while the unsoldered circuit boards will be conveyed to the tinning component for soldering. During soldering, the soldering component will be used to perform the soldering work, and at the same time, the soldering component will achieve the effect of automatically conveying the solder wire.

[0008] In a preferred embodiment, the present invention may be further configured such that: the soldering assembly includes a plurality of electrically operated telescopic joints, the electrically operated telescopic joints are installed on the top side inside the support frame, the output end of the electrically operated telescopic joints faces downward and is equipped with a solder pen, the bottom end of the solder pen is equipped with a solder head, wherein the solder head is inclined, and a solder wire loading assembly is provided between the support frame and the solder pen.

[0009] By adopting the above technical solution, the electric telescopic joint drives the solder pen downward, which in turn drives the solder head downward, so that the solder head reaches the pin on the circuit board where soldering is required. Soldering is then performed through the solder head, achieving the effect of soldering on the circuit board. At the same time, the solder wire assembly will leave a certain length of solder wire when the electric telescopic joint rises, and fix the length of solder wire when the electric telescopic joint rises and then falls. The solder head will press the solder wire onto the part that needs to be tinned, and then the soldering work will be performed through the solder head.

[0010] In a preferred embodiment, the present invention may be further configured such that: the welding wire loading assembly includes a clamp plate, the clamp plate is mounted on the side of the support frame, a storage rod is rotatably mounted inside the clamp plate, and welding wire is wound on the storage rod.

[0011] By adopting the above technical solution, the welding wire is stored in the storage rod, which facilitates the pulling of the electric telescopic joint to pull out the welding wire on the storage rod. Then, the welding wire is pressed onto the part of the circuit board that needs to be soldered by the soldering tip on the soldering pen.

[0012] In a preferred embodiment, the present invention can be further configured such that: a ratchet groove is provided on one side of the clamping plate, a limiting wheel is provided at the end of the receiving rod, the limiting wheel extends into the ratchet groove, and a limiting spring piece matching the ratchet groove is fixedly installed on the arc side of the limiting wheel.

[0013] By adopting the above technical solution, when the solder pen descends, it will pull the solder wire downwards, and when the solder pen ascends, the limiting spring will be locked in the ratchet groove to prevent the storage rod from rotating. This ensures that a portion of the solder wire is reserved when the solder pen ascends, and when the solder pen descends, the solder head will be pressed onto the circuit board for soldering. This eliminates the need for a soldering drive device and reduces the cost of the soldering equipment.

[0014] In a preferred embodiment, the present invention can be further configured as follows: a mounting plate is fixedly connected to the bottom of the arc side of the solder pen, a mounting groove is provided on the bottom side of the mounting plate, a guide shaft is rotatably mounted in the mounting groove, a gap is left between the guide shaft and the solder pen, and the solder wire extends through the guide shaft and the solder pen to the bottom side of the solder head.

[0015] By adopting the above technical solution, when the solder pen moves upward, the solder wire passes through the gap between the guide shaft and the solder pen. At the same time, the guide shaft will rotate. Due to the curvature of the solder pen, the solder wire will be bent when the guide shaft rotates. After bending, the solder wire is fed to the bottom of the solder head. When the solder pen descends, the solder head will press the solder wire to fix it, thus facilitating the application of solder wire to the circuit board for soldering.

[0016] In a preferred embodiment, the present invention can be further configured as follows: a limiting groove is provided on one side of the mounting groove, the limiting groove is circular, a plurality of ratchet plates are installed on the end side of the guide shaft in a circular shape, a limiting wheel is fixedly installed in the limiting groove, and a limiting spring is fixedly installed on the outside of the limiting wheel.

[0017] By adopting the above technical solution, through the cooperation of the set limiting groove, the set ratchet plate, the limiting wheel and the limiting spring, the receiving rod of the solder pen moves upward and rotates, thereby driving the ratchet plate to rotate. When the ratchet plate rotates, the limiting spring does not limit the rotation of the receiving rod, and the solder wire will continue to move forward. When the solder pen descends, the receiving rod will be limited by the limiting spring on the limiting wheel to limit the ratchet plate, and at this time it will not rotate, thereby pulling the solder wire downward, so as to facilitate soldering the solder wire to the circuit board and the pins of electronic components through the solder head.

[0018] In a preferred embodiment, the present invention may be further configured such that: the conveying assembly includes a transmission gear rack, the transmission gear rack is sleeved on the outer side of the conveyor belt, a transmission gear that meshes with the drive gear rack is rotatably mounted on the inner side of the support frame, an annular groove is formed on the side of the transmission gear, and a drive gear rack is rotatably mounted in the annular groove.

[0019] By adopting the above technical solution, the rising and falling of the solder pen will drive the rotation of the drive gear rack when it rises, which in turn drives the rotation of the transmission gear. Subsequently, the transmission slave gear will drive the rotation of the transmission gear rack, causing the conveyor belt to rotate, thereby achieving the effect of transporting the circuit board.

[0020] In a preferred embodiment, the present invention may be further configured such that: a ratchet side tooth is installed on the inner side of the drive gear rack, wherein a drive rod is installed on the arc surface side of the solder pen near the ratchet side tooth, the drive rod extends to the side of the drive gear rack, and a drive spring is fixedly installed at the end of the drive rod, the drive spring extending to the inner side of the ratchet side tooth.

[0021] By adopting the above technical solution, the drive rod moves along with the soldering pen, thereby driving the drive spring to move. This ensures that the drive spring does not drive the drive gear rack to rotate when it descends, but drives the drive gear rack to rotate when it rises, thus saving transportation costs.

[0022] In summary, the present invention has at least one of the following beneficial technical effects:

[0023] 1. In use, this invention uses a soldering component to apply solder and simultaneously feed the solder wire. This allows the solder wire to be pulled out directly during soldering, and the conveyor belt automatically moves forward after soldering. This eliminates the need for separate control of the solder wire feeding and conveying devices during soldering, thus saving on drive costs. Furthermore, after a certain period of use, there is no need to inspect or replace the servo motor in the solder wire feeding drive component and the conveying device, allowing for continuous use and eliminating the need for maintenance. This results in cost savings and increased efficiency during use.

[0024] 2. The welding wire is wound on the storage rod. When the electric telescopic joint descends, the ratchet plate at the end of the guide shaft will be limited by the limiting spring. At this time, the storage shaft will not rotate, and the welding wire will be clamped through the gap between the solder pen and the guide shaft. The welding wire will be pulled downward by friction. When the welding wire is pulled downward, the limiting spring will not be limited by the ratchet groove, and the limiting wheel can rotate, thereby pulling the welding wire out of the storage shaft. At the same time as descent, the solder head will press down on the pulled-out welding wire, thus completing the welding process. The wire is pressed onto the pin on the circuit board for soldering. After soldering, when the electric telescopic joint retracts upward, the ratchet plate is no longer limited by the limiting spring. At this time, the guide shaft can rotate due to the friction with the solder wire, and the gap between it and the solder pen bends the solder wire so that the solder wire is facing the direction of the solder head. This makes it easier to press the solder wire onto the circuit board when the solder head descends, thus achieving the effect of automatic solder wire loading. This also ensures that the solder wire is always under the solder head, making it convenient to directly perform the soldering work and saving the cost of loading solder wire. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of this embodiment;

[0026] Figure 2 This is a schematic diagram of the internal structure of the bearing plate in this embodiment;

[0027] Figure 3 This is an enlarged schematic diagram of structure A in this embodiment;

[0028] Figure 4 This is a schematic diagram of the external structure of this embodiment;

[0029] Figure 5 This is an enlarged structural diagram of section B in this embodiment;

[0030] Figure 6 This is a schematic diagram of the conveying component structure in this embodiment.

[0031] In the diagram, 1. Bearing plate; 2. Support platform; 3. Bearing frame; 4. Groove; 5. Support shaft; 6. Conveyor belt; 7. Soldering assembly; 701. Electric telescopic joint; 702. Solder pen; 703. Solder tip; 704. Solder wire loading assembly; 705. Clamping plate; 706. Storage rod; 707. Solder wire; 708. Ratchet groove; 709. Limiting wheel; 710. Limiting spring; 711. Mounting plate; 712. Mounting groove; 713. Guide shaft; 714. Limiting groove; 715. Ratchet piece; 716. Limiting wheel; 717. Limiting spring; 8. Conveying assembly; 801. Transmission gear rack; 802. Transmission gear; 803. Annular groove; 804. Drive gear rack; 805. Ratchet side teeth; 806. Drive rod; 807. Drive spring. Detailed Implementation

[0032] The present invention will be further described in detail below with reference to the accompanying drawings. Example

[0033] Reference Figure 1-6 This invention discloses an automatic soldering device for circuit board pins, comprising a carrier plate 1, a support platform 2, and a carrier frame 3. The support platform 2 is installed on the side of the carrier plate 1, and the carrier frame 3 is installed on the top side of the support platform 2. A groove 4 is formed on the top side of the carrier plate 1, and support shafts 5 are symmetrically and rotatably installed in the groove 4. A conveyor belt 6 is connected between the two support shafts 5. A gap is left between one side of the conveyor belt 6 and the inner wall of the groove 4. A soldering component 7 is provided on the top side of the carrier frame 3, and a conveying component 8 is installed on the inner side of the carrier frame 3 through the soldering component 7.

[0034] In this embodiment, when in use, the circuit board is placed on the conveyor belt 6, and the electronic components to be installed are placed on the circuit board with the pins aligned with the connection points on the circuit board. At this time, the first circuit board is placed directly below the soldering component 7, and the remaining circuit boards are arranged in sequence. The soldering component 7 is then activated. After the first circuit board is soldered by the soldering component 7, it returns to its original position. At the same time as returning to its original position, the subsequent circuit boards will be conveyed forward by the set conveyor component 8. After conveying, the soldering component 7 is activated again, and this process is repeated.

[0035] In use, this invention employs a soldering component 7 for soldering and simultaneously feeds the solder wire 707. This allows the solder wire 707 to be directly pulled out and positioned during soldering. The soldering component 7 then applies solder to the circuit board and electronic components. After soldering, the conveyor belt 6 automatically moves forward, eliminating the need for separate control of the solder wire feeding and conveying devices, thus saving on drive costs. Furthermore, after a certain period of use, the drive component for feeding the solder wire 707 and the servo motor in the conveying device do not require maintenance or replacement, allowing for continuous use and eliminating the need for repairs. This results in cost savings and increased efficiency.

[0036] Reference Figure 1-4 The soldering assembly 7 includes several electric telescopic joints 701. The electric telescopic joints 701 are installed on the top side inside the support frame 3. The output end of the electric telescopic joint 701 faces downward and is equipped with a solder pen 702. The bottom end of the solder pen 702 is equipped with a solder head 703, wherein the solder head 703 is inclined. A solder wire loading assembly 704 is provided between the support frame 3 and the solder pen 702.

[0037] In this embodiment, when in use, the electric telescopic joint 701 is activated, which drives the solder pen 702 and solder head 703 to move downward, so that the solder head 703 can perform the soldering work. At the same time, when in use, the extension and retraction of the electric telescopic joint 701 drives the solder wire 707 assembly to pull down the solder wire 707, and then the solder head 703 presses the solder wire 707 onto the part that needs to be soldered, so as to achieve the effect of automatically loading the solder wire 707.

[0038] Reference Figure 1-5 The welding wire loading assembly 704 includes a clamping plate 705, which is installed on the side of the support frame 3. A storage rod 706 is rotatably mounted inside the clamping plate 705, and welding wire 707 is wound on the storage rod 706. A ratchet groove 708 is provided on one side of the clamping plate 705. A limiting wheel 709 is provided at the end of the storage rod 706, and the limiting wheel 709 extends into the ratchet groove 708. A limiting spring piece 710 matching the ratchet groove 708 is fixedly installed on the arc side of the limiting wheel 709. A mounting plate 711 is fixedly connected to the bottom of the arc side of the solder pen 702. A mounting groove 712 is provided on the bottom side, and a guide shaft 713 is rotatably mounted in the mounting groove 712. A gap is left between the guide shaft 713 and the solder pen 702. The solder wire 707 passes through the guide shaft 713 and the solder pen 702 and extends to the bottom side of the solder head 703. A limiting groove 714 is provided on one side of the interior of the mounting groove 712. The limiting groove 714 is circular. A number of ratchet plates 715 are mounted on the circular side of the end of the guide shaft 713. A limiting wheel 716 is fixedly mounted in the limiting groove 714. A limiting spring 717 is fixedly mounted on the outside of the limiting wheel 716.

[0039] In this embodiment, the solder wire 707 is wound around the storage rod 706. When the electric telescopic joint 701 descends, the ratchet plate 715 at the end of the guide shaft 713 will be limited by the limiting spring plate 717. At this time, the storage shaft will not rotate, and the solder wire 707 will be clamped by the gap between the solder pen 702 and the guide shaft 713. The solder wire 707 will be pulled downward by friction. When the solder wire 707 is pulled downward, the limiting spring plate 710 will not be limited by the ratchet groove 708. Similarly, the limiting wheel 709 can rotate, thereby pulling out the solder wire 707 on the storage shaft. At the same time as descending, the solder head 703 presses down on the pulled-out solder wire 707. This presses the solder wire 707 onto the pins on the circuit board for soldering. When the soldering is complete and the electric telescopic joint 701 retracts upward, the ratchet plate 715 is no longer limited by the limiting spring 717. At this time, the guide shaft 713 can rotate due to the friction with the solder wire 707, and the gap between it and the solder pen 702 bends the solder wire 707 so that the solder wire 707 faces the solder head 703. This makes it easier to press the solder wire 707 onto the circuit board when the solder head 703 descends, thus achieving the effect of automatic solder wire loading. This also ensures that the solder wire 707 is always below the solder head 703, making it convenient to directly perform the soldering work and saving the cost of loading the solder wire 707.

[0040] Reference Figure 4-6 The conveying assembly 8 includes a drive gear rack 801, which is sleeved on the outer side of the conveyor belt 6. A drive gear 802 that meshes with the drive gear rack 801 is rotatably mounted on the inner side of the support frame 3. An annular groove 803 is formed on the side of the drive gear 802. A drive gear rack 804 is rotatably mounted in the annular groove 803. A ratchet tooth 805 is mounted on the inner side of the drive gear rack 804. A drive rod 806 is mounted on the arc side of the solder pen 702 near the ratchet tooth 805. The drive rod 806 extends to the side of the drive gear rack 804. A drive spring 807 is fixedly mounted at the end of the drive rod 806. The drive spring 807 extends to the inner side of the ratchet tooth 805.

[0041] In this embodiment, when the electric telescopic joint 701 moves upward after tinning, the drive rod 806 will drive the drive spring 807 to move upward, which in turn drives the drive gear rack 804 to rotate through the ratchet side teeth 805. When the drive gear rack 804 rotates, it will drive the window gear to rotate, which in turn drives the transmission gear rack 801 to rotate, causing the conveyor belt 6 to rotate and transport the circuit board behind it forward. This eliminates the need for the servo motor drive step and saves on transportation costs. When the electric telescopic joint 701 descends, the drive spring 807 will not drive the drive gear rack 804 to rotate, which facilitates the tinning work.

[0042] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. An automatic soldering device for circuit board pins, comprising a carrier plate (1), a support platform (2), and a carrier frame (3), characterized in that: The support platform (2) is installed on the side of the bearing plate (1), the bearing frame (3) is installed on the top side of the support platform (2), the top side of the bearing plate (1) is provided with a groove (4), the support shaft (5) is symmetrically rotated and installed in the groove (4), the two support shafts (5) are connected by a conveyor belt (6), one side of the conveyor belt (6) is left with a gap between it and the inner wall of the groove (4), the top side of the bearing frame (3) is provided with a soldering component (7), and the inner side of the bearing frame (3) is provided with a conveying component (8) through the soldering component (7). The soldering assembly (7) includes several electric telescopic joints (701). The electric telescopic joints (701) are installed on the top side inside the support frame (3). The output end of the electric telescopic joint (701) faces downward and is equipped with a solder pen (702). The bottom end of the solder pen (702) is equipped with a solder head (703). The solder head (703) is inclined. A solder wire loading assembly (704) is provided between the support frame (3) and the solder pen (702). The welding wire loading assembly (704) includes a clamping plate (705), which is installed on the side of the support frame (3). A storage rod (706) is rotatably installed inside the clamping plate (705), and welding wire (707) is wound on the storage rod (706). The conveying assembly (8) includes a transmission gear rack (801), which is sleeved on the outer side of the conveyor belt (6). A transmission gear (802) that meshes with the transmission gear rack (801) is rotatably mounted on the inner side of the support frame (3). An annular groove (803) is provided on the side of the transmission gear (802), and a drive gear rack (804) is rotatably mounted in the annular groove (803). A ratchet groove (708) is provided on one side of the clamping plate (705), and a limiting wheel (709) is provided at the end of the receiving rod (706). The limiting wheel (709) extends into the ratchet groove (708), and a limiting spring (710) matching the ratchet groove (708) is fixedly installed on the arc side of the limiting wheel (709). The bottom of the arc side of the solder pen (702) is fixedly connected to the mounting plate (711). The bottom side of the mounting plate (711) is provided with a mounting groove (712). A guide shaft (713) is rotatably installed in the mounting groove (712). A gap is left between the guide shaft (713) and the solder pen (702). The solder wire (707) passes through the guide shaft (713) and the solder pen (702) and extends to the bottom side of the solder head (703). A limiting groove (714) is provided on one side of the mounting groove (712). The limiting groove (714) is circular. A number of ratchet plates (715) are installed on the end side of the guide shaft (713) in a circular shape. A limiting wheel (716) is fixedly installed in the limiting groove (714). A limiting spring plate (717) is fixedly installed on the outside of the limiting wheel (716). A ratchet tooth (805) is installed on the inner side of the drive gear rack (804), and a drive rod (806) is installed on the arc side of the solder pen (702) near the ratchet tooth (805). The drive rod (806) extends to the side of the drive gear rack (804), and a drive spring (807) is fixedly installed at the end of the drive rod (806). The drive spring (807) extends to the inner side of the ratchet tooth (805).

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