Die cutting method and die cutting apparatus

Abstract

The application discloses a die-cutting method and a die-cutting device. In the die-cuting method, the relative position between a first film material and a bottom supporting film is adjusted first, then the first film material is die-cut to make a first material block separate from the first film material and adhere to a first area of a first adhering area, then the relative position between a second film material and the bottom supporting film is adjusted, and then the second film material is die-cut to make a second material block separate from the second film material and adhere to a second area of the first adhering area. When the first film material and the second film material are die-cut, the position relationship between the bottom supporting film and the first film material and the position relationship between the bottom supporting film and the second film material are adjusted in real time, so that the first material block and the second material block can accurately adhere to the bottom supporting film. After the die-cut semi-product is formed by adhering on the bottom supporting film, the die-cut semi-product has higher precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die cutting, in particular to a die cutting method and a die cutting device. BACKGROUND

[0002] Part of the die cutting semi-finished product has similar island blocks and dispersed pull-tab glue.

[0003] In related technologies, when processing such die cutting semi-finished products, various pull-tab glues are first die cut, and multiple pull-tab glues of the same type are arranged at a preset distance, and then the various pull-tab glues are attached to the main material to form multiple die cutting semi-finished products on the main material.

[0004] Correspondingly, since there are errors in arranging multiple pull-tab glues of the same type, and there are also attachment errors in attaching various pull-tab glues to the main material, these errors gradually accumulate, resulting in low precision of the subsequently formed die cutting semi-finished products. SUMMARY

[0005] The present application aims to at least solve one of the technical problems in the prior art, and the first aspect of the present application provides a die cutting method, which has higher precision of the die cutting semi-finished products processed by the die cutting method. The second aspect of the present application provides a die cutting device capable of implementing the die cutting method of the first aspect of the present application.

[0006] The die cutting method provided by the first aspect of the present application is used for attaching die cutting semi-finished products to a backing film, the area of the backing film where the die cutting semi-finished products are attached is an attachment area, the die cutting semi-finished product includes a first material block from a first film material and a second material block from a second film material, and the die cutting method includes the following steps:

[0007] Adjusting the relative position between the first film material and the backing film so that the first material block of the first film material is opposite to a first area of the first attachment area;

[0008] Die cutting the first film material so that the first material block is separated from the first film material and is attached to the first area of the first attachment area;

[0009] Adjusting the relative position between the second film material and the backing film so that the second material block of the second film material is opposite to a second area of the first attachment area;

[0010] Die cutting the second film material so that the second material block is separated from the second film material and is attached to the second area of the first attachment area, and the first material block and the second material block jointly form the die cutting semi-finished product;

[0011] According to the above steps, multiple die cutting semi-finished products are sequentially attached and formed on the backing film.

[0012] The die cutting method has at least the following beneficial effects: the relative position between the first film material and the backing film is first adjusted so that the first material block of the first film material is directly opposite the first region of the first bonding area, then the first film material is die cut so that the first material block is separated from the first film material and bonded to the first region of the first bonding area, then the relative position between the second film material and the backing film is adjusted so that the second material block of the second film material is directly opposite the second region of the first bonding area, and then the second film material is die cut so that the second material block is separated from the second film material and bonded to the second region of the first bonding area. Since the position relationship between the first film material and the backing film is adjusted in real time when the first film material is die cut, the first material block can be accurately bonded to the backing film. Since the position relationship between the second film material and the backing film is adjusted in real time when the second film material is die cut, the second material block can be accurately bonded to the backing film. Therefore, the precision of the die cutting semi-finished product is higher after the die cutting semi-finished product is bonded on the backing film.

[0013] According to the die cutting method of the first aspect of the present application, the relative position between the first film material and the backing film is adjusted, including the following steps:

[0014] It is judged whether the first material block is the first material block on the first film material;

[0015] If the first material block has a third material block in front, the first film material is pulled to move backward until the distance between the first material block and the third material block is the same as the distance between the first bonding area and the second bonding area; wherein the third material block is bonded to the second bonding area.

[0016] According to the die cutting method of the first aspect of the present application, the first film material is pulled to move backward, including the following steps:

[0017] The first distance between the first material block and the third material block is obtained;

[0018] The second distance between the first bonding area and the second bonding area is obtained;

[0019] The third distance is obtained according to the first distance and the second distance, and the third distance is the difference between the second distance and the first distance;

[0020] The first film material is pulled to move backward by the third distance.

[0021] According to the die cutting method of the first aspect of the present application, the profiles of the material blocks on the first film material are the same, and each material block on the first film material includes a first side edge;

[0022] The first distance between the first material block and the third material block is obtained, including the following steps:

[0023] The first position information of the first side edge of the third material block is obtained;

[0024] acquiring second position information of the first side edge of the first material block;

[0025] acquiring a first distance according to the first position information and the second position information.

[0026] According to the die-cutting method of the first aspect of the present application, the relative position between the first film material and the backing film is adjusted, and the method further comprises the following steps:

[0027] If the first material block is the first material block on the first film material, the relative position between the first film material and the backing film is kept unchanged.

[0028] According to the die-cutting method of the first aspect of the present application, the relative position between the second film material and the backing film is adjusted, and the method comprises the following steps:

[0029] determining whether the second material block is the first material block on the second film material;

[0030] If the second material block has a fourth material block in front, the second film material is pulled to move backward until the distance between the second material block and the fourth material block is the same as the distance between the first bonding area and the second bonding area, wherein the fourth material block is bonded to the second bonding area.

[0031] According to the die-cutting method of the first aspect of the present application, the profiles of the material blocks on the second film material are the same, and each material block on the second film material comprises a second side edge.

[0032] The second film material is pulled to move backward, comprising the following steps:

[0033] acquiring third position information of the second side edge of the second material block;

[0034] acquiring fourth position information of the second side edge of the fourth material block;

[0035] acquiring a fourth distance between the second material block and the fourth material block according to the third position information and the fourth position information;

[0036] According to the fourth distance and the second distance between the first bonding area and the second bonding area, the second film material is pulled to move backward by a fifth distance, wherein the fifth distance is the difference between the second distance and the fourth distance.

[0037] According to the die-cutting method of the first aspect of the present application, the first material block and the second material block are separated by a preset distance in the same die-cutting semi-finished product.

[0038] The relative position between the second film material and the backing film is adjusted, and the method further comprises the following steps:

[0039] If the second material block is the first material block on the second film material, the second film material is pulled until the second material block is separated from the first material block in the first bonding area by a preset distance.

[0040] According to the die cutting method provided by the embodiment of the first aspect of the present application, the second film material is pulled, including the following steps:

[0041] Obtain the fifth position information of the second side edge of the second material block;

[0042] Obtain the sixth position information of the first side edge of the first material block in the first bonding area;

[0043] According to the fifth position information and the sixth position information, obtain the sixth distance between the first side edge of the first material block and the second side edge of the second material block;

[0044] According to the preset distance and the sixth distance, pull the second film material to move a seventh distance; wherein the seventh distance is the difference between the sixth distance and the preset distance.

[0045] According to the die cutting device provided by the embodiment of the second aspect of the present application, the die cutting method provided by the embodiment of the first aspect of the present application is implemented, and the die cutting device includes a first storage roller, a second storage roller, a third storage roller, a first die cutting roller group, a second die cutting roller group, a pulling assembly, a first sensor and a second sensor: the first storage roller is wound with a first film material; the second storage roller is wound with a second film material; the third storage roller is wound with a bottom film; the first die cutting roller group is arranged on the moving path of the first film material and the bottom film, and is used for die cutting the first film material to form a first material block and can bond the first material block on the bottom film; the second die cutting roller group is arranged on the moving path of the second film material and the bottom film, and is located at the rear side of the first die cutting roller group along the movement direction of the bottom film, and is used for die cutting the second film material to form a second material block and can bond the second material block on the bottom film; the pulling assembly is arranged on the moving path of both the first film material and the second film material, and can pull the first film material and the second film material respectively; the first sensor is electrically connected with the pulling assembly, and is arranged at the front side of the first die cutting roller group along the moving direction of the first film material, and is used for detecting the position of the first material block of the first film material; the second sensor is electrically connected with the pulling assembly, and is arranged at the front side of the second die cutting roller group along the moving direction of the second film material, and is used for detecting the position of the second material block of the second film material.

[0046] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0047] The present application will be further described below in conjunction with the drawings and embodiments.

[0048] Figure 1 Flowchart of the die-cutting method according to an embodiment of the present application;

[0049] Figure 2 Flowchart of adjusting the relative position between the first film and the backing film according to an embodiment of the present application;

[0050] Figure 3 Flowchart of pulling the first film to move backward according to an embodiment of the present application;

[0051] Figure 4 Flowchart of obtaining the first distance between the first material block and the third material block according to an embodiment of the present application;

[0052] Figure 5 Flowchart of adjusting the relative position between the second film and the backing film according to an embodiment of the present application;

[0053] Figure 6 Flowchart of pulling the second film to move backward according to an embodiment of the present application;

[0054] Figure 7 Flowchart of pulling the second film according to an embodiment of the present application;

[0055] Figure 8 Structural diagram of the die-cutting device according to an embodiment of the present application;

[0056] Figure 9 Structural diagram of the backing film carrying the die-cutting semi-finished product according to an embodiment of the present application.

[0057] Reference signs:

[0058] First storage roller 100; second storage roller 110; third storage roller 120; first die-cutting roller group 130; second die-cutting roller group 140; first sensor 150; second sensor 160;

[0059] Backing film 200; die-cutting semi-finished product 210; first material block 211; first side edge 211a; second material block 212; second side edge 212a;

[0060] First film 300;

[0061] Second film 400. DETAILED DESCRIPTION

[0062] The specific embodiments of the present application will be described in detail in this part, the preferred embodiments of the present application are shown in the drawings, the role of the drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the present application, but it cannot be understood as a limitation on the protection scope of the present application.

[0063] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0064] In the description of the present application, one or more is meant to be one or more, more than two is meant to be two or more, greater than, less than, more than, etc. are understood to not include the number, above, below, etc. are understood to include the number. If the first, second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0065] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood broadly, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical scheme.

[0066] The following refers to Figures 1 to 9 The die cutting method of the present application will be described in detail.

[0067] Reference is made to Figure 9 In some die cutting semi-finished products 210, a plurality of dispersed material blocks are included, which have a certain distance from each other, and the die cutting semi-finished products 210 need to be carried on the bottom supporting film 200, and the distance between adjacent die cutting semi-finished products 210 is certain.

[0068] The die cutting method and die cutting equipment of the present application will be described below with an example of two material blocks included in the die cutting semi-finished product 210.

[0069] Reference is made to Figure 1 According to the die cutting method of the present application, the following steps are included, but are not limited to:

[0070] Step S100: adjusting the relative position between the first film material 300 and the bottom supporting film 200, so that the first material block 211 of the first film material 300 is opposite to the first area of the first bonding area;

[0071] Step S200: die cutting the first film material 300 to separate the first material block 211 from the first film material 300 and adhere the first material block 211 to the first region of the first adhering area;

[0072] Step S300: adjusting the relative position between the second film material 400 and the backing film 200 to make the second material block 212 of the second film material 400 face the second region of the first adhering area;

[0073] Step S400: die cutting the second film material 400 to separate the second material block 212 from the second film material 400 and adhere the second material block 212 to the second region of the first adhering area, and the first material block 211 and the second material block 212 together form the die cut semi-finished product 210.

[0074] Step S500: sequentially adhering a plurality of die cut semi-finished products 210 on the backing film 200 according to the above steps.

[0075] It can be understood that the first film material 300 includes a plurality of material blocks connected in sequence, and the distance between adjacent adhering areas on the backing film 200 is constant and the same, the distance between adjacent material blocks on the first film material 300 is different from the distance between adjacent adhering areas on the backing film 200, and before the first material block 211 on the first film material 300 is die cut and adhered to the first region of the first adhering area, the relative position between the first film material 300 and the backing film 200 is adjusted so that the first material block 211 can be accurately adhered to the first region of the first adhering area; the second film material 400 includes a plurality of material blocks connected in sequence, and the distance between adjacent material blocks on the second film material 400 is different from the distance between adjacent adhering areas on the backing film 200, and before the second material block 212 on the second film material 400 is die cut and adhered to the second region of the first adhering area, the relative position between the second film material 400 and the backing film 200 is adjusted so that the second material block 212 can be accurately adhered to the second region. In the die cutting method of the present application, the relative position between the first film material 300 and the backing film 200 is adjusted before die cutting the first film material 300 each time, so that the material block on the first film material 300 can be accurately adhered to the adhering area of the backing film 200, and the relative position between the second film material 400 and the backing film 200 is adjusted before die cutting the second film material 400 each time, so that the material block on the second film material 400 can be accurately adhered to the adhering area of the backing film 200; further, after the die cut semi-finished product 210 is formed on the backing film 200, the precision of the die cut semi-finished product 210 is higher, and the distance between adjacent die cut semi-finished products 210 is consistent.

[0076] In some embodiments of the present application, with reference to Figure 2 , in step S100, the following steps are included but not limited to:

[0077] Step S110: judging whether the first material block 211 is the first material block on the first film material 300.

[0078] Step S120: if the first material block 211 has a third material block in front side, pulling the first film material 300 to move backward until the distance between the first material block 211 and the third material block is equal to the distance between the first bonding area and the second bonding area; wherein the third material block is bonded on the second bonding area.

[0079] It can be understood that the distance between two adjacent die-cut semi-finished products 210 on the backing film 200 is consistent and same, so the distance between two adjacent bonding areas on the backing film 200 is also the same and is the preset distance; the distance between two adjacent material blocks on the first film material 300 is less than the distance between two adjacent bonding areas on the backing film 200; when the first material block 211 has a third material block in front side, it means that the first material block 211 is not the first material block on the first film material 300, and the third material block is bonded on the second bonding area of the backing film 200, so when the first material block 211 is bonded on the first bonding area of the backing film 200, the distance between the first material block 211 and the third material block is equal to the distance between the first bonding area and the second bonding area, and by pulling the first film material 300 to move backward, the distance between the first material block 211 and the third material block is equal to the distance between the first bonding area and the second bonding area, so that the first material block 211 can be accurately bonded on the first bonding area.

[0080] Further, referring to Figure 3 , in step S120, the following steps are included but not limited to:

[0081] Step S121: obtaining a first distance between the first material block 211 and the third material block.

[0082] Step S122: obtaining a second distance between the first bonding area and the second bonding area.

[0083] Step S123: obtaining a third distance according to the first distance and the second distance, the third distance is the difference between the second distance and the first distance.

[0084] Step S124: pulling the first film material 300 to move backward by the third distance.

[0085] It can be understood that the distance between any two adjacent bonding areas on the backing film 200 is certain and equal, that is, the distance between any two adjacent bonding areas on the backing film 200 is the second distance, by pulling the first film material 300 to move backward by the third distance, the distance between the first material block 211 and the third material block is the second distance, and the third material block is bonded to the second bonding area, at this time, the first material block 211 can be opposite to the first bonding area, and when the first material block 211 is bonded to the backing film 200, the first material block 211 can be accurately bonded to the first bonding area.

[0086] Further, with reference to Figure 4 , in step S121, the following steps are included but not limited to:

[0087] Step S121a: obtaining the first position information of the first side edge 211a of the third material block;

[0088] Step S121b: obtaining the second position information of the first side edge 211a of the first material block 211;

[0089] Step S121c: obtaining the first distance according to the first position information and the second position information.

[0090] It can be understood that the profiles of the material blocks on the first film material 300 are the same, each material block has a first side edge 211a, and the extension direction of the first side edge 211a can be parallel to the width direction of the backing film 200; the distance between the first side edge 211a on the first material block 211 and the first side edge 211a on the third material block is equal to the distance between the first material block 211 and the third material block.

[0091] In some embodiments of the present application, with reference to Figure 2 , in step S100, the following steps are included but not limited to:

[0092] Step S130: if the first material block 211 is the first material block on the first film material 300, keeping the relative position between the first film material 300 and the backing film 200 unchanged.

[0093] It can be understood that when the first material block 211 is the first material block on the first film material 300, at this time, the backing film 200 has not yet bonded with the material block, and at this time, the first material block 211 can be bonded anywhere on the backing film 200.

[0094] In some embodiments of the present application, with reference to Figure 5 , in step S300, the following steps are included but not limited to:

[0095] Step S310: judging whether the second material block 212 is the first material block on the second film material 400;

[0096] Step S320: If the second material block 212 has a fourth material block in front side, pull the second film material 400 to move backward until the distance between the second material block 212 and the fourth material block is the same as the distance between the first bonding area and the second bonding area; wherein the fourth material block is bonded on the second bonding area.

[0097] It can be understood that the distance between any two adjacent die-cut semi-finished products 210 on the backing film 200 is certain and equal, therefore, the distance between any two adjacent bonding areas on the backing film 200 is also certain and equal; the distance between any two adjacent material blocks on the second film material 400 is smaller than the distance between any two adjacent bonding areas on the backing film 200; when the second material block 212 has a fourth material block in front side, it means that the second material block 212 is not the first material block on the second film material 400, and the fourth material block is bonded on the second bonding area of the backing film 200, therefore, when the second material block 212 is bonded on the first bonding area of the backing film 200, the distance between the second material block 212 and the fourth material block is the second distance, by pulling the second film material 400 to move backward, the distance between the second material block 212 and the fourth material block is the second distance, so that the second material block 212 can be accurately bonded on the first bonding area.

[0098] Further, referring to Figure 6 , in step S320, the following steps are included but not limited to:

[0099] Step S321: Obtain the third position information of the second side edge 212a of the second material block 212;

[0100] Step S322: Obtain the fourth position information of the second side edge 212a of the fourth material block;

[0101] Step S323: Obtain the fourth distance between the second material block 212 and the fourth material block according to the third position information and the fourth position information;

[0102] Step S324: Pull the second film material 400 to move backward by a fifth distance according to the fourth distance and the second distance between the first bonding area and the second bonding area; wherein the fifth distance is the difference between the second distance and the fourth distance.

[0103] It can be understood that the profiles of the material blocks on the second film material 400 are the same, and each of the material blocks on the second film material 400 has a second side edge 212a, and the extension direction of the second side edge 212a is parallel to the width direction of the bottoming film 200; the distance between the second side edge 212a on the second material block 212 and the second side edge 212a on the fourth material block is the distance between the second material block 212 and the fourth material block; by pulling the second film material 400 to move backward by a fifth distance, the second material block 212 and the fourth material block are separated by a second distance at this time, and since the fourth material block is attached in the second attachment area, the second material block 212 can be directly attached to the first attachment area, and the second material block 212 can be accurately attached to the first attachment area.

[0104] In some embodiments of the present application, with reference to Figure 5 , in step S300, the following steps are included but not limited to:

[0105] Step S330: If the second material block 212 is the first material block on the second film material 400, pull the second film material 400 until the second material block 212 is separated from the first material block 211 in the first attachment area by a preset distance.

[0106] It can be understood that the second material block 212 and the first material block 211 are attached in the first attachment area, and the first material block 211 and the second material block 212 are separated by a preset distance when the second material block 212 and the first material block 211 are attached in the first attachment area; by pulling the second film material 400, the second material block 212 is separated from the first material block 211 in the first attachment area by a preset distance, and at this time, the second material block 212 can be accurately attached to the first attachment area.

[0107] Specifically, with reference to Figure 7 , in step S330, the following steps are included but not limited to:

[0108] Step S331: Obtain the fifth position information of the second side edge 212a of the second material block 212;

[0109] Step S332: Obtain the sixth position information of the first side edge 211a of the first material block 211 in the first attachment area;

[0110] Step S333: According to the fifth position information and the sixth position information, obtain the sixth distance between the first side edge 211a of the first material block 211 and the second side edge 212a of the second material block 212;

[0111] Step S334: Pull the second film material 400 to move by a seventh distance according to the preset distance and the sixth distance; wherein the seventh distance is the difference between the sixth distance and the preset distance.

[0112] Referring to Figure 8 , according to the die-cutting device of the second aspect of the present application, the die-cutting device comprises a first storage roller 100, a second storage roller 110, a third storage roller 120, a first die-cutting roller set 130, a second die-cutting roller set 140, a material pulling assembly (not shown in the figure), a first sensor 150, and a second sensor 160: the first storage roller 100 is wound with a first film material 300; the second storage roller 110 is wound with a second film material 400; the third storage roller 120 is wound with a backing film 200; the first die-cutting roller set 130 is arranged on the moving path of the first film material 300 and the backing film 200, and is used for die-cutting the first film material 300 to form a first material block 211 and capable of adhering the first material block 211 to the backing film 200; the second die-cutting roller set 140 is arranged on the moving path of the second film material 400 and the backing film 200, and is located at the rear side of the first die-cutting roller set 130 along the movement direction of the backing film 200, and is used for die-cutting the second film material 400 to form a second material block 212 and capable of adhering the second material block 212 to the backing film 200; the material pulling assembly is arranged on the moving path of both the first film material 300 and the second film material 400, and is capable of pulling the first film material 300 and the second film material 400 respectively; the first sensor 150 is electrically connected with the material pulling assembly, and is arranged at the front side of the first die-cutting roller set 130 along the moving direction of the first film material 300, and is used for detecting the position of the first material block 211 of the first film material 300; the second sensor 160 is electrically connected with the material pulling assembly, and is arranged at the front side of the second die-cutting roller set 140 along the moving direction of the second film material 400, and is used for detecting the position of the second material block 212 of the second film material 400.

[0113] When the die-cutting device is working, the first storage roller 100 can output the first film material 300, the third storage roller 120 can output the backing film 200, the first sensor 150 can detect the relative position relationship between the first film material 300 and the backing film 200, and transmit the detection information to the material pulling assembly, the material pulling assembly can adjust the relative position between the first film material 300 and the backing film 200 according to the detection information of the first sensor 150, so that the first material block 211 of the first film material 300 is opposite to the first area of the first bonding area, and then the first die-cutting roller group 130 can die-cut the first film material 300, so that the first material block 211 is separated from the first film material 300 and bonded to the first area of the first bonding area; the second storage roller 110 can output the second film material 400, the second sensor 160 can detect the relative position relationship between the second film material 400 and the backing film 200, and transmit the detection information to the material pulling assembly, the material pulling assembly can adjust the relative position between the second film material 400 and the backing film 200 according to the detection information of the second sensor 160, so that the second material block 212 of the second film material 400 is opposite to the second area of the first bonding area, and then the second die-cutting roller group 140 can die-cut the second film material 400, so that the second material block 212 is separated from the second film material 400 and bonded to the second area of the first bonding area, and the first material block 211 and the second material block 212 jointly form the die-cut semi-finished product 210.

[0114] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A die-cutting method for forming a die-cut half-product (210) on a backing film (200), a region of the backing film (200) on which the die-cut half-product (210) is to be adhered being an adhered region, the die-cut half-product (210) comprising a first material block (211) from a first film material (300) and a second material block (212) from a second film material (400), characterized in that, The die-cutting method comprises the following steps: Adjusting the relative position between the first film material (300) and the backing film (200) so that the first material block (211) of the first film material (300) is opposite to the first region of the first bonding area; the adjusting the relative position between the first film material (300) and the backing film (200) comprises the following steps: judging whether the first material block (211) is the first material block on the first film material (300); if the first material block (211) has a third material block in front, pulling the first film material (300) to move backward until the distance between the first material block (211) and the third material block is the same as the distance between the first bonding area and the second bonding area; wherein the third material block is bonded to the second bonding area; Die-cutting the first film material (300) so that the first material block (211) is separated from the first film material (300) and bonded to the first region of the first bonding area; Adjusting the relative position between the second film material (400) and the backing film (200) so that the second material block (212) of the second film material (400) is opposite to the second region of the first bonding area; Die-cutting the second film material (400) so that the second material block (212) is separated from the second film material (400) and bonded to the second region of the first bonding area, and the first material block (211) and the second material block (212) jointly form the die-cutting semi-finished product (210); According to the above steps, a plurality of die-cutting semi-finished products (210) are sequentially bonded on the backing film (200).

2. A die cutting method according to claim 1, wherein, The pulling the first film material (300) to move backward comprises the following steps: Obtaining a first distance between the first material block (211) and the third material block; Obtaining a second distance between the first bonding area and the second bonding area; Obtaining a third distance according to the first distance and the second distance, the third distance being the difference between the second distance and the first distance; Pulling the first film material (300) to move backward by the third distance.

3. A die cutting method according to claim 2, wherein, The profiles of each of the material blocks on the first film material (300) are the same, and each of the material blocks on the first film material (300) comprises a first side edge (211a); The obtaining the first distance between the first material block (211) and the third material block comprises the following steps: Obtaining first position information of the first side edge (211a) of the third material block; Obtaining second position information of the first side edge (211a) of the first material block (211); Obtaining the first distance according to the first position information and the second position information.

4. A method of die cutting according to claim 1, wherein, The adjusting the relative position between the first film material (300) and the backing film (200) further comprises the following steps: If the first material block (211) is the first material block on the first film material (300), the relative position between the first film material (300) and the backing film (200) is kept unchanged.

5. A method of die cutting according to claim 1 wherein, The adjusting the relative position between the second film material (400) and the backing film (200) comprises the following steps: determining whether the second material block (212) is the first material block on the second film material (400); if the second material block (212) has a fourth material block in front, pulling the second film material (400) to move backward until the distance between the second material block (212) and the fourth material block is the same as the distance between the first bonding area and the second bonding area; wherein the fourth material block is bonded to the second bonding area.

6. A method of die cutting according to claim 5, wherein, The profiles of each material block on the second film material (400) are the same, and each material block on the second film material (400) comprises a second side edge (212a); The pulling the second film material (400) to move backward comprises the following steps: obtaining third position information of the second side edge (212a) of the second material block (212); obtaining fourth position information of the second side edge (212a) of the fourth material block; obtaining a fourth distance between the second material block (212) and the fourth material block according to the third position information and the fourth position information; pulling the second film material (400) to move backward by a fifth distance according to the fourth distance and a second distance between the first bonding area and the second bonding area; wherein the fifth distance is the difference between the second distance and the fourth distance.

7. A method of die cutting according to claim 6, wherein, In the same die-cut semi-finished product (210), the first material block (211) and the second material block (212) are separated by a preset distance; The adjusting the relative position between the second film material (400) and the backing film (200) further comprises the following steps: if the second material block (212) is the first material block on the second film material (400), pulling the second film material (400) until the second material block (212) is separated from the first material block (211) in the first bonding area by a preset distance.

8. A die cutting method according to claim 7, wherein, The pulling the second film material (400) comprises the following steps: obtaining fifth position information of the second side edge (212a) of the second material block (212); obtaining sixth position information of a first side edge (211a) of the first material block (211) in the first bonding area; obtaining a sixth distance between the first side edge (211a) of the first material block (211) and the second side edge (212a) of the second material block (212) according to the fifth position information and the sixth position information; pulling the second film material (400) to move by a seventh distance according to the preset distance and the sixth distance; wherein the seventh distance is the difference between the sixth distance and the preset distance.

9. A die cutting apparatus characterized by, The die-cutting device for implementing the die-cutting method according to any one of claims 1 to 8 comprises: A first storage roller (100) has a first film material (300) wound thereon; A second storage roller (110) has a second film material (400) wound thereon; A third storage roller (120) has a bottom film (200) wound thereon; A first die-cutting roller set (130) is arranged on a moving path of the first film material (300) and the bottom film (200), and is used for die-cutting the first film material (300) to form a first material block (211) and capable of adhering the first material block (211) to the bottom film (200); A second die-cutting roller set (140) is arranged on a moving path of the second film material (400) and the bottom film (200), and is located at a rear side of the first die-cutting roller set (130) along a moving direction of the bottom film (200), and is used for die-cutting the second film material (400) to form a second material block (212) and capable of adhering the second material block (212) to the bottom film (200); A material pulling assembly is arranged on a moving path of both the first film material (300) and the second film material (400), and is capable of pulling the first film material (300) and the second film material (400) respectively; A first sensor (150) is electrically connected with the material pulling assembly, and is arranged at a front side of the first die-cutting roller set (130) along a moving direction of the first film material (300), and is used for position detection of the first material block (211) of the first film material (300); A second sensor (160) is electrically connected with the material pulling assembly, and is arranged at a front side of the second die-cutting roller set (140) along a moving direction of the second film material (400), and is used for position detection of the second material block (212) of the second film material (400).

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