A surface treatment apparatus for integrated circuit manufacturing

Abstract

The application provides a surface treatment device for integrated circuit manufacturing, and belongs to the technical field of integrated circuit manufacturing, and comprises a base, a gas collecting shell, a waste box, a gas pump, a temperature regulator and a gas collecting box. The application solves the problem that the existing surface treatment device for integrated circuit manufacturing cannot centrally process the waste material swept from the surface of the integrated plate during surface treatment of the integrated plate, so that the waste material is scattered around the device, which easily causes the working environment to be unclean, and the device cannot dissipate the heat energy generated by the integrated plate and the polishing head during polishing, and the accumulated heat energy can cause damage to the integrated plate and the polishing head, thereby increasing the maintenance cost of the device.

Description

Technical field:

[0001] The present invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a surface treatment device for integrated circuit manufacturing. Background technology:

[0002] With the development of science and technology and the continuous updating of electronic equipment, the requirements of the electronics industry for integrated circuit boards are gradually increasing, making integrated circuit boards develop in the direction of high precision, high density, high reliability, low cost and small size. At the same time, there are certain requirements for the surface treatment of integrated circuit boards. In the process of manufacturing integrated circuits, scientific researchers usually polish and clean the surface of the integrated circuit in order to improve the performance of the integrated circuit.

[0003] Prior art CN215314124U discloses a surface treatment device for integrated circuit board processing, comprising a cleaning mechanism, a limiting mechanism, and a frame. The cleaning mechanism is located near the top of the frame's inner cavity, the limiting mechanism is located at the bottom of the cleaning mechanism, and the limiting mechanisms are located at the front and rear sides of the frame's inner cavity. The frame has a feed port on the left side and a discharge port on the right side. Both sides of the frame's inner cavity are fixedly connected to horizontal plates. When surface treating an integrated circuit board, this device does not centrally process waste material removed from the board's surface, causing it to scatter near the device, potentially leading to an unclean working environment. Furthermore, the device is unable to dissipate the heat energy generated by the board and the grinding head during the grinding process. The accumulated heat energy can damage the board and the grinding head, increasing the maintenance cost of the device. Summary of the invention:

[0004] The present invention provides a surface treatment device for integrated circuit manufacturing, which aims to solve the problem that the existing surface treatment device for integrated circuit manufacturing does not centrally treat the waste materials swept from the surface of the integrated board when performing surface treatment on the integrated board, so that the waste materials are scattered near the device, which easily leads to an unclean working environment. In addition, the device is unable to dissipate the heat energy generated by the integrated board and the grinding head during the grinding process. The accumulated heat energy will damage the integrated board and the grinding head, thereby increasing the maintenance cost of the device.

[0005] An embodiment of the present invention provides a surface treatment device for integrated circuit manufacturing, comprising a base, a gas collecting shell, a waste discharge box, an air pump, a thermostat, and a gas collecting box;

[0006] A receiving cavity is reserved on the base;

[0007] The lower wall of the gas collecting shell is fixedly connected to the upper wall of the base, the gas collecting shell is located outside the accommodating cavity, and an air inlet is reserved on the side wall of the gas collecting shell farther from the accommodating cavity;

[0008] The waste discharge box is located on the base, and the side wall of the gas collecting shell farther from the accommodating chamber is fixedly connected to the waste discharge box. A screening element is fixedly connected inside the waste discharge box, and the screening element is a plate with a plurality of small circular holes penetrating at both ends reserved on the surface. One end of the screening element adjacent to the gas collecting shell is fixedly connected to the upper wall of the waste discharge box, and the other end of the screening element farther from the gas collecting shell is fixedly connected to the lower left wall of the waste discharge box. A waste discharge hole is reserved on the base, and the waste discharge hole is located below the waste discharge box. A sealing plug is movably installed inside the waste discharge hole.

[0009] The lower wall of the air pump is fixedly connected to the base, and the air pump is connected to a conveying channel 1 and a conveying channel 2, and the end of the conveying channel 1 farther from the air pump is connected to the waste discharge box;

[0010] The lower wall of the thermostat is fixedly connected to the base, the air pump is located on the left side of the thermostat, a temperature regulating unit is installed on the side wall of the thermostat, and the side of the temperature regulating unit for lowering the temperature faces the inside of the thermostat, and the two side walls of the thermostat are respectively connected to the delivery channel three and the delivery channel four, the end of the delivery channel two farther from the air pump is connected to the delivery channel three, the end of the delivery channel three extending into the thermostat is connected to the delivery channel five, and the other end of the delivery channel five is connected to the delivery channel four, and the delivery channel five is evenly laid on the lower wall surface inside the thermostat;

[0011] The gas collecting box is located on the base, the accommodating cavity is located on the left side of the gas collecting box, an air outlet is reserved on the side wall of the gas collecting box adjacent to the accommodating cavity, the air outlet is connected to the inner part of the gas collecting box, the side wall of the gas collecting box adjacent to the thermostat is connected to a conveying channel six, and the other end of the conveying channel six is ​​connected to the conveying channel four.

[0012] Furthermore, two pairs of clamping plates are screwed onto the base, and the two pairs of clamping plates are arranged in mirror images about the center of the accommodating cavity.

[0013] Furthermore, the side of the sealing plug farther from the waste discharge hole is fixedly connected to a support plate, a pair of suction cups 1 are fixedly connected to the bottom wall of the base, the pair of suction cups 1 are arranged with respect to the central mirror image of the waste discharge hole, a socket is reserved on the support plate, the opening of the socket faces the suction cup 1, and a suction cup 2 is fixedly connected to the lower wall of the socket.

[0014] Furthermore, a cylinder is movably mounted on the upper wall of the waste box, the upper wall of the cylinder is fixedly connected to the handle, the lower wall of the cylinder is fixedly connected to the prism, a rotating column is screwed into the air inlet, and a stirring leaf is fixedly connected to the rotating column, and the size of the stirring leaf is adapted to the air inlet.

[0015] Furthermore, a support bracket is fixedly connected to the side wall of the thermostat, the thermostat unit is located inside the support bracket, the side of the thermostat unit for lowering the temperature faces the inside of the thermostat, the thermostat unit is fixedly connected to a conductive sheet one, a side of the thermostat unit for lowering the temperature is provided with a conductive sheet two, the conductive sheet two and the thermostat unit are fixedly connected via the conductive sheet one, a side of the thermostat unit for increasing the temperature is provided with a conductive sheet three, the conductive sheet three and the thermostat unit are fixedly connected via the conductive sheet one.

[0016] Furthermore, the conductive sheet three is fixedly connected to the conductive sheet four on a side farther from the thermostat, and the conductive sheets four are evenly distributed on the conductive sheet three.

[0017] Furthermore, the conveying channel six is ​​made of PVC, the gas collecting box is movably mounted on the base, the upper wall of the base is fixedly connected to the long rail, the gas collecting box is located on the left side of the long rail, and the side of the gas collecting box farther from the accommodating cavity is fixedly connected to the sleeve, and the sleeve is movably mounted on the long rail.

[0018] The beneficial effects of the present invention are:

[0019] 1. The present invention adopts the setting of a waste discharge box and uses an air pump to transfer the waste appearing on the surface of the polished integrated board into the waste discharge box through the air inlet on the air collecting shell, so as to remove and collect the polishing waste from the integrated board. The screening element is helpful in screening out the waste. The screening element is fixedly connected to the waste discharge box in a shape of lower left and higher right, so as to increase the contact range between the screening element and the waste in the waste discharge box, thereby improving the efficiency of screening the waste.

[0020] 2. The present invention uses an air collecting shell and an air pump to screen and polish the waste generated by the integrated board. When the gas carrying the waste passes through the air inlet, it touches the stirring blades and the rotating column, causing them to swirl, disrupting the motion of the airflow. The airflow collides with the prism, and the prism moves upward under its influence. When the airflow is interrupted, the prism automatically moves downward. In this case, the prism moves back and forth and collides with the screening element to prevent the sieve holes of the screening element from being blocked and affecting the efficiency of screening out the waste.

[0021] 3. The present invention is provided with a thermostat and a gas collecting box, and the sleeve is movably installed on the long rail so that the gas collecting box can be moved along the long rail so that the air outlet is directed to different polishing points on the integrated board, and the gas that has screened out the waste is discharged into the conveying channel 2, conveying channel 3, conveying channel 5, and conveying channel 4. The thermostat is filled with coolant, and the thermostat unit and the conductive plate 2 are used to lower the temperature of the coolant in the thermostat, so that the temperature of the gas discharged into the conveying channel 5 is also lowered, and the heat energy of the conductive plate 3 is dissipated through the conductive plate 4, thereby ensuring the operation of the thermostat unit. The gas leaving the thermostat is discharged into the conveying channel 6 and then moves to the gas collecting box, and then moves out from the air outlet toward the accommodating cavity, thereby lowering the temperature of the surface of the integrated board being polished and the polishing head, which is beneficial to protecting the integrated board and the polishing head and extending the service life of the device.

[0022] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the structures particularly pointed out in the description and the drawings. Description of the drawings:

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 Schematic diagram of the overall structure of an embodiment of the present invention;

[0025] Figure 2 Schematic diagram of a top view of the structure of an embodiment of the present invention;

[0026] Figure 3 This is a schematic structural diagram of a stirring blade in an embodiment of the present invention;

[0027] Figure 4 Schematic diagram of the structure of the thermostat in an embodiment of the present invention;

[0028] Figure 5 Schematic diagram of the structure of the gas collecting shell and the waste discharge box in an embodiment of the present invention;

[0029] Figure 6 Schematic diagram of the structure of the support frame in an embodiment of the present invention.

[0030] Reference numerals: 101, base; 111, accommodating chamber; 113, clamping plate; 102, gas collecting shell; 121, air inlet; 103, waste discharge box; 131, screening element; 132, waste discharge hole; 133, sealing plug; 134, supporting plate; 135, suction cup 1; 136, socket; 137, suction cup 2; 138, cylinder; 139, handle; 1310, prism; 1311, rotating column; 1312, stirring blade; 104, air filter; Pump; 141. Delivery channel one; 142. Delivery channel two; 105. Thermostat; 151. Temperature control unit; 152. Delivery channel three; 153. Delivery channel four; 154. Delivery channel five; 155. Support bracket; 156. Conductive plate one; 157. Conductive plate two; 158. Conductive plate three; 159. Conductive plate four; 106. Gas collecting box; 161. Air outlet; 162. Delivery channel six; 163. Long rail; 164. Sleeve. Specific implementation method:

[0031] In order to make the purpose, technical solution and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of specific embodiments of the present invention. The same figure marks in the drawings represent the same components. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Reference Figure 1-6 , an embodiment of the present invention provides a surface treatment device for integrated circuit manufacturing, comprising a base 101, a gas collecting shell 102, a waste discharge box 103, an air pump 104, a thermostat 105 and a gas collecting box 106;

[0033] A receiving cavity 111 is reserved on the base 101;

[0034] The lower wall of the gas collecting shell 102 is fixedly connected to the upper wall of the base 101. The gas collecting shell 102 is located outside the accommodating cavity 111. An air inlet 121 is reserved on the side wall of the gas collecting shell 102 farther from the accommodating cavity 111.

[0035] The waste box 103 is located on the base 101. The side wall of the gas collecting shell 102 farther from the accommodating chamber 111 is fixedly connected to the waste box 103. A screening member 131 is fixedly connected inside the waste box 103. The screening member 131 is a plate with a plurality of small circular holes on its surface that pass through both ends. The screening member 131 is used to screen out waste materials in the conveying gas. One end of the screening member 131 adjacent to the gas collecting shell 102 is fixedly connected to the upper wall of the waste box 103, and the other end of the screening member 131 farther from the gas collecting shell 102 is fixedly connected to the lower left wall of the waste box 103. A waste discharge hole 132 is reserved on the base 101. The waste discharge hole 132 is located below the waste box 103. A sealing plug 133 is movably installed inside the waste discharge hole 132.

[0036] The lower wall of the air pump 104 is fixedly connected to the base 101. The air pump 104 is connected to the delivery channel 141 and the delivery channel 2 142. The delivery channel 1 141 is connected to the waste box 103 at the end farther from the air pump 104.

[0037] The lower wall of the thermostat 105 is fixedly connected to the base 101. The air pump 104 is located on the left side of the thermostat 105. A thermostat unit 151 is installed on the side wall of the thermostat 105. The thermostat unit 151 is a heat pump that utilizes the Peltier effect. When direct current passes through a galvanic couple in the thermostat unit 151, which is made of two different materials (the electrical conductivity of the materials at room temperature is between that of a conductor and an insulator) connected in series, energy transfer occurs, forming a cold end and a hot end at both ends of the galvanic couple, thereby achieving the effect of adjusting the temperature. The thermostat unit The side of element 151 used for lowering the temperature faces the inside of the thermostat 105. The two side walls of the thermostat 105 are respectively connected to the delivery channel 3 152 and the delivery channel 4 153. The end of the delivery channel 2 142 farther from the air pump 104 is connected to the delivery channel 3 152. The end of the delivery channel 3 152 extending into the thermostat 105 is connected to the delivery channel 5 154. The other end of the delivery channel 5 154 is connected to the delivery channel 4 153. The delivery channel 5 154 is evenly laid on the lower wall surface inside the thermostat 105.

[0038] The gas collecting box 106 is located on the base 101, and the accommodating cavity 111 is located on the left side of the gas collecting box 106. An air outlet 161 is reserved on the side wall of the gas collecting box 106 adjacent to the accommodating cavity 111. The air outlet 161 is connected to the inner part of the gas collecting box 106. The side wall of the gas collecting box 106 adjacent to the thermostat 105 is connected to a conveying channel six 162, and the other end of the conveying channel six 162 is connected to the conveying channel four 153.

[0039] Two pairs of clamping pieces 113 are screwed onto the base 101 , and the two pairs of clamping pieces 113 are arranged in a mirror image with respect to the center of the accommodating cavity 111 .

[0040] The side of the sealing plug 133 farther from the waste discharge hole 132 is fixedly connected to a support plate 134. A pair of suction cups 135 are fixedly connected to the bottom wall of the base 101. The pair of suction cups 135 are arranged in the mirror image of the center of the waste discharge hole 132. A socket 136 is reserved on the support plate 134. The opening of the socket 136 faces the suction cup 135. The lower wall of the socket 136 is fixedly connected to the suction cup 1 135.

[0041] A cylinder 138 is movably mounted on the upper wall of the waste box 103, the upper wall of the cylinder 138 is fixedly connected to the handle 139, the lower wall of the cylinder 138 is fixedly connected to the prism 1310, a rotating column 1311 is screwed into the air inlet 121, and a stirring paddle 1312 is fixedly connected to the rotating column 1311, and the size of the stirring paddle 1312 is adapted to the air inlet 121.

[0042] A support bracket 155 is fixedly connected to the side wall of the thermostat 105, and the thermostat unit 151 is located inside the support bracket 155. The side of the thermostat unit 151 used for lowering the temperature faces the inside of the thermostat 105. A conductive plate 156 is fixedly connected to the thermostat unit 151. A conductive plate 2 157 is installed on the side of the thermostat unit 151 used for lowering the temperature. The conductive plate 2 157 and the thermostat unit 151 are fixedly connected via the conductive plate 156. A conductive plate 3 158 is installed on the side of the thermostat unit 151 used for increasing the temperature. The conductive plate 3 158 and the thermostat unit 151 are fixedly connected via the conductive plate 156.

[0043] The conductive sheet 3 158 is fixedly connected to the conductive sheet 4 159 on the side farther from the thermostat 105 , and the conductive sheet 4 159 is evenly spaced on the conductive sheet 3 158 .

[0044] Conveying channel six 162 is made of PVC, and the gas collecting box 106 can be movably installed on the base 101. The upper wall of the base 101 is fixedly connected to the long rail 163. The gas collecting box 106 is located on the left side of the long rail 163. The side of the gas collecting box 106 farther from the accommodating chamber 111 is fixedly connected to the sleeve 164, and the sleeve 164 can be movably installed on the long rail 163.

[0045] The specific implementation method is: when working, first place the integrated board in the accommodating cavity 111, then rotate the clamping piece 113 to correspond to the upper wall surface of the integrated board, reinforce the integrated board in the accommodating cavity 111 through the clamping piece 113, and then polish the surface of the integrated board.

[0046] When polishing the surface of the integrated board, the electrically connected air pump 104 and the temperature control unit 151 are turned on, and the waste generated by polishing the surface of the integrated board is transferred to the waste discharge box 103 through the air inlet 121 on the gas collecting shell 102. The screening element 131 screens out the waste, and the waste moves downward, and the gas that has screened out the waste is discharged into the conveying channel 141.

[0047] The screening element 131 is fixedly connected to the waste discharge box 103 in a shape of lower left and higher right, which can increase the contact range between the screening element 131 and the waste in the waste discharge box 103. When screening, the gas carrying the waste passes through the air inlet 121, touches the stirring blade 1312 and the rotating column 1311, and makes it rotate, disrupting the movement state of the airflow. The airflow collides with the prism 1310, and the prism 1310 moves upward under its influence. When the airflow is interrupted, the prism 1310 automatically moves downward. In this case, the prism 1310 reciprocates up and down and collides with the screening element 131 to prevent the sieve holes of the screening element 131 from being blocked and affecting the efficiency of screening out the waste.

[0048] The sealing plug 133 is moved downward, and the waste in the waste box 103 is moved out of the waste box 103 through the waste hole 132. Then, the sealing plug 133 is moved back into the waste hole 132, and the suction cup 135 and the suction cup 2 137 are abutted against each other so that the sealing plug 133 can seal the waste hole 132.

[0049] The gas that has filtered out the waste is discharged into the second conveying channel 142, the third conveying channel 152, the fifth conveying channel 154, and the fourth conveying channel 153. The thermostat 105 is filled with coolant. The temperature of the coolant in the thermostat 105 is lowered by the temperature regulating unit 151 and the second conductive plate 157, and the temperature of the gas discharged from the fifth conveying channel 154 is also lowered accordingly.

[0050] The heat energy of the conductive plate 3 158 is dissipated through the conductive plate 4 159 , thereby ensuring the operation of the temperature adjustment unit 151 .

[0051] The gas from the thermostat 105 is discharged into the delivery channel 6 162 and then moves to the gas collecting box 106, and then moves out from the gas outlet 161 toward the accommodating chamber 111, thereby lowering the temperature of the surface of the integrated circuit board being polished and the polishing head.

[0052] The sleeve 164 is movably mounted on the long rail 163 so that the gas collecting box 106 can be moved along the long rail 163 so that the gas outlet 161 faces different grinding points on the integrated board.

[0053] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A surface treatment device for integrated circuit manufacturing, characterized in that: It comprises a base (101), a gas collecting shell (102), a waste discharge box (103), an air pump (104), a thermostat (105) and a gas collecting box (106); A receiving cavity (111) is reserved on the base (101); The lower wall of the gas collecting shell (102) and the upper wall of the base (101) are fixedly connected, the gas collecting shell (102) is located outside the accommodating cavity (111), and an air inlet (121) is reserved on the gas collecting shell (102); The waste discharge box (103) is located on the base (101), the gas collecting shell (102) is fixedly connected to the waste discharge box (103), and a screening element (131) is fixedly connected inside the waste discharge box (103). The screening element (131) is a plate with a plurality of small circular holes on its surface and two through holes. One end of the screening element (131) is fixedly connected to the upper wall of the waste discharge box (103), and the other end of the screening element (131) is fixedly connected to the lower left wall of the waste discharge box (103). A waste discharge hole (132) is reserved on the base (101), and the waste discharge hole (132) is located below the waste discharge box (103). A sealing plug (133) is movably installed inside the waste discharge hole (132). The lower wall of the air pump (104) is fixedly connected to the base (101), the air pump (104) is connected to a conveying channel 1 (141) and a conveying channel 2 (142), and the conveying channel 1 (141) is connected to the waste discharge box (103); The lower wall of the thermostat (105) is fixedly connected to the base (101), the air pump (104) is located on the left side of the thermostat (105), a thermostat unit (151) is installed on the side wall of the thermostat (105), the side of the thermostat unit (151) for reducing the temperature faces the inside of the thermostat (105), and the two side walls of the thermostat (105) are respectively connected to the delivery channel three (152) and the delivery channel four (153), the delivery channel two (142) and the delivery channel three (152) are connected, the delivery channel three (152) extends into the thermostat (105) and is connected to the delivery channel five (154), the other end of the delivery channel five (154) is connected to the delivery channel four (153), and the delivery channel five (154) is evenly laid on the lower wall surface inside the thermostat (105); The gas collecting box (106) is located on the base (101), the accommodating cavity (111) is located on the left side of the gas collecting box (106), an air outlet (161) is reserved on the gas collecting box (106), the air outlet (161) is connected to the inner part of the gas collecting box (106), the gas collecting box (106) is connected to a conveying channel six (162), and the other end of the conveying channel six (162) is connected to the conveying channel four (153); A cylinder (138) is movably mounted on the upper wall of the waste discharge box (103), the upper wall of the cylinder (138) is fixedly connected to a handle (139), the lower wall of the cylinder (138) is fixedly connected to a prism (1310), a rotating column (1311) is screwed into the air inlet (121), and a stirring paddle (1312) is fixedly connected to the rotating column (1311), and the size of the stirring paddle (1312) is adapted to the air inlet (121).

2. The surface treatment device for integrated circuit manufacturing according to claim 1, characterized in that: Two pairs of clamping plates (113) are screwed onto the base (101), and the two pairs of clamping plates (113) are arranged in mirror images with respect to the center of the accommodating cavity (111).

3. The surface treatment device for integrated circuit manufacturing according to claim 1, characterized in that: The lower wall of the sealing plug (133) is fixedly connected to a support plate (134), and a pair of suction cups (135) are fixedly connected to the bottom wall of the base (101). The pair of suction cups (135) are arranged in a mirror image with respect to the center of the waste discharge hole (132). A socket (136) is reserved on the support plate (134), and the opening of the socket (136) faces the suction cup (135). The lower wall of the socket (136) is fixedly connected to a suction cup (137).

4. The surface treatment device for integrated circuit manufacturing according to claim 1, characterized in that: The side wall of the thermostat (105) is fixedly connected to a support bracket (155), the thermostat unit (151) is located inside the support bracket (155), the side of the thermostat unit (151) for reducing the temperature faces the inside of the thermostat (105), the thermostat unit (151) is fixedly connected to a first conductive plate (156), the side of the thermostat unit (151) for reducing the temperature is provided with a second conductive plate (157), the second conductive plate (157) and the thermostat unit (151) are fixedly connected via the first conductive plate (156), the side of the thermostat unit (151) for increasing the temperature is provided with a third conductive plate (158), the third conductive plate (158) and the thermostat unit (151) are fixedly connected via the first conductive plate (156).

5. The surface treatment device for integrated circuit manufacturing according to claim 4, characterized in that: The conductive sheet three (158) is fixedly connected to the conductive sheet four (159), and the conductive sheet four (159) is equidistantly distributed on the conductive sheet three (158).

6. The surface treatment device for integrated circuit manufacturing according to claim 1, characterized in that: The conveying channel six (162) is made of PVC material. The gas collecting box (106) is movably mounted on the base (101). The upper wall of the base (101) is fixedly connected to the long rail (163). The gas collecting box (106) is located on the left side of the long rail (163). The gas collecting box (106) is fixedly connected to a sleeve (164). The sleeve (164) is movably mounted on the long rail (163).

Images